CN106952857A - A kind of equipment processed for wafer - Google Patents
A kind of equipment processed for wafer Download PDFInfo
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- CN106952857A CN106952857A CN201710193713.8A CN201710193713A CN106952857A CN 106952857 A CN106952857 A CN 106952857A CN 201710193713 A CN201710193713 A CN 201710193713A CN 106952857 A CN106952857 A CN 106952857A
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- groove
- screw rod
- equipment
- circulation duct
- wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Abstract
The embodiment of the invention discloses a kind of equipment processed for wafer, for reducing wafer bonding to tearing the difficulty and cost of bonding open after device wafers back process is completed, wafer bonding is improved to tearing the piece rate of bonding open.Present invention method includes：First groove, sonic generator, acoustic wave transducer, rotation screw rod, clamping device and support meanss；The one end for rotating screw rod is connected with support meanss, and the other end is connected with clamping device, and clamping device is used to clamp and adsorb machine component；At least one in the first side wall of first groove, bottom, top is provided with least one support means；The bottom of first groove is provided with acoustic wave transducer, acoustic wave transducer and sonic generator connection.
Description
Technical field
The present invention relates to semiconductor device processing technology field, more particularly to a kind of equipment processed for wafer.
Background technology
With expanding economy and the improvement of people's living standards, people are increasingly intended to small-sized to electronic product requirement
Change, multifunction and environmental protection.The miniaturization of electronic product essentially asks for condensing the section of more renewals in its product
Skill achievement, to a greater extent more does electronic system technical cure in the product to increase the proportion of technical information content
Smaller, integrated level more and more higher, function is more and more, more and more stronger.
To meet the demand, semi-conductor industry needs device wafers being thinned to 100 microns or less.But ultra-thin wafers
The features such as with flexible and fragility, easy warpage and fluctuating, these features become device wafers and are thinned and the processing of thin chip
Bottleneck, so as to draw the interim bonding of wafer and tear bonding technology open.Interim bonding techniques can effectively solve thin wafer
Hold with the fragment problems in technical process, but many unstability factors during due to wafer separate, in wafer separate still
It there is very big fragment risk.At present, the media processes mode of wafer separate has laser treatment, heat sliding and Zonebond machines
Tool tears the modes such as key open, but all there is certain defect, wherein, laser treatment is limited to the slide glass wafer for glass material, and
Laser equipment is expensive；Hot slip apart makes the thin wafer after separation produce certain warpage and certain fragment wind at high temperature
Danger；Pre-soaking times of the Zonebond before bonding is torn open is longer, and needs to apply the mechanical external force for tearing bonding open, is easily caused broken
Piece, while to tear bonding apparatus cost open also higher for machinery.
The content of the invention
The embodiments of the invention provide a kind of equipment processed for wafer, the equipment can be using sound wave to wafer bonding
To splitting, equipment cost is low, and can realize once multipair wafer while tearing bonding open, and piece rate is high.
In view of this, first aspect present invention provides a kind of equipment processed for wafer, it may include：
First groove, sonic generator, acoustic wave transducer, rotation screw rod, clamping device and support meanss；
The one end for rotating screw rod is connected with support meanss, and the other end is connected with clamping device, and clamping device is used to clamp
And adsorb machine component；
At least one in the first side wall of first groove, bottom, top is provided with least one support means；
The bottom of first groove is provided with acoustic wave transducer, acoustic wave transducer and sonic generator connection.
Further, rotating screw rod includes the first screw rod and the second screw rod, the first screw rod and the second screw rod respectively with support
Device is connected；
Clamping device includes the first holding piece and the second holding piece, and the first holding piece is connected with the first screw rod, the second clamping
Piece is connected with the second screw rod.
Further, the first holding piece and the second holding piece are respectively equipped with sucker.
Further, the first side wall of the first groove is provided with liquid outlet.
Further, the first side wall of the first groove is additionally provided with inlet.
Further, equipment also includes transfer pump and circulation duct；
The two ends of circulation duct are connected with liquid outlet and inlet respectively；
Transfer pump is connected with circulation duct.
Further, equipment also includes heater, and heater is connected with circulation duct.
Further, equipment also includes filter, and filter is connected with circulation duct.
Further, equipment also includes cleaning agent feeding mechanism, and cleaning agent feeding mechanism is connected with circulation duct.
Further, equipment also includes the second groove, and the predetermined fraction of the first groove is sheathed on the inside of the second groove, the second groove
Outer is higher than the outer of the first groove.
Further, the second sidewall of the second groove is provided with leakage fluid dram, the circulation of liquid outlet one end of leakage fluid dram and the first groove
Pipeline is connected.
Further, the bottom provided with leakage fluid dram side is less than the bottom of opposite side in the second groove.
As can be seen from the above technical solutions, the embodiment of the present invention has advantages below：
The invention provides a kind of equipment processed for wafer, the equipment can be added using gripping apparatus grips and absorption
Work element, such as wafer bonding pair, clamping device clamp wafer bonding to that in the presence of screw rod is rotated, can make wafer bonding pair
Move up and down and rotate, meanwhile, the acoustic vibration effect produced by combining acoustic wave transducer can cause wafer bonding to dividing
From relative to existing technologies, wafer bonding pair can be quickly realized in the micro-structural for not damaging wafer bonding pair tears key open
Close, and equipment cost is low, piece rate is high.
Brief description of the drawings
Fig. 1 is the equipment first structure schematic diagram in the embodiment of the present invention for wafer processing；
Fig. 2 is the connection diagram of sonic generator and acoustic wave transducer in the embodiment of the present invention；
Fig. 3 is the structural representation of equipment second in the embodiment of the present invention for wafer processing；
Fig. 4 is the structural representation of equipment the 3rd in the embodiment of the present invention for wafer processing；
Fig. 5 is the structural representation of equipment the 4th in the embodiment of the present invention for wafer processing.
Embodiment
The embodiments of the invention provide a kind of equipment processed for wafer, the equipment can be using sound wave to wafer bonding
To splitting, equipment cost is low, and can realize once multipair wafer while tearing bonding open, and piece rate is high.
In order that those skilled in the art more fully understand the present invention program, below in conjunction with the embodiment of the present invention
Accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill people
The every other embodiment that member is obtained under the premise of creative work is not made, should all belong to the model that the present invention is protected
Enclose.
Term " first ", " second ", " the 3rd " in description and claims of this specification and above-mentioned accompanying drawing, "
The (if present)s such as four " are for distinguishing similar object, without for describing specific order or precedence.It should manage
The data that solution is so used can be exchanged in the appropriate case, so that the embodiments described herein can be with except illustrating herein
Or the order beyond the content of description is implemented.In addition, term " comprising " and " having " and their any deformation, it is intended that
Covering is non-exclusive to be included, for example, containing process, method, system, product or the equipment of series of steps or unit need not limit
In those steps or unit for clearly listing, but may include not list clearly or for these processes, method, production
Product or the intrinsic other steps of equipment or unit.
In the embodiment of the present invention, machine component can be to need the machine component that be separated or cleaned, herein to add
Work element illustrates to need progress exemplified by tearing the wafer bonding pair of bonding open.However, in the scope without departing from this disclosure
In the case of the concept covered, no matter wafer bonding pair is wherein described herein, the wafer bonding is to can be by another
The machine component for planting general type is substituted, and is not limited herein.
For ease of understand, below in the embodiment of the present invention be used for wafer process equipment be described, refer to Fig. 1 and
Being used for equipment one embodiment of wafer processing in Fig. 2, the embodiment of the present invention includes：
First groove 1, sonic generator 2, acoustic wave transducer 3, rotation screw rod 4, clamping device 5 and support meanss 6；
Rotating one end of screw rod 4 can be connected with support meanss 6, and the other end can be connected with clamping device 5, clamping dress
5 are put to can be used for clamping and adsorb machine component 7；
At least one in the first side wall of first groove 1, bottom, top can be provided with least one support means 6；
The bottom of first groove 1 can be provided with acoustic wave transducer 3, and acoustic wave transducer 3 can be connected with sonic generator 2.
It is changed specifically, the equipment for being used for wafer processing in the present embodiment can include the first groove 1, sonic generator 2, sound wave
Can device 3, rotation screw rod 4, clamping device 5 and support meanss 6.Wherein, the bottom of the first groove 1 can be provided with acoustic wave transducer 3,
At least one in the first side wall of first groove 1, bottom, top can be provided with least one support means 6, each support dress
Putting 6 can then be connected with rotating the two ends of screw rod 4 respectively with clamping device 5.
Further, as shown in Fig. 2 in the structure design for the equipment processed for wafer, sonic generator 2 can be with
Acoustic wave transducer 3 is connected, to provide high-frequency signal to acoustic wave transducer 2, so that the sonic generator 2 can be set with the first groove 1
Overall structure is calculated as, two monomer structures is may be designed in, does not limit herein.
It is understood that the first side wall of the first groove 1 can be four the week side of boss walls of the inside of the first groove 1 in the present embodiment
In any one side wall, it is described herein as after, later i.e. be not repeated to be defined.
In actual applications, machine component 7 can for processing (including device wafers pass through grinding, chemically mechanical polishing, carve
Erosion, PVD, plating and the critical process step for planting the Advanced Packaging such as ball) after wafer bonding pair, wherein, the first groove 1 can be used
In the solvent for containing separation wafer bonding pair；Sonic generator 2 can be used for producing high-frequency signal and send to acoustic wave transducer
3；Acoustic wave transducer 3 can produce acoustic vibration effect after high-frequency signal is received so that solvent can be to wafer bonding pair
Percussion is produced, and accelerates dissolving of the solvent to wafer bonding to intermediate gelatine layer；Rotating screw rod 4 can rotate freely and move
It is dynamic, it is possible to drive clamping device 5；Clamping device 5 can clamp wafer bonding pair, and adsorb positive and negative the two of wafer bonding pair
Face, to prevent wafer bonding to the possible risk of breakage occurred after separation；Support meanss 6 can be used for support rotating screw rod 4 with
And clamping device 5, at the same time it can also provide multiple support sites to rotation screw rod 4, multipair wafer bonding pair is torn open with realizing
Bonding operation.
It is understood that the sonic generator 2 in the present embodiment can be super/mega sonic wave generator, corresponding, sound wave
Transducer 3 can be super/megasonic transducer, to provide enough acoustic vibration frequencies.
It is formed by connecting it should be noted that the rotation screw rod 4 in the present embodiment can be the screw rod saved no less than one, so that
It may insure to rotate the rotation flexibility of screw rod 4, and provide the larger anglec of rotation, meanwhile, the length of each section screw rod can be with
Designed accordingly according to actual needs, to ensure to tear open the wafer bonding after bonding to that can be taken out from the first groove 1.
In the present embodiment, with reference to the interim bonding techniques of wafer, wafer bonding is brilliant to that can include device wafers and slide glass
Circle, in general, device wafers can be with one layer of ephemeral key rubber alloys of spin coating, after baking-curing, and the thickness of cured glue layer can
Think 10 to 25 microns, slide glass wafer outer ring can with one layer of edge ring-type glue of spin coating, after baking-curing, slide glass wafer it is surplus
Remaining region can be with one layer of anti-adhesive material of spin coating, after baking-curing, and the thickness of the anti-adhesive material after solidification can be 10 to 30
Nanometer, subsequently cleans edge ring-type glue with cleaning agent, can prepare the slide glass wafer of two kinds of different adhesive interfacials, will scribble
The device wafers of ephemeral key rubber alloy and surface-treated slide glass wafer bonding, can obtain wafer bonding pair.It follows that
When tearing bonding open to progress to wafer bonding, because the wafer bonding has larger adhesion strength to only edge region, and in
Heart most areas only has very low adhesion strength, then after the edge ring-type glue-line for removing wafer bonding pair, in the vibration of sound wave
Effect and sound wave drive can be so that wafer bonding be to being separated under the mobilization of solvent.
Based on described above, the step of tearing bonding open to progress to wafer bonding in the present embodiment can be：
1st, cleaning agent is delivered to the first groove 1；
2nd, regulation rotates screw rod 4, and the clamping device 5 being connected with rotating screw rod 4 is pressed from both sides the wafer bonding held after processing
It is right；
3rd, by the wafer bonding after processing to immersing in the cleaning agent of the first groove 1；
4th, sonic generator 2 and acoustic wave transducer 3 are opened；
5th, after wafer bonding is to separation, regulation rotates screw rod 4, releases the suction-operated of clamping device 5, takes out after separation
Wafer bonding pair.
With reference to above-mentioned steps, during the equipment that wafer is processed is used in application the present embodiment, add in the first groove 1
Enter after the solvent for cleaning agent, rotation screw rod 4 can be adjusted so that the folder of clamping device 5 holds wafer bonding to being immersed in cleaning
In agent, it is possible to open sonic generator 2 and acoustic wave transducer 3, the high-frequency signal that sonic generator 2 is produced will be sent to sound
Wave transducer 3, acoustic wave transducer 3, which receives the vibration produced after high-frequency signal, can then drive the cleaning agent in the first groove 1 fast
Speed flowing, and the dissolving of the edge ring-type glue-line with larger adhesion strength can be accelerated, after the dissolving of edge ring-type glue-line, sound
The acoustic vibration effect of wave transducer 3 and the mobilization of cleaning agent can promote the separation of wafer bonding pair.Meanwhile, rotate spiral shell
Bar 4 can drive the wafer bonding that clamping device 4 is clamped to moving up and down and rotating in the cleaning agent in the first groove 1, and be
Be conducive to the acoustic vibration effect produced using acoustic wave transducer 3, wafer bonding is to can be parallel with acoustic wave transducer 3 or being in
Certain angle, then can pass through adjust rotate screw rod 4 so that wafer bonding to 20 in the first groove 1 in suitable position with
And angle.Thus, under effect of vibration in sound wave, the mobilization of cleaning agent, wafer bonding can be caused to being separated, and
Because clamping device 5 can be used for adsorbing machine component 7, then the wafer bonding after separating is to the suction-operated in clamping device 5
Under can prevent from dropping and by fragment risk.
It is understood that the step of tearing bonding open to progress to wafer bonding in the present embodiment is except the order of described above
Operation, step 1 to step 4 in actual applications, can also be carried out the execution of different order, do not done herein specifically as needed
Limit.
It should be noted that bonding process is torn open in wafer bonding pair, except the effect of vibration and cleaning agent of sound wave
Mobilization, optionally, can also provide one auxiliary external force help wafer bonding pair fractionation, such as act on wafer bonding
To positive and negative opposite direction external force, do not limit herein.
Explanation based on above-described embodiment, referring to Fig. 3, being used for another reality of equipment that wafer is processed in the embodiment of the present invention
Applying example includes：
The first screw rod 41 and the second screw rod 42 can be included by rotating screw rod 4, the first screw rod 42 and the second screw rod 42 respectively with
Support meanss 6 are connected；
Clamping device 5 can include the first holding piece 51 and the second holding piece 52, and the first holding piece 51 can be with the first spiral shell
Bar 41 is connected, and the second holding piece 52 can be connected with the second screw rod 42.
Specifically, in order to be advantageously implemented separation after wafer bonding pair taking-up, the first side wall of the first groove 1 and/or
Bottom and/or top can be provided with least one support means 6, and the top and bottom of such as the first groove 1 is respectively provided with a support dress
Put 6, or, top and the first side wall of the first groove 1 are respectively provided with a support meanss 6, or, two adjacent the first side walls
It is respectively equipped with a support meanss 6.Further, the first screw rod 41 and the second screw rod 42, the first spiral shell can be included by rotating screw rod 4
The screw rod 42 of bar 41 and second can be connected with support meanss 6 respectively, i.e. each screw rod 41 of support meanss 6 and first or the second spiral shell
Bar 42 is connected, and the mating connection of two screw rods 41 of support meanss 6 and first and the second screw rod 42 rotates screw rod 4 for one, meanwhile,
Clamping device 5 can include the first holding piece 51 and the second holding piece 52, and the first holding piece 51 can be connected with the first screw rod 41,
Second holding piece 52 can be connected with the second screw rod 42, so as to can be realized to wafer bonding pair in the presence of two holding pieces
Folder inhale.
For example, as shown in figure 1, a support meanss 6,1 the first side wall of the first groove can be provided with the top of the first groove 1
A support meanss 6 can be provided with, wherein, the support meanss 6 that top is set can be connected with the first screw rod 41, and the first side wall is set
Support meanss 6 can be connected with the second screw rod 42, and the first screw rod 41 can be connected with the first holding piece 51, the second screw rod 42
It can be connected with the second holding piece 52, the first holding piece 51 and the second holding piece 52 are respectively in the first screw rod 41 and the second screw rod 42
Rotation under coordinate it is lower can to wafer bonding to carrying out folder suction, with to wafer bonding to carrying out tearing bonding open.
It is understood that in the present embodiment, in support meanss 6 on can be provided with multiple support sites, for
Multiple first screw rods 41 or multiple second screw rods 42 are connected so that corresponding first holding piece 51 and corresponding second holding piece 52
It can press from both sides and hold multipair wafer bonding pair, while realizing open bonding be torn to multipair wafer bonding pair.
Further, because clamping device 5 has the effect of the positive and negative of absorption wafer bonding pair, then in the first clamping
The holding piece 52 of piece 51 and second folder is inhaled on the face of wafer bonding pair, sucker can be respectively equipped with, to allow to by sucker
The positive and negative of wafer bonding pair is adsorbed on sucker by active force, can not only prevent the wafer bonding after separation to due to dropping
And broken risk, and can prevent from tearing open the wafer bonding after bonding to crimping.Specifically, position and the number of sucker
Amount can be set according to actual needs, not limited herein.
It should be noted that the offer of the suction-operated of clamping device is except that can utilize sucker in the present embodiment, in reality
In the application of border, other means can also be used, the face of wafer bonding pair is such as inhaled in the first holding piece 51 and the second holding piece 52 folder
Upper stomata of the design with suction-operated, is not limited specifically herein.
It is understood that in the present embodiment, rotate screw rod 4 and support meanss 6, the annexation of clamping device 5 except
The content of described above, in actual applications, can also use other modes, for example, can will rotate screw rod 4 connects clamping dress
The one end for putting 5 is designed as movable chuck structure, and first can be connected with each chuck of the movable chuck structure
The holding piece 52 of holding piece 51 or second, so as to by the holding action of movable chuck structure drive the first holding piece 51 with
Second holding piece 52 is inhaled to the folder of wafer bonding pair, while can realize to rotate the connection of the support meanss 6 of screw rod 4 and one, only
Allow the clamping device 5 rotated on screw rod 4 to realize the folder suction to wafer bonding pair, and rotate freely revolving for screw rod 4
Turn, it is mobile, rotate the concrete structure of screw rod 4, rotate screw rod 4 with support meanss 6, the annexation of clamping device 5 not
Limit.
Explanation based on above-described embodiment, referring to Fig. 3, being used for another reality of equipment that wafer is processed in the embodiment of the present invention
Applying example includes：
The first side wall of first groove 1 can be provided with liquid outlet 8.
Specifically, in order to be conducive to the solvent for cleaning agent can be flowed out from the first groove 1, hand labor intensity is reduced,
Liquid outlet 8 can be provided with the first side wall of the first groove 1, after wafer bonding terminates to separation, liquid outlet 8 can be opened and allowed clearly
Lotion flows out from liquid outlet 8.In actual applications, in order that obtaining cleaning agent more can thoroughly discharge, optionally, liquid is gone out
Mouth 8 can be located at the bottom of the first side wall of the first groove 1.
Further, for the ease of cleaning agent is discharged into the first groove 1, it can also be provided with the first side wall of the first groove 1
Inlet 9, when needing to wafer bonding to separating, can open inlet 9 and allow cleaning agent to be discharged into from inlet 9.
In practical application, inlet 9 can also be located at different the first side walls with liquid outlet 8 on same the first side wall
On, do not limit herein.
Further, in order to recycle cleaning agent, economize on resources, in the present embodiment, be also provided with circulation duct
10, liquid outlet 8 and inlet 9 can be connected with the circulation duct 10 respectively, so that can be with shape in the presence of circulation duct 10
Into the currency structure of circulation, i.e., the cleaning agent discharged each time from liquid outlet 8 can be back to feed liquor by circulation duct 10
Mouth 9, and it is again introduced into recycling in the first groove 1.Meanwhile, in order to provide in the power that cleaning agent is circulated, the present embodiment,
Transfer pump 11 is also provided with, transfer pump 11 can be connected with circulation duct 10, so that under the power drive of transfer pump 11, from
Liquid outlet 8 flow out input of the cleaning agent through circulation duct 10 to transfer pump 11, then can by transfer pump 11 output end
Inlet 9 is drained into via circulation duct 10, and is entered in the first groove 1.In actual applications, circulation duct 10 and liquid outlet 8, enter
The two ends of the connection of liquid mouthful 9 can be respectively equipped with liquid valve door, liquid flowing valve, can be controlled by controlling liquid valve door and liquid flowing valve
The circulation time of cleaning agent processed and circulation rate.In addition, tapping valve can be provided with circulation duct 10, in above-mentioned bonding of tearing open
During, after cleaning agent recycles a period of time, the tapping valve on circulation duct 10 can be opened, will be a certain amount of
Cleaning agent is drained, while supplying fresh cleaning agent again.
In said structure, in order to improve the automation of equipment, equipment is also provided with cleaning agent feeding mechanism 12, and this is clear
Lotion feeding mechanism 12 can be connected with circulation duct 10, then when providing fresh cleaning agent, can open cleaning agent supply
Device 12 so that fresh cleaning agent can enter in the first groove 1 from circulation duct 10 in cleaning agent feeding mechanism 12, wherein,
Controlled valve can be provided between cleaning agent feeding mechanism 12 and circulation duct 10, the controlled valve can control cleaning agent to supply
Device 12 is turned on and off, and then controls supply and the feed speed of fresh cleaning agent.
In the present embodiment, wafer bonding to after completing to tear bonding open, cleaning agent can also acoustic wave transducer 3 effect
It is lower continue clean separation after wafer bonding pair, it is to be separated after wafer bonding to cleaning up after, sound wave can be closed
Device 2, acoustic wave transducer 3, regulation rotate screw rod 4 and take out the wafer bonding pair after separation.It follows that relative to prior art
Speech, the separation and cleaning of wafer bonding pair can utilize same equipment, integrate and tear bonding technology and cleaning open, simply
It is convenient.
Explanation based on above-described embodiment, referring to Fig. 4, being used for another reality of equipment that wafer is processed in the embodiment of the present invention
Applying example includes：
Equipment can also include heater 13, and heater 13 can be connected with circulation duct 10.
Specifically, can be provided with heater 13 in the present embodiment, the heater 13 can be connected with circulation duct 10,
When the cleaning agent in circulation duct 10 enters heater 13 by input in heater 13, cleaning agent can be in heating
Heated in device 13, the cleaning agent after heating can be entered circulation duct 10 by the output end of heater 13 and be again introduced into
In one groove 1, comparatively, the cleaning agent after heating is more beneficial for promoting the edge ring-type glue-line of wafer bonding pair, and in sound wave
Under the acoustic vibration effect of transducer 3, high temperature can accelerate the separation of wafer bonding pair.It is understood that in the present embodiment
The heating-up temperature of cleaning agent can be set according to actual needs, not limited herein.
It is understood that in addition to aforesaid way is heated to the cleaning agent in circulation duct 10, actually should
In, other mode of heatings can also be used, heater 13 can not also be attached with circulation duct 10, for example, heating
Device 13 can be installed on the outer surface of circulation duct 10 and the tube wall of circulation duct is heated, and realize and the indirect of cleaning agent is added
Heat, is not limited specifically herein.
Further, in order to not influence the recycling of cleaning agent, and wafer bonding is reduced to being dissolved when tearing bonding open
Filter 14 is also provided with jelly, the present embodiment, the filter 14 can also be connected with circulation duct 10, be used for
Contaminant filter is carried out to the cleaning agent in circulation duct 10, is such as filled when the cleaning agent recycled enters filtering from circulation duct 10
When putting 14, filter 14 can filter out a certain amount of jelly.
Optionally, tear the effect of bonding open to improve, with the attachment structure of circulation duct 10, heater 13 can be with
Circulation duct that can be with the one end of liquid outlet 8 located at the centre of transfer pump 11 and filter 14, the i.e. input of transfer pump 11
10 connections, the output end of transfer pump 11 can be connected via circulation duct 10 with the input of heater 13, heater
13 output end can be connected via circulation duct 10 with the input of filter 14, and the output end of filter 14 then may be used
Be connected with the circulation duct 10 of one end of inlet 9 with the first groove 1 so that the first groove 1, transfer pump 11, heater 13,
Peripheral passage is may be constructed between filter 14, so that cleaning agent is circulated.So to wafer bonding pair in the present embodiment
Bonding process of tearing open can be as follows：
1st, fresh cleaning agent is delivered to transfer pump 11；
2nd, cleaning agent is conveyed through heater 13 by transfer pump 11 successively and filter 14 is handled；
3rd, the cleaning agent after treating is transported to the inlet 9 of the first groove 1, and enters the first groove 1；
4th, regulation rotates screw rod 4, and the clamping device 5 being connected with rotating screw rod 4 is pressed from both sides the wafer bonding held after processing
It is right；
5th, by the wafer bonding after processing to immersing in the cleaning agent of the first groove 1；
6th, sonic generator 2 and acoustic wave transducer 3 are opened；
7th, after cleaning agent acts on wafer bonding to be separated to preset time, cleaning agent in the first groove 1 is from the first groove 1
Liquid outlet 8 exit into circulation duct 10, by transfer pump 11, to reach the purpose of recycling；
8th, after wafer bonding is to separation and cleaning, regulation rotates screw rod 4, releases the suction-operated of clamping device 5, takes out
Wafer bonding pair after separation.
It is above-mentioned tear bonding open during, can to being updated replacement to cleaning agent using cleaning agent feeding mechanism 12,
Preferably to reach the separating effect and cleaning performance of wafer bonding pair.Meanwhile, it is above-mentioned can be according to reality the step of tear bonding open
Border needs to be adjusted, and does not limit herein.
It is understood that the annexation of transfer pump 11, heater 13 and filter 14 is removed in the present embodiment
The content of described above, in actual applications, can also design other annexations, if can respective effect,
Do not limit herein specifically.
Explanation based on above-described embodiment, referring to Fig. 5, being used for another reality of equipment that wafer is processed in the embodiment of the present invention
Applying example includes：
Equipment can also include the second groove 15, and the predetermined fraction of the first groove 1 is sheathed on the inside of the second groove 15, the second groove 15
Outer be higher than the first groove 1 outer.
Specifically, in order to prevent the wasting of resources that cleaning agent causes from the outflow of the top of the first groove 1 and to processing environment
Adverse effect, the second groove 15 is also provided with the present embodiment, as shown in figure 5, the predetermined fraction of the first groove can be sheathed on
The inside of second groove 15, and the outer of the second groove 15 can be higher than the outer of the first groove 1, when cleaning agent is from the top of the first groove 1
, can be with excessive into the second groove 15, so as to be recycled to the excessive cleaning agent into the second groove 15 during outflow.Its
In, the predetermined fraction of the first groove 1 can be designed as needed, such as the first groove 1 height 1/2nd or three/
More than one part, in actual applications, can also be other, not limit herein.
Further, in the present embodiment, in order to reuse the excessive cleaning agent into the second groove 15, the of the second groove 15
Leakage fluid dram 16 can be provided with two side walls, the leakage fluid dram 16 can connect with the circulation duct 10 of one end of liquid outlet 8 of the first groove 1
Connect.In actual applications, the coupling part of leakage fluid dram 16 and circulation duct 10 can also be provided with draining valve, to recycle
During cleaning agent, the draining valve can be opened so that the cleaning agent in cleaning agent and the first groove 1 in the second groove 15 can be simultaneously
Circulate in pipeline 10, and be conveyed through transfer pump 11, heater 13 and filter 14 successively and handle.
Further, in the present embodiment, it is preferred that the bottom provided with the side of leakage fluid dram 16 can be less than in the second groove 15
The bottom of opposite side, then when cleaning agent overflows next from the first groove 1, can make it that overflowing the cleaning agent come is collected to second
One end of leakage fluid dram 16 is provided with groove 15, drains into circulation duct 10 and carries out from the leakage fluid dram 16 in the second groove 15 beneficial to cleaning agent
Recycle or discharge.
It is understood that the bottom design of the second groove 15 is not limited to the arc shape shown in Fig. 5 in the present embodiment, in reality
In, other shapes can also be used, optionally so that the bottom of the second groove 15 is inclined design, is collected beneficial to cleaning agent
One end of leakage fluid dram 16 is provided with into the second groove, is not limited herein specifically.
It should be noted that circulation duct 10 in a present embodiment not pipeline, but can be with one or
With the pipeline of top set, that is, providing outside the circulation of cleaning agent, be also provided with time pipeline, this time pipeline can be use
It can be the supply for fresh cleaning agent in the discharge of cleaning agent, can also be the cleaning for being discharged in the second groove 15
The recycling of agent.In actual applications, the structure design of circulation duct 10 is not limited to the explanation in foregoing description and figure, only
Corresponding effect can be realized, is not limited herein specifically.
By foregoing description, the equipment that wafer processing is used in the embodiment of the present invention can be using super/mega sonic wave
The mobilization of effect of vibration and cleaning agent tears bonding open to wafer bonding to progress, and equipment cost is low, and can realize once
Multipair wafer bonding pair tears bonding open simultaneously, and piece rate is high, meanwhile, wafer bonding is to tearing open after bonding, without the crystalline substance after transfer separation
Round key conjunction pair, you can cleaned in same equipment, considerably increase and tear bonding efficiency open, shorten scavenging period, and cleaned
Agent is circulated using being advantageously implemented recycling to resource.
It is apparent to those skilled in the art that, for convenience and simplicity of description, each in this specification
Embodiment is described by the way of progressive, and what each embodiment was stressed is the difference with other embodiment, each
Between embodiment identical similar portion mutually referring to.
In several embodiments provided herein, it should be understood that above example is only to illustrate the present invention's
Technical scheme, rather than its limitations；Although the present invention is described in detail with reference to the foregoing embodiments, this area it is common
Technical staff should be understood：It can still modify to the technical scheme described in foregoing embodiments, or to wherein
Some technical characteristics carry out equivalent；And these modifications or replacement, the essence of appropriate technical solution is departed from this hair
The spirit and scope of bright each embodiment technical scheme.
Claims (12)
1. a kind of equipment processed for wafer, it is characterised in that including：
First groove, sonic generator, acoustic wave transducer, rotation screw rod, clamping device and support meanss；
Described one end for rotating screw rod is connected with the support meanss, and the other end is connected with the clamping device, the clamping
Device is used to clamp and adsorb machine component；
At least one in the first side wall of first groove, bottom, top is provided with least one described support means；
The bottom of first groove is provided with the acoustic wave transducer, the acoustic wave transducer and sonic generator connection.
2. equipment according to claim 1, it is characterised in that the rotation screw rod includes the first screw rod and the second screw rod,
First screw rod and second screw rod are connected with the support meanss respectively；
The clamping device includes the first holding piece and the second holding piece, and first holding piece is connected with first screw rod,
Second holding piece is connected with second screw rod.
3. equipment according to claim 2, it is characterised in that first holding piece and second holding piece are set respectively
There is sucker.
4. equipment according to any one of claim 1 to 3, it is characterised in that the first side wall of first groove
Provided with liquid outlet.
5. equipment according to claim 4, it is characterised in that the first side wall of first groove be additionally provided with it is described enter
Liquid mouthful.
6. equipment according to claim 5, it is characterised in that the equipment also includes transfer pump and circulation duct；
The liquid outlet and the inlet are connected with the circulation duct respectively；
The transfer pump is connected with the circulation duct.
7. equipment according to claim 6, it is characterised in that the equipment also includes heater, the heater
It is connected with the circulation duct.
8. the equipment according to claim 6 or 7, it is characterised in that the equipment also includes filter, the filtering dress
Put and be connected with the circulation duct.
9. equipment according to claim 8, it is characterised in that the equipment also includes cleaning agent feeding mechanism, described clear
Lotion feeding mechanism is connected with the circulation duct.
10. equipment according to claim 9, it is characterised in that the equipment also includes the second groove, first groove it is pre-
If part is sheathed on the inside of second groove, the outer of second groove is higher than the outer of first groove.
11. equipment according to claim 10, it is characterised in that the second sidewall of second groove is provided with leakage fluid dram, institute
The circulation duct that leakage fluid dram is stated with described liquid outlet one end of first groove is connected.
12. equipment according to claim 11, it is characterised in that the bottom of the leakage fluid dram side is provided with second groove
Portion is less than the bottom of opposite side.
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| CN201710193713.8A CN106952857B (en) | 2017-03-28 | 2017-03-28 | Equipment for wafer processing |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710193713.8A CN106952857B (en) | 2017-03-28 | 2017-03-28 | Equipment for wafer processing |
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| CN106952857B CN106952857B (en) | 2020-03-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112201566A (en) * | 2020-09-22 | 2021-01-08 | 武汉电信器件有限公司 | Wafer thinning method and device and wafer unloading clamp |
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| TW201423853A (en) * | 2012-10-19 | 2014-06-16 | Fujifilm Corp | Method for manufacturing semiconductor device |
| CN103956327A (en) * | 2014-04-28 | 2014-07-30 | 华进半导体封装先导技术研发中心有限公司 | Laser bonding-removing technological method and system |
| US9127126B2 (en) * | 2012-04-30 | 2015-09-08 | Brewer Science Inc. | Development of high-viscosity bonding layer through in-situ polymer chain extension |
| CN106328588A (en) * | 2016-08-30 | 2017-01-11 | 浙江中纳晶微电子科技有限公司 | Thin chip machining and pasting assembly method |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9127126B2 (en) * | 2012-04-30 | 2015-09-08 | Brewer Science Inc. | Development of high-viscosity bonding layer through in-situ polymer chain extension |
| TW201423853A (en) * | 2012-10-19 | 2014-06-16 | Fujifilm Corp | Method for manufacturing semiconductor device |
| CN103956327A (en) * | 2014-04-28 | 2014-07-30 | 华进半导体封装先导技术研发中心有限公司 | Laser bonding-removing technological method and system |
| CN106328588A (en) * | 2016-08-30 | 2017-01-11 | 浙江中纳晶微电子科技有限公司 | Thin chip machining and pasting assembly method |
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| CN112201566A (en) * | 2020-09-22 | 2021-01-08 | 武汉电信器件有限公司 | Wafer thinning method and device and wafer unloading clamp |
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