CN105679960A - Light emitting device and packaging method therefor - Google Patents
Light emitting device and packaging method therefor Download PDFInfo
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- CN105679960A CN105679960A CN201410669526.9A CN201410669526A CN105679960A CN 105679960 A CN105679960 A CN 105679960A CN 201410669526 A CN201410669526 A CN 201410669526A CN 105679960 A CN105679960 A CN 105679960A
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Abstract
The invention relates to a packaging method for a light emitting device. The packaging method comprises the following steps of coating the surface of a packaging cover plate to form a glass frit sealing frame; polishing the top surface of the glass frit sealing frame; enabling the packaging cover plate to be laminated with the substrate of the light emitting device; and then performing fusion welding on the glass frit sealing frame by laser and curing the glass frit sealing frame to finish sealing between the packaging cover plate and the substrate of the light emitting device. According to the packaging method for the light emitting device, before the fusion welding is performed on the glass fit sealing frame by laser, the top surface of the glass frit sealing frame is polished firstly, so that a relatively smooth glass frit sealing frame top surface and a relatively consistent glass frit height can be provided; therefore, the pressing and laser sealing yield in the subsequent process can be improved, the packaging effect can be greatly reinforced, and the service life of the light emitting device is prolonged; and in addition, the invention also provides the light emitting device prepared by the method.
Description
Technical field
The present invention relates to display device and make field, particularly relate to a kind of organic luminescent device and method for packing thereof.
Background technology
As the advantage that the display device of a new generation, organic light emitting display and OLED have traditional monitor incomparable, such as luminous, do not need backlight, ultra-thin display can be realized and Flexible Displays, driving voltage are low, power saving, speed of response are fast etc. But OLED is very responsive to oxygen and moisture, it is subject to oxygen and moisture invasion and attack meeting performance degradation ultimate failure. Therefore packaging process is very big on the impact in OLED life-span. Frit method for packing seal protection OLED is adopted to be widely used at present.
The principle of existing frit method for packing is as shown in Figure 1, periphery at encapsulation cover plate 102 arranges frit-sealed frame 103, frit-sealed frame 103 is fitted encapsulation cover plate 102 and oled substrate 101, it may also be useful to the frit-sealed frame 103 of laser welding has also solidified encapsulation. OLED 104 is sealed in the enclosed space that encapsulation cover plate 102, oled substrate 101 and frit-sealed frame 103 are formed. In this kind of encapsulation process, due to the impact of silk-screen printing technique and frit self character, after hot setting, the roughness Ra of frit end face 105 exceedes pre-determined range, and part projection even reaches zero point several microns; Or in gluing process, the thickness of initial, final position joint is obviously higher than other regions, highly irregular, causes pressing gap inconsistent, and the energy absorption of package sealing with laser is uneven, the good rate of whole encapsulation procedure is caused to reduce, package failure.
Summary of the invention
Based on this, it is necessary to provide the method for packing of a kind of luminescent device that can improve frit-sealed performance.
A method for packing for luminescent device, comprises the following steps: form frit-sealed frame on encapsulation cover plate; The end face of described frit-sealed frame is polished flat; Described encapsulation cover plate has the one side of described frit-sealed frame and luminescent device baseplate-laminating, and the frit-sealed frame of laser welding also solidifies, and completes the sealing between encapsulation cover plate and luminescent device substrate.
Wherein in an embodiment, the end face of frit-sealed frame polish flat after roughness Ra be 0～0.1 μm.
Wherein in an embodiment, form frit-sealed frame by silk screen printing or gluing process.
Wherein in an embodiment, the step that the end face of described frit-sealed frame polishes flat is comprised: the end face grinding described frit-sealed frame; Clean described frit-sealed frame; Remove the moisture on the end face of described frit-sealed frame.
Wherein in an embodiment, the mode of baking or volatilization naturally is utilized to remove the moisture on the end face of described frit-sealed frame.
Wherein in an embodiment, the mode of described cleaning is spray pouring.
Wherein in an embodiment, the raw material of the frit that described frit-sealed frame is used comprises: V2O5、P2O5、BaO、SiO2、B2O3、Al2O3、SnO、TeO2、MgO、CaO、ZnO、TiO2、WO3、Bi2O3、Fe2O3、CuO、Sb2O3、Ru2O、Rb2Any one or multiple combination in O, phosphoric acid tin glass, vanadate glass and borosilicate.
Wherein in an embodiment, the particle diameter of described frit is of a size of 0.1～10 μm.
Wherein in an embodiment, the thickness of described frit-sealed frame is 3～30 μm, and width is 300～1000 μm; In the step polished flat by the end face of described frit-sealed frame, the height polished off is H, wherein 0 < H < 500nm.
Also proposing a kind of luminescent device, comprise encapsulation cover plate and luminescent device substrate, described encapsulation cover plate and luminescent device substrate are packaged together by the method for packing described in aforementioned arbitrary item.
In the method for packing of above-mentioned luminescent device, before laser sealing glass material sealing frame, first end face by frit-sealed frame polishes flat, comparatively smooth frit-sealed frame end face and more consistent frit height are provided, pressing in section operation, the good rate of package sealing with laser after promoting, greatly strengthen packaging effect, extend the life-span of luminescent device.
Obtaining luminescent device by aforesaid method, good sealing effect, the life-span of luminescent device is long.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of conventional package method;
Fig. 2 is the schema of method for packing of the present invention;
Fig. 3 adopts silk-screen printing technique to form the schematic diagram of frit-sealed frame on encapsulation cover plate;
Fig. 4 adopts gluing process to form the diagrammatic top view of frit-sealed frame on encapsulation cover plate;
Fig. 5 adopts gluing process to form the diagrammatic side view of frit-sealed frame on encapsulation cover plate;
Fig. 6 is the schematic diagram after the frit-sealed frame shown in Fig. 3 is polished;
Fig. 7 is the schematic diagram that encapsulation cover plate and oled substrate carry out encapsulating.
Embodiment
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully. Accompanying drawing gives the preferred embodiment of the present invention. But, the present invention can realize in many different forms, is not limited to embodiment described herein. On the contrary, it is provided that the object of these embodiments makes the understanding of the disclosure to the present invention more comprehensively thorough.
It should be noted that, when element is called as " being fixed on " another element, it can directly on another element or can also there is element placed in the middle. When an element is considered as " connection " another element, it can be directly connected to another element or may there is element placed in the middle simultaneously. On the contrary, when element be referred to as " directly existing " another element " on " time, there is not intermediary element. Term as used herein " vertical ", " level ", "left", "right" and similar statement are just for illustrative purposes.
Unless otherwise defined, all technology used herein are identical with the implication that the those skilled in the art belonging to the present invention understand usually with scientific terminology. The term used in the description of the invention herein is the object in order to describe specific embodiment, is not intended to be restriction the present invention. Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in further detail.
The present invention provides the method for packing of a kind of luminescent device (being described for OLED luminescent device), and Fig. 2 illustrates the flow process of the method. Each step of the method shown in Fig. 2 is described in detail below in conjunction with Fig. 3 to Fig. 7.
S110, on the surface of encapsulation cover plate coating formed frit-sealed frame.
In this step, by silk screen printing or gluing process, the graph layer of coated glass material sealing frame 303 on encapsulation cover plate 302, frit-sealed frame 303 thickness can be controlled between 3～30 μm, width can be controlled in 300～1000 μm, solidifies, through pre-drying, high temperature sintering, the frit-sealed frame 303 that acquisition is highly 1～10 μm. The scope of frit-sealed frame 303 should be able to cover the OLED 304 on luminescent device substrate (i.e. oled substrate 301).
As shown in Figure 3, being coated with for screen printing mode and frit-sealed frame 303 schematic cross sectional views after solidifying, the frit-sealed frame 303 of acquisition has uneven coarse end face 305. Fig. 4 and Fig. 5 is then the schematic plan after adopting coating in gluing process to solidify and side-view. Ginseng Fig. 5, it can be seen that the height of the frit of initial, final position joint 306 is obviously greater than other regions. In Fig. 5, initial, final position joint 306 is positioned at the mid-way of certain side of frit-sealed frame 303, it is also possible in other positions of frit-sealed frame 303, such as corner.
In this step, the raw material of the frit that frit-sealed frame 303 is used comprises: V2O5、P2O5、BaO、SiO2、B2O3、Al2O3、SnO、TeO2、MgO、CaO、ZnO、TiO2、WO3、Bi2O3、Fe2O3、CuO、Sb2O3、Ru2O、Rb2Any one or multiple combination in O, phosphoric acid tin glass, vanadate glass and borosilicate. The particle diameter of frit is of a size of 0.1～10 μm. Above-mentioned glass material can meet many-sided requirements such as package temperature, thermal expansivity, thermostability and chemical stability simultaneously.
S120, end face by described frit-sealed frame polish flat. The step that the end face of described frit-sealed frame polishes flat is comprised: the end face grinding described frit-sealed frame; Clean described frit-sealed frame; Remove the moisture on the end face of described frit-sealed frame. The frit-sealed frame 303 formed for the screen printing mode shown in Fig. 3 below is described.
Owing to OLED is very responsive to oxygen and moisture, it is subject to oxygen and moisture invasion and attack meeting performance degradation ultimate failure, it is necessary to ensure packaging effect. Front literary composition is chatted, and after frit-sealed frame 303 is obtained, its end face is smooth not, can affect follow-up packaging effect.
Therefore, in this step, the one side of uncoated for encapsulation cover plate 302 frit is placed on fixed support table top, repeatedly grind back and forth at the end face of frit-sealed frame 303 by the grinding apparatus of high precision, face contact, adjust the pressure that grinding applies, grinding is highly H, wherein 0 < H < 500nm. Then encapsulation cover plate 302 is sent to cleaning equipment cleaning showers, after cleaned, then low-temperature bake for some time, removing the moisture of frit-sealed frame 303 end face, the shape looks after polishing are as shown in Figure 6.
Frit-sealed frame 303 end face polish flat after roughness Ra be 0～0.1 μm, smooth end face and consistent frit height is possessed before not polishing, thus promote the pressing in rear section operation, the good rate of package sealing with laser, greatly strengthen packaging effect, extend the OLED life-span.
In this step, employing low-temperature bake removes the moisture that frit-sealed frame 303 end face is left over when cleaning.Low temperature herein refers to the temperature lower than the welding of frit-sealed frame 303, and concrete restriction is not done in concrete temperature and baking, can the end face of dry glass sealing frame 303 be as the criterion. But it is noted that remove the mode that moisture is not limited to adopt baking, it is also possible to be other modes, such as natural volatilization.
S130, by encapsulation cover plate and luminescent device baseplate-laminating, the frit-sealed frame of laser welding also solidifies, and completes the sealing between encapsulation cover plate and luminescent device substrate.
Please refer to Fig. 7, encapsulation cover plate 302 and oled substrate 301 are fitted, frit-sealed frame 303 is relative with oled substrate 301. Using the frit-sealed frame 303 of laser welding and solidify, complete the gas-tight seal between encapsulation cover plate 302 and oled substrate 301, prevent OLED 304 to be subject to the infringement of water, oxygen, final effect is namely as shown in Figure 7.
Due to through grinding, frit-sealed frame 303 possesses comparatively smooth end face and consistent height, encapsulation cover plate 302 is better with the effect of oled substrate 301 phase pressing, therebetween gap everywhere is consistent, energy absorption is obtained so comparatively even when package sealing with laser, thus ensure the good rate of whole encapsulation procedure, ensure packaging effect.
In addition, present invention also offers a kind of luminescent device, a kind of OLED is such as provided, comprising encapsulation cover plate and luminescent device substrate, the two is packaged together by aforesaid method for packing, before package sealing with laser, the end face of frit-sealed frame has been ground, therefore the energy absorption of package sealing with laser is even, good sealing effect, thus ensure the life-span of luminescent device.
The above embodiment only have expressed several enforcement modes of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to patent scope of the present invention. , it is also possible to make some distortion and improvement, it should be appreciated that for the person of ordinary skill of the art, without departing from the inventive concept of the premise these all belong to protection scope of the present invention. Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. the method for packing of a luminescent device, it is characterised in that, comprise the following steps:
Encapsulation cover plate is formed frit-sealed frame;
The end face of described frit-sealed frame is polished flat;
Described encapsulation cover plate has the one side of described frit-sealed frame and luminescent device baseplate-laminating, and the frit-sealed frame of laser welding also solidifies, and completes the sealing between encapsulation cover plate and luminescent device substrate.
2. the method for packing of luminescent device according to claim 1, it is characterised in that, the end face of frit-sealed frame polish flat after roughness Ra be 0～0.1 μm.
3. the method for packing of luminescent device according to claim 1, it is characterised in that, form frit-sealed frame by silk screen printing or gluing process.
4. the method for packing of luminescent device according to claim 1, it is characterised in that, the step that the end face of described frit-sealed frame polishes flat is comprised:
Grind the end face of described frit-sealed frame;
Clean described frit-sealed frame;
Remove the moisture on the end face of described frit-sealed frame.
5. the method for packing of luminescent device according to claim 4, it is characterised in that, utilize the mode of baking or volatilization naturally to remove the moisture on the end face of described frit-sealed frame.
6. the method for packing of luminescent device according to claim 4, it is characterised in that, the mode of described cleaning is spray pouring.
7. the method for packing of luminescent device according to claim 1, it is characterised in that, the raw material of the frit that described frit-sealed frame is used comprises: V2O5、P2O5、BaO、SiO2、B2O3、Al2O3、SnO、TeO2、MgO、CaO、ZnO、TiO2、WO3、Bi2O3、Fe2O3、CuO、Sb2O3、Ru2O、Rb2O, any one or multiple combination in phosphoric acid tin glass, vanadate glass and borosilicate.
8. the method for packing of luminescent device according to claim 7, it is characterised in that, the particle diameter of described frit is of a size of 0.1～10 μm.
9. the method for packing of luminescent device according to claim 1, it is characterised in that, the thickness of described frit-sealed frame is 3～30 μm, and width is 300～1000 μm; In the step polished flat by the end face of described frit-sealed frame, the height polished off is H, wherein 0 < H < 500nm.
10. a luminescent device, comprises encapsulation cover plate and luminescent device substrate, it is characterised in that, described encapsulation cover plate and luminescent device substrate are packaged together by the method for packing according to any one of claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410669526.9A CN105679960A (en) | 2014-11-20 | 2014-11-20 | Light emitting device and packaging method therefor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410669526.9A CN105679960A (en) | 2014-11-20 | 2014-11-20 | Light emitting device and packaging method therefor |
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| CN105679960A true CN105679960A (en) | 2016-06-15 |
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| CN201410669526.9A Pending CN105679960A (en) | 2014-11-20 | 2014-11-20 | Light emitting device and packaging method therefor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110238526A (en) * | 2019-07-17 | 2019-09-17 | 昆山龙腾光电有限公司 | Display panel production method, display panel and welder |
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| US20140196502A1 (en) * | 2011-07-27 | 2014-07-17 | Noriaki Masuda | Glass substrate with sealing material layer, organic el device using same, and manufacturing method for electronic device |
| CN104124179A (en) * | 2013-04-26 | 2014-10-29 | 上海和辉光电有限公司 | Display device packaging technology and device |
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Patent Citations (6)
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| US20110249376A1 (en) * | 2010-04-13 | 2011-10-13 | Au Optronics Corporation | Display device package and packaging process thereof |
| US20140196502A1 (en) * | 2011-07-27 | 2014-07-17 | Noriaki Masuda | Glass substrate with sealing material layer, organic el device using same, and manufacturing method for electronic device |
| CN102701591A (en) * | 2012-06-07 | 2012-10-03 | 上海大学 | Laser packaged glass powder sealing material for photoelectric device packaging |
| CN104124179A (en) * | 2013-04-26 | 2014-10-29 | 上海和辉光电有限公司 | Display device packaging technology and device |
| CN103367658A (en) * | 2013-07-17 | 2013-10-23 | 深圳市华星光电技术有限公司 | Glass packaging structure and packaging method |
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| CN110238526A (en) * | 2019-07-17 | 2019-09-17 | 昆山龙腾光电有限公司 | Display panel production method, display panel and welder |
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Application publication date: 20160615 |
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