JP2010204236A - Method of manufacturing electrooptical device, and electrooptical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To cut out a display panel from a large substrate by cutting a sealing material portion. <P>SOLUTION: According to the manufacturing method, in a scribing step, the display panel 100 is cut out as single article by cutting the large substrate 150 in the condition of secondary cooling, along scribe lines B12 and B22 formed in a part overlapped with a common sealing material 5c. Cutting, which is difficult under normal temperature, is enabled when cutting step is carried out in the brittle as well as cured condition due to low temperatures. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electro-optical device and an electro-optical device manufactured by the manufacturing method.

  When manufacturing an electro-optical device using an electro-optical material such as liquid crystal or organic EL (Electro Luminescence), in order to increase manufacturing efficiency, the electro-optical device is substantially completed in the state of a large-sized substrate with a plurality of surfaces mounted. The method of manufacturing to a state and then cutting out individual electro-optical devices has been adopted.

FIGS. 11A and 11B are plan views of a large substrate in a conventional electro-optical device.
FIG. 11A is an enlarged plan view of a large-sized substrate 450 on which a plurality of liquid crystal panels (liquid crystal display devices) 400 are attached, and two liquid crystal panels 400 are arranged in the lateral direction (X-axis direction) as opposed to the drawing. It shows how they are arranged. The large-sized substrate 450 is formed by bonding two substrates having substantially the same size, and a display in which liquid crystal is sealed in an area partitioned by the sealing material 5 between the two substrates on the front and back sides. Region 6 was formed.
For example, in the large format substrate 450 of FIG. 11A, a gap G in which the sealing material 5 is not formed is provided between the adjacent liquid crystal panels 400, and the liquid crystal panel 400 is arranged in the vertical direction (Y-axis direction). When cutting, the cutting was performed along the scribe line s1 indicated by the broken line in the center between the gaps G. Also in the lateral direction, cutting was performed along the scribe line s2 formed in the gap G where the sealing material 5 was not formed.

That is, each panel is cut at a position where the sealing material is not exposed at the peripheral edge of the cut-out liquid crystal panel 400. However, this method has the following problems.
First, since the gap G is provided, there is a problem that the frame size surrounding the display area 6 is increased by the gap, and the external size of the liquid crystal panel is increased. In other words, there is a problem that it is difficult to narrow the frame.
In addition, there is a problem in that the sealing member 5 is not filled on both sides of the terminal portion 8 and a hollow portion 405 (a portion indicated by hatching) surrounded by two substrates is formed. . When the hollow portion 405 is present, for example, there is a problem that the cleaning liquid is easily accumulated in the cleaning process of the liquid crystal panel and the terminal portion 8 is deteriorated by the retained cleaning liquid. Furthermore, since the cleaning liquid or the like that has entered the cavity 405 is difficult to dry, there is a problem that it takes time for the drying process.

Patent Document 1 discloses one technical idea for solving the above problem.
FIG.11 (b) is a top view of the large format board | substrate 460 which concerns on the manufacturing method of the said literature, and respond | corresponds to Fig.11 (a).
In this manufacturing method, the seal material 5 in the adjacent liquid crystal panel 410 is formed in common across the two display areas 6, and then the scribe line s 1 is formed at a position overlapping the common seal material 5. In other words, it is a method of cutting a portion of the common sealing material 5 straddling both sides without providing a gap G between adjacent display regions 6. In this document, the width L2 of the liquid crystal panel can be made shorter than the width L1 in FIG. 11A, and the cavity 405 is not formed.

JP 2008-96836 A

However, in the manufacturing method of Patent Document 1 (conventional), it is considered that it is difficult to cut the sealing material portion for the following reason.
First, when two glass substrates sandwiching a sealing material are cut at a portion of the sealing material, if the hardness difference between the sealing material and the glass substrate is too large, the sealing material is not cut even if the glass substrate is cut. However, in this document, the description regarding the hardness of the sealing material is not found, and the description regarding the material (type) is not found. In particular, according to the document, it is described that after a scribe line is formed on one of two glass substrates, an impact is applied by a break device to perform cutting (cutting). When a sealing material made of resin is used, it is considered difficult to cause cracks in the glass substrate that has grown from the scribe line to occur continuously in the sealing material made of resin because of the above hardness difference. The
That is, the manufacturing method has a problem that it is difficult to cut out the liquid crystal panel 410 by cutting the portion of the sealing material 5 from the large-sized substrate 460. In other words, there is a problem that it is difficult to solve the above problem.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples or forms.

(Application example)
One or more electro-optical devices including an electro-optical device including two opposing substrates, a display region in which an electro-optical material is sandwiched between the two substrates, and a seal material that partitions the display region Is a manufacturing method for cutting out a large-sized substrate having an imprinted surface, a cooling step for cooling the large-sized substrate, and a scribing step for forming a scribe line on at least one of the two substrates in the large-sized substrate; And a cutting step of cutting the large-sized substrate by applying pressure along the scribe line, and a part of the scribe line is formed so as to overlap the sealing material.

According to this manufacturing method, after the large substrate is cooled in the cooling step, the electro-optical device is cut out along the scribe line formed in the portion overlapping the sealing material.
Therefore, for example, when the substrate material is inorganic glass and the sealing material is resin, the substrate hardness and the sealing material hardness are higher than those at room temperature by cooling in the cooling step. Therefore, it becomes possible to cause the crack of the glass substrate grown along the scribe line to continuously occur in the sealing material. In other words, by performing the cutting process in a state of becoming hard and fragile at a low temperature, cutting that was difficult at room temperature can be performed.
Accordingly, it is possible to provide a method for manufacturing an electro-optical device that can cut a portion of a sealing material from a large-sized substrate and cut out a display panel. This also solves the problems described in the background art.

In addition, the material of the substrate is inorganic glass, and the sealing material is made of a resin formed by applying a liquid sealing material to one of the substrates and then curing the sealing material. The temperature is preferably not higher than the melting point of the raw material.
The electro-optical material is an organic EL material containing an organic light emitting material. In the display region, the organic EL material is covered with a filler, and the filler is a liquid filler so as to cover the organic EL material. It consists of a resin formed by curing the filler material after applying the material, and the cooling temperature is preferably a temperature lower than the melting point of the seal material and higher than the melting point of the filler material. .
Moreover, it is preferable that cooling temperature is the temperature within the range of -10 degreeC--35 degreeC.
In the scoring process, the scribe line may be formed on the other substrate, and the scribe line on the other substrate may be formed so as to overlap with the scribe line formed on the one substrate in plan view. preferable.

In the cutting process, the table on which the large-sized substrate is set is formed with a concave shape such that the portion overlapping the scribe line becomes a gap, and both sides sandwiching the scribe line become fulcrums. It is preferable to apply pressure to the large substrate from the surface opposite to the gap.
In addition, a large-sized substrate is provided with a plurality of electro-optical devices, and a common sealing material is provided between two adjacent electro-optical devices over two display areas. It is preferable to form the scribe line so that at least a part thereof overlaps the common sealing material.
Moreover, it is preferable that each process from a cooling process to a cutting process is performed under the temperature environment substantially the same as the temperature environment in a cooling process.

Moreover, it is preferable that a bead-like spacer is added to the sealing material.
Further, the substrate is preferably alkali-free glass, the sealing material is an ultraviolet curable liquid material containing an epoxy resin, and the filler material is preferably a thermosetting transparent liquid material.
In addition, the display area is preferably substantially rectangular, and a terminal portion is formed on one side of the rectangle, and the common sealing material is preferably formed on at least two sides adjacent to one side.

  An electro-optical device manufactured by the manufacturing method described above.

FIG. 3 is a plan view illustrating one mode of a large-sized substrate according to Embodiment 1. The perspective view which shows the one aspect | mode of a display panel. Sectional drawing of the display panel in the pp cross section of FIG. The flowchart figure which shows the flow of the manufacturing method of a display panel. (A) The figure which shows the application | coating process of a sealing material, (b) The figure which shows the application | coating process of a filler, and a board | substrate bonding process. (A) Outline | summary figure of scribe apparatus, (b) The enlarged view of a cutter part. The perspective view which shows the outline | summary of a break device. (A), (b) The enlarged view at the time of a break. (A), (b) The figure which shows the one aspect | mode in the break process of the manufacturing method which concerns on Embodiment 2. FIG. The figure which shows the one aspect | mode in the break process of the manufacturing method which concerns on Embodiment 3. FIG. (A), (b) The top view of the large format board | substrate in the conventional electro-optical apparatus. The top view which shows the one aspect | mode of the large sized board | substrate which concerns on the modification 1. FIG. The enlarged view of the breaking apparatus which concerns on the modification 2. FIG. The enlarged view of the sealing material in the display panel which concerns on the modification 3. FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the scales are different for each layer and each member so that each layer and each member can be recognized on the drawing.

(Embodiment 1)
"Display Panel Manufacturing Method (Overview)"
FIG. 1 is a plan view showing an aspect of a large-sized substrate according to the present embodiment. FIG. 2 is a perspective view illustrating one embodiment of the display panel.
First, an outline of a method for manufacturing an electro-optical device according to Embodiment 1 of the present invention will be described with reference to FIGS. In addition, the same number is attached | subjected about the component same as FIG.

Four display panels 100 as electro-optical devices are attached to the large substrate 150. The rectangular display panel 100 is arranged on the large substrate 150 in a matrix of two columns in the X-axis direction and two rows in the Y-axis direction. For ease of explanation, a case of 2 rows and 2 columns will be described here, but any number of impositions may be used.
The large-sized substrate 150 has a configuration in which two large-sized substrates are stacked in the thickness direction (Z-axis direction), and each display panel 100 is partitioned by the seal material 5. Specifically, an area surrounded by the seal material 5 in each display panel 100 is a display area 6 in which an electro-optical material is enclosed.
Further, each display panel 100 is formed with a terminal portion 8 in which a plurality of terminals for electrical connection with the outside are formed.

In the case of FIG. 1, the display panel 100 in the upper row (Y-axis (+) side) facing the paper surface has a terminal portion 8 formed on the upper side, and the display panel 100 in the lower row (Y-axis (−) side). 100 has a terminal portion 8 formed below.
In other words, the upper and lower display panels 100 are arranged with the opposite sides of the terminal portion 8 facing each other. In addition, a common sealing material 5c is disposed between the two, and the width thereof is set to, for example, about twice the width w of the sealing material 5 on the side along the terminal portion 8 (width 2w). Yes. Further, a common sealing material 5c is also disposed between two adjacent display areas 6 in the upper stage, and the width thereof is set to about 2w.
That is, a common sealing material 5c is arranged between two adjacent display regions 6, and the width of the sealing material 5c is larger than the width of the sealing material 5 in other portions (for example, the side along the terminal portion 8). Is also set widely (approximately twice). In addition, the width w of the sealing material 5 is set to about 0.8 to 1.6 mm as a preferable example.

Here, the manufacturing method according to the present embodiment overlaps the common sealing material 5c in a state where the large substrate 150 is cooled when the single display panel 100 as shown in FIG. One of the features is that the part is cut.
FIG. 1 shows the cutting position at this time. Cutting positions in the vertical direction (Y-axis direction) are scribe lines (cutting lines) B11 to B13. Among these, scribe line B12 is formed in the approximate center of the common sealing material 5c.
Further, the cutting positions in the lateral direction (X-axis direction) are scribe lines B21 to B23. Among these, scribe line B22 is formed in the approximate center of the common sealing material 5c.
In the case of FIG. 1, there is one common seal material 5 c in the vertical and horizontal directions.
As will be described later, the display panel 100 of FIG. 2 is cut out from the large substrate 150 by cutting only the front and back substrates or the front substrate (CF substrate) along each scribe line.

"Display Panel Configuration"
The display panel 100 includes an element substrate 1, a CF (Color Filter) substrate 30, a sealing material 5, and the like.
The display panel 100 is an organic EL panel in which an organic EL material is sandwiched between the element substrate 1 and the CF substrate 30 as an electro-optical material. In addition, the organic EL material is arranged in a region surrounded by the sealing material 5 in a plan view, and the region is a display region 6.
In the display area 6, a plurality of pixels are arranged in a matrix. Specifically, pixels of three colors of red, green, and blue are periodically arranged.
The display panel 100 is a top emission type organic EL panel that emits light emitted from these pixels from the CF substrate 30 side.

In the element substrate 1, an overhang region is formed with one side extending from the outer shape of the CF substrate 30, and a terminal portion 8 is formed in the overhang region. For this reason, when the region is cut out, the scribe lines B21 and B23 in FIG. 1 are formed on the large CF substrate 30 side, and only the portion of the CF substrate 30 that covers the overhanging region is cut out.
In addition, as described above, the two sides adjacent to one side where the terminal portion 8 is formed and the side opposite to the one side are cut off at the portion overlapping the common sealing material 5c, and therefore the side surface (cutting) The sealing material 5 is exposed on the surface. In other words, the outer shape of the display panel 100 in plan view and the shape of the sealing material 5 substantially coincide with each other on three consecutive sides other than the sealing material in the overhang region.

3 is a cross-sectional view of the display panel taken along the line pp of FIG.
The display panel 100 includes an element substrate 1, an element layer 3, a planarization layer 9, a pixel electrode 10, an EL layer 15, a common electrode 17, an electrode protective layer 19, a buffer layer 20, a gas barrier layer 22, a filler 23, and a CF substrate 30. Etc.
The element substrate 1 is made of transparent inorganic glass. Preferably, alkali-free glass having a thickness of about 0.3 to 0.7 mm is used.
In the element layer 3, a pixel circuit for actively driving each pixel is formed. The pixel circuit includes a selection transistor for selecting a pixel made of a TFT (Thin Film Transistor), a driving transistor for flowing a current through the EL layer 15, and the like, and is formed corresponding to each pixel. Yes.

On the upper layer (the Z-axis (−) direction) of the element layer 3, the planarization layer 9 and the pixel electrode 10 are stacked in this order.
The pixel electrode 10 is composed of a transparent electrode such as ITO (Indium Tin Oxide) or ZnO, and is connected to the drain terminal of the driving transistor TR of the element layer 3 and a contact hole penetrating the planarizing layer 9 for each pixel. ing.
Further, in the planarizing layer 9 made of a transparent insulating material such as resin, a thin reflective layer 26 made of Al, Ag, or an alloy thereof is formed so as to overlap the pixel electrode 10. Yes.
The partition 12 is made of a photocurable black resin or the like, and partitions each pixel in a lattice shape.

Although the EL layer 15 has a single layer structure in FIG. 3, it is actually composed of a hole transport layer, a light emitting layer, an electron injection layer, and the like, and is laminated on the pixel electrode 10 in this order. .
The hole transport layer is made of a sublimable material such as aromatic diamine (TPAB2Me-TPD, α-NPD), and emits white light when an electric current flows.
The light emitting layer is composed of a sublimable material such as Alq ₃ (aluminum quinolinol complex), although the composition differs for each RGB pixel.
The electron injection layer is made of LiF (lithium fluoride) or the like.

The common electrode 17 is a metal thin film layer in which a metal such as MgAg is formed very thin so as to transmit light.
The electrode protective layer 19 is made of a transparent material such as SiO ₂ or Si ₃ N ₄ and having a function of blocking moisture.
The buffer layer 20 is a transparent organic buffer layer such as a thermosetting epoxy resin.
The gas barrier layer 22 is a sealing layer that is transparent and has a function of blocking moisture, such as SiO ₂ and Si ₃ N ₄ , and has a function of preventing moisture from entering the EL layer 15.
The filler 23 is a transparent adhesive layer made of, for example, a thermosetting epoxy resin, and fills the uneven surface between the gas barrier layer 22 and the CF substrate 30 and bonds them together. Further, it also functions to prevent moisture from entering the EL layer 15 from the outside.

The CF substrate 30 is made of the same inorganic glass as the element substrate 1, and the CF layer 24 is formed on the EL layer 15 side.
In the CF layer 24, a red color filter 25R, a green color filter 25G, and a blue color filter 25B are arranged similarly to the pixel arrangement. Specifically, the color filters for each color are arranged so as to overlap the pixel electrode 10, and light shielding portions indicated by hatching are formed between the color filters. The light shielding portion is formed in a lattice shape so as to overlap the partition wall 12 in a plan view, and optically functions as a black matrix.
One pixel of the display panel 100 configured as described above has a stacked structure from the reflective layer 26 to the red color filter 25R surrounded by a dotted line on the left side of FIG.
In the case of this red pixel, of the white light emitted from the EL layer 15, the light traveling toward the red color filter 25 </ b> R is transmitted through the color filter and emitted as red light from the CF substrate 30. The light traveling toward the reflective layer 26 is reflected by the reflective layer 26, then passes through the EL layer 15, passes through the red color filter 25 </ b> R, and is emitted as red light from the CF substrate 30. The same applies to the green and blue pixels.

“Seal materials and filler materials”
Here, the characteristics of the sealing material 5 and the filler 23 that play an important role in the cooling process described later will be described in detail.
In FIG. 3, the laminated structure portion is illustrated in an enlarged manner in order to clarify the laminated structure of each layer including the EL layer 15. Actually, the thickness of the layer is about 5 to 100 μm in total. In other words, the thickness of the sealing material 5 is also the same as the dimension.
As the sealing material 5, an ultraviolet curable adhesive is preferable. Specifically, any material may be used as long as the hardness thereof is higher than the hardness at room temperature under the temperature condition in the cooling step described later and approaches the hardness of the inorganic glass.

In this embodiment, an epoxy resin-based ultraviolet curable adhesive is used as a suitable example. The adhesive contains, for example, a bisphenol type epoxy resin, a photopolymerization initiator, a silane coupling agent, and the like, and is a liquid at normal temperature (20 ± 15 ° C.). The liquid raw material of the sealing material 5 is referred to as a sealing raw material.
Such a sealing raw material exhibits characteristics close to a crystalline polymer in the state of the sealing raw material, and has a melting point of about −10 ° C., for example. In addition, after curing by ultraviolet irradiation, it exhibits characteristics close to an amorphous polymer.
In this embodiment, as a suitable example, Sekisui Chemical Co., Ltd. Photorec (registered trademark) is used as a sealing material.

Since the filler 23 covers each layer including the EL layer 15 in the entire display region 6, there is a possibility that the display panel 100 is warped due to contraction in a low temperature environment in the cooling process. For this reason, the filler 23 is required to have a low thermal expansion coefficient in addition to transparency and adhesiveness.
In this embodiment, a thermosetting epoxy adhesive is used as a suitable example. Further, the adhesive is a liquid at normal temperature, and this liquid raw material is referred to as a filler raw material.
Such a filler material exhibits characteristics close to a crystalline polymer in the state of the material, and has a melting point of about −40 ° C., for example. Further, after being cured by heating, it exhibits characteristics close to an amorphous polymer.

"Display Panel Manufacturing Method (Details)"
FIG. 4 is a flowchart showing the flow of the manufacturing method of the display panel. FIG. 5A is a diagram showing a sealing material application process, and FIG. 5B is a diagram showing a filler application process and a substrate bonding process.
Here, the manufacturing method of the display panel will be described in detail along the flowchart of FIG.

In step S1, a sealing material is applied to a large CF substrate 30a, and then the sealing material 5 is semi-cured by irradiating ultraviolet rays.
The seal raw material is applied in a lattice shape as shown in FIG. 5A, for example, by a dispenser device capable of managing the application position and the application amount. In addition, as long as the application position and the application amount can be controlled, other application methods such as a screen printing method may be used. In addition, about the common sealing material 5c part, it forms by apply | coating twice adjacently in parallel using the nozzle which apply | coats the sealing material of the width | variety w in an outer periphery, for example.
And after apply | coating a sealing raw material, an ultraviolet-ray is irradiated on predetermined conditions. The predetermined conditions are set to an ultraviolet intensity and an irradiation time for curing the sealant 5 so that the sealant 5 itself does not flow and can hold a filler to be described later.

In step S2, after applying the filler material 23a to the large CF substrate 30a, the large element substrate 1a is bonded. In FIG. 5B, the filler material 23a is shown in the form of droplets. However, the filler material 23a is applied so as to have a substantially uniform thickness in a region (display region) partitioned by the sealant 5. Steps S1 and S2 are preferably performed in a clean room environment where the pressure is reduced in order to reduce the adhesion of foreign substances and the generation of bubbles.
Further, at this stage, the laminated structure including the EL layer 15 described in FIG. 3 is already formed on the surface of the large element substrate 1a on the sealing material side.
In step S3, the bonded large substrate is heated to cure the filler. The heating conditions are set to about 4 hours in a temperature environment of 80 to 120 ° C., for example. In addition, although hardening of the sealing material 5 is accelerated | stimulated by this heating, you may irradiate an ultraviolet-ray simultaneously.
The large-sized substrate 150 of FIG. 1 is completed through the steps S1 to S3.

FIG. 6A is a schematic diagram of the scribe device, and FIG. 6B is an enlarged view of the cutter unit.
In step S4, the large substrate is primarily cooled to room temperature. Specifically, the large substrate is placed on a cooling plate and cooled for about 10 minutes. Since a pipe for circulating water is provided inside the cooling plate, the large-sized substrate can be returned to room temperature in about 10 minutes.
In step S5, the large substrate is secondarily cooled to a predetermined temperature. In addition, although the process which needs to carry out secondary cooling of the large-sized board | substrate is only a breaking process (S7, S9), in the process flow of this embodiment, since a scribe process and a breaking process are performed alternately, these processes are performed. By performing all four processes in a temperature-controlled room set at a predetermined temperature, the secondary cooling process in step S5 is performed.
Moreover, the predetermined temperature in secondary cooling is set to 5 degrees C or less lower than normal temperature. Specifically, the temperature is 5 ° C. or lower and −40 ° C. or higher. Moreover, it is more preferable that it is a low temperature environment of -10 degrees C or less and -30 degrees C or more. In this embodiment, it is set as -10 degreeC as a suitable example.

In step S6, as shown in FIG. 6A, the large substrate 150 is mounted on the scribe device 200, and a scribe line (ruled line) is placed on the large element substrate 1a (first scribe step).
Specifically, the scribing device 200 is set on the table 210 so that the large element substrate 1a is on the upper side, and a scribe line is formed while being pressed by a ruled part 220 having a rotary blade 221 at the tip. The table 210 is movable in the X-axis direction and the Y-axis direction, and is provided so as to be able to turn around its central portion as indicated by a rotation arrow. The ruled part 220 is provided so as to be movable in the Z-axis direction, and is provided so as to be able to apply a pressure for placing a scribe line on the large-sized substrate, as indicated by a white arrow. That is, the scribe line is formed by moving the large substrate 150 relative to the ruled part 220 by the table 210.

FIG. 6A shows a state in which a scribe line B22 in the X-axis direction in FIG. 1 is formed. After the formation of the line, the table 210 is turned 90 ° to scribe lines B11 to B11 in the Y-axis direction. B13 is formed.
FIG. 6B shows a state in which the ruled part 220 is observed from the X-axis direction in FIG. An edge is formed on the peripheral edge of the rotary blade 221 made of a cutting wheel such as super steel, and the angle θ is set to 115 ° to 125 °, for example.
Further, the pressing is set to, for example, 0.05 to 0.18 Mp, and the condition is set such that the cutting depth d is, for example, 0.09 to 0.18 mm.

FIG. 7 is a perspective view showing an outline of the breaking device. FIG. 8A is an enlarged view at the time of a break.
In step S7, as shown in FIG. 7, the large substrate 150 is mounted on the breaking device 250, and only the large element substrate 1a side is cut (first breaking step).
Specifically, by setting the large CF substrate 30a side on the table 260 of the breaker 250 and pressing it with a break bar 270 extending along the scribe line, only the large element substrate 1a side is set. Divide.

The table 260 is movable in the X-axis direction and the Y-axis direction, and is provided so as to be able to turn around its central portion as indicated by a rotation arrow. The break bar 270 is connected to the drive motor 278 via a transmission unit 275 including a ball screw, and the rotational motion of the motor is converted into a force for pushing the break bar in the Z-axis direction by the transmission unit 275. The large substrate 150 is pressed by the pressing force.
In addition, as the drive motor, since a motor capable of precisely controlling the rotation speed, such as a servo motor, a pulse motor, or a linear motor, is used, for example, compared to a device that controls the press using an air cylinder. The pressing can be controlled with high accuracy. Furthermore, in the case of a device using an air cylinder, the movement of the break bar becomes abrupt (impact), whereas the device using a drive motor ensures the necessary pressing force, The descending speed can be kept constant (stabilized).

FIG. 8A is an enlarged view of the state when the large-sized element substrate 1a is cut along the scribe line B22 by the break device 250, as observed from the X-axis direction of FIG.
The table 260 has a configuration in which an elastic body 262 such as rubber is attached to a base 261 made of metal such as stainless steel or aluminum. Moreover, the structure which provided metal plates, such as stainless steel, on the elastic body 262 may be sufficient.
Moreover, the break bar 270 has a configuration in which a pressing body 272 made of an elastic body such as hard rubber is attached to the tip of a metal support bar 271. As shown in FIG. 8A, the cross section of the pressing body 272 has a substantially triangular shape, and the apex on the large substrate 150 side is provided with a roundness (tip R).
When the large-sized element substrate 1a is divided along the scribe line B22, the line is positioned immediately below the tip R of the pressing body 272 in the break bar 270, in other words, the extension of the scribe line and the tip R. The table 260 moves so as to overlap with the current direction.
Then, when the break bar 270 is lowered and the large CF substrate 30a is pressed, stress is generated with the tip R of the pressing body 272 as a fulcrum, and a crack is generated from the triangular cut shape of the scribe line B22. As shown, the large element substrate 1a is broken from the apex of the triangle toward the tip R.

Here, as the large element substrate 1a is divided, the common sealing material 5c is also divided. Specifically, the crack generated along the broken line propagates to the sealing material, and the common sealing material 5c is also divided along the broken line. This is because the break process is performed in a secondary cooling environment, so that the temperature of the large-sized substrate 150 is lowered and the hardness is higher than that at room temperature.
In particular, in terms of the difference in hardness from room temperature, the glass substrate slightly increases in hardness, but the ratio is small, but the hardness of the sealing material 5 increases at a larger ratio than the glass substrate.
That is, in the secondary cooling environment, the difference in hardness between the glass substrate and the sealing material 5 is smaller than that at room temperature, so that cracks are easily transmitted and the sealing material 5 is also cut together.

In particular, in this embodiment, the preferred secondary cooling temperature setting is −10 ° C., because the sealing material has a melting point of about −10 ° C. as described above.
Specifically, since the cured sealant 5 has characteristics close to amorphous, it is considered that the correlation with the melting point of the seal raw material exhibiting characteristics close to that of a crystalline polymer is considered to be poor. This is because the melting point is one threshold in the physical properties of the sealing material 5 according to the findings from the above.
Similarly, the lower limit temperature setting in the secondary cooling is set to −40 ° C. because the melting point of the filler material is about −40 ° C.
Specifically, since the filler 23 after curing has characteristics close to amorphous, it is considered that the correlation with the melting point of the filler material showing characteristics close to that of a crystalline polymer is poor. This is because, according to the knowledge from the data, the melting point is one threshold in the physical properties of the filler 23.

FIG. 8B is an enlarged view of the state when the large CF substrate 30a is cut along the scribe line B22 by the break device 250 as observed from the X-axis direction of FIG.
In step S8, the top and bottom of the large-sized substrate 150 in a state where the element substrate 1a side is divided are reversed, and a scribe line is placed on the large-sized CF substrate 30a side (second scribe step).
Specifically, it is set on the table 210 of the scribing apparatus 200 so that the large CF substrate 30a side is up, and a scribing line is formed by the ruled part 220 under the same conditions as in the first scribing process. Even when the element substrate 1a side is divided in a plane, the display region 6 and the sealing material 5 are fixed (adhered) in the thickness direction to one uncut CF substrate 30a. Therefore, it is possible to handle such as reversing as one large substrate 150.
The scribe lines form scribe lines B21 to B23 in the X-axis direction in FIG. 1, and then turn the table 210 by 90 ° to form scribe lines B11 to B13 in the Y-axis direction. Here, the scribe lines B22, B11 to B13 are formed so as to overlap with the lines formed on the element substrate 1a in the thickness direction (Z-axis direction). In other words, a scribe line is formed in the same portion in plan on both the front and back surfaces of the large substrate 150. The scribe lines B21 and B23 are formed only on the CF substrate 30a side.

In step S9, the large-sized substrate 150 is mounted on the breaking device 250, and the large-sized CF substrate 30a side is cut (second breaking step).
Specifically, the large-sized substrate 150 is divided by setting the large-sized element substrate 1a on the table 260 of the breaker 250 so that the large-sized element substrate 1a is on the upper side, and pressing with the break bar 270 along the scribe line.
As shown in FIG. 8B, when the large CF substrate 30a is divided along the scribe line B22, the line is positioned immediately below the tip R of the pressing body 272 in the break bar 270. Then, the table 260 moves so that the scribe line and the extending direction of the tip end R overlap each other.
Then, the break bar 270 descends and presses the large element substrate 1a side, so that stress with the tip R of the pressing body 272 as a fulcrum is generated, and a crack is generated from the triangular notch shape of the scribe line B22. As shown, the large CF substrate 30a is broken from the apex of the triangle toward the dividing line (tip R side) of the element substrate 1a. In the scribe lines B21 and B23, only the large CF substrate 30a side is cut, and the terminal portion 8 is exposed.
Thereby, the large-sized substrate 150 is cut into the state of the single display panel 100 shown in FIG.

In addition, even if it is a case where the common sealing material 5c is not cut | disconnected completely in a 1st breaking process, it will be divided in this 2nd breaking process reliably.
Moreover, although the press at the time of a cutting | disconnection demonstrated as what was the same setting by the 1st and 2nd break process, you may make it different. For example, the pressure in the first breaking step may be lower than the pressure in the second breaking step, and the common sealing material 5c may be cut together in the second breaking step.
In addition, after being divided into the state of a single display panel 100, the plurality of display panels are placed in a thermostat and gradually returned to room temperature so as not to cause condensation.
Moreover, in the said embodiment, although demonstrated as what performs all four processes of step S6 to S9 in the temperature-controlled room which set the temperature of secondary cooling, in the breaking process of step S7, S9, the large-sized board | substrate 150 is. What is necessary is just to be the said temperature. For example, before the break process is performed, the large-sized substrate 150 may be cooled and the break process may be performed quickly at room temperature. In this case, it is preferable to set the environment so that the large substrate 150 does not condense.

As described above, according to the display panel 100 and the manufacturing method thereof according to the present embodiment, the following effects can be obtained.
According to this manufacturing method, in the breaking process of step S7 (S9), the large-sized substrate 150 in a secondary cooled state is cut along the scribe lines B12 and B22 formed in the portion overlapping with the common sealing material 5c. Then, the single display panel 100 is cut out.
Therefore, by performing the cutting process in a state of becoming hard and fragile at a low temperature, cutting that was difficult at room temperature can be performed. In other words, by performing the cutting process in a state where the hardness difference between the glass substrate and the sealing material 5 is smaller than that at room temperature, cracks are easily transmitted and the glass substrate and the sealing material 5 are cut together. Can do.
Accordingly, it is possible to provide a method for manufacturing an electro-optical device that can cut a portion of a sealing material from a large-sized substrate and cut out a display panel.

Unlike a conventional display panel (FIG. 11A) in which a gap G in which no sealing material is formed is provided between adjacent display regions 6, according to the display panel 100, as shown in FIG. A common sealing material 5c is formed between them, and the top of the sealing material is cut.
Therefore, the outer size (L2 × H2) of the display panel 100 can be made smaller than the conventional outer size (L1 × H1) of the display panel. In other words, a narrow frame can be achieved.
Further, unlike the conventional display panel (FIG. 11A) in which the cavity portion 405 is formed on both sides of the terminal portion 8, according to the display panel 100, the terminal portion 8 is formed as shown in FIG. The sealing material 5 is exposed on the end faces of the three sides excluding the one side, and no cavity is formed.
Therefore, compared with the conventional display panel, it is possible to reduce the occurrence of cleaning liquid pool and the fear of deterioration of the terminal portion 8 due to the staying cleaning liquid. Furthermore, the end face can be quickly dried.

(Embodiment 2)
FIGS. 9A and 9B are diagrams showing an aspect in the breaking step of the manufacturing method according to the second embodiment, and correspond to FIGS. 8A and 8B.
Hereinafter, the manufacturing method according to Embodiment 2 of the present invention will be described with reference to FIG.
The manufacturing method in the present embodiment is different from that in the first embodiment in the structure of the table of the break device 250 (FIG. 7) in the break process.
Here, the description overlapping with the description in the first embodiment is omitted, and the configuration of the table will be mainly described. The same constituent parts will be described with the same numbers.

The manufacturing method of the present embodiment performs cutting in the breaking process more efficiently by utilizing the principle of leverage.
As shown in FIG. 9A, the break device 250 (FIG. 7) includes a table 265. The table 265 has a configuration in which an elastic body 266 such as rubber is pasted on a metal base 261.
Here, a concave portion 267 is formed in the elastic body 266 at a portion overlapping the scribe line B22. In other words, the recess 267 is formed so that the gap immediately below the scribe line is a gap. Except this point, it is the same as the table 260 of the first embodiment.

The manufacturing process is also the same as the flowchart of FIG.
In step S7, only the large element substrate 1a side is cut, but the fulcrum on the table 265 side at this time is the fulcrum e on the upper end of the wall surface (large substrate side) in the elastic body 266 forming the recess 267. f. Further, the width j1 of the recess 267 is set to, for example, about 3 to 20 mm, and the position is set so that the scribe line comes to the middle of the width j1.
Similarly, in step S9, the break bar 270 is lowered with the scribe line positioned in the middle of the recess 267, in other words, with the scribe line straddling the gap of the recess 267, the large bar By pressing the substrate 150, the large substrate is cut.
In the above description, the scribe line B22 has been described. Similarly, for the other scribe lines in steps S7 and S9, the break process is performed in a state in which the concave portion 267 is disposed across the line.

As described above, according to the present embodiment, in addition to the effects in the first embodiment, the following effects can be obtained.
According to this manufacturing method, since the recess 267 straddling the scribe line is formed, the fulcrum of the large substrate 150 on the table 265 side in the breaking process becomes the fulcrums e and f separated by the width j1.
Therefore, when pressing with the tip R of the pressing body 272 as a power point, the large substrate 150 is easily bent with the fulcrums e and f as fulcrums according to the principle of the lever, so that even with a small press, the apex of the triangle of the scribe line ( Cracks from the action point) are likely to grow.
In addition, since the pressing has a correlation with the length of the width j1, optimization can be achieved according to the size and thickness of the large-sized substrate, and the process design can have a width.
Therefore, it is possible to provide a method for manufacturing an electro-optical device that can cut out a portion of a sealing material from a large substrate and efficiently cut out a display panel.

(Embodiment 3)
FIG. 10 is a diagram illustrating an aspect in the breaking process of the manufacturing method according to the third embodiment, and corresponds to FIG.
Hereinafter, the manufacturing method according to Embodiment 3 of the present invention will be described with reference to FIG.
The manufacturing method in the present embodiment is different from that in the second embodiment in that the scribing process and the breaking process are performed once, and in the scribing process, all the scribe lines are put on both the front and back surfaces of the large-sized substrate.
Here, the same parts as those in the first and second embodiments are omitted, and differences will be mainly described. The same constituent parts will be described with the same numbers.

The manufacturing method of this embodiment is similar to the manufacturing method of Embodiment 2 in that the break process is performed using the principle of leverage, but the large-sized substrate is not cut by one side of the substrate, but by two sheets. The point which cut | disconnects a board | substrate collectively differs from Embodiment 2. FIG.
The manufacturing method of this embodiment is a flow in which steps S8 and S9 in the process flow of FIG. 4 are eliminated.
Specifically, in step S6, the scribe line that was entered in step S8 is also entered. That is, the scribe lines B11 to B13 and B22 are placed on the large element substrate 1a, and the scribe lines B11 to B13 and B21 to B23 are placed on the large CF substrate 30a.
In step S7, the large element substrate 1a side is set on the table 265, and only the large CF substrate 30a is cut along the scribe lines B21 and B23. Thereby, the terminal portion 8 is exposed.

Next, the large substrate 150 is sequentially cut along the scribe lines B11 to B13 and B22. FIG. 10 shows a state in which the scribe line B22 is cut, and the large-sized substrate 150 has a triangular shape of the line on both the front and back surfaces.
Here, the width j2 of the recess 267 is set wider than W1 in FIG. For example, the width j2 is set to about 5 to 30 mm, and the position is set so that the scribe line comes in the middle of the width j2.
In this state, the break bar 270 descends and presses the large substrate 150, thereby cutting the two large substrates together.
Due to the fact that scribe lines are formed at the same position on the front and back of the large substrate 150 and the lever principle of the recess 267 having the width j2, the large substrate having the fulcrums e and f as fulcrums is more easily bent. For this reason, the crack generated from the triangular vertex of the scribe line B22 in the CF substrate 30a grows at a stretch toward the triangular vertex (tip R side) of the scribe line B22 on the element substrate 1a side, and the common sealing material 5c. Can be cut together by a line indicated by a broken line.

In step S7, it is preferable that the pressure of the break bar at the time of cutting along the scribe lines B21 and B23 is smaller than the pressure at the time of cutting along the other scribe lines. This is because in the former case, it is sufficient if the pressure is necessary for cutting one substrate.
In the case of the manufacturing method of the present embodiment, the secondary cooling may be performed only in step S7.

As described above, according to the present embodiment, in addition to the effects in the first and second embodiments, the following effects can be obtained.
Compared to the process flow of the second embodiment, two processes (steps S8 and S9) can be omitted, so that the manufacturing efficiency can be improved.
Accordingly, it is possible to provide a method for manufacturing an electro-optical device that can cut a display panel more efficiently by cutting a portion of a sealing material from a large-sized substrate.

  Note that the present invention is not limited to the above-described embodiment, and various modifications and improvements can be added to the above-described embodiment. A modification will be described below.

(Modification 1)
FIG. 12 is a plan view showing an aspect of a large-sized substrate according to Modification 1, and corresponds to FIG. In the first embodiment, the large-sized substrate 150 on which four display panels are imposed has been described, but the number of impositions may be one.
Hereinafter, the description overlapping with the description in each of the above embodiments will be omitted. In addition, about the same component, it attaches | subjects and demonstrates the same number.

One large display panel 110 (width L3) larger than the display panel (width L2) shown in FIG.
In the case of manufacturing a large display panel 110, there may be a configuration of taking one piece for the convenience of manufacturing equipment. In such a case, the alignment mark M required in the manufacturing process is often put in the blank portion (ear portion) of the display panel 110. In this case, the large substrate 160 is cut at a position overlapping the sealing material 5. be able to.
Specifically, the sealing material 5 may be formed wide on three sides except one side where the terminal portion 8 is formed, and the large substrate 160 may be cut in the middle of the portion by any one of the above-described embodiments. . Even with this method, it is possible to obtain the same effects as those of the above embodiments.

(Modification 2)
FIG. 13 is an enlarged view of the breaking device according to the second modification, and corresponds to FIG.
In the break device of the first embodiment, the substrate facing the table side is cut, but the break bar side substrate may be cut.
Hereinafter, the description overlapping with the description in each of the above embodiments will be omitted. In addition, about the same component, it attaches | subjects and demonstrates the same number.
The break device 290 of FIG. 13 includes a break bar 291 and a table 292 that have a different configuration from the break device of FIG.
Specifically, the tip of the break bar 291 is divided into two forks. Each tip divided into two forks is referred to as tips Ra and Rb. The large substrate 150 is set on the table 292 with the large element substrate 1a facing upward (toward the break bar).
That is, the tips Ra and Rb of the break bar 291 are arranged across the scribe line B22.

The table 292 is configured by attaching an elastic body 293 such as rubber on a metal base 261.
Here, the elastic body 293 is provided with a convex portion 294 at a portion overlapping the scribe line B22.
In other words, the convex portion 294 for forming a convex shape immediately below the scribe line is formed. Although only one convex portion is shown in FIG. 13, a plurality of convex portions are periodically formed to support the large-sized substrate 150 substantially in parallel. Except this point, it is the same as the table 260 of the first embodiment.
In this configuration, when the break bar 291 that is the power point descends, the large-sized substrate bends with the convex portion 294 as a fulcrum according to the principle of leverage, and a crack is generated from the triangular apex of the scribe line B22 that is the action point, as shown by a broken line The large element substrate 1a and the common sealing material 5c are divided.
As described above, the break device 290 according to the present modification can be applied to each embodiment and modification, and can obtain the same effects.

(Modification 3)
FIG. 14 is an enlarged view of the sealing material in the display panel according to the modified example 3, and corresponds to FIG.
A configuration in which a bead-shaped spacer is mixed in the sealing material in each embodiment and modification may be employed.
Hereinafter, the description overlapping with the description in each of the above embodiments will be omitted. In addition, about the same component, it attaches | subjects and demonstrates the same number.
FIG. 14 is an enlarged view showing a state in which the crack BL generated from the scribe line B22 propagates to the common sealing material 5c in the breaking process of FIG. 8A.
Here, a bead-shaped spacer j is mixed in the sealing material according to this modification. As the spacer j, resin beads, glass beads, silica beads, glass fibers, or the like can be used. In the present modification, as a suitable example, an appropriate amount of glass spacer j is mixed into the sealing material. The diameter of the spacer j was set to be approximately the same as the cell gap (lamination of electro-optic materials). Specifically, the thickness is adjusted to the layer thickness (for example, about 5 to 100 μm) of each layer including the EL layer 15 (FIG. 3).

For this reason, as shown in FIG. 14, a plurality of spacers j having the same diameter as the cell gap are observed in the common sealant 5c after curing.
Here, in the breaking process, when the crack BL generated from the scribe line B22 reaches the common sealing material 5c, it propagates along the outer periphery of the nearest spacer j. In addition, since the spacer j is spherical, the portion where the crack propagates is substantially point-like, but since a plurality of spacers j are scattered in the portion overlapping the scribe line, the portion in the common sealing material 5c The growth of cracks along is promoted.
Therefore, the sealing material 5c can be cut more easily than when no spacer is mixed.
Therefore, by mixing bead-shaped spacers in the sealing material, the sealing material can be cut more efficiently in addition to the effects of the embodiments and the modified examples.

(Modification 4)
This will be described with reference to FIG.
In each of the above-described embodiments and modifications, the display panel is described as a top emission type organic EL panel, but may be a bottom emission method in which light is emitted from the element substrate 1 side.
The display panel is not limited to an organic EL panel, and any display panel may be used as long as an electro-optical material is sandwiched between display substrates surrounded by a sealing material between two substrates. For example, a liquid crystal panel, a plasma panel, an inorganic EL panel, or the like may be used.
Even if it is these structures, the effect substantially the same as said each embodiment and a modification can be acquired.

  DESCRIPTION OF SYMBOLS 1 ... Element board | substrate, 5 ... Sealing material, 5c ... Common sealing material, 6 ... Display area, 8 ... Terminal part, 15 ... EL layer as electro-optical substance, 23 ... Filler, 100, 110 ... As electro-optical apparatus Display panels, 150, 160, large substrates, 260, 265, 292, tables, 267, recesses as concave shapes, j, spacers, B11-13, B21-23, scribe lines.

Claims (12)

Two opposing substrates;
A display area in which an electro-optic material is sandwiched between the two substrates;
A manufacturing method for cutting out an electro-optical device configured to include a sealing material that partitions the display area from a large substrate on which one or more of the electro-optical devices are surfaced,
A cooling step for cooling the large format substrate;
A scoring step of forming a scribe line on at least one of the two substrates in the large substrate;
Cutting the large substrate by pressurizing along the scribe line, and
A method for manufacturing an electro-optical device, wherein a part of the scribe line is formed so as to overlap with the sealing material. The material of the substrate is inorganic glass,
The sealing material is made of a resin formed by applying a liquid sealing material to the one substrate and then curing the sealing material.
The method for manufacturing an electro-optical device according to claim 1, wherein a cooling temperature in the cooling step is a temperature equal to or lower than a melting point of the sealing material. The electro-optical material is an organic EL material containing an organic light emitting material,
In the display area, the organic EL material is covered with a filler,
The filler comprises a resin formed by applying a liquid filler material so as to cover the organic EL material, and then curing the filler material.
2. The method of manufacturing an electro-optical device according to claim 1, wherein the cooling temperature is a temperature equal to or lower than a melting point of the sealing material and higher than a melting point of the filler material.   The method of manufacturing an electro-optical device according to claim 3, wherein the cooling temperature is a temperature within a range of −10 ° C. to −35 ° C. 5. In the scoring step, the scribe line is also formed on the other substrate,
5. The electricity according to claim 1, wherein the scribe line on the other substrate is formed so as to overlap the scribe line formed on the one substrate in plan view. Manufacturing method of optical device. In the cutting step, the table on which the large substrate is set is formed with a concave shape such that a portion overlapping the scribe line becomes a gap, and both sides sandwiching the scribe line become fulcrums,
The method of manufacturing an electro-optical device according to claim 1, wherein the pressurizing is performed by applying pressure to the large-sized substrate from a surface opposite to the gap. The large format substrate has a plurality of the electro-optical devices attached thereto,
Between the adjacent electro-optical devices, the common sealing material straddling the two display areas is provided,
The method of manufacturing an electro-optical device according to claim 1, wherein in the ruled writing step, the scribe line is formed so that at least a part thereof overlaps the common sealing material. .   The electro-optical device according to claim 1, wherein each step from the cooling step to the cutting step is performed in a temperature environment substantially the same as the temperature environment in the cooling step. Manufacturing method.   The method for manufacturing an electro-optical device according to claim 1, wherein a bead-shaped spacer is added to the sealing material. The substrate is alkali-free glass,
The sealing material is an ultraviolet curable liquid material containing an epoxy resin,
The method for manufacturing an electro-optical device according to claim 1, wherein the filler material is a thermosetting transparent liquid material. The display area is substantially rectangular,
A terminal portion is formed on one side of the rectangle,
The method of manufacturing an electro-optical device according to claim 7, wherein the common sealing material is formed on at least two sides adjacent to the one side.   An electro-optical device manufactured by the manufacturing method according to claim 1.

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