CN106980891B - Smart card manufacturing assembly and smart card manufacturing process - Google Patents
Smart card manufacturing assembly and smart card manufacturing process Download PDFInfo
- Publication number
- CN106980891B CN106980891B CN201710209628.6A CN201710209628A CN106980891B CN 106980891 B CN106980891 B CN 106980891B CN 201710209628 A CN201710209628 A CN 201710209628A CN 106980891 B CN106980891 B CN 106980891B
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- middle frame
- upper substrate
- glue
- smart card
- substrate
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 62
- 239000000758 substrate Substances 0.000 claims abstract description 211
- 239000003292 glue Substances 0.000 claims abstract description 161
- 238000010030 laminating Methods 0.000 claims abstract description 7
- 238000003860 storage Methods 0.000 claims description 28
- 230000001680 brushing effect Effects 0.000 claims description 7
- 238000012797 qualification Methods 0.000 abstract description 10
- 238000003475 lamination Methods 0.000 abstract description 6
- 230000002035 prolonged effect Effects 0.000 abstract description 6
- 238000004382 potting Methods 0.000 abstract description 4
- 239000012790 adhesive layer Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 13
- 239000000565 sealant Substances 0.000 description 10
- 239000010410 layer Substances 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
Abstract
The invention discloses a smart card manufacturing assembly, which comprises an upper substrate, a middle frame and a lower substrate which are sequentially arranged, and is characterized in that a hollow cavity is formed among the upper substrate, the middle frame and the lower substrate, the hollow cavity is used for filling glue to connect the upper substrate, the middle frame and the lower substrate, a glue overflow groove is formed in the middle frame, and one end of the glue overflow groove is communicated with the hollow cavity; the manufacturing process of the smart card comprises the steps of fixing the middle frame on the lower surface of the upper substrate, filling glue solution into the hollow cavity, fixing the lower substrate on the lower surface of the middle frame, laminating the upper substrate, the middle frame and the lower substrate, extruding air and/or redundant glue solution in the hollow cavity into a glue overflow groove, and solidifying the glue solution; during lamination, air and redundant glue in the hollow cavity are extruded to the glue overflow groove, so that the adhesion force of the potting adhesive layer to the upper substrate, the middle frame and the lower substrate is enhanced, layering is avoided, the smart card is ensured to meet the standard requirement of the thickness of the card, the surface flatness, the structural stability and the product qualification rate of the smart card are improved, and the service life of the smart card is prolonged.
Description
Technical Field
The invention belongs to the field of smart cards, and particularly relates to a smart card manufacturing assembly and a smart card manufacturing process.
Background
The intelligent card has large capacity, the working principle is similar to that of a microcomputer, and the intelligent card can realize multiple functions and is widely applied to the fields of data statistics storage, access security control, mobile payment, entry and exit control and the like. Smart cards typically include user information and small amounts of security control information, and these smart cards are composed of a multi-layered structure between which internal components such as circuit boards, displays, etc. are wrapped, with the multi-layered structure providing the required rigidity and protection of the internal components, and the multi-layered structures are typically assembled by lamination. However, the existing smart card has the following problems:
1) The display screen cannot be positioned in the middle frame, so that the phenomenon of inclination and deviation of the display screen occurs after the intelligent card is molded by glue filling;
2) The upper substrate, the middle frame and the lower substrate cannot be positioned, the production is difficult, and the reject ratio of the product is high;
3) The glue filling amount in the middle frame is difficult to grasp, the upper substrate, the middle frame and the lower substrate cannot be effectively bonded if the glue is too small, and the thickness of the intelligent card does not meet the standard requirement if the glue is too large;
4) Bubbles are formed in the smart card, so that the card surface is uneven; particularly, bubbles are easily generated in the display area of the card, resulting in poor display effect.
Disclosure of Invention
The invention aims to provide a smart card manufacturing assembly which meets the requirements of card thickness specifications and has high product yield.
In order to solve the technical problems, the intelligent card manufacturing assembly adopts the following technical scheme:
the intelligent card manufacturing assembly comprises an upper substrate, a middle frame and a lower substrate which are sequentially arranged, wherein a hollow cavity is formed between the upper substrate, the middle frame and the lower substrate, the hollow cavity is used for being connected with the upper substrate through glue filling, the middle frame and the lower substrate are connected, a glue overflow groove is formed in the middle frame, and one end of the glue overflow groove is communicated with the hollow cavity.
Further, a glue storage groove is formed in the middle frame and is communicated with the hollow cavity through the glue overflow groove.
Specifically, the glue overflow groove is positioned at one side of the middle frame, which is close to the upper substrate.
Further, the display device also comprises a flexible circuit board and a display screen which are arranged in the hollow cavity, and the flexible circuit board is electrically connected with the display screen.
Further, a first indication position for indicating the placement position of the display screen is arranged on the upper substrate, and the display screen is adhered to the upper substrate corresponding to the first indication position.
Further, a through hole is formed in the middle frame, and a second indication bit corresponding to the through hole is arranged on the lower surface of the upper substrate.
Further, a through hole is formed in the middle frame, and a third indication position corresponding to the through hole is formed in the upper surface of the lower substrate.
The intelligent card manufacturing assembly provided by the invention has the beneficial effects that: the overflow glue groove communicated with the hollow cavity is formed in the middle frame, glue can be filled in the hollow cavity, and in-process of forming the pouring sealant layer through lamination, air and/or redundant glue in the hollow cavity can be extruded into the overflow glue groove, so that the problem that bubbles are formed in the pouring sealant layer formed by solidifying the glue or the intelligent card does not meet the thickness specification and is poor in surface flatness due to over-thick and uneven pouring sealant layer can be avoided, the adhesive force of the pouring sealant layer to the upper substrate and the lower substrate is enhanced, layering is avoided, the intelligent card meets the requirements of card thickness specification, the surface flatness, structural stability and product percent of pass of the intelligent card are improved, and the service life of the intelligent card is prolonged.
Another technical problem to be solved by the invention is to provide a smart card manufacturing process which meets the requirements of card thickness specification and has high product qualification rate.
The smart card manufacturing process based on the smart card manufacturing assembly comprises the following steps of:
fixing the middle frame on the lower surface of the upper substrate;
filling glue solution into the hollow cavity;
fixing the lower substrate on the lower surface of the middle frame;
laminating the upper substrate, the middle frame and the lower substrate, so that air and/or redundant glue solution in the hollow cavity is extruded into the glue overflow groove, and curing the glue solution.
Further, before the step of fixing the middle frame on the upper substrate, a glue storage groove is formed in the middle frame and is communicated with the hollow cavity through the glue overflow groove; so that when the upper substrate, the middle frame and the lower substrate are laminated, air and/or surplus glue solution in the hollow cavity is extruded into the glue overflow groove or is extruded into the glue storage groove through the glue overflow groove.
Further, the method further comprises the following steps performed before the middle frame is fixed on the upper substrate: and fixing the flexible circuit board and the display screen on the lower surface of the upper substrate.
Further, the method further comprises the following steps performed before the flexible circuit board and the display screen are fixed on the upper substrate: printing a first indication bit for indicating the placement position of the display screen on the lower surface of the upper substrate;
the step of fixing the flexible circuit board and the display screen on the upper substrate comprises the following steps: and brushing glue on the lower surface of the upper substrate, adhering the flexible circuit board and the display screen to the lower surface of the upper substrate, and positioning the display screen at the first indication position.
Further, the method further comprises the following steps performed before the middle frame is fixed on the upper substrate: a through hole is formed in the middle frame, and a second indication position corresponding to the through hole is printed on the lower surface of the upper substrate;
the step of fixing the middle frame on the upper substrate comprises the following steps: and brushing glue on the lower surface of the upper substrate, aligning the through holes with the second indication positions, and bonding the middle frame on the lower surface of the upper substrate.
Further, the method further comprises the following steps performed before the middle frame is fixed on the upper substrate: a through hole is formed in the middle frame, and a third indication position corresponding to the through hole is printed on the upper surface of the lower substrate;
the step of fixing the lower substrate to the middle frame includes: and brushing glue on the upper surface of the lower substrate, aligning the third indication position with the through hole, and bonding the lower substrate on the lower surface of the middle frame.
The smart card manufacturing process provided by the invention has the beneficial effects that: according to the manufacturing process of the smart card, glue solution is filled into the hollow cavity and extruded into the glue overflow groove when the glue solution is laminated, so that the problem that the smart card does not meet the thickness specification and is poor in surface flatness due to the fact that bubbles are formed in the pouring sealant layer formed by solidifying the glue solution or the pouring sealant layer is too thick and uneven can be avoided, the adhesion of the pouring sealant layer to the upper substrate and the lower substrate is enhanced, layering is avoided, the smart card meets the requirements of the card thickness specification, the surface flatness, the structural stability and the product percent of pass of the smart card are improved, and the service life of the smart card is prolonged.
Drawings
Fig. 1 is a schematic structural diagram of an upper substrate of a smart card manufacturing assembly according to an embodiment of the present invention;
FIG. 2 is a schematic view of the structure of the display panel and flexible circuit board of FIG. 1 after being mounted;
FIG. 3 is a schematic diagram of a middle frame of a smart card manufacturing assembly according to an embodiment of the present invention;
FIG. 4 is a cross-sectional view A-A of FIG. 3;
FIG. 5 is a schematic view of the middle frame of FIG. 3 after being fixed to the upper substrate of FIG. 2;
FIG. 6 is a schematic diagram of the middle frame of FIG. 5 after the lower substrate is fixed thereon;
FIG. 7 is a schematic diagram of a smart card formed after the blanking of FIG. 6;
FIG. 8 is a section B-B of FIG. 7;
wherein: the display device comprises a 1-upper substrate, a 11-first indicating position, a 12-second indicating position, a 2-middle frame, a 21-hollow cavity, a 22-glue overflow groove, a 23-glue storage groove, a 24-through hole, a 3-lower substrate, a 31-third indicating position, a 32-transparent area, a 4-display screen, a 5-flexible circuit board, a 6-potting adhesive layer, a 7-display window and an 8-printing area.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It should be understood that the terms "upper," "middle," "lower," "inner," "outer," and the like indicate an orientation or a positional relationship based on that shown in the drawings, and are merely for convenience of description and to simplify the description, but do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention.
Furthermore, the terms "first," "second," and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
As shown in fig. 2, 5 and 6, the smart card manufacturing assembly comprises an upper substrate 1, a middle frame 2 and a lower substrate 3 which are sequentially arranged, a hollow cavity 21 is formed among the upper substrate 1, the middle frame 2 and the lower substrate 3, the hollow cavity 21 is used for filling glue to connect the upper substrate 1, the middle frame 2 and the lower substrate 3, a glue overflow groove 22 is formed in the middle frame 2, and one end of the glue overflow groove 22 is communicated with the hollow cavity 21. The middle frame 2 is provided with the glue overflow groove 22 communicated with the hollow cavity 21, after the hollow cavity 21 is filled with glue when the hollow cavity 21 is internally encapsulated and controlled (such as a flexible circuit board 5 described below) and even a display part (such as a display screen 4 described below), the whole body formed by bonding the upper substrate 1, the middle frame 2 and the lower substrate 3 is laminated, and air and/or redundant glue in the hollow cavity 21 can be extruded into the glue overflow groove 22, so that the problem that bubbles are formed in the glue solution 6 formed by solidifying the glue solution or the problem that the smart card does not meet the thickness specification and has poor surface flatness due to the fact that the glue solution 6 is too thick and uneven is solved, the bonding force of the glue solution 6 to the upper substrate 1 and the lower substrate 3 is enhanced, layering is avoided, the requirements of the smart card thickness specification are met, the surface flatness, the structural stability and the product percent of pass are improved, and the service life of the smart card is prolonged.
Further, as shown in fig. 3, in the embodiment of the present invention, a glue storage groove 23 is provided on the middle frame 2, and the glue storage groove 23 is communicated with the hollow cavity 21 through the glue overflow groove 22; the surplus glue solution in the hollow cavity 21 and air can be discharged to the glue storage groove 23 through the glue overflow groove 22, the glue storage groove 23 has a larger accommodating space, the storage capacity of the surplus glue solution and air is guaranteed, after the glue storage groove 23 is arranged, the length of a runner of the glue overflow groove 22 can be reduced, and the phenomenon that the glue solution is hardened to block the glue overflow groove 22 to cause incomplete discharge of the air and the surplus glue solution in the hollow cavity 21 is avoided. Preferably, the depth of the glue storage groove 23 is greater than that of the glue overflow groove 22, so that when the upper substrate 1, the middle frame 2 and the lower substrate 3 are laminated, air and redundant glue solution (if air or redundant glue solution exists) in the hollow cavity 21 are extruded into the glue storage groove 23 through the glue overflow groove 22, the air and redundant glue solution in the hollow cavity 21 are discharged more thoroughly, the surface flatness, the structural stability and the product qualification rate of the smart card are improved, and the service life of the smart card is prolonged. Specifically, the number of the glue overflow grooves 22 and the glue storage grooves 23 can be one or more, and the glue overflow grooves 22 and the glue storage grooves 23 can be in one-to-one correspondence, or one glue storage groove 23 can be corresponding to one or more glue overflow grooves 22. The glue reservoir 23 may be a blind hole or a through hole, preferably a through hole in this embodiment.
Further, as shown in fig. 3, in the embodiment of the present invention, glue storage grooves 23 are all disposed around the middle frame 2, and each glue storage groove 23 corresponds to at least one glue overflow groove 22. The glue filling and laminating process can reduce the travel of redundant glue solution and air discharged to the glue storage tank 23 through the glue overflow tank 22, the glue solution and air are easy to discharge, the glue solution can not be discharged due to the fact that the glue solution is blocked by the glue overflow tank 22 due to overlarge glue solution viscosity is avoided, air is wrapped in the glue solution to generate bubbles when the glue solution is solidified and the viscosity is overlarge, and therefore the thickness of the intelligent card manufacturing assembly is guaranteed to meet the thickness requirement of the card manufacturing assembly, the connection reliability between each layer of structure of the intelligent card manufacturing assembly is improved, the display performance of the intelligent card manufacturing assembly is improved, the processing is easy, the production efficiency is improved, and the product qualification rate is effectively increased.
Further, as shown in fig. 4 and 8, the glue overflow groove 22 is located at one side of the middle frame 2 near the upper substrate 1. The glue overflow groove 22 is close to the lower substrate 3, and can discharge air from the glue overflow groove 22 at the upper end of the hollow cavity 21 when glue is filled, so that the time lag of air migration to the top of glue solution is avoided, the air overflow groove has better capability of preventing bubbles, the connection reliability between each layer of structure of the intelligent card manufacturing assembly is improved, the display performance of the intelligent card manufacturing assembly is improved, and the product qualification rate is effectively increased.
Further, as shown in fig. 2 and 8, in the embodiment of the present invention, the display panel further includes a flexible circuit board 5 and a display screen 4 disposed in the hollow cavity 21, and the flexible circuit board 5 is electrically connected to the display screen 4. The flexible circuit board 5 flexibility is good, leads to control circuit damage when preventing the smart card buckling, and the setting of display screen 4 can audio-visual demonstration information, and it is more convenient to use.
Further, as shown in fig. 1, in the embodiment of the present invention, a first indication bit 11 for indicating a placement position of the display screen 4 is provided on the upper substrate 1, and the display screen 4 is adhered to the upper substrate 1 corresponding to the first indication bit 11. The display screen 4 is adhered to the upper substrate 1, so that the phenomenon that the display screen 4 is inclined and deviated during glue filling can be avoided, the display performance of the intelligent card manufacturing assembly is improved, and the qualification rate of products is guaranteed. Specifically, the first indicator 11 may be disposed on the upper substrate 1 by printing, and the shape of the first indicator 11 may be the same as the outline of the display screen 4, for example, the first indicator 11 is a printed wire frame with the same size as the display screen 4, and of course, the first indicator 11 may also be an indicator groove disposed on the upper substrate 1.
Further, as shown in fig. 1 and 4, in the embodiment of the present invention, the middle frame 2 is provided with a through hole 24, and the lower surface of the upper substrate 1 is provided with a second indicator 12 corresponding to the through hole 24. The operation is simple, the through hole 24 and the second indication position 12 are opposite, the upper substrate 1 and the middle frame 2 can be accurately positioned, the intelligent card manufacturing assembly is easier to process, and the production efficiency is higher. Specifically, the through hole 24 may be a round hole, a square hole, a triangular hole or other holes, and the second indicator bit 12 is consistent with the shape of the through hole 24, which is more beneficial to the alignment of the through hole 24 and the second indicator bit 12. Preferably, the number of the second indicator bits 12 and the number of the through holes 24 are at least two, and each through hole 24 is opposite to the corresponding second indicator bit 12; therefore, at least two positions of the upper substrate 1 and the middle frame 2 can be positioned, and the upper substrate 1 and the middle frame 2 can be positioned more rapidly and accurately.
Alternatively, the middle frame 2 is provided with a through hole 24, and the upper surface of the lower substrate 3 is provided with a third indication bit 31 corresponding to the through hole 24. The structure is simple, the positioning between the lower substrate 3 and the middle frame 2 is realized through the right opposite direction of the third indication position 31 and the through hole 24, the positioning capability is quick and accurate, the positioning operation is simpler and more convenient, the intelligent card manufacturing component is easier to process, and the production efficiency and the qualification rate of the intelligent card are improved. Specifically, the through hole 24 may be a round hole, a square hole, a triangular hole or another hole, and the third indicator bit 31 is consistent with the shape of the through hole 24, so as to facilitate alignment of the through hole 24 with the third indicator bit 31.
Of course, the second indicator bit 12 and the third indicator bit 31 may be set at the same time, and the upper end of the through hole 24 formed in the middle frame 2 corresponds to the second indicator bit 12, and the lower end corresponds to the third indicator bit 31. Therefore, through the through holes 24 corresponding to the second indication bit 12 and the third indication bit 31 at the same time, the positioning of the upper substrate 1, the middle frame 2 and the lower substrate 3 can be realized, the structure is simple, and the influence on the stability of the middle frame 2 caused by too many through holes 24 arranged on the middle frame 2 is avoided.
Further, as shown in fig. 1, 4 and 6, in the embodiment of the present invention, the second indicator bit 12, the third indicator bit 31 and the through holes 24 are four, and two ends of each through hole 24 are opposite to the corresponding second indicator bit 12 and third indicator bit 31 respectively. The upper substrate 1, the middle frame 2 and the lower substrate 3 are more easily and accurately positioned, and the production efficiency is high. Specifically, the second indicator bit 12 and the third indicator bit 31 may be correspondingly disposed on the upper substrate 1 and the lower substrate 3 in a printing manner, and the shapes of the second indicator bit 12 and the third indicator bit 31 may be the same as the outline of the through hole 24, for example, when the through hole 24 is a round hole, the second indicator bit 12 and the third indicator bit 31 are printed round frames, and the second indicator bit 12 and the third indicator bit 31 may also be indicator through holes 24 or indicator protrusions respectively disposed on the upper substrate 1 and the lower substrate 3. When the lower substrate 3 portion on which the third indicating bits 31 are printed is transparent for assembly, the positioning of the third indicating bits 31 and the through holes 24 is seen from the lower surface of the lower substrate.
Specifically, the lower surface of the lower substrate 3 is provided with a printing area 8 and a non-printing area, and the upper surface of the upper substrate 1 may be provided with a printing area and a non-printing area, and customized printing may be performed in the printing area 8 according to customer requirements. The part of the lower substrate 3 corresponding to the non-printing area is a transparent area 32, and when the third indication bit 31 is printed on the corresponding transparent area 32, the third indication bit can be seen through the lower surface of the lower substrate 3, so that the positioning is convenient.
The smart card manufacturing process provided by the embodiment of the invention can be based on the smart card manufacturing assembly of any one of the previous embodiments, and comprises the following steps:
s1, preparing an upper substrate 1, a middle frame 2 and a lower substrate 3;
s3, fixing the middle frame 2 on the lower surface of the upper substrate 1 by making the lower surface of the upper substrate 1 upper;
s4, filling glue solution into the hollow cavity 21;
s5, fixing the lower substrate 3 on the lower surface of the middle frame 2;
s6, laminating the upper substrate 1, the middle frame 2 and the lower substrate 3, and extruding air and/or redundant glue solution in the hollow cavity 21 into the glue overflow groove 22 and curing the glue solution when laminating the upper substrate 1, the middle frame 2 and the lower substrate 3.
According to the manufacturing process of the smart card, glue solution is filled into the hollow cavity 21, and air and redundant glue solution in the hollow cavity 21 are extruded into the glue overflow groove 22 in a laminated mode, so that the problem that bubbles are formed in the pouring sealant 6 formed by solidifying the glue solution or the smart card does not meet the thickness specification and is poor in surface flatness due to the fact that the pouring sealant 6 is too thick and uneven can be avoided, the adhesion of the pouring sealant 6 to the upper substrate 1 and the lower substrate 3 is improved, layering is avoided, the fact that the smart card meets the card thickness specification is guaranteed, the surface flatness, the structural stability and the product percent of pass of the smart card are improved, and the service life of the smart card is prolonged. In order to bond the upper substrate 1, the middle frame 2, and the lower substrate 3 better, it is preferable to fill the hollow cavity 21 with a slight excess glue solution.
Further, in the embodiment of the present invention, if the glue tank 23 is provided on the middle frame 2, the glue tank 23 is provided on the middle frame 2 when the middle frame 2 is prepared in step S1; when the upper substrate 1, the middle frame 2 and the lower substrate 3 are laminated in this way, air and excessive glue solution (if air or excessive glue solution exists) in the hollow cavity 21 are extruded into the glue overflow groove 22, and when the air or excessive glue solution is more, the air and excessive glue solution can also be extruded into the glue storage groove 23 through the glue overflow groove 22. So that bubbles can be prevented from being formed in the potting adhesive 6 during curing, the adhesion force of the potting adhesive 6 to the upper substrate 1 and the lower substrate 3 is enhanced, layering is avoided, and the structural stability and the service life of the smart card are ensured; the manufacturing process can produce the intelligent card meeting the thickness requirement through simple operation, and the produced intelligent card has high qualification rate and high production efficiency.
Further, in the embodiment of the present invention, if the flexible circuit board 5 and the display screen 4 are provided, step S2 is performed between step S1 and step S3, where step S2 includes: the flexible circuit board 5 and the display panel 4 are fixed to the lower surface of the upper substrate 1. After the display screen 4 and the flexible circuit board 5 are fixed on the upper substrate 1, glue is filled, so that the display screen 4 is prevented from tilting and shifting, the display screen 4 is ensured to be in the normal position, and the display performance is improved.
Further, in the embodiment of the present invention, if the first indicator bit 11 is set, the first indicator bit 11 is set on the upper substrate 1 when the upper substrate 1 is prepared in step S1, specifically, the first indicator bit 11 for indicating the placement position of the display screen 4 may be printed on the lower surface of the upper substrate 1, and the first indicator bit 11 is printed to position the display screen, so that the process is simpler, which is beneficial to maintaining the flatness of the lower surface of the upper substrate 1, reducing the positioning deviation, and increasing the stability of the upper substrate 1.
When the first indication bit 11 is provided, the step of fixing the flexible circuit board 5 and the display screen 4 to the upper substrate 1 in the step S2 preferably includes: brushing glue on the lower surface of the upper substrate 1, adhering the flexible circuit board 5 and the display screen 4 on the lower surface of the upper substrate 1, wherein the display screen 4 is positioned at the first indication position 11; the display screen 4 is positioned through the first indicating position 11, and the position of the flexible circuit board 5 is restrained by the display screen 4, so that after the display screen 4 and the flexible circuit board 5 are positioned, glue filling is performed, the display screen 4 can be prevented from tilting and shifting, the display screen 4 is ensured to be in a normal position, and the display performance is improved.
Further, in the embodiment of the present invention, if the through hole 24 and the second indicator bit 12 are provided, the through hole 24 is provided on the middle frame 2 when the middle frame 2 and the upper substrate 1 are prepared in step S1, specifically, the through hole 24 is provided on the middle frame 2, and the second indicator bit 12 corresponding to the through hole 24 is printed on the lower surface of the upper substrate 1; the printed second indication bit 12 and the through hole 24 are correspondingly positioned, so that the process is simpler, the flatness of the lower surface of the upper substrate 1 is kept, the positioning deviation is reduced, and the stability of the upper substrate 1 is improved.
When the through hole 24 and the second indicator 12 are provided, the step of fixing the middle frame 2 to the upper substrate 1 preferably includes: the lower surface of the upper substrate 1 is glued, the through holes 24 are aligned with the second indication positions 12, and the middle frame 2 is adhered to the lower surface of the upper substrate 1. The lower surface of the upper substrate 1 is brushed with glue, the middle frame 2 is placed on the upper substrate 1 when the through holes 24 and the second indication positions 12 are aligned, so that the middle frame 2 and the upper substrate 1 can be rapidly and accurately positioned, the positioning operation is simpler and more convenient, the qualification rate of the smart card is improved, the production efficiency is improved, and the smart card manufacturing assembly is easier to process and has higher production efficiency.
The display screen 4, the flexible circuit board 5 and the middle frame 2 are fixed on the upper substrate 1 in an adhering mode, the operation is simple and convenient, the assembly efficiency is high, the processing time of the smart card is shortened, the production efficiency is higher, the upper substrate 1 and the middle frame 2 are adhered, the upper substrate 1 and the middle frame 2 can be primarily fixed, the abnormal positions of the upper substrate 1 and the middle frame 2 during lamination are avoided, glue solution seeping out from between the upper substrate 1 and the middle frame 2 during glue filling can be avoided, and the positioning of the upper substrate 1 and the middle frame 2 is ensured. When the second indication position 12 and the through hole 24 are arranged, the through hole 24 is opposite to the second indication position 12, so that the positioning between the upper substrate 1 and the middle frame 2 is realized, the positioning capability is quick and accurate, the positioning operation is simpler and more convenient, the qualification rate of the smart card is improved, and the production efficiency is improved.
Further, in the embodiment of the present invention, if the through hole 24 and the third indicator bit 31 are provided, the through hole 24 is provided on the middle frame 2, the third indicator bit 31 is provided on the lower substrate 3 when the middle frame 2 and the lower substrate 3 are prepared in step S1, specifically, the through hole 24 is provided on the middle frame 2, and the third indicator bit 31 corresponding to the through hole 24 is printed on the upper surface of the lower substrate 3; the third indication position 31 and the through hole 24 are correspondingly positioned, so that the process is simpler, the flatness of the upper surface of the lower substrate 3 is kept, the positioning deviation is reduced, and the stability of the lower substrate 3 is improved.
When the through hole 24 and the third indication position 31 are provided, the step of fixing the lower substrate 3 to the middle frame 2 preferably includes: the upper surface of the lower substrate 3 is coated with glue, the third indication position 31 is aligned with the through hole 24, and the lower substrate 3 is adhered to the lower surface of the middle frame 2. The upper surface of the lower substrate 3 is brushed with glue, and when the through holes 24 and the third indication positions 31 are aligned, the lower substrate 3 is placed on the middle frame 2, so that the positioning and bonding of the middle frame 2 and the lower substrate 3 can be realized, the intelligent card manufacturing assembly is easier to process, and the production efficiency is higher.
The lower substrate 3 is adhered to the middle frame 2, so that the lower substrate 3 and the middle frame 2 can be preliminarily fixed, the dislocation of the lower substrate 3 and the middle frame 2 during lamination is avoided, glue solution can be prevented from seeping out from the connecting surface of the lower substrate 3 and the middle frame 2, and the positioning of the lower substrate 3 and the middle frame 2 is ensured.
Further, in the embodiment of the present invention, step S7 is performed after step S6, and step S7 includes: the edge region is blanked out. The smart card obtained by removing the card making edge area can avoid the influence of the hollow structure of the positioning hole and the glue storage groove 23 on the stability of the smart card edge area, namely, the smart card with the punched edge area has better structural stability.
The following describes in detail a preferred smart card manufacturing process according to an embodiment of the present invention with reference to the accompanying drawings:
1) As shown in fig. 1, the upper substrate 1 is first placed in the opposite direction with its inner side (i.e., the lower surface of the upper substrate 1) facing upwards, and in fig. 1, a first indicator bit 11 and four second indicator bits 12 on the upper substrate 1 can be seen;
2) As shown in fig. 2, the inner side of the upper substrate 1 is firstly coated with glue, and then the display screen 4 and the flexible circuit board 5 are adhered to the upper substrate 1, wherein the display screen 4 corresponds to the first indication position 11; in fact the first indicator bit 11 indicates the position of the display screen 4, and the display screen 4 in turn limits the fixed position of the flexible circuit board 5; the display screen 4 selects a liquid crystal screen; the first indicator bit 11 is a printed wire frame;
3) As shown in fig. 5, the middle frame 2 is bonded to the upper substrate 1, and the through holes 24 of the middle frame 2 are aligned with the second indication bits 12 on the upper substrate 1. In fig. 3-4 it can be seen that the middle frame 2 has a hollow cavity 21, four glue overflow grooves 22, four glue storage grooves 23 and four through holes 24; the second indication bit 12 is a printing round frame, and the through hole 24 is a printing round frame;
4) Filling excess glue into the hollow cavity 21;
5) The lower substrate 3 is glued on the inner side of the lower substrate 3 (i.e. the upper surface of the lower substrate 3), the lower substrate 3 is glued to the middle frame 2, and the third indication position 31 of the lower substrate 3 is aligned with the through hole 24 of the middle frame 2. In fig. 6 it can be seen that the upper surface of the lower substrate 3 has four third indication bits 31; the third indication bit 31 is a printed circular frame;
6) The upper substrate 1, the middle frame 2 and the lower substrate 3 are moved to a laminating device for lamination, the redundant glue solution in the hollow cavity 21 can be extruded into a glue storage groove 23 through a glue overflow groove 22, and air can be discharged to the glue storage groove 23; after the glue solution in the hollow cavity 21 is solidified, the primary product of the smart card is prepared;
7) And blanking the smart card initial product to obtain a smart card finished product, as shown in figures 7-8.
The preferred smart card manufacturing process has the following advantages:
1) The liquid crystal display is accurately positioned through the printing wire frame on the upper substrate 1, and the operation is simple and the production efficiency is high.
2) The upper substrate 1, the middle frame 2 and the lower substrate 3 are precisely positioned through round holes and a printing round frame.
3) The middle frame 2 is provided with the glue overflow groove 22 and the glue storage groove 23, after the intelligent card is laminated by glue filling, the thickness of the card meets the standard requirement of the card, and the glue in the display area of the card is not easy to generate bubbles.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (11)
1. The intelligent card manufacturing assembly comprises an upper substrate, a middle frame and a lower substrate which are sequentially arranged, and is characterized in that a hollow cavity is formed among the upper substrate, the middle frame and the lower substrate, the hollow cavity is used for glue filling to connect the upper substrate, the middle frame and the lower substrate, a glue overflow groove is formed in the middle frame, and one end of the glue overflow groove is communicated with the hollow cavity; the middle frame is provided with a glue storage groove which is communicated with the hollow cavity through the glue overflow groove; when the upper substrate, the middle frame and the lower substrate are laminated, air and/or redundant glue solution in the hollow cavity is extruded into the glue overflow groove or is extruded into the glue storage groove through the glue overflow groove, and the depth of the glue storage groove is larger than that of the glue overflow groove.
2. The smart card manufacturing assembly of claim 1, wherein the glue overflow groove is located at a side of the middle frame close to the upper substrate.
3. The smart card manufacturing assembly of any one of claims 1-2, further comprising a flexible circuit board and a display screen disposed within the hollow cavity, the flexible circuit board being electrically connected to the display screen.
4. A smart card manufacturing assembly according to claim 3, wherein the upper substrate is provided with a first indication position for indicating a placement position of the display screen, and the display screen is adhered to the upper substrate corresponding to the first indication position.
5. The smart card manufacturing assembly as claimed in any one of claims 1-2, wherein a through hole is formed in the middle frame, and a second indication bit corresponding to the through hole is formed on a lower surface of the upper substrate.
6. The smart card manufacturing assembly as claimed in any one of claims 1-2, wherein a through hole is provided in the middle frame, and a third indication position corresponding to the through hole is provided on the upper surface of the lower substrate.
7. A smart card manufacturing process based on a smart card manufacturing assembly as claimed in claim 1, comprising the steps of:
fixing the middle frame on the lower surface of the upper substrate;
filling glue solution into the hollow cavity;
fixing the lower substrate on the lower surface of the middle frame;
laminating the upper substrate, the middle frame and the lower substrate, so that air and/or redundant glue solution in the hollow cavity is extruded into the glue overflow groove, and curing the glue solution.
8. A smart card manufacturing process based on a smart card manufacturing assembly as claimed in claim 7, further comprising the steps of, prior to fixing said intermediate frame to said upper substrate: the flexible circuit board and the display screen are fixed on the lower surface of the upper substrate.
9. The smart card manufacturing process of claim 8, further comprising the steps of, prior to securing the flexible circuit board and the display screen to the upper substrate: printing a first indication bit for indicating the placement position of the display screen on the lower surface of the upper substrate;
the step of fixing the flexible circuit board and the display screen on the upper substrate comprises the following steps: and brushing glue on the lower surface of the upper substrate, adhering the flexible circuit board and the display screen to the lower surface of the upper substrate, and positioning the display screen at the first indication position.
10. The smart card manufacturing process of claim 7, further comprising the steps of, prior to securing the center to the upper substrate: a through hole is formed in the middle frame, and a second indication position corresponding to the through hole is printed on the lower surface of the upper substrate;
the step of fixing the middle frame on the upper substrate comprises the following steps: and brushing glue on the lower surface of the upper substrate, aligning the through holes with the second indication positions, and bonding the middle frame on the lower surface of the upper substrate.
11. The smart card manufacturing process of claim 7, further comprising the steps of, prior to securing the center to the upper substrate: a through hole is formed in the middle frame, and a third indication position corresponding to the through hole is printed on the upper surface of the lower substrate;
the step of fixing the lower substrate to the middle frame includes: and brushing glue on the upper surface of the lower substrate, aligning the third indication position with the through hole, and bonding the lower substrate on the lower surface of the middle frame.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710209628.6A CN106980891B (en) | 2017-03-31 | 2017-03-31 | Smart card manufacturing assembly and smart card manufacturing process |
| PCT/CN2018/078137 WO2018177086A1 (en) | 2017-03-31 | 2018-03-06 | Smart card manufacturing assembly and process |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710209628.6A CN106980891B (en) | 2017-03-31 | 2017-03-31 | Smart card manufacturing assembly and smart card manufacturing process |
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| CN106980891B true CN106980891B (en) | 2024-02-13 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106980891B (en) * | 2017-03-31 | 2024-02-13 | 深圳市文鼎创数据科技有限公司 | Smart card manufacturing assembly and smart card manufacturing process |
| US20200167626A1 (en) * | 2017-08-18 | 2020-05-28 | Excelsecu Data Technology Co., Ltd. | Smart card and manufacturing method therefor |
| CN110443340B (en) * | 2019-08-06 | 2023-07-07 | 上海中卡智能卡有限公司 | Smart card processing method and smart card |
| CN112677046A (en) * | 2020-12-22 | 2021-04-20 | 金华博蓝特电子材料有限公司 | Polishing pad dresser and manufacturing method thereof |
| CN112739127A (en) * | 2020-12-28 | 2021-04-30 | 维沃移动通信有限公司 | Electronic device |
| CN113327511B (en) * | 2021-06-03 | 2023-05-12 | 业成科技（成都）有限公司 | Display device and electronic apparatus |
| CN113927900B (en) * | 2021-08-03 | 2023-10-13 | 芜湖市爱三迪电子科技有限公司 | Photocuring 3D printer of leak protection liquid |
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Also Published As
| Publication number | Publication date |
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| CN106980891A (en) | 2017-07-25 |
| WO2018177086A1 (en) | 2018-10-04 |
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