CN105874890B

CN105874890B - The heat dissipation of substrate in batch piece installing

Info

Publication number: CN105874890B
Application number: CN201580003580.2A
Authority: CN
Inventors: D.A.赖特; D.迪安; R.W.埃利斯
Original assignee: SanDisk Corp
Current assignee: SanDisk Corp
Priority date: 2014-02-27
Filing date: 2015-02-19
Publication date: 2019-06-04
Anticipated expiration: 2035-02-19
Also published as: US20150245533A1; CN105874890A; KR101951082B1; WO2015130551A1; US20170064870A1; US9848512B2; US9497889B2; KR20160128291A

Abstract

Various embodiments described herein includes the systems, methods and/or devices for the heat generated by the electronic component in electronic system (storage system for example including intensive memory module) that dissipates.In one aspect, a kind of electronic system (100) includes substrate (206), at least one electronic component (212) and heat sink (214).At least one electronic component (212) is mechanically coupled to substrate (206) and is thermally coupled to the ground plane (210) of substrate (206), so that being at least partly dissipated to the ground plane (210) of substrate by the heat that at least one electronic component (212) generates.Heat sink (214) are mechanically coupled to the edge of substrate (206), and are thermally coupled to the ground plane (210) of substrate with the heat generated by least one electronic component (212) that at least partly dissipates.In some embodiments, heat sink further includes accessory structure (216), contact pin (218) and multiple radiators (220).

Description

The heat dissipation of substrate in batch piece installing

Technical field

The disclosed embodiments relate generally to radiate, and more particularly to dissipate by the ministry of electronics industry in electronic system The heat that part generates.

Background technique

Many electronic systems include semiconductor storage module, such as solid state drive (SSD), dual-in-line memories Module (DIMM) and small shape DIMM, it is all these all using memory cell to store data as charge or voltage.? The density for increasing the memory cell on each individual memory member by using the manufacturing technology of enhancing realizes this The improvement of the storage density of a little modules.In addition, also by using advanced Board level packaging technology so that each memory device or Module includes more memory members and increases the storage density of these modules.However, with the increase of storage density, mould The total amount of heat that block generates also increases.These fever particularly problematic, middle-high densities in blade (blade) server system SSD and DIMM is continually accessed, and reads and writees operation for memory.In the case where lacking effective cooling mechanism, The increased heat can eventually lead to the reduced performance or failure of individual memory cell or entire module.

For the heat that the memory member to dissipate by compact package generates, memory module can be used to be couple to and partly lead Body memory device or module it is heat sink.The heat sink top that can be installed in memory device or memory module.From wind The air-flow of fan can be with cloth stream (routed through) or by heat sink to help the heat that dissipates.However, in view of memory module Cumulative compact form factor, the heat dissipation effect of the combination of heat sink and air-flow is usually insufficient.Therefore, it generally requires Bigger cooling system and/or fan is run with higher speed, which results in noises big, low efficiency and high-cost system, It cannot fully solve the non-homogeneous heat dissipation problem through each memory module.Accordingly, it is desired to provide a kind of solution is above-mentioned The cooling system of problem.

Summary of the invention

Each of various embodiments of system, method and apparatus in the application have several aspects, without list A aspect is responsible for attribute described herein.In the case where not limiting scope of the present application, after considering the disclosure, And after especially considering the chapters and sections of entitled " specific embodiment ", it will be appreciated that how the various aspects of each embodiment are used for The electronics in electronic module to dissipate by being integrated in electronic system (storage system for example including intensive memory module) The heat that component generates.

In one aspect, electronic system include substrate (substrate further includes ground plane), at least one electronic component, with And be mechanically coupled to the substrate edge it is heat sink.At least one described electronic component is mechanically coupled to the substrate and thermal coupling It is bonded to the ground plane, so that being at least partly dissipated to the substrate by the heat that at least one described electronic component generates Ground plane.It is described it is heat sink be thermally coupled to the ground plane, at least partly dissipate by least one described electronic component generate Heat.In some embodiments, heat sink further includes accessory structure, and the accessory structure is configured to be mechanically coupled to the substrate Edge and be thermally coupled to the ground plane of the substrate；Contact pin, the width of the thickness with the substantially equal to described substrate are described Contact pin be configured to from the accessory structure extend with group shelve in slot match；And multiple radiators, it is configured to increase The heat sink heat dissipation area.

According in this specification description and attached drawing, other embodiments and advantage will show to those skilled in the art And it is clear to.

Detailed description of the invention

In order to be more fully understood the disclosure, can be carried out particularly with reference to the feature of various embodiments Description, some of embodiments are shown in the accompanying drawings.However, attached drawing illustrates only the more relevant feature of the disclosure, and therefore Be not construed as it is restrictive because the description can permit other effective features.

Fig. 1 is the block diagram of the exemplary system module in typical computing device in accordance with some embodiments.

Fig. 2A is the isometric view of the exemplary electronic assembly part in accordance with some embodiments including electronic system, wherein electricity Subsystem includes heat sink.

Fig. 2 B shows the block diagram of the exemplary electronic assembly part in accordance with some embodiments including electronic system, wherein electricity Subsystem includes one or more heat sink.

Fig. 2 C is the electric discharge of the exemplary electrostatic used in the electronic system of Fig. 2 B (ESD) protection in accordance with some embodiments The circuit diagram of circuit.

Fig. 3 A be another exemplary electronic system in accordance with some embodiments being assembled on the frame of electronic assembly part etc. Away from view.

Fig. 3 B is the isometric view of electronic system shown in Fig. 3 A, and according to some embodiments, two in its substrate are opposite Edge include heat sink.

Fig. 3 C is the heat sink isometric view of demonstration in accordance with some embodiments, this is heat sink to be configured to be couple to substrate and consume It is dispersed in the heat generated on substrate.

The substrate edges of Fig. 4 A and 4B connecting mechanically to each other in accordance with some embodiments and thermal coupling and heat sink two points Solve isometric view.

Fig. 5 A-5C is the heat sink three-dimensional view of three demonstrations in accordance with some embodiments including corresponding accessory structure Figure, the accessory structure are configured to be mechanically coupled to the edge of substrate.

Fig. 6 A and 6B are the heat sink isometric views of two demonstrations in accordance with some embodiments, each of which is dissipated with multiple Hot device, multiple heat sink arrangements are to increase corresponding heat sink heat dissipation area.

Fig. 7 shows in accordance with some embodiments for assembling the exemplary flow chart of the method for electronic system, the electronics System includes that one or more is heat sink, and the one or more is heat sink to be configured to the heat generated in dissipation electronic system.

According to common practice, various features shown in the accompanying drawings may be not necessarily to scale.Correspondingly, being risen to be clear See, the size of various features may be zoomed in or out specially.In addition, some attached drawings may not be painted given system, method Or all components of device.Finally, similar appended drawing reference can be used to refer to for similar spy in the whole instruction and attached drawing Sign.

Specific embodiment

Various embodiments described herein includes systems, methods and/or devices, can be used for or be integrated in Electronic Assemblies In part.Particularly, electronic system described herein, heat sink and heat dissipating method help to be generated by the electronic component in electronic system Heat dissipation.

Such electronic system another example is storage systems, be generally integrated in many computers and consumer electronics In device.Storage system generally includes the memory module being closely arranged, and needs effective heat dissipation.Some embodiments are at this Described in the text is in the background of universal electric system.However, it would be recognized by those skilled in the art that embodiment described herein It can be used in storage system or other electronic systems, these systems include two or more electricity being integrated in the confined space Submodule, and need effective heat dissipation.

More specifically, according to some embodiments, electronic system includes substrate (substrate further includes ground plane), at least one A electronic component and be mechanically coupled to the substrate edge it is heat sink.At least one described electronic component is mechanically coupled to The substrate and the ground plane for being thermally coupled to the substrate so that by least one described electronic component generate heat at least partly Ground is dissipated to the ground plane of the substrate.The heat sink ground plane for being thermally coupled to the substrate, at least partly dissipate by The heat that at least one described electronic component generates.

In some embodiments, it is described it is heat sink further include accessory structure, the accessory structure is configured to be mechanically coupled to institute It states the edge of substrate and is thermally coupled to the ground plane of the substrate；Contact pin, the width of the thickness with the substantially equal to described substrate Degree, the contact pin be configured to from the accessory structure extend with group shelve in slot match；And multiple radiators, configuration To increase the heat sink heat dissipation area.In some embodiments, multiple radiators include first group be substantially parallel to each other Fin and second group of fin being substantially parallel to each other.First group of fin and second group of fin are according to the direction of air-flow Orientation is different, substantially homogeneously to distribute air-flow in the substrate.In some embodiments, at least one in multiple radiators Region of a radiator on the heat sink central area for extending to the substrate attached by the edge of the substrate, and with it is described Substrate partly overlaps.

In some embodiments, it is described it is heat sink further include accessory structure, the accessory structure is configured to allow the substrate Marginal mechanical be locked to the accessory structure.

In some embodiments, it is described it is heat sink include first heat sink, described first heat sink is mechanically coupled to the substrate First edge, and the electronic system further includes second heat sink, described second heat sink is mechanically coupled to via the second accessory structure The second edge of the substrate, the second edge of the substrate are opposite with the first edge of the substrate.Described second it is heat sink also It is thermally coupled to the ground plane, at least partly to dissipate from the second edge of the substrate by least one described electronic component The heat of generation.In addition, in some embodiments, described first it is heat sink and it is described second it is each of heat sink include connecing accordingly Piece, corresponding contact pin have the corresponding width for the thickness for being substantially equal to the substrate.Described first is heat sink and described Second heat sink contact pin is configured to extend from corresponding accessory structure, is guided with the card shelved in the two of substrate edge and group Structure matches.

In some embodiments, it is described it is heat sink via Electro-static Driven Comb (ESD) protection circuit be conductively coupled to the ground plane.

In some embodiments, apply heat-conductive bonding agent so that the described heat sink and described substrate is thermally coupled and electrically isolated, and The heat-conductive bonding agent has substantially low thermal resistance and substantially high resistance.

In some embodiments, the substrate includes first substrate, and the electronic system includes multiple substrates, Duo Geji Plate includes the first substrate.Each substrate in the subgroup of the multiple substrate is thermally coupled to phase at the edge of corresponding substrate That answers is heat sink, with the heat generated by least one the corresponding electronic component being mounted on corresponding substrate that dissipates, and it is described Each substrate in the subgroup of substrate via it is corresponding it is heat sink on corresponding contact pin be assembled in group and shelve, and it is substantial parallel Orientation.

According to another aspect of the present invention, it provides a kind of for the heat sink of heat dissipation.It is described heat sink including accessory structure, it is described Accessory structure is configured to be mechanically coupled to the edge of substrate and is thermally coupled to the ground plane of the substrate, wherein the substrate includes Ground plane and at least one electronic component, and at least one described electronic component is mechanically coupled to the substrate and is thermally coupled to institute Ground plane is stated, so that the ground plane is at least partly dissipated to by the heat that at least one described electronic component generates, and Further it is dissipated to the heat sink accessory structure.

It is described it is heat sink further include contact pin, the contact pin has the width for the thickness for being substantially equal to the substrate, wherein institute It states contact pin to be configured to extend from the accessory structure, to match in group is shelved with card guide structure.It is described heat sink to further include Multiple radiators, the multiple heat sink arrangements be increase the heat sink heat dissipation area and at least partly dissipate by it is described extremely The heat that a few electronic component generates.

In some embodiments, the accessory structure further includes the attached slot of friction lock, and the attached slot of friction lock is configured to According to narrow slot neck mechanical caging substrate edges.

In some embodiments, the accessory structure further includes first passage of heat, the position of first passage of heat and phase The position of second passage of heat on corresponding substrate edges matches, and is integrated according to described heat sink and the substrate, described First passage of heat and second passage of heat alignment, to form the heat passage for passing through the integrated heat sink and substrate.

Finally, according to another aspect of the present invention, providing a kind of heat dissipating method, which comprises according to the side of substrate The geometry of edge provides accessory structure and heat sink contact pin, wherein the contact pin has the thickness for being substantially equal to the substrate Width and be configured to from the accessory structure extend, matched with being shelved in group with card guide structure.The method is also wrapped It includes in the heat sink upper multiple radiators of offer, to increase the heat sink heat dissipation area, at least partly to dissipate by institute State the heat of heat sink absorption.It is described heat sink to form electronics in the edge of substrate mechanical attachment via the accessory structure System.The accessory structure is mechanically coupled to the edge of the substrate and is thermally coupled to the ground plane of the substrate.At least one Electronic component is mechanically coupled on the substrate and is thermally coupled to the ground plane of the substrate.By at least one described electronic component The heat of generation is at least partly dissipated to the ground plane of the substrate, and is further dissipated to including the accessory structure, institute State the described heat sink of contact pin and the multiple radiator.

In some embodiments, the heat dissipating method further includes the electronic system collection that will include described heat sink and described substrate It is shelved at the group in electronic assembly part.

This document describes many details to provide the thorough understanding to example embodiment shown in the accompanying drawings.However, some Embodiment may not need these multiple specific details to implement, and the scope of the claims in claim only by specifically enumerating Those of feature and aspect limit.In addition, well known method, component and circuit are not described in detail, in order to avoid not It is necessary obscure embodiment described herein more relevant aspect.

Fig. 1 is the block diagram of the exemplary system module 100 in accordance with some embodiments in typical computing device.The meter Calculate the system module 100 in device include at least central processing unit (CPU) 102, for storing program, instruction and data is deposited Memory modules 104, input/output (I/O) controller 106, such as network interface 108 one or more communication interfaces and For interconnecting one or more communication bus 150 of these components.In some embodiments, I/O controller 106 allows CPU 102 communicate via Universal Serial Bus Interface with I/O device (such as keyboard, mouse, Trackpad etc.).In some embodiments, Network interface 108 includes one or more interfaces for Wi-Fi, Ethernet, and/or blueteeth network, each of which allows to count It calculates device 100 and exchanges data with external source (such as server or another computing device).In some embodiments, communication bus 150 include circuit (sometimes referred to as chipset), with interconnect and control system module in include various system units between it is logical Letter.

In some embodiments, memory module 104 includes high-speed random access memory, such as DRAM, SRAM, DDR RAM or other random access solid state memory devices.In some embodiments, memory module 104 includes non-volatile memories Device, such as one or more disk storage devices, optical disk storage apparatus, flash memory devices or other nonvolatile solid states Storage device.In some embodiments, memory module 104, or it is alternative, it is non-volatile in memory module 104 Memory device, including non-transitorycomputer readable storage medium.In some embodiments, retain on system module 100 Memory bank is to receive memory module 104.Once being inserted into memory bank, memory module 104 is integrated in system mould In block 100

In many examples, system module 100 further includes selected from following one or more components:

Memory Controller 110 in computing device controls CPU 102 and the memory including memory module 104 Communication between component；

Solid state drive (SSD) 112, application integrated circuit assembly is with the storing data in computing device, and in many In embodiment, solid-state device 112 is configured based on NAND or NOR memory；

Hard disk drive 114 is based on machine for storing and retrieving (retrieving) for conventional data storage device The digital information of electromagnetic disc；

Power supply connector 116 is electrically coupled to receive external power supply；

The supply of received external power is modulated to other desired DC electricity by electrical management integrated circuit (PMIS) 118 Voltage levels, such as 5V, 3.3V or 1.8V, as in computing device various parts and circuit required for；

Video card 120 is generated according to the desired image/video format of one or more display devices to this or more The feeding of the output image of a display device；And

Sound card 122, facilitate to travel to and fro between under control of a computer program the audio signal of computing device input and Output.

It should be noted that communication bus 150 is also interconnected and is controlled between various system units (including component 110-122) Communication.

Further, it will be understood by those skilled in the art that other non-transitorycomputer readable storage mediums can be used, With the exploitation of new data storage technology, the non-transitory stored information in memory module 104 and SSD 112 is calculated In machine readable storage medium storing program for executing.These new non-provisional computer-readable recording mediums include but is not limited to: by biomaterial, nanometer Those of line, carbon nanotube and unimolecule manufacture storage medium, though corresponding data storage technology at present still in exploitation and It is not commercialized also.

Some in above-mentioned parts generate heat during normal operation, and are therefore integrated with the heat sink corresponding to reduce of separation The temperature of component.For example, can have for the solid state drive 112 in blade server, to be mounted on each individual biserial straight It inserts on the top of formula memory module (DIMM) or is mounted on heat sink on the electronic assembly part comprising DIMM.By the electricity in DIMM The heat that subassembly generates is directed to heat sink first, and is further dissipated by the air-flow that is generated by fan.However, with this Data workload in a little blade servers increases and the reduction of the form factor of DIMM is (such as in memory module 104 In the memory bank that is closely arranged), so that conventional heat sink and high speed fan is more difficult to effectively to guide and dissipation heat.

To solve this problem, various embodiments described herein includes one or more heat sink, one or more of At least one edge of the heat sink substrate for being mechanically coupled to electronic system (such as solid state drive 112 or memory module 104), And in some embodiments, two opposite edges of the substrate of electronic system are couple to.These are heat sink to be thermally coupled to substrate Ground plane 210, substrate is further thermally coupled to heat generating components, is at least partly dissipated with providing effective heat dissipation channel by pacifying The heat that electronic component on substrate generates.In addition, in some embodiments, heat sink and substrate is configured to avoid for protecting Hold the cabinet of electronic system or the design variation of shell.Therefore, heat sink geometric configurations are to match the corresponding side of substrate The geometry of edge and the corresponding group of geometry shelved in cabinet/shell, as described below.By these modes, It is heat sink can be convenient with the substrate mounting of electronic system and be couple to existing cabinet/shell, thus improve in electronic system Radiating efficiency.

Fig. 2A is according to some embodiments include the exemplary electronic assembly part 200 containing heat sink electronic system 202 etc. Away from view.In some embodiments, such electronic assembly part 200 includes for storing in computing device as shown in Figure 1 The solid state drive 112 or memory module 104 of program, instruction and/or data.In some embodiments, electronic assembly part 200 It is also normally used as in addition to the solid state drive 112 in Fig. 1 or any part other than memory module 104.In some implementations In example, electronic system 202 includes multiple substrates, is equipped at least one electronic component on each substrate, and each substrate is optional It is associated with DIMM.

Electronic assembly part 200 includes that group shelves 204 (sometimes referred to as cabinet frames or outer casing frame), and group shelves 204 for assembling The substrate of electronic system 202.In specific embodiment shown in Fig. 2, it includes a pair of of frame part 204A and 204B that group, which shelves 204, And each frame part has multiple card guide slots.Two frame part 204A and 204B are faced each other, and on two frame parts Card guide slot substantial alignment.In some embodiments, group shelves the component that part 204A and 204B are two separation, and one In a little embodiments, together via connector mechanical attachment not shown in FIG. 2.Each substrate of electronic system 202 can Being configured to of choosing heat sink slips into two frame part 204A by itself or via the one or more for being coupled in its edge With the card guide slot of the alignment on 204B.When all substrates of electronic system 202, which are assembled into group, to be shelved on 204, they are real It is positioned in parallel within group in matter to shelve in 204, and becomes a part of electronic assembly part 200 together.

In some embodiments, multiple substrates filling of electronic system 202, but not every card guide slot, and Retain some slots to open wide between corresponding adjacent substrate.In some embodiments, card guide slot be left it is open with Accommodate the top side or additional heat sink on bottom side for being mounted on adjacent substrate.Even if in not such additional heat sink feelings Under condition, open card guide slot increase the volume of air that passes through between the corresponding adjacent substrate of electronic system 202 and Air-flow, and therefore improve the radiating efficiency of electronic assembly part 200.However, in some cases, using open card guide slot Such heat dissipation improvement be undesirable, this is because it has impact on the device density of electronic assembly part 200.

Each substrate of electronic system 202 includes two opposite edges, and the thickness at two opposite edges is configured to The card guide slot on frame part 204A and 204B is slipped into respectively.In some embodiments, electronic system 202 includes the first heat It is heavy, first heat sink one be mechanically coupled in two opposite edges, and be configured to slip into corresponding card guide slot. When electronic system 202, which is assembled into group, shelves on 204, the first heat sink substrate for being connected in group and shelving 204 and electronic system 202 Between.

In some embodiments, identical electronic system 202 further include be mechanically coupled to substrate opposite edge second It is heat sink.Here, when electronic system 202, which is assembled into group, shelves on 204, first is heat sink and that each of second is heat sink is coupled Between the corresponding slot that electronic system 202 and group shelve 204, that is, in the opposite edge of the corresponding substrate of electronic system 202 Place.

According to its own radiating requirements, each substrate for shelving the electronic system 202 that 204 fit together with group is optional Its corresponding edge be integrated with one it is heat sink, two it is heat sink or not heat sink.When the substrate direct-assembling of electronic system 202 When shelving on 204 in group and not including heat sink in its edge, two opposite edges of corresponding substrate all have to be shelved with group The geometry that corresponding card guide slot matches those of on 204, and substrate length match group shelves the corresponding card on 204 Interval d between guiding groove.When electronic system substrate one or both of two opposite edge place connection have it is heat sink When, the substrate length of electronic system 202 must shorten heat sink to accommodate in corresponding edge.Heat sink geometric match base Both the geometry and the geometry of card guide slot at the edge of plate.Here, there are one or more heat sink substrates Total length is equal to the interval d between the corresponding slot that group is shelved.On how to configure the more details of heat sink geometry It is explained in detail below with regard to Fig. 3 A-3C.

In some embodiments, it is couple to the heat sink not instead of single component at the edge of the substrate of electronic system 202, is wrapped Include two or more heat sink components.

Fig. 2 B show it is in accordance with some embodiments include containing one or more heat sink 214 electronic system 202 demonstration The block diagram of property electronic assembly part 200.As explained above, electronic assembly part 200 includes that group shelves 204 (sometimes referred to as cabinets Or outer casing frame), group shelves 204 and is configured to receive one or more substrates 206 of electronic system 202.Particularly, group shelves 204 Including multiple card guide structures 208 (such as card guide slot shown in Fig. 2A), card guide structure 208 is used for electronic system 202 It is aligned and is maintained in electronic assembly part 200.

Each substrate 206 of electronic system 202 includes two opposite sides for being configured to be couple to card guide structure 208 Edge.In some embodiments, substrate 206 is made of printed circuit board (PCB), and including multiple electric power faces (such as ground plane And multiple signal faces 210).

Electronic system 202 further includes at least one electronic component 212 being mounted on each substrate 206.Electronic component 212 The heat of generation is at least partly dissipated to substrate 206.In some cases, the heat of generation is not effectively from Electronic Assemblies Part 200, which dissipates, to be discharged, and the electric power face in substrate 206 and the temperature in signal face is caused to increase.

In some embodiments, as explained above with reference to Fig. 2A, electronic assembly part 200 further includes being thermally coupled to ground connection One or more electronic components 212 in face 210.Heat sink 214 are also thermally coupled to the ground plane 210 of substrate 206, at least partly Dissipate the heat generated by least one electronic component 212.In some embodiments, heat sink 214 further include accessory structure 216, Card guide tab 218 and multiple radiators 220.Accessory structure 216 is configured to be mechanically coupled to the edge and thermal coupling of substrate 206 It is bonded to the ground plane 210 of substrate 206.Card guide tab 218 is configured to extend from accessory structure 216, to shelve on 204 with group Corresponding card guide structure 208 matches.In some embodiments, card guide tab is thermally coupled to accessory structure 216 and card draws Both guide structures 208.Multiple radiators 220 are connected in accessory structure 216 and/or card guide tab 218.Radiator 220 is matched It is set to and increases heat sink heat dissipation area, and the heat generated by electronic component 212 that at least partly dissipates.

In some embodiments, as use heat sink 214 as a result, thermal dissipating path 222 is formed, to dissipate by being mounted on pair The heat that electronic component 212 on the substrate 206 for the electronic system 202 answered generates.Along thermal dissipating path 222, the heat of generation At least part is transferred to the ground plane 210 of substrate 206, further to heat sink 214, and after this via heat sink 214 Radiator 220 is effectively dissipated.It should also be pointed out that when, in some embodiments, the heat absorbed by heat sink 214 is also at least It is partly transmitted to group and shelves 204 card guide structure 208 to radiate.

In some embodiments, electronic system 202 further includes static discharge (ESD) protection circuit 224.Esd protection circuit 224 are mechanically mounted on the substrate 206 of electronic system 202, and are configured to the ground plane for being conductively coupled to substrate 206 for heat sink 214 210.Esd protection circuit 224 be heat sink 214 be provided to electronic system 202 ground connection electric pathway, for discharge be gathered in it is heat sink Electrostatic charge on 214, otherwise the electrostatic charge can damage electronic component 212.In some cases, when heat sink 214 is attached When to substrate edges or being inserted into card guide structure 208, electrostatic charge is generated on heat sink 214, electrostatic charge may also be by passing through The air-flow on heat sink 214 surface generates.

One skilled in the art will appreciate that esd protection circuit 224 optionally in electrically connect heat sink 214 and substrate 206 connect Ground 210.In some embodiments, Thermal connector (such as heat-conductive bonding agent) is used for thermal coupling heat sink 214 and ground plane 210.Thermal connector without or with substantial low conductivity, therefore heat sink 214 and ground plane 210 it is substantially insulated from each other. In order to discharge the electrostatic charge being gathered on heat sink 214, electric pathway is optionally formed at heat sink 214 and some ground connection (such as electricity The assembly of subassemblies 200 is grounded) between.

Fig. 2 C is the protection electricity of demonstration ESD used in the electronic system 202 in accordance with some embodiments shown in Fig. 2 B The circuit diagram on road 224.Esd protection circuit 224 includes the resistor being connected in parallel between the ground plane 210 of substrate 206 and heat sink 214 R and capacitor C.In certain embodiments, resistor R has the resistance of 1Mohm, light current access is thus generated, by electrostatic Charge is leak into the ground connection of substrate 206.Although having the resistor R of substantial small resistance can will be heat sink in a manner of more preferably 214 are conductively coupled to the ground connection of substrate 206, but such electrically connect can generate earth-return circuit, which increases noise and damage The performance of electronic component 212 in evil electronic system 202.Optionally, resistor R and capacitor C are mounted in electronic system 202 Substrate 206 on discrete electronic component.However, in some embodiments, resistor R and capacitor C are integrated in electronics In component 212, which is especially provided as ESD guard block.In some embodiments, resistor R and electricity Container C is comprised in electronic component 212, and other than the electrostatic charge in release heat sink 214, which is led It is used for another function.

In some embodiments, electronic assembly part 200 will accumulate in the electrostatic charge in heat sink 214 or electronic system 202 It is grounded via the overall situation that group shelves 204 release of card guide structure 208 to electronic assembly part 200.In these embodiments, ESD Protection circuit 224 is not connected between the substrate 206 of electronic system 202 and heat sink 214.Therefore, according to specific assembly Grade considers that esd protection circuit 224 is optionally included in electronic system 202, to reduce electrical noise and avoid Electronic Assemblies Current loop in the earthed system of part 200.

Generally, heat sink 214 by having the material of the thermal capacity of the substrate 206 higher than electronic system 202 to be made, and therefore As storage heater with the heat generated by the electronic component 212 in electronic system 202 that absorbs and dissipate.In addition, heat sink 214 is preferred Be couple to ground connection via electric pathway, effectively to eliminate the electrostatic charge being accumulated on heat sink 214.

Fig. 3 A is another exemplary Department of Electronics on the frame 204 in accordance with some embodiments for being assembled in electronic assembly part 200 The isometric view of system 202.In this particular embodiment, a substrate 206 is illustrated only in electronic system 202 and is mounted on The group of electronic assembly part 200 is shelved on 204.Fig. 3 B is the equidistant of electronic system 202 shown in Fig. 3 B in accordance with some embodiments View, the electronic system 202 include heat sink 214 at two opposite edges of its substrate 206.Fig. 3 C is according to some implementations The isometric view of the demonstration heat sink 214 of example, this is heat sink 214 to be configured to be couple to what substrate 206 and being dissipated in generated on substrate Heat.In the specific embodiment shown in Fig. 3 B, heat sink 214 are assembled on the edge of substrate 206 to form electronic system 202, with the frame 204 being further coupled in electronic assembly part 200 shown in Fig. 3 A.In some implementations not shown in figures In example, before the substrate 206 of electronic system 202 is then couple to heat sink 214, heat sink 214 are optionally assembled to assembling Frame 204.

It includes two opposite frame part 204A and 204B that group, which shelves 204, and frame part 204A and 204B have between fixation Every d.Frame part 204A and 204B includes also card guide structure 208 in its corresponding inside, and card guide structure 208 is configured to connect Receive the substrate 206 of electronic system 202.As explained above with reference to Fig. 2A, in some embodiments, multiple card guide structures 208 are comprised on frame part 204A and 204B, for multiple substrates of substantial parallel configuration assembling electronic system 202 206。

In some embodiments, two adjacent card guide structures 208 on frame part 204A and 204B pass through ventilation Mouth 302 separates.The air-flow generated by external fan enters via ventilation opening 302 or leaves two corresponding neighbouring substrates Space between 206, so that generating and the heat being accumulated on two adjacent substrates 206 is effectively taken away by air-flow. In some embodiments, when heat sink 214, which are connected in group, shelves between 204 and the substrate 206 of electronic system 202, air-flow warp The radiator 220 on heat sink 214 and especially heat sink 214 is crossed, thus the heat for the absorption that dissipates.

Optionally, two opposite edges of the substrate 206 of electronic system 202 are coupled directly to group and shelve on 204 Card guide structure 208.In these embodiments, the interval d between the length matching frame part 204A and 204B of substrate 206.It can Choosing, it is using corresponding heat sink 214 that at least one of two opposite edges of substrate 206 of electronic system 202 is indirect Ground is couple to card guide structure 208.The length of substrate 206 is reduced to accommodate heat sink 214 so that substrate 206 and one or Multiple heat sink 214 total lengths still match the interval d between frame part 204A and 204B.

In some embodiments, electronic system 202 is memory module comprising is mounted on printed circuit board (PCB) base Memory integrated circuit component on plate.The embodiment of memory module includes but is not limited to signle in-line memory module (SIMM) and dual inline memory modules (DIMM).Each memory module further includes a series of random access memory Integrated circuit.These memory integrated circuits are conductively coupled to signal path and electric power rail using surface installation or through-hole technology, These signal paths and electric power rail are implemented on the multiple signal faces and electric power face being comprised in PCB substrate.Signal path and Memory integrated circuit is optionally coupled to each other by electric power rail by routing, is couple in PCB substrate other electronic components or The electric welding pad being arranged on substrate edges is couple to for external connection.In some embodiments, signal path and electric power rail At least some of be routed to the third edge of substrate 202 (it shelve 204 two opposite edges not with group is couple to Together), it and terminates at corresponding group of the electric welding pad on the third edge of substrate 202.In some embodiments, for some common DIMM, the range from 72 to 244 of the quantity of electric welding pad.

In some embodiments, electric connector 304 is further coupled in the space between frame part 204A and 204B.Electricity Connector 304 is configured to, and when electronic system 202, which is assembled into group, shelves on 204, which is conductively coupled to substrate The group of electric welding pad on 202 third edge.When group, which shelves 204, to be further integrated in system module 100, electric connector 304 are mechanically and electrically couple to system board (such as mainboard of computer), and make electronic system 202 and system module The communication between other modules in 100 is possibly realized.Particularly, the accessible storage of other modules in system module 100 Device module is to store and retrieve information therein.

As shown in Figure 3 C, heat sink 214 include accessory structure 216, card guide tab 218 and radiator 220, and special, Accessory structure 216 is configured to the width or thickness of the corresponding edge of the substrate 206 of matching electronic system 202.In the specific reality It applies in example, accessory structure 216 is open channel, receives the edge of corresponding substrate 206 wherein heat sink 214, and be thermally coupled to The ground plane 210 of substrate 206.In some cases, accessory structure 216 physically contacts with ground plane 210.However, in some feelings Under condition, the layer of heat-conductive bonding agent is applied on accessory structure 216, heat sink to couple heat sink 214 and substrate 206, and therefore 214 can not directly contact substrate 206 or ground plane 210 wherein.

As further shown in fig. 3 c, card guide tab 218 includes that card guidance squeezes (extrusion), card guidance extrusion tool There is the blade width of the substantially equal to thickness of substrate 206, card guide tab 218 can fit into group and shelve on 204 as a result, Card guide structure 208, card guide structure 208 be initially configured to matching substrate 206 edge.In some embodiments, card draws Guide-joining plate 218 has the contact pin length extended, and substrate must be shortened with its own and group shelve accommodated between 204 it is heat sink 214.In some embodiments, two opposite edges of substrate 206 are coupled to for two heat sink 214.Two heat sink 214 cards Guide tab 218 is configured to extend from heat sink 214 corresponding accessory structure 216, to shelve the card guide structure on 204 with group 208 match.

In various embodiments of the present invention, it heat sink 214 is mechanically coupled to the substrate 206 of electronic system 202 and assembles The card guide structure of frame 204.In some embodiments for needing compressed fit, certain power is needed to shift onto heat sink 214 pair On the substrate edges answered, and/or the electronic system of assembling 202 is further assembled into the card guide structure that group shelves 204 208.Heat sink 214 be heat sink to be couple to a demonstration of corresponding substrate edges using compressed fit shown in Fig. 3 C.? In some embodiments, welding refers to/contact pin and welding footmark pad be separately positioned on heat sink 214 accessory structure 216 with And on the fringe region of corresponding substrate 216.Referred to by solder bonds welding/contact pin and footmark pad be by heat sink 214 and substrate 206 mechanical attachments are together.In a further embodiment, substrate is attached to by heat sink 214 using screw, contact pin and/or glue 206, thereby increases and it is possible to facilitate the replacement of heat sink 214 or substrate 206.

Fig. 4 A and 4B be connecting mechanically to each other in accordance with some embodiments and thermal coupling substrate edges and heat sink two Exploded isometric view 400 and 450.The two exploded isometric views 400 and 450 are obtained from the two sides of corresponding substrate 206. It should be pointed out that in various embodiments of the present invention, substrate edges include but is not limited to the substantial narrow side of substrate edges Wall.Not equal to substrate edges 402 also refer to the fringe region of close and/or narrow side walls around substrate edges 402 (such as in base Substrate edges 402A and 402B observed by two opposite sides of plate 206).

In some embodiments, substrate edges 402 include one or more heat through-holes 406, and similar, heat sink 214 Accessory structure 216 also includes one or more heat through-holes 408 at corresponding position.When heat sink 214 and substrate 206 integrate when, Heat through-hole 406 on substrate edges 402 and one or two corresponding heat through-hole 408 on heat sink 214 accessory structure 216 It is directed at and is formed the heat passage of heat sink 214 and substrate 206 by assembling.When air-flow passes through heat passage 222, gas can be passed through Stream effectively takes away a part of the heat absorbed by heat sink 214.In some embodiments, the position of heat through-hole 406 is arranged Between two corresponding radiators 220 for being couple to accessory structure 216.Although in the specific embodiment shown in Fig. 4 A and 4B Two heat passages are formed via two groups of heat through-holes, but are more than those skilled in the art will know that can be formed on substrate edges 402 Two heat passages, their position are selected well to avoid radiator 220.

In some embodiments, the region of substrate edges 402 further extends the central area for backing into substrate 206, To accommodate more heat through-holes other than heat through-hole 406 on the outmost edge of substrate 206.Accessory structure 216 can Therefore the extension of choosing accommodates more heat through-holes with more Chong Die with substrate edges 402, with on substrate edges 402 Corresponding additional heat through-hole is formed together more heat passages.According to such arrangement, radiating efficiency is increased, this is not only Due to the bigger overlapping area between substrate 206 and heat sink 214, and it is also due to the increased quantity of heat passage.However, In some embodiments, only the region of substrate edges 402 extends the central area for backing into substrate 206 further to accommodate more More heat through-holes, and air-flow by these additional heat through-holes directly to dissipate come the heat of self-reference substrate 206.

In some embodiments, in the side wall of the heat through-hole 406 on substrate 206 and additional heat through-hole and substrate 206 Any signal or ground plane 210 be electrically insulated.Based on heat through-hole formed heat passage side wall also in substrate 206 signal or Ground plane 210 is electrically insulated.In other words, it is logical to be not exposed to the heat on substrate 206 for the signal traces in substrate 206 or ground plane 210 On the side wall in hole 206 or on corresponding heat passage, to not formed directly from heat sink 214 to the ground plane 210 in substrate 206 Power path.In some cases, the heat through-hole 406 on substrate 206 has substantially small buffer area (or substantially small Size), and the heat that the edge of signal traces or ground plane 210 is physically close to, but is not exposed on substrate 206 in signal face The side wall of through-hole 406.In contrast, in some embodiments, esd protection circuit 224 is electrically connected in heat sink 214 and substrate 206 Ground plane 210 between, discharge the electrostatic charge being gathered on heat sink 208 to provide alternative power path.

In some embodiments, it is drilled out on the accessory structure 216 on substrate edges 402 and/or on heat sink 214 similar Through-hole.Fastener (such as screw or nuts/bolts) is inserted into these through-holes and tightens, by substrate 206 and heat sink 214 machine Tool is linked together.In some embodiments, substrate edges 402A and/or accessory structure 216 further include corresponding contact pin, the phase The contact pin answered optionally includes through-hole, and the corresponding contact pin is also contributed to substrate 206 and heat sink 214 using certain fasteners It tightens together.

In some embodiments, the layer of heat-conductive bonding agent is applied with coated substrate edge 402 and/or accessory structure 216. Therefore, substrate 206 and heat sink 214 is not directly contacted with, but is coupled to each other via the holding of the layer of heat-conductive bonding agent.Heat-conductive bonding agent Layer has substantially low thermal resistance and substantially high resistance, is thermally coupled to ground plane 210 in substrate 206 for heat sink 214, Them are made to be electrically insulated simultaneously.In some embodiments, heat sink 214 esd protection circuit 224, esd protection circuit 224 are conductively coupled to Alternative power path is provided discharging the electrostatic charge on heat sink 214 to the ground plane 210 of substrate 206.Above with reference to figure 2B and Fig. 2 C discusses the more details about esd protection circuit 224.

Fig. 5 A-5C is that the edge in accordance with some embodiments including being configured to be mechanically coupled to substrate 206 is attached accordingly The 3-D view of structure 216A, 216B or three demonstrations heat sink 214 of 216C.Each accessory structure 216A, 216B or 216C Including the attached slot 502 of friction lock, corresponding substrate edges are inserted into and are locked to the attached slot 502 of friction lock.Particularly, attached Belonging to structure 216A has narrow slot neck 504 in the edge of the attached slot 502 of friction lock, and the substrate edges being inserted into are corresponding It must include groove at position to match narrow slot neck 504.When vertically by the insertion attached slot 502 of friction lock of substrate 206 When, it cannot be separated freely along other directions (such as horizontal direction), this is because narrow slot neck 504 is substantially by substrate 206 Locking is in place.

In the specific embodiment shown in Fig. 5 A, accessory structure 216A is left to be opened between every two radiator 220 It opens, which is mechanically coupled to two opposite sides of accessory structure 216A.Open side in addition to receiving substrate 206 And for being couple to other than the two sides of radiator 220, accessory structure 216A further includes distal side, when substrate 206 locks just When position, which maintains to contact with the good of the edge of substrate 206.

Optionally, the attached slot 502 of the friction lock of accessory structure (such as structure 216B) has the slot end widened, to have Help substrate 206 and is inserted into the attached slot 502 of friction lock.Optionally, the friction lock of accessory structure (such as structure 216C) is attached Slot 502 has the shape of slight curvature, and corresponding substrate edges use the shape to match with the curved shape of slot 502.

In some embodiments, the layer of adhesion material is applied in accessory structure 216A-216C and corresponding substrate edges Interface.When substrate 206 be positioned in place and the layer of adhesion material pass through certain processing (such as passing through heat treatment) healing (healed) when, heat sink 214 and substrate 206 it is glued together.However, in some embodiments, applying alternative mechanical caging Mechanism (such as narrow slot neck 504) replaces jointing material, and the mechanical stability needed for providing.In some cases, when heat sink 214 or 206 cisco unity malfunction of substrate and when needing to be replaced, alternative locking mechanism allows nonfunctional part easily to be divided From and replacement, while keeping other function part.

Fig. 6 A and 6B are the isometric views of two demonstrations heat sink 214 in accordance with some embodiments, each of which is with multiple Radiator 220, multiple radiator 220 are configured to increase corresponding heat sink 214 heat dissipation area.Multiple radiators 220 are attached It is connected to the card guide tab 218 of accessory structure 216 and/or heat sink 214.In the two specific embodiments, radiator 220 is wrapped Multiple fins are included, multiple fin effectively acts on as heat radiator and controls air-flow.In the embodiment shown in Fig. 6 A, multiple heat dissipations Device includes first group of fin 220A being substantially parallel to each other and second group of fin 220B substantial also parallel to each other.First group of fin 220A and second group of fin 220B is orientated different (such as with 60 °/120 ° angles) according to the direction for entering air-flow.In addition, In some embodiments, heat sink 214 fin orientation depends on the air inlet side or sky that heat sink 214 are located at electronic assembly part 200 Gas outlet side.Therefore, air-flow is assigned to form air flow swirl, and is substantially distributed evenly between and is thermally coupled to heat sink 214 Substrate 206.

In some embodiments, heat sink attached by least one edge of radiator from substrate in multiple radiators 214 extend to the region above the central area of substrate 206, and substantially partly overlaps with substrate.Optionally, this at least one A radiator is not contacted with substrate 206.Optionally, which connects with the electronic component being mounted on substrate 206 Touching, and directly absorption and the heat generated by the electronic component that dissipates.

In some embodiments, multiple radiators include substantial parallel multiple fins 220, and multiple fin 220C are in substrate 206 side extends to the central area of substrate 206.In the specific embodiment shown in Fig. 6 B, substrate 206 is opposite at two Two heat sink 214 are thermally coupled at substrate edges, and each heat sink 214 include multiple radiators, multiple radiator is in substrate 206 side extends to the central area of substrate 206.When two heat sink 214 radiators 220 cross (meet around) exist When the central area of substrate 206, the respective side of substrate 206 is substantially covered by heat sink 214.Unshowned some implementations here In example, in the two sides of substrate 206, the corresponding heat sink 214 radiator 220C at two opposite substrate edges is extended to The central area of substrate 206.When two heat sink 214 radiators 220 meet at the central area of substrate 206, substrate 206 is real It is closed in matter by heat sink 214 radiator.

When apply air-flow with generated in the electronic system 202 that dissipates heat when, the radiator extended in this way increases heat sink 214 corresponding heat dissipation area simultaneously improves heat transfer efficiency.In a particular embodiment, substrate 206 is by common PCB system At, and corresponding electronic system 202 consumes the electric power of 12W.When the gas using 200 lineal foot per minute (linear feet) When stream, the temperature of substrate 206 is reduced about 6 DEG C by the radiator 220 of extension.

In various embodiments of the present invention, when using different manufacturing process (such as die casting, injection-molded, forging and Punching press) manufacture heat sink 214 when, the geometry of a variety of different fins is available.It is such it is heat sink can from have it is different scattered A series of different substrates of heat demand are used together.In some embodiments, the fansink designs of heat sink 214 extension are to enclose Key area around electronic system forms local turbulence air-flow.

Fig. 7 shows the exemplary flow chart of the method 700 in accordance with some embodiments for being used to assemble electronic system 202, Electronic system 202 is configured to the heat generated in dissipation electronic system including heat sink 214, heat sink 214.According to the edge of substrate Geometry provides heat sink accessory structure (such as accessory structure 216) and contact pin (such as card guide tab 218) (702), and Contact pin has the width for the thickness for being substantially equal to substrate, and the card guidance for being configured to extend from accessory structure to shelve with group Structure matches.In some embodiments, card guide structure includes card guide slot, which receives substrate edges and (work as heat It is heavy when being not coupled to substrate edges) or heat sink contact pin (when it is heat sink be couple to substrate edges when).

In some embodiments, accessory structure includes the attached slot of friction lock, and the attached slot of the friction lock is configured to match The geometry of substrate edges, so that substrate edges can be inserted and be locked to the attached slot of friction lock.Optionally, friction lock Fixed attached slot has locking mechanism (such as narrow slot neck), with mechanical interlocking is heat sink and substrate edges.Optionally, using heat conductive adhesive Agent is with glued together by heat sink and substrate edges.In some embodiments, through-hole is drilled out on substrate edges and accessory structure, To allow fastener to be mechanically locked together them.In some cases, it is bored on both accessory structure and substrate edges Heat through-hole out, to form the heat sink heat passage by being assembled in substrate edges.It is discussed above with reference to Fig. 4 A, 4B and 5A-5C More details and embodiment about accessory structure.

Multiple radiators (such as radiator 220) are further arranged (704) on heat sink, to increase heat sink radiating surface Product, with the heat by heat sink absorption that at least partly dissipates.It discusses above with reference to Fig. 6 A and 6B about the more thin of radiator Section and embodiment.

It is heat sink to be mechanically coupled (706) in the edge of substrate to form electronic system, wherein attached knot via accessory structure Structure is mechanically coupled to the edge of substrate and is thermally coupled to the ground plane of substrate, and wherein at least one electronic component is mechanically coupled in On substrate and it is thermally coupled to the ground plane 210 of substrate, and the heat generated by least one electronic component at least partly dissipates To the ground plane of substrate, and further it is dissipated to including the heat sink of accessory structure, contact pin and multiple radiators.Above with reference to figure 2A, 2B and 3A-3C discuss the more details about integral heat sinks and substrate.

In addition, including that heat sink and substrate (such as first substrate) electronic system is integrated (708) in electronic assembly part Group is shelved.In some embodiments, electronic system further includes optionally being couple to corresponding at least one heat sink substrate (example Such as the second substrate), and shelved according to the group of electronic assembly part, first substrate and the second substrate are arranged as being substantially parallel to each other. It discusses above with reference to Fig. 2A, 2B and 3A about the more details being integrated in electronic system in electronic assembly part.

According to various embodiments of the present invention, by force substrate and it is heat sink between thermal convection and by increase ground connection Face is exposed to the effective surface area for the air-flow being guided, and heat sink application effectively reduces substrate (such as routine PCB) Thermal resistance.In many examples, minimum thermal conductivity denominator (the thermal conductivity in electronic system Denominator) related to the face internal thermal resistance of the substrate of electronic system.Therefore, when it is heat sink have be greater than or be equivalent to substrate In corresponding face when thermal conductivity, heat sink is the suitable selection for improving the radiating efficiency of electronic system.

In addition, when it is heat sink be mechanically coupled substrate edges when, it is heat sink effect for extend Protect edge information.For example, The heat sink substrate that can promote electronic system avoids electronic component mounted thereto from directly falling on surface on surface And it is likely to be broken.In addition, heat sink (rather than substrate edges) repeatedly shelved from group card guide structure insertion and Separation, and electrostatic charge is generated heat sink above rather than on substrate.Therefore, the substrate edges of electronic system from due to misuse or It is repeatedly inserted into caused mechanical damage, and prior, when charge is not accumulated on the direct coupled substrate of electronic component, Electronic component is preferably from the influence of electrostatic charge.Particularly, in some embodiments, can by card guide structure without The esd discharge path of management is provided across substrate, and is further reduced the influence to the electronic component on substrate.

In some embodiments, heat sink to be couple to substrate edges rather than individual electronic component.It is such heat sink to be not required to It directly to be contacted as required in many existing electronic systems with the holding of multiple electronic components.Therefore, allow heat sink and right The mismatch of hot coefficient between the electronic component answered.

As described above, in some embodiments, electronic system 202 includes one or more storages in computing device Device module, and in some embodiments, the electronic component 212 of electronic system 202 includes semiconductor memory system or element.Half Conductor memory device includes volatile storage, such as dynamic random access memory (" DRAM ") or static random-access Memory (" SRAM ") device, non-volatile memory device, such as resistive random access memory (" ReRAM "), electricity can Erasable programmable read-only memory (EPROM) (" EEPROM "), flash memories (its subset that can also be considered as EEPROM), ferroelectric random Memory (" FRAM "), magnetic random access memory (" MRAM ") are accessed, and other semiconductors of information can be stored Element.In addition, each type of memory device can have different configurations.For example, flash memory devices can configure It is configured for NAND or NOR.

Memory device can be formed by passive element, active component or both.It is passive partly to lead as non-limiting example Body memory element includes ReRAM device element, in some embodiments includes that resistance switch memory element is (such as anti-molten Silk, phase-change material etc.), and optional guide element (such as diode etc.).It is active as further non-limiting example Semiconductor memery device includes EEPROM and flash memory devices element, in some embodiments includes depositing comprising charge Storage area domain, such as floating gate, conductive nano-particles or charge storage dielectric material, element.

Multiple memorizers element may be configured such that they are connected in series, or each element can independently be accessed. As non-limiting example, NAND device includes memory component (such as the dress comprising charge storage region being connected in series It sets).For example, NAND memory array may be configured such that the array is made of multiple strings (string) of memory, wherein Each string is by sharing single bit line and forming as a group multiple memory components for access.In contrast, memory component can be with It is configured so that each element can independently access, such as NOR memory array.It would be recognized by those skilled in the art that NAND It is exemplary with the configuration of NOR memory, and can otherwise configuration memory element.

It include that semiconductor memery device in single device (such as is located in identical substrate and/or identical Memory component on substrate, or the memory component in single naked core) can with two dimension or three dimensional constitution (such as two dimension (2D) memory array organization or three-dimensional (3D) memory array organization) distribution.

In two dimensional memory structure, semiconductor memery device may be arranged to single plane or single memory device Grade (level).Typically, in two dimensional memory structure, memory component is positioned in the planes (such as in x-z direction plane In), the main surface that the substrate of bearing memory component is parallel on the flat surface extends.Substrate can be chip, in the crystalline substance The material layer of on piece deposit memory element, and/or memory component is formed in the chip or the substrate can be carrier The carrier substrate is attached to memory component after forming memory component by substrate.

Memory component may be arranged to oldered array, such as multirow and/or multiple row, single memory device grade.So And memory component may be arranged to non-rule or nonopiate configuration, as understood by the skilled person.Each memory Element can have two or more electrodes or contact line, including bit line and wordline.

3 D memory array can be organized to be so that memory component occupies multiple planes or multiple Unit Levels, formation three The structure of dimension is (that is, in the x, y and z directions, wherein the direction y is basically perpendicular to the main surface of substrate, and x and z directions are substantially flat Row is in the main surface of substrate).

As non-limiting example, each plane in three-dimensional storage device array structure can be physically located at have it is more In two dimensions (storage level) of a two dimensional memory grade, to form three-dimensional storage device array structure.As another non- Limited example, 3 D memory array can physically be configured to multiple vertical rows (such as in y-direction basically perpendicular to base The column that the main surface of plate extends), there is multiple element in each column, and therefore there are several vertical stacks across memory device The element in folded face.Column may be arranged to two-dimensional arrangement, such as in x-z-plane, thus generate the three dimensional arrangement of memory component. Those skilled in the art will be appreciated that the other configurations of the memory component in three dimensions will also constitute 3 D memory array.

As non-limiting example, in three-dimensional NAND memory array, memory component can be joined together With the NAND string formed in single face, for the ease of discussing, the face is known as horizontal face (such as x-z) sometimes.Alternatively, it stores Device element can be joined together to extend through multiple parallel surfaces.It is contemplated that other three-dimensional configurations, some of NAND string includes the memory component in the single face (sometimes referred to as storage level) of memory component, and other strings are comprising extending The memory component extended through multiple parallel surfaces (sometimes referred to as parallel storage grade).3 D memory array can also be set It is calculated as NOR configuration and ReRAM configuration.

In monolithic (monolithic) 3 D memory array, according to the sequence of manufacturing process, storage unit it is multiple Plane (also referred to as multiple storage levels) be formed on single substrate (such as semiconductor wafer) and/or single substrate in.? In monolithic 3D memory array, the material layer (such as storage level of top) for forming corresponding storage level is located in be formed The top of the material layer of following storage level, but on the same substrate.In some embodiments, monolithic 3D memory array Adjacent storage level optionally share at least one material layer, and in other embodiments, adjacent storage level has The intermediate layer of material separated.

In contrast, two dimensional memory arrays be could be separately formed, and be then integrated in together to form mixing The non-monolithic 3D memory device of mode.For example, by forming 2D storage level on individual substrate, and one above the other The 2D storage level of formation is integrated, to construct the memory stacked.Before being integrated into 3D memory device, each 2D storage The substrate of device grade can be thinned or remove.When individual storage level is formed on individual substrate, the 3D of generation is stored Device array is not monolithic three dimensional memory array.

In addition, can selected from the more than one memory array of 2D memory array and 3D memory array (monolithic or mixing) To be separately formed, and then it is packaged together to form the chip memory device stacked.The chip memory device of stacking Multiple planes or layer including memory device, sometimes referred to as storage level.

Term " three-dimensional storage device " (or 3D memory device) is defined herein as meaning with memory The memory device of multiple layers of element or multiple grades (such as sometimes referred to as multiple storage levels) comprising following any one Kind: some of non-limiting show is hereinbefore described in the memory device with monolithic or non-monolithic 3D memory array Example；Or two or more 2D and/or 3D memory devices, it is packaged together to form the chip memory device stacked, on Some of non-limiting examples have been described in text.

Those skilled in the art will appreciate that invention described and claimed herein be not limited to it is described herein Two and three dimensions demonstrative structure, but covering be adapted for carrying out invention as described herein and such as those skilled in the art institute All relevant memory constructions understood.

It should be understood that although herein various elements may be described using term " first ", " second " etc., these Element should not be limited by these terms.These terms are only used to for element being distinguished from each other.For example, the first contact can be referred to as the Two contacts, similar, the second contact can be referred to as the first contact, this changes the meaning of description, as long as occurred " the One contact " all consistently renames, and " the second contact " that is occurred all consistently renames.First contact and the second contact It is all contact, but they are not identical contacts.

Term as used herein collection is merely to describe specific embodiment, and be not intended to limit claim.Strictly according to the facts It applies used in example, " one " of singular, "one" and "the" are intended to also include plural form, unless context is clearly It points out.It is to be further understood that term term as used herein "and/or" refers to and includes one or more associated listed items Any and all possible combinations of purpose.It is to be further understood that when used in the instructions, term " includes " and/or " packet Containing " institute's features set forth, integer, step, operation, the presence of element, and/or component are defined, but it is not precluded additional one Or a number of other features, integer, step, operation, the presence of component, assembly unit and/or their group.

As it is used herein, depend on context, term " if " can be construed as to imply that " when " or " " or " in response to determining " or " according to determining " or " in response to detection ", the prerequisite of statement is true.Similar, it depends on up and down Text, phrase " if it is decided that [prerequisite of statement is true] " or " if [prerequisite of statement is true] " or " when [statement Prerequisite be true] " can be construed as to imply that " when determining " or " in response to determine " or " according to determining " or " examine When survey " or " in response to detection ", the prerequisite of statement is true.

For task of explanation, specific embodiment is referred to and has described preceding description.However, illustrative discussions above without Meaning exhaustion limits the invention to disclosed precise forms.In view of above teachings, many modifications and variations are possible. Selected and description embodiment is the principle of the present invention and its practical application in order to most preferably explain, to make art technology Personnel most preferably utilize the present invention and the various embodiments with various modifications, to be suitable for contemplated special-purpose.

Claims

1. a kind of electronic system, comprising:

Substrate, including ground plane；

At least one electronic component is mechanically coupled to the substrate and is thermally coupled to the ground plane, so that by described at least one The heat that a electronic component generates at least partly is dissipated to the ground plane of the substrate；And

It is heat sink, it is mechanically coupled to the edge of the substrate, the heat sink ground plane for being thermally coupled to the substrate, at least partly Dissipate the heat that is generated by least one described electronic component on ground, wherein it is described it is heat sink further include slot, be configured to receive the base The edge of plate；And contact pin, it is set as with the slot on the contrary, the contact pin is configured to slide into card guide slot,

It is wherein described heat sink further include:

Multiple radiators are configured to increase the heat sink heat dissipation area, wherein the multiple radiator includes substantially each other First group of parallel fin and second group of fin being substantially parallel to each other, and first group of fin and second group of fin are according to air-flow Direction be orientated it is different, so that substantially homogeneously distribution air-flow is in the substrate.

2. electronic system as described in claim 1, wherein the heat sink ground plane for being configured to be thermally coupled to the substrate, and And it is described it is heat sink further include the contact pin opposite with the slot, and the contact pin has the thickness for being substantially equal to the substrate The width of degree, wherein the contact pin be configured to shelve with group in the card guide slot match.

3. electronic system as described in claim 1, wherein described heat sink further include:

Multiple radiators are configured to increase the heat sink heat dissipation area, wherein at least one in the multiple radiator radiates Device extends to the region above the central area of the substrate from the edge of the heat sink attached substrate, and with the substrate Partly overlap.

4. electronic system as described in claim 1, wherein it is described it is heat sink further include accessory structure, the accessory structure is configured to The marginal mechanical of the substrate is allowed to be locked to the accessory structure.

5. electronic system as described in claim 1, wherein it is described it is heat sink include first heat sink, described first is heat sink via first Accessory structure is mechanically coupled to the first edge of the substrate, the electronic system further include:

Second is heat sink, and the of the substrate opposite with the first edge of the substrate is mechanically coupled to via the second accessory structure Two edges, described second it is heat sink be also thermally coupled to the ground plane, at least partly from the second edge of the substrate dissipate The heat generated by least one described electronic component.

6. electronic system as claimed in claim 5, wherein described first it is heat sink and it is described second it is each of heat sink include corresponding Contact pin, the contact pin has the corresponding width for the thickness for being substantially equal to the substrate, and described first heat sink and described Second heat sink contact pin is configured to extend from first accessory structure and second accessory structure respectively, in the substrate Two edges and group shelve in the card guide slot match.

7. electronic system as described in claim 1, heat sink it is conductively coupled to via static discharge (ESD) protection circuit wherein described The ground plane.

8. electronic system as described in claim 1, wherein applying heat-conductive bonding agent so that the described heat sink and described substrate thermal coupling It closes and is electrically insulated, and the heat-conductive bonding agent has substantially low thermal resistance and substantially high resistance.

9. electronic system as described in claim 1, wherein the substrate includes first substrate, and the electronic system includes more A substrate, the multiple substrate include the first substrate, and each substrate in the subgroup of the multiple substrate is in corresponding base The edge of plate be thermally coupled to it is corresponding heat sink, to dissipate by least one the corresponding electricity being mounted on corresponding substrate The heat that subassembly generates, each substrate of the subgroup of the substrate via it is corresponding it is heat sink on corresponding contact pin be assembled in group It shelves, and substantial parallel orientation.

10. electronic system as described in claim 1 is configured to wherein the slot further includes friction lock slot by the substrate Marginal mechanical be locked in the slot.

11. electronic system as claimed in claim 4, wherein the accessory structure further includes the first heat through-hole, first heat The position of through-hole and the position of the second heat through-hole on the edge match, and according to the heat sink collection with the substrate At first heat through-hole and second heat through-hole alignment are to form the heat passage by the integrated heat sink and substrate.

12. electronic system as described in claim 1, wherein during the group that the electronic system is integrated into electronic assembly part shelves.