CN104132569A - Silicon-based micro-pulsating heat pipe with function channel structure - Google Patents
Silicon-based micro-pulsating heat pipe with function channel structure Download PDFInfo
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- CN104132569A CN104132569A CN201410025799.XA CN201410025799A CN104132569A CN 104132569 A CN104132569 A CN 104132569A CN 201410025799 A CN201410025799 A CN 201410025799A CN 104132569 A CN104132569 A CN 104132569A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
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- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to pulsating heat pipes, in particular to a silicon-based micro-pulsating heat pipe with a function channel structure. The silicon-based micro-pulsating heat pipe is bonded by a pair of semiconductor silicon wafers and a heat-resistant borosilicate glass sheet, and a vacuuming/liquid injection hole is processed in the borosilicate glass sheet; the vacuuming/liquid injection hole corresponds to the top of a vacuuming/liquid injection micro-channel in each semiconductor silicon wafer, and each semiconductor silicon wafer is etched with a plurality of micro-channels. The silicon-based micro-pulsating heat pipe is characterized in that the width of the micro-channels is linearly changed along the length direction of the heat pipe. By the structure, shortcomings that an internal working medium of inside the silicon-based micro-pulsating heat pipe with an ordinary uniform-section channel is difficult to form overall directional circulation movement and evaporator sections are prone to 'dryout' and the like are overcome, and capabilities of cooling temperature control performance and bearing thermal load can be improved by adjusting section size of the pulsating heat pipe and heat pipe configurations.
Description
Technical field
The present invention relates to pulsating heat pipe, refer in particular to a kind of silicon-base miniature pulsating heat pipe that has function channel design, can effectively promote the functional form channel design silicon-base miniature pulsating heat pipe of working medium circulation motion, than normal miniature pulsating heat pipe, there is better heat-transfer effect, can be applicable to the high efficiency cooling temperature control field of integrated IC electronic devices and components.
Background technology
Along with developing rapidly of microelectric technique and large scale integrated circuit, the calorific intensity of various microelectronic chips is increasing, if the heat of generation cannot be got rid of in time, will have a strong impact on microelectronic element even service behaviour and service life of whole system; Therefore, the microelectronics temperature control technology of development high-efficiency compact, the problems such as chip cooling space is narrow and small to solve, heat radiation difficulty are the urgent tasks that current this field development is faced.
In various heat dissipation from microelectronic devices cooling technologies, pulsating heat pipe because it is simple in structure, just day by day receive publicity without liquid-sucking core and unique heat dispersion and good space adaptability, is considered to a kind of heat sinking cooling technology that has development prospect, but the overall dimensions of common pulsating heat pipe is larger, how the microelectronic chip size height-limited with heat-dissipating space carries out effectively mating becoming restricts it in key factor of this field application, recently, Qu etc. are at < < International Journal of Heat and Mass Transfer > > (international heat and mass magazine) (volume 55 in 2012, the 21-22 phase) " the Start-up delivering on, heat transfer and flow characteristics of silicon-based micro pulsating heat pipes " (the startup of silicon-base miniature pulsating heat pipe, heat transfer and flow characteristic) in a literary composition, proposed a kind of by MEMS technique by pyrex be etched with the miniature pulsating heat pipe technology of the silicon chip processing and fabricating of micro-channel, this technology can significantly reduce the overall dimensions of pulsating heat pipe, and can by its directly and integrated chip be integrated, really realize chip-scale (chip-level) refrigerating function, can effectively solve the thermal stress concentration problem causing because material is incompatible simultaneously, but research is found, increase along with heating power, miniature pulsating heat pipe evaporator section is prone to liquid phase volume share and reduces gradually, finally disappears even completely and present the state of " dryouting ", liquid phase cannot enter wherein and be limited near condensation segment, vibrate suppressed, heat transfer temperature control capacity significantly declines, simultaneously, this article points out that the generation of above-mentioned phenomenon is mainly due to the little whole shuttling movement that is difficult to form similar common small-sized pulsating heat pipe to working medium after certain size within it of miniature pulsating heat pipe passage hydraulic diameter, this is totally unfavorable to improving its heat transfer temperature control capacity, easily causes the overheated of chip local temperature in practical application, therefore, how to utilize MEMS technology suitably to adjust or improve the channel design of miniature pulsating heat pipe and even the overall configuration of heat pipe in the unique advantage aspect micro-processing, to improve its carrying thermic load ability and cooling temperature-control performance, also become the key point of this micro cooler development and application.
Summary of the invention
The object of the invention is to overcome that common uiform section passage silicon-base miniature pulsating heat pipe internal working medium is difficult to form global orientation shuttling movement and deficiencies such as " dryouting " easily occurs evaporator section, by adjusting pulsating heat pipe channel cross-section size and heat pipe configuration, realize the ability that improves its cooling temperature-control performance and carrying thermic load.
Operation principle of the present invention is as follows:
The gradual change of channel cross-section size can make liquid plug both sides in passage produce asymmetric surface tension, drive thus bubble (vent plug) towards certain direction motion, mode by continuous gradation changes silicon-base miniature pulsating heat pipe channel cross-section size and can realize identity function, makes arbitrary vent plug in heat pipe passage under anisopleual surface tension effects, form the effect of moving to certain direction.After this kind of effect spreads all over whole heat pipe channel loop, can form the impetus to inner vapour, liquid plug working medium global orientation shuttling movement, promote the generation of its cyclic process.
It is analytic target that Fig. 1 be take local unit in a certain passage of the miniature pulsating heat pipe of function channel design of steady operation, has provided the steam binding both sides force analysis situation drawing according to above-mentioned principle.
Wherein, the pressure reduction between left side steam binding and liquid plug is:
（1）
Pressure reduction between right side steam binding and liquid plug is:
（2）
Because the density of steam in steam binding is less, so in Fig. 1, suppose that whole vent plug internal pressure equates, according to formula (1) and (2), can obtain vent plug both sides institute pressure difference and be:
（3）
The thickness of ignoring liquid film in Fig. 1, steam binding arranged on left and right sides radius
r 1with
r 2can be similar to half (supposing that channel cross-section is rectangle) of being considered as correspondence position channel width.
In conjunction with Fig. 1, by formula (3), can find that the capillary force that steam binding is subject to from left to right drives, in this variable cross-section passage, on vent plug, there is by small cross sections the active force to the motion of larger cross-section direction, and drive adjacent liquid plug to produce together motion, according to this principle, when the channel cross-section of silicon-base miniature pulsating heat pipe changes, the working medium in heat pipe passage can produce self-drive power, promotes the formation of its global orientation (clockwise or counterclockwise) shuttling movement.
The miniature pulsating heat pipe of variable cross-section function channel design of the present invention, when inheriting common uiform section Channel Micro pulsating heat pipe plurality of advantages, also has following advantage:
1. in variable cross-section situation, the liquid plug in the arbitrary passage of pulsating heat pipe is adjacent both sides vent plug interfacial surface tension and varies in size, this influence of unbalance power can be ordered about liquid plug from the little side of channel cross-sectional area towards the large side autogenic movement of sectional area, impel thus vapour, liquid plug in heat pipe in whole loop, to do directed shuttling movement, even if overcome the deficiency that common miniature pulsating heat pipe its internal working medium when heating power is higher is also difficult to form whole shuttling movement, strengthen heat-transfer capability.
2. variable cross-section Channel Micro pulsating heat pipe is beneficial to the feature that forms the directed shuttling movement of working medium and also can to evaporator section, supplements condensate liquid in time, obviously suppress the appearance that evaporator section " dryouies " state, strong ability and the cooling temperature-control performance that promotes its carrying thermic load, thus balance microelectronic chip " focus " temperature strengthen its whole uniform temperature.
Accompanying drawing explanation
Fig. 1 is analytic target for take local unit in a certain passage of the miniature pulsating heat pipe of function channel design of steady operation, the steam binding both sides force analysis situation schematic diagram drawing.
Fig. 2 is a kind of function channel design silicon-base miniature pulsating heat pipe silicon chip structure chart of the present invention.
Fig. 3 is the second function channel design silicon-base miniature pulsating heat pipe silicon chip structure chart of the present invention.
Fig. 4 is the third function channel design silicon-base miniature pulsating heat pipe silicon chip structure chart of the present invention.
Fig. 5 is the pyrex chip architecture figure that forms silicon-base miniature pulsating heat pipe in the present invention.
Number in the figure explanation: 1, vacuumize/fluid injection micro-channel; 2, silicon chip; 3, the micro-channel on silica-based; 4, vacuumize/liquid injection hole
;5, pyrex sheet.
The specific embodiment
For further understanding content of the present invention, below in conjunction with Figure of description and specific embodiment, describe the present invention.
The present invention, by MEMS electrostatic bonding technology, is integrated pyrex and the silicon chip that is etched with function channel structure by anode linkage technology, form the function channel design silicon-base miniature pulsating heat pipe by glass capsulation.
Embodiment 1
As shown in Fig. 2 and 5, a kind of function channel design silicon-base miniature pulsating heat pipe is formed by a pair of semi-conductor silicon chip 2 and heat-resisting pyrex sheet 5 bondings; The surface that wherein silicon chip 2 contacts with pyrex sheet is etched with the micro-channel 3 of square-section by the dry lithography of plasma; On pyrex sheet 5, be processed with vacuumize/liquid injection hole 4; Vacuumize/liquid injection hole 4 is corresponding with the apical position of vacuumizing on semi-conductor silicon chip/fluid injection micro-channel 1, and vacuumize/fluid injection micro-channel 1 access micro-channel 3, from described vacuumizing/liquid injection hole
4fill the FC-72 of 50% volume fraction.
In Fig. 2, silicon chip size is 50 mm * 35 mm, and wherein heat pipe longitudinal length is 40 mm, and transverse width is 28 mm, is carved with the micro-channel that 16 center lines and silicon chip long end border are parallel to each other on silicon chip, and in both sides, respectively forms 8 U-shaped elbows; The shape of cross section of micro-channel is rectangle, the degree of depth 280 μ m, width is continuous linear change along heat pipe channel-length direction, a less side width is 350 μ m, a larger side is 700 μ m, corresponding passage two ends cross section equivalent diameter is respectively 321.3 μ m and 400 μ m, and the passage equivalent diameter between two ends is linear change.
According to aforesaid operation principle, this function channel design silicon-base miniature pulsating heat pipe makes vapour in heat pipe passage, liquid plug have the trend of directed movement toward the clockwise direction by the change of channel cross-section size, thereby promote the formation of hot intraductal working medium global orientation shuttling movement in the higher situation of heating power, strengthen heat transfer temperature control capacity.
Embodiment 2
As shown in Figures 3 and 5, with embodiment 1, difference is the certain difference that exists in micro-channel 3 and Fig. 2 of this function channel design silicon-base miniature pulsating heat pipe; This micro-channel shape of cross section is all identical with embodiment 1 with the degree of depth, but in Fig. 3, the width of adjacent two micro-channel only has one along heat pipe channel-length direction, to be continuous linear change, its less side equivalent diameter is 321.3 μ m, and a larger side equivalent diameter is 400 μ m; And adjacent another micro-channel width 525 μ m remain unchanged with it, equivalent diameter is 365.2 μ m.
Equally, when heating power is higher under channel structure as shown in Figure 3 in this silicon-base miniature pulsating heat pipe passage vapour, liquid plug also can realize directed movement toward the clockwise direction.
Embodiment 3
With embodiment 1 and embodiment 2, the micro-channel shape of cross section of function channel design silicon-base miniature pulsating heat pipe is all identical with embodiment 1 with the degree of depth, and heat pipe longitudinal length is 40 mm, and transverse width is 24.5mm, on silicon chip, be carved with 14 micro-channel, and in both sides, respectively form 7 U-shaped elbows; The shape of cross section of micro-channel is rectangle, the degree of depth 280 μ m, and difference is that its micro-channel is as shown in Fig. 43; The now variation of micro-channel width is that the border in micro-channel is continuous linear change along channel-length direction, another border is parallel with silicon chip border, a wherein less side width is 280 μ m, a larger side is 770 μ m, and corresponding passage two end section equivalent diameters are respectively 280 μ m and 410 μ m.
In this kind of situation, comparatively similar to embodiment 1 structure, when heating power is higher, working medium can realize global orientation shuttling movement equally in heat pipe circuit, improves cooling temperature control capacity.
Claims (11)
1. a function channel design silicon-base miniature pulsating heat pipe, described miniature pulsating heat pipe is formed by a pair of semi-conductor silicon chip and heat-resisting pyrex sheet bonding, on described pyrex sheet, is processed with vacuumize/liquid injection hole; Described vacuumize/liquid injection hole is corresponding with the apical position of vacuumizing on semi-conductor silicon chip/fluid injection micro-channel, is etched with some micro-channel on described silicon chip, it is characterized in that: the width of described micro-channel is linear change along heat pipe length direction.
2. a kind of function channel design silicon-base miniature pulsating heat pipe according to claim 1, is characterized in that: the width of described micro-channel is linear along heat pipe length direction and increases or reduce.
3. a kind of function channel design silicon-base miniature pulsating heat pipe according to claim 1, is characterized in that: the center line of described micro-channel and silicon chip long end border are parallel to each other, and micro-channel two edge passage lengths are linear and increase or reduce.
4. a kind of function channel design silicon-base miniature pulsating heat pipe according to claim 3, it is characterized in that: heat pipe longitudinal length is 40 mm, transverse width is 28 mm, is carved with the micro-channel that 16 center lines and silicon chip long end border are parallel to each other on silicon chip, and in both sides, respectively forms 8 U-shaped elbows; The shape of cross section of micro-channel is rectangle, the degree of depth 280 μ m, width is continuous linear change along heat pipe channel-length direction, a less side width is 350 μ m, a larger side is 700 μ m, corresponding passage two ends cross section equivalent diameter is respectively 321.3 μ m and 400 μ m, and the passage equivalent diameter between two ends is linear change.
5. a kind of function channel design silicon-base miniature pulsating heat pipe according to claim 1, it is characterized in that: in described micro-channel, the width of adjacent two micro-channel only has the both sides of a micro-channel to be continuous linear change along heat pipe channel-length direction, and the center line of this micro-channel and silicon chip long end border are parallel to each other; Another micro-channel width remains unchanged, and the both sides of micro-channel and silicon chip long end border are parallel to each other.
6. a kind of function channel design silicon-base miniature pulsating heat pipe according to claim 5, it is characterized in that: heat pipe longitudinal length is 40 mm, transverse width is 28 mm, is carved with the micro-channel that 16 center lines and silicon chip long end border are parallel to each other on silicon chip, and in both sides, respectively forms 8 U-shaped elbows; The shape of cross section of micro-channel is rectangle, the degree of depth 280 μ m, and the width of adjacent two micro-channel only has one along heat pipe channel-length direction, to be continuous linear change, and its less side equivalent diameter is 321.3 μ m, and a larger side equivalent diameter is 400 μ m; And adjacent another micro-channel width 525 μ m remain unchanged with it, equivalent diameter is 365.2 μ m.
7. a kind of function channel design silicon-base miniature pulsating heat pipe according to claim 1, is characterized in that: the border in described micro-channel is continuous linear change along channel-length direction, and another border is parallel with silicon chip border.
8. a kind of function channel design silicon-base miniature pulsating heat pipe according to claim 7, is characterized in that: heat pipe longitudinal length is 40 mm, and transverse width is 24.5mm, is carved with 14 micro-channel, and in both sides, respectively forms 7 U-shaped elbows on silicon chip; The shape of cross section of micro-channel is rectangle, the degree of depth 280 μ m, the variation of micro-channel width is that the border in micro-channel is continuous linear change along channel-length direction, another border is parallel with silicon chip border, a wherein less side width is 280 μ m, a larger side is 770 μ m, and corresponding passage two end section equivalent diameters are respectively 280 μ m and 410 μ m.
9. a kind of function channel design silicon-base miniature pulsating heat pipe according to claim 1, is characterized in that: described micro-channel shape of cross section is rectangle, trapezoidal or part trapezoidal portions triangle.
10. a kind of function channel design silicon-base miniature pulsating heat pipe according to claim 1, is characterized in that: in described vacuumizing/fluid injection microchannel, liquid working substance fills volume and accounts for 35% ~ 65% of whole heat pipe circuit cumulative volume; Filled liquid working substance is the lower boiling phase-change working substance FC-72 of environmental protection, FC7100 or R141b.
11. a kind of function channel design silicon-base miniature pulsating heat pipes according to claim 1 are in the cooling purposes of heat dissipation from microelectronic devices.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104406440A (en) * | 2014-11-06 | 2015-03-11 | 江苏大学 | Silicon-based miniature loop heat pipe cooler |
| CN105161473A (en) * | 2015-07-09 | 2015-12-16 | 江苏中圣压力容器装备制造有限公司 | Micro silicon-based capillary pump loop cooler |
| CN106643243A (en) * | 2016-12-14 | 2017-05-10 | 江苏大学 | Silicon-based micro pulse heat pipe with micro/nano composite structures |
| CN113154912A (en) * | 2020-01-22 | 2021-07-23 | 讯凯国际股份有限公司 | Multi-channel thin heat exchanger |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111457768B (en) * | 2020-03-24 | 2021-04-06 | 东南大学 | Be applied to frozen low temperature phase transition heat exchanger of cell vitrification |
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| US6977010B2 (en) * | 2000-02-01 | 2005-12-20 | Komatsu Denshi Kinzoku Kabushiki Kaisha | Apparatus for pulling single crystal by CZ method |
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| US6977010B2 (en) * | 2000-02-01 | 2005-12-20 | Komatsu Denshi Kinzoku Kabushiki Kaisha | Apparatus for pulling single crystal by CZ method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104406440A (en) * | 2014-11-06 | 2015-03-11 | 江苏大学 | Silicon-based miniature loop heat pipe cooler |
| CN105161473A (en) * | 2015-07-09 | 2015-12-16 | 江苏中圣压力容器装备制造有限公司 | Micro silicon-based capillary pump loop cooler |
| CN106643243A (en) * | 2016-12-14 | 2017-05-10 | 江苏大学 | Silicon-based micro pulse heat pipe with micro/nano composite structures |
| CN113154912A (en) * | 2020-01-22 | 2021-07-23 | 讯凯国际股份有限公司 | Multi-channel thin heat exchanger |
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| CN104132569B (en) | 2016-08-17 |
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