FR2560731B1 - MULTI-LAYER PRINTED CARD - Google Patents

MULTI-LAYER PRINTED CARD

Info

Publication number
FR2560731B1
FR2560731B1 FR8403380A FR8403380A FR2560731B1 FR 2560731 B1 FR2560731 B1 FR 2560731B1 FR 8403380 A FR8403380 A FR 8403380A FR 8403380 A FR8403380 A FR 8403380A FR 2560731 B1 FR2560731 B1 FR 2560731B1
Authority
FR
France
Prior art keywords
layer printed
printed card
card
layer
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8403380A
Other languages
French (fr)
Other versions
FR2560731A1 (en
Inventor
Marc Edouard Descarpentries
Yves Le Meur
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Societe Anonyme de Telecommunications SAT
Original Assignee
Societe Anonyme de Telecommunications SAT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Societe Anonyme de Telecommunications SAT filed Critical Societe Anonyme de Telecommunications SAT
Priority to FR8403380A priority Critical patent/FR2560731B1/en
Publication of FR2560731A1 publication Critical patent/FR2560731A1/en
Application granted granted Critical
Publication of FR2560731B1 publication Critical patent/FR2560731B1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09572—Solder filled plated through-hole in the final product
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR8403380A 1984-03-05 1984-03-05 MULTI-LAYER PRINTED CARD Expired FR2560731B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8403380A FR2560731B1 (en) 1984-03-05 1984-03-05 MULTI-LAYER PRINTED CARD

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8403380A FR2560731B1 (en) 1984-03-05 1984-03-05 MULTI-LAYER PRINTED CARD

Publications (2)

Publication Number Publication Date
FR2560731A1 FR2560731A1 (en) 1985-09-06
FR2560731B1 true FR2560731B1 (en) 1989-05-12

Family

ID=9301700

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8403380A Expired FR2560731B1 (en) 1984-03-05 1984-03-05 MULTI-LAYER PRINTED CARD

Country Status (1)

Country Link
FR (1) FR2560731B1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9158349B2 (en) 2013-10-04 2015-10-13 Sandisk Enterprise Ip Llc System and method for heat dissipation
US9313874B2 (en) 2013-06-19 2016-04-12 SMART Storage Systems, Inc. Electronic system with heat extraction and method of manufacture thereof
US9348377B2 (en) 2014-03-14 2016-05-24 Sandisk Enterprise Ip Llc Thermal isolation techniques
US9470720B2 (en) 2013-03-08 2016-10-18 Sandisk Technologies Llc Test system with localized heating and method of manufacture thereof
US9485851B2 (en) 2014-03-14 2016-11-01 Sandisk Technologies Llc Thermal tube assembly structures
US9497889B2 (en) 2014-02-27 2016-11-15 Sandisk Technologies Llc Heat dissipation for substrate assemblies
US9519319B2 (en) 2014-03-14 2016-12-13 Sandisk Technologies Llc Self-supporting thermal tube structure for electronic assemblies
US9549457B2 (en) 2014-02-12 2017-01-17 Sandisk Technologies Llc System and method for redirecting airflow across an electronic assembly

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2620587B1 (en) * 1987-09-16 1993-07-02 Telemecanique Electrique PRINTED CIRCUIT WITH THERMAL DRAIN
DE3813364A1 (en) * 1988-04-21 1989-11-02 Bodenseewerk Geraetetech DEVICE FOR HEAT EXHAUSTING COMPONENTS ON A CIRCUIT BOARD
DE9300865U1 (en) * 1993-01-22 1994-05-26 Siemens Ag One-piece plastic part, especially injection molded part
DE102011077206B4 (en) * 2011-06-08 2019-01-31 Zf Friedrichshafen Ag Printed circuit board and control unit for a transmission of a vehicle with the printed circuit board
US9898056B2 (en) 2013-06-19 2018-02-20 Sandisk Technologies Llc Electronic assembly with thermal channel and method of manufacture thereof
US10013033B2 (en) 2013-06-19 2018-07-03 Sandisk Technologies Llc Electronic assembly with thermal channel and method of manufacture thereof
FR3054292B1 (en) * 2016-07-22 2019-04-05 Valeo Vision LIGHT MODULE OF LAND VEHICLE
US10732893B2 (en) 2017-05-25 2020-08-04 Western Digital Technologies, Inc. Non-volatile memory over fabric controller with memory bypass
US10860508B2 (en) 2017-05-25 2020-12-08 Western Digital Technologies, Inc. Offloaded disaggregated storage architecture
US10635529B2 (en) 2017-05-25 2020-04-28 Western Digital Technologies, Inc. Parity offload for multiple data storage devices
US10642525B2 (en) 2017-12-07 2020-05-05 Western Digital Technologies, Inc. Multiple-stage data lifetime management for storage devices
US11054991B2 (en) 2018-03-21 2021-07-06 Western Digital Technologies, Inc. Data storage system scale-out with local address remapping

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1468552A (en) * 1966-02-18 1967-02-03 Litton Industries Inc Manufacturing process of multi-layer interconnect circuit boards
US3932932A (en) * 1974-09-16 1976-01-20 International Telephone And Telegraph Corporation Method of making multilayer printed circuit board
GB1501500A (en) * 1975-06-20 1978-02-15 Int Computers Ltd Multilayer printed circuit boards
US4298904A (en) * 1979-12-17 1981-11-03 The Boeing Company Electronic conduction cooling clamp
US4410927A (en) * 1982-01-21 1983-10-18 Olin Corporation Casing for an electrical component having improved strength and heat transfer characteristics

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9470720B2 (en) 2013-03-08 2016-10-18 Sandisk Technologies Llc Test system with localized heating and method of manufacture thereof
US9313874B2 (en) 2013-06-19 2016-04-12 SMART Storage Systems, Inc. Electronic system with heat extraction and method of manufacture thereof
US9158349B2 (en) 2013-10-04 2015-10-13 Sandisk Enterprise Ip Llc System and method for heat dissipation
US9549457B2 (en) 2014-02-12 2017-01-17 Sandisk Technologies Llc System and method for redirecting airflow across an electronic assembly
US9497889B2 (en) 2014-02-27 2016-11-15 Sandisk Technologies Llc Heat dissipation for substrate assemblies
US9348377B2 (en) 2014-03-14 2016-05-24 Sandisk Enterprise Ip Llc Thermal isolation techniques
US9485851B2 (en) 2014-03-14 2016-11-01 Sandisk Technologies Llc Thermal tube assembly structures
US9519319B2 (en) 2014-03-14 2016-12-13 Sandisk Technologies Llc Self-supporting thermal tube structure for electronic assemblies

Also Published As

Publication number Publication date
FR2560731A1 (en) 1985-09-06

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Legal Events

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