CN103442541A - Micro cooling device of silicon-substrate capillary pump loop - Google Patents
Micro cooling device of silicon-substrate capillary pump loop Download PDFInfo
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- CN103442541A CN103442541A CN2013103220456A CN201310322045A CN103442541A CN 103442541 A CN103442541 A CN 103442541A CN 2013103220456 A CN2013103220456 A CN 2013103220456A CN 201310322045 A CN201310322045 A CN 201310322045A CN 103442541 A CN103442541 A CN 103442541A
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Abstract
The invention discloses a micro cooling device of a silicon-substrate capillary pump loop and belongs to the temperature-control field of microelectronic chips. The micro cooling device of the silicon-substrate capillary pump loop is formed by bonding a pair of semi-conductor silicon wafers and a heat-resistant boron silicic acid glass piece. An evaporator, a condenser, a vapor phase channel, a liquid phase channel, a liquid storing cavity and a pumping or liquid filling channel are formed in the contact surface between the silicon wafers and the heat-resistant boron silicic acid glass piece in an etching mode. The evaporator and the condenser are connected through the vapor phase channel and the liquid phase channel to form a closed circuit. The evaporator comprises a micro conduit. The condenser comprises a condensing micro channel. A pumping or liquid filling hole is machined in the silicic acid glass piece. The liquid storing cavity is connected with the evaporator. The micro cooling device of the silicon-substrate silicon substrate loop can be directly integrated with a semi-conductor microelectronic chip so as to effectively reduce the temperature and the temperature gradient of the chip. The problems of hot spots caused by local high heat flow are reduced and relieved. Safe and reliable operation of the chip is ensured.
Description
Technical field
The present invention relates to a kind of efficient micro-cooler device, relate in particular to a kind of silica-based capillary pump loop micro cooler, belong to the temperature control field of microelectronic chip.
Background technology
Fast development along with semiconductor information communication industry, the Highgrade integration of various Related products and equipment and microminaturization have become important development trend, cause thus microelectronic chip working heat load increase fast and cause the excessive problem of caloric value, have a strong impact on the functional reliability of itself and even whole system.Simultaneously, the heating inequality of microelectronic chip itself will produce on surface " focus " (calorific intensity can surpass 10
7w/m
2), the key reason that its existence is considered to cause chip " thermal runaway ", threatens system safety., dispel the heat difficult characteristics narrow and small for the microelectronic chip cooling space, for chip temperature being controlled to lsafety level and improving its uniform temperature, minimizing local " focus ", need the chilly but technology of Development of Novel badly.
In various heat dissipation from microelectronic devices cooling technologies, microminiature capillary pump loop (CPL) receives publicity just day by day because of its unique heat dispersion and good space adaptability, is considered to a kind of very promising novel chilly but heat dissipation technology.At present, this heat pipe is mainly realized by the microchannel structure of making the formation loop or directly processing for forming evaporator and condenser on metallic plate that is connected of capillary and metallic plate (piece).The capillary pump loop that the evaporator proposed in " Design and performance test of miniature capillary pumped loop for electronics cooling " (the cooling design with miniature capillary pump loop of electronics and performance test) delivered on " Journal of Central South University Technology " (15 volume 235-239 pages in 2008) as Wan etc. is separated from each other with condenser and by capillary, both is connected; And patent No. US20000702860, name is called disclosed a kind of dull and stereotyped capillary pump loop of directly on flat board, processing evaporator, condenser and loop structure in the United States Patent (USP) of " Cooling Device Using Capillary Pumped Loop " (cooling device based on capillary pump loop).Made the capillary pump loop obtained by said method, general by with direct contact of microelectronic component, heat being taken out of, reduce thus its working temperature.This radiating mode can be introduced extra contact heat resistance in connection procedure, reduces its radiating efficiency, and also has larger limitation aspect minimizing chip surface local " focus "; Simultaneously, also may be because material compatibility causes the concentrated problem of thermal stress, when device self-temperature skewness, performance is even more serious.
Summary of the invention
, the problem that will solve
Being difficult to solve microelectronic chip working heat load for existing CPL heat pipe heat radiation technology increases fast and causes excessive and heating inequality microelectronic chip itself of caloric value will produce on surface the problem of part " focus ", the invention provides a kind of silica-based capillary pump loop micro cooler, directly effectively reduce temperature, the raising cooling efficiency at chip " focus " position by silica-based CPL, the advantage of conducting heat in conjunction with self-characteristic and the minute yardstick of CPL strengthens the heat transfer temperature control capacity, makes the service behaviour of microelectronic chip more safe and reliable.
, technical scheme
For addressing the above problem, the present invention adopts following technical scheme.
A kind of silica-based capillary pump loop micro cooler, described micro cooler is formed by a pair of semi-conductor silicon chip and heat-resisting pyrex sheet bonding; The surface etch that described silicon chip contacts with the pyrex sheet has evaporator, condenser, vapor phase channel, liquid channel, liquid storage cylinder and vacuumize/reservoir channel; Described evaporator is connected with liquid channel by vapor phase channel with condenser, forms closed-loop path; Described evaporator inside comprises microchannel; Described condenser comprises the condensation microchannel; Described condensation microchannel consists of the silicon chip along condensate flow direction etching; Be processed with vacuumize/liquid injection hole on described pyrex sheet; Described vacuumizing/liquid injection hole is corresponding with the apical position of the vacuumize/fluid injection microchannel that condenser is connected; Described liquid storage cylinder is connected with evaporator.Described silica-based micro-cooler can be directly and the semiconductor microactuator electronic chip become one.
Preferably, the microchannel structure of described evaporator consists of micro-rib array capillary structure or evaporation microchannel.
More preferably, described micro-rib array capillary structure is silicon chip that the evaporator place is not etched and after cutting off processing; Described evaporation microchannel partly consists of the silicon chip be etched along the cooling working medium flow direction.
Preferably, described condensation microchannel is equidistant array, and spacing is 300 ~ 700 μ m.
Preferably, micro-rib cross section of described micro-rib array capillary structure is shaped as rectangle, triangle or circle; The cross section of described evaporation microchannel and condensation microchannel is rectangle, triangle or trapezoidal.
Preferably, the sectional dimension of described vapor phase channel and liquid channel remains unchanged or is linear change along channel direction.
More preferably, the sectional dimension of described vapor phase channel and liquid channel is along the channel direction linear change, and wherein from evaporator to the condenser direction, linearity increases vapor phase channel, and liquid channel reduces to condenser direction linearity from evaporator.
Preferably, in described vacuumizing/fluid injection microchannel, liquid working substance fills volume and accounts for 40% ~ 60% of whole silica-based capillary pump loop cumulative volume.
More preferably, filled liquid working substance is environmental protection low boiling phase-change working substance, water, ethanol, FC-72.
The present invention is for the size Selection of silica-based CPL microchannel, its hydraulic diameter usually can be between 100 ~ 500 μ m, wherein heat pipe evaporator position passage hydraulic diameter is less, desirable 100 ~ 300 μ m, and microchannel, condenser position hydraulic diameter is desirable 200 ~ 500 μ m; And, to connecting vapour, the liquid channel of evaporator and condenser, require the size of liquid channel little than vapor phase channel, be beneficial to the periodic duty of working medium in heat pipe.
The present invention is by semi-conductor silicon chip and heat-resisting pyrex sheet electrostatic bonding technology, by pyrex be etched with capillary structure, the wafer bonding of microchannel and reservoir is integrated, formation is by the silica-based CPL of glass capsulation, during use, adopt certain technological means that silica-based CPL and semiconductor microactuator electronic chip are become one, directly effectively reduce the temperature at chip " focus " position by silica-based CPL, improve cooling efficiency, the advantage of conducting heat in conjunction with self-characteristic and the minute yardstick of CPL strengthens the heat transfer temperature control capacity, make the service behaviour of microelectronic chip more safe and reliable.
, beneficial effect
Than prior art, beneficial effect of the present invention is:
(1) in the present invention, related CPL evaporator inside comprises micro-rib array capillary structure, and silicon chip that this micro-rib array is not etched by the evaporator place and through cutting off after processing forms, there is the function that enhanced heat exchange is separated in microchannel, by being cut off, microchannel processes formed micro-rib array, can destroy the abundant development in boundary layer, make the mean boundary-layer thickness attenuation along its length of whole microchannel with this, thereby play the effect of enhanced heat exchange.Simultaneously, this kind of structure when reducing the Working fluid flow resistance, can also significantly strengthen the CPL evaporator wetting/from wetting effect, postpone its under the higher thermal load condition because of the not enough problem of dryouting caused of working medium, improve the heat transport limitation of heat pipe;
(2) evaporator described in the present invention is connected with liquid channel by vapor phase channel with condenser, the heat that the silica-based absorption of evaporator produces from microelectronic chip work, and cooling working medium is accepted, after heat, evaporative phase-change occurs, and by liquid phase, becomes vapour phase.Under the effect of evaporator and condenser working medium pressure reduction, the vapour phase working medium that evaporation forms is moved to condenser through the vapour phase loop, reverts to again liquid phase after cooling at the condenser place, under differential pressure action, cooling fluid is along liquid phase loop Returning evaporimeter, continue the heat absorption evaporation, and so forth, periodic duty.By this process, can make " focus " position heat warp that chip temperature is higher be passed to its CPL directly integrated the position that temperature is lower, realization reduces the effect with the balance temperature difference;
(3) silica-based CPL micro cooler of the present invention, due to the heat conduction reinforced advantage under the characteristics with traditional C PL and minute yardstick, make it effectively overcome when the traditional heat-dissipating mode is difficult to reply " chip-scale is cooling " deficiency the function that has again enhanced heat exchange concurrently;
(4) but connect evaporator and the vapor phase channel of condenser and the diameter linear change of liquid channel in the present invention, be conducive to the periodic duty of working medium in heat pipe.
(5) in the present invention by silica-based CPL and the integrated one that is made in of microelectronic chip, can effectively reduce traditional cooling cost, reduce energy consumption, and can improve the cooling effect of chip and the ability of carrying heat load.
The accompanying drawing explanation
Fig. 1 is a kind of silicon chip structure chart that forms the capillary pump loop micro cooler of the present invention.
Fig. 2 is the another kind of silicon chip structure chart that forms the capillary pump loop micro cooler of the present invention.
Form the heat-resisting pyrex structure chart of capillary pump loop micro cooler in Fig. 3 the present invention
Number in the figure explanation: 1, silicon chip; 2, evaporator; 3, condenser; 4, vapor phase channel; 5, liquid channel; 6, liquid storage cylinder; 7, micro-rib array capillary structure; 8, condensation microchannel; 9, vacuumize/fluid injection microchannel; 10, evaporation microchannel; 11, pyrex sheet; 12, vacuumize/liquid injection hole.
Embodiment
For further understanding content of the present invention, below in conjunction with Figure of description and specific embodiment, describe the present invention.
embodiment 1
As shown in Figure 1, Figure 3, a kind of silica-based capillary pump loop micro cooler by a pair of semi-conductor silicon chip and heat-resisting pyrex sheet 11 bondings, formed and can be directly and the semiconductor microactuator electronic chip become one.The surface etch that wherein silicon chip 1 contacts with the pyrex sheet has evaporator 2, condenser 3, vapor phase channel 4, liquid channel 5, liquid storage cylinder 6 and vacuumize/reservoir channel 9; Evaporator 2 is connected with liquid channel 5 by vapor phase channel 4 with condenser 3, forms closed-loop path; Evaporator 2 inside comprise microchannel, and condenser 3 comprises condensation microchannel 8; Condensation microchannel 8 consists of the silicon chip along condensate flow direction etching; Be processed with vacuumize/liquid injection hole 12 on pyrex sheet 11; Vacuumize/liquid injection hole 12 is corresponding with the apical position of the vacuumize/fluid injection microchannel 9 that condenser is connected; 6 of liquid storage cylinders are connected with evaporator 2.The interior water that fills 50% volume fraction from described vacuumizing/fluid injection microchannel 9.
In addition, the microchannel structure of evaporator 2 consists of micro-rib array capillary structure 7 or evaporation microchannel 10.Wherein micro-rib array capillary structure 7 is silicon chip that evaporator 2 places are not etched and after cutting off processing; Evaporation microchannel 10 partly consists of the silicon chip be etched along the cooling working medium flow direction.The sectional dimension of vapor phase channel 4 and liquid channel 5 remains unchanged.
In Fig. 1, on silicon chip, the width of vapor phase channel 4 is 800 μ m, the width of liquid channel 5 is 500 μ m, condenser contains the microchannel of 8 width 400 μ m, the interior microchannel that has 10 width 240 μ m along the micro-rib length direction of rectangle of evaporator 2 is 500 μ m along the spacing of micro-rib width direction.The microchannel dry etching degree of depth is 200 μ m, and the hydraulic diameter of vapor phase channel 4, liquid channel 5, condenser microchannel 8 and micro-rib array capillary structure 7 of the square-section formed thus is respectively 320 μ m, 285.7 μ m, 267.7 μ m and 218.2 μ m.The size of the rectangle liquid storage cylinder 6 be connected with evaporator is 3000 μ m * 2500 μ m, can effectively control the evaporation capacity of evaporator worker quality liquid under different heat loads by this liquid storage cylinder 6, and bear the task of regulating condenser 3 cooling heat dissipation areas, the working temperature of control chip thus.
This silica-based CPL micro cooler can be directly integrated with microelectronic chip, and the phase transformation by water in heat pipe circuit and vapour, liquid two-phase movement are realized direct cooling and " focus " of chip eliminated to function.
As shown in Figure 2 and Figure 3, with embodiment 1, difference is that evaporator 2 places of capillary pump loop are not the described micro-rib array capillary structure 7 of embodiment 1, but similarly evaporates microchannel 10 with condenser 3.
With embodiment 1, embodiment 2, difference is that in silica-based capillary pump loop micro cooler, the sectional dimension of vapor phase channel 4 and liquid channel 5 is linear change along channel direction, wherein vapor phase channel 4 linear increase of 3 directions from evaporator 2 to condenser, the variation of liquid channel 5 is just contrary.The vapor phase channel width is increased to 1200 μ m by 600 μ m, and the respective channel hydraulic diameter is increased to 342.9 μ m by 300 μ m; And the sectional area of liquid channel 5 is from evaporator 2 to condenser, 3 directions are linearity and reduce to change, and channel width is reduced to 300 μ m by 700 μ m, and the respective channel hydraulic diameter is reduced to 240 μ m by 311.1 μ m.Through above adjustment, be conducive to strengthen the autogenic movement effect of cooling working medium vapor phase channel 4 and liquid channel 5 in, reduce flow resistance, thereby make mobile more unimpeded in whole capillary pump loop micro cooler of working medium, improve its runnability.
embodiment 4
With embodiment 1, embodiment 2, embodiment 3, difference is, micro-rib cross section of micro-rib array capillary structure 7 be shaped as triangle, the cross sectional shape of evaporation microchannel 10 is triangle, the cross sectional shape of condensation microchannel 8 is triangle.
With embodiment 1, embodiment 2, embodiment 3, difference is, micro-rib cross section of micro-rib array capillary structure 7 be shaped as circle, the cross sectional shape of evaporation microchannel 10 is trapezoidal, the cross sectional shape of condensation microchannel 8 is triangle.
embodiment 6
With embodiment 1, embodiment 2, embodiment 3, difference is, the interior ethanol that fills 50% volume fraction from described vacuumizing/fluid injection microchannel 9.
embodiment 7
With embodiment 1, embodiment 2, embodiment 3, difference is, the interior FC-72 that fills 40% volume fraction from described vacuumizing/fluid injection microchannel 9.
Embodiments of the present invention are not restricted to the described embodiments, and wherein width and the quantity of vapor phase channel 4 and liquid phase microchannel 5 width and condenser 2 and evaporator 3 interior microchannels can be adjusted according to actual needs.And the etching depth of microchannel equally also can be adjusted.
Claims (10)
1. a silica-based capillary pump loop micro cooler, is characterized in that, described micro cooler is formed by a pair of semi-conductor silicon chip and heat-resisting pyrex sheet (11) bonding; The surface etch that described silicon chip (1) contacts with the pyrex sheet has evaporator (2), condenser (3), vapor phase channel (4), liquid channel (5), liquid storage cylinder (6) and vacuumize/reservoir channel (9); Described evaporator (2) is connected with liquid channel (5) by vapor phase channel (4) with condenser (3), forms closed-loop path; Described evaporator (2) inside comprises microchannel; Described condenser (3) comprises condensation microchannel (8); Described condensation microchannel (8) consists of the silicon chip along condensate flow direction etching; Be processed with vacuumize/liquid injection hole (12) on described pyrex sheet (11); Described vacuumizing/liquid injection hole (12) is corresponding with the apical position of the vacuumize/fluid injection microchannel (9) that condenser is connected; Described liquid storage cylinder (6) is connected with evaporator (2).
2. silica-based capillary pump loop micro cooler according to claim 1, is characterized in that, the microchannel structure of described evaporator (2) consists of micro-rib array capillary structure (7) or evaporation microchannel (10).
3. silica-based capillary pump loop micro cooler according to claim 2, is characterized in that, described micro-rib array capillary structure (7) is located not to be etched for evaporator (2) and the silicon chip after cutting off processing; Described evaporation microchannel (10) partly consists of the silicon chip be etched along the cooling working medium flow direction.
4. silica-based capillary pump loop micro cooler according to claim 1, is characterized in that, described condensation microchannel (8) is equidistant array.
5. silica-based capillary pump loop micro cooler according to claim 3, is characterized in that, micro-rib cross section of described micro-rib array capillary structure (7) be shaped as rectangle, triangle or circle; The cross section of described evaporation microchannel (10) and condensation microchannel (8) is rectangle, triangle or trapezoidal.
6. silica-based capillary pump loop micro cooler according to claim 1, it is characterized in that, the sectional dimension of described vapor phase channel (4) and liquid channel (5) remains unchanged or is linear change along channel direction, and the diameter of liquid channel (5) is less than the diameter of vapor phase channel (4).
7. silica-based capillary pump loop micro cooler according to claim 6, it is characterized in that, the sectional dimension of described vapor phase channel (4) and liquid channel (5) is along the channel direction linear change, and wherein from evaporator (2) to condenser (3) direction, linearity increases vapor phase channel (4); And liquid channel (5) reduces to condenser (3) direction linearity from evaporator (2).
8. silica-based capillary pump loop micro cooler according to claim 1, described vacuumizing/interior liquid working substance in fluid injection microchannel (9) fills volume and accounts for 40% ~ 60% of whole silica-based capillary pump loop cumulative volume.
9. silica-based capillary pump loop micro cooler according to claim 8, it is characterized in that: filled liquid working substance is environmental protection low boiling phase-change working substance, water, ethanol, FC-72 etc.
10. according to the described silica-based capillary pump loop micro cooler of claim 1 to 9 any one, described silica-based micro-cooler can be directly and the semiconductor microactuator electronic chip become one.
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103824825A (en) * | 2014-02-13 | 2014-05-28 | 中国科学院工程热物理研究所 | Microchannel phase-change heat transfer device |
| CN103839905A (en) * | 2014-01-17 | 2014-06-04 | 华南理工大学 | Silicon substrate micro-channel heat exchanger with electric fluid power micro-pump and manufacturing method thereof |
| CN104132569A (en) * | 2014-01-21 | 2014-11-05 | 江苏大学 | Silicon-based micro-pulsating heat pipe with function channel structure |
| CN104154787A (en) * | 2014-08-29 | 2014-11-19 | 电子科技大学 | Multi-stage evaporation micro-channel heat pipe heat transferring and radiating device |
| CN104347546A (en) * | 2014-09-17 | 2015-02-11 | 江苏大学 | Multiple-effect chip liquid cooling device |
| CN104406440A (en) * | 2014-11-06 | 2015-03-11 | 江苏大学 | Silicon-based miniature loop heat pipe cooler |
| CN104540373A (en) * | 2014-12-23 | 2015-04-22 | 江苏大学 | Low-melting-point alloy-silicon-based miniature cooler used for smartphone heat dissipation |
| CN105161473A (en) * | 2015-07-09 | 2015-12-16 | 江苏中圣压力容器装备制造有限公司 | Micro silicon-based capillary pump loop cooler |
| CN114518044A (en) * | 2020-11-18 | 2022-05-20 | 山东大学 | Silicon-based evaporator loop heat pipe |
| CN116294301A (en) * | 2022-12-05 | 2023-06-23 | 大连理工大学 | Pump-assisted capillary force driven two-phase fluid heat management system |
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| CN103839905B (en) * | 2014-01-17 | 2016-10-05 | 华南理工大学 | There is silicon substrate microchannel heat exchanger and the manufacture method thereof of electrohydrodynamic Micropump |
| CN104132569B (en) * | 2014-01-21 | 2016-08-17 | 江苏大学 | A kind of silicon-base miniature pulsating heat pipe with function channel design |
| CN104132569A (en) * | 2014-01-21 | 2014-11-05 | 江苏大学 | Silicon-based micro-pulsating heat pipe with function channel structure |
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| CN104154787A (en) * | 2014-08-29 | 2014-11-19 | 电子科技大学 | Multi-stage evaporation micro-channel heat pipe heat transferring and radiating device |
| CN104347546A (en) * | 2014-09-17 | 2015-02-11 | 江苏大学 | Multiple-effect chip liquid cooling device |
| CN104406440A (en) * | 2014-11-06 | 2015-03-11 | 江苏大学 | Silicon-based miniature loop heat pipe cooler |
| CN104540373A (en) * | 2014-12-23 | 2015-04-22 | 江苏大学 | Low-melting-point alloy-silicon-based miniature cooler used for smartphone heat dissipation |
| CN105161473A (en) * | 2015-07-09 | 2015-12-16 | 江苏中圣压力容器装备制造有限公司 | Micro silicon-based capillary pump loop cooler |
| CN114518044A (en) * | 2020-11-18 | 2022-05-20 | 山东大学 | Silicon-based evaporator loop heat pipe |
| CN114518044B (en) * | 2020-11-18 | 2023-11-21 | 山东大学 | Loop heat pipe of silicon-based evaporator |
| CN116294301A (en) * | 2022-12-05 | 2023-06-23 | 大连理工大学 | Pump-assisted capillary force driven two-phase fluid heat management system |
| CN116294301B (en) * | 2022-12-05 | 2024-05-03 | 大连理工大学 | Pump-assisted capillary force driven two-phase fluid heat management system |
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Application publication date: 20131211 |