CN103093271A - Double-interface intelligent card manufacture process and double-interface intelligent card - Google Patents
Double-interface intelligent card manufacture process and double-interface intelligent card Download PDFInfo
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- CN103093271A CN103093271A CN2013100063025A CN201310006302A CN103093271A CN 103093271 A CN103093271 A CN 103093271A CN 2013100063025 A CN2013100063025 A CN 2013100063025A CN 201310006302 A CN201310006302 A CN 201310006302A CN 103093271 A CN103093271 A CN 103093271A
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Abstract
The invention provides double-interface intelligent card manufacture process and a double-interface intelligent card. The manufacture process comprises INLAY manufacture which specifically comprises the following steps of punching, punching through an automatic punching machine and full version chip position holes; winding, adopting an ultrasonic winding technology to achieve a non-contact function of a double-interface intelligent card; adhesive applying and sealing, adopting thermosensitive adhesive with improved flowability to achieve non-excessive-glue during lamination, and hollowing the adhesive at the position where a chip needs butt-welding; butt-welding, connecting the chip and a coil; composition, laminating a layer of soft PVC or PET substrate on a coil face of a chip encapsulating layer to protect an electronic coil circuit, and fixing the substrate through spot welding corresponding to locating holes; and lamination, performing lamination in a laminating device. Under the condition of low cost, the double-interface intelligent card manufacture process completes high-speed encapsulation manufacture and personalization of the card, and can be practically applied to product industrialization.
Description
Technical field
The present invention relates to smart card manufacture craft and smart card, particularly a kind of double-interface smart card manufacture craft and double-interface smart card.
Background technology
At present, the magnetic stripe bank card is stolen, copies and to be used for the phenomenon of illegal activities more and more, have a strong impact on citizen's information and property safety, therefore the American-European state that waits comes into effect EMV standard (international three biggest banks blocks the technical standard that the bank card of organizing Continental Europe card, Master Card and Visa Card jointly to initiate to formulate shifts from magnetic stripe card to intellective IC card), and the important smart card such as bank card begins to turn to chip card by magnetic stripe card.Our country has announced the standard (Chinese Financial IC Card Standard) of PBOC2.0 also according to s own situation, and requires each bank to complete financial chip card conversion in State Council sets the time limit.
On market, the manufacturing process of smart card comprises following several now:
1, because new chip belongs to two interface chips, namely comprise contact-carrying and the chip that is integrated of two kinds of smart card working methods of contact-carrying not, therefore, this smart card can only adopt the single deck tape-recorder manufacture, also needs the electronic coil in the combined with intelligent card when chip package, chip package place's groove milling at individual card, then by hand to the electronic coil take-up, the end of a thread is spot welded on chip contacts, then places a slice hot melt adhesive under chip, send into sealed in unit by hot pressing mode, chip package is fixed.After this, card is sent into personalization device, through the pre-individualized system that writes of 90 seconds, then complete whole blocking through formal individualized operation and do, this scheme only can be used for product sample, is not suitable for industrialization.
Its major defect is:
Production efficiency is low, and this scheme needs a large amount of manpowers to go to make by hand, does not meet the demand for development of technology enterprise;
Product percent of pass is low, and artificial take-up and spot welding need to have great patience and fineness, and yield rate is lower, a skilled operative employee, about more than 150 of the output of one day, qualification rate approximately 70%;
In the pre-individualized stage, owing to can only adopt single deck tape-recorder to make, based on equipment on the market, can only carry out at most the pre-individualized of three cards at every turn, the production time is long;
Production cost is high, and a large amount of manpowers have improved production cost, and low qualification rate can not be used for mass production fully.
2, abroad current technique is by the chip package place's groove milling at individual card, until expose the coil metal part of card, inserts high-performance conducting resin, the chip of fitting again, by hot pressing, the mode of colding pressing, chip is fixed on card, this is comparatively ripe at present a solution.
Its major defect is:
Production efficiency is low, and reach high production capacity needs numerous equipment investment runnings, and card is inserted conductive glue, expends time in production procedure;
Production cost is high, in the application of financial IC card, there is requirement in life-span of card, generally need 3-5, even more permanent, therefore, the performance requirement of glue is higher, the extraordinary glue as only several the enterprises of Germany or the U.S. that uses at present, price is very expensive, simultaneously, and large usage quantity, increased the cost of whole card, be unfavorable for permanent operation and produce in enormous quantities;
Simultaneously, this technique is also the single deck tape-recorder production program, and the individualized stage is expended the more time equally in advance.
The way of the company that 3, domestic smart card industry is leading is, first two interface chips are carried out gum and encapsulate out metal wire on the contact, by the accurate slotter of special double-interface card, card is carried out groove milling, the coil position of Ka Jinei can be milled out aperture, metal wire on the docking chip, encapsulation.
Its major defect is:
Near harshness, qualification rate can be subject to the mould impact of exact instrument to technique to the requirement of precision, frequent more mold exchange, and cost can improve, if but frequent mold exchange more not, the qualification rate of product own can reduce;
Belong to single deck tape-recorder together and make, individualized problem can't solve in advance.
In the manufacturing process of above-mentioned the 2nd kind and the 3rd kind smart card, also there is a safety problem, if be that financial chip card is lost, the winner can directly take off chip, then be packaged on copy card, can make the security of the card types such as credit card can not get ensureing, be only the making of having reached card, and essence does not reach the safety requirements of expectation.
Summary of the invention
The technical problem to be solved in the present invention to be that in prior art, production efficiency is low, production cost is high in order overcoming, to have the defectives such as potential safety hazard, a kind of low cost, high efficiency is provided and satisfies the double-interface smart card manufacturing process of safety requirements and the double-interface smart card that goes out with this fabrication process.
The present invention solves above-mentioned technical matters by following technical proposals:
A kind of double-interface smart card manufacture craft, its characteristics be, it comprises that one kind of an INLAY(contains by multilayer PVC sheet material the pre-laminated product that chip and coil layer are combined) make, this INLAY makes and specifically comprises the following steps:
Punching, die-cut by automatic punch machine and full version chip position hole;
Coiling adopts ultrasound wave coiling technology to realize the non-contact function of double-interface smart card;
Gum and encapsulation are adopted through the improved heat-sensitive glue of mobility, and realizing the glue that do not overflow when the lamination, and this chip needs butt-joint position hollow out on gum;
Butt-joint connects chip and coil;
Compound, the soft PVC(Polyvinylchloride of stack one deck on chip package layer coil surface) or the PET(polyethylene terephthalate) base material, with protection electronic coil circuit, corresponding pilot hole spot welding is fixed;
Lamination carries out lamination in laminating apparatus.
Preferably, this gum and packaging technology also are included in chip surface and are covered with resistant to elevated temperatures adhesive tape, and to protect the chip outward appearance and to be controlled to the core of the card sheet height, this adhesive tape tears off after lamination step is completed.
Preferably, this butt-joint technique is the chip hollow part to be connected butt-joint connect with the coil connectors place, makes chip be connected with coil and connects.If by force chip is separated with coil, can cause the damage of chip, so just can guarantee, if smart card is lost, other people can't take off chip in good condition from smart card, have guaranteed the security of smart card.
Preferably, this laminating technology need to be on the position of corresponding chip on high temperature cloth and laminate steel the position hollow out of corresponding chip, prevent that chip from damaging.
Preferably, the double-interface smart card manufacture craft also comprises the ATR(reset answer of an INLAY) select to reply with ATS() detect and the INLAY step that individualizes in advance, on the individualized platform of multiple-head type, this chip is carried out ATR and ATS detection, the non-defective unit situation of pio chip individualizes in advance to this chip on the individualized platform of this multiple-head type.
Preferably, this individualized platform is the non-conductive medium of a level, and this non-conductive medium has some contactless electronic coils.
Preferably, the double-interface smart card manufacture craft is further comprising the steps of:
Plate-making adopts the CTP(off line directly to make a plate) laser plate-making;
Printing is printed the plate to PVC with the pattern on the CTP version;
Punching is to the chip position punching of reserving on the PVC plate, so that exposed chip.
Preferably, the double-interface smart card manufacture craft is further comprising the steps of:
Finished product is compound, and INLAY and the positive and negative surface and PVC plate after punching after individualizing in advance is superimposed, and corresponding pilot hole spot welding is fixed;
The finished product lamination, the material after finished product is compound is sent into laminating apparatus and is carried out lamination;
Die-cut, the material after the finished product lamination is sent into die cutting device carry out die-cut;
Individualized, the finished chip after die-cut is sent into personalization device individualize.
Preferably, this finished product laminating technology need to be on the position of corresponding chip on high temperature cloth and laminate steel the position hollow out of corresponding chip, prevent that chip from damaging.
By the double-interface smart card that above-mentioned double-interface smart card manufacture craft is made, its characteristics are, the chip of this double-interface smart card is connected with the coil butt-joint.
Positive progressive effect of the present invention is: double-interface smart card manufacturing process provided by the invention is under prerequisite cheaply, and the high speed encapsulation of completing card is made and be individualized, and can be actually used in the product industrialization.Double-interface smart card provided by the invention has solved the safety problem after chip is stolen.
Description of drawings
Fig. 1 is the process flow diagram of the double-interface smart card manufacturing process of preferred embodiment of the present invention.
Fig. 2 is the coil schematic diagram of completing in the double-interface smart card manufacturing process of preferred embodiment of the present invention after wire winding.
Fig. 3 is the justifying coil schematic diagram of completing in the double-interface smart card manufacturing process of preferred embodiment of the present invention after wire winding.
Fig. 4 is the structure skeleton diagram of the double-interface smart card of preferred embodiment of the present invention.
Embodiment
The below lifts a preferred embodiment, and comes by reference to the accompanying drawings the clearer the present invention that intactly illustrates.
The invention provides a kind of double-interface smart card manufacturing process and double-interface smart card.As shown in Figure 1, the double-interface smart card manufacturing process specifically can be divided into following step:
One, the making of INLAY, detection and pre-individualized
1, INLAY makes
A, punching
By automatic punch machine (automatically fixation and recognition mark cut circular pilot hole) and full version chip position hole die-cut (the directly punching of full version does not exist the stepping error of traditional punching, the position precision in assurance hole when molding).
B, coiling
Double-interface card has non-contact function and namely relates to wire winding, adopts ultrasound wave coiling technology, can according to customer demand, change coiling size and line style.Coil after coiling is completed is as shown in Fig. 2,3, and coil has two the end of a thread, and these two the end of a thread are connected by following butt-joint technique with chip.
C, gum, packing integral machine
All-in-one has improved the stability of production efficiency and production technology greatly.
Material: make for large and adopt through the improved heat-sensitive glue of mobility, but not the hot melt adhesive of traditional IC-card processing can guarantee the glue that do not overflow when lamination, and this heat-sensitive glue is than the cheap approximately price of 16 times of the conductive glue of mentioning in background technology.
Gum: chip need butt-joint position hollow out on gum, for follow-up butt-joint technique is prepared, truly realize the function at " two interface ", separately be covered with resistant to elevated temperatures adhesive tape at chip surface, reach the function of protecting the chip outward appearance and being controlled to the core of the card sheet height.Owing to being that large account is made, so this adhesive tape can be overlayed on the chip of a row INLAY, as shown in Figure 3, can overlaying on three of level with three adhesive tapes respectively and arrange on the chip of INLAY.
Encapsulation: the parameter of adjusting software by encapsulation is come the positioning chip package position, guarantees the consistance of chip putting position, and because chip is unified standard in the position of card face, after confirming through adjustment, i.e. parameter locking is no longer adjusted, the stability of being convenient to produce in batches.
D, butt-joint
There is the butt-joint of robotization butt-joint equipment to be connected the chip hollow part with the coil connectors place, this parameter can arrange based on chip package layer and coil shape, this operation can connect butt-joint by disposable chip package layer to 27, this stage is connected chip and connects with coil, physics is peeled off and will be caused chip to damage.
E, compound
At the chip package layer, the stack soft PVC of one deck or PET base material on coil surface, with protection electronic coil circuit, corresponding pilot hole spot welding is fixed.
F, INLAY lamination
Above-mentioned material is put into laminating apparatus, carries out lamination, by high temperature cloth (a kind of surface scribbles the yarn fabric of heat-resistant layer, and thickness is 0.12mm, under 140 degree high temperature not can with PVC or PET material binding, play heat insulation, buffer action) corresponding chip place hollow out.Corresponding, the laminate steel place is hollow out also, in case stop loss bad chip, after completing, tears the adhesive tape that sticks in the C gum stage off, and finished product is INLAY.
2, ATR and ATS detect
INALY is placed on the individualized platform of multiple-head type, the individualized platform of so-called multiple-head type is the non-conductive medium of a level, the contactless electronic coil that corresponding each chip position of view picture chip package layer arranged under it, connection data equipment, can carry out ATR and ATS detection this moment to chip, the non-defective unit situation of each chip of output on display.
3, pre-individualized
At above-mentioned individualized platform, start the pre-individualized input to chip, this process continues approximately 90 seconds, and the radix that INALY can corresponding Card Reader coil increases disposable pre-individualized quantity.
Two, the plate-making of printing surface, printing and punching
1, plate-making
Due to large singularity of making, increase the printing of printing pilot hole during the CTP laser plate-making, increase the punching position degree of accuracy.
2, printing
Due to needs printing punching position, on the original basis, position and the size (the machine printing is less than the size of design, and reverse printed is drawn rule and drags tip transposition) of drawing rule and dragging the tip have been revised.
3, punching
To the chip position punching of reserving on printing surface, so that exposed chip.
Three, in the making of having completed above-mentioned INLAY, detection, in advance after the steps such as plate-making, printing, punching of individualized and printing surface, then INLAY is completed following steps together with printing surface:
1, finished product is compound
INLAY and positive back face printing face (portioned product is the film of stackable transparent wear also) is superimposed, and corresponding pilot hole spot welding is fixed.
2, finished product lamination
Above-mentioned material after compound is sent into laminating apparatus, same, to high temperature cloth and the corresponding chip position of laminate steel place hollow out, protection chip.
3, die-cut
Finished product after above-mentioned lamination is sent into die cutting device, according to product standard, punch out the specification card, make the special-purpose registering of die-cut self check, after die-cut, control in real time product quality.
4, individualized
With the finished product card after die-cut, send into personalization device, whole card is carried out complete individualizing, comprise data inside chips (such as cardholder information, accounts information etc.), card face data (such as holder name, photo, card number, holographic mark etc.) and physical appearance.
The chip of the double-interface smart card that is made by above-mentioned double-interface smart card manufacture craft is connected with the coil butt-joint.Its structure as schematically shown in Figure 4, comprising INLAY1 and printing surface 2.
Although more than described the specific embodiment of the present invention, it will be understood by those of skill in the art that this only illustrates, protection scope of the present invention is limited by appended claims.Those skilled in the art can make various changes or modifications to these embodiments under the prerequisite that does not deviate from principle of the present invention and essence, but these changes and modification all fall into protection scope of the present invention.
Claims (10)
1. a double-interface smart card manufacture craft, is characterized in that, it comprises that an INLAY makes, and this INLAY makes and specifically comprises the following steps:
Punching, die-cut by automatic punch machine and full version chip position hole;
Coiling adopts ultrasound wave coiling technology to realize the non-contact function of double-interface smart card;
Gum and encapsulation are adopted through the improved heat-sensitive glue of mobility, and realizing the glue that do not overflow when the lamination, and this chip needs butt-joint position hollow out on gum;
Butt-joint connects chip and coil;
Compound, the stack soft PVC of one deck or PET base material on chip package layer coil surface, with protection electronic coil circuit, corresponding pilot hole spot welding is fixed;
Lamination carries out lamination in laminating apparatus.
2. double-interface smart card manufacture craft as claimed in claim 1; it is characterized in that; this gum and packaging technology also are included in chip surface and are covered with resistant to elevated temperatures adhesive tape, and to protect the chip outward appearance and to be controlled to the core of the card sheet height, this adhesive tape tears off after lamination step is completed.
3. double-interface smart card manufacture craft as claimed in claim 1, is characterized in that, this butt-joint technique is the chip hollow part to be connected butt-joint connect with the coil connectors place, makes chip be connected with coil and connects.
4. double-interface smart card manufacture craft as claimed in claim 1, is characterized in that, this laminating technology need to be on the position of corresponding chip on high temperature cloth and laminate steel the position hollow out of corresponding chip, prevent that chip from damaging.
5. double-interface smart card manufacture craft as claimed in claim 1, it is characterized in that, step that this double-interface smart card manufacture craft comprises also that the ATR of an INLAY and ATS detect and an INLAY individualizes in advance, on the individualized platform of multiple-head type, this chip is carried out ATR and ATS detection, the non-defective unit situation of pio chip individualizes in advance to this chip on the individualized platform of this multiple-head type.
6. double-interface smart card manufacture craft as claimed in claim 5, is characterized in that, this individualized platform is the non-conductive medium of a level, and this non-conductive medium has some contactless electronic coils.
7. double-interface smart card manufacture craft as claimed in claim 5, is characterized in that, this double-interface smart card manufacture craft is further comprising the steps of:
The CTP laser plate-making is adopted in plate-making;
Printing is printed the plate to PVC with the pattern on the CTP version;
Punching is to the chip position punching of reserving on the PVC plate, so that exposed chip.
8. double-interface smart card manufacture craft as claimed in claim 7, is characterized in that, this double-interface smart card manufacture craft is further comprising the steps of:
Finished product is compound, and INLAY and the positive and negative surface and PVC plate after punching after individualizing in advance is superimposed, and corresponding pilot hole spot welding is fixed;
The finished product lamination, the material after finished product is compound is sent into laminating apparatus and is carried out lamination;
Die-cut, the material after the finished product lamination is sent into die cutting device carry out die-cut;
Individualized, the finished chip after die-cut is sent into personalization device individualize.
9. double-interface smart card manufacture craft as claimed in claim 8, is characterized in that, this finished product laminating technology need to be on the position of corresponding chip on high temperature cloth and laminate steel the position hollow out of corresponding chip, be used for preventing that chip from damaging.
10. the double-interface smart card that adopts double-interface smart card manufacture craft as described in any one in claim 1-9 to be made is characterized in that the chip of this double-interface smart card is connected with the coil butt-joint.
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| CN103413674A (en) * | 2013-06-09 | 2013-11-27 | 北京三友恒瑞科技有限公司 | Winding method for coils applied in antenna of dual interface card |
| CN103871935A (en) * | 2014-03-19 | 2014-06-18 | 东莞市曙光自动化设备科技有限公司 | Chip back gluing and packaging device |
| CN105680149A (en) * | 2016-01-15 | 2016-06-15 | 深圳市骄冠科技实业有限公司 | Antenna chip inlay and device and technology for manufacturing antenna chip inlay |
| CN106980891A (en) * | 2017-03-31 | 2017-07-25 | 深圳市文鼎创数据科技有限公司 | Smart card fabrication component and smart card manufacturing process |
| CN107038474A (en) * | 2017-03-31 | 2017-08-11 | 深圳市文鼎创数据科技有限公司 | Smart card manufacturing process |
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| CN108073972A (en) * | 2017-12-29 | 2018-05-25 | 靖州鑫兴智能科技有限公司 | A kind of double interface chip IC card and preparation method thereof |
| CN109624455A (en) * | 2018-12-03 | 2019-04-16 | 上海安全印务有限公司 | A kind of lamination process technique of multilayer IC card |
| CN110411400A (en) * | 2019-07-19 | 2019-11-05 | 闽南理工学院 | A kind of punching control system and method for smart card module manufacture |
| CN111091172A (en) * | 2019-11-28 | 2020-05-01 | 安陆市鑫冠峰科技有限公司 | Smart card manufacturing process and smart card |
| CN112350129A (en) * | 2020-11-18 | 2021-02-09 | 广州展丰智能科技有限公司 | Non-contact smart card winding butt-welding production process and system |
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| CN103413674A (en) * | 2013-06-09 | 2013-11-27 | 北京三友恒瑞科技有限公司 | Winding method for coils applied in antenna of dual interface card |
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| CN105680149A (en) * | 2016-01-15 | 2016-06-15 | 深圳市骄冠科技实业有限公司 | Antenna chip inlay and device and technology for manufacturing antenna chip inlay |
| CN107038474B (en) * | 2017-03-31 | 2019-12-20 | 深圳市文鼎创数据科技有限公司 | Smart card manufacturing process |
| CN106980891A (en) * | 2017-03-31 | 2017-07-25 | 深圳市文鼎创数据科技有限公司 | Smart card fabrication component and smart card manufacturing process |
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| CN106980891B (en) * | 2017-03-31 | 2024-02-13 | 深圳市文鼎创数据科技有限公司 | Smart card manufacturing assembly and smart card manufacturing process |
| CN107766920A (en) * | 2017-10-24 | 2018-03-06 | 苏州海博智能系统有限公司 | A kind of processing method of visual intelligent card |
| CN108073972A (en) * | 2017-12-29 | 2018-05-25 | 靖州鑫兴智能科技有限公司 | A kind of double interface chip IC card and preparation method thereof |
| CN109624455A (en) * | 2018-12-03 | 2019-04-16 | 上海安全印务有限公司 | A kind of lamination process technique of multilayer IC card |
| CN110411400A (en) * | 2019-07-19 | 2019-11-05 | 闽南理工学院 | A kind of punching control system and method for smart card module manufacture |
| CN111091172A (en) * | 2019-11-28 | 2020-05-01 | 安陆市鑫冠峰科技有限公司 | Smart card manufacturing process and smart card |
| CN112350129A (en) * | 2020-11-18 | 2021-02-09 | 广州展丰智能科技有限公司 | Non-contact smart card winding butt-welding production process and system |
| CN112350129B (en) * | 2020-11-18 | 2021-12-03 | 广州展丰智能科技有限公司 | Non-contact smart card winding butt-welding production process and system |
| CN112990413A (en) * | 2021-03-09 | 2021-06-18 | 深圳源明杰科技股份有限公司 | Coil dispensing method, device, equipment and computer readable storage medium |
| CN112990413B (en) * | 2021-03-09 | 2023-07-25 | 深圳源明杰科技股份有限公司 | Coil dispensing method, device, equipment and computer readable storage medium |
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Application publication date: 20130508 |