CN105818542A - Flexible substrate with integrated circuit - Google Patents
Flexible substrate with integrated circuit Download PDFInfo
- Publication number
- CN105818542A CN105818542A CN201610328667.3A CN201610328667A CN105818542A CN 105818542 A CN105818542 A CN 105818542A CN 201610328667 A CN201610328667 A CN 201610328667A CN 105818542 A CN105818542 A CN 105818542A
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- CN
- China
- Prior art keywords
- integrated circuit
- electric connector
- connector pad
- flexible
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Accessory Devices And Overall Control Thereof (AREA)
Abstract
The invention relates to a sample circuit and a method of a flexible substrate of a liquid ink box. A flexible circuit comprises an integrated circuit which is connected to the flexible substrate, and an electric connector bonding pad which is arranged on the flexible substrate and is connected to the integrated circuit.
Description
Background technology
This case is application number:201280068664.0, invention entitled:Flexible base board with integrated circuitDivisional application.
The example of liquid ink box is to provide the ink cartridge of integrated liquid distribution mould (die).Liquid distribution mould is provided with nozzle and actuator.Actuator can be signaled for a very short time by the control circuit in main equipment and distribute for liquid.When print cartridge is installed in printer, electric connector pad array is connected to the corresponding adapter pad of printer, so that printer controller is capable of signaling that mould circuit and actuator, and liquid can be dispensed on medium according to input digital image data.Electric connector pad array and liquid distribution mould are attached to flexible circuit.In the industry, such flexible circuit can also be referred to as flexible tabs (tabflex) or tab head assembly (tabheadassembly).Flexible circuit generally includes flexible membrane, for the liquid distribution window of mould, liquid distribution mould, electric connector pad and the wire that adapter pad is connected to actuator.It is challenging in cost-efficient mode, other function being integrated in flexible circuit.
Accompanying drawing explanation
For illustrative purposes, referring now to accompanying drawing, some example that the teaching according to the disclosure constructs is described, wherein:
Fig. 1 illustrates the schematic diagram of the example of flexible circuit；
Fig. 2 illustrates the schematic diagram of the example of the cross-sectional side view of liquid ink box；
Fig. 3 illustrates the schematic diagram of the front view of the example of the liquid ink box of Fig. 2；
Fig. 4 illustrates the schematic diagram of the top view of another example of flexible circuit；
Fig. 5 illustrates the schematic diagram of the example of the flexible circuit cross-sectional side view of Fig. 4；
Fig. 6 illustrates the schematic diagram of a part for the example of the flexible circuit of Fig. 4；
Fig. 7 illustrates the block diagram of the example of secure microcontroller；
Fig. 8 illustrates the flow chart of the example of the method manufacturing flexible circuit；
Fig. 9 illustrates the flow chart of another example of the method manufacturing flexible circuit；
Figure 10 illustrates the flow chart of the part of the other example of the method manufacturing flexible circuit.
Detailed description of the invention
With reference to accompanying drawing in the following detailed description.It should be considered as schematic for describing with the example in accompanying drawing, and is not construed as described concrete example or the restriction of element.Multiple example can be drawn from explained below and/or accompanying drawing by revising, combining or change some element.Furthermore, it is to be appreciated that those of ordinary skill in the art from describing and can draw, accompanying drawing, the example or element not described on literal.
Fig. 1 illustrates the schematic diagram of the example of flexible circuit 1.Such as, flexible circuit 1 be arranged to be applied to liquid ink box 80(Fig. 2,3).Such as, flexible base board 2 includes single integrated substrate (such as, single flexible film).Such as, flexible base board 2 is sheared out from single continuous flexible film.Flexible circuit 1 also includes the first integrated circuit 3 being attached to flexible base board 2.Such as, the first integrated circuit 3 includes memorizer 4 and processing unit 5.Flexible circuit 1 includes electric connector pad array 6, and it is arranged to reception and carrys out the signal of autonomous device (the most such as, printer or other fluid distribution equipment).Such as, such as web(network) miscellaneous equipment of server or mobile communication equipment etc can be by printer or directly communicate with the first integrated circuit 3.
Example electric connector pad array 6 is arranged to constant pattern.Such as, electric connector pad array 6 includes the some adapter pads being placed on regularly on flexible base board 2 along parallel lines, as shown in fig. 1.Such as, electric connector pad array 6 is with equal or similar to such as known typical electrical connector pad 6 from existing liquid ink box adapter pad array.Electric connector pad array 6 includes the first electric connector pad 7 being connected to the first integrated circuit 3 and for being connected to the second electric connector pad 8 of liquid distribution mould 9.Such as, the first electric connector pad 7 is connected to the first wire 10, and the first wire 10 is connected to the first integrated circuit 3.Such as, the second electric connector pad 8 is connected to the second wire 11 for being connected to liquid distribution mould 9.Such as, the first wire 10 and the second wire 11 are respectively connecting to the first integrated circuit 3 and liquid distribution mould 9 by bond pad.In this example, bond pad is can to engage (gangbonding) by group or other joining technique is connected to the conductive contact (joint) of each lead-in wire.Such as, bond pad or adapter pad 7,8 form single joint, or bond pad or adapter pad 7,8 serve as joint.
Such as, liquid distribution mould 9 includes at least one in actuator, nozzle, slot and the second integrated circuit.Second electric connector pad 8 is connected at least one in these actuators, nozzle, slot and the second integrated circuit by the second wire 11.
In this example, the flexible circuit 1 of Fig. 1 allows the group of these features on flexible base board 2 to engage.Such as, electric connector pad 7,8 and wire 10,11 engage connected by group.Such as, the first integrated circuit 3 and liquid distribution mould 9 are respectively connected to corresponding wire 10,11 by group's joint.Such as, integrated circuit 3 can utilize identical group to engage instrument with electric connector pad array 6 and mould 9, be bonded on flexible base board 2 by group, to allow to utilize the most cost-efficient instrument and process to manufacture in identical group's bond pad and with identical group's engaging process step.
Fig. 2 and Fig. 3 respectively illustrates the cross-sectional side view of liquid ink box 80 and the schematic diagram of front view.Fig. 2 represents the cross-sectional side view of Fig. 3.For the reason illustrated, the size in Fig. 2 and Fig. 3 is exaggerated strongly.The print cartridge 80 of Fig. 2 and Fig. 3 includes housing 23 and is attached to the flexible circuit 1 of housing 23.In figs. 2 and 3, flexible circuit 1 is installed to print cartridge 80 it should be appreciated that flexible circuit 1 itself is product in this example, such as, and intermediate products separate with liquid ink box 80.Housing 23 includes liquid storage device 12.Housing 23 includes single mold and for opening (tap) or lid or the shell of shutting reservoir 12.Flexible circuit 1 includes flexible base board 2 and is connected to its first integrated circuit 3 and liquid distribution mould 9.Such as, liquid ink box 80(Fig. 2,3) be the ink cartridge with integrated print head.Such as, liquid distribution mould 9 is printhead die.Such as, actuator is at least one in the thermal resistor or piezoresistor of ink-jet.
Example shown in Fig. 2 and Fig. 3 includes single-chamber room reservoir 12.In another example, liquid ink box 80 include for different liquids (such as, the ink of different colours), by the separate multiple reservoir cavity of inwall.Such as, reservoir 12 provides at least one capillary medium 15 and at least one standpipe 16(such as, one capillary medium 15 of each chamber and standpipe 16), provide liquid for liquid distribution mould 9.In the example shown, liquid ink box 80 includes bed 22 or the frame that can be molded in advance in housing 23, is connected to housing 23 for receiving and liquid distributing mould 9.In this example, liquid distribution mould 9 was connected to flexible base board 2 before being attached to housing 23.
Liquid distribution mould 9 includes nozzle 13 and actuator 14.Such as, actuator 14 includes the thermal resistor for spraying liquid from chamber or piezoresistor.Provide the second integrated circuit 17 being connected to (such as, being included in) liquid distribution mould 9.In this example, the second integrated circuit 17 includes second memory 18.In this example, the second integrated circuit 17 includes at least one transistor 20, such as, for promoting the triggering to actuator 14.Such as, liquid distribution mould 9 includes the conductor circuit 21 for connecting different circuit.Such as, actuator 14 is connected to the second integrated circuit 17 and is connected to electric connector pad array 6 by conductor circuit 21, such as, for promoting by the triggering to actuator 14 of the main equipment controller.In the example shown, the second integrated circuit 17 is disposed in away from the first a certain distance of integrated circuit 3.Such as, second integrated circuit 17 is disposed in liquid distribution mould 9 or near liquid distribution mould 9, the bottom 25 of close liquid ink box 80, and the first integrated circuit 3 is disposed adjacent to electric connector pad array 6, such as, before liquid ink box 80 at 26.Such as, the second integrated circuit 17 is integrated in liquid distribution mould 9.Such as, the second integrated circuit 17 is fabricated by with JetMos integrated circuit fabrication process, and wherein, the mould 9 including transistor 20 and memorizer 18 also is able to be manufactured.Such as, memorizer 18 includes at least one in read only memory (ROM), a series of link and Erasable Programmable Read Only Memory EPROM (EPROM), such as, there is less than about 200, less than about 400 or less than about 2048 or more finite memory.
Such as, print cartridge ID28 is stored on the memorizer 18 of the second integrated circuit 17.Such as, print cartridge ID28 includes the part of the unique sequence numbers about print cartridge 80.Such as, print cartridge ID28 includes other corresponding for the ID code with such as serial number etc.Such as, print cartridge ID28 include hash, encrypted code or such as serial number etc other ID through obscuring (obfuscated) version.Such as, the print cartridge ID28 being stored on the second integrated circuit 17 uses industrial standard secure coding method to protect.Such as, main equipment controller is configured to decoding or otherwise processes print cartridge ID28 for checking.
Such as, authentication codes 29 is stored on the memorizer 4 of the first integrated circuit 3.Such as, authentication codes 29 is corresponding with the described print cartridge ID28 being stored on the second integrated circuit 17, so that the ID being stored on the second integrated circuit 17 and the authentication codes 29 being stored on the first integrated circuit 3 such as can be mated by main equipment controller.In one example, print cartridge ID28 and authentication codes 29 are equivalents and can directly match.In another example, the one or both in print cartridge ID28 and authentication codes 29 needed before can mating print cartridge ID28 and authentication codes 29 processed.Such as, authentication codes 29 is protected, such as, encrypted.Such as, authentication codes 29 is privacy key.Such as, authentication codes 29 includes the version through obscuring of other ID of hash, encrypted code or print cartridge ID28 or such as serial number etc, in order to allow described coupling.Such as, main equipment controller be configured to decoding or otherwise process authentication codes 29 match for print cartridge ID28.Replacing or be additional to authentication codes, the first integrated circuit 3 can comprise the other privacy key for certification.
In this example, the second integrated circuit 17 includes the hash of print cartridge ID28.Such as, the first integrated circuit 3 includes the hash of authentication codes 29.Such as, the signature of password is applied to the one or both utilized in the hash of asymmetric arithmetic (such as, using private cipher key).Such as, private cipher key be according in these technology following at least one arrange: RSA(Rivest, Shamir, Adleman), ECDSA(ECDSA) and DSA(Digital Signature Algorithm).Such as, signature is stored in resist and distorts in memorizer, such as, on the memorizer of the first integrated circuit 3.Such as, main equipment can verify the verity of print cartridge 80 by reading digital signature, print cartridge ID28 and authentication codes 29, and uses public keys known to main equipment to verify them.
As from Fig. 2 and Fig. 3, in this example, the first and second electric connector pads 7,8 define the part of single regular pattern adapter pad array 6.Such as, the first and second electric connector pads 7,8 are arranged to along such as embarking on journey or straight parallel lines 27 in column.In unshowned example, line 27 has the orientation of the inclination of the longitudinal edge relative to flexible base board 2.First and second electric connector pads 7,8 can be arranged to along identical line 27.In the example shown, electric connector pad array 6 includes that two parallel lines 27 of electric connector pad 7,8, every line all include both the first and second electric connector pads 7,8.One example of flexible circuit 1 includes being regularly arranged at least four the first electric connector pad 7 in electric connector pad array 6, that be connected to the first integrated circuit 3, such as, include: grounding connection, power supply connect (Vcc), data cube computation and clock circuit and connect.
Such as, the first integrated circuit 3 and the second integrated circuit 17 share at least one unit connector pad A, B.In the disclosure, unit connector pad A, B can be defined as the first adapter pad 7 and the second electric connector pad 8 combination.Unit connector pad A, B are electrically connected to the first and second wires 10,11.Such as, when being connected to main equipment, at least one unit connector pad A, B are configured for the ground connection of the first and second integrated circuits 3,17.Such as, when being connected to main equipment, at least one unit connector pad A, B are configured for the power supply (Vcc) of the first and second integrated circuits 3,17.
Such as, the constant pattern with electric connector pad 7,8 can allow for the most cost-effectively manufacturing flexible circuit 1 and the main equipment adapter of correspondence.In this example, the first integrated circuit 3 is applied to flexible circuit 1 do not require existing flexible circuit manufacture is modified or only carries out very few modifications.
Figure 4 and 5 illustrate the other example of flexible circuit 1.Exemplary Flexible circuit 1 includes that liquid distributes mould 9.Exemplary Flexible circuit 1 includes flexible base board 2 and the first integrated circuit 3.Flexible base board 2 includes band or film and flexible wire 10,11.Such as, flexible base board 2 is made up of the strong polymer thin film of such as polyimides etc.Thin wire 10,11 is such as by photoetching process imaging.In this example, single flexible substrate 2 includes at least one first window 30 and at least one second window 31.Such as, the first integrated circuit 3 is connected to flexible base board 2, the edge of close first window 30.Such as, liquid distribution mould 9 is connected to flexible base board 2, the edge of close second window 31 via bond pad and/or other joint.Such as, liquid distribution mould 9 and/or the first integrated circuit 3 are engaged by group via bond pad or the joint (wirebond) that goes between is to flexible base board 2.Such as, integrated circuit 3 is bonded to the first wire 10 via the first bond pad by group, and liquid distribution mould 9 is bonded to the second wire 11 via the second bond pad by group.Such as, the first integrated circuit 3 and liquid distribution mould 9 are connected to the same side of flexible base board 2.Such as, the first integrated circuit 3 and liquid distribution mould 9 are bonded to identical group's bond pad by group in a process steps.In another example, liquid distribution mould 9 and the first integrated circuit 3 are engaged in different process steps, and the most such as, flexible base board 2 is relocated or mobile to another instrument between these process steps.
Such as, encapsulated layer 32 encapsulates the first integrated circuit 3.Such as, encapsulated layer 33 encapsulates electric connector pad array 6.The example package layer 33 of shown electric connector pad array 6 also covers the first integrated circuit 3.Shown example package layer 33 defines a continuous encapsulated layer 33 for adapter pad array 6 and the first integrated circuit 3.In another example, multiple encapsulation islands 32 can be applied to individually encapsulating the first integrated circuit 3 and electric connector pad array 6.Such as, encapsulated layer 32,33 is made up of identical material, and is applied to the same side of flexible base board 2.Such as, identical process steps provides encapsulated layer 32,33.Such as, encapsulated layer 32,33 is configured to protect each encapsulated circuit 6,3 affects from ink or other liquid.In this example, encapsulated layer 32,33 includes epoxy resin.
The example electric connector pad array 6 of Fig. 4 illustrates along two the first and second electric connector pads 7,8 to parallel lines 27A, 27B.Such as, the layout of electric connector pad array 6 is similar or identical to the typical electrical connector pad array of the conventional flex circuits of liquid ink box.Such as, every line 27A, 27B have the tilt alpha of sidewall relative to flexible base board 2, a β, such as, wire 10,11 are arranged towards the first integrated circuit 3 and liquid distribution mould 9 in order to promoting.As from Fig. 4 it can be seen that the line 27A of left side pair of connectors pad subarray has the first tilt alpha, and the line 27B of right side pair of connectors pad subarray has the second inclination β.Such as, tilt alpha, β be equal but in a reverse direction.
Such as, the first integrated circuit 3 is disposed between the side of electric connector pad array 6 and single flexible substrate 2.Such as, the first integrated circuit 3 is positioned at liquid ink box 80(Fig. 2 by this promotion) front 26 on.Such as, this promotes to be prone to encapsulate electric connector pad array 6 and the first integrated circuit 3.Such as, electric connector pad array 6 is symmetrical, has the axis of symmetry S of central authorities by electric connector pad array 6 (such as, several to electric connector pad subarray between).Such as, axis of symmetry S is disposed adjacent to the centrage C of flexible base board 2.Centrage C extends through the center of flexible base board 2, is parallel to longitudinal side of flexible base board 2.In this example, the width W of flexible base board 2 is more than the conventional width of the traditional type flexible circuit 1 of similar liquid ink box 80, and such as, the size of the sprocket wheel of a flexible membrane is wider.Such as, distance D between the axis of symmetry S and the centrage C of flexible base board 2 of electric connector pad array 6 is approximately many times of 1/2nd of pitch of chain wheel of 1/2nd or flexible membrane of pitch of chain wheel (pitch) of flexible membrane.Such as, distance D between centrage C and axis of symmetry S is approximately one times of pitch of chain wheel, one 1/2nd times not only, two times, two but also 1/2nd times, three times etc..
Fig. 6 illustrates the top view of the schematic diagram of the example of the first integrated circuit 3.Such as, the first integrated circuit 3 is secure microcontroller.In the example shown, the first integrated circuit 3 includes master integrated circuit 40.Further it is provided that master integrated circuit 40 to be connected at least four bond pad 41 of wire 10.Bond pad 41 promotes to be bonded to integrated circuit 40 first wire 10.Such as, the first integrated circuit 3, bond pad 41 and the first wire 10 are bonded together by group.Such as, at group's zygophase, between wire 10 and bond pad 41, form joint.Such as, master integrated circuit 40 and bond pad 41 are disposed on relative stiffness substrate 42.Such as, encapsulated layer 32 at least encapsulates master integrated circuit 40 and bond pad 41.In this example, at least one or at least two bond pad 41 are connected to combined electric connector pad A, B(Fig. 2).
In this example, the first integrated circuit 3 includes secure microcontroller 50.Fig. 7 illustrates the schematic diagram of the example of secure microcontroller 50.Such as, secure microcontroller 50 includes the memory component being connected to internal bus 51, and such as, RAM52, EEPROM53, user ROM54 and STROM(guide software) at least one in 55.Such as, secure microcontroller 50 includes the EDES accelerator 56 being connected to internal bus 51.Such as, STROM fire wall 57 is provided between STROM55 and internal bus 51.Such as, secure microcontroller 50 includes the processing module communicated with internal bus 51, such as, Cyclic Redundancy Check module 60, clock generator block 61, double 8 bit timing devices 62, safety monitoring and control circuit 63,64,8/16 central processing unit core 65 of True Random Number Generator and at least one being used in the Asynchronous Receiver Transmitter (IART) 66 that high-speed serial data is supported.Such as, the other circuit on secure microcontroller 50 includes clock circuit 70(CLK), reset circuit 71, power supply or Vcc circuit 72, grounded circuit 73 and input/output circuitry 74.In this example, Vcc circuit 72 and grounded circuit 73 are connected to combined electric connector pad A, B by wire 10, and wherein, combined electric connector pad A, B are additionally coupled to the second integrated circuit 17.Such as, other circuit (such as, clock circuit 70 or input/output circuitry 74) is unique to secure microcontroller 50, and does not shares with liquid distribution mould 9.
Such as, replacing or be additional to secure microcontroller, the first integrated circuit 3 also includes another safe storage.
Such as, secure microcontroller 50 is configured to promote safety certification.Such as, in addition to authentication codes 29, secure microcontroller 50 also stores the other data of at least one such as included in the following: data that data that ink level is relevant to return and coupons or reward voucher are correlated with, station address, view data, one group of instruction etc. for printer.Secure microcontroller 50 can be bonded to flexible base board 2 by common group together with liquid distribution mould 9.
Fig. 8 illustrates the example of the method for the flexible circuit 1 manufacturing liquid distribution print cartridge 80.Exemplary method is included on flexible base board 2 the constant array (frame 100) providing the first and second electric connector pads 7,8.Such as, method includes the first integrated circuit 3 is connected to flexible base board 2(frame 110).Such as, the first integrated circuit 3 is such as engaged (such as, group engages) to flexible base board 2 via the first bond pad 41 provided on a substrate 2.First bond pad 41 is connected to the first wire 10.Exemplary method includes the first integrated circuit 3(or the first bond pad 41) it is connected to the first electric connector pad 7(frame 120 of array 6).Such as, the first integrated circuit 3 includes the secure microcontroller 50 being configured to promote the safety certification of liquid ink box 80.Exemplary method includes that liquid distributes mould 9 and is being connected to flexible base board 2(frame 130 away from the first a certain distance of integrated circuit 3).Such as, liquid distribution mould 9 such as via the bond pad 41 provided on a substrate 2 and is such as engaged (such as, group engages) to flexible base board 2 together with integrated circuit 3 in one step.Second bond pad is connected to the second wire 11.Such as, method includes the second electric connector pad 8 is connected to liquid distribution mould 9, such as, is connected to its second integrated circuit 17(frame 140).Such as, method includes obtained flexible circuit 1 is attached to liquid ink box 80(frame 150) so that liquid is connected to liquid storage device 12 with distributing mould 9 liquid and electric connector pad array 6 extends on front 26.
Fig. 9 illustrates another example of the method for the flexible circuit 1 manufacturing liquid distribution print cartridge 80.Such as, method includes providing flexible base board 2, and flexible base board 2 at least includes the first window 30 for the first integrated circuit 3 and the second window 31 for liquid distribution mould 9 and the wire 10 of pre-arranged, 11(frame 200).In this example, flexible base board 2 is previously fabricated by third party.Such as, the size of the circuit of flexible circuit 1 and position are predetermined, and determine size and the position of flexible base board 2.Such as, wire 10,11 is arranged for mould 9 and the first integrated circuit 3 are connected to corresponding electric connector pad 7,8 in advance.
Such as, the exemplary method of Fig. 9 includes jig 9 and the first integrated circuit 3(frame 210 relative to corresponding window 30,31), and such as mould 9 and the first integrated circuit 3 are connected to flexible base board 2(frame 220).Such as, lead-in wire engages and is used for mould 9 and the first integrated circuit 3 are connected to flexible base board 2 with one or a combination set of group's joint.Such as, this method includes the first integrated circuit 3, mould 9 and the first and second electric connector pads 7,8 groups are bonded to the wire 10 of correspondence, 11(frame 230).Such as, a group engages instrument and is used for each adapter pad 7,8 and bond pad 41 groups are bonded to wire 10,11.Group's engaging process allows to make multiple electrical contact in a process steps.Such as in the case of moving flexible base board 2 not with respect to bond pad, such as, use identical encapsulating material, such as, use same tool, and such as in identical process steps, electric connector pad the 7,8 and first integrated circuit 3 is packaged (frame 240).In another example, mould 9 and the first integrated circuit 3 are engaged in different process steps, and such as, after one of mould 9 or the first integrated circuit 3 are engaged, flexible base board 2 is reset (reposition).Such as, different joint instruments or bond pad are used for engaging mould 9 and the first integrated circuit 3.
Figure 10 illustrates another example of the method for the flexible circuit 1 manufacturing liquid distribution print cartridge 80.Such as, method includes print cartridge ID28 writes on (frame 250) on the second integrated circuit 17.Such as, the method includes the authentication codes 29 corresponding with print cartridge ID28 is write on (frame 260) on the first integrated circuit 3.Such as, the method includes writing each flexible circuit 1 or the different print cartridge ID28 of each liquid ink box 80 and different corresponding authentication codes 29(frames 270) so that each liquid ink box 80 has unique ID28 and authentication codes 29.Such as, step below provides the protected of each liquid ink box 80 and unique authentication codes 29.
Such as, some features disclosed in this specification provide certification flexible circuit 1 safely or liquid ink box 80 and allow the ability of its integrated and cost-efficient manufacture simultaneously.Such as, integrated circuit 3 is configured to promote safety certification.In different examples, different main equipments (such as, printer, smart phone, web server, any calculating equipment etc.) can authenticate flexible circuit 1 or liquid ink box 80.In this example, main equipment is docked with flexible circuit 1 by printer.In this example, the first integrated circuit 3 is configured to store other data, such as, and code that liquid is relevant, color adjustment information, coupons correlative code, advertisement, reward voucher etc..Such as, only after having passed through the first integrated circuit 3 and having set up safety certification, main equipment could access, revise or process such other data.Such as, the first integrated circuit 3 is configured to only provide other data above-mentioned after setting up certification or provide the access to other data above-mentioned.In this example, liquid distribution mould 9 needs with little or no needing the adaptation relative to existing integrated print head.In another example, flexible base board 2 and electric connector pad array 6 need with little or no the adaptation needing the existing electric connector pad array relative to integrated print head liquid ink box.Such as, integrated circuit 3 is bonded to wire 10 by group distributing mould 9 away from the liquid distribution a certain distance of mould 9 with liquid while and group is bonded to flexible base board 2.
Such as, the flexibility of flexible circuit 1 refers to flexible base board 2, and some circuit on flexible base board 2 itself can be relative stiffness.It is true that in this example, flexible circuit 1 can be relative stiffness due to the circuit on flexible base board 2.Such as, in addition to group engages or replace group to engage, additionally it is possible to use lead-in wire to engage or other suitable welding method, it may for example comprise to use heat treated, electric energy or chemical composition.
In one example, liquid ink box 80 is adapted to be connected to main equipment.In another example, liquid ink box 80 is the part of hand-held liquid distributing equipment.In still another example, fluid distribution equipment or main equipment are printer or titration device or another type of high-precision liquid distributing equipment.
That above description is not intended to limit or the disclosure is limited to disclosed example.Those of ordinary skill in the art by research accompanying drawing, disclosure and claim it will be appreciated that and realize other change to disclosed example.Indefinite article "a" or "an" is not excluded for multiple, and the element of certain quantity is quoted the probability being not excluded for having more or less element.Individual unit can realize the function of described in the disclosure some, and vice versa, and some items can realize the function of a unit.Without departing from the scope of the disclosure, multiple replacement can be made, be equal to, change and combine.
Claims (15)
1. a flexible circuit for liquid ink box, including
Single flexible substrate,
It is connected to the first integrated circuit of single flexible substrate, and
Electric connector pad array, it is disposed on single flexible substrate for being connected to master controller with constant pattern, and described electric connector pad array includes: be connected to the first electric connector pad of the first integrated circuit and for being connected to the second electric connector pad of liquid distribution mould.
2. flexible circuit as claimed in claim 1, wherein said first electric connector pad is connected to the first wire, described first wire is connected to the first integrated circuit, and wherein said first integrated circuit has storage thereon and is available for the memorizer of the authentication codes that master controller reads.
3. flexible circuit as claimed in claim 1, wherein said first integrated circuit has storage thereon and is available for the memorizer of the authentication codes that master controller reads, and wherein said electric connector pad array is for receiving signal from master controller.
4. flexible circuit as claimed in claim 1, wherein said second electric connector pad is connected to the second wire, and described second wire is used for being connected to described liquid distribution mould, and wherein said electric connector pad array is for receiving signal from master controller.
5. flexible circuit as claimed in claim 1, wherein said first electric connector pad is connected to the first wire, described first wire is connected to the first integrated circuit, wherein said first integrated circuit has storage thereon and is available for the memorizer of the authentication codes that master controller reads, and wherein said second electric connector pad is connected to the second wire, described second wire is used for being connected to described liquid distribution mould, and wherein said electric connector pad array is for receiving signal from master controller.
6. flexible circuit as claimed in claim 1, wherein said electric connector pad array is with equal or similar to such as known typical electrical connector pad array from existing liquid ink box adapter pad array.
7. flexible circuit as claimed in claim 1, wherein said first integrated circuit is secure microcontroller.
8. being at least partially disposed on straight line of flexible circuit as claimed in claim 1, wherein said first electric connector pad and described second electric connector pad.
9. flexible circuit as claimed in claim 1, wherein
Described first integrated circuit is disposed between the side of electric connector pad array and single flexible substrate, and
The axis of symmetry of described electric connector pad array is disposed parallel to the longitudinal centre line of flexible base board and in a certain distance of the longitudinal centre line away from flexible base board.
10. a liquid ink box, including
Liquid storage device,
Liquid distribution mould,
For the flexible circuit of liquid ink box, including
Single flexible substrate, first integrated circuit is connected to single flexible substrate, and electric connector pad array, it is disposed on single flexible substrate for being connected to master controller with constant pattern, described electric connector pad array includes: be connected to the first electric connector pad of the first integrated circuit and for being connected to the second electric connector pad of liquid distribution mould, and
Second integrated circuit, it is connected at least one second electric connector pad, spaced apart with the first integrated circuit, is connected to liquid distribution mould, and is configured to signal actuator,
Print cartridge ID, it is stored on the second integrated circuit, and
The authentication codes corresponding with print cartridge ID, it is stored on the first integrated circuit, so that the authentication codes on the ID of the second integrated circuit and the first integrated circuit can be mated by main equipment.
11. liquid ink boxes as claimed in claim 10, wherein said first electric connector pad is connected to the first wire, described first wire is connected to the first integrated circuit, wherein said first integrated circuit has storage thereon and is available for the memorizer of the authentication codes that master controller reads, and wherein said second electric connector pad is connected to the second wire, described second wire is used for being connected to described liquid distribution mould, and wherein said electric connector pad array is for receiving signal from master controller.
The method of 12. 1 kinds of flexible circuits manufacturing liquid distribution print cartridge, including
First electric connector pad and the constant array of the second electric connector pad are provided on flexible substrates,
First integrated circuit is connected to flexible base board,
Liquid is distributed mould and is connected to flexible base board, and
First integrated circuit is connected to the first electric connector pad, and liquid is distributed mould is connected to the second electric connector pad.
13. methods as claimed in claim 12, encapsulate the first electric connector pad and the first integrated circuit including utilizing identical material, use same package instrument.
14. methods as claimed in claim 12, wherein said first integrated circuit includes secure microcontroller.
15. method as claimed in claim 12, including
Print cartridge ID is write on the second integrated circuit,
The authentication codes corresponding with print cartridge ID is write on the first integrated circuit, and
Unique ID and corresponding authentication codes are write on the flexible circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610328667.3A CN105818542B (en) | 2012-04-30 | 2012-04-30 | Flexible base board with integrated circuit |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610328667.3A CN105818542B (en) | 2012-04-30 | 2012-04-30 | Flexible base board with integrated circuit |
| CN201280068664.0A CN104066585B (en) | 2012-04-30 | 2012-04-30 | With the flexible base board of unicircuit |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280068664.0A Division CN104066585B (en) | 2012-04-30 | 2012-04-30 | With the flexible base board of unicircuit |
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| Publication Number | Publication Date |
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| CN105818542A true CN105818542A (en) | 2016-08-03 |
| CN105818542B CN105818542B (en) | 2018-10-30 |
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| CN201610328667.3A Active CN105818542B (en) | 2012-04-30 | 2012-04-30 | Flexible base board with integrated circuit |
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Cited By (1)
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| CN105818542B (en) | 2018-10-30 |
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