CN105189808A

CN105189808A - Thin film cluster and thin film particle, and manufacturing methods therefor

Info

Publication number: CN105189808A
Application number: CN201380075548.6A
Authority: CN
Inventors: 李亨坤
Original assignee: Individual
Current assignee: Individual
Priority date: 2011-04-26
Filing date: 2013-04-17
Publication date: 2015-12-23
Anticipated expiration: 2033-04-17
Also published as: KR20120121299A; WO2012148192A2; CN105189808B; WO2012148192A3

Abstract

The present invention, which comprises two or more of thin film layers separated in the present state by a coated material combined under in-situ conditions and one or more of coated material layers blended between said two or more of thin film layers, relates to: a thin film cluster and a manufacturing method therefor, wherein the thin film, at the first vapor-deposition, has a maximum length at least 100 times greater than the thickness of the thin film layer, and when combined with the coated material, has a thin film cluster of which the length/thickness ratio is greater than or equal to two; and a thin film particle and a manufacturing method therefor, wherein a thin film particle is manufactured by an additional crushing process after removing at least a part of the coated material from the thin film cluster. According to the present invention, all of the problems related to the prior art indicated in the present document such as production of a manufacturing apparatus, and maintenance and repair, contamination of a thin film, wasting of energy and the like are solved.

Description

Film group, film particle and manufacture method

Technical field

The present invention relates to produced by physical vapor deposition method film group, film particle and manufacture method.

Physical vapor deposition also can be described as dry type plated film, compared to wet method, is nature environmental protection and harmless method, is therefore one of film forming method being used in various field.

Background technology

Recently, the technology utilizing nanoparticle or particulate to manufacture a product is widely used in every field.

The field and the product that use particulate and manufacture method thereof are as described below.As the particulate that the materials'use for the manufacture of conductive paste is made up of silver (Ag) or copper (Cu) or silver-bearing copper composite bed, but also in the important materials being used in the pigment, cosmetic material, sunscreen particle, pigment particles, sintering particle, cell active materials, solar cell, thermoelectric element, insulation component, catalyst particles, nano combined material etc. mixed in grout, paint and the ink being manufactured on green product LED chip and technology.

Summary of the invention

Described particulate or nanoparticle are in order to improve its quality and purity and the characteristic that will realize and preferably use the dry type film coating method by physical vapor deposition operation.But the described dry type film coating method major part by physical vapor deposition operation completes in vacuum vessel, therefore productivity reduces, and cost uprises.Therefore, the particulate production method by chemical wet operation instead of described physical vapor deposition method is used in production building site.

Pass through because of unavoidable reason physical vapor deposition method produce particulate time, its productivity is very low and the cost of product is very high, therefore use field or product restricted.

Look-ahead technique for solving described problem is roughly divided into two classes, and described two classes are discharged to vacuum vessel outside, and pulverize after smearing the thin film layer of big area or volume under (INSITU) state all in position, manufactures film group or film particle.

Below technical Analysis is carried out in detail.

First, the first kind is the United States Patent (USP) 6398999BI form as Avery Dennison Corp, after the thin film layer utilizing the manufacture of multi-layer thin rete to obtain in position under state, this thin film layer is utilized to obtain film group or film particle, as above in order to manufacture multilayer film, manufactured the multilayer film group of thin film layer that the multilayer that is alternately arranged will obtain and soluble film layer by evaporation coating method evaporation solubility (or release) thin film layer between thin film layer and thin film layer after, be discharged to vacuum vessel outside, after once pulverizing, pulverize further after dissolving in solvent to dissolve described soluble film layer, obtain film particle thus.

Equations of The Second Kind is United States Patent (USP) 4168986 form as Polaroid Corp, before the thin film layer that evaporation will obtain, first in vacuum vessel by after solubility (or release) thin film layer evaporation is on coated base material, the thin film layer that will obtain described in evaporation, and in order under state in position, from thin film layer described in coated material separation, be sent to disengagement chamber, after solubility (or release) thin film layer dissolving described evaporation in solvent is separated, coated material is re-moved to side, evaporation chamber, again evaporation soluble film layer and the thin film layer that will obtain, and this operation repeatedly, thus a large amount of production film particle.

Described two kinds of mass production methods necessarily improve the productivity of film particle by physical vapor deposition method, and reduce costs, but in fact can not be adapted on production building site or critical constraints because of following problem.

Described first method in look-ahead technique, the alternately described thin film layer that will obtain and soluble film layer and evaporation successively, and be the mode of evaporation a cycle period while, therefore, except the evaporation source (EVAPORATIONSOURCE) for evaporating the thin film layer that will obtain, also need the evaporation source for evaporating soluble film layer in addition, for supplying the additional unit such as evaporation supply unit and/or the evaporation shield (SHUTTER) being incorporated into evaporation source of described evaporation source energy, therefore the manufacture of vacuum unit and structure very complicated and maximize, and the enforcement of operation and operation management also very difficult.

Larger problem is, in order to the alternately described thin film layer evaporation that will obtain and soluble film layer evaporation, needs in a loop cycle, evaporate described two materials simultaneously.When evaporating two materials simultaneously, must in identical vacuum vessel, make the vapor phase mutual diffusion of described two materials and interfere, cause thus in each thin film layer containing different materials.This reduces the purity of each thin film layer, quality and characteristic greatly.

Except described problem, described soluble film layer mainly utilizes the high organism of vapour pressure to be formed, inner and vacuum comb and vacuum pump system etc. the pollution of vacuum vessel caused because of described inorganics steam will become serious as time goes by gradually, can affect total system thus.

By as above process, when polluting vacuum pump and system because of described source of pollution, the result damaging production equipment function completely finally can be caused.Therefore, described first method needs to solve for problems such as the pollution problem of described device and film and film characteristics reductions.

Described second method in look-ahead technique, before the thin film layer that will obtain described in evaporation, first on coated base material after evaporation soluble film layer, the thin film layer that evaporation will obtain on the coated base material that described evaporation has soluble film layer, then the separation vessel region for separating of film is sent to, after utilizing designated solvent to be separated the described thin film layer that will obtain from described coated base material, the coated base material of separating film layer is retransmitted to evaporation region, evaporation and separation circuit repeatedly, thus in the separation vessel completing described separation circuit, film particle can be collected in a large number.Although described film particle production method concept idea is outstanding, there is in implementation process various problem, therefore, be difficult to realize because of problems such as the manufacture of its device or the mass defects of operation and product.

Described two kinds of mass production methods use with the operation of steam condition evaporation soluble film layer, therefore in order to improve the vapour pressure of described soluble substance, need the heating process being heated to high temperature.In order to implement described heating process, needing to increase heating source and powering, being therefore attended by waste energy problem.

Larger problem is, in order to be separated described soluble film layer, the coated base material completing thin film layer evaporation is not only needed to be sent to separation vessel region, also in order to the coated base material completing thin film separation is retransmitted to evaporated receptacles region, described evaporated receptacles and its vacuum tightness of separation vessel can be different, but vacuum environment is identical with space requirement.Therefore, its steam of solvent used to be separated described soluble film layer reaches serious level, and is diffused into described evaporated receptacles region and becomes source of pollution, thus causes problem in various part and region.

In order to solve described problem, the invention provides film group manufacture method, the film group manufactured thus and film particle, in order to the method by not causing above problem improves productivity and quality, under state, produce a large amount of film groups in position, and manufacture film group and film thus.The method of coated material is inserted between thin film layer and thin film layer, it uses the method removing the pollution problem caused because of the high vapour pressure of each material described, thus do not cause above problem, and thin film layer and the mixed film group of coated material can be obtained.

The present invention has following effect.That is, as having very high quality and characteristic, and environmentally friendly film production method uses physical vapor deposition method, can supply film group and film in a large number thus with nominal price.

When manufacturing described film group and film particle, can not only reduce the size of vacuum unit, structure and cost, the space needed when can also greatly reduce to produce and area, therefore, it is possible to the economical film that production cost is low.

When manufacturing described film group and film particle, improving the quality of product itself, and greatly reducing contamination phenomenon and the failure rate of vacuum unit, the manpower needed when significantly reducing maintenance, part cost and time.

Accompanying drawing explanation

Fig. 1 (first) is the state graph being alternately coated with coated material 3 and thin film layer 1 on support base material 5.

Fig. 1 (second) is the state graph of removing coated material 3 under the state of Fig. 1 (first).

Fig. 1 (third) be under the state of Fig. 1 (second) thin film layer 1 by the state graph of pulverizing more than 1 time.

Fig. 2 (first) is the state graph of once evaporated film layer 1 in the one side of coated material 3.

In coated material 3, the state graph that thin film layer 1 carries out mixing is pushed under the state that Fig. 2 (second) is Fig. 2 (first).

Fig. 2 (third) is the state graph of secondary evaporated film layer 1 on the coated material 3 under Fig. 2 (second) state.

Fig. 2 (fourth) is the state graph that the thin film layer 1 pushing further evaporation under the state of Fig. 2 (third) in coated material 3 carries out mixing.

Fig. 2 (penta) is the state graph of three evaporated film layers 1 on the coated material 3 under Fig. 2 (fourth) state.

Fig. 2 (own) is the state graph that the thin film layer 1 pushing further evaporation under the state of Fig. 2 (penta) in coated material 3 carries out mixing.

Fig. 2 (heptan) is the state graph of four evaporated film layers 1 on the coated material 3 under Fig. 2 (own) state.

Fig. 3 (first) is the state graph that on support base material 5, evaporation possesses the thin film layer 1 of coated material 3.

Fig. 3 (second) is the state graph that separating film layer 1 and carrying out in other space is collected under the state of Fig. 3 (first).

Fig. 3 (third) is the state graph of evaporated film layer 1 again on the coated material 3 under Fig. 3 (second) state.

Fig. 3 (fourth) is the state graph of carrying out together with separating film layer 1 and the thin film layer 1 collected in other space and Fig. 3 (second) collecting under the state of Fig. 3 (third).

Fig. 3 (penta) is the state graph of evaporated film layer 1 again on the coated material 3 under Fig. 3 (fourth) state.

Fig. 3 (own) is the state graph of carrying out together with separating film layer 1 and the thin film layer 1 collected in other space and Fig. 3 (second) collecting under the state of Fig. 3 (penta).

Fig. 4 (first) is the state graph having coated base material 7.

Fig. 4 (second) is the state graph that evaporation has thin film layer 1 on of coated base material.

Fig. 4 (third) is the state graph engaging parting material 9 on the thin film layer of evaporation.

Fig. 4 (fourth) is the state graph that the thin film layer of evaporation is separated from coated base material with parting material simultaneously.

Fig. 4 (penta) is that evaporation has the state graph of thin film layer 1 again on coated base material.

Fig. 4 (own) is bonded to the state graph of parting material on the thin film layer of evaporation.

Fig. 4 (heptan) is the state graph that the thin film layer of evaporation is separated from coated base material with parting material simultaneously.

Reference numeral:

1: thin film layer, 3: coated material, 5: carrier (support base material), 7: coated base material, 9: parting material

For the optimal morphology carried out an invention

In order to solve described problem, the film group of a form of the present invention, it to be included under home state at least two film layers that existed with separate stage by the coated material of mixing and coated material more than described one deck be at least mixed with between two film layers, described thin film layer its maximum length under evaporation state is more than 100 times of thin film layer thickness, is more than 2 times with its length of thin film layer of described coated material mixing and the ratio of thickness.

Described thin film layer is the thin film layer formed by physical vapor deposition method (physicalvapordeposition), during evaporation described thin film layer the surface being formed in described coated material at least partially on, at least one deck in described thin film layer is described coated material is shape further under state in position become after at least other thin film layers, a more than part for the coated material of described further formation is formed in by physical vapor deposition method, in the coated material of described further formation is by causing displacement without applying physics strength with the state with the stated limit viscosity of the mobility keeping described coated material to described coated material under state in position with the process of steam condition evaporation and formed at least partially, the thickness of described thin film layer is more than 0.1 nanometer less than 50 microns, described coated material is fluidity substance or plastic material, at least one surface mass saturated vapor pressure at 25 DEG C of described coated material is below 100 holders, softening temperature is less than 650 DEG C simultaneously.

Described in its Thickness Ratio of described coated material of described thin film layer coating time point, the thickness of thin film layer is thick, viscosity is more than 10cps, be blended in the coated material between described thin film layer and also cause displacement without with the process of steam condition evaporation with the state of the mobility keeping coated material at least partially, mix under state in position, the mixed processes of the coated material described in being blended at least between two film layers is after at least one layer film layer in described thin film layer is formed in the surface of described coated material, state completes in position, the coated material mixed under described home state does not adopt the mode of dissolving coated material in solvent, mix by least applying physics strength to described coated material without the need to solvent, being pulverized at least partially in the thin film layer of final described film group is that less than 1/100 of size in film vapor deposition operation uses.

The film group of other forms of the present invention, it to be included under home state at least two film layers that existed with separate stage by the coated material of mixing and coated material more than described one deck be at least mixed with between two film layers, described thin film layer its maximum length under evaporation state is more than 100 times of thin film layer thickness, is more than 2 times with its length of thin film layer of described coated material mixing and the ratio of thickness.

Described thin film layer is the thin film layer formed by physical vapor deposition method (physicalvapordeposition), during evaporation described thin film layer the surface being formed in described coated material at least partially on, at least one deck in described thin film layer is formed in by physical vapor deposition method under state in position the above thin film layer of other one decks together with a part for coated material from described coated material (or carry body) be separated and more than the part of the lingering section (or carrier) of described coated material exposed or to one of the coated material that the lingering section (or carrier) of described coated material is supplied further more than pointthin film layer, in the coated material of described further supply is by causing displacement without applying physics strength with the state with the stated limit viscosity of the mobility keeping described coated material to described coated material under state in position with the process of steam condition evaporation and supply at least partially, the thickness of described thin film layer is more than 0.1 nanometer less than 50 microns, described coated material is fluidity substance or plastic material, at least one surface mass saturated vapor pressure at 25 DEG C of described coated material is below 100 holders, softening temperature is less than 650 DEG C simultaneously, described in its Thickness Ratio of described coated material of described thin film layer coating time point, the thickness of thin film layer is thick, viscosity is more than 10cps, to be blended in the coated material between described thin film layer at least partially also without with the process of steam condition evaporation through coated material with the above thin film layer of described one deck together from the process that other parts (or carrier) of described coated material are separated and collect, and mix under state in position together with described thin film layer, the mixed processes of the coated material described in being blended at least between two film layers is after at least one layer film layer in described thin film layer is formed in the surface of described coated material, state completes in position, the coated material mixed under described home state does not adopt the mode of dissolving coated material in solvent, without the need to solvent by applying physics strength to described coated material and described thin film layer, and described thin film layer is at least pulverized once above mixing, being pulverized at least partially in the thin film layer of final described film group is that less than 1/100 of size in film vapor deposition operation uses.

The film group of other another forms of the present invention, it to be included under home state at least two film layers that existed with separate stage by the parting material of mixing and at the above parting material of described one deck be at least mixed with between two film layers, described thin film layer its maximum length under evaporation state is more than 100 times of thin film layer thickness, and the ratio of its length of the thin film layer mixed with described parting material and thickness is more than 2 times.

Described thin film layer is the thin film layer being formed (coating) by physical vapor deposition method (physicalvapordeposition), during evaporation described thin film layer the part being formed in described coated base material 7 surface at least partially on, after in the part being formed in described coated substrate surface, after engaging with described parting material 9 under state in position, be separated from described coated base material together with described parting material, at least one deck in described thin film layer is after the above thin film layer of one deck be first formed on described coated base material engages with described parting material, after being separated from described coated base material together with described parting material, again to be formed under state in position on described coated base material and to be separated, at least two-layer its in described thin film layer is respectively formed at described coated base material and the time point difference be separated from described coated base material, surface at least partially in described coated base material is the face of the process be at least repeatedly separated after the above thin film layer of one deck described in identical place forming for twice, described parting material is without being undertaken moving by physics strength instead of evaporation operation under state in position with the process of steam condition evaporation and engaging with described thin film layer, also be separated from described coated base material together with described thin film layer by physics strength, there is stated limit viscosity to have the material of mobility at the time point engaged with described thin film layer and designated duration, the bonding force of described thin film layer and described coated base material is more weak than the bonding force of described thin film layer and described parting material, the thickness of described thin film layer is more than 0.1 nanometer less than 50 microns, described parting material is fluidity substance or plastic material, at least one surface mass saturated vapor pressure at 25 DEG C is below 100 holders simultaneously, softening temperature is less than 650 DEG C, the physics strength of use at least partially in the process engaged with described thin film layer and the process of mixing instead of evaporation operation, being pulverized at least partially in the thin film layer of described film group is that less than 1/100 of size in film vapor deposition operation uses.

Described coated base material is the concept different from coated material, and the part being preferably fabricated at least surface has release.Coated substrate material itself can be the material with release, but also can form the above release layer of one deck at coated substrate surface and use.This be in order to by evaporation when the described thin film layer of described coated substrate surface is separated together with described parting material, easily can complete operation.Now, the method for giving release does not belong in category of the present invention, implements by known look-ahead technique.The various materials such as aluminium, aluminum oxide epithelium, rubber resin, silicon oxide epithelium, Teflon can be used, but be not limited thereto.

The film group manufacture method of other another forms of the present invention, it to be included under home state at least two film layers that existed with separate stage by the coated material of mixing and coated material more than described one deck be at least mixed with between two film layers, described thin film layer its maximum length under evaporation state is more than 100 times of thin film layer thickness, is more than 2 times with its length of thin film layer of described coated material mixing and the ratio of thickness.

Described manufacture method comprises: the step preparing more than one coated materials (plural number), prepare the step of more than one coated materials (plural number), described coated material and coated material are loaded into (load) to the step in vacuum vessel, to be formed by described coated material and the step a of the above thin film layer of one deck formed by physical vapor deposition method smearing at least partially of described coated material, in thin film layer more than one deck of described step a floating coat at least partially above form further the step b of (or mobile) coated material, the coated material formed further in described step b or step b2 at least partially further coating by the step a2 of the above thin film layer of one deck of described coated material, in thin film layer more than one deck of described step a2 floating coat at least partially above form further the step b2 of (or mobile) coated material, and the step r of more than twice operation from described step a2 to step b2 repeatedly, described coated material is fluidity substance or plastic material, at least one surface mass saturated vapor pressure at 25 DEG C is below 100 holders simultaneously, softening temperature is less than 650 DEG C, at least when being formed in described step b and step b2 and forming (or mobile) coated material further, described coated material be by without with the process of steam condition evaporation with the state of the stated limit viscosity with the mobility keeping described coated material, at least cause displacement to described coated material applying physics strength and formed.

Described step a, step b, step a2, step b2 and step r completes under state in position, the mixed processes being at least blended in the coated material between described two-layer above thin film layer is that at least one layer film layer in described thin film layer is formed in after on described coated material surface, complete under state in position, the coated material mixed under described home state does not adopt the mode of dissolving coated material in solvent, mix by applying physics strength to described coated material without the need to solvent, described in its Thickness Ratio of described coated material of at least described thin film layer coating time point, the thickness of thin film layer is thick, viscosity is more than 10cps.

Described manufacture method comprises: the step preparing coated material, prepare the step of more than one coated materials, described coated material and coated material are loaded into the step in vacuum vessel, to be formed by described coated material and the step a of the above thin film layer of one deck formed by physical vapor deposition method smearing at least partially of described coated material, the steps d at least partially the thin film layer of more than one deck of described step a floating coat and described coated material is separated in from described coated material (or carrier), in position under state, supplied the step S of coated material further by the residual part of described coated material remaining in described steps d (or steps d 3) or solid support material, in described step S, the coating at least partially of the coated material of further supply is by the step a3 of the above thin film layer of one deck of described coated material, the steps d 3 at least partially the thin film layer of more than one deck of described step a3 floating coat and described coated material is separated in from described coated material (or carrier), and repeatedly more than twice from described step S to described step a3, the step r of the operation of d3, described coated material is fluidity substance or plastic material, at least one surface mass saturated vapor pressure at 25 DEG C is below 100 holders simultaneously, softening temperature is less than 650 DEG C, the coated material mixed with thin film layer under described home state carries out moving changing position at designated duration to keep once the state of above mobility, when supplying coated material further in described step S, described coated material be by without with the process of steam condition evaporation with the state of the stated limit viscosity with the mobility keeping described coated material, at least apply physics strength to described coated material and cause displacement, supply thus.

Described step a, steps d, step S, step a3, steps d 3 and step r complete under state in position, the mixed processes being at least blended in the coated material between described two-layer above thin film layer is that at least one layer film layer in described thin film layer is formed in after on described coated material surface, complete under state in position, the coated material mixed under described home state does not adopt the mode of dissolving coated material in solvent, without the need to solvent by applying physics strength to described coated material and described thin film layer and make described thin film layer pulverize at least one times and mix, described in its Thickness Ratio of described coated material of at least described thin film layer coating time point, the thickness of thin film layer is thick, viscosity is more than 10cps.

The film group manufacture method of other another forms of the present invention, it to be included under home state at least two film layers that existed with separate stage by the coated material of mixing and at the above parting material of described one deck be at least mixed with between two film layers, described thin film layer its maximum length under evaporation state is more than 100 times of thin film layer thickness, and the ratio of its length of the thin film layer mixed with described parting material and thickness is more than 2 times.

Described manufacture method comprises: the step preparing coated base material, prepare the step of more than one coated materials, prepare the step of more than one parting materials, by the step that described coated base material, coated material and parting material arrange or be loaded in vacuum vessel, to be formed by described coated material and the step a of the above thin film layer of one deck formed by physical vapor deposition method smearing at least partially of described coated base material, be bonded with each other the above thin film layer of one deck of described step a floating coat and the step 1 of described parting material, the step m of described thin film layer and the parting material be bonded with each other described step 1 is separated in from coated base material, after described step m (or step m5) at least surface a part by more than the part of described coated base material exposed again coating to be formed by described coated material and the step a5 of the above thin film layer of one deck formed by physical vapor deposition method, be bonded with each other the above thin film layer of one deck of described step a5 floating coat and the step 15 of described parting material, the step m5 of described thin film layer and the parting material be bonded with each other described step 15 is separated in from coated base material, and repeatedly more than twice from described step a5 to step 15, the step r of m5, described step a, step 1, step m, step a5, step 15, step m5 and step r completes under state in position, the described parting material mixed with described thin film layer under described home state mixes by applying physics strength without the need to solvent, in described mixing process, described thin film layer and described parting material are at least pulverized once, described parting material is without being undertaken moving by physics strength instead of evaporation operation under state in position with the process of steam condition evaporation and engaging with described thin film layer, also be separated from described coated base material together with described thin film layer by physics strength, there is stated limit viscosity to have the material of mobility at the time point engaged with described thin film layer and designated duration, the bonding force of described thin film layer and described coated base material is more weak than the bonding force of described thin film layer and described parting material, the mean thickness of described parting material is thicker than the mean thickness of described thin film layer, the thickness of described thin film layer is more than 0.1 nanometer less than 50 microns, described parting material is fluidity substance or plastic material, at least one surface mass saturated vapor pressure at 25 DEG C is below 100 holders simultaneously, softening temperature is less than 650 DEG C, the physics strength of use at least partially in the process engaged with described thin film layer and the process of mixing instead of evaporation operation, being pulverized at least partially in the thin film layer of described film group is that less than 1/100 of size in film vapor deposition operation uses.

According in the film group manufacture method of other another forms of the present invention, described coated material is the free-flowing material under normal temperature.Described coated material is thermoplastic material, in position under state in order to designated duration has mobility, even and if by heating by the state of hot melt, also can be a form of the present invention.Described coated material is positioned at above support base material at least partially, can be made as have designated shape with independence (free-standing) state as thermoplastically material.

According in the film group manufacture method of other another forms of the present invention, in described step b, step b2, step S, in the described coated material of further supply is not move from other places and supply at least partially, but the coated material that the part that the described thin film layer through coating causes displacement and is positioned at the coated material of described thin film layer bottom is supplied again by exposing.

According in the film group manufacture method of other another forms of the present invention, in described step b, the method for the coated material of formation is selected from more than one in the method on the method increasing coated material on the thin film layer of described step a floating coat and the thin film layer top part in the coated material of the thin film layer bottom of described step a floating coat being moved to step a floating coat further.

According in the film group manufacture method of other another forms of the present invention, described pulverizing process completes under state in position, from described pulverizing process to terminate in designated duration, on the coated material mixed with the thin film layer of described pulverizing, form at least thin film layer further.In the present invention, home state refers to the state completed in the vacuum vessel that carries out in film operation, namely under atmospheric pressure state, rests on the state in vacuum vessel before unloading described coated material or thin film layer.

According in the film particle of other another forms of the present invention, remove a more than part for described coated material from described film group, and carry out pulverizing to reach the size of specifying further and obtain.

According in the film particle manufacture method of other another forms of the present invention, the enterprising stepping of described film group manufacture method be about to described film group remove ornaments and formal dress vacuum vessel outside step, remove described coated material a part more than step and the step pulverized further as specifying size.The all film particles obtained in the present invention can provide further across with after the analysis of size of particles and classifying step according to known technology.

According in the film group manufacture method of other another forms of the present invention, it more than the part in described thin film layer is the thin film layer of the multi-ply construction comprising other materials at least two-layer.Such as, the chemical stability of at least one deck of described thin film layer is higher than the chemical stability of other one decks.

According in the film group manufacture method of other another forms of the present invention, the time point of thin film layer described in evaporation, the surface shape of described coated material is as the form of be in depression at least two place's solid figures portion and/or protuberance, and above at least partially in described thin film layer (plural number) is formed as three-dimensional shape.

According in the film group of other another forms of the present invention, described thin film layer is multi-ply construction, and the thin film layer of outside surface is compared to the high coating material of other thin film layer chemical stability.

According in the film group of other another forms of the present invention, at least one deck in described thin film layer has the film blocking characteristic ultraviolet (absorbing and/or reflection function).

According in the film group of other another forms of the present invention, in described thin film layer is stupalith at least partially.

According in the film group of other another forms of the present invention, in described thin film layer is cosmetics material or tinting dye at least partially.

According in the film group of other another forms of the present invention, in described thin film layer is conducting metal or heat conducting material at least partially.

According in the film group of other another forms of the present invention, the ratio of its length/width at least partially in described thin film layer is more than 10, has long band form or has the band shape in designated shape cross section.The scale of its width of the film of described form and length is nano level or micron order, and this is the structure being conducive to industry, can by manufactures such as nano threads.

According in the film group manufacture method of other another forms of the present invention, described coated material is formed at more than the one side of the carrier (support base material) of specifying, and described carrier (support base material) is film or roller or tape loop.

For the form carried out an invention

When explanation manufacture method of the present invention, be illustrated as each step as described in step a, step b, steps d have any different, therefore the enforcement time point that can be regarded as each step is had any different, but can be embodied as each step be arranged in order in each step and implement region iterative cycles simultaneously, it is conducive to improving productivity.A form for implementing described operation can be described above, arranges described coated material more than the one side of the carrier of specifying, and described carrier can use long film morphology or the roller repeatedly rotated or tape loop, but is not limited thereto.

The present invention has the multi-ply construction comprising described film group or film particle and described two-layer other materials above, but the film group of three-dimensional formation or film particle can be used in the various fields such as cosmetics material, pigment, coating, medical material, electronic material, catalyst particle or cell active materials.Moreover, as the useful form of described film, at least the conductance of one deck or thermal conductivity are greater than conductance or the thermal conductivity of other one decks.The various electronics connector element such as actual load or distribution that described structure can be used as electronic component uses.

Film group of the present invention or its coated material of film particle are yielding material or plastic material, therefore in each thin film layer described specifying the designated duration of time point, without the need to solvent just can be separated from each other, mutual position changes at least partially.As mentioned above, the one in the optional auto flowability material of coated material or plastic material, saturated vapor pressure uses fully low vapour pressure in case affect the formation of physics evaporated film.

Described mixing refers to and comprises thin film layer, coated material and the material of the above thin film layer of one deck that formed further neatly stacked state and the state that mutually mixes with chaotic state as Suo Shi Fig. 2 (heptan) and Fig. 3 (own) as shown in Fig. 1 (first).Described thin film layer is when under initial evaporation state, its maximum length is less than 100 of thin film layer thickness, quality can be enhanced, but greatly reduce productivity and there is no economy, when the ratio of the length/thickness with the thin film layer under described coated admixture is less than 2, not film (THINFILM) form but nanoparticle (NANOPARTICLE) form, therefore can not production the present invention film particle that will provide.

In order to produce a large amount of thin film layers with appointed thickness, distinguish the mixing of the coated material between described thin film layer and thin film layer under needing state in position, but the mixing of coated material does not need through steam condition.This is because by when under steam condition, the method for evaporation between thin film layer and thin film layer mixes, the vapor phase mutual diffusion of each other materials described and mixing, produce pollution substance and reduce purity and the quality of film, and the pollution of vacuum unit and part and the problem such as to raise the cost can also be caused.

Therefore, in order to mix coated material without steam condition between described thin film layer and thin film layer, coated materials'use fluidity substance of the present invention or plastic material, and suitably utilize this material characteristic and to be separated from each other thin film layer and thin film layer described in state evaporation.Described coated material be fluidity substance especially normal temperature fluidity substance time, without the need to heating, therefore operation is very simple.

But in order to make described thin film layer have three-dimensional shape or designated shape, when described coated material is fluidity substance, accurate shape adjustments can be restricted.Now, use heating flow material or thermoplastically material and when using method for stamping, the three-dimensional shape of the film that heated die (MOLD) can be used will to manufacture in the surface imprint of described coated material, therefore, it is possible to the film that continuous seepage is corresponding with the three-dimensional shape on described mould.

As mentioned above, when using the coated material of mobility, evaporization process is utilized just can between described thin film layer, to utilize mechanical force to mix coated material without the need to the operation of carrying out evaporation through steam condition, therefore, it is possible to the film group that the state providing the mutual pollution problem or other problems solving above steam molecule manufactures.

This operation can only at least one layer film in described thin film layer be formed in coated material surface after implement, now could complete with described at least one layer film layer and mix, and complete under state in position and could keep high productivity.

At least one deck in described thin film layer is that described coated material is formed in further after at least one layer film layer under state in position and is formed in described coated material surface, film could be produced in a large number, now also should be formed by physical vapor deposition method and could meet above object of the present invention.

Described coated material does not use by heating the operation of carrying out evaporating, but under preferred normal temperature state in vacuum unit, its saturation steam forces down.Under normal temperature state in vacuum unit, saturated vapor pressure is that in the following material of 100 holders, saturated vapor pressure is more low better.When being used as coated material by the material more than 100 holders, although variant because of the structure and characteristics of physical vapor deposition device, the steam because of coated material hinders or pollutes the formation of thin film layer and cause serious problems.

Described coated material require in position state carries out the operation of movement in few designated duration by applying physics strength, therefore need to use fluidity substance or plastic material, the softening temperature that described coated material is softened as removable state is more low better.

But in order to widen the range of choice of coated material substance, described softening temperature is preferably less than 650 DEG C.When using the coated material of softening temperature higher than this temperature, need to consume a lot of energy to temperature be brought up to described softening temperature, and physical vapor deposition device also in order to process the coated material of high temperature, its structure complicates, therefore tight choosing structure and material.

The described coated material that described thin film layer smears time point is formed as film thickness described in Thickness Ratio.When the thickness of coated material is formed as thinner than the thickness of described thin film layer, need to use physical vapor deposition method, it is the method departing from scope to use this physical vapor deposition method to form coated material, and in order to the structure implementing its physical vapor deposition device of the method very complicated, and need operation also strict.

In position under state, the coated material of described mixing does not comprise solvent.Its vapour pressure of most solvent is very high and become the reason of the vacuum polluted in vacuum unit, and can also affect the numerous parts such as vacuum pump.Therefore, described coated material causes displacement not have the state of solvent, and mixes with described thin film layer.

Finally, less than 1/100 of size when being evaporation operation by pulverizing at least partly in the thin film layer of described film group, as above a part for crushing process can be implemented in process in position, but can utilize after being unloaded to vacuum vessel outside to pulverize and sort special purpose device and carry out as required.

When the viscosity of described coated material is below 10cps, described thin film layer is difficult to the film morphology keeping specified requirements under evaporation state, and its thickness also will belong in specialized range.

When thin film layer thickness is below 0.1 nanometer, be difficult to keep thin film layer form, when higher than 50 microns, described thin film layer is difficult to be ground into trickle film, and waste material, and film vapor deposition expense also increases.The film group utilizing above condition to obtain is in position under state or under the state being unloaded to vacuum vessel outside, and it is the film particle of less than 1/100 size that the area can produced compared to the time point of evaporation is pulverized.

Industrial utilization possibility

Membrane according to the invention group, film and manufacture method, as the particulate that the materials'use for the manufacture of conductive paste is made up of silver (Ag) or copper (Cu) or silver-bearing copper composite bed, but also in the important materials being used in the pigment, cosmetic material, sunscreen particle, pigment particles, sintering particle, cell active materials, solar cell, thermoelectric element, insulation component, catalyst particles, nano combined material etc. mixed in grout, paint and the ink being manufactured on green product LED chip and technology.

Claims

1. a film group, it to be included under home state at least two film layers that existed with separate stage by the coated material of mixing and coated material more than described one deck be at least mixed with between two film layers, described thin film layer its maximum length under evaporation state is more than 100 times of thin film layer thickness, it is more than 2 times with its length of thin film layer of described coated material mixing and the ratio of thickness, it is characterized in that

Described thin film layer is the thin film layer formed by physical vapor deposition method, during evaporation described thin film layer the surface being formed in described coated material at least partially on, at least one deck in described thin film layer is that described coated material is formed under state after at least on other thin film layers in position further, a more than part for the coated material of described further formation is formed in by physical vapor deposition method, in the coated material of described further formation is by causing displacement without applying physics strength with the state with the stated limit viscosity of the mobility keeping described coated material to described coated material under state in position with the process of steam condition evaporation and formed at least partially, the thickness of described thin film layer is more than 0.1 nanometer less than 50 microns, described coated material is fluidity substance or plastic material, at least one surface mass saturated vapor pressure at 25 DEG C of described coated material is below 100 holders, softening temperature is less than 650 DEG C simultaneously

2. a film group, it to be included under home state at least two film layers that existed with separate stage by the coated material of mixing and coated material more than described one deck be at least mixed with between two film layers, described thin film layer its maximum length under evaporation state is more than 100 times of thin film layer thickness, it is more than 2 times with its length of thin film layer of described coated material mixing and the ratio of thickness, it is characterized in that

Described thin film layer is the thin film layer formed by physical vapor deposition method, during evaporation described thin film layer the surface being formed in described coated material at least partially on, at least one deck in described thin film layer is formed in the above thin film layer of other one decks by physical vapor deposition method under state to be in position separated from described coated material (or carrier) together with a part for coated material and more than the part of coated material of supplying further more than the part of the lingering section (or carrier) of described coated material exposed or to the lingering section (or carrier) of described coated material thin film layer, in the coated material of described further supply is by causing displacement without applying physics strength with the state with the stated limit viscosity of the mobility keeping described coated material to described coated material under state in position with the process of steam condition evaporation and supply at least partially, the thickness of described thin film layer is more than 0.1 nanometer less than 50 microns, described coated material is fluidity substance or plastic material, at least one surface mass saturated vapor pressure at 25 DEG C of described coated material is below 100 holders, softening temperature is less than 650 DEG C simultaneously, described in its Thickness Ratio of described coated material of described thin film layer coating time point, the thickness of thin film layer is thick, viscosity is more than 10cps, to be blended in the coated material between described thin film layer at least partially also without with the process of steam condition evaporation through coated material with the above thin film layer of described one deck together from the process that other parts (or carrier) of described coated material are separated and collect, and mix under state in position together with described thin film layer, the mixed processes of the coated material described in being blended at least between two film layers is after at least one layer film layer in described thin film layer is formed in the surface of described coated material, state completes in position, the coated material mixed under described home state does not adopt the mode of dissolving coated material in solvent, without the need to solvent by applying physics strength to described coated material and described thin film layer, and described thin film layer is at least pulverized once above mixing, being pulverized at least partially in the thin film layer of final described film group is that less than 1/100 of size in film vapor deposition operation uses.

3. a film group, it to be included under home state at least two film layers that existed with separate stage by the parting material of mixing and at the above parting material of described one deck be at least mixed with between two film layers, described thin film layer its maximum length under evaporation state is more than 100 times of thin film layer thickness, the ratio of its length of the thin film layer mixed with described parting material and thickness is more than 2 times, it is characterized in that

Described thin film layer is the thin film layer being formed (coating) by physical vapor deposition method, during evaporation, described thin film layer is formed in the surperficial part of described coated base material (7) at least partially, after in the part being formed in described coated substrate surface, after engaging with described parting material (9) under state in position, be separated from described coated base material together with described parting material, at least one deck in described thin film layer is after the above thin film layer of one deck be first formed on described coated base material engages with described parting material, after being separated from described coated base material together with described parting material, again to be formed under state in position on described coated base material and to be separated, at least two-layer its in described thin film layer is respectively formed at described coated base material and the time point difference be separated from described coated base material, surface at least partially in described coated base material is the face of the process be at least repeatedly separated after the above thin film layer of one deck described in identical place forming for twice, described parting material is without being undertaken moving by physics strength instead of evaporation operation under state in position with the process of steam condition evaporation and engaging with described thin film layer, also be separated from described coated base material together with described thin film layer by physics strength, there is stated limit viscosity to have the material of mobility at the time point engaged with described thin film layer and designated duration, the bonding force of described thin film layer and described coated base material is more weak than the bonding force of described thin film layer and described parting material, the thickness of described thin film layer is more than 0.1 nanometer less than 50 microns, described parting material is fluidity substance or plastic material, at least one surface mass saturated vapor pressure at 25 DEG C is below 100 holders simultaneously, softening temperature is less than 650 DEG C, the physics strength of use at least partially in the process engaged with described thin film layer and the process of mixing instead of evaporation operation, being pulverized at least partially in the thin film layer of described film group is that less than 1/100 of size in film vapor deposition operation uses.

4. a film group manufacture method, it to be included under home state at least two film layers that existed with separate stage by the coated material of mixing and coated material more than described one deck be at least mixed with between two film layers, described thin film layer its maximum length under evaporation state is more than 100 times of thin film layer thickness, it is more than 2 times with its length of thin film layer of described coated material mixing and the ratio of thickness, it is characterized in that

Described manufacture method comprises: the step preparing more than one coated materials (plural number), prepare the step of more than one coated materials (plural number), described coated material and coated material are loaded into (load) to the step in vacuum vessel, to be formed by described coated material and the step (a) of the above thin film layer of one deck formed by physical vapor deposition method smearing at least partially of described coated material, in thin film layer more than one deck of described step (a) floating coat at least partially above form further the step (b) of (or mobile) coated material, the coated material formed further in described step (b) or step (b2) at least partially further coating by the step (a2) of the above thin film layer of one deck of described coated material, in thin film layer more than one deck of described step (a2) floating coat at least partially above form further the step (b2) of (or mobile) coated material, and repeatedly more than twice from described step (a2) to the step (r) of the operation of step (b2), described coated material is fluidity substance or plastic material, at least one surface mass saturated vapor pressure at 25 DEG C is below 100 holders simultaneously, softening temperature is less than 650 DEG C, at least when being formed in described step (b) and step (b2) forms (or mobile) coated material further, described coated material be by without with the process of steam condition evaporation with the state of the stated limit viscosity with the mobility keeping described coated material, at least cause displacement to described coated material applying physics strength and formed,

Described step (a), step (b), step (a2), step (b2) and step (r) complete under state in position, the mixed processes being at least blended in the coated material between described two-layer above thin film layer is that at least one layer film layer in described thin film layer is formed in after on described coated material surface, complete under state in position, the coated material mixed under described home state does not adopt the mode of dissolving coated material in solvent, mix by applying physics strength to described coated material without the need to solvent, described in its Thickness Ratio of described coated material of at least described thin film layer coating time point, the thickness of thin film layer is thick, viscosity is more than 10cps.

5. a film group manufacture method, it to be included under home state at least two film layers that existed with separate stage by the coated material of mixing and coated material more than described one deck be at least mixed with between two film layers, described thin film layer its maximum length under evaporation state is more than 100 times of thin film layer thickness, it is more than 2 times with its length of thin film layer of described coated material mixing and the ratio of thickness, it is characterized in that

Described manufacture method comprises: the step preparing coated material, prepare the step of more than one coated materials, described coated material and coated material are loaded into the step in vacuum vessel, to be formed by described coated material and the step (a) of the above thin film layer of one deck formed by physical vapor deposition method smearing at least partially of described coated material, the step (d) at least partially the thin film layer of more than one deck of described step (a) floating coat and described coated material is separated in from described coated material (or carrier), in position under state, supplied the step (S) of coated material further by the residual part of described coated material remaining in described step (d) (or steps d 3) or solid support material, in described step (S), the coating at least partially of the coated material of further supply is by the step (a3) of the above thin film layer of one deck of described coated material, the step (d3) at least partially the thin film layer of more than one deck of described step (a3) floating coat and described coated material is separated in from described coated material (or carrier), and repeatedly more than twice from described step (S) to described step (a3), (d3) step (r) of operation, described coated material is fluidity substance or plastic material, at least one surface mass saturated vapor pressure at 25 DEG C is below 100 holders simultaneously, softening temperature is less than 650 DEG C, the coated material mixed with thin film layer under described home state carries out moving changing position at designated duration to keep once the state of above mobility, when supplying coated material further in described step (S), described coated material be by without with the process of steam condition evaporation with the state of the stated limit viscosity with the mobility keeping described coated material, at least apply physics strength to described coated material and cause displacement, supply thus,

Described step (a), step (d), step (S), step (a3), step (d3) and step (r) complete under state in position,

The mixed processes being at least blended in the coated material between described two-layer above thin film layer is that at least one layer film layer in described thin film layer is formed in after on described coated material surface, complete under state in position, the coated material mixed under described home state does not adopt the mode of dissolving coated material in solvent, without the need to solvent by applying physics strength to described coated material and described thin film layer and make described thin film layer pulverize at least one times and mix, described in its Thickness Ratio of described coated material of at least described thin film layer coating time point, the thickness of thin film layer is thick, viscosity is more than 10cps.

6. a film group manufacture method, it to be included under home state at least two film layers that existed with separate stage by the coated material of mixing and at the above parting material of described one deck be at least mixed with between two film layers, described thin film layer its maximum length under evaporation state is more than 100 times of thin film layer thickness, the ratio of its length of the thin film layer mixed with described parting material and thickness is more than 2 times, it is characterized in that

Described manufacture method comprises: the step preparing coated base material, prepare the step of more than one coated materials, prepare the step of more than one parting materials, by the step that described coated base material, coated material and parting material arrange or be loaded in vacuum vessel, to be formed by described coated material and the step (a) of the above thin film layer of one deck formed by physical vapor deposition method smearing at least partially of described coated base material, be bonded with each other the above thin film layer of one deck of described step (a) floating coat and the step (1) of described parting material, the step (m) of described thin film layer and the parting material be bonded with each other described step (1) is separated in from coated base material, after described step (m) (or step m5) at least surface a part by more than the part of described coated base material exposed again coating to be formed by described coated material and the step (a5) of the above thin film layer of one deck formed by physical vapor deposition method, the above thin film layer of one deck of the described step that is bonded with each other (a5) floating coat and the step (15) of described parting material, the step (m5) of described thin film layer and the parting material be bonded with each other described step (15) is separated in from coated base material, and repeatedly more than twice from described step (a5) to step (15), (m5) step (r), described step (a), step (1), step (m), step (a5), step (15), step (m5) and step (r) complete under state in position, the described parting material mixed with described thin film layer under described home state mixes by applying physics strength without the need to solvent, in described mixing process, described thin film layer and described parting material are at least pulverized once, described parting material is without being undertaken moving by physics strength instead of evaporation operation under state in position with the process of steam condition evaporation and engaging with described thin film layer, also be separated from described coated base material together with described thin film layer by physics strength, there is stated limit viscosity to have the material of mobility at the time point engaged with described thin film layer and designated duration, the bonding force of described thin film layer and described coated base material is more weak than the bonding force of described thin film layer and described parting material, the mean thickness of described parting material is thicker than the mean thickness of described thin film layer, the thickness of described thin film layer is more than 0.1 nanometer less than 50 microns, described parting material is fluidity substance or plastic material, at least one surface mass saturated vapor pressure at 25 DEG C is below 100 holders simultaneously, softening temperature is less than 650 DEG C, the physics strength of use at least partially in the process engaged with described thin film layer and the process of mixing instead of evaporation operation, being pulverized at least partially in the thin film layer of described film group is that less than 1/100 of size in film vapor deposition operation uses.

7. the film group manufacture method according to any one of claim 4 to 6, is characterized in that, described coated material or separation material are free-flowing material at normal temperatures.

8. the film group manufacture method according to claim 4 or 5, it is characterized in that, in the described coated material of supply further in described step (b), step (b2), step (S) is not move from other places and supply at least partially, but the coated material that the part that the described thin film layer through coating causes displacement and is positioned at the coated material of described thin film layer bottom is supplied again by exposing.

9. film group manufacture method according to claim 5, it is characterized in that, described pulverizing process completes under state in position, from described pulverizing process to terminate in designated duration, on the coated material mixed with the thin film layer of described pulverizing, form at least thin film layer further.

10. a film particle, it is characterized in that, remove a more than part for described coated material from the described film group by the described film group manufacture method manufacture any one of claim 4 to 6, and carry out pulverizing to reach the size of specifying further and obtain.

11. 1 kinds of film particle manufacture method, it is characterized in that, comprise further: in any one of claim 4 to 6, be unloaded to the step of vacuum vessel outside, the step at least partially removing described coated material or parting material and the step pulverized further as specifying size by the described film group of described film group manufacture method manufacture.

12. film group manufacture method according to any one of claim 4 to 6, it is characterized in that, more than the part in described thin film layer be the thin film layer of the multi-ply construction comprising other materials at least two-layer.

13. film group manufacture method according to any one of claim 4 to 6, it is characterized in that, the time point of thin film layer described in evaporation, the surface of described coated material or coated base material comprises and to be in depression portion and/or protuberance at least two place's solid figures with designated shape, and above at least partially in described thin film layer (plural number) is formed as three-dimensional shape.

14. film groups according to any one of claim 1 to 3, is characterized in that, at least one deck in described thin film layer has the film blocking characteristic ultraviolet (absorbing and/or reflection function).

15. film groups according to any one of claim 1 to 3, is characterized in that, described thin film layer is multi-ply construction, and the thin film layer of outside surface is compared to the high coating material of other thin film layer chemical stability.

16. film groups according to any one of claim 1 to 3, is characterized in that, in described thin film layer be selected from metallic substance, semiconductor material, stupalith at least partially more than one.

17. film groups according to any one of claim 1 to 3, is characterized in that, in described thin film layer is cosmetics material or tinting dye at least partially.

18. film groups according to any one of claim 1 to 3, is characterized in that, (transparent) at least partially in described thin film layer is conducting metal or heat conducting material.

19. film groups according to any one of claim 1 to 3, is characterized in that, the ratio of (length/width) at least partially in described thin film layer is more than 10, have long band form or have the band shape in designated shape cross section.

20. according to the film group manufacture method described in claim 4 or 5, it is characterized in that, described coated material is formed at more than the one side of the carrier (support base material) of specifying, described carrier (support base material) be selected from film, roller, tape loop more than one.