CN107265839B - Scribing equipment - Google Patents
Scribing equipment Download PDFInfo
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- CN107265839B CN107265839B CN201610887336.3A CN201610887336A CN107265839B CN 107265839 B CN107265839 B CN 107265839B CN 201610887336 A CN201610887336 A CN 201610887336A CN 107265839 B CN107265839 B CN 107265839B
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- substrate
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- loading table
- holding member
- scribing
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- 239000000758 substrate Substances 0.000 claims abstract description 310
- 238000001514 detection method Methods 0.000 claims 2
- 238000000034 method Methods 0.000 description 11
- 230000003993 interaction Effects 0.000 description 5
- 238000005401 electroluminescence Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Liquid Crystal (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A scribing apparatus according to an exemplary embodiment of the present invention is provided to reduce time and space required for transporting a substrate and adjusting a position of the substrate, and the scribing apparatus may include: a substrate supporting unit supporting the substrate supplied by the substrate supplying unit; a loading table disposed under the substrate supporting unit; a scribing unit which is arranged at one side of the loading platform and forms a scribing line on the substrate; and a substrate carrying unit that carries the substrate placed on the loading table to the dicing unit; and a substrate transfer unit that transfers the substrate from the substrate support unit to the loading table, wherein the substrate support unit forms an opening through which the substrate passes so that the substrate transfer unit transfers the substrate to the loading table through the opening, and the substrate transfer unit includes a position adjustment unit that adjusts a position of the substrate while the substrate transfer unit transfers the substrate to the loading table so that the position of the substrate coincides with an accurate position where the substrate is to be positioned on the loading table.
Description
Technical Field
The present invention relates to a dicing apparatus that forms a dicing line on a substrate so as to cut the substrate.
Background
In general, a liquid crystal display panel, an organic electroluminescence panel, an inorganic electroluminescence panel, a transmissive projection substrate, a reflective projection substrate, and the like used for a flat panel display are manufactured by using a unit glass panel (hereinafter, referred to as "unit substrate") made by cutting a brittle mother glass panel (hereinafter, referred to as "substrate") into a predetermined size.
The process of cutting the substrate includes: a dicing process of forming a dicing line by pressing a dicing wheel made of a hard material such as diamond against a substrate with a predetermined pressing force and moving the dicing wheel along a predetermined cutting line along which the substrate is to be cut; and a breaking process of cutting the substrate by pressing the substrate along the scribing line so as to obtain a unit substrate.
In the case of the dicing apparatus in the related art, the means for supplying the substrate, the means for aligning the supplied substrate, the means for conveying the aligned substrate to the dicing process, and the means for performing the dicing process are horizontally arranged in a line, and as a result, there is a problem in that a large space is required to install these means, and thus the cost required to perform the dicing process increases.
Further, as shown in fig. 1, in the case of the related art dicing apparatus, a substrate S is placed on a table 200, and a plurality of pressing members 300 physically push lateral sides of the substrate S, thereby aligning the substrate S. As a result, there is a problem in that damage such as scratching may be caused to the surface of the substrate S in contact with the table 200 when the substrate is pushed and moved (and/or rotated) by the pressing member 300.
Disclosure of Invention
The present invention is directed to providing a dicing apparatus capable of preventing damage to a substrate in a process of aligning the substrate.
The present invention is also directed to providing a scribing apparatus capable of reducing time and space required for transporting and aligning a substrate.
An exemplary embodiment of the present invention provides a dicing apparatus including: a substrate supporting unit supporting the substrate supplied by the substrate supplying unit; a loading table disposed under the substrate supporting unit; a scribing unit which is arranged at one side of the loading platform and forms a scribing line on the substrate; a substrate carrying unit that carries the substrate placed on the loading table to the dicing unit; and a substrate transfer unit that transfers the substrate from the substrate support unit to the loading table, wherein the substrate support unit forms an opening through which the substrate passes so that the substrate transfer unit transfers the substrate to the loading table through the opening, and the substrate transfer unit includes a position adjustment unit that adjusts a position of the substrate while the substrate transfer unit transfers the substrate to the loading table so that the position of the substrate coincides with an accurate position where the substrate is to be positioned on the loading table.
According to the scribing apparatus of the exemplary embodiment of the present invention, the substrate holding member of the substrate transfer unit is rotated or moved in the X-axis direction or the Y-axis direction by the position adjusting unit in a state where the substrate is held by the substrate holding member, and as a result, the position of the substrate S may be adjusted. Accordingly, the position of the substrate can be adjusted without physically pressing a portion of the substrate to position the substrate, with the result that the substrate can be prevented from being damaged during the process of positioning and aligning the substrate.
According to the scribing apparatus of the exemplary embodiment of the present invention, the substrate supporting unit and the loading table are disposed on the same vertical line, and the substrate transferring unit may transfer the substrate directly to the loading table while the position adjusting unit adjusts the position of the substrate, and as a result, it is possible to reduce the time required to convey the substrate and adjust the position of the substrate and improve the space utilization of the scribing apparatus.
Drawings
Fig. 1 is a side view schematically showing an apparatus for aligning a substrate in the related art.
Fig. 2 is a side view schematically showing a dicing apparatus according to an exemplary embodiment of the present invention.
Fig. 3 is a plan view schematically showing the scribing apparatus shown in fig. 2.
Fig. 4 and 5 are plan views schematically illustrating a substrate supporting unit of the dicing apparatus shown in fig. 2.
Fig. 6 and 7 are views schematically showing a position adjusting unit provided in a substrate transfer unit of the dicing apparatus shown in fig. 2.
Fig. 8 to 10 are schematic views for explaining the operation of the position adjustment unit shown in fig. 6 and 7.
Fig. 11 to 14 are schematic views for explaining the operation of the dicing apparatus shown in fig. 2.
Detailed Description
Hereinafter, a dicing apparatus according to an exemplary embodiment of the present invention will be described with reference to the accompanying drawings.
As shown in fig. 2 and 3, the scribing apparatus according to the exemplary embodiment of the present invention includes: a substrate supply unit 10 that supplies a substrate S from the outside; a substrate supporting unit 20 on which the substrate S supplied by the substrate supply unit 10 is supported; a loading table 30 disposed under the substrate supporting unit 20; a scribing unit 50 disposed at one side of the loading table 30 and forming a scribing line on the substrate S; a substrate carrying unit 60 that carries the substrate S placed on the loading table 30 to the dicing unit 50; and a substrate transfer unit 70 that transfers the substrate S from the substrate support unit 20 to the loading table 30.
As an example, as shown in fig. 2, the substrate supply unit 10 may include a plurality of transport belts or transport rollers such that the substrate S is supplied to the substrate support unit 20 by rotation of the belts or rollers. As another example, the substrate supply unit 10 may be configured to hold the substrate S by clamping or vacuum suction, and then supply the substrate S to the substrate support unit 20.
As an example, as shown in fig. 2 to 5, the substrate supporting unit 20 may include a plurality of transport belts 22. As another example, the substrate supporting unit 20 may include a plurality of rollers, or a plurality of air tables (air tables) that inject air to the substrate S so as to float the substrate S.
The substrate supporting unit 20 may form an opening 21 through which the substrate S passes, so that the substrate transfer unit 70 may transfer the substrate S to the loading table 30 through the opening 21.
For this, as shown in fig. 5, the plurality of strips 22 of the substrate support unit 20 may be configured to move in a direction (Y-axis direction) perpendicular to the direction (X-axis direction) in which the substrate S is conveyed along the shaft 23. To move the plurality of strips 22 in the Y-axis direction, a linear motion mechanism 24 (such as an actuator operated by pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a ball screw mechanism) may be connected to the plurality of strips 22 through a shaft 23.
The loading table 30 and the substrate support unit 20 may be disposed on the same vertical line. Accordingly, the substrate transfer unit 70 may directly transfer the substrate S to the loading table 30 by moving downward from the substrate support unit 20.
The loading table 30 provides an area where the substrate S is loaded to the dicing unit 50. Meanwhile, an unloading stage 40 may be provided at the opposite side of the loading stage 30 based on the dicing unit 50, the unloading stage 40 providing an area where the substrate S having the dicing line formed by the dicing unit 50 is unloaded from the dicing unit 50.
The loading station 30 and the unloading station 40 may include multiple strips 32, 42, respectively. The plurality of strips 32, 42 may be spaced apart from one another in the Y-axis direction. Each belt 32 or 42 is supported by a plurality of rollers 33 or 43, and at least one of the plurality of rollers 33 or 43 may be a driving roller that provides a driving force to rotate each belt 32 or 42.
The scribing unit 50 may include: a frame 51 extending in the Y-axis direction; and a scribing head 52 mounted on the frame 51 so as to be movable in the Y-axis direction. A plurality of scribing heads 52 may be disposed on the frame 51 at predetermined intervals in the Y-axis direction.
These dicing heads 52 may be disposed above and below the substrate S so as to face each other. However, the present invention is not limited thereto, and the scribing head 52 may be disposed above or below the substrate S.
Each of the dicing heads 52 is provided with a dicing wheel 53 for forming a dicing line on the surface of the substrate S. For example, a pair of scribing heads 52 may be disposed above and below the substrate S so as to face each other, and thus a pair of scribing wheels 53 may be disposed above and below the substrate S so as to face each other. Accordingly, a plurality of scribe lines may be formed on the upper and lower surfaces of the substrate S by the relative movement of the substrate S with respect to the scribe head 52 and/or the relative movement of the scribe head 52 with respect to the substrate S in a state where the pair of scribe wheels 53 are pressed against the upper and lower surfaces of the substrate S, respectively.
The substrate carrying unit 60 may include: a holding member 61 for holding the substrate S; and a guide rail 62 extending in the X-axis direction. A linear motion mechanism, such as an actuator operated by pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a ball screw mechanism, may be provided between the holding member 61 and the guide rail 62.
Therefore, in a state where the holding member 61 holds the substrate S, the substrate S can be conveyed in the X-axis direction as the holding member 61 is moved in the X-axis direction by the linear motion mechanism. In this case, the belt 32 rotates in accordance with the movement of the holding member 61, and thus the lower surface of the substrate S can be stably supported.
The holding member 61 may be a jig that physically presses and holds the rear edge of the substrate S. However, the present invention is not limited thereto, and the holding member 61 may be provided with at least one vacuum hole connected to a vacuum source, and may be configured to hold the trailing edge of the substrate S by suction.
The guide rail 62 may be disposed between the plurality of strips 32. The guide rail 62 serves to guide the movement of the holding member 61 in the X-axis direction.
The substrate transfer unit 70 may include: a substrate holding member 71 that holds the substrate S placed on the substrate support unit 20; a support member 72 that supports the substrate holding member 71; and a lifting device 73 that is connected to the substrate holding member 71 through the support member 72 and moves the substrate holding member 71 in the vertical direction.
The substrate holding member 71 may be provided with at least one vacuum hole connected to a vacuum source, and may be configured to hold the upper surface of the substrate S by suction. However, the present invention is not limited thereto, and the substrate holding member 71 may be a jig that physically presses and holds the substrate S.
The lifting device 73 may be configured as a linear movement mechanism, such as an actuator operated by pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a ball screw mechanism. The substrate holding member 71 may be moved in the vertical direction by the operation of the elevating device 73, and thus the substrate S may be moved in the vertical direction.
Meanwhile, the substrate transfer unit 70 may include a position adjusting unit 74, and the position adjusting unit 74 adjusts the position of the substrate S when the substrate transfer unit 70 transfers the substrate S to the loading table 30.
As shown in fig. 2, a position adjusting unit 74 may be installed between the substrate holding member 71 and the support member 72, and may adjust a relative horizontal position of the substrate holding member 71 with respect to the support member 72. The position adjusting unit 74 may include a substrate rotating device that rotates the substrate S, a substrate moving device that moves the substrate S horizontally and linearly, or both the substrate rotating device and the substrate moving device.
Here, the substrate rotating means may include a rotating motor connecting the substrate holding member 71 and the supporting member 72. Also, the substrate moving device is provided between the substrate holding member 71 and the supporting member 72, and may be a linear motion mechanism such as an actuator operated by air pressure or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a ball screw mechanism.
As another example shown in fig. 6 to 10, a pair of position adjusting units 74 may be provided, and the position adjusting units 74 may include: a connecting member 75 connected to the substrate holding member 71; an X-axis drive unit 76 that moves the connecting member 75 in the X-axis direction; and a Y-axis driving unit 77 that moves the connecting member 75 in the Y-axis direction. The X-axis drive unit 76 and/or the Y-axis drive unit 77 may be configured as a linear motion mechanism, such as an actuator operated by pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a ball screw mechanism. The connecting member 75 may be rotatably connected to the X-axis drive unit 76 or the Y-axis drive unit 77 through a rotation shaft 78. Therefore, when the connecting member 75 of one position adjusting unit 74 of the pair of position adjusting units 74 is linearly moved, the connecting member 75 of the other position adjusting unit 74 may be rotated about the rotation shaft 78.
The pair of position adjusting units 74 may be disposed between the substrate holding member 71 and the supporting member 72 so that the substrate S may be supported at a plurality of supporting points, thereby more stably performing an operation of adjusting the position of the substrate S.
When the connecting member 75 of one position adjusting unit 74 of the pair of position adjusting units 74 is moved in the X-axis direction or the Y-axis direction, the connecting member 75 of the other position adjusting unit 74 is rotatable, and as a result, the substrate holding member 71 is rotatable. Also, both of the connecting members 75 of the pair of position adjusting units 74 may be moved in the X-axis direction and/or the Y-axis direction by the operation of the X-axis driving unit 76 and/or the Y-axis driving unit 77, with the result that the substrate holding member 71 may be moved in the X-axis direction and/or the Y-axis direction.
Therefore, as shown in fig. 8, even in the case where the position of the substrate S held by the substrate holding member 71 is deviated by an angle from the accurate position T of the substrate S to be positioned on the loading table 30 and/or is deviated by a distance in the X-axis direction and/or the Y-axis direction from the accurate position T, the angle of the substrate S may become coincident with the angle at the accurate position T as the substrate holding member 71 is rotated as shown in fig. 9, and the position of the substrate S may become coincident with the accurate position T as the substrate holding member 71 is moved in the X-axis direction and/or the Y-axis direction as shown in fig. 10.
By the pair of position adjusting units 74, the substrate S can be rotated and moved in the horizontal direction. Therefore, it is possible to rotate the substrate S more stably than in the case where the substrate holding member 71 having a heavy weight and a high load and the substrate S are rotated by a single rotating motor, and as a result, it is possible to accurately adjust the position of the substrate S.
As described above, the position adjusting unit 74 that can rotate the substrate holding member 71 and can move the substrate holding member 71 in the X-axis direction and/or the Y-axis direction is provided between the substrate holding member 71 and the support member 72, with the result that the position of the substrate S can be adjusted when the substrate transfer unit 70 transfers the substrate S to the loading table 30. Therefore, the space and time required to convey the substrate S and perform the dicing process can be minimized, compared to the case where a separate device is provided to adjust the position of the substrate S independently of the substrate transfer unit 70.
Meanwhile, the scribing apparatus according to the exemplary embodiment of the present invention may include a position detecting unit 80 that detects a position of at least a portion of the substrate S held by the substrate transfer unit 70. The position detecting unit 80 may be mounted on the loading table 30 to detect the position of the lower surface of the substrate S. However, the mounting position of the position detecting unit 80 is not limited, and for example, the position detecting unit 80 may be mounted on the substrate transfer unit 70 so as to detect the position of the upper surface of the substrate S placed on the substrate supporting unit 20.
The position detecting unit 80 may include an image pickup unit that picks up an image of the substrate S and determines whether the substrate S deviates from the accurate position T based on the picked-up image of the substrate S.
As another example, the position detecting unit 80 may include an optical sensor that emits light toward at least a portion of the substrate S and determines whether reflected light from the substrate S is received, thereby determining whether the substrate S deviates from the accurate position T.
Also, based on the position of the substrate S detected by the position detecting unit 80, the position adjusting unit 74 may rotate the substrate holding member 71 or may move the substrate holding member 71 in the X-axis direction and/or the Y-axis direction.
Hereinafter, an operation of the scribing apparatus according to the exemplary embodiment of the present invention will be described with reference to fig. 11 to 14.
First, as shown in fig. 11, a substrate S is supplied from the outside to the substrate supporting unit 20 by the substrate supply unit 10. In this case, the substrate transfer unit 70 is disposed to be spaced apart from the substrate support unit 20 by a predetermined interval. Meanwhile, a stopper may be provided on the substrate supporting unit 20 so that the substrate S may be placed at an appropriate position on the substrate supporting unit 20.
Also, as shown in fig. 12, when the substrate S is placed on the substrate support unit 20, the substrate holding member 71 of the substrate transfer unit 70 moves downward and holds the substrate S placed on the substrate support unit 20. In this case, the position detecting unit 80 may detect the position of at least a portion of the substrate S in order to determine whether the substrate S deviates from the accurate position T.
Further, as shown in fig. 13, the substrate holding member 71 is moved upward from the substrate support unit 20 in a state where the substrate holding member 71 holds the substrate S. In this case, the substrate holding member 71 is rotated or moved in the X-axis direction and/or the Y-axis direction by the position adjusting unit 74, and as a result, the position of the substrate S can be adjusted.
Also, the substrate supporting unit 20 may form an opening 21 through which the substrate S passes, so that the substrate transfer unit 70 may transfer the substrate S to the loading table 30 through the opening 21.
Also, as shown in fig. 14, the substrate holding member 71 moves downward while passing through the opening 21, with the result that the substrate S can be transferred to the loading table 30.
When the substrate S is placed on the loading table 30, the substrate carrying unit 60 holds the trailing edge of the substrate S, and then moves the substrate S to the scribing unit 50. Also, the scribing unit 50 forms a scribing line on the substrate S. Thereafter, the substrate S having the scribe lines is unloaded via the unloading station 40 to subsequent processing.
According to the scribing apparatus of the exemplary embodiment of the present invention, in a state where the substrate S is held by the substrate holding member 71 of the substrate transfer unit 70, the substrate holding member 71 is rotated or moved in the X-axis direction and/or the Y-axis direction by the position adjusting unit 74, and as a result, the position of the substrate S may be adjusted. Therefore, the position of the substrate S can be adjusted without physically pressing a portion of the substrate S to align and position the substrate S, and as a result, damage to the substrate S during a process of positioning and aligning the substrate S can be prevented.
According to the dicing apparatus of the exemplary embodiment of the present invention, the substrate supporting unit 20 and the loading table 30 are disposed on the same vertical line, and the substrate transfer unit 70 may transfer the substrate S directly to the loading table 30 while the position adjusting unit 74 adjusts the position of the substrate S, and as a result, the time required to convey the substrate S and adjust the position of the substrate S can be reduced, and the space utilization of the dicing apparatus can be improved.
Further, according to the scribing apparatus of the exemplary embodiment of the present invention, when the substrate transfer unit 70 transfers the substrate S to the loading table 30, the position of the substrate S may be adjusted by the position adjusting unit 74 provided in the substrate transfer unit 70. Therefore, it is not necessary to provide a separate device for positioning and aligning the substrate S in the path along which the substrate S is conveyed, and as a result, the horizontal space required for conveying the substrate S and performing the dicing process can be minimized.
Various exemplary embodiments of the present invention have been described herein for illustrative purposes. It should be recognized, however, that the scope of the present invention is not limited to the specific exemplary embodiments, and that various modifications may be made without departing from the scope of the invention as defined by the appended claims.
Claims (9)
1. A dicing apparatus, comprising:
a substrate supporting unit supporting the substrate supplied by the substrate supplying unit;
a loading table disposed under the substrate supporting unit;
a scribing unit disposed at one side of the loading table and forming a scribing line on the substrate;
a substrate carrying unit that carries the substrate placed on the loading table to the dicing unit; and
a substrate transfer unit that transfers the substrate from the substrate support unit to the loading table,
wherein the substrate supporting unit forms an opening through which the substrate passes so that the substrate transferring unit transfers the substrate to the loading table through the opening, and
the substrate transfer unit includes a position adjustment unit that adjusts a position of the substrate while the substrate transfer unit transfers the substrate to the loading table so that the position of the substrate coincides with an accurate position where the substrate is to be positioned on the loading table.
2. The scribing apparatus according to claim 1, wherein the substrate transfer unit is disposed above the substrate supporting unit, and the substrate is directly transferred to the loading table by moving downward from the substrate supporting unit through the opening.
3. The dicing apparatus of claim 1, further comprising:
a position detection unit that detects a position of at least a part of the substrate held by the substrate transfer unit.
4. The dicing apparatus of claim 3, wherein the position detection unit is mounted on the loading table so as to detect a position of the lower surface of the substrate placed on the loading table.
5. The scribing apparatus according to claim 3, wherein the position detecting unit is mounted on the substrate transferring unit so as to detect a position of an upper surface of the substrate placed on the substrate supporting unit.
6. The dicing apparatus according to claim 3, wherein the position adjusting unit includes a substrate rotating device that rotates the substrate based on the position of the substrate detected by the position detecting unit.
7. The scribing apparatus of claim 3, wherein the position adjusting unit includes a substrate moving device that moves the substrate horizontally and linearly based on the position of the substrate detected by the position detecting unit.
8. The dicing apparatus according to claim 1, wherein the substrate transfer unit includes a substrate holding member that holds the substrate, and the position adjustment unit includes: a connecting member connected to the substrate holding member; and a driving unit rotatably connected to the connection member by a rotation shaft and moving the connection member in an X-axis direction or a Y-axis direction.
9. The dicing apparatus according to claim 1, wherein the substrate transfer unit includes a substrate holding member that holds the substrate; a support member that supports the substrate holding member; and a lifting device connected to the substrate holding member through the supporting member and moving the substrate holding member in a vertical direction; and wherein the position adjustment unit is located between the substrate holding member and the support member.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2016-0042749 | 2016-04-07 | ||
| KR1020160042749A KR102605917B1 (en) | 2016-04-07 | 2016-04-07 | Scribing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107265839A CN107265839A (en) | 2017-10-20 |
| CN107265839B true CN107265839B (en) | 2021-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610887336.3A Active CN107265839B (en) | 2016-04-07 | 2016-10-11 | Scribing equipment |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102605917B1 (en) |
| CN (1) | CN107265839B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102067987B1 (en) * | 2017-11-23 | 2020-01-20 | 주식회사 탑 엔지니어링 | Apparatus for cutting substrate |
| KR102114025B1 (en) * | 2018-01-30 | 2020-05-25 | 주식회사 탑 엔지니어링 | Apparatus for cutting substrate |
| KR102158035B1 (en) * | 2018-05-24 | 2020-09-22 | 주식회사 탑 엔지니어링 | Apparatus for cutting substrate |
| KR20200092022A (en) | 2019-01-24 | 2020-08-03 | (주)두영티앤에스 | Drone-mounted lighting system with heat shield in the gimbal and lighting areas |
| KR20200098067A (en) | 2019-02-11 | 2020-08-20 | 조정기 | Drone-mounted lighting system with fixed tools for holding heat shield mounted on gimbal and light fittings |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN1728356A (en) * | 2004-07-28 | 2006-02-01 | 大日本网目版制造株式会社 | Substrate processor |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN107265839A (en) | 2017-10-20 |
| KR102605917B1 (en) | 2023-11-27 |
| KR20170115635A (en) | 2017-10-18 |
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