CN105818542B - Flexible base board with integrated circuit - Google Patents
Flexible base board with integrated circuit Download PDFInfo
- Publication number
- CN105818542B CN105818542B CN201610328667.3A CN201610328667A CN105818542B CN 105818542 B CN105818542 B CN 105818542B CN 201610328667 A CN201610328667 A CN 201610328667A CN 105818542 B CN105818542 B CN 105818542B
- Authority
- CN
- China
- Prior art keywords
- electric connector
- integrated circuit
- connector pad
- circuit
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Accessory Devices And Overall Control Thereof (AREA)
Abstract
The exemplary circuit and method of the flexible base board for being related to liquid ink box are described, including is connected to the integrated circuit of flexible base board, and is arranged on flexible substrates for being connected to the electric connector pad of integrated circuit.
Description
Background technology
This case is application number：201280068664.0 entitled：The division Shen of flexible base board with integrated circuit
Please.
The example of liquid ink box, which is to provide, integrated liquid distribution mold（die）Ink cartridge.Liquid distributes mold and provides
There are nozzle and actuator.Actuator can be signaled by the control circuit in main equipment to be distributed for liquid.When
When print cartridge is installed in printer, electric connector pad array is connected to the corresponding connector pad of printer, so that
It obtains printer controller and is capable of signaling that mold circuit and actuator, and liquid can be according to input digital image data
And it is dispensed on medium.Electric connector pad array and liquid distribution mold are attached to flexible circuit.In the industry, in this way
Flexible circuit can also be referred to as flexible tabs（tab flex）Or tab head assembly（tab head assembly）.It is flexible
Circuit generally includes flexible membrane, mold is distributed for liquid window, liquid distribution mold, electric connector pad and by connector
Pad is connected to the conducting wire of actuator.It is to have challenge that other function, which is integrated in flexible circuit, in a manner of cost-efficient
Property.
Description of the drawings
For illustrative purposes, certain examples of the introduction construction according to the disclosure are described with reference to the drawings, wherein：
Fig. 1 illustrates the exemplary schematic diagrames of flexible circuit；
Fig. 2 illustrates the exemplary schematic diagram of the cross-sectional side view of liquid ink box；
Fig. 3 illustrates the schematic diagram of the exemplary front view of the liquid ink box of Fig. 2；
Fig. 4 illustrates the schematic diagram of another exemplary top view of flexible circuit；
Fig. 5 illustrates the exemplary schematic diagram of the flexible circuit cross-sectional side view of Fig. 4；
Fig. 6 illustrates the schematic diagram of an exemplary part for the flexible circuit of Fig. 4；
Fig. 7 illustrates the exemplary block diagram of secure microcontroller；
Fig. 8 illustrates the exemplary flow chart of the method for manufacture flexible circuit；
Fig. 9 illustrates another exemplary flow chart of the method for manufacture flexible circuit；
Figure 10 illustrates the flow chart of the other exemplary part of the method for manufacture flexible circuit.
Specific implementation mode
In the following detailed description with reference to attached drawing.It describes be considered schematical with the example in attached drawing,
And it is not construed as the limitation to described specific example or element.By modification, combination or certain members can be changed
Part obtains multiple examples from following description and/or attached drawing.Furthermore, it is to be appreciated that those of ordinary skill in the art can
To obtain the example not described on literal or element from description and attached drawing.
Fig. 1 illustrates the exemplary schematic diagrames of flexible circuit 1.For example, flexible circuit 1 is arranged to applied to liquid ink box
80（Fig. 2,3）.For example, flexible base board 2 includes individually integrating substrate（For example, single flexible film）.For example, flexible base board 2 be from
Single continuous flexible film is cut out next.Flexible circuit 1 further includes the first integrated circuit 3 for being attached to flexible base board 2.For example,
First integrated circuit 3 includes memory 4 and processing unit 5.Flexible circuit 1 includes electric connector pad array 6, is arranged to
It receives and carrys out autonomous device（Such as, printer or other fluid distribution equipments）Signal.For example, such as web（Network）Clothes
The miscellaneous equipment of business device or mobile communication equipment etc can be led to by printer or directly with the first integrated circuit 3
Letter.
Example electric connector pad array 6 is arranged to constant pattern.For example, electric connector pad array 6 includes along flat
Line is placed on several connector pads on flexible base board 2 regularly, as shown in fig. 1.For example, electric connector pad battle array
Row 6 are the same as equal or similar to the known typical electrical connector pad 6 for example from existing liquid ink box connector pad array.Electricity
Connector pad array 6 includes being connected to the first electric connector pad 7 of the first integrated circuit 3 and for being connected to liquid distribution
Second electric connector pad 8 of mold 9.For example, the first electric connector pad 7 is connected to the first conducting wire 10, the first conducting wire 10 connects
It is connected to the first integrated circuit 3.For example, the second electric connector pad 8 is connected to the second conducting wire 11 for being connected to liquid distribution
Mold 9.For example, the first conducting wire 10 and the second conducting wire 11 are respectively connected to the first integrated circuit 3 to landing pad and liquid distributes
Mold 9.In this example, landing pad is can be engaged by group（gang bonding）Or other joining techniques are connected to respectively
The conductive contact of a lead（joint）.For example, forming individual connector, Huo Zhejie in landing pad or connector pad 7,8
It closes pad or connector pad 7,8 serves as connector.
For example, liquid distribution mold 9 includes at least one of actuator, nozzle, slot and second integrated circuit.Second
Electric connector pad 8 is connected in these actuators, nozzle, slot and the second integrated circuit at least by the second conducting wire 11
One.
In this example, the flexible circuit 1 of Fig. 1 allows the group of these features on flexible base board 2 to engage.For example, electric connector
Pad 7,8 and conducting wire 10,11 are engaged by group to be connected.For example, the first integrated circuit 3 and liquid distribution mold 9 are connect by group
Conjunction is respectively connected to corresponding conducting wire 10,11.For example, integrated circuit 3 can be with 9 profit of electric connector pad array 6 and mold
It is bonded to identical group engagement tool, in identical group's bonded stage and with identical group's engaging process step by group soft
On property substrate 2, to allow to be manufactured using relatively cost-efficient tool and process.
Fig. 2 and Fig. 3 respectively illustrates the cross-sectional side view of liquid ink box 80 and the schematic diagram of front view.Fig. 2 indicates Fig. 3
Cross-sectional side view.The reason of in order to illustrate, the size in Fig. 2 and Fig. 3 are exaggerated strongly.The print cartridge 80 of Fig. 2 and Fig. 3
Including shell 23 and the flexible circuit 1 for being attached to shell 23.In figure 2 and figure 3, flexible circuit 1 is mounted to print cartridge 80, still
It should be understood that flexible circuit 1 itself is product in this example, for example, the intermediate products separated with liquid ink box 80.Shell 23
Including liquid storage device 12.Shell 23 is including single mold and for being open（tap）Or shut the lid or shell of reservoir 12.
Flexible circuit 1 includes flexible base board 2 and is connected to its first integrated circuit 3 and liquid distribution mold 9.For example, liquid ink box
80（Fig. 2,3）It is the ink cartridge with integrated print head.For example, liquid distribution mold 9 is printhead die.For example, actuator
It is at least one of the thermal resistor of ink-jet or piezoresistor.
Fig. 2 and example shown in Fig. 3 include single-chamber room reservoir 12.In another example, liquid ink box 80 includes using
In different liquids（For example, the ink of different colours）, the multiple reservoir cavities separated by inner wall.For example, in reservoir 12
It is middle that at least one capillary medium 15 and at least one standpipe 16 are provided（For example, each one capillary medium 15 of chamber and vertical
Pipe 16）, for providing liquid to liquid distribution mold 9.In the example shown, liquid ink box 80 include can by advance at
Bed 22 or frame of the type in shell 23, for receiving and liquid distribution mold 9 being connected to shell 23.In this example, liquid
Distribution mold 9 is connected to flexible base board 2 before being attached to shell 23.
It includes nozzle 13 and actuator 14 that liquid, which distributes mold 9,.For example, actuator 14 includes for spraying liquid from chamber
The thermal resistor or piezoresistor of body.It provides and is connected to（E.g., including in）Liquid distributes the second integrated electricity of mold 9
Road 17.In this example, the second integrated circuit 17 includes second memory 18.In this example, the second integrated circuit 17 includes at least
One transistor 20, for example, for promoting the triggering to actuator 14.For example, liquid distribution mold 9 includes for connecting difference
The conductor circuit 21 of circuit.For example, actuator 14 is connected to the second integrated circuit 17 and is connected to electrical connection by conductor circuit 21
Device pad array 6, for example, for promoting the triggering by main equipment controller to actuator 14.In the example shown, the second collection
It is disposed in away from 3 a certain distance of the first integrated circuit at circuit 17.For example, the second integrated circuit 17 is disposed in liquid distribution
In mold 9 or close to liquid distribution mold 9, close to the bottom 25 of liquid ink box 80, and the first integrated circuit 3 is arranged to and leans on
Nearly electric connector pad array 6, for example, at 26 before the liquid ink box 80.For example, the second integrated circuit 17 is integrated in liquid
Distribute mold 9.For example, the second integrated circuit 17 is fabricated with JetMos integrated circuit fabrication process, wherein including transistor
20 and the mold 9 of memory 18 can also be manufactured.For example, memory 18 includes read-only memory（ROM）, a series of links and
Erasable Programmable Read Only Memory EPROM（EPROM）At least one of, for example, with about 200 or less, about 400 with
It is lower or about 2048 or less, or more finite memory.
For example, print cartridge ID 28 is stored on the memory 18 of the second integrated circuit 17.For example, print cartridge ID 28 includes closing
In the part of the unique sequence numbers of print cartridge 80.For example, print cartridge ID 28 includes other ID with such as sequence number etc corresponding
Code.For example, print cartridge ID 28 include hash, encrypted code or such as sequence number etc other ID through obscuring
（obfuscated）Version.For example, the print cartridge ID 28 being stored on the second integrated circuit 17 uses industrial standard safe coding side
Method is protected.For example, main equipment controller is configured to decoding or handles print cartridge ID 28 in other ways for verification.
For example, authentication codes 29 are stored on the memory 4 of the first integrated circuit 3.For example, authentication codes 29 and storage
The print cartridge ID 28 on the second integrated circuit 17 is corresponding, so that the ID being stored on the second integrated circuit 17 and depositing
The authentication codes 29 stored up on the first integrated circuit 3 can for example be matched by main equipment controller.In one example, black
Box ID 28 and authentication codes 29 are equivalent and can directly match.In another example, print cartridge ID 28 and certification
One or both needs in code 29 are handled before it can match print cartridge ID 28 and authentication codes 29.For example, certification generation
Code 29 is protected, for example, being encrypted.For example, authentication codes 29 are privacy keys.For example, authentication codes 29 include hash, encryption
The version through obscuring of the other ID of code or print cartridge ID 28 or such as sequence number etc, to allow the matching.Example
Such as, main equipment controller is configured to decoding or handles authentication codes 29 in other ways for matching with print cartridge ID 28.
Instead of or be additional to authentication codes, the first integrated circuit 3 can include the other privacy key for certification.
In this example, the second integrated circuit 17 includes the hash of print cartridge ID 28.For example, the first integrated circuit 3 includes certification
The hash of code 29.For example, the signature of password is applied to utilize asymmetric arithmetic（For example, using private cipher key）Hash in
One or both.For example, private cipher key is arranged according at least one of these following technologies：RSA（Rivest,
Shamir,Adleman）,ECDSA（Elliptic curve digital signature algorithm）And DSA（Digital Signature Algorithm）.For example, signature is deposited
Storage is in anti-distort memory, for example, on the memory of the first integrated circuit 3.For example, main equipment can be by reading number
Signature, print cartridge ID 28 and authentication codes 29 are come to verify the authenticity of print cartridge 80 using public keys known to main equipment
Verify them.
As it can be seen that in this example, the first and second electric connector pads 7,8 form single rule schema such as from Fig. 2 and Fig. 3
The part of case connector pad array 6.For example, the first and second electric connector pads 7,8 be arranged to along for example embark on journey or at
The straight parallel lines 27 of row.In unshowned example, line 27 has the inclined fixed of the longitudinal edge relative to flexible base board 2
To.First and second electric connector pads 7,8 can be arranged to along identical line 27.In the example shown, electric connector
Pad array 6 includes two parallel lines 27 of electric connector pad 7,8, and every line all includes the first and second electric connector pads
7, both 8.One example of flexible circuit 1 include be regularly arranged in it is in electric connector pad array 6, be connected to first
At least four first electric connector pads 7 of integrated circuit 3, such as including：Grounding connection, power supply connection（Vcc）, data connection
It is connected with clock circuit.
For example, the first integrated circuit 3 and the second integrated circuit 17 share at least one unit connector pad A, B.At this
In open, unit connector pad A, B can be defined as both the first connector pad 7 and the second electric connector pad 8
Combination.Unit connector pad A, B are electrically connected to the first and second conducting wires 10,11.For example, when being connected to main equipment, until
Few unit connector pad A, a B are configured for the ground connection of the first and second integrated circuits 3,17.For example, when being connected
When to main equipment, at least one unit connector pad A, B are configured for the power supply of the first and second integrated circuits 3,17
（Vcc）.
For example, the constant pattern with electric connector pad 7,8 can allow for cost-effectively manufacturing flexible electrical relatively
Road 1 and corresponding main equipment connector.In this example, the first integrated circuit 3 is not required applied to flexible circuit 1 to existing
Flexible circuit, which manufactures, modifies or only carries out very few modifications.
Figure 4 and 5 illustrate the other example of flexible circuit 1.Exemplary Flexible circuit 1 includes that liquid distributes mold 9.Example
Flexible circuit 1 includes flexible base board 2 and the first integrated circuit 3.Flexible base board 2 includes band or film and flexible wire 10,11.Example
Such as, flexible base board 2 is made of the strong polymer thin film of such as polyimides etc.Thin wire 10,11 is for example to be imaged by photoetching process
's.In this example, single flexible substrate 2 includes at least one first window 30 and at least one second window 31.For example, first
Integrated circuit 3 is connected to flexible base board 2, close to the edge of first window 30.For example, liquid distributes mold 9 via seam welding
Disk and/or other connectors are connected to flexible base board 2, the edge close to the second window 31.For example, liquid distribution mold 9 and/or
First integrated circuit 3 is engaged or wire bonding via landing pad by group（wire bond）To flexible base board 2.For example, integrated electricity
Road 3 is bonded to the first conducting wire 10 via the first landing pad by group, and liquid distributes mold 9 via the second landing pad by group
It is bonded to the second conducting wire 11.For example, the first integrated circuit 3 and liquid distribution mold 9 are connected to the same side of flexible base board 2.Example
Such as, the first integrated circuit 3 and liquid distribution mold 9 are bonded to identical group's bonded stage in a process steps by group.Another
In one example, liquid distribution mold 9 and the first integrated circuit 3 are engaged in different process steps, wherein for example, soft
Property substrate 2 is relocated or is moved to another tool between these process steps.
For example, encapsulated layer 32 encapsulates the first integrated circuit 3.For example, encapsulated layer 33 encapsulates electric connector pad array 6.Institute
The example package layer 33 for the electric connector pad array 6 shown also covers the first integrated circuit 3.Shown in example package layer 33 define
It is directed to a continuous encapsulated layer 33 of connector pad array 6 and the first integrated circuit 3.In another example, Duo Gefeng
Dress island 32 can be applied to be individually encapsulated the first integrated circuit 3 and electric connector pad array 6.For example, encapsulated layer 32,33 is
Made of identical material, and it is applied to the same side of flexible base board 2.For example, in identical process steps
Encapsulated layer 32,33 is provided.For example, encapsulated layer 32,33 is configured to protect each encapsulated circuit 6,3 from ink or other liquid
It influences.In this example, encapsulated layer 32,33 includes epoxy resin.
The example electric connector pad array 6 of Fig. 4 illustrates the first and second electrical connections along two couples of parallel lines 27A, 27B
Device pad 7,8.For example, the conventional flex circuits of the layout of electric connector pad array 6 similar or identical to liquid ink box
Typical electrical connector pad array.For example, every line 27A, 27B have the tilt alpha of the side wall relative to flexible base board 2, β, example
Such as, mold 9 is distributed to promote conducting wire 10,11 being arranged towards the first integrated circuit 3 and liquid.It can such as from Fig. 4
Go out, the line 27A of left side a pair of connectors pad subarray has the first tilt alpha, and right side a pair of connectors pad subarray
Line 27B have second tilt β.For example, tilt alpha, β are equal but in a reverse direction.
For example, the first integrated circuit 3 is disposed between electric connector pad array 6 and the side of single flexible substrate 2.
For example, this promotes the first integrated circuit 3 being located in liquid ink box 80（Fig. 2）Front 26 on.For example, this promotion is easy to encapsulate
Electric connector pad array 6 and the first integrated circuit 3.For example, electric connector pad array 6 is symmetrical, have by being electrically connected
Connect the center of device pad array 6（For example, between several pad subarrays to electric connector）Symmetry axis S.For example, symmetry axis S
It is disposed adjacent to the center line C of flexible base board 2.Center line C extends through the center of flexible base board 2, is parallel to flexible base board 2
Longitudinal side.In this example, the width W of flexible base board 2 is more than the traditional type flexible circuit 1 of similar liquid ink box 80
Conventional width, for example, the size of the sprocket wheel of a flexible membrane is wider.For example, the symmetry axis S of electric connector pad array 6 and soft
The distance between the center line C of property substrate 2 D are approximately the pitch of chain wheel of flexible membrane（pitch）Half or flexible membrane
More times of the half of pitch of chain wheel.For example, the distance between center line C and symmetry axis S D are approximately the one of pitch of chain wheel
Times, half times, two times, two but also half times, a three times etc. not only.
Fig. 6 illustrates the top view of the exemplary schematic diagram of the first integrated circuit 3.For example, the first integrated circuit 3 is safety
Microcontroller.In the example shown, the first integrated circuit 3 includes master integrated circuit 40.Further it is provided that by master integrated circuit
40 are connected at least four landing pads 41 of conducting wire 10.Landing pad 41 promotes integrated circuit 40 being bonded to the first conducting wire
10.For example, the first integrated circuit 3, landing pad 41 and the first conducting wire 10 are bonded together by group.For example, in group's zygophase,
Connector is formed between conducting wire 10 and landing pad 41.For example, master integrated circuit 40 and landing pad 41 are disposed in relatively just
On property substrate 42.For example, encapsulated layer 32 at least encapsulates master integrated circuit 40 and landing pad 41.In this example, at least one or
At least two landing pads 41 are connected to combined electric connector pad A, B（Fig. 2）.
In this example, the first integrated circuit 3 includes secure microcontroller 50.Fig. 7 illustrates showing for secure microcontroller 50
The schematic diagram of example.For example, secure microcontroller 50 includes the memory component for being connected to internal bus 51, such as, RAM 52,
EEPROM 53, user ROM 54 and ST ROM（Guide software）At least one of 55.For example, secure microcontroller 50 wraps
Include the EDES accelerators 56 for being connected to internal bus 51.For example, ST ROM fire walls 57 are provided at ST ROM 55 and inside is total
Between line 51.For example, secure microcontroller 50 includes the processing module communicated with internal bus 51, and such as, cyclic redundancy
Verification（CRC）It is module 60, clock generator block 61, double 8 bit timing device 62, safety monitoring and control circuit 63, truly random
Number 64,8/16 central processing unit cores 65 of generator and the Asynchronous Receiver Transmitter supported for high-speed serial data
（IART）At least one of 66.For example, the other circuit on secure microcontroller 50 includes clock circuit 70（CLK）, again
Circuits 71, power supply or Vcc circuits 72, earthed circuit 73 and input/output circuitry 74.In this example, it Vcc circuits 72 and connects
Ground circuit 73 is connected to combined electric connector pad A, B by conducting wire 10, wherein combined electric connector pad A, B are also connected with
To the second integrated circuit 17.For example, other circuits（Such as, clock circuit 70 or input/output circuitry 74）It is to safe micro-control
Device 50 processed is unique, and not shared with liquid distribution mold 9.
For example, instead of or be additional to secure microcontroller, the first integrated circuit 3 further includes another safe storage.
For example, secure microcontroller 50 is configured to promote safety certification.For example, in addition to authentication codes 29, safety is micro-
Controller 50 also stores such as other data including at least one of the following：Ink level, with return it is relevant
Data and coupons or the relevant data of discount coupon, station address, image data, one group of instruction etc. for printer.Safety
Microcontroller 50 can distribute mold 9 with liquid and be bonded to flexible base board 2 by common group together.
Fig. 8 illustrates the example of the method for the flexible circuit 1 of manufacture liquid distribution print cartridge 80.Exemplary method is included in flexibility
The constant array of first and second electric connector pads 7,8 is provided on substrate 2（Frame 100）.For example, method includes being integrated first
Circuit 3 is connected to flexible base board 2（Frame 110）.For example, the first integrated circuit 3 is for example via the first engagement provided on a substrate 2
Pad 41 and engaged（For example, group engages）To flexible base board 2.First landing pad 41 is connected to the first conducting wire 10.Example side
Method includes by the first integrated circuit 3（Or first landing pad 41）It is connected to the first electric connector pad 7 of array 6（Frame 120）.
For example, the first integrated circuit 3 includes the secure microcontroller 50 for being configured to promote the safety certification of liquid ink box 80.Example side
Method includes that liquid distribution mold 9 is connected to flexible base board 2 at away from 3 a certain distance of the first integrated circuit（Frame 130）.For example,
Liquid distribution mold 9 is for example for example walked via the landing pad 41 provided on a substrate 2 and at one with integrated circuit 3 together
It is engaged in rapid（For example, group engages）To flexible base board 2.Second landing pad is connected to the second conducting wire 11.For example, method packet
It includes and the second electric connector pad 8 is connected to liquid distribution mold 9, for example, being connected to its second integrated circuit 17（Frame 140）.
For example, method includes that obtained flexible circuit 1 is attached to liquid ink box 80（Frame 150）, so that liquid distributes 9 liquid of mold
It is connected to body liquid storage device 12 and electric connector pad array 6 extends on front 26.
Fig. 9 illustrates another example of the method for the flexible circuit 1 of manufacture liquid distribution print cartridge 80.For example, method packet
It includes and flexible base board 2 is provided, flexible base board 2 is included at least for the first window 30 of the first integrated circuit 3 and distributed for liquid
Second window 31 of mold 9 and the conducting wire 10,11 of pre-arranged（Frame 200）.In this example, flexible base board 2 is advance by third party
Manufacture.For example, the size of the circuit of flexible circuit 1 and position are scheduled, and size and the position of flexible base board 2 is determined
It sets.For example, conducting wire 10,11 is arranged for mold 9 and the first integrated circuit 3 to be connected to corresponding electric connector pad in advance
7、8。
For example, the exemplary method of Fig. 9 includes positioning mold 9 and the first integrated circuit 3 relative to corresponding window 30,31
（Frame 210）, and mold 9 and the first integrated circuit 3 are for example connected to flexible base board 2（Frame 220）.For example, wire bonding and
One or a combination set of group's engagement be used to mold 9 and the first integrated circuit 3 being connected to flexible base board 2.For example, this method includes
First integrated circuit 3, mold 9 and the first and second electric connector pads 7,8 groups are bonded to corresponding conducting wire 10,11（Frame
230）.For example, group engage tool be used for by each connector pad 7,8 and landing pad 41 groups be bonded to conducting wire 10,
11.Multiple electrical contacts are made in group's engaging process permission in a process steps.Such as it is flexible not moved relative to bonded stage
In the case of substrate 2, such as using identical encapsulating material, such as using same tool, and for example walked in identical process
In rapid, electric connector pad 7,8 and the first integrated circuit 3 are packaged（Frame 240）.In another example, mold 9 and
One integrated circuit 3 is engaged in different process steps, for example, in one of mold 9 or the first integrated circuit 3 by engagement
Afterwards, flexible base board 2 is reset（reposition）.For example, different engagement tools or bonded stage be used to collect mold 9 and first
It is engaged at circuit 3.
Figure 10 illustrates another example of the method for the flexible circuit 1 of manufacture liquid distribution print cartridge 80.For example, method packet
It includes and writes on print cartridge ID 28 on second integrated circuit 17（Frame 250）.For example, this method includes will be corresponding with print cartridge ID 28
Authentication codes 29 write on the first integrated circuit 3（Frame 260）.For example, this method includes that each flexible circuit 1 or each liquid is written
The different print cartridge ID 28 of body print cartridge 80 and different correspondence authentication codes 29（Frame 270）, so that each liquid ink box 80 has
Unique ID 28 and authentication codes 29.For example, the step of back, provides the protected and unique certification of each liquid ink box 80
Code 29.
For example, some features disclosed in this specification provide safely certification flexible circuit 1 or liquid ink box 80
And allow the ability of its integrated and cost-efficient manufacture simultaneously.For example, integrated circuit 3 is configured to that safety is promoted to recognize
Card.In different examples, different main equipments（For example, printer, smart phone, web server, any computing device etc.）It can
Certification flexible circuit 1 or liquid ink box 80.In this example, main equipment is docked by printer with flexible circuit 1.In this example,
First integrated circuit 3 is configured to store other data, such as, the relevant code of liquid, color adjustment information, coupons phase
Close code, advertisement, discount coupon etc..For example, only after establishing safety certification by the first integrated circuit 3, main equipment
It could access, change or handle such other data.For example, the first integrated circuit 3 be configured to only establish certification it
Other data above-mentioned are provided afterwards or the access to other data above-mentioned is provided.In this example, liquid distributes mould
9 needs of tool are seldom or need not be relative to the adaptation of existing integrated print head.In another example, it flexible base board 2 and is electrically connected
Connect device pad array 6 need seldom or need not be relative to the existing electric connector pad array of integrated print head liquid ink box
Adaptation.It is led for example, integrated circuit 3 is bonded to by group at away from liquid distribution 9 a certain distance of mold with liquid distribution mold 9 simultaneously
Simultaneously group is bonded to flexible base board 2 to line 10.
For example, the flexibility of flexible circuit 1 refers to flexible base board 2, and some circuits on flexible base board 2 itself can be
Relative stiffness.In fact, in this example, flexible circuit 1 can be relative stiffness due to the circuit on flexible base board 2.
For example, in addition to group engages or group is replaced to engage, additionally it is possible to wire bonding or other suitable welding methods are used, for example, packet
It includes using heat treatment, electric energy or chemical composition.
In one example, liquid ink box 80 is adapted to be connected to main equipment.In another example, liquid ink box 80
It is the part of hand-held liquid distributing equipment.In still another example, fluid distribution equipment or main equipment are printer or drop
Locking equipment or another type of high-precision liquid distributing equipment.
Above description is not intended to exhausted or the disclosure is limited to disclosed example.Ordinary skill people
Member is by studying attached drawing, open and claim it will be appreciated that and realizing to disclosed exemplary other changes.Indefinite article
"a" or "an" is not excluded for multiple, and is not excluded for the possibility with more or less elements to the reference of the element of some quantity
Property.Several functions recorded in the disclosure may be implemented in individual unit, and vice versa, and a list may be implemented in several items
The function of member.Without departing from the scope of the disclosure, a variety of replacements, equivalent, change and combination can be made.
Claims (16)
1. a kind of flexible circuit for being attached to liquid ink box, including
Single flexible substrate,
It is connected to the first integrated circuit of single flexible substrate, and
Electric connector pad array is disposed on single flexible substrate with constant pattern for being connected to master controller,
The electric connector pad array includes：It is connected to the first electric connector pad of the first integrated circuit and for being connected to liquid
The second electric connector pad of mold is distributed,
Wherein the first electric connector pad and the second electric connector pad arranged along the same line,
At least four first electric connector pads are regularly arranged in electric connector pad array, and it is integrated that they are connected to first
Circuit, including the connection of grounding connection, power supply, data connection are connected with clock circuit；And
At least one unit connector pad of the wherein described first electric connector pad and the second electric connector pad is configured
To distribute the ground connection of the second integrated circuit at mold as the first integrated circuit and for liquid, and/or when being connected to master
When equipment, at least one unit connector pad of the first electric connector pad and the second electric connector pad is configured to
Power supply as the first integrated circuit and the second integrated circuit.
2. flexible circuit as described in claim 1, wherein the first integrated circuit is engaged or lead via landing pad by group
It is joined to flexible base board.
3. flexible circuit as claimed in claim 1 or 2, wherein encapsulated layer encapsulate the first integrated circuit.
4. flexible circuit as claimed in claim 1 or 2, wherein encapsulated layer encapsulate electric connector pad array.
5. flexible circuit as claimed in claim 1 or 2, wherein flexible base board are to be cut out to come from single continuous flexible film.
6. flexible circuit as claimed in claim 1 or 2, wherein the first integrated circuit has memory, on the memory
Authentication storage code.
7. flexible circuit as claimed in claim 6, wherein the authentication codes are protected or are encrypted.
8. flexible circuit as claimed in claim 1 or 2, wherein the first electric connector pad and the second electric connector pad
It is disposed on long straight parallel lines.
9. flexible circuit as claimed in claim 8, wherein the line has the longitudinal edge relative to flexible base board inclined
Orientation.
10. flexible circuit as claimed in claim 1 or 2, wherein the first electric connector pad and the second electric connector pad quilt
It is arranged along two pairs of parallel lines.
11. flexible circuit as claimed in claim 8, wherein depending on the symmetry axis relative to the electric connector pad array
The line of left side a pair of connectors pad subarray of position has the first tilt alpha, and relative to the electric connector pad array
Symmetry axis and the line of right side a pair of connectors pad subarray that positions has second to tilt β.
12. flexible circuit as claimed in claim 1 or 2, wherein the first integrated circuit includes master integrated circuit, and at least four
A landing pad is provided, for master integrated circuit to be connected to conducting wire.
13. flexible circuit as claimed in claim 3, the wherein encapsulated layer of electric connector pad array also cover the first integrated electricity
Road.
14. flexible circuit as claimed in claim 1 or 2, wherein the first electric connector pad is connected to the first conducting wire, institute
It states the first conducting wire and is connected to the first integrated circuit, storage can be by master controller wherein first integrated circuit has on it
The memory of the authentication codes of processing, and the wherein described second electric connector pad is connected to the second conducting wire, and described second leads
Line is for being connected to the liquid distribution mold, and the wherein described electric connector pad array is used to receive from master controller and believe
Number.
15. a kind of printer, including the flexible circuit described in master controller and claim 6, wherein the master controller by with
The processing authentication codes are set to be matched with print cartridge ID, wherein the authentication codes include the print cartridge ID or another ID
Or the hash of sequence number, encrypted code or version is obscured, to consider the matching.
16. a kind of liquid ink box, including:
Liquid storage device,
Liquid distributes mold, and
According to the flexible circuit described in one or more in claim 1-14.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610328667.3A CN105818542B (en) | 2012-04-30 | 2012-04-30 | Flexible base board with integrated circuit |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610328667.3A CN105818542B (en) | 2012-04-30 | 2012-04-30 | Flexible base board with integrated circuit |
| CN201280068664.0A CN104066585B (en) | 2012-04-30 | 2012-04-30 | With the flexible base board of unicircuit |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280068664.0A Division CN104066585B (en) | 2012-04-30 | 2012-04-30 | With the flexible base board of unicircuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105818542A CN105818542A (en) | 2016-08-03 |
| CN105818542B true CN105818542B (en) | 2018-10-30 |
Family
ID=56529815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610328667.3A Active CN105818542B (en) | 2012-04-30 | 2012-04-30 | Flexible base board with integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105818542B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7427367B2 (en) * | 2019-04-26 | 2024-02-05 | キヤノン株式会社 | Liquid ejection head and its manufacturing method |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5610635A (en) * | 1994-08-09 | 1997-03-11 | Encad, Inc. | Printer ink cartridge with memory storage capacity |
| US6053598A (en) * | 1995-04-13 | 2000-04-25 | Pitney Bowes Inc. | Multiple print head packaging for ink jet printer |
| US6174046B1 (en) * | 1994-10-06 | 2001-01-16 | Hewlett-Packard Company | Reliable contact pad arrangement on plastic print cartridge |
| CN1529657A (en) * | 2001-08-20 | 2004-09-15 | 明基电通股份有限公司 | Ink box with asymmetrical-arragned contact point |
| CN1539644A (en) * | 1998-11-02 | 2004-10-27 | ������������ʽ���� | Ink cartridge and printer using same |
| CN1704243A (en) * | 2004-06-02 | 2005-12-07 | 佳能株式会社 | Liquid ejecting head and liquid ejecting apparatus usable therewith |
| US7025440B2 (en) * | 2003-10-15 | 2006-04-11 | Lexmark International, Inc. | Low profile ink jet cartridge assembly |
| CN101365591A (en) * | 2005-10-06 | 2009-02-11 | Zih公司 | Memory system and method for consumables of a printer |
| CN104066585A (en) * | 2012-04-30 | 2014-09-24 | 惠普发展公司，有限责任合伙企业 | Flexible substrate with integrated circuit |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6227643B1 (en) * | 1997-05-20 | 2001-05-08 | Encad, Inc. | Intelligent printer components and printing system |
| FR2852886A1 (en) * | 2003-03-25 | 2004-10-01 | Secap | SECURE PRINT CARTRIDGE |
| KR100612261B1 (en) * | 2004-12-10 | 2006-08-14 | 삼성전자주식회사 | Inkjet cartridge and fabrication method thereof |
-
2012
- 2012-04-30 CN CN201610328667.3A patent/CN105818542B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5610635A (en) * | 1994-08-09 | 1997-03-11 | Encad, Inc. | Printer ink cartridge with memory storage capacity |
| US6174046B1 (en) * | 1994-10-06 | 2001-01-16 | Hewlett-Packard Company | Reliable contact pad arrangement on plastic print cartridge |
| US6053598A (en) * | 1995-04-13 | 2000-04-25 | Pitney Bowes Inc. | Multiple print head packaging for ink jet printer |
| CN1539644A (en) * | 1998-11-02 | 2004-10-27 | ������������ʽ���� | Ink cartridge and printer using same |
| CN1529657A (en) * | 2001-08-20 | 2004-09-15 | 明基电通股份有限公司 | Ink box with asymmetrical-arragned contact point |
| US7025440B2 (en) * | 2003-10-15 | 2006-04-11 | Lexmark International, Inc. | Low profile ink jet cartridge assembly |
| CN1704243A (en) * | 2004-06-02 | 2005-12-07 | 佳能株式会社 | Liquid ejecting head and liquid ejecting apparatus usable therewith |
| CN101365591A (en) * | 2005-10-06 | 2009-02-11 | Zih公司 | Memory system and method for consumables of a printer |
| CN104066585A (en) * | 2012-04-30 | 2014-09-24 | 惠普发展公司，有限责任合伙企业 | Flexible substrate with integrated circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105818542A (en) | 2016-08-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10086620B2 (en) | Flexible substrate with integrated circuit | |
| CN104066585B (en) | With the flexible base board of unicircuit | |
| TWI609796B (en) | Molded printhead | |
| WO2007002861A3 (en) | Smart layered heater surfaces | |
| US20190061349A1 (en) | Droplet deposition head and manifold components therefor | |
| MX2009011225A (en) | Electric battery comprising thermal packaging modules encapsulated in a structural matrix. | |
| TW201004516A (en) | Circuit board structure | |
| KR20200067902A (en) | Semiconductor device assembly comprising multiple semiconductor die tiling stacks | |
| CN105818542B (en) | Flexible base board with integrated circuit | |
| US10029467B2 (en) | Molded printhead | |
| EP3373511A1 (en) | Method and apparatus for binding stacked die using a physically unclonable function | |
| ES2636746T3 (en) | Procedure to authenticate a portable data storage medium | |
| CN103874245A (en) | Bonding pad structure of ceramic heating piece with temperature control | |
| KR102043102B1 (en) | Digital credit card with improved durability | |
| CN102088834B (en) | Heat dissipation device for electronic circuit module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |