CN104144796B - False proof carrier and manufacture method thereof - Google Patents
False proof carrier and manufacture method thereof Download PDFInfo
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- CN104144796B CN104144796B CN201380012081.0A CN201380012081A CN104144796B CN 104144796 B CN104144796 B CN 104144796B CN 201380012081 A CN201380012081 A CN 201380012081A CN 104144796 B CN104144796 B CN 104144796B
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- variable element
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/405—Marking
- B42D25/41—Marking using electromagnetic radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
- B42D25/29—Securities; Bank notes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
- G09F3/02—Forms or constructions
- G09F3/0291—Labels or tickets undergoing a change under particular conditions, e.g. heat, radiation, passage of time
- G09F3/0294—Labels or tickets undergoing a change under particular conditions, e.g. heat, radiation, passage of time where the change is not permanent, e.g. labels only readable under a special light, temperature indicating labels and the like
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- B42D2033/24—
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
- G09F3/02—Forms or constructions
- G09F2003/0276—Safety features, e.g. colour, prominent part, logo
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- Manufacturing & Machinery (AREA)
- Accounting & Taxation (AREA)
- Business, Economics & Management (AREA)
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- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Holo Graphy (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The present invention relates to one and there is the false proof carrier (1) of at least one metal layer (2), wherein introduce and have at least one optically variable element (6), described at least one optically variable element (6) has dependent patterned structure (A), wherein, described at least one optically variable element (6) has the resolution ratio independent laser lithography structure (B) less than 20 microns.
Description
Technical field
The present invention relates to the false proof carrier that a kind of preceding feature part according to claim 1 is limited, and a kind of method producing false proof carrier.
Background technology
To the false proof protection for product, file and qualification, use optically variable element.Optically variable element includes the structure that resolution ratio is the highest, and it can produce special optical effect.Such structure is difficult to replicate, and generally cannot be manufactured by common printing technology.Optically variable element can comprise the structure that bore hole is visible and verifies, it is also possible to comprises the available simple or special structure reading unit check.Optically variable element is known, and can use in various ways.Optically variable element includes, such as, hologram, striograph (cinegram) and light needle drawing (lithograms).The structure comprised in optically variable element can be hologram, special rainbow hologram (special rainbow hologram), transmission hologram, reflection hologram, two-dimensional hologram, three-dimensional hologram, fourier hologram, Fresnel hologram, volume hologram and kinoforms (kinoforms).Such hologram can directly produce by optics, or available computer calculates.Furthermore, it is possible to comprise diffraction structure, particularly diffraction grating.Refraction structure can be comprised, such as Fresnel lens or flash of light grating.Dispersing element can be comprised, such as scatterer.Document describes other structure that may be embodied in optically variable element numerous.Various structures can partly overlap, so as to the same area at optically variable element provides the effect of two or more.Various structures may be used for being configured to graphic elements, such as guilloching, mark, image, line, face etc..Also character element, such as letter, numeral or alphanumeric sequence number, micro explanation (microscripts) can be configured further.Also can configuration feature element further, such as bar code or other machine-readable structure.Various structures and element combine with suitable process, form the global design of varying optical elements, meet as far as possible varying optical elements security, functional and aesthetic impression etc. is required.
Optically variable element can manufacture with replica technique (replication process).To this end, elaborate a main knurling mould with special global design.Such main knurling mould can be by E-beam lithography or by dot matrix (dot-matrix method) manufacture, in such a case, it is possible to realize high resolution ratio.In the case of E-beam lithography, it is possible to achieve the resolution ratio of little to a few nanometer.In the case of dot matrix or other interference technique, the diffraction grating of little to hundreds of nanometer grating constant can be produced.Thus can produce duplicate knurling mould from main knurling mould, and duplicate knurling mould can be produced by it further.Then, use this knurling mould to imprint substantial amounts of optically variable element in moulding process.In such imprint process, produced optically variable element is essentially all the same.
The prior art that EP0420261B1 is closest to, it discloses a kind of method, wherein, modified by the difference at imprint process, introduce personalized measure, so that optically variable element prepared by imprint process is safer, and in optically variable element, introduce additional data.By this way, batch information or sequence number information can be added in this optically variable element.But, described personalized method is restricted and relates in former design the destruction of specific region, bridge joint (bridging) or disables, owing to original design cannot pass through above-mentioned measures to reform.Particularly, by described personalized method, it is impossible to produce holographic, diffraction or the absolute construction of other optically-variables.
Summary of the invention
Present invention aims to carrier and there is more preferable anti-counterfeit capability, and their production method is provided.
About goods, this purpose is that the false proof carrier of the feature by having claim 1 realizes.Preferably improvement is the theme of goods dependent claims.
False proof carrier according to the present invention can have multiple structure.Especially, it is configurable to self-adhesive label or is heat seal mateiral.The shape of described label shape or heat seal mould can be any required shape, such as circular, oval, polygon, fillet polygon etc..In the case of heat seal mateiral, it is band-shaped that global design can be configured as strip, is sealed in the whole length of substrate.This band can be known by landing card, transport season ticket or banknote.Surprisingly, have been found that when this optically variable element has dependent patterned structure, and when at least one optically variable element described also has the resolution ratio discrete laser photolithographic structures less than 20 microns, the anti-forgery security of the carrier of described optically variable element can improve.False proof carrier according to the present invention includes at least one metal layer, it is preferable that described dependent patterned structure and discrete laser photolithographic structures are introduced in identical metal layer.By introducing dependent patterned structure and discrete laser photolithographic structures in same optically variable element in combination, its duplication is become extremely difficult.
To this end, the resolution ratio of described photolithographic structures is less than 20 microns, preferably smaller than 5 microns.In this case, mean that this construction package has less than 20 microns or the development length of 5 microns less than the resolution ratio of 20 microns or 5 microns, and less than 20 microns or 5 microns to each other away from.On each assembly, preferably observe these development lengths and spacing, but on multiple assemblies, at least observe these development lengths and spacing.In the case of pixel being incorporated into described metal layer by laser, this resolution ratio means that the diameter of single pixel should be less than 20 microns or 5 microns, and pixel spacing to each other should be less than 20 microns or 5 microns.
Term carrier by broad understanding, and should can include deformable band in the application, the most banded multilayer film, adhesive tape, but may also be stiff beam.
Varying optical elements or multiple varying optical elements are arranged along described carrier and preferably along described carrier.Preferably, described carrier is discerptible between described optically variable element so that each Individual optical variable element can be further used as can adhesive bond or thermosealed label, holographic point (holospot) etc..
As the base material of carrier, metalized film or metalized coated particularly can be used.In such a case, it is possible to first imprint, then metallizing, vice versa.The burr of impressing is imprintable to metal layer.This metal layer is not stamped destruction, and is used as reflecting layer, will be reflected back in space by the light of patterned structure diffraction.
In numerous applications, such as, in order to increase security, in some applications it may be desirable to metallization ground de-metallization.In the case of the optically variable element of impressing, this generally completes in the second technique mutually independent with impressing.
DE3430111 C1 describes such a process.Before metallization, can partly apply a release layer, it is washed off together with metal layer after metallization.In the position not applying release layer, metal is retained.Here, the metal level that can produce the most described part de-metallization demarcates the difficulty in impressing direction the most matchingly.Additionally, the personalization to this de-metallization does not illustrates.Owing to using typography to apply described release layer in these methods, the resolution ratio of the method is limited.Typically, it is achieved that the minimum of a value of 20 microns.
The possibility of independent de-metallization is described by DE4131964 A1.Here, use laser scribing method to make the metal level de-metallization of hologram independently.But, in the method, holographic, diffraction or other optically-variable absolute construction can not be generated by laser beam.Additionally, the resolution ratio that such laser grooving and scribing method is when de-metallization is limited.Typically, it is achieved that the minimum of a value of 20 microns.
In being directly produced optically variable element, personalization be there is no any restriction.In this case, this optically variable element is not to be manufactured by replica technique, but is introduced directly in target substrate or intermediate product.Such as, this can be by completing at later step independent exposed photosensitive film.Another example is high-resolution laser photoetching technique, wherein, under the auxiliary of laser beam, it would be desirable to structure be introduced directly into laser-sensitive layer.In this case, there is a need to the method for follow-up improvement and optically variable element is not required to those methods of further improving.In this case, high-resolution laser photoetching process can distinguish with conventional laser scribing method, because only that high-resolution laser photoetching technique is possible to realize the least physical dimension, so that using exposure structure to be possibly realized as optically variable element.Below, reference will be made to only high-resolution laser photoetching technique, wherein, base resolution and physical dimension are less than 20 microns, preferably smaller than 5 microns.
In laser lithography, structure to be exposed transfers to substrate by means of laser beam.This structure to be exposed is predetermined through computer installation or calculates, and exists in the way of image or vector data.Laser stepper uses described image or vector data to control the laser beam position relative to described substrate, and controls to incide intensity and the action time of laser beam in substrate.In laser lithography, have been established for multiple method.Such as, write light beam can be fixed in space, and substrate can move relative to this.Substrate can also be fixed in space, and write light beam moves relative to substrate.In addition it is also possible to be substrate and described laser beam all moves.With flat light modulator regulation write light beam, thus relatively large area of base can also be exposed simultaneously.Same principle, write light beam and substrate may move.
In laser lithography, resolution ratio is to be limited by the wavelength used and the optical principle used.In order to produce the structure of the resolution ratio with maximum possible, short wavelength is preferably used.Suitably wavelength is in the range of 0.2 micron to 10 micron, preferably in the range of 0.2 micron to 1 micron.Shorter wavelength is equally possible.Use these wavelength, it is possible to produce effective structure in visible-range (wavelength is about 0.4 micron to 0.7 micron).Therefore, it can produce the diffraction grating of the grating constant of visible ray magnitude, and it has the big angle of diffraction, therefore can perceive particularly well.Hologram also has the biggest angle of diffraction.Preparing optically variable element and only can use high-resolution laser photoetching technique, in this case, base resolution is necessarily less than 20 microns, preferably smaller than 5 microns.
Due to this manufacture method, use the optical element that laser lithography manufactures can personalized designs completely.All of structure can separate configurations.This by numerical value or the auxiliary of alphanumeric sequence number or can be completed by independent graphic element such as image or guilloching.
As the base material of Laser lithography, in the case of embossed optical variable element, especially with metalized film or metalized coated.In this case, the wavelength of laser beam, intensity, pulse length, shape and write energy will be adjusted, so that base material specific precalculated position de-metallization, and therefore become transparent or semitransparent.This is by ablation (ablating) metal level, by moving metal level towards described exposure position edge or carrying out by described metal level is changed into transparent or semitransparent oxide skin(coating).It can also happen that the mixing of above-mentioned three kinds of effects.De-metallization can orient the most matchingly relative to other structure produced by laser lithography, because they can introduce in identical exposure process.Owing to, in the case of Laser lithography, de-metallization occurs with high-resolution laser photoetching process in principle, therefore can produce high-resolution de-metallization structure.These include that micro describes (microscripts), diffusing structure, gray value or GTG wedge (gray step wedges).Such gray value can be produced by suitable rasterizing (rastering) in halftoning method, and in some region, this halftoning method only becomes grating at a part of de-metallization in this region.In the case of GTG wedge, by complying with rasterizing in this region, it is gradually increased de-metallization surface proportion.
In the case of Laser lithography, except complete de-metallization, it is also possible to reduce metal layer thickness by accurately adjusting the laser energy introduced in ablation process.By reducing metal layer thickness, the light transmittance of metal level increases.Gray value or GTG wedge can also produce in this way.
Produced optically variable element by high-resolution laser photoetching to be limited definitely.Such as, base resolution is limited by wavelength and the optical principle used of the write laser used.Owing to high writing rate and the purpose of high yield therefore obtained are to realize producing in enormous quantities, it is desirable to reduce resolution ratio further, because in this manner it is possible to exposing bigger region in the short period of time.The typical base resolution used in this case is 0.5 micron to 5 microns.In laser lithography, it can be assumed that limited resolution ratio.For producing diffraction structure, such as grating or hologram, due to the resolution ratio that this is limited, the not every angle of diffraction can realize.Additionally, the phase place or the Modulation and Amplitude Modulation that are realized in the material by laser lithography are unsatisfactory, therefore, it is not reaching to the theoretical maximum diffraction efficiency of diffraction structure.
In accordance with the invention, it has been found that the restriction suffered by optically variable element of restriction suffered by embossed optical variable element and laser lithography manufacture is partial complementarity.Such as, embossed optical variable element can not be the most personalized, and the optically variable element that laser lithography manufactures is permissible.Embossed optical variable element can only in the second processing step de-metallization, and laser lithography manufacture optically variable element can the most matchingly in a technique exposure and de-metallization.The de-metallization of embossed optical variable element is carried out with low resolution ratio, and the de-metallization in laser lithography technique can be carried out by the complete resolution ratio of this technique.The optically variable element of laser lithography manufacture is typically to be limited by limited resolution ratio, and embossed optical variable element is then not so limited.Additionally, they are generally limited by limited diffraction efficiency, and the highest diffraction efficiency can be obtained with optically variable element.
In accordance with the invention, it has been found that there is the base material being both suitable to the optically variable element that embossed optical variable element is also applied for laser lithography manufacture.This material is metalized film or the coating of composite bed.In order to allow efficient laser lithography coating, optical thickness (OT) should be the least.On the other hand, when OT is less, the degree of reflection of metal layer tails off accordingly.The described scope having been found that applicable OT is 0.1 to 10, preferably 0.8 to 3.
For the method, this purpose can be realized by the method with claim 11 feature.Preferably improvement is the theme of dependent claims.
According to the present invention, dependent patterned structure is impressed into the metal level of carrier, and by means of laser by laser lithography exposure structure to metal layer.The described photolithographic structures that exposure produces has the resolution ratio less than 20 microns, preferably smaller than 5 microns, and patterned structure forms at least one optically variable element together with photolithographic structures.However, it is possible to consider the high-resolution of 1 micron or less.
In a preferred embodiment of the invention, optically variable element is imprinted in the first processing step, and laser lithography exposure in the second processing step.In another embodiment of the invention, by the laser lithography exposure in the first processing step of described optically variable element, and imprint in the second processing step.In another embodiment of the invention, first described optically variable element is imprinted, with after-applied (preferably can adhesive bond or sealing) to goods, and laser lithography exposure in further processing step subsequently.In this case, described goods are probably, and such as, product, product is packed, and identifies, bank note, file, plastic cards, film or label.
As the base material of the optically variable element relevant with the present invention, the most not only can imprint but also can be with the material of laser lithography exposure.Especially, these are metalized coated or film, particularly polymer film, such as PET, PMMA, PVC, BOPP.Preferably in composite bed, wherein there is other layer, such as further coating or film, especially thin polymer film or adhesive phase, such as acrylic ester adhesive mixed thing or hotmelt in described metalized coated or film.Base material preferably has the label material of at least one of which adhesive phase.In another preferred embodiment, base material is a kind of containing metal layer with the heat-sealing film of hotmelt.In another preferred embodiment, base material is the cold seal film comprising metal layer.The metallization of described coating or film can be by evaporation, sputtering or by producing with the printing of metallic pigments ink.This metallization can be on the surface of base material, or can also be internally positioned.
According to the present invention, a kind of dependent global design of the impressing processing of this optically variable element is carried out, and it is massive duplication and the structure that particularly can contain all known embossed optical variable elements.This dependent global design is referred to as patterned structure.
Structure that the global design of laser lithography exposure can comprise static state, that repeat and sequence, the structure of change, such as numeral or alphanumeric sequence number, this sequence number or the hologram of individual volume graphic.The global design of described laser lithography exposure can be also the region of grating containing de-metallization or de-metallization.The global design of laser lithography exposure is referred to as laser lithography structure.
According to the present invention, described dependent patterned structure forms at least one optically variable element together with described discrete laser photolithographic structures.In this case, described patterned structure and described laser lithography structure or its single region, the layout that can be spatially separated from each other.It addition, described patterned structure and described laser lithography structure or its single region, layout that can be partially or completely overlapping.It addition, described patterned structure and described laser lithography structure or its single region, can be with alternate mixed or arrange across.
By the present invention's, it is possible to producing a kind of optically variable element, it comprises the structure that can be the most only manufactured and both the structures that can be the most only manufactured by laser lithography by impressing.By the combination of this patterned structure Yu laser lithography structure, independent structure can combine with logical course to graphically.Independent structure can complement each other.Owing to laser lithography provides the possibility of de-metallization, the isolated area of this patterned structure can destroy individually.
By the combination of this patterned structure Yu laser lithography structure, can form new structure, the traditional optical variable element that this structure can not never produce according to the inventive method is learnt.Such as, by being used in the de-metallization of resolution ratio the highest in laser lithography, the structure of patterned structure can partially or completely be destroyed.This destruction can individually be carried out.Owing to described de-metallization has high resolution ratio, rasterizing, this patterned structure can be used in de-metallization gradually to destroy in these positions.Particularly, passing through rasterizing, it is possible to produce a kind of gamma characteristic (gray profile) when de-metallization, thus make described patterned structure produce gamma characteristic, this is that a kind of perceptible gradual change of human eye converts.This structure cannot be prepared by conventional method.Except rasterizing, it is also possible to by being modulated in laser lithography exposure gray value or the gamma characteristic that the laser power used realizes in de-metallization controllably.Another example of new construction is fine diffraction structure, such as line or point, and it has high-diffraction efficiency and any required angle of diffraction, and it can be independent.In this case, the predetermined diffraction region substantially de-metallization of embossed designs so that only fine structure retains.These metallization fine structures retained can have the highest diffraction efficiency and any required angle of diffraction, because the two factor is determined by impressing, and can is independent and high-resolution because they are produced by laser lithography.High-resolution laser lithography gives described fine structure degree, and its resolution ratio is significantly higher than the resolution ratio of other demetalization process.
In a preferred embodiment, the exposure of described laser lithography can be carried out with relatively imprinting precise match.This can realize under the following conditions, i.e. if in the making of optically variable element, first imprints, and carries out laser lithography subsequently.Accurate cooperation can be ensured by the special measure in laser lithography, such as, ensures precise match by the feature being detected precreping structure by trigger sensor or video camera.Such feature can include embossed designs specially in, to realize the cooperation of high precision.Because in material carries, laser lithography is generally of pinpoint accuracy and navigation accuracy (guide fidelity), and laser lithography design orients, relative to the precise match of described embossed designs, the requirement not made an exception laser lithography.The accurate coupling of the resolution ratio magnitude of laser lithography can be realized.
If in process of production, first carrying out laser lithography and then imprint, then described impressing can be with in precise match to the structure introduced by laser lithography.To this end, first, the position of laser lithography structure needs to be detected by trigger sensor or camera head, and then, the position of described impressing needs to be adjusted to this position.This can be imprinted with the horizontal of technique or time bias, or is completed by extension base material.
In another embodiment of the invention, by the precreping structure suitably selected or laser lithography structure, the accurate match orientation of two structures can be solved.Such as, if one of two of which structure includes graphic element such as guilloching, sinusoidal line, jaggies, band or the dot pattern continuously repeated, then, owing to structure repeats, accurately coupling it is not necessary that.The patterned structure that need not with laser lithography structure accurately mate is preferably used.
This false proof carrier with optically variable element can seal or can adhesive bond on goods, such as product, product packs, mark, file, banknote, plastic clip etc..Can also after carrier is made on other label, by this evident seal or can adhesive bond, afterwards by carrier itself again can adhesive bond on goods.In both cases, it is possible to make the design of described goods or described other label adapt to the design of described optically variable element.This is the most suitable when the subregion de-metallization of described carrier.Then, in the subregion of de-metallization, it can be seen that the underlying design on described goods or described other label.This de-metallization subregion that is possibly due to becomes transparent or semitransparent shape.In this fashion, in addition to patterned structure and laser lithography structure, this configuration also can comprise described goods or the basic engineering of described other label.This basic engineering can be combined with the embossed designs specified by patterned structure and laser lithography structure and lithography design in any suitable manner.In this case, in addition to figure combines, it is also possible to carry out logical combination.Described basic engineering both can comprise static elements also can comprise independent element, and such as, they can be by independent printing technology manufacture.Independent element can be numeral or alphanumeric sequence number, bar code or independent figure.The stand-alone assembly of described basic engineering can be logically combined with the stand-alone assembly that laser lithography designs with figure.Such as, described basic engineering can comprise the numeral or alphanumeric sequence number repeated wholly or in part with laser lithography design.Described basic engineering and laser lithography design can comprise numeral or alphanumeric numbering, and they are bonded to each other by database or by mathematical operation.But, the static elements of described basic engineering is likely to combine with the independent element of laser lithography design.Such as, in laser lithography designs, subregion de-metallization, these certain areas making it possible to see basic engineering can be made independently.By this way, such as, numeral or the colored region of described basic engineering can be seen individually.
Accompanying drawing explanation
Under the auxiliary of the illustrative embodiments in 11 accompanying drawings, the present invention will be described, wherein below:
Fig. 1 shows the ribbon carrier according to the present invention, and it has embossing and the lithography design not having precise match.
Fig. 2 shows the ribbon carrier of embossed designs and the lithography design with precise match.
Fig. 3 shows that the carrier according to Fig. 1, each separate label have mark line.
Fig. 4 shows that the carrier according to Fig. 2, each separate label have mark line.
Fig. 5 shows that 5 kinds are implemented separately example, its embossed designs and lithography design and mark line associated configuration.
Fig. 6 shows the GTG wedge design of embossed designs, lithography design and combination.
Fig. 7 shows the fine structure manufactured by embossed designs design and the fine structure design manufactured by lithography design.
Fig. 8 is illustrated that and is designed, by embossed designs and laser lithography, the Combination Design formed.
Fig. 9 is illustrated that the another kind of example being designed the Combination Design formed by embossed designs and laser lithography.
Figure 10 shows embossed designs, and laser lithography designs, the Combination Design on label, surface of package and be applied to the label of this surface of package.
Figure 11 shows embossed designs, and laser lithography designs, the Combination Design on label, surface of package and be applied to the label of this surface of package.
Fig. 1 shows the carrier 1 with metal layer 2, and it had both included that embossed designs A also included that laser lithography designs B.
Detailed description of the invention
On the one hand the reference quoted refers to this embossed designs A or this laser lithography design B, but refers also to the patterned structure in metal layer 2 or laser lithography structure simultaneously, and A, B are based on described patterned structure or laser lithography structure in design.
Continuously wave and three parallel lines represent the placeholder for static structure (placeholder) of described embossed designs A.Sequence number and ellipse representation laser lithography design independence and the placeholder of static structure of B.Described placeholder symbolically understands, and represents and can be imprinted with technique or any structure that laser lithography manufactures.This layout and number of symbols are the most only interpreted as citing.
Described impressing and laser lithography exposure do not coordinate the most accurately.This can find out relative to the migration of wave from this sequence number.But, because sequence number is always located on wave, so both design teams are combined.This combination is to be carried out by the fixed vertical relation of two kinds of designs.
Fig. 2 shows embossed designs A and the carrier of laser lithography design B precise match each other.Impressing A and laser lithography exposure B coordinates the most accurately.The fact that this from sequence number and can migrate not with respect to wave find out.Being coordinated by accurate, both design energy complete combination is together.This combination is to be carried out by the fixing horizontal and vertical relation of two kinds of designs A, B.
Fig. 3 shows embossed designs A the most accurately do not mated and the carrier 1 of lithography design B having according to Fig. 1, it is shown that mark line 7 is around individual optical elements 6.What broken circle represented is for the mark line 7 of label or for carrying out the mold shape of heat seal application, and therefore represents the border of the optically variable element 6 used on the object of optically variable element 6.Mark line 7 is not necessarily circular, but can have any other desired shape, such as oval, polygon, fillet polygon etc..
Described impressing A and laser lithography exposure B the most accurate cooperation arrange.But, described laser lithography exposure B coordinates accurately relative to the border of optically variable element 6 and the border of carrier 1 and arranges, so that each optically variable element 6 carries out the personalization of uniqueness.
Fig. 4 shows carrier 1, and wherein impressing A and laser lithography exposure B coordinates the most accurately and coordinates accurately relative to the border of optically variable element 6 and the border of carrier 1 and arranges.
In Figure 5, what broken circle represented is for the label line 7 of label or in heat seal is applied the shape of mould, be the most also the border of optically variable element 6 in final products.Illustrate the various possible layout of structure A, B.What region A represented is the structure of embossed designs, and region B represent be laser lithography design structure.Independent structure A, B can be to be separated from each other, it is also possible to partially or completely overlapping.In one designs, some subregions can also be overlapping and other subregions are the most overlapping.In addition to shown layout, layout that is alternate mixed or that intersect also is possible.
According to Fig. 6, embossed designs is made up of the region A containing patterned structure.Laser lithography design is made up of the region B of high-resolution gration GTG wedge 8.In this embodiment, GTG wedge 8 never de-metallization is to de-metallization gradually transition.By this way, embossed area A is gradually destroyed to transition in the B of region, so for observer, patterned structure gradually merges.If patterned structure is the diffraction grating of the low-light of the color flashing rainbow, then this flicker progressively will be faded out in the B of region.If patterned structure is hologram, the most visually hologram gradually can fade out in the B of region.Mark line 7 limits the border of optically variable element 6 again.
By this way, a kind of structure that can not only can not be only produced by laser lithography is produced by embossed technology production.
According to Fig. 7, embossed designs is made up of the region A containing patterned structure.The region B that laser lithography design is retained by de-metallization and fine high-resolution line by bulk zone forms.By this way, in the B of region, leave behind the fine embossed lines of embossed area A.If patterned structure is the diffraction grating of the low-light of the color flashing rainbow, then these fine lines also can flash the low-light of rainbow color.These gratings can not can be configured by them now by the way of laser lithography technique manufactures.
By this way, a kind of structure that can not individually can not be individually produced by laser lithography is produced by imprint process.Mark line 7 limits the border of optically variable element 6 again.
In fig. 8, embossed designs A is by identifying, and exquisite button Suo Wen and region, full surface (dash area) form.These three region can be made up of different structure；Such as, described mark is configurable to rainbow hologram, and described torsion Suo Wen is configured to 2D hologram, and region, described full surface is configured to refraction or diffraction structure.Laser lithography design B is made up of square structure, two fine rules, first sequence number and antitone sequence No. the second.The fourier hologram with stand-alone content that described square structure is produced by computer, said two fine rule can be made up of diffraction grating, and described sequence number above can be made up of Fresnel hologram.When the antitone sequence number of bottom, the perimeter of sequence number is by de-metallization.
If both designs being all incorporated into metal layer 2 according to the present invention, then obtain the optically variable element 6 of Combination Design.On the one hand, this design is made up of a kind of separated regions included the most respectively in two kinds of designs, such as mark or fourier hologram.On the other hand, it is made up of non-overlapping structure, as turned round Suo Wen, strain line and First ray number.And it is made up of combining structure, the most explicit second sequence number of such as laser lithography, numeral is loaded with refraction or the diffraction structure of impressing processing.
By this way, produce a kind of cannot be by the structure individually imprinted or produced by single laser lithography.
Fig. 8 shows embossed designs A and the logical combination of laser lithography design B.Numeral 1 to 5 is had in embossed designs A.Last bit digital of sequence number according to laser lithography design B, individually retains the region of last bit digital of duplicate serial numbers.This optically variable element 6 illustrates logical combination.
First Figure 10 is shown that embossed designs A, followed by lithography design B, in the 3rd image of Figure 10, it is shown that embossed designs A and the combination of lithography design B.3rd graphical representation is the optically variable element 6 of label form.The lower section Serial No. of laser lithography design B is transparent.4th image shows have the surface 11 of goods of structure being expressed as wavelike structure in the application, and described goods are such as packed.Owing to being applied to by optically variable element 6 on the surface 11 of goods, being positioned at the described structure below the transparent region 10 of described optically variable element 6 can glitter through described region.
By the mode of similar Figure 10, shown in Figure 11 be surface 11 structure between logical combination, it is provided with one group of sequence number extraly.According to last bit digital of sequence number, by independent for region 10 de-metallization.Numeral 1-5 is that static state is printed on the surface 11 of goods；By de-metallization region 10 it can be seen that the correspondence on surface 11 is digital.
Reference numerals list
1 carrier
2 metal layers
6 optical elements
7 mark lines
8 grey photometric wedges
10 de-metallizations/transparent region
11 surfaces
A embossed designs
B laser lithography designs
Claims (19)
1. a false proof carrier (1) with at least one metal layer (2), at least one metallization described
Introduce in Ceng and have at least one optically variable element (6), and at least one optically variable element described (6)
There is dependent patterned structure (A), it is characterised in that:
Described at least one optically variable element (6) has independent laser lithography structure (B), this laser light
Carve structure and there is the resolution ratio less than 20 microns, and described patterned structure (A) and described laser lithography are tied
The layout of structure (B) precise match each other.
False proof carrier (1) the most as claimed in claim 1, it is characterised in that described resolution ratio is micro-less than 5
Rice.
False proof carrier (1) the most as claimed in claim 1, it is characterised in that: described patterned structure (A) and
Described laser lithography structure (B) is incorporated into same metal layer (2).
False proof carrier (1) the most as claimed any one in claims 1 to 3, it is characterised in that described sharp
Light photolithographic structures (B) is at least at subregion (10) at least partially de-metallization.
False proof carrier (1) the most as claimed in claim 4, it is characterised in that described subregion (10) is complete
De-metallization.
False proof carrier (1) the most as claimed in claim 4, it is characterised in that described subregion (10) conduct
Grating de-metallization.
False proof carrier (1) the most as claimed in claim 5, it is characterised in that described subregion (10) conduct
Grating de-metallization.
False proof carrier (1) the most as claimed in claim 6, it is characterised in that in subregion (10), institute
The rasterizing stating de-metallization is gradually increased.
9. the false proof carrier (1) as described in any one in claims 1 to 3, it is characterised in that described
Optically variable element (6) is transparent in subregion (10).
10. the false proof carrier (1) as described in any one in claims 1 to 3, it is characterised in that institute
The optical thickness stating metal layer is 0.1 to 10.
11. false proof carriers (1) as claimed in claim 10, it is characterised in that described metal layer
Optical thickness is 0.8 to 3.
The manufacture method of 12. 1 kinds of false proof carriers (1) with at least one metal layer (2), its by with
Lower step manufacture
Embossing is processed in a kind of dependent patterned structure (A) arrives described metal layer (2) and by means of laser
Independent laser lithography structure (B) photolithographic exposure to metal layer (2) is interior,
With photolithographic structures (B) described in the resolution exposure less than 20 microns,
At least one optically variable element described is formed together with described photolithographic structures (B) by patterned structure (A)
(6),
Wherein said laser lithography structure (B) and described patterned structure (A) precise match each other be incorporated into gold
In genusization layer (2).
13. methods as claimed in claim 12, it is characterised in that dependent patterned structure (A) is first
In being embossing to described metal layer (2) along described carrier (1), then, independent laser lithography structure (B)
It is exposed in described metal layer (2).
14. methods as claimed in claim 12, it is characterised in that independent laser lithography structure (B)
First in being exposed to metal layer (2) along described carrier (1), subsequently, dependent patterned structure (A) embossing
In described metal layer (2).
15. methods as according to any one of claim 12 to 14, it is characterised in that described photoetching is tied
Subregion (10) de-metallization of structure (B) is to transparent degree, and the subregion of described patterned structure (A) is relative
Arrange in described sub-area (10), make them pass through sub-area (10) flash of light.
16. methods as according to any one of claim 12 to 14, it is characterised in that described carrier (1)
Separate between described optically variable element (6), and described optically variable element (6) is applied to
On goods.
17. methods as claimed in claim 16, it is characterised in that described goods are packaging.
18. methods as claimed in claim 16, it is characterised in that described optically variable element (6) sets
There is sub-area (10), and the surface mark of described goods is glistened through described sub-area (10).
19. methods as claimed in claim 17, it is characterised in that described optically variable element (6) sets
There is sub-area (10), and the surface mark of described goods is glistened through described sub-area (10).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102012203350A DE102012203350A1 (en) | 2012-03-02 | 2012-03-02 | Security label and a method for its production |
| DE102012203350.5 | 2012-03-02 | ||
| PCT/EP2013/053167 WO2013127650A1 (en) | 2012-03-02 | 2013-02-18 | Security label and a method for the production thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104144796A CN104144796A (en) | 2014-11-12 |
| CN104144796B true CN104144796B (en) | 2016-08-24 |
Family
ID=47740945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380012081.0A Active CN104144796B (en) | 2012-03-02 | 2013-02-18 | False proof carrier and manufacture method thereof |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP2819851B1 (en) |
| CN (1) | CN104144796B (en) |
| DE (1) | DE102012203350A1 (en) |
| WO (1) | WO2013127650A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012213502B4 (en) * | 2012-07-31 | 2022-12-22 | Scribos Gmbh | heat seal film |
| DE102014200595B4 (en) * | 2014-01-15 | 2019-08-22 | Tesa Scribos Gmbh | Safety arrangement and method for producing a safety arrangement |
| DE102015202106A1 (en) | 2015-02-06 | 2016-08-11 | Tesa Scribos Gmbh | Optically variable security element |
| DE102015207268A1 (en) * | 2015-04-22 | 2016-10-27 | Tesa Scribos Gmbh | Security element and method for producing a security element |
| DE102015210982A1 (en) | 2015-06-15 | 2016-12-15 | Tesa Scribos Gmbh | Safety label with tilting effect |
| DE102016214407A1 (en) * | 2016-08-04 | 2018-02-08 | Tesa Scribos Gmbh | Optically variable security element |
| DE102016216878A1 (en) | 2016-09-06 | 2018-03-08 | Tesa Scribos Gmbh | Security label with metal layer |
| DE102017215288B3 (en) | 2017-08-31 | 2018-12-27 | Tesa Scribos Gmbh | Holographic multilayer film, product packaging, portion capsule, beverage preparation system, process for producing a holographic multilayer film and method for operating a beverage preparation system |
| DE102021203749A1 (en) | 2021-04-15 | 2022-10-20 | Scribos Gmbh | Security label, series of security labels, authentication system with a series of security labels, and method of manufacturing a security label |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010028758A1 (en) * | 2008-09-10 | 2010-03-18 | Giesecke & Devrient Gmbh | Method for producing a security or value document |
| CN101678697A (en) * | 2007-05-23 | 2010-03-24 | L·F·M·扎赫迪 | Film element for detecting authenticity |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3430111C1 (en) | 1984-08-16 | 1985-10-24 | Leonhard Kurz GmbH & Co, 8510 Fürth | Foil, in particular hot stamping foil, with a decorative metal layer and process for its production |
| DE3932505C2 (en) | 1989-09-28 | 2001-03-15 | Gao Ges Automation Org | Data carrier with an optically variable element |
| DE4131964A1 (en) | 1991-09-25 | 1993-04-08 | Holtronic Gmbh | Inscribing hologram with markings - using laser beam to produce localised breakdown in transparent metallised foil in hologram |
| FR2885072B1 (en) * | 2005-04-29 | 2007-07-27 | Gemplus Sa | CARD MARKING BY LASER |
| DE102006032234A1 (en) * | 2006-07-12 | 2008-01-17 | Tesa Scribos Gmbh | Method for applying a security feature to a security document and security document with a security feature |
| FR2942811B1 (en) * | 2009-03-04 | 2011-05-06 | Oberthur Technologies | SECURITY ELEMENT FOR DOCUMENT-VALUE. |
-
2012
- 2012-03-02 DE DE102012203350A patent/DE102012203350A1/en not_active Withdrawn
-
2013
- 2013-02-18 CN CN201380012081.0A patent/CN104144796B/en active Active
- 2013-02-18 EP EP13705157.9A patent/EP2819851B1/en active Active
- 2013-02-18 WO PCT/EP2013/053167 patent/WO2013127650A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101678697A (en) * | 2007-05-23 | 2010-03-24 | L·F·M·扎赫迪 | Film element for detecting authenticity |
| WO2010028758A1 (en) * | 2008-09-10 | 2010-03-18 | Giesecke & Devrient Gmbh | Method for producing a security or value document |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2819851B1 (en) | 2016-04-13 |
| WO2013127650A1 (en) | 2013-09-06 |
| DE102012203350A1 (en) | 2013-09-05 |
| CN104144796A (en) | 2014-11-12 |
| EP2819851A1 (en) | 2015-01-07 |
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