CN204578961U - Radiator structure and there is the electronic installation of this radiator structure - Google Patents
Radiator structure and there is the electronic installation of this radiator structure Download PDFInfo
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- CN204578961U CN204578961U CN201520314035.2U CN201520314035U CN204578961U CN 204578961 U CN204578961 U CN 204578961U CN 201520314035 U CN201520314035 U CN 201520314035U CN 204578961 U CN204578961 U CN 204578961U
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- air entry
- radiator
- air
- electronic component
- radiator structure
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Abstract
The utility model provides a kind of radiator structure, comprise housing and radiator fan, described housing is offered at least one air entry and exhaust outlet, an air duct is at least formed between described air entry and described exhaust outlet, described radiator fan is arranged in described housing, for driving air duct described in air flow direction.Above-mentioned radiator structure is by arranging at least one air duct, dispel the heat to the electronic component of housing, to form heat loss through convection pattern, such as, be provided with two air entries and exhaust outlet, so form twin-channel radiating layout, the heat of this enclosure interior is conducive to all to be discharged, and improve radiating efficiency, thus without the need to heat-pipe radiator, such that the structure of this radiator structure is simple and cost is lower.The utility model also provides a kind of electronic installation with this radiator structure.
Description
Technical field
The utility model relates to technical field of heat dissipation, particularly relates to a kind of radiator structure and has the electronic installation of this radiator structure.
Background technology
At present, the electronic product of high heat flux, such as camera head, be provided with radiator structure, to dispel the heat to the chip in this electronic product, and then ensures that this electronic product can run well.Traditional radiator structure adopts the mode of fan heating tube usually, be specially: utilize the high-termal conductivity of heat pipe to be conducted to fast on the fin of far-end by the heat of chip, then utilize fan to dispel backing such forced-convection heat transfer the heat on fin is shed, thus reach the object reducing chip temperature.But, due to the processing technology more complicated of heat-pipe radiator, make cost higher than common radiator a lot.Simultaneously in order to heat is shed, the ratio comparatively dense that the fin of far-end often will do, it is larger that this just inevitably causes fan to blow over the windage of fin, causes the noise ratio of product higher.
Utility model content
In view of above content, be necessary to provide a kind of structure simple and lower-cost radiator structure and there is the electronic installation of this radiator structure.
A kind of radiator structure, comprise housing and radiator fan, described housing is offered at least one air entry and exhaust outlet, between described air entry and described exhaust outlet, at least form an air duct, described radiator fan is arranged in described housing, for driving air duct described in air flow direction.
Further, described radiator fan is scavenger fan, for being discharged from described exhaust outlet by the air-flow of enclosure interior;
Or described radiator fan is extraction fan, for the air-flow outside housing is sucked in described housing from described air entry.
Further, described housing is offered the first air entry and the second air entry, described first air entry and described exhaust outlet form the first air duct, and described second air entry and described exhaust outlet form the second air duct.
Further, described first air duct is crossing with the second air duct.
Further, described first air entry and the second air entry are arranged away from described exhaust outlet;
And/or the bearing of trend of described first air entry and the second air entry is not identical with the bearing of trend of described exhaust outlet;
And/or the bearing of trend of described first air entry is not identical with the bearing of trend of the second air entry.
Further, described housing comprises diapire, roof and perisporium, described diapire and roof are oppositely arranged, described perisporium is connected on the side of described diapire and roof, and jointly form a receiving space with described diapire and roof, described receiving space is in order to accommodate described radiator fan and multiple electronic component, and described multiple electronic component is thermal source.
Further, described first air entry and the second air entry be the through diverse location be arranged on described perisporium respectively, and described exhaust outlet is arranged on described diapire.
Further, described first air entry and the second air entry are opened on two sides adjacent in described perisporium respectively;
Or described first air entry and the second air entry are opened on two sides relative in described perisporium respectively.
Further, described radiator structure also comprises substrate and radiator, and described substrate and described radiator are all arranged in described receiving space, and described substrate is for carrying electronic component, described radiator is used for contacting with described electronic component, goes out with the heat conduction produced by described electronic component.
Further, described radiator is heat-conducting plate.
Further, described radiator is laid with multiple radiating fin, described radiating fin corresponds to electronic component more responsive to temperature on described substrate.
Further, described radiating fin comprises the first radiating fin group and the second radiating fin group, described first radiating fin group is arranged along the airintake direction of described first air entry, and described second radiating fin group is arranged along the airintake direction of described second air entry.
A kind of electronic installation, comprise electronic component and above-mentioned every radiator structure, wherein said electronic component is thermal source, and is arranged in described air duct.
Further, described substrate is circuit board.
Further, described electronic component is multiple, and all contiguous described air entry is arranged.
Further, described housing offers opening, one of them electronic component is arranged in described opening, and remaining electronic component is arranged on the substrate.
Further, described opening is opened in the side at the first air entry place described in described perisporium.
Further, described electronic installation is The Cloud Terrace, and the electronic component being located at described opening is hard disk, and described hard disk is for storing the view data of the camera head of described The Cloud Terrace carrying.
Above-mentioned radiator structure and there is this radiator structure electronic installation by arranging at least one air duct, dispel the heat to the electronic component of housing, to form heat loss through convection pattern, such as, be provided with two air entries and exhaust outlet, so form twin-channel radiating layout, the heat of this enclosure interior is conducive to all to be discharged, and improve radiating efficiency, thus without the need to heat-pipe radiator, such that the structure of this radiator structure is simple and cost is lower.
Accompanying drawing explanation
Fig. 1 is the overall schematic of the electronic installation of the utility model embodiment.
Fig. 2 is the schematic diagram at another visual angle of electronic installation shown in Fig. 1.
The decomposed schematic diagram that Fig. 3 is electronic installation shown in Fig. 1.
Fig. 4 is the decomposing schematic representation of substrate and radiator in electronic installation shown in Fig. 3.
Fig. 5 is the partial schematic diagram after the dismounting of electronic installation shown in Fig. 1 partial shell.
Fig. 6 is electronic installation internal gas flow analogous diagram described in Fig. 1.
Fig. 7 is the temperature simulation figure of electronic installation internal electronic element described in Fig. 1.
Main element symbol description
| Electronic installation | 100 |
| Housing | 10 |
| Diapire | 11 |
| Exhaust outlet | 111 |
| Roof | 13 |
| Perisporium | 15 |
| First air entry | 151 |
| Second air entry | 153 |
| Opening | 155 |
| Substrate | 30 |
| Electronic component | 41-49 |
| Radiator fan | 50 |
| Radiator | 70 |
| First radiating fin group | 71 |
| Second radiating fin group | 73 |
Following embodiment will further illustrate the utility model in conjunction with above-mentioned accompanying drawing.
Embodiment
Refer to Fig. 1-3, the utility model preferred embodiment provides a kind of electronic installation 100, comprise housing 10, the substrate 30 be arranged in housing 10, multiple electronic component 41-49(please refer to the drawing 4), radiator fan 50 and radiator 70.In the present embodiment, described electronic installation 100 is a The Cloud Terrace, in order to carry a camera head (not shown).Certainly, in other embodiments, described electronic installation 100 can also be other any electronic equipments with electronic component.
In the present embodiment, this housing 10 comprises diapire 11, roof 13 and perisporium 15.Described diapire 11 is oppositely arranged with roof 13.Described perisporium 15 is connected to described diapire 11 with on the side of roof 13, jointly to surround a receiving space 17 with described diapire 11 with roof 13.Described receiving space 17 is for accommodating described substrate 30, multiple electronic component 41-49, radiator fan 50 and radiator 70.
Described housing 10 also offers exhaust outlet 111, first air entry 151, second air entry 153 and opening 155.The bearing of trend of this first air entry 151 and the second air entry 153 is not identical with the bearing of trend of described exhaust outlet 111; And/or the bearing of trend of described first air entry 151 is not identical with the bearing of trend of the second air entry 153, so to guarantee that air enters this housing 10 from two different directions of housing 10.In the present embodiment, described exhaust outlet 111 is through is opened on described diapire 11.Described first air entry 151 and the second air entry 153 are all arranged on described perisporium 15.Concrete, described first air entry 151 and the second air entry 153 are opened on two sides adjacent in described perisporium 15 respectively.Certainly, in other embodiments, described first air entry 151 and the second air entry 153 also can be arranged at other positions of housing 10, such as, are arranged on two sides being oppositely arranged in this perisporium 15.In addition, described first air entry 151 and the second air entry 153 are arranged away from described exhaust outlet 111, to avoid the circulation causing hot-fluid as far as possible.Contiguous described first air entry 151 of described opening 155 and/or the second air entry 153 are arranged.In the present embodiment, described opening 155 is opened in the side at the first air entry 151 place described in described perisporium 15, and this first air entry 151 contiguous is arranged.
See also Fig. 4, described substrate 30 is roughly in tabular, and it is arranged in the receiving space 17 of described housing 10.The plurality of electronic component 41-49 can be the thermal source such as power amplifier, radio-frequency (RF) transmit-receive circuit.In the present embodiment, all contiguous described first air entry 151 of the plurality of electronic component 41-49 and/or the second air entry 153 are arranged.In the present embodiment, one of them electronic component, such as electronic component 41 is arranged in described opening 155, and contiguous described first air entry 151 and/or the second air entry 153 are arranged.Remaining electronic component, such as electronic component 42-49 is all arranged on described substrate 30, and contiguous described first air entry 151 and/or the second air entry 153 are arranged.In the present embodiment, this substrate 30 is circuit board.Certainly, described substrate 30 can be also the plate body of carrying electronic component 41-49, and provides independent circuit board in addition, and described electronic component 41-49 and other circuit board are electrically connected.
It should be noted that, in the illustrated embodiment in which, electronic component 41 is hard disk, and described hard disk is for storing the view data of the camera head of described The Cloud Terrace carrying.
The corresponding described multiple electronic component 41-49 of described radiator fan 50 is installed in this receiving space 17, in order to drive air-flow to enter from described first air entry 151 and the second air entry 153 respectively, and discharges from described exhaust outlet 111.In the present embodiment, described radiator fan 50 is extraction fan, and arranges near described exhaust outlet 111.When described radiator fan 50 starts, described radiator fan 50 is in order to suck the air-flow outside housing 10 from described first air entry 151 and the second air entry 153 respectively, described air-flow flows through this electronic component 41-49 more respectively, to take away the heat produced when this electronic component 41-49 works, and discharge from described exhaust outlet 111.Be arranged at the diverse location on this housing 10 due to described first air entry 151 and the second air entry 153, therefore formed between described first air entry 151 and described exhaust outlet 111 and allow the first air duct of air circulation (scheming not mark); Formed between described second air entry 153 and described exhaust outlet 111 and allow the second air duct of air circulation (scheming not mark), and electronic component 41-49 is arranged in described first air duct and/or the second air duct.Therefore, after air enters from above-mentioned first air duct and the second air duct respectively, the electronic component 41-49 be arranged in the first air duct and in the second air duct will be blowed to respectively, and discharge from described exhaust outlet 111.
Further, the first air duct is crossing with the second air duct, to form heat loss through convection, improves radiating efficiency.
Be appreciated that in other embodiments, this radiator fan 50 can also be scavenger fan, for being discharged from described exhaust outlet 111 by the air-flow of this housing 10 inside.
See also Fig. 5, in the present embodiment, described radiator 70 is heat-conducting plate.Described radiator 70 is roughly in " L " matrix shape, and it is pasted by the Heat Conduction Material such as heat conductive silica gel, heat-conducting silicone grease and is fixed on this electronic component 41-49, for carrying out auxiliary heat dissipation to described electronic installation 100 entirety.Certainly, in other embodiments, the shape of this radiator 70 and structure also can adjust accordingly according to the position of the electronic component be laid on this substrate 30.Such as, when being arranged on the entirety of the electronic component on this substrate 30 in " U " type structural arrangement, described radiator 70 also can be " U " matrix shape.
Be appreciated that, when being arranged at the electronic component on substrate 30, when such as, having the electronic component to temperature is more responsive in electronic component 42-49, described radiator 70 also can be the described electronic component more responsive to temperature and arranges corresponding radiating fin, effectively to improve the radiating efficiency of the described electronic component more responsive to temperature.Such as, in the present embodiment, multiple electronic component more responsive to temperature is provided with in described electronic component 41-49, such as electronic component 45,48,49.Therefore, on described radiator 70, the position of the corresponding described electronic component 45,48,49 more responsive to temperature is provided with the first radiating fin group 71 and the second radiating fin group 73.First radiating fin group 71 and the second radiating fin group 73 are all located at described radiator 70 and deviate from the surface of described electronic component 42-49.Be appreciated that described radiating fin group can be arranged along the airintake direction of described first air entry 151 and/or the second air entry 153, to improve its radiating efficiency further.Such as, in an embodiment, described first radiating fin group 71 entirety is arranged along the airintake direction of described first air entry 151, and described second radiating fin group 73 entirety is arranged along the airintake direction of described second air entry 153.
See also Fig. 6, in the electronic installation 100 of the present embodiment, its housing 10, substrate 30, radiator fan 50 and radiator 70 form radiator structure jointly.When described radiator fan 50 works, the air of flowing enters described receiving space 17 by the first air entry 151 and the second air entry 153, and blow to corresponding electronic component respectively along two different air ducts, then by described exhaust outlet 111, the heat that described electronic component 41-49 produces is derived fast.Concrete, when the air flowed enters the first air duct by the first air entry 151, the air of described flowing will flow through and directly acts on the electronic component be arranged in the first air duct, to take away the heat that this electronic component produces, and arrives radiator 70.Meanwhile, when the air flowed enters the second air duct by the second air entry 153, the air of described flowing will flow through and directly acts on the electronic component be arranged in the second air duct, to take away the heat of this electronic component, and arrives radiator 70.Described radiator 70 converges the heat from the first air duct and the second air duct, and carries out heat convection with described radiator fan 50, and then is discharged through described exhaust outlet 111 by the heat that described electronic component 41-49 produces.
In addition, due to described radiator 70 being provided with radiating fin, therefore the radiating efficiency of its corresponding electronic component can be accelerated, make its temperature lower than the temperature not having correspondence to arrange the electronic component of radiating fin, and then guarantee that the electronic component of different temperatures sensitiveness all can well be dispelled the heat, effectively can reduce system wind resistance, to reduce the noise of this electronic installation 100 simultaneously.
Fig. 7 is the Temperature Distribution analogous diagram of each electronic component in electronic installation 100, and wherein more to deeply feel temp. displaying function higher for color.Obviously, above-mentioned radiator structure and there is this radiator structure electronic installation 100 by arranging two air entries and exhaust outlet, the radiating layout of formation like this " two enter one goes out ", the heat of this housing 10 inside is conducive to all to be discharged, and improve radiating efficiency, thus without the need to heat-pipe radiator, such that the structure of this radiator structure is simple and cost is lower.In addition, because described electronic component 41-49 is all arranged near two air entries, after air so can be made to enter from two air entries, directly flow through electronic component, and then high efficiency and heat radiation.Meanwhile, because described electronic component 41-49 separates layout, such as, be separately positioned in different air ducts, so can make full use of product structure space, effectively reduce density of heat flow rate.Again, described radiator 70 only arranges radiating fin group near temperature sensitive electronic component, so can effectively reduce system wind resistance, to reduce the noise of this electronic installation 100.
Be appreciated that in other embodiments, the cold air of outside also can suck from described exhaust outlet 111 by described radiator fan 50, then discharges respectively by described first air entry 151 and the second air entry 153.That is, above-mentioned wind path can reverse by this electronic installation 100, by original exhaust outlet 111 as inlet port, and using the first original air entry 151 and the second air entry 153 as exhaust outlet, to form the radiator structure of " enters scene 2 ", and then reach same radiating effect.
Be appreciated that, the quantity of described air entry can be not limited to two in the present embodiment, it can adjust according to actual conditions, such as, only arrange an air entry (first air entry 151 or the second air entry 153), or arrange more than three or three air entries.Accordingly, described air entry can form the air duct of, more than three or three with this exhaust outlet 111.
Claims (18)
1. a radiator structure, it is characterized in that: described radiator structure comprises housing and radiator fan, described housing is offered at least one air entry and exhaust outlet, an air duct is at least formed between described air entry and described exhaust outlet, described radiator fan is arranged in described housing, for driving air duct described in air flow direction.
2. radiator structure as claimed in claim 1, is characterized in that: described radiator fan is scavenger fan, for being discharged from described exhaust outlet by the air-flow of enclosure interior;
Or described radiator fan is extraction fan, for the air-flow outside housing is sucked in described housing from described air entry.
3. radiator structure as claimed in claim 1 or 2, it is characterized in that: described housing is offered the first air entry and the second air entry, described first air entry and described exhaust outlet form the first air duct, and described second air entry and described exhaust outlet form the second air duct.
4. radiator structure as claimed in claim 3, is characterized in that: described first air duct is crossing with the second air duct.
5. radiator structure as claimed in claim 3, is characterized in that: described first air entry and the second air entry are arranged away from described exhaust outlet;
And/or the bearing of trend of described first air entry and the second air entry is not identical with the bearing of trend of described exhaust outlet;
And/or the bearing of trend of described first air entry is not identical with the bearing of trend of the second air entry.
6. radiator structure as claimed in claim 5, it is characterized in that: described housing comprises diapire, roof and perisporium, described diapire and roof are oppositely arranged, described perisporium is connected on the side of described diapire and roof, and jointly form a receiving space with described diapire and roof, described receiving space is in order to accommodate described radiator fan and multiple electronic component, and described multiple electronic component is thermal source.
7. radiator structure as claimed in claim 6, is characterized in that: described first air entry and the second air entry be the through diverse location be arranged on described perisporium respectively, and described exhaust outlet is arranged on described diapire.
8. radiator structure as claimed in claim 7, is characterized in that: described first air entry and the second air entry are opened on two sides adjacent in described perisporium respectively;
Or described first air entry and the second air entry are opened on two sides relative in described perisporium respectively.
9. radiator structure as claimed in claim 6, it is characterized in that: described radiator structure also comprises substrate and radiator, described substrate and described radiator are all arranged in described receiving space, described substrate is for carrying electronic component, described radiator is used for contacting with described electronic component, goes out with the heat conduction produced by described electronic component.
10. radiator structure as claimed in claim 9, is characterized in that: described radiator is heat-conducting plate.
11. radiator structures as claimed in claim 9, is characterized in that: described radiator is laid with multiple radiating fin, and described radiating fin corresponds to electronic component more responsive to temperature on described substrate.
12. radiator structures as claimed in claim 11, it is characterized in that: described radiating fin comprises the first radiating fin group and the second radiating fin group, described first radiating fin group is arranged along the airintake direction of described first air entry, and described second radiating fin group is arranged along the airintake direction of described second air entry.
13. 1 kinds of electronic installations, comprise electronic component and as the radiator structure in claim 1-12 as described in any one, wherein said electronic component is thermal source, and are arranged in described air duct.
14. electronic installations as claimed in claim 13, is characterized in that: described substrate is circuit board.
15. electronic installations as claimed in claim 13, is characterized in that: described electronic component is multiple, and all contiguous described air entry is arranged.
16. electronic installations as claimed in claim 15, it is characterized in that: described housing offers opening, one of them electronic component is arranged in described opening, and remaining electronic component is arranged on the substrate.
17. electronic installations as claimed in claim 16, is characterized in that: described opening is opened in the side at the first air entry place described in described perisporium.
18. electronic installations as claimed in claim 16, is characterized in that: described electronic installation is The Cloud Terrace, the electronic component being located at described opening is hard disk, and described hard disk is for storing the view data of the camera head of described The Cloud Terrace carrying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520314035.2U CN204578961U (en) | 2015-05-15 | 2015-05-15 | Radiator structure and there is the electronic installation of this radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520314035.2U CN204578961U (en) | 2015-05-15 | 2015-05-15 | Radiator structure and there is the electronic installation of this radiator structure |
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| Publication Number | Publication Date |
|---|---|
| CN204578961U true CN204578961U (en) | 2015-08-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520314035.2U Active CN204578961U (en) | 2015-05-15 | 2015-05-15 | Radiator structure and there is the electronic installation of this radiator structure |
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| CN (1) | CN204578961U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105552659A (en) * | 2016-02-24 | 2016-05-04 | 苏州携旅网络技术有限公司 | Intelligent USB interface kit |
| CN109050955A (en) * | 2018-09-30 | 2018-12-21 | 广州科易光电技术有限公司 | Light-duty unmanned machine head and UAV system |
| CN109050954A (en) * | 2018-09-30 | 2018-12-21 | 广州科易光电技术有限公司 | The unmanned machine head of lightweight |
| CN109050953A (en) * | 2018-09-30 | 2018-12-21 | 广州科易光电技术有限公司 | The unmanned machine head of lightweight and UAV system with multi-cam |
| CN109050952A (en) * | 2018-09-30 | 2018-12-21 | 广州科易光电技术有限公司 | The unmanned machine head of lightweight with external radiator |
| CN110313225A (en) * | 2018-06-26 | 2019-10-08 | 深圳市大疆创新科技有限公司 | Radiating subassembly and circuit board assemblies, unmanned vehicle with it |
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2015
- 2015-05-15 CN CN201520314035.2U patent/CN204578961U/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105552659A (en) * | 2016-02-24 | 2016-05-04 | 苏州携旅网络技术有限公司 | Intelligent USB interface kit |
| CN110313225A (en) * | 2018-06-26 | 2019-10-08 | 深圳市大疆创新科技有限公司 | Radiating subassembly and circuit board assemblies, unmanned vehicle with it |
| WO2020000189A1 (en) * | 2018-06-26 | 2020-01-02 | 深圳市大疆创新科技有限公司 | Heat dissipating assembly, and circuit board assembly and unmanned aerial vehicle having the heat dissipating assembly |
| CN109050955A (en) * | 2018-09-30 | 2018-12-21 | 广州科易光电技术有限公司 | Light-duty unmanned machine head and UAV system |
| CN109050954A (en) * | 2018-09-30 | 2018-12-21 | 广州科易光电技术有限公司 | The unmanned machine head of lightweight |
| CN109050953A (en) * | 2018-09-30 | 2018-12-21 | 广州科易光电技术有限公司 | The unmanned machine head of lightweight and UAV system with multi-cam |
| CN109050952A (en) * | 2018-09-30 | 2018-12-21 | 广州科易光电技术有限公司 | The unmanned machine head of lightweight with external radiator |
| CN109050955B (en) * | 2018-09-30 | 2023-10-13 | 广州科易光电技术有限公司 | Light unmanned aerial vehicle cloud platform and unmanned aerial vehicle system |
| CN109050953B (en) * | 2018-09-30 | 2023-10-13 | 广州科易光电技术有限公司 | Unmanned aerial vehicle cloud platform and unmanned aerial vehicle system with many cameras |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170605 Address after: 518057 Guangdong city of Shenzhen province Nanshan District Guangdong streets south four Road No. 18 building in the West SKYWORTH semiconductor design 12 Patentee after: Shenzhen City, Jiang Mou Ling Technology Co. Ltd. Address before: 518057 Guangdong province Shenzhen city Nanshan District high tech Zone South Hing a No. 9 Hongkong, Shenzhen building 6 floor Patentee before: Shenzhen Dji Technology Co., Ltd. |
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| TR01 | Transfer of patent right |