CN106125870A - Server - Google Patents
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- Publication number
- CN106125870A CN106125870A CN201610537589.8A CN201610537589A CN106125870A CN 106125870 A CN106125870 A CN 106125870A CN 201610537589 A CN201610537589 A CN 201610537589A CN 106125870 A CN106125870 A CN 106125870A
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- China
- Prior art keywords
- server
- processor
- kuppe
- module
- accommodation space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
nullThe invention provides a kind of server，Comprise mainframe box、Fan module、At least two processor mounting seats and at least one kuppe，Described mainframe box has an accommodation space and two side plates being positioned at accommodation space opposite sides，Described fan module is placed in accommodation space，Described processor mounting seat is placed in accommodation space and is adjacent to the air outlet side of fan module，Described kuppe has the main part and a diversion division being connected to each other，Each processor mounting seat alternative arranges processor module or a kuppe，Described kuppe can be removable installed in via main part in the processor mounting seat being not provided with processor module，Described diversion division has nearly wind side relative to each other and remote wind side，Described nearly wind side is unequal to the spacing of wherein side plate with remote wind side，Radiating airflow from air outlet side is concentrated by the guiding of diversion division.
Description
Technical field
The present invention relates to a kind of server, a kind of server with kuppe.
Background technology
High in the clouds information and application at present is seen everywhere in daily life, and various different services are sent out with the flourishing of interconnection device
Exhibition makes data volume the most increasing, and server just plays whole high in the clouds industry considerable role behind.Wherein, in order to
Expansion in usefulness in the future, would generally be configured with multiple processor mounting seat in server, so that user can be entered according to demand
The amplification of row processor chips.
But it practice, the processor mounting seat in usual single server can't be both provided with processor chips.Therefore,
A spacious region then can be vacated in the top of the processor mounting seat being not provided with processor chips.In the case, clothes are worked as
The radiating airflow of business device fan blowout when flowing to the region of this spaciousness, then can loss and become disorderly, the not only heat radiation of part
Air-flow can be diverted to other unscheduled heat dissipation region so that the heat dissipation region that radiating airflow makes a reservation for pass through cannot obtain properly
Heat radiation, and then the operating usefulness of server can be affected.
To this, there is dealer that fan replaces to high power fan, it is desirable to radiating area can be made up in the way of improving wind speed
The radiating airflow that territory is not enough, but this way not only increases the manufacturing cost of entirety, also can increase the power consumption of server, fall
Low economic benefit.
Summary of the invention
It is an object of the invention to provide a kind of server, effectively to utilize the radiating airflow of fan.
For achieving the above object and other relevant purpose, the invention provides a kind of server, comprise a mainframe box, one
Fan module, at least two processor mounting seats and at least one kuppe；Described mainframe box has an accommodation space and is positioned at appearance
Being empty two side plates of an opposite sides, described fan module is placed in the accommodation space of mainframe box, described at least two processors
Mounting seat is placed in accommodation space, and is adjacent to an air outlet side of described fan module, and described at least one kuppe has
The main part being connected to each other and a diversion division；At least two processor mounting seats described in each may be used to selectivity and arrange at one
Reason device module or described at least one kuppe, described at least one kuppe is removable installed in via described main part and is not provided with
In the wherein at least two processor mounting seats described in of described processor module, described diversion division has the nearly wind of relative to each other one
Side and a remote wind side, described nearly wind side is unequal to the spacing of wherein side plate described in described remote wind side so that from described
The radiating airflow of air outlet side is concentrated by the guiding of described diversion division.
Preferably, in above-mentioned server, the described near wind side of described diversion division is to neighbouring wherein side plate described in
The described remote wind side being smaller than described diversion division to the spacing of described side plate.
Preferably, in above-mentioned server, described server also comprises at least one electronic component, is placed in described main frame
In the described accommodation space of case, described at least one electronic component be positioned at described at least two processor mounting seats away from described fan mould
One end of group, and an air stream outlet of at least one kuppe described in being adjacent to so that described radiating airflow is by described diversion division
Guide and concentrate at least one electronic component described in the flow direction.
Preferably, in above-mentioned server, described at least one electronic component and wherein have described between side plate
Treat that extended area, described at least one kuppe treat extended area described in corresponding to, with prevent described radiating airflow flow to described in treat
Extended area.
Preferably, in above-mentioned server, described at least one electronic component comprise at least one after hard disk module or one electricity
Source module.
Preferably, in above-mentioned server, the described main part of described at least one kuppe has a water conservancy diversion slope, even
It is connected to described diversion division, and raised towards the direction away from described fan module.
Preferably, in above-mentioned server, the described main part of described at least one kuppe has multiple installation portion, uses
To fasten or to be screw-locked at wherein at least two processor mounting seat described in.
Preferably, in above-mentioned server, described server also comprises a system wind scooper, is removably placed in master
In the accommodation space of cabinet, described system wind scooper is adjacent to the described air outlet side of described fan module, and is covered in described
On at least two processor mounting seats and described at least one kuppe, in order to guide described radiating airflow.
Preferably, in above-mentioned server, described server also comprise at least one before hard disk module, the most accommodating
In the described accommodation space of described mainframe box, and it is positioned at described fan module one air inlet side.
Preferably, in above-mentioned server, described processor module comprises processor chips and a heat-sink unit, institute
Stating processor chips to be disposed therein in processor mounting seat described in, described heat-sink unit is removable installed in described process
In device mounting seat and thermally contact described processor chips.
According to the server disclosed by the invention described above, owing to kuppe is mountable to be not provided with processor module wherein
In one processor mounting seat, and the nearly wind side of the diversion division of kuppe is unequal to the spacing of wherein side plate with remote wind side, makes
Can must be directed to and focus utilization from the radiating airflow of fan module, to avoid radiating airflow to be blown to unscheduled heat dissipation region
And reduce the heat dissipation on heat radiation goal setting.Thus, except server usefulness is promoted, the power of fan module
Also the adjustment of adaptability and reach energy-conservation effect.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of the server of one embodiment of the invention；
Fig. 2 is the top view of the server of Fig. 1；
Fig. 3 is the explosive view of the server of Fig. 1；
Fig. 4 is the partial enlarged drawing of the server of Fig. 2；
Fig. 5 is the axonometric chart of the kuppe of the server of Fig. 1；
Fig. 6 is the use situation figure of the server of Fig. 1；
Fig. 7 is the use situation figure of the server of another embodiment of the present invention.
[symbol description]
1-server；
10-mainframe box；10a-front end；10b-rear end；
20-fan module；20a-air inlet side；20b-air outlet side；
30-processor mounting seat；
40,40 '-kuppe；40a-air flow inlet；40b-air stream outlet；
50-system wind scooper；
91-processor module；Hard disk module before 93-；Hard disk module after 95-；97-power supply module；
110-side plate；111-base plate；
410-main part；410s-water conservancy diversion slope；
420-diversion division；420a-nearly wind side；420b-remote wind side；
430-mounting post；
911-processor chips；
912-heat-sink unit；
F1, F2-radiating airflow；D1, D2-spacing；S1-accommodation space；S2-treats extended area.
Detailed description of the invention
Hereinafter the narration detailed features of the present invention and advantage the most in detail, its content be enough to make any be familiar with
Relevant art understands the technology contents of the present invention and implements according to this, and according to the content disclosed by this specification, apply for a patent
Scope and graphic, any relevant art of being familiar with can be readily understood upon the relevant purpose of the present invention and advantage.With purgation embodiment
System further describes the viewpoint of the present invention, but non-to limit the category of the present invention anyways.
Additionally, the following embodiments of the present invention that will schematically disclose, as clearly stated, the details in many practices will
It is explained in the following description.However, it is understood that, the details in these practices is not used to limit the present invention.It addition,
For simplify graphic for the sake of, some known usual structures and assembly will illustrate it, even in the drawings in the way of simple signal
The graphic structures such as cabling (cable or flat cable) that eliminate of part, to keep drawing clean and tidy, first state it in this.
Furthermore, unless otherwise defined, all vocabulary used herein, including technology and scientific terminology etc., there is it usual
Meaning, its meaning can be familiar with this those skilled in the art and be understood.Further, the definition of above-mentioned vocabulary, at this
Description should be read as technical field related to the present invention there is consistent meaning.Unless there are the clearest and the most definite definition, this
A little vocabulary will be not construed as the most Utopian or formal meaning.
Refer to Fig. 1～5, Fig. 1 is the axonometric chart of the server of one embodiment of the invention, and Fig. 2 is bowing of the server of Fig. 1
View, Fig. 3 is the explosive view of the server of Fig. 1, and Fig. 4 is the partial enlarged drawing of the server of Fig. 2, and Fig. 5 is the server of Fig. 1
The axonometric chart of kuppe.As it is shown in figure 1, the present embodiment proposes a kind of server 1, it is adaptable to a server cabinet (is not schemed
Show).
Specifically, as shown in figures 2-3, server 1 comprises mainframe box 10, fan module 20, multiple processor peace
After dress seat 30, an at least kuppe 40, system wind scooper 50, at least processor module 91, multiple front hard disk module 93,
Hard disk module 95 and a power supply module 97.
Mainframe box 10 comprises two side plate 110 and base plates 111.Two side plates 110 are both vertically arranged on relative the two of base plate 111
Side, with base plate 111 jointly around an accommodation space S1, in order to accommodating above-mentioned fan module 20, processor mounting seat 30,
Kuppe 40, processor module 91, front hard disk module 93, rear hard disk module 95 and power supply module 97 etc. other electronics unit
Part.
In the present embodiment, the quantity of front hard disk module 93 is two, is configured at mainframe box 10 in tandem mode
Front end 10a.Multiple hard disk (not shown) can be deposited in each front hard disk module 93.
After fan module 20 arranges on base plate 111 and be arranged in front hard disk module 93, may be used to the electricity in server 1
Sub-element dispels the heat.Furthermore, it is understood that the air inlet side 20a of fan module 20 is adjacent to front hard disk module 93.Additionally, at this
In embodiment, fan module 20 includes many sub-fans (non-label), and with Fig. 2 visual angle from the point of view of, the sub-fan of Fig. 2 leftmost side
Wouldn't operate because practical factor considers, but the present invention is not so limited.
The quantity of processor mounting seat 30 is two, is arranged on base plate 111 and is arranged in the air outlet side of fan module 20
After 20b.There is in each processor mounting seat 30 multiple installing hole (non-label), in order to processor module 91 is installed, described
Installing hole can be a screw or a connecting hole.It is noted that the present invention not with the quantity of processor mounting seat 30 with
Position is limited.The most in other embodiments, the quantity of processor mounting seat 30 can be three or more than three.
Furthermore, it is understood that each processor module 91 comprise processor chips (Central Processing Unit,
CPU) 911 and heat-sink unit 912.Heat-sink unit 912 described here is radiating fin.Processor chips 911 are selectively
First it is disposed therein in a processor mounting seat 30, then heat-sink unit 912 is arranged in described processor mounting seat 30 so that
Heat-sink unit 912 can be close to processor chips 911, gets rid of heat produced by processor chips 911 in the way of thermo-contact,
And the radiating airflow (such as Fig. 6) that described heat can directly be produced by boasting by the air outlet side 20b of fan module 20 be blown toward mainframe box 10
Rear end 10b.It is noted that in the present embodiment, server 1 only configures one group of processor module 91 in operating.
It is to say, under general operational requirements, can be to be provided with processor module 91 in only one processor mounting seat 30
, and another, or processor module 91 will not be configured with in other processor mounting seat 30 the most multiple.Can deduce,
The present invention is not limited with the quantity of processor module 91, as long as in the case of the quantity of processor mounting seat 30 is enough, making
User is can be according to actual demand so that the quantity of the server 1 interior processor module 91 that configured is increased or decreased, such as at it
In his embodiment, the quantity of processor module 91 can be two or more.But it is noted that coordinate server 1 real
The demand of border operating, even if being mounted with multiple processor module 91, still can select running wherein by control module (not shown)
One or multiple processor module 91, the present invention is not so limited.
Rear hard disk module 95 and power supply module 97 are then configured at the rear end 10b of mainframe box 10, and are adjacent to processor installation
Seat 30.Rear hard disk module 95 is similar to front hard disk module 93, may be used to accommodating many hard disks (not shown).And power supply module 97 can
Dock with the power supply of server cabinet via cabling (not shown) and operate required electric energy receiving server 1.
Additionally, by Fig. 2 it can be seen that, in accommodation space S1, particularly in the region of rear hard disk module 95 left and right sides, with
And the region outside two processor mounting seats 30 is defined as treating extended area S2.So-called treat that extended area S2 refers to, clothes
The region of multiple expansion slot (non-label) it is configured with, although these expansion slots are available for random access memory in business device 1
(Random Access Memory, RAM) or pci card grafting, but before plugging above-mentioned expansion board, these regions are the most empty
Spacious, thus these regions are not the main heat sink target in fan module 20 setting.It may also be said that treat extended area S2 not
The main heat sink region set for fan module 20.
Kuppe 40 is suitable to be arranged in the processor mounting seat 30 being not configured with processor module 91.Specifically, lead
Stream cover 40 comprises main part 410, diversion division 420 and the multiple installation portion 430 being connected to each other.Main part 410 can be via
Installation portion 430 is removable installed in the processor mounting seat 30 being not configured with processor module 91.Each installation portion 430 can
Think a screw collocation design for screw, a buckle structure or a column structure, may be used to be fixed in processor mounting seat 30
Installing hole on, but the present invention is not so limited.As long as it practice, installation portion 430 be adaptability be installed on processor
The design of mounting seat 30, belongs to the category of the present invention.Diversion division 420 is a platy structure, and main body 410 is towards fan mould
The direction of the air outlet side 20b of group 20 extends.Furthermore, it is understood that diversion division 420 have the nearly wind side 420a of relative to each other one with
And a remote wind side 420b.So-called nearly wind side 420a and remote wind side 420b, refer respectively on diversion division 420 close to away from wind
The opposite sides of the air outlet side 20b of fan module 20.Additionally, by Fig. 4 it can be seen that, set on, the nearly wind side of diversion division 420
The space D 1 of the wherein side plate 110 that 420a is the most neighbouring is less than between the remote wind side 420b extremely described side plate 110 of diversion division 420
Away from D2 so that the setting that diversion division 420 is inclined relative to main part 410.
And system wind scooper 50 is adjacent to the air outlet side 20b of fan module 20, and cover in comprising kuppe 40, processing
The top of the electronic components such as device module 91 and processor mounting seat 30, is used for guiding the radiating airflow from air outlet side 20b blowout,
Can avoid radiating airflow is that loss is in external environment after air outlet side 20b blows out.
Then, will compare for the situation with or without configuration kuppe 40 and illustrate.Referring to Fig. 6, it is the clothes of Fig. 1
The use situation figure of business device.Need to first state, for convenience of description, Fig. 6 eliminate system wind scooper 50.
Configure in processor mounting seat 30 and without air current flow shape during configuration kuppe 40 as it can be seen, can simultaneously view
Condition.Specifically, first, first from the point of view of radiating airflow F1 (dotted arrow), radiating airflow F1 refers to ought a wherein processor
Processor module 91 it is configured without when being also configured without kuppe 40 in mounting seat 30 (the processor mounting seat 30 in graphic left side),
Air stream from fan module 20.Owing to being configured without processor module 91 or kuppe in described processor mounting seat 30
40, the region of a spaciousness can be formed above described processor mounting seat 30, the easy loss when radiating airflow F1 flow to this region
And become disorderly, and have most radiating airflow F1 and take advantage of a situation and flow to treat extended area S2 (i.e. on the left of rear hard disk module 95
The non-main heat sink region set for fan module 20), i.e. can relative reduction fan module 20 dissipating rear hard disk module 95
Thermal effect.Show, in the case of ambient temperature is 35 degree Celsius, if being not provided with processor module 91 according to experimental data
Processor mounting seat 30, is also not provided with kuppe 40, and the temperature of rear hard disk module 95 can soar to 68 degree Celsius, exceed and taken the photograph
The safety value that family name is 64 degree.The problem that overheated rear hard disk module 95 can cause running speed to decline, and then have impact on integrity service
The operating usefulness of device 1.
In comparison, please referring next to radiating airflow F2 (solid arrow), radiating airflow F2 refers to when being configured without place
When wherein a processor mounting seat 30 (the processor mounting seat 30 in graphic left side) is configured with kuppe 40 of device module 91 of reason, comes
From the air stream of fan module 20.Specifically, from the point of view of drawing visual angle, radiating airflow F2 is from the air outlet side of fan module 20
Can be guided by the diversion division 420 tilted on kuppe 40 after 20b blowout, and owing to the nearly wind side 420a of diversion division 420 is to adjacent
The space D 1 of near wherein side plate 110 be less than the remote wind side 420b of diversion division 420 to described side plate 110 space D 2 (as
Fig. 4) so that radiating airflow F2 can be blown toward after being adjacent to the air stream outlet 40b of kuppe 40 along diversion division 420 by concentration
Hard disk module 95.It is to say, diversion division 420 has the effect of guiding, concentration for radiating airflow F2, can avoid dissipating as the aforementioned
Thermal current F1 can flow to until extended area S2 relative reduction fan module 20 to after the problem of radiating effect of hard disk module 95.
Show according to experimental data, in the case of ambient temperature is all 35 degree Celsius, if being not provided with the process of processor module 91
Device mounting seat 30 arranges kuppe 40, can make radiating airflow F2 certain be led to rear hard disk module 95, with hard after allowing
The temperature of dish module 95 is reduced to 57.5 degree Celsius, the safety value far below 64 degree Celsius.Thus, rear hard disk module 95 can be smooth and easy
Running, and then the operational effectiveness of server 1 can be maintained.
Additionally, the present invention is not limited with the position of the kuppe 40 in first embodiment.Such as, Fig. 7, Fig. 7 are referred to
It is the use situation figure of the server of another embodiment of the present invention, is similar to Fig. 6, Fig. 7 and also omit system wind scooper 50.Can see
Arriving, the present embodiment proposes kuppe 40 ', with kuppe 40 specular each other of previous embodiment.And and first embodiment
Kuppe 40 unlike, the kuppe 40 ' of the present embodiment is disposed on the processor mounting seat being positioned on the right side of drawing visual angle
On 30.But it is similar to previous embodiment, after the radiating airflow of fan module 20 blowout can be concentrated to by the guiding of kuppe 40 '
Hard disk module 95, and then the radiating effect predetermined to rear hard disk module 95 can be maintained.It follows that the present invention is not with water conservancy diversion
Cover position set by 40 is limited, i.e. the present invention is not limited with the position of the processor mounting seat 30 set by kuppe 40.
Additionally, please continue to refer to Fig. 5 and Fig. 6, the main part 410 of kuppe 40 has a water conservancy diversion slope 410s, from
The air flow inlet 40a of kuppe 40 is inclined upwardly toward the direction of air stream outlet 40b, forms one at air stream outlet 40b relatively
Raised slope, contributes to the air principle coordinating the cold air meeting nature flowing through kuppe 40 to decline.Specifically, when cold sky
After gas rises to higher level height via water conservancy diversion slope 410s, blow backward during hard disk module 95 can naturally under
Drop and be evenly distributed to rear hard disk module 95, with the uniform radiating effect of hard disk module 95 after providing.Certainly, the present invention not with
The gradient of water conservancy diversion slope 410s, even be that water conservancy diversion slope 410s is limited.
From the above mentioned, in server provided by the present invention, owing to kuppe is mountable to be not provided with processor module
A wherein processor mounting seat on, and the spacing not phase of the nearly wind side of the diversion division of kuppe and remote wind side to wherein side plate
Deng so that the radiating airflow from fan module can be directed to and focus utilization, to avoid radiating airflow to be blown to unscheduled dissipating
Thermal region and reduce to heat radiation goal setting on heat dissipation.Thus, except server usefulness is promoted, fan module
The adjustment of power also adaptability and reach energy-conservation effect.
Additionally, due to the diversion division adaptability ground regulation angle of wind scooper, with adaptive the placed diverse location of kuppe
Processor mounting seat.Therefore, no matter the position set by kuppe, all can effectively guide, concentrate radiating airflow with heat radiation
The electronic component of server back end.
Although the present invention is disclosed above with aforementioned embodiment, so it is not limited to the present invention.Without departing from this
In bright spirit and scope, change for it and retouching, all belong to the scope of patent protection of the present invention.It is defined about the present invention
Protection domain refer to appended claim.
Claims (10)
1. a server, it is characterised in that comprise:
One mainframe box, two side plates that there is an accommodation space be positioned at described accommodation space opposite sides；
One fan module, is placed in the described accommodation space of described mainframe box；
At least two processor mounting seats, are placed in the described accommodation space of described mainframe box, and are adjacent to described fan module
An air outlet side；And
At least one kuppe, has the main part and a diversion division being connected to each other；
Wherein, at least two processor mounting seats described in each arrange a processor module or described at least one water conservancy diversion in order to selectivity
Cover, described at least one kuppe is removable installed in the wherein institute being not provided with described processor module via described main part
Stating at least two processor mounting seats, described diversion division has the nearly wind side of relative to each other one and a remote wind side, described nearly wind side
Unequal to the spacing of wherein side plate described in described remote wind side so that from the radiating airflow of described air outlet side by described
The guiding of diversion division and concentrate.
2. server as claimed in claim 1, it is characterised in that the described near wind side of described diversion division to the most neighbouring wherein
The spacing of the described remote wind side being smaller than described diversion division of described side plate extremely described side plate.
3. server as claimed in claim 1, it is characterised in that described server also comprises at least one electronic component, accommodating
In the described accommodation space of described mainframe box, described at least one electronic component be positioned at described at least two processor mounting seats away from
One end of described fan module, and an air stream outlet of at least one kuppe described in being adjacent to so that described radiating airflow is by institute
State the guiding of diversion division and concentrate at least one electronic component described in the flow direction.
4. server as claimed in claim 3, it is characterised in that described at least one electronic component and wherein side plate described in it
Between have and treat extended area, described at least one kuppe correspond to described in treat extended area, to prevent described radiating airflow stream
Extended area is treated described in entering.
5. server as claimed in claim 3, it is characterised in that described at least one electronic component comprise at least one after hard disk mould
Group or a power supply module.
6. server as claimed in claim 1, it is characterised in that the described main part of described at least one kuppe has leads
Stream slope, is connected to described diversion division, and raised towards the direction away from described fan module.
7. server as claimed in claim 1, it is characterised in that the described main part of described at least one kuppe has multiple
Installation portion, in order to fasten or to be screw-locked at wherein at least two processor mounting seat described in.
8. server as claimed in claim 1, it is characterised in that described server also comprises a system wind scooper, detachably
Be placed in the described accommodation space of described mainframe box, described system wind scooper is adjacent to the described air-out of described fan module
On mouthful side, and at least two processor mounting seats described in being covered in and described at least one kuppe, in order to guide described heat transmission gas
Stream.
9. server as claimed in claim 1, it is characterised in that described server also comprise at least one before hard disk module, can
Releasably it is placed in the described accommodation space of described mainframe box, and is positioned at an air inlet side of described fan module.
10. server as claimed in claim 1, it is characterised in that described processor module comprises processor chips and
Heat-sink unit, described processor chips are disposed therein in processor mounting seat described in, and described heat-sink unit removably sets
It is placed in described processor mounting seat and thermally contacts described processor chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610537589.8A CN106125870A (en) | 2016-07-08 | 2016-07-08 | Server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610537589.8A CN106125870A (en) | 2016-07-08 | 2016-07-08 | Server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106125870A true CN106125870A (en) | 2016-11-16 |
Family
ID=57283572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610537589.8A Pending CN106125870A (en) | 2016-07-08 | 2016-07-08 | Server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106125870A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020107450A1 (en) * | 2018-11-30 | 2020-06-04 | 北京比特大陆科技有限公司 | Data processing apparatus |
| CN112181112A (en) * | 2020-09-22 | 2021-01-05 | 苏州浪潮智能科技有限公司 | Heat dissipation device and method and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102160171A (en) * | 2008-08-11 | 2011-08-17 | 绿色革命冷却股份有限公司 | Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack |
| TW201422135A (en) * | 2012-11-28 | 2014-06-01 | Inventec Corp | Electronic device |
| CN103857256A (en) * | 2012-11-28 | 2014-06-11 | 鸿富锦精密工业（深圳）有限公司 | Wind scooper and electronic apparatus having the same |
| CN104679182A (en) * | 2013-11-28 | 2015-06-03 | 英业达科技有限公司 | Server |
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2016
- 2016-07-08 CN CN201610537589.8A patent/CN106125870A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102160171A (en) * | 2008-08-11 | 2011-08-17 | 绿色革命冷却股份有限公司 | Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack |
| TW201422135A (en) * | 2012-11-28 | 2014-06-01 | Inventec Corp | Electronic device |
| CN103857256A (en) * | 2012-11-28 | 2014-06-11 | 鸿富锦精密工业（深圳）有限公司 | Wind scooper and electronic apparatus having the same |
| CN104679182A (en) * | 2013-11-28 | 2015-06-03 | 英业达科技有限公司 | Server |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020107450A1 (en) * | 2018-11-30 | 2020-06-04 | 北京比特大陆科技有限公司 | Data processing apparatus |
| CN112181112A (en) * | 2020-09-22 | 2021-01-05 | 苏州浪潮智能科技有限公司 | Heat dissipation device and method and electronic equipment |
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Application publication date: 20161116 |