CN103982782A - LED (light emitting diode) fluorescent lamp and assembling method thereof - Google Patents

Abstract

The invention relates to the technology of semiconductor illumination, in particular to an LED (light emitting diode) fluorescent lamp integrating a light source and a drive power and an assembling method of the fluorescent lamp. The fluorescent lamp comprises a tube body, end covers which are arranged on two ends of the tube body and a light source and drive power integrated unit, wherein each end cover is provided with a pin which is adaptive to a fluorescent lamp holder; the light source and drive power integrated unit comprises a substrate, a plurality of LED units which are arranged on the substrate and a drive power module which is arranged on one end or two ends of the substrate and electrically connected with the LED units and the pins.

Description

LED fluorescent lamp and assembly method thereof

Technical field

The present invention relates to semiconductor lighting technology, the LED fluorescent lamp particularly light source and driving power being integrated and the assembly method of this LED fluorescent lamp.

Background technology

The light emitting diode (LED) that is used as at present light source in lighting device is a kind of solid-state semiconductor devices, and its basic structure generally comprises the support of band lead-in wire, the encapsulating material (for example silica gel or epoxy resin) that is arranged on the semiconductor wafer on support and this wafer surrounding is sealed.Above-mentioned semiconductor wafer includes P-N structure, and in the time that electric current passes through, electronics is pushed to P district, and in P district, electronics, with hole-recombination, then sends energy with the form of photon, and light wavelength is to be determined by the material that forms P-N structure.

Compared with traditional fluorescent lamp, LED fluorescent lamp has that photoelectric transformation efficiency is high, light-source brightness is constant, without stroboscopic with containing plurality of advantages such as harmful heavy metals.Typical LED fluorescent tube is made up of tube tube body, end cap, lamp plate and driving power, and wherein driving power can be built in body or be arranged on body outside.

Chinese utility model patent 200920134372.8 discloses a kind of by fluorescent lamp external LED power supply, it comprises LED daylight lamp body, on this lamp body, be connected with external LED power supply, this LED power supply comprises PCB circuit board, input and output terminal, power pack, PCB circuit board is built in power pack, and input terminal is connected with LED daylight lamp body by PCB circuit board, lead-out terminal.Adopt external power supply to do larger change to the mode of connection of fluorescent lamp, and install also inconvenient.

Chinese invention patent application 201110037855.9 discloses a kind of LED fluorescent lamp, the end cap that it comprises fluorescent tube and is arranged on lamp tube ends, wherein fluorescent tube comprises plurality of LEDs on lamp plate of lamp plate, array and is positioned at the bright dipping case above LED, the step-down constant-current source module that constant current is provided to LED is installed in end cap, and the both positive and negative polarity conducting end of lamp plate is connected to the output of step-down constant-current source module.It is pointed out that above-mentioned LED fluorescent lamp abandoned the constraint of original daylight lamp holder in design completely, although it is not this is conducive to optimize fluorescent structure and circuit design, good with the compatibility of existing daylight lamp holder.

Summary of the invention

The object of this invention is to provide a kind of LED fluorescent lamp, its have simple in structure, compact and with the compatible advantage such as good of existing daylight lamp holder.

LED fluorescent lamp according to one embodiment of the invention comprises:

Body;

Be positioned at the end cap at described body two ends, on it, be provided with the pin of adaptive daylight lamp holder;

Light source and driving power integrated unit, comprising:

Substrate;

Multiple LED unit that are arranged on described substrate;

Driving power module, it is disposed in the one or both ends of described substrate and is electrically connected with described LED unit and described pin.

Preferably, in above-mentioned LED fluorescent lamp, further comprise the heat sink that is fixed on described body inside, described substrate setting thereon.

Preferably, in above-mentioned LED fluorescent lamp, described heat sink inwall offers groove and inserts for described substrate.

Preferably, in above-mentioned LED fluorescent lamp, described heat sink surface applies infrared radiant material.

Preferably, in above-mentioned LED fluorescent lamp, described body is made up of plastics, offers along its groove extending longitudinally on described inboard wall of tube body.

Preferably, in above-mentioned LED fluorescent lamp, described body is made up of glass.

Preferably, in above-mentioned LED fluorescent lamp, described substrate is ceramic substrate, heat conductive insulating polymer composite material board, glass mat, glass plate, copper-clad plate or aluminium base.

Preferably, in above-mentioned LED fluorescent lamp, described substrate surface covers infrared radiant material.

Preferably, in above-mentioned LED fluorescent lamp, described LED unit is coupled to form LED load with series, parallel or series-parallel mode.

Preferably, in above-mentioned LED fluorescent lamp, described driving power module comprises:

Rectification filtering unit;

DC-DC boosting inverter unit, comprise inductor, switching diode, PWM controller and metal-oxide-semiconductor, wherein, described inductor and switching diode are connected between described rectification filtering unit and LED load, the drain electrode of described metal-oxide-semiconductor is electrically connected between described inductor and the positive pole of switching diode, the output electrical connection of grid and described PWM controller; And

Feedback unit, comprises transistor, and its base stage is electrically connected to the loop of described LED load, and colelctor electrode is electrically connected to the control end of described PWM controller.

Under above-mentioned optimal way, provide feedback signal by transistor to PWM controller, realized the function of constant current and constant voltage simultaneously.In addition, in the driving power module of said structure, component number is less and can realize miniaturization, and therefore make becomes possibility by LED unit and driving power module integration on same substrate.

Preferably, in above-mentioned LED fluorescent lamp, described driving power module also comprises the capacitor of electrical connection between control end and the ground connection of described PWM controller.By selecting large value capacitor, can make backfeed loop response slow down, thereby reach the object of power factor correcting.

Preferably, in the above-described embodiments, described PWM controller and metal-oxide-semiconductor are integrated in same IC chip.Or preferably, described PWM controller, metal-oxide-semiconductor and transistor are integrated in same IC chip.The integrated reliability that improved of above-mentioned multiple semiconductor devices, and contribute to the miniaturization of driving power module.

Preferably, in above-mentioned LED fluorescent lamp, described driving power module comprises:

Rectification filtering unit;

Decompression transformation unit, comprise inductor, switching diode, PWM controller and metal-oxide-semiconductor, wherein, the positive pole of the negative pole of described switching diode and described LED load is connected to the output of described rectification filtering unit altogether, the drain electrode of described metal-oxide-semiconductor and the electrical connection of the positive pole of described switching diode, the output electrical connection of grid and described PWM controller, and described inductor is electrically connected between the drain electrode of described metal-oxide-semiconductor and the negative pole of described LED load; And

Feedback unit, comprises resistor, and the control end of itself and described PWM controller is connected to the source electrode of described metal-oxide-semiconductor altogether.

Preferably, in above-mentioned LED fluorescent lamp, described driving power module also comprises the capacitor of electrical connection between positive pole and the negative pole of described LED load.

Preferably, in above-mentioned LED fluorescent lamp, described driving power module also comprises the pair of electrodes pin of the same one end that is arranged on described substrate, and it is electrically connected with live wire and the zero line of external ac power source respectively through described pin.

Preferably, in above-mentioned LED fluorescent lamp, further comprise the removable connector between live wire and the described anodal pin that is connected to external ac power source.Better, described removable connector comprises Interface Terminal, the starter socket adaptation on described pin and Inductive ballast.

Make line conduction by insert again above-mentioned connector after completing LED fluorescent lamp installation steps, can greatly reduce the generation of electric shock accidents.

Of the present invention also have an object to be to provide a kind of method of assembling above-mentioned LED fluorescent lamp, and it has the advantages such as simple, convenient.

According to the assembly method of one embodiment of the invention, described body is made up of plastics, offers along its groove extending longitudinally on described inboard wall of tube body, and described driving power module also comprises the pin that is arranged on described substrate two ends, it is characterized in that, comprise the following steps:

Described substrate is inserted in the groove of described inboard wall of tube body;

At outer surface and/or the described end cap inwall application of adhesive at described body two ends; And

Described end cap is enclosed within to the two ends of described body and makes described pin and corresponding described pin is electrically connected together.

According to the assembly method of another embodiment of the present invention, described LED fluorescent lamp further comprises that inwall offers reeded heat sink, described body is made up of plastics, on described inboard wall of tube body, offer along its groove extending longitudinally, described driving power module also comprises the pin that is arranged on described substrate two ends, it is characterized in that, comprise the following steps:

Described substrate is inserted in the groove of described heat sink inwall;

Described heat sink is inserted in the groove of described inboard wall of tube body;

At outer surface and/or the described end cap inwall application of adhesive at described body two ends; And

Described end cap is enclosed within to the two ends of described body and makes described pin and corresponding described pin is electrically connected together.

According to the assembly method of another embodiment of the present invention, described body is made up of glass, and described driving power module also comprises the pin that is arranged on described substrate two ends, it is characterized in that, comprises the following steps:

Described substrate is put into described body;

At outer surface and/or the described end cap inwall application of adhesive at described body two ends;

Described end cap is enclosed within to the two ends of described body and makes described pin and corresponding described pin is electrically connected together; And

Heat described body two ends so that described body, described substrate and described end cap be fixed together.

According to the assembly method of another embodiment of the present invention, described body is made up of glass, and described driving power module also comprises the pin that is arranged on described substrate two ends, it is characterized in that, comprises the following steps:

Described substrate is inserted in the groove of described heat sink inwall;

Described heat sink is put into described body;

At outer surface and/or the described end cap inwall application of adhesive at described body two ends;

Described end cap is enclosed within to the two ends of described body and makes described pin and corresponding described pin is electrically connected together; And

Heat described body two ends so that described body, described substrate and described end cap be fixed together.

Brief description of the drawings

Above-mentioned and/or other side of the present invention and advantage become the description of the various aspects by below in conjunction with accompanying drawing more clear and are easier to understand, and in accompanying drawing, same or analogous unit adopts identical label to represent.

Fig. 1 is according to the decomposing schematic representation of the LED fluorescent lamp of one embodiment of the invention.

Fig. 2 can be used for the light source of the fluorescent lamp of LED shown in Fig. 1 and the schematic diagram of driving power integrated unit.

Fig. 3 A is the wiring diagram of common fluorescent lamp that adopts Inductive ballast, wiring diagram when Fig. 3 B is common fluorescent lamp shown in LED fluorescent lamp alternate figures 3A embodiment illustrated in fig. 1.

Fig. 4 A is the wiring diagram of common fluorescent lamp that adopts electric ballast, wiring diagram when Fig. 4 B is common fluorescent lamp shown in LED fluorescent lamp alternate figures 4A embodiment illustrated in fig. 1.

Fig. 5 is the schematic diagram that can be used for the heat sink of the fluorescent lamp of LED shown in Fig. 1.

Schematic diagram when Fig. 6 shows light source in the fluorescent lamp of LED shown in Fig. 1 and driving power integrated unit and heat sink and is assembled together.

Fig. 7 is according to the partial schematic diagram of the LED fluorescent lamp of another embodiment of the present invention.

The circuit theory diagrams that Fig. 8 is a kind of driving power module of comprising in light source shown in Fig. 2 and driving power integrated unit.

The circuit theory diagrams that Fig. 9 is the another kind of driving power module that comprises in light source shown in Fig. 2 and driving power integrated unit.

The circuit theory diagrams that Figure 10 is the another kind of driving power module that comprises in light source shown in Fig. 2 and driving power integrated unit.

The circuit theory diagrams that Figure 11 is the another kind of driving power module that comprises in light source shown in Fig. 2 and driving power integrated unit.

Reference list:

1LED fluorescent lamp

10 bodys

11 inner tubes

12 outer tubes

21,22 end caps

211A, 211B, 221A, 221B pin

30 light sources and driving power integrated unit

310 substrates

320 light emitting diodes (LED) unit

330 driving power modules

331 bridge rectifier filter units

332A DC-DC boosting inverter unit

332B DC-DC decompression transformation unit

333 feedback units

BR1 full-bridge rectifier

C1, C2, C3, C4, C5, C6, C7 capacitor

D1 switching diode

L1, L2 inductor

LED1-LEDn LED load

Q1 transistor

R1, R2, R3, R4, R5, R6 resistor

T1, T2MOS pipe

U1, U4 switch adjuster

U2, U3PWM controller

340A, 340B, 350A, 350B pin

40 heat sinks

401 inwalls

2 common fluorescent lamps

3 starters

4 Inductive ballasts

5 connectors

6 electric ballasts

Detailed description of the invention

Below with reference to the accompanying drawing that wherein illustrates illustrative examples of the present invention, the present invention is described more all sidedly.But the present invention can realize by multi-form, and should not be read as the each embodiment that only limits to provide herein.The various embodiments described above that provide are intended to make disclosure herein comprehensively complete, convey to more all sidedly those skilled in the art's protection scope of the present invention.

In this manual, unless stated otherwise, term " semiconductor crystal wafer " such as refers to, at the upper multiple independently single circuit that form of semi-conducting material (silicon, GaAs etc.), " semiconductor wafer " or " wafer (die) " refers to this single circuit, and " packaged chip " refers to the physical arrangement of semiconductor wafer after encapsulation, in typical this physical arrangement, semiconductor wafer is for example installed on support and encapsulates with encapsulant.

Term " light emitting diode " refers to the unit that comprises electroluminescent material, and the example of this unit includes but not limited to P-N knot inorganic semiconductor light emitting diode and Organic Light Emitting Diode (OLED and polymer LED (PLED)).

P-N knot inorganic semiconductor light emitting diode can have different version, for example, include but not limited to LED core and light emitting diode monomer.Wherein, " LED core " refers to and includes semiconductor wafer P-N structure, that have electroluminescent ability, and " light emitting diode monomer " refers to the physical arrangement forming after die package, in typical this physical arrangement, tube core is for example installed on support and encapsulates with encapsulant.

Term " wiring ", " wiring pattern " and " wiring layer " refer to the conductive pattern for being electrically connected between components and parts of arranging on insulating surface, include but not limited to cabling (trace) and hole (as pad, component hole, fastener hole and plated through-hole etc.).

Term " heat radiation " refer to object owing to thering is temperature the phenomenon of radiated electromagnetic wave.

Term " heat conduction " refers to heat and is sent to from the higher part of temperature in solid the transfer mode of the part that temperature is lower.

" electrical connection " and " coupling " should be understood to be included in the situation that directly transmits electric flux or the signal of telecommunication between two unit, or indirectly transmits the situation of electric flux or the signal of telecommunication through one or more Unit the 3rd.

" driving power " or " LED driving power " refers to and is connected to the interchange (AC) of lighting device outside or direct current (DC) power supply and as " electronic-controlled installation " between the light emitting diode of light source, is used to light emitting diode that required curtage (such as constant current, constant voltage or firm power etc.) is provided.In specific embodiment, driving power can modular structure be realized, for example it comprises printed circuit board (PCB) and one or more components and parts that are electrically connected together on printed circuit board (PCB) and by wiring that are arranged on, and the example of these components and parts includes but not limited to LED driving governor chip, rectification chip, resistor, capacitor and coil etc.

Term such as " comprising " and " comprising " represent except have in description and claims, have directly and the unit and step of clearly statement, technical scheme of the present invention is not got rid of yet and is had other unit of directly or clearly not explained and the situation of step.

Term such as " first ", " second ", " the 3rd " and " the 4th " does not represent that unit is to be only used as to distinguish each unit in the order of the aspects such as time, space, size.

Term such as " object A is arranged on the surface of object B " should be broadly interpreted as the surface that object A is directly placed on to object B, or object A is placed on to the surface that has other object contacting with object B.

By accompanying drawing, embodiments of the invention are described below.

Fig. 1 is according to the schematic diagram of the LED fluorescent lamp of one embodiment of the invention.

LED fluorescent lamp 1 shown in Fig. 1 comprises body 10, be positioned at a pair of end cap 21,22 at body 10 two ends and be positioned at light source and the driving power integrated unit 30 of body 10.Alternatively, the LED fluorescent lamp shown in Fig. 1 also can comprise the heat sink 40 that is fixed on body 10 inside, and light source and driving power integrated unit 30 can be set on it.

Body 10 can be made up of glass or plastics.For fear of glare effect, frosted processing (for example using acid solution to make inner tube surface roughening) is done at least one surface in inner surface and the outer surface of the body 10 that can make glass.Alternatively, also can consider to apply light spread powder at the inner surface of body 10.In the time that body 10 is made up of glass, as shown in Figure 1, body 10 can inwardly shrink at its 101 places, end (being also the external diameter that the external diameter of end is less than remainder).In the process that end is inwardly shunk, the stress of tube wall is effectively discharged, and has improved thus intensity, thereby is conducive to reduce the loss in transport and assembling process.The object that it is pointed out that contraction is intended to discharge stress, and therefore the internal diameter of body 10 might not need to dwindle.

In each of end cap 21 and 22, be provided with and the pin of common fluorescent lamp base adaptation, in Fig. 1, be positioned at a pair of pin 211A, the 211B on end cap 21 outer surfaces and be positioned at another on end cap 22 outer surfaces to pin 221A, 221B.Pin provides the electrical connection between light source and driving power integrated unit 30 and external power source on the one hand, makes on the other hand LED fluorescent lamp can be fixed on lamp socket.It should be understood that shown in Fig. 1 to be the schematic diagram under decomposing state, in the time that LED fluorescent lamp 1 completes assembling, end cap 21 and 22 is the two ends of closed tube 10 respectively.In the present embodiment, can for example, by adhesive (clay (being called again lamp mud) or epoxy resin) outer surface of the inner surface of end cap 21 and 22 and body 10 be bonded together, thereby realize the fixing of end cap.

In the present embodiment, light source and driving power integrated unit 30 can adopt structure described below and operation principle, are wherein integrated on same substrate as LED unit and the driving power module of light source.

Fig. 2 can be used for the light source of the fluorescent lamp of LED shown in Fig. 1 and the schematic diagram of driving power integrated unit.

Light source shown in Fig. 2 and driving power integrated unit 30 comprise substrate 310, multiple light emitting diode (LED) unit 320 and driving power module 330.Below each component units is further described.

Substrate 310 is strip as shown in Figure 2, and it can adopt the ceramic substrate of being made by mould pressing, and sheet material thicker (for example 1.5-3mm) and hardness that this method is manufactured are high.Alternatively, substrate 310 also can adopt heat conductive insulating polymer composite to make.In addition, in order to improve heat-sinking capability, can cover infrared radiant material at substrate surface, or adopt the material that has good insulation heat-conducting property and infrared radiation property concurrently to make substrate, thereby make to distribute with heat conduction and thermal-radiating mode from the heat of LED unit and driving power module simultaneously.It is pointed out that except above-mentioned pottery, heat conductive insulating polymer composite and infrared radiant material, substrate 310 can be also aluminium base, glass plate, copper-clad plate or glass mat.In addition, the components and parts of light source and driving power integrated unit 30 can be arranged in a surface of substrate 310, also can be arranged on two surface.

Continue referring to Fig. 2, multiple LED unit 320 along substrate 310 longitudinal arrangements to form uniform luminous zone.Although the LED unit shown in figure is arranged on substrate with form in upright arrangement, arrangement mode is not limited to this, and for example can also arrange in the mode of multiple row or S shape in LED unit.LED unit 320 can adopt the form of packaged chip or tube core, and it is for example installed on substrate 310 by surface mount process.In addition, also can adopt surface mount process that the components and parts of driving power module 330 to be described in detail below are arranged on substrate 310.

In the light source shown in Fig. 2 and driving power integrated unit 30, multiple LED unit 320 is coupled in series in together, driving power module 330 is for example electrically connected by the wiring on substrate 310 and LED unit 320, thereby provides constant electric current and/or voltage to the latter.It is worthy of note, although multiple LED unit here with coupled in series together, they also can be in parallel, the form of series-parallel connection or crossed array is coupled.

As shown in Figure 2, the components and parts of driving power module 330 are arranged in the two ends of substrate 310.In addition, be provided with pin 340A and 340B in wherein one end of substrate 310, respectively as the first electrode of driving power module 330 and the second electrode (therefore following pin 340A and 340B are called again to " electrode pin ").After completing assembling, electrode pin 340A and 340B respectively with end cap 21 on pin 211A and 211B electrical connection.In the time of work, one of them in pin 340A and 340B corresponding pin on end cap 21 for example, is electrically connected with the live wire of external ac power source (civil power), and the pin of another pin on end cap 21 and the zero line electrical connection of external ac power source, thereby external ac power source is powered to driving power module 330.In the structure shown in Fig. 2, electrode pin 340A and 340B are welded on substrate 310.In order to reinforce electrode pin, can make electrode pin pass substrate 310 and be welded on the another side of substrate 310.

Referring to Fig. 2, alternatively, the other end of substrate 310 also arrange a pair of respectively with end cap 22 on pin 221A and pin 350A and the 350B of 221B electrical connection, these two pins are through linking together after substrate 310, thereby are securely fixed on substrate 310.Preferably, pin 350A and 350B can be integrated parts.

Will recognize that from the following description, a pair of pin 350A being directly connected and 350B are set on the other end relative with one end that electrode pin 340A and 340B are set can greatly facilitate the installation of LED fluorescent lamp.

Fig. 3 A is the wiring diagram of common fluorescent lamp that adopts Inductive ballast, wiring diagram when Fig. 3 B is common fluorescent lamp shown in LED fluorescent lamp alternate figures 3A embodiment illustrated in fig. 1.

In common fluorescent lamp lighting circuit, lamp socket generally comprises two pairs of sockets, and fluorescent lamp two inserts respectively in two pairs of sockets pin.As shown in Figure 3A, different connect starter 3 between to socket B, the D of socket adhering to separately, socket A is electrically connected to the live wire L of external power source, and socket C is electrically connected to the zero line N of external power source through Inductive ballast 4, after installation, two pairs of pins of common fluorescent lamp 2 respectively with socket A, B and socket C and D electrical connection.Compared with Fig. 3 A, under the mode of connection shown in Fig. 3 B, starter 3 is connected device 5 and substitutes.Preferably, this connector 5 is removable and adopts the form of similar starter, that is, it comprise with Inductive ballast on the Interface Terminal that matches of starter socket.

Although above-mentioned by the embodiment described in Fig. 1 and 2 in, the electrode pin 340A of light source and driving power integrated unit 30 and 340B are directly connected on two pins of same end cap, but in the time that LED fluorescent lamp 1 is installed on lamp socket, the position of electrode pin be there is no to special requirement.That is to say, no matter the pin of connecting electrode pin is arranged in hot side (with socket A and B electrical connection) or the neutral side (with socket C and D electrical connection) of wiring diagram shown in Fig. 3 B, and external power source can be to LED fluorescent lamp 1 normal power supply.Particularly, for example, when electrode pin 340A and 340B are respectively with socket A and B electrical connection and pin 350A and 350B during respectively with socket C and D electrical connection, electrode pin 340A and live wire L electrical connection, meanwhile, because the pin 350A and the 350B that are positioned at substrate 310 other ends are shorted together, so electrode pin 340B can be electrically connected to zero line N through connector 5, pin 350A and 350B and Inductive ballast 4, realize thus the power supply of external power source to light source and driving power integrated unit.On the other hand, when electrode pin 340A and 340B are respectively with socket C and D electrical connection and pin 350A and 350B during respectively with socket A and B electrical connection, electrode pin 340A can be electrically connected to zero line N through Inductive ballast 4, meanwhile, because the pin 350A and the 350B that are positioned at substrate 310 other ends are shorted together, so electrode pin 340B can be electrically connected through connector 5, pin 350A and 350B and live wire L, thereby has realized equally the power supply of external power source to LED driving power.

Fig. 4 A is the wiring diagram of common fluorescent lamp that adopts electric ballast, wiring diagram when Fig. 4 B is common fluorescent lamp shown in LED fluorescent lamp alternate figures 4A embodiment illustrated in fig. 1.

As shown in Figure 4 A, live wire L and the zero line N of external ac power source are electrically connected to electric ballast 5, and socket A, B, C and the D of lamp socket is electrically connected with the lead-out terminal of electric ballast 6.After installation, two pairs of pins of common fluorescent lamp 2 respectively with socket A, B and socket C and D electrical connection.Compared with Fig. 4 A, under the mode of connection shown in Fig. 4 B, electric ballast 6 is removed, and be directly connected, and another is electrically connected to respectively live wire L and the zero line N of external ac power source to socket C and D between socket B and D.Equally, in Fig. 4 B, no matter the pin of connecting electrode pin is positioned at hot side (with socket A and B electrical connection) or neutral side (with socket C and D electrical connection), and external ac power source can be to LED fluorescent lamp 1 normal power supply.If for example electrode pin 340A and 340B are electrically connected with socket A and B respectively, pin 350A and 350B are electrically connected with socket C and D respectively, electrode pin 340A and live wire L electrical connection, meanwhile, electrode pin 340B is electrically connected to zero line N through pin 350A and 350B, has realized thus the power supply of external power source to light source and driving power integrated unit.On the other hand, if electrode pin 340A and 340B are electrically connected with socket C and D respectively, pin 350A and 350B are electrically connected with socket A and B respectively, electrode pin 340A is electrically connected to zero line N, and electrode pin 340B can be through pin 350A and 350B and live wire L electrical connection, thereby realize equally the power supply of external power source to LED driving power.

Although it is pointed out that the components and parts of drive circuit module 330 are arranged on the two ends of substrate 310 as shown in Figure 2, it is also feasible that these components and parts are only arranged on to one end.Also it is to be noted, also can be arranged on the two ends of substrate 310 as the pin 340A of LED driving power electrode and 340B, under this set layout, pin 340A and 330B be live wire and the zero line electrical connection of the pin on different end caps and external ac power source respectively.

In order to improve heat-sinking capability, heat sink 40 can be provided in body 10 and the substrate 310 of light source and driving power integrated unit 30 is arranged on heat sink 40.

Fig. 5 is the schematic diagram that can be used for the heat sink of the fluorescent lamp of LED shown in Fig. 1.As shown in Figure 5, heat sink 40 is for example also strip, and its both sides of the edge upwards bend to form inwall 401.Preferably, on the inwall 401 of heat sink 40, offering groove inserts with substrate 310.In order to expand area of dissipation, can on the lower surface of heat sink 40 shown in Fig. 5, be formed with fin.Alternatively, also the lower surface of heat sink can be made into cambered surface, this has expanded surface area on the one hand, is also convenient on the other hand heat sink to pack in body 10.

Schematic diagram when Fig. 6 shows light source in the fluorescent lamp of LED shown in Fig. 1 and driving power integrated unit and heat sink and is assembled together.As shown in Figure 6, be fixed together thereby the substrate 310 of light source and driving power integrated unit 30 inserts the groove of heat sink 40, the heat of LED unit and the generation of driving power module can be passed to heat sink thus.In the present embodiment, heat sink can be made up of ceramic material, metal material or heat conductive insulating polymer composite.In addition, in order further to improve heat-sinking capability, can be at heat sink surface coverage infrared radiant material, or adopt the material that has good insulation heat-conducting property and infrared radiation property concurrently to make heat sink.

It is worthy of note, also can adopt alternate manner that light source and driving power integrated unit 30 are fixed together with heat sink 40.For example can the substrate 310 of light source and driving power integrated unit 30 be adhered on heat sink 40 with heat-conducting glue.

The heat sink 40 that is equipped with light source and driving power integrated unit 30 can adopt variety of way to be fixed on body 10 inside.For example, in the time that body adopts glass to make, heat sink 40 can be packed in body 10, apply the adhesive such as clay and end cap is enclosed within to body two ends at the outer surface at body 10 two ends and/or the inwall of end cap 21,22 subsequently, corresponding pin on pin and end cap on substrate 310 is electrically connected together, finally heats the two ends of body 10.In heating process, thereby clay expanded by heating is fixed on heat sink and end cap the end of body.The body of and for example making for plastic material can be offered and insert fixing for heat sink along body groove extending longitudinally on inboard wall of tube body.

In order to facilitate the electrical connection of pin and pin, preferably, for example, can offer in end cap inside and the jack of external pin conductive communication, therefore in the time that end cap is installed, realize the electrical connection of itself and pin by pin being inserted to jack.

It is pointed out that, in the time that the substrate 310 of light source and driving power integrated unit 30 has enough heat-sinking capabilities, heat sink is also omissible.Now can adopt mode similar to the above directly substrate 310 to be fixed on to body 10 inside.For example, for canals of stilling, can by the adhesive of clay and so on, substrate and end cap be fixed on as mentioned above to the end of body.And for example, for plastic tube body, can on inboard wall of tube body, offer and insert fixing with substrate along body groove extending longitudinally.

In the time that body adopts glass, can adopt double pipe structure as shown in Figure 7.For simplicity, Fig. 7 only illustrates the structure division different from the fluorescent lamp of LED shown in Fig. 1.As shown in Figure 7, body 10 comprises inner tube 11 and is enclosed within the outer tube 12 outside inner tube 11.It will be appreciated that, outer tube 12 is enclosed within layout outside inner tube 11 and should be broadly interpreted as and at least comprises following state: the outer surface of inner tube 11 contacts completely with the inner surface of outer tube 12; And have at least a part to have gap between inner tube 11 and outer tube 12.

For fear of glare effect, can do frosted processing (for example using acid solution to make inner tube surface roughening) at least one surface in the inner surface of inner tube 11 and outer surface.Alternatively, also can consider to apply light spread powder or at least one in outer tube surfaces externally and internally done to frosted processing at the inner surface of outer tube 12.In the present embodiment, because substrate 310 or the heat sink 40 of light source and driving power integrated unit 30 are arranged in inner tube 11, so can avoid circuit board to hang the light spread powder on outer tube 12 inner surfaces in assembling process.

Continue referring to Fig. 7, outer tube 12 inwardly shrinks at its 121 places, end, makes the external diameter of outer tube end be less than the external diameter of remainder.In the process that outer tube end is inwardly shunk, the stress of outer tube wall is effectively discharged, and has improved thus intensity, thereby is conducive to reduce the loss in transport and assembling process.The object that it is pointed out that contraction is intended to discharge stress, and therefore the internal diameter of outer tube 12 might not need to dwindle.In the present embodiment, inner tube 11 is slightly shorter than the length of outer tube 12, makes in the LED fluorescent lamp after assembling completes, and inner tube 11 is positioned at outer tube 12 inside completely.But for inner tube 11 also being showed in Fig. 7, the right part of the inner tube 11 has here extended to the outside of outer tube 21.Alternatively, the length of inner tube 11 also can be longer than outer tube 12, and therefore after assembling completes, outer tube 12 is extended at the two ends of inner tube 11.

Below driving power module is explained in detail.

Driving power module can adopt the circuit of various topological structures, for example, include but not limited to non-isolated buck-type topological circuit structure, reverse exciting topological circuit structure and half-bridge LLC topological circuit structure etc.Can be referring to " LED illumination driving power source and Design of Luminaires " book of the 1st edition in People's Telecon Publishing House's May in 2011 about the detailed description of driving power module, this publication in full way of reference comprises in this manual.

In the embodiment described above, driving power module 330 can multiple type of drive (mode such as such as constant voltage power supply, constant current-supplying and constant pressure and flow power supply) provide suitable curtage to LED unit, it can be made up of one or more independently parts, preferably, the one or more parts in driving power module are realized with the form of wafer or packaged chip.

The circuit theory diagrams that Fig. 8 is a kind of driving power module of comprising in light source shown in Fig. 2 and driving power integrated unit.

Driving power module 330 shown in Fig. 8 comprises bridge rectifier filter unit 331, DC-DC boosting inverter unit 332A and feedback unit 333, below unit is further described.

As shown in Figure 8, bridge rectifier filter unit 331 comprises full-bridge rectifier BR1, capacitor C1, C2, C3, piezoresistor R1 and inductor L1.Alternating current (for example civil power) is exported all-wave pulsating volage after full-bridge rectifier BR1 rectification on positive terminal 1.Filter condenser C1, C2, C3, piezoresistor R1 and inductor L1 form EMI filter circuit, and it suppresses the impact on drive circuit of High-frequency Interference in AC network on the one hand, suppresses on the other hand the electromagnetic interference of drive circuit to AC network.

It is worthy of note, although shown here is way of full-wave rectification, halfwave rectifier is also available.

Referring to Fig. 8, filter condenser C1 and piezoresistor R1 are connected in parallel between the ac input end B3 and B4 of full-bridge rectifier BR1, and wherein piezoresistor R1 clamps down on the input voltage of full-bridge rectifier BR1 in predetermined level by suppressing the abnormal overvoltage occurring in circuit.Filter condenser C2, C3 and inductor L1 composition π type filter circuit and electrical connection are between the positive terminal B1 and negative pole end B2 of full-bridge rectifier BR1, so that the pulsating volage of full-bridge rectifier BR1 output is carried out to LPF, the negative pole end B2 is here grounded.

DC-DC boosting inverter unit 332A and bridge rectifier filter unit 331, feedback unit 333 and LED load LED1-LEDn(are also light source shown in Fig. 2 and multiple LED unit 320 together with series coupled in driving power integrated unit) electrical connection, its pulsating volage that bridge rectifier filter unit 331 is exported is promoted to required voltage and current level and offers LED load.In addition, DC-DC boosting inverter unit 332A also with feedback unit 333 collaborative works so that offer the electric current of LED load and voltage keeps constant and realizes power factor correcting function.Under typical application scenario, the total voltage after multiple LED units in series is designed to exceed the voltage peak of electrical network input, and therefore the lifting of voltage is essential.220V alternating current taking fluctuation range as ± 10% is as example, and its ceiling voltage is about 342V, and LED series voltage will exceed 342V.

In the driving power module shown in Fig. 8, DC-DC boosting inverter unit 332A comprises inductor L2, switching diode D1, capacitor C6 and switch adjuster U1.

Preferably, can adopt the IC chip that is integrated with pulsewidth modulation (PWM) controller and metal oxide semiconductor field effect tube (below again referred to as metal-oxide-semiconductor) as switch adjuster U1, wherein the output of PWM controller and the grid of metal-oxide-semiconductor are electrically connected to realize the control to metal-oxide-semiconductor turn-on and turn-off.In concrete switch adjuster chip, in order to simplify the adjusting of dutycycle, the switching frequency that can keep metal-oxide-semiconductor is definite value (for example about 1MHz), and the turn-off time of metal-oxide-semiconductor is adjustable; Or the turn-off time that can keep metal-oxide-semiconductor is definite value (for example about 320ns), and the switching frequency of metal-oxide-semiconductor is adjustable.Typically, this class switch adjuster chip generally all configure the feedback pin being electrically connected with the drain lead of the drain electrode electrical connection of metal-oxide-semiconductor, with the control end of PWM controller.CW12L30 and CW12L40 chip etc. that the example of above-mentioned switch adjuster is produced including, but not limited to Chinese Pu Xinda Electronics Co., Ltd..

As shown in Figure 8, inductor L2 and switching diode D1 are connected between bridge rectifier filter unit 331 and LED load, the wherein positive pole of switching diode D1 and inductor L2 electrical connection, the positive pole electrical connection of negative pole and LED load.Preferably, can adopt speed is fast, pressure drop is little Schottky diode as switching diode D1.Continue referring to Fig. 8, the drain lead D of switch adjuster U1 is electrically connected between inductor L2 and the positive pole of switching diode D1, and feedback pin FB(switch adjuster inner its with the control end electrical connection of PWM controller, therefore also referred to as control end) and feedback unit 333 be electrically connected.In addition, in the circuit shown in Fig. 8, the negative pole that the positive pole of capacitor C6 and LED load is connected to switching diode D1 altogether with in the time that switching diode D1 ends to LED load discharge.

Referring to Fig. 8, switch adjuster U1 comprises power pins VCC and grounding pin GND, and wherein power pins VCC is through capacitor C4 ground connection.

Feedback unit 333 comprises transistor Q1, resistor R2, R3 and capacitor C5.As shown in Figure 8, transistor Q1 adopts the type of attachment of common emitter amplifying circuit, wherein, colelctor electrode is electrically connected to the feedback pin FB of switch adjuster U1 feedback signal is provided to switch adjuster U1 through resistor R3, its emitter-base bandgap grading and ground connection are electrically connected using the common ground end as input circuit and output loop, and the loop of base stage access LED load is to extract detection signal.Resistor R2 is electrically connected between base stage and ground connection to form input circuit.In addition, the feedback pin FB of switch adjuster U1 is also through capacitor C5 ground connection.

The operation principle of the module of driving power shown in Fig. 8 330 is below described.

In the time connecting AC power, bridge rectifier filter unit 331 is transformed to pulsating volage by the alternating current of input and exports the inductor L2 of DC-DC boosting inverter unit 332A to.The metal-oxide-semiconductor of switch adjuster U1 inside under the control of PWM controller signals with very high frequency turn-on and turn-off.

In the time of metal-oxide-semiconductor conducting, under the effect of the output voltage of bridge rectifier filter unit 331, electric current flow through inductor L2 and metal-oxide-semiconductor, switching diode D1 ends because of the voltage on capacitor C6.Along with the electric current of the inductor L2 that flows through constantly increases, in inductor, the energy of storage is also on the increase.Now, LED load is powered by capacitor C6, and it relies on the discharge current work of capacitor C6.

In the time that metal-oxide-semiconductor switches to off state, the electric current of the inductor L2 that flows through starts to reduce, thereby brings out induced electromotive force at the two ends of inductor L2, and its polarity is lower just upper negative.The superimposed rear output voltage that promotes bridge rectifier filter unit 331 of output voltage of induced electromotive force and bridge rectifier filter unit 331.Now, the voltage of stack is higher than the voltage on capacitor C6, and therefore switching diode D1 enters conducting state, and LED load changes by inductor L2 powers, and capacitor C6 is also charged by inductor L2 and until metal-oxide-semiconductor switches to conducting state once again.In the circuit structure shown in Fig. 8, the size of induced electromotive force depends on the dutycycle of metal-oxide-semiconductor, therefore can promote amplitude by regulating the dutycycle of PWM controller output signal to obtain desirable voltage.

In the time that metal-oxide-semiconductor is switched back to conducting state once again, the superimposed voltage at switching diode D1 place starts to reduce and by again lower than the voltage on capacitor C6, therefore switching diode D1 enters cut-off state, LED load changes the power voltage supply to promote by capacitor C6, and inductor L2 starts storage of electrical energy.

Therefore under the control of PWM controller, metal-oxide-semiconductor constantly switches between above-mentioned turn-on and turn-off state, thereby makes the voltage on LED load positive pole remain at higher voltage levvl.

Referring to Fig. 8, LED load and resistor R4, R5 are connected in parallel between the negative pole and resistor R2 of switching diode D1, and the negative pole of LED load is electrically connected to the base stage of transistor Q1.In the time there is fluctuation in the electric current of the LED load of flowing through and/or voltage, the electric current of base stage of transistor Q1 of flowing through also can change, feedback signal after transistor Q1 amplifies exports the feedback pin of switch adjuster U1 to through resistor R3 from colelctor electrode, PWM controller can be adjusted the dutycycle of output signal according to feedback signal thus, makes thus the electric current and the voltage that offer LED load keep constant.

In the circuit structure shown in Fig. 8, the feedback pin FB of switch adjuster U1 is also through jumbo capacitor C5 ground connection, and this can make the response of feedback control loop slow down, feedback level in the alternating current transmission line half period close to constant.Substantially invariable feedback level is illustrated in electric current in metal-oxide-semiconductor corresponding to be sent to the average energy in LED load within the half period of alternating current circuit.Due to switch adjuster, U1 works in fixed frequency, and before metal-oxide-semiconductor ON time finishes, the increase of electric current can not exceed certain scope.By reduce the switching current of the metal-oxide-semiconductor of flowing through in the time that the alternating voltage of input increases, and in the time that reducing, the alternating voltage of input increases the switching current of the metal-oxide-semiconductor of flowing through, make the corrugated minimum of LED load input terminal, and exchange input current and can follow the tracks of the variation of AC-input voltage the moment, thereby realize the function of power factor correcting.

It is to be noted, in the embodiment shown in fig. 8, PWM controller and metal-oxide-semiconductor are integrated in same IC chip, in order further to improve integrated level, it is also conceivable that transistor Q1, PWM controller and metal-oxide-semiconductor three are integrated in same IC chip.

Alternatively, PWM controller and metal-oxide-semiconductor also can be provided in according in light source embodiment illustrated in fig. 2 and driving power integrated unit with the form of discrete component.Driving power module shown in Fig. 9 shows an example of this form, wherein adopts identical label to represent with same or analogous unit in Fig. 8.

Driving power module 330 shown in Fig. 9 comprises bridge rectifier filter unit 331, DC-DC boosting inverter unit 332A and feedback unit 333 equally.Bridge rectifier filter unit 331 and feedback unit 333 adopt form same as shown in Figure 3 and structure, repeat no more herein.

Referring to Fig. 9, DC-DC boosting inverter unit 332A comprises inductor L2, switching diode D1, capacitor C6, PWM controller U2 and metal-oxide-semiconductor T1, wherein, inductor L2 and switching diode D1 are connected between bridge rectifier filter unit 331 and the positive pole of LED load, the positive pole of switching diode D1 and inductor L2 electrical connection, the positive pole electrical connection of negative pole and LED load.In the present embodiment, the drain D of metal-oxide-semiconductor T1 is electrically connected between inductor L2 and the positive pole of switching diode D1, and source S is electrically connected to control end FB, and grid G is connected with the output P of PWM controller U2.PWM controller U2 generally provides with the form of IC chip, and its control end FB and feedback unit 333 are electrically connected.As shown in Figure 9, the negative pole that the positive pole of capacitor C6 and LED load is connected to switching diode D1 altogether with in the time that switching diode D1 ends to LED load discharge.

Feedback unit 133 comprises transistor Q1, resistor R2, R3 and capacitor C5 equally.Transistor Q1 adopts the type of attachment of common emitter amplifying circuit, wherein, colelctor electrode is electrically connected to the control end FB of PWM controller U2 feedback signal is offered to PWM controller U2 through resistor R3, its emitter-base bandgap grading and ground connection are electrically connected using the common ground end as input circuit and output loop, and the loop of base stage access LED load is to extract detection signal.The control end FB of PWM controller is also through capacitor C5 ground connection.

Similar to shown in Fig. 8 of the operation principle of the module of driving power shown in Fig. 9 therefore repeats no more herein.

The circuit theory diagrams that Figure 10 is the another kind of driving power module that comprises in light source shown in Fig. 2 and driving power integrated unit.

Driving power module 330 shown in Figure 10 comprises bridge rectifier filter unit 331, DC-DC decompression transformation unit 332B and feedback unit 333, below unit is further described.

As shown in figure 10, bridge rectifier filter unit 331 comprises full-bridge rectifier BR1, capacitor C2, C3, piezoresistor R1 and inductor L1.Alternating current (for example civil power) is exported all-wave pulsating volage after full-bridge rectifier BR1 rectification on positive terminal B1.Filter condenser C2, C3, piezoresistor R1 and inductor L1 form EMI filter circuit, and it suppresses the impact on drive circuit of High-frequency Interference in AC network on the one hand, suppresses on the other hand the electromagnetic interference of drive circuit to AC network.

Referring to Figure 10, piezoresistor R1 is connected in parallel between the ac input end B3 and B4 of full-bridge rectifier BR1, and wherein piezoresistor R1 clamps down on the input voltage of full-bridge rectifier BR1 in predetermined level by suppressing the abnormal overvoltage occurring in circuit.Filter condenser C2, C3 and inductor L1 composition π type filter circuit and electrical connection are between the positive terminal B1 of full-bridge rectifier BR1 and the negative pole end B2 of ground connection, so that the pulsating volage of full-bridge rectifier BR1 output is carried out to LPF.

DC-DC decompression transformation unit 332B and bridge rectifier filter unit 331, feedback unit 333 and LED load LED1-LEDn(are also light source shown in Fig. 2 and multiple LED unit 320 together with series coupled in driving power integrated unit) electrical connection, its pulsating volage that bridge rectifier filter unit 331 is exported is reduced to required voltage and current level and offers LED load.In addition, DC-DC decompression transformation unit 332B also with feedback unit 333 collaborative works so that offer the electric current of LED load and voltage keeps constant.

In the driving power module shown in Figure 10, DC-DC decompression transformation unit 332B comprises inductor L2, switching diode D1, capacitor C7, metal-oxide-semiconductor T2 and pulsewidth modulation (PWM) controller U3.

The output P of PWM controller U3 and the grid G of metal-oxide-semiconductor T2 are electrically connected to realize the control to metal-oxide-semiconductor turn-on and turn-off.The HV9910 type LED driver chip that the example of said PWM controller is produced including, but not limited to Supertex limited company of the U.S. etc.

As shown in figure 10, the anodal LED+ of the negative pole of switching diode D1 and LED load is connected to the output of bridge rectifier filter unit 331 jointly, and the positive pole of switching diode D1 is electrically connected with the drain D of metal-oxide-semiconductor T2.Preferably, can adopt speed is fast, pressure drop is little Schottky diode as switching diode D1.Inductor L2 is electrically connected between the negative pole LED-of LED load and the drain D of metal-oxide-semiconductor T2.Continue referring to Figure 10, PWM controller U3 also comprises feedback pin FB, and itself and feedback unit 333 are electrically connected.In addition,, in the circuit shown in Figure 10, capacitor C7 is connected in parallel between the anodal LED+ of LED load and negative pole LED-smoothly to offer the operating voltage of LED load.Can select according to the ripple value of the operating voltage allowing the capacitance of capacitor C7.

Referring to Figure 10, PWM controller U3 comprises power pins VCC and grounding pin GND, and wherein power pins VCC is through capacitor C4 ground connection.

Feedback unit 333 comprises resistor R6.As shown in figure 10, resistor R6 is electrically connected between the source S and ground connection of metal-oxide-semiconductor T2.On the other hand, the feedback pin FB that one end that is electrically connected to source S of resistor R6 is also electrically connected to PWM controller U3 is to offer feedback signal PWM controller U3.

The operation principle of the module of driving power shown in Figure 10 330 is below described.

In the time connecting AC power, bridge rectifier filter unit 331 is transformed to pulsating volage by the alternating current of input and exports DC-DC decompression transformation unit 332B to.Now, under the control of PWM controller U3, metal-oxide-semiconductor T2 constantly switches between above-mentioned turn-on and turn-off state, thereby makes the voltage on LED load two ends remain at certain voltage levvl.

Particularly, in the time of metal-oxide-semiconductor T2 conducting, switching diode D1 is in cut-off state.The output current of bridge rectifier filter unit 331 flows into and flow to inductor L2 from negative pole LED-from the anodal LED+ of LED load.The electric current of inductor L2 of flowing through will constantly increase until metal-oxide-semiconductor T2 turn-offs.Along with the electric current of the inductor L2 that flows through constantly increases, in inductor, the energy of storage is also on the increase.

In the time that metal-oxide-semiconductor T2 switches to off state, the electric current of the inductor L2 that flows through starts to reduce, thereby brings out induced electromotive force at the two ends of inductor L2, and its polarity is left positive right negative.After the output voltage of induced electromotive force and bridge rectifier filter unit 331 is superimposed higher than the voltage on capacitor C7, therefore switching diode D1 enters conducting state, thereby provides afterflow path until metal-oxide-semiconductor T2 switches to conducting state once again for the electric current of inductor L2.In the circuit structure shown in Figure 10, can obtain desirable lower voltage amplitude by the dutycycle that regulates PWM controller output signal.

Referring to Figure 10, resistor R6 is electrically connected between the source S and ground connection of metal-oxide-semiconductor T2.Because the voltage at resistor R6 two ends is corresponding to the electric current of flow through metal-oxide-semiconductor T2 and inductor L2, the feedback pin FB that therefore this voltage can be applied in PWM controller U3 is as feedback signal.Particularly, when after metal-oxide-semiconductor T2 conducting, the electric current of inductor L2 constantly increases, in the time that the voltage at resistor R6 two ends exceedes default peak current detection threshold value, on pin P, export the control signal of turn-offing metal-oxide-semiconductor T2 by triggering PWM controller U3, can realize constant current control by the peak point current of controlling metal-oxide-semiconductor T2 thus.Obviously, reach the time that peak point current spends relevant with the inductance value of inductor L2, more Current rise speed is slower for inductance value, arrives the peak point current time used longer, and vice versa.

It is pointed out that because capacitor C7 is connected in parallel between LED load as shown in figure 10, so pulsation that can smoothing current rises and falls, the electric current of the LED load that makes to flow through is more constant.

Alternatively, PWM controller U3 and metal-oxide-semiconductor T2 can be provided in according in light source embodiment illustrated in fig. 2 and driving power integrated unit to be integrated in the form of same IC chip.Driving power module shown in Figure 11 shows an example of this form, wherein adopts identical label to represent with same or analogous unit in Figure 10.

Driving power module 330 shown in Figure 11 comprises bridge rectifier filter unit 331, DC-DC decompression transformation unit 332B and feedback unit 333 equally.Bridge rectifier filter unit 331 and feedback unit 333 adopt form same as shown in Figure 10 and structure, repeat no more herein.

DC-DC decompression transformation unit 332B and bridge rectifier filter unit 331, feedback unit 333 and LED load LED1-LEDn electrical connection, its pulsating volage that bridge rectifier filter unit 331 is exported is reduced to required voltage and current level and offers LED load.In addition, DC-DC decompression transformation unit 332B also with feedback unit 333 collaborative works so that offer the electric current of LED load and voltage keeps constant.

In the driving power module shown in Figure 11, DC-DC decompression transformation unit 332B comprises inductor L2, switching diode D1, capacitor C7 and switch adjuster U4.

Preferably, can adopt the IC chip that is integrated with pulsewidth modulation (PWM) controller and metal-oxide-semiconductor as switch adjuster U1, wherein the output of PWM controller and the grid of metal-oxide-semiconductor are electrically connected to realize the control to metal-oxide-semiconductor turn-on and turn-off.Typically, this class switch adjuster chip generally all configures the drain lead being electrically connected with the drain electrode of metal-oxide-semiconductor and the source lead being electrically connected with the source electrode of metal-oxide-semiconductor, and preferably, source lead is electrically connected so that the detection signal corresponding with the electric current of the metal-oxide-semiconductor of flowing through fed back to PWM controller with the control end of PWM controller.The SSL2108x type LED illumination driver chip that the example of above-mentioned switch adjuster is produced including, but not limited to Dutch En Zhi Pu semiconductor company etc.

As shown in figure 11, the anodal LED+ of the negative pole of switching diode D1 and LED load is connected to the output of bridge rectifier filter unit 331 jointly, and the positive pole of switching diode D1 is electrically connected with the drain lead D of switch adjuster U4.Inductor L2 is electrically connected between the negative pole LED-of LED load and the drain lead D of switch adjuster U4.Continue referring to Figure 11, switch adjuster U4 also comprises source lead S, and its control end at chip internal and PWM controller is electrically connected and is electrically connected in chip exterior and feedback unit 333.In addition,, in the circuit shown in Figure 11, capacitor C7 is connected in parallel between the anodal LED+ of LED load and negative pole LED-smoothly to offer the operating voltage of LED load.

Referring to Figure 11, switch adjuster U4 comprises power pins VCC and grounding pin GND, and wherein power pins VCC is through capacitor C4 ground connection.

Feedback unit 333 comprises the resistor R6 between source S and the ground connection of switch adjuster U4 by electrical connection.As pointed when the driving power module of describing as shown in Figure 10, the voltage at resistor R6 two ends is corresponding to the electric current of flow through metal-oxide-semiconductor and inductor L2, and it is used as feedback signal and puts on the source S of switch adjuster U4 so that the PWM controller of switch adjuster U4 inside is realized constant current control by the peak point current of controlling metal-oxide-semiconductor.Similar to shown in Figure 10 of the operation principle of the module of driving power shown in Figure 11 therefore repeats no more herein.

Alternatively, the circuit of all right other function of integration realization in the driving power module shown in above-mentioned Fig. 8-11, such as adjusting control circuit, sensing circuit, intelligent lighting control circuit, telecommunication circuit and holding circuit etc.These circuit can be integrated in same semiconductor wafer or packaged chip with driving governor, or these circuit can provide with the form of semiconductor wafer or packaged chip individually, or some or all in these circuit can be combined and provide with the form of semiconductor wafer or packaged chip.

Adopt modular version convenient for assembly by the LED fluorescent lamp described in Fig. 1-11 above, therefore both can scale manufacture in factory, and be suitable for client or the consumer assembling of doing it yourself.

As an example of the LED fluorescent lamp of structure shown in Fig. 1 and 2 example, corresponding assembly method is described below.The parts to be assembled that provide comprise body 10, end cap 21 and 22, light source and driving power integrated unit 30 and heat sink 40.

According to the assembly method of one embodiment of the invention, first the substrate 310 of light source and driving power integrated unit 30 is inserted in the groove of inwall of heat sink 40, thereby substrate 310 and heat sink 40 are fixed together.Subsequently, the heat sink 40 that substrate 310 is set on it is put into body 10.For the body that adopts plastic material to make, can on body 10 inwalls, offer the groove extending longitudinally along body, heat sink 40 can be fixed with body by inserting in this groove like this.Then the two ends of the end cap 21 and 22 of inwall application of adhesive (for example epoxy resin) being covered at body 10, and make corresponding pin electrical connection on pin 340A, 340B, 350A and the 350B of driving power integrated unit 30 and end cap 21 and 22, thereby complete the assembling of the fluorescent lamp of LED shown in Fig. 1.As mentioned above, can offer in end cap inside and the jack of external pin conductive communication, therefore, in the time that end cap is installed, realize electrical connection by electrode pin being inserted to jack.

In the time that body is made up of glass, can adopt described below according to the assembly method of another embodiment of the present invention.Particularly, first the substrate 310 of light source and driving power integrated unit 30 is inserted in the groove of inwall of heat sink 40, thereby substrate 310 and heat sink 40 are fixed together.Subsequently, the heat sink 40 that substrate 310 is set on it is put into body 10, now heat sink 40 is not fixed on body 10.Then the end cap 21 and 22 of inwall application of adhesive (for example clay) is covered at the two ends of body 10, and make corresponding pin electrical connection on pin 340A, 340B, 350A and the 350B of driving power integrated unit 30 and end cap 21 and 22.Finally, for example, utilize the end of the heater heating body 10 of heading machine and so on, thereby make clay expanded by heating heat sink 40 and end cap 21,22 are fixed on to the end of body 10, complete thus the assembling of LED fluorescent lamp.

It is to be noted, in above-mentioned assembly method, adhesive such as epoxy resin and clay, except being coated in end cap inwall, also can be coated in the outer surface of body end, or can also be coated in the outer surface of end cap inwall and body end simultaneously.

As mentioned above, in the time that the substrate of light source and driving power integrated unit has enough heat-sinking capabilities, heat sink is also omissible.Assembling process has now been omitted the step that substrate and heat sink are assembled together, and can adopt mode similar to the above directly substrate to be fixed on to body inside.For example, for canals of stilling, can by clay, substrate and end cap be fixed on as mentioned above to the end of body.And for example, for plastic tube body, can on inboard wall of tube body, offer and insert fixing with substrate along body groove extending longitudinally.

Although represented and aspects more of the present invention be discussed, but those skilled in the art are to be appreciated that and can change aspect above-mentioned under the condition that does not deviate from the principle of the invention and spirit, therefore scope of the present invention will be limited by claim and the content that is equal to.

Claims (10)

1. a LED fluorescent lamp, comprising:

Body;

Be positioned at the end cap at described body two ends, on it, be provided with the pin of adaptive daylight lamp holder;

Light source and driving power integrated unit, comprising:

Substrate;

Multiple LED unit that are arranged on described substrate;

Driving power module, it is disposed in the one or both ends of described substrate and is electrically connected with described LED unit and described pin.

2. LED fluorescent lamp as claimed in claim 1, wherein, further comprises the heat sink that is fixed on described body inside, and described substrate setting thereon.

3. LED fluorescent lamp as claimed in claim 2, wherein, described heat sink surface applies infrared radiant material.

4. LED fluorescent lamp as claimed in claim 1, described substrate is ceramic substrate, heat conductive insulating polymer composite material board, glass mat, glass plate, copper-clad plate or aluminium base.

5. LED fluorescent lamp as claimed in claim 1, wherein, described driving power module comprises:

Rectification filtering unit;

DC-DC boosting inverter unit, comprise inductor, switching diode, PWM controller and metal-oxide-semiconductor, wherein, described inductor and switching diode are connected between described bridge rectifier filter unit and LED load, the drain electrode of described metal-oxide-semiconductor is electrically connected between described inductor and the positive pole of switching diode, the output electrical connection of grid and described PWM controller; And

Feedback unit, comprises transistor, and its base stage is electrically connected to the loop of described LED load, and colelctor electrode is electrically connected to the control end of described PWM controller.

6. LED fluorescent lamp as claimed in claim 1, wherein, described driving power module comprises:

Rectification filtering unit;

Decompression transformation unit, comprise inductor, switching diode, PWM controller and metal-oxide-semiconductor, wherein, the positive pole of the negative pole of described switching diode and described LED load is connected to the output of described bridge rectifier filter unit altogether, the drain electrode of described metal-oxide-semiconductor and the electrical connection of the positive pole of described switching diode, the output electrical connection of grid and described PWM controller, and described inductor is electrically connected between the drain electrode of described metal-oxide-semiconductor and the negative pole of described LED load; And

Feedback unit, comprises resistor, and the control end of itself and described PWM controller is connected to the source electrode of described metal-oxide-semiconductor altogether.

7. the assembly method of LED fluorescent lamp as claimed in claim 1, described body is made up of plastics, offers along its groove extending longitudinally on described inboard wall of tube body, and described driving power module also comprises the pin that is arranged on described substrate two ends, it is characterized in that, comprise the following steps:

Described substrate is inserted in the groove of described inboard wall of tube body;

At outer surface and/or the described end cap inwall application of adhesive at described body two ends; And

Described end cap is enclosed within to the two ends of described body and makes described pin and corresponding described pin is electrically connected together.

8. the assembly method of LED fluorescent lamp as claimed in claim 1, described LED fluorescent lamp further comprises that inwall offers reeded heat sink, described body is made up of plastics, on described inboard wall of tube body, offer along its groove extending longitudinally, described driving power module also comprises the pin that is arranged on described substrate two ends, it is characterized in that, comprise the following steps:

Described substrate is inserted in the groove of described heat sink inwall;

Described heat sink is inserted in the groove of described inboard wall of tube body;

At outer surface and/or the described end cap inwall application of adhesive at described body two ends; And

Described end cap is enclosed within to the two ends of described body and makes described pin and corresponding described pin is electrically connected together.

9. an assembly method for LED fluorescent lamp as claimed in claim 1, described body is made up of glass, and described driving power module also comprises the pin that is arranged on described substrate two ends, it is characterized in that, comprises the following steps:

Described substrate is put into described body;

At outer surface and/or the described end cap inwall application of adhesive at described body two ends;

Described end cap is enclosed within to the two ends of described body and makes described pin and corresponding described pin is electrically connected together; And

Heat described body two ends so that described body, described substrate and described end cap be fixed together.

10. an assembly method for LED fluorescent lamp as claimed in claim 1, described body is made up of glass, and described driving power module also comprises the pin that is arranged on described substrate two ends, it is characterized in that, comprises the following steps:

Described substrate is inserted in the groove of described heat sink inwall;

Described heat sink is put into described body;

At outer surface and/or the described end cap inwall application of adhesive at described body two ends;

Described end cap is enclosed within to the two ends of described body and makes described pin and corresponding described pin is electrically connected together; And

Heat described body two ends so that described body, described substrate and described end cap be fixed together.