CN103899939A - LED fluorescent lamp and installation method thereof - Google Patents

LED fluorescent lamp and installation method thereof Download PDF

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Publication number
CN103899939A
CN103899939A CN201210583504.1A CN201210583504A CN103899939A CN 103899939 A CN103899939 A CN 103899939A CN 201210583504 A CN201210583504 A CN 201210583504A CN 103899939 A CN103899939 A CN 103899939A
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led
fluorescent lamp
socket
electrically connected
pin
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CN201210583504.1A
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Chinese (zh)
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李文雄
赵依军
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Individual
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Abstract

The invention relates to the semiconductor lighting technology, in particular to an LED fluorescent lamp and an installation method thereof. The LED fluorescent lamp according to embodiments comprises a glass inner tube, a glass outer tube enclosing the glass inner tube, end covers covering two ends of the glass inner tube, an LED drive power source, a plurality of LED units, and a drive circuit module; each end cover is provided with pins adapting to a fluorescent lamp holder; the LED drive power source comprises an elongated substrate fixed within the glass inner tube; the drive circuit module is arranged at one end or two ends of the elongated substrate and electrically connected with the LED units and the pins.

Description

LED fluorescent lamp and installation method thereof
Technical field
The present invention relates to semiconductor lighting technology, particularly the installation method of LED fluorescent lamp and this fluorescent lamp.
Background technology
The light emitting diode (LED) that is used as at present light source in lighting device is a kind of solid-state semiconductor devices, and its basic structure generally comprises the support of band lead-in wire, the encapsulating material (for example silica gel or epoxy resin) that is arranged on the semiconductor wafer on support and this wafer surrounding is sealed.Above-mentioned semiconductor wafer includes P-N structure, and in the time that electric current passes through, electronics is pushed to P district, and in P district, electronics, with hole-recombination, then sends energy with the form of photon, and light wavelength is to be determined by the material that forms P-N structure.
Compared with traditional fluorescent lamp, LED fluorescent lamp has that photoelectric transformation efficiency is high, light-source brightness is constant, without stroboscopic with containing plurality of advantages such as harmful heavy metals.Typical LED fluorescent tube is made up of tube tube body, end cap, lamp plate and driving power, and wherein driving power can be built in body or be arranged on body outside.
Chinese utility model patent 200920134372.8 discloses a kind of by fluorescent lamp external LED power supply, it comprises LED daylight lamp body, on this lamp body, be connected with external LED power supply, this LED power supply comprises PCB circuit board, input and output terminal, power pack, PCB circuit board is built in power pack, and input terminal is connected with LED daylight lamp body by PCB circuit board, lead-out terminal.Adopt external power supply to do larger change to the mode of connection of fluorescent lamp, and install also inconvenient.
Chinese invention patent application 201110037855.9 discloses a kind of LED fluorescent lamp, the end cap that it comprises fluorescent tube and is arranged on lamp tube ends, wherein fluorescent tube comprises plurality of LEDs on lamp plate of lamp plate, array and is positioned at the bright dipping case above LED, the step-down constant-current source module that constant current is provided to LED is installed in end cap, and the both positive and negative polarity conducting end of lamp plate is connected to the output of step-down constant-current source module.For above-mentioned fluorescent lamp, in lamp plate installation process, lamp plate edge easily and tube inner wall grazing, thereby wipe the light spread powder being coated on inwall off.In addition, above-mentioned LED fluorescent lamp has been abandoned the constraint of original daylight lamp holder in design completely, although this is conducive to optimize fluorescent structure and circuit design, not good with the compatibility of existing daylight lamp holder.
Summary of the invention
An object of the present invention is to provide a kind of LED fluorescent lamp, it has compact conformation and the advantage such as manufacturing process is simple.
LED fluorescent lamp according to one embodiment of the invention comprises:
Glass inner tube;
Be enclosed within the glass outer tube outside described glass inner tube;
Seal described glass inner tube two ends end cap, on it, be provided with the pin of adaptive daylight lamp holder;
LED driving power, comprising:
Be fixed on the strip substrate of described glass inner tube inside;
Multiple LED unit that are arranged on described strip substrate;
Drive circuit module, it is disposed in the one or both ends of described strip substrate and is electrically connected with described LED unit and described pin.
In the above-described embodiments, by substrate is arranged in glass inner tube, the light spread powder on can cover glass outer pipe internal surface is not scratched.In addition, LED unit and drive circuit module are integrated in the volume that has reduced photovoltaic element on same substrate, and this is conducive to the optimization of LED fluorescent lamp general structure.
Preferably, in above-mentioned LED fluorescent lamp, inwardly shrink described glass outer tube end.Better, in above-mentioned LED fluorescent lamp, the outer surface of described glass outer tube end inwardly shrinks to form step, and described end cap covers described step.Through after shrink process, the stress of glass tube is effectively discharged, and has therefore improved body intensity.
Preferably, in above-mentioned LED fluorescent lamp, the inner surface of described glass inner tube and/or outer surface are the surface through frosted processing.
Preferably, in above-mentioned LED fluorescent lamp, the inner surface of described glass outer tube covers light spread powder.
Preferably, in above-mentioned LED fluorescent lamp, the inner surface of described glass outer tube and/or outer surface are the surface through frosted processing.
Preferably, in above-mentioned LED fluorescent lamp, described strip substrate is bonded to the two ends of described glass inner tube.
Preferably, in above-mentioned LED fluorescent lamp, described strip substrate is aluminium base or double-sided printed-circuit board.
Preferably, in above-mentioned LED fluorescent lamp, described LED unit is coupled with series, parallel or series-parallel connection mode.
Preferably, in above-mentioned LED fluorescent lamp, described drive circuit module comprises:
Bridge rectifier filter unit;
DC-DC boosting inverter unit, comprise inductor, switching diode, PWM controller and metal-oxide-semiconductor, wherein, described inductor and switching diode are connected between described bridge rectifier filter unit and the LED unit of series coupled, the drain electrode of described metal-oxide-semiconductor is electrically connected between described inductor and the positive pole of switching diode, the output electrical connection of grid and described PWM controller; And
Feedback unit, comprises transistor, and its base stage is electrically connected to the loop of the LED unit of described series coupled, and colelctor electrode is electrically connected to the control end of described PWM controller.
In the above-described embodiments, provide feedback signal by transistor to PWM controller, realized the function of constant current and constant voltage simultaneously.In addition, in the drive circuit module of said structure, component number is less and can realize miniaturization, therefore makes LED unit and drive circuit module be integrated on same substrate and become possibility.
Preferably, in the above-described embodiments, described drive circuit module also comprises the capacitor of electrical connection between control end and the ground connection of described PWM controller.By selecting large value capacitor, can make backfeed loop response slow down, thereby reach the object of power factor correcting.
Preferably, in the above-described embodiments, described PWM controller and metal-oxide-semiconductor are integrated in same IC chip.Or preferably, described PWM controller, metal-oxide-semiconductor and transistor are integrated in same IC chip.The integrated reliability that improved of above-mentioned multiple semiconductor devices, and contribute to the miniaturization of drive circuit module.
Preferably, in above-mentioned LED fluorescent lamp, described drive circuit module also comprises the pair of pins of the first end that is arranged on described strip substrate, and it is electrically connected with live wire and the zero line of external ac power source respectively through described pin.
Preferably, in above-mentioned LED fluorescent lamp, described drive circuit module also comprises a pair of directly connected pin, and it is arranged on second end relative with described first end.
Of the present invention also have an object to be to provide a kind of method that above-mentioned LED fluorescent lamp is installed, and it has easy-to-install advantage.
In the installation method of above-mentioned LED fluorescent lamp, lamp socket comprises first pair of socket and second pair of socket, wherein, between one of them socket in one of them socket in described first pair of socket and described second pair of socket, electrical connection has connector, another socket in described first pair of socket is electrically connected to the live wire of external ac power source, and another socket in described second pair of socket is electrically connected to the zero line of external ac power source through Inductive ballast.
Preferably, described connector be removable and comprise with described Inductive ballast on the Interface Terminal that matches of starter socket.
Accompanying drawing explanation
Above-mentioned and/or other side of the present invention and advantage become the description of the various aspects by below in conjunction with accompanying drawing more clear and are easier to understand, and in accompanying drawing, same or analogous unit adopts identical label to represent.
Fig. 1 is according to the decomposing schematic representation of the LED fluorescent lamp of one embodiment of the invention.
Fig. 2 is the schematic diagram that can be used for the LED driving power of the fluorescent lamp of LED shown in Fig. 1.
Fig. 3 is the partial schematic diagram of LED fluorescent lamp shown in Fig. 1.
Fig. 4 A is the wiring diagram of common fluorescent lamp that adopts Inductive ballast, wiring diagram when Fig. 4 B is common fluorescent lamp shown in LED fluorescent lamp alternate figures 4A embodiment illustrated in fig. 1.
Fig. 5 A is the wiring diagram of common fluorescent lamp that adopts electric ballast, wiring diagram when Fig. 5 B is common fluorescent lamp shown in LED fluorescent lamp alternate figures 5A embodiment illustrated in fig. 1.
The circuit theory diagrams that Fig. 6 is a kind of drive circuit module of comprising in the driving power of LED shown in Fig. 2.
The circuit theory diagrams that Fig. 7 is the another kind of drive circuit module that comprises in the driving power of LED shown in Fig. 2.
Reference list:
1LED fluorescent lamp
10 bodys
11 inner tubes
12 outer tubes
21,22 end caps
211A, 211B, 212A, 212B pin
30LED driving power
310 substrates
320 light emitting diodes (LED) unit
330 driving power modules
331 bridge rectifier filter units
332DC-DC boosting inverter unit
333 feedback units
BR1 full-bridge rectifier
C1, C2, C3, C4, C5, C6 capacitor
D1 switching diode
L1, L2 inductor
LED1-LEDn LED load
Q1 transistor
R1, R2, R3, R4, R5 resistor
T1 metal-oxide-semiconductor
U1 switch adjuster
U2 PWM controller
340A, 340B, 350A, 350B pin
40 adhesives
2 common fluorescent lamps
3 starters
4 Inductive ballasts
5 connectors
6 electric ballasts
The specific embodiment
Below with reference to the accompanying drawing that wherein illustrates illustrative examples of the present invention, the present invention is described more all sidedly.But the present invention can realize by multi-form, and should not be read as the each embodiment that only limits to provide herein.The various embodiments described above that provide are intended to make disclosure herein comprehensively complete, convey to more all sidedly those skilled in the art's protection scope of the present invention.
In this manual, unless stated otherwise, term " semiconductor crystal wafer " such as refers to, at the upper multiple independently single circuit that form of semi-conducting material (silicon, GaAs etc.), " semiconductor wafer " or " wafer (die) " refers to this single circuit, and " packaged chip " refers to the physical arrangement of semiconductor wafer after encapsulation, in typical this physical arrangement, semiconductor wafer is for example installed on support and encapsulates with encapsulant.
Term " light emitting diode " refers to the unit that comprises electroluminescent material, and the example of this unit includes but not limited to P-N knot inorganic semiconductor light emitting diode and Organic Light Emitting Diode (OLED and polymer LED (PLED)).
P-N knot inorganic semiconductor light emitting diode can have different version, for example, include but not limited to LED core and light emitting diode monomer.Wherein, " LED core " refers to and includes semiconductor wafer P-N structure, that have electroluminescent ability, and " light emitting diode monomer " refers to the physical arrangement forming after die package, in typical this physical arrangement, tube core is for example installed on support and encapsulates with encapsulant.
Term " wiring ", " wiring pattern " and " wiring layer " refer to the conductive pattern for being electrically connected between components and parts of arranging on insulating surface, include but not limited to cabling (trace) and hole (as pad, component hole, fastener hole and plated through-hole etc.).
Term " heat radiation " refer to object owing to thering is temperature the phenomenon of radiated electromagnetic wave.
Term " heat conduction " refers to heat and is sent to from the higher part of temperature in solid the transfer mode of the part that temperature is lower.
" electrical connection " and " coupling " should be understood to be included in the situation that directly transmits electric flux or the signal of telecommunication between two unit, or indirectly transmits the situation of electric flux or the signal of telecommunication through one or more Unit the 3rd.
" driving power " or " LED driving power " refers to and is connected to the interchange (AC) of lighting device outside or direct current (DC) power supply and as " electronic-controlled installation " between the light emitting diode of light source, is used to light emitting diode that required curtage (such as constant current, constant voltage or firm power etc.) is provided.In specific embodiment, driving power can modular structure be realized, for example it comprises printed circuit board (PCB) and one or more components and parts that are electrically connected together on printed circuit board (PCB) and by wiring that are arranged on, and the example of these components and parts includes but not limited to LED driving governor chip, rectification chip, resistor, capacitor and inductor or coil etc.
Term such as " comprising " and " comprising " represent except have in description and claims, have directly and the unit and step of clearly statement, technical scheme of the present invention is not got rid of yet and is had other unit of directly or clearly not explained and the situation of step.
Term such as " first ", " second ", " the 3rd " and " the 4th " does not represent that unit is to be only used as to distinguish each unit in the order of the aspects such as time, space, size.
Term such as " object A is arranged on the surface of object B " should be broadly interpreted as the surface that object A is directly placed on to object B, or object A is placed on to the surface that has other object contacting with object B.
By accompanying drawing, embodiments of the invention are described below.
Fig. 1 is according to the decomposing schematic representation of the LED fluorescent lamp of one embodiment of the invention.
LED fluorescent lamp 1 shown in Fig. 1 comprises body 10, is positioned at a pair of end cap 21,22 at body 10 two ends and is positioned at the LED driving power 30 of body 10.
As shown in Figure 1, body 10 comprises inner tube 11 and is enclosed within the outer tube 12 outside inner tube 11, and they can be made up of glass material.It will be appreciated that, outer tube 12 is enclosed within layout outside inner tube 11 and should be broadly interpreted as and at least comprises following state: the outer surface of inner tube 11 contacts completely with the inner surface of outer tube 12; And have at least a part to have gap between inner tube 11 and outer tube 12.
For fear of glare effect, can do frosted processing (for example using acid solution to make inner tube surface roughening) at least one surface in the inner surface of inner tube 11 and outer surface.Alternatively, also can consider to apply light spread powder or at least one in outer tube surfaces externally and internally done to frosted processing at the inner surface of outer tube 12.In the present embodiment, because the printed circuit board (PCB) of LED driving power 30 is arranged in inner tube 11, so can avoid circuit board to hang the light spread powder on outer tube 12 inner surfaces in assembling process.
Continue referring to Fig. 1, outer tube 12 inwardly shrinks at its 121 places, end, makes the external diameter of outer tube end be less than the external diameter of remainder.In the process that outer tube end is inwardly shunk, the stress of outer tube wall is effectively discharged, and has improved thus intensity, thereby is conducive to reduce the loss in transportation and assembling process.The object that it is pointed out that contraction is intended to discharge stress, and therefore the internal diameter of outer tube 12 might not need to dwindle.In the present embodiment, inner tube 11 is slightly shorter than the length of outer tube 12, makes in the LED fluorescent lamp after assembling completes, and inner tube 11 is positioned at outer tube 12 inside completely.But for inner tube 11 also being showed in Fig. 1, the right part of the inner tube 11 has here extended to the outside of outer tube 21.Alternatively, the length of inner tube 11 also can be longer than outer tube 12, and therefore after assembling completes, outer tube 12 is extended at the two ends of inner tube 11.
In each of end cap 21 and 22, be provided with and the pin of common fluorescent lamp base adaptation, in Fig. 1, be positioned at a pair of pin 211A, the 211B on end cap 21 outer surfaces and be positioned at another on end cap 22 outer surfaces to pin 221A, 221B.Pin provides the electrical connection between LED driving power 30 and external power source on the one hand, makes on the other hand LED fluorescent lamp can be fixed on lamp socket.It should be understood that shown in Fig. 1 to be the schematic diagram under decomposing state, in the time that LED fluorescent lamp 1 completes assembling, end cap 21 and 22 will seal respectively the two ends of inner tube 11.In the present embodiment, can for example, by adhesive (lamp mud) outer surface of the inner surface of end cap 21 and 22 and outer tube 12 be bonded together, thereby realize the fixing of end cap.
In the present embodiment, below can adopting, LED driving power 30 by the structure described in Fig. 2-5 and form, is wherein integrated on same substrate as LED unit and the driving power module of light source.
Fig. 2 is the schematic diagram that can be used for the LED driving power of the fluorescent lamp of LED shown in Fig. 1.
LED driving power 30 shown in Fig. 2 comprises substrate 310, multiple light emitting diode (LED) unit 320 and driving power module 330.Below each component units is further described.
Substrate 310 is strip as shown in Figure 2, and it can adopt the ceramic substrate of being made by mould pressing, and sheet material thicker (for example 1.5-3mm) and hardness that this method is manufactured are high.Alternatively, substrate 310 also can adopt heat conductive insulating polymer composite to make.In addition, in order to improve heat-sinking capability, can cover infrared radiant material at substrate surface, or adopt the material that has good insulation heat-conducting property and infrared radiation property concurrently to make substrate, thereby make to distribute with heat conduction and thermal-radiating mode from the heat of LED unit and driving power module simultaneously.It is pointed out that except above-mentioned pottery, heat conductive insulating polymer composite and infrared radiant material, substrate 310 can be also aluminium base or glass mat.In addition, the components and parts of LED power supply can be arranged in a surface of substrate 310, also can be arranged on two surface.
The substrate 310 of LED power supply 30 is fixed in the inside of inner tube 11, for example can substrate 310 be fixed on by the adhesive of silica gel and so on to the inner surface of inner tube 11 ends for this reason.
Continue referring to Fig. 2, multiple LED unit 320 along substrate 310 longitudinal arrangements to form uniform luminous zone.Although the LED unit shown in figure is arranged on substrate with form in upright arrangement, arrangement mode is not limited to this, and for example can also arrange in the mode of multiple row or S shape in LED unit.LED unit 320 can adopt the form of packaged chip or tube core, and it is for example installed on substrate 310 by surface mount process.In addition, also can adopt surface mount process that the components and parts of driving power module 330 to be described in detail below are arranged on substrate 310.
In the LED driving power shown in Fig. 2, multiple LED unit 320 is coupled in series in together, and drive circuit module 330 is for example electrically connected by the wiring on substrate 310 and LED unit 320, thereby provides constant electric current and/or voltage to the latter.It is worthy of note, although multiple LED unit here with coupled in series together, they also can be in parallel, the form of series-parallel connection or crossed array is coupled.
As shown in Figure 2, the components and parts of drive circuit module 330 are arranged in the two ends of substrate 310.In addition, be provided with pin 340A and 340B in wherein one end of substrate 310, respectively as the first electrode of LED drive circuit module 330 and the second electrode (therefore following pin 340A and 340B are called again to " electrode pin ").After completing assembling, electrode pin 340A and 340B respectively with end cap 21 on pin 211A and 211B electrical connection.In the time of work, one of them in pin 340A and 340B corresponding pin on end cap 21 for example, is electrically connected with the live wire of external ac power source (civil power), and the pin of another pin on end cap 21 and the zero line electrical connection of external ac power source, thereby external ac power source is powered to drive circuit module 330.In the embodiment shown in Figure 2, electrode pin 340A and 340B are welded on substrate 310.In order to reinforce electrode pin, can make electrode pin pass substrate 310 and be welded on the another side of substrate 310.
Alternatively, as shown in Figure 3, the other end of substrate 310 arrange a pair of respectively with end cap 22 on pin 221A and pin 350A and the 350B of 221B electrical connection, these two pins are through linking together after substrate 310, thereby are securely fixed on substrate 310.Preferably, pin 350A and 350B can be integrated parts.In addition, the end of substrate 310 is fixed in the inner surface of inner tube 11 by adhesive 40.
Will recognize that from the following description, a pair of pin 350A being directly connected and 350B are set on the other end relative with one end that electrode pin 340A and 340B are set can greatly facilitate the installation of LED fluorescent lamp.
Fig. 4 A is the wiring diagram of common fluorescent lamp that adopts Inductive ballast, wiring diagram when Fig. 4 B is common fluorescent lamp shown in LED fluorescent lamp alternate figures 4A embodiment illustrated in fig. 1.
In common fluorescent lamp lighting circuit, lamp socket generally comprises two pairs of sockets, and fluorescent lamp two inserts respectively in two pairs of sockets pin.As shown in Figure 4 A, different connect starter 3 between to socket B, the D of socket adhering to separately, socket A is electrically connected to the live wire L of external power source, and socket C is electrically connected to the zero line N of external power source through Inductive ballast 4, after installation, two pairs of pins of common fluorescent lamp 2 respectively with socket A, B and socket C and D electrical connection.Compared with Fig. 4 A, under the mode of connection shown in Fig. 4 B, starter 3 is connected device 5 and substitutes.Preferably, this connector 5 is removable and adopts the form of similar starter, that is, it comprise with Inductive ballast on the Interface Terminal that matches of starter socket.
Although above-mentioned by the embodiment described in Fig. 1-3 in, the electrode pin 340A of LED driving power and 340B are directly connected on two pins of same end cap, but in the time that LED fluorescent lamp 1 is installed on lamp socket, the position of electrode pin be there is no to special requirement.That is to say, no matter the pin of connecting electrode pin is arranged in hot side (with socket A and B electrical connection) or the neutral side (with socket C and D electrical connection) of wiring diagram shown in Fig. 4 B, and external power source can be to LED fluorescent lamp 1 normal power supply.Particularly, for example, when electrode pin 340A and 340B are respectively with socket A and B electrical connection and pin 350A and 350B during respectively with socket C and D electrical connection, electrode pin 340A and live wire L electrical connection, meanwhile, because the pin 350A and the 350B that are positioned at substrate 310 other ends are shorted together, so electrode pin 340B can be electrically connected to zero line N through connector 5, pin 350A and 350B and Inductive ballast 4, has realized thus the power supply of external power source to LED driving power.On the other hand, when electrode pin 340A and 340B are respectively with socket C and D electrical connection and pin 350A and 350B during respectively with socket A and B electrical connection, electrode pin 340A can be electrically connected to zero line N through Inductive ballast 4, meanwhile, because the pin 350A and the 350B that are positioned at substrate 310 other ends are shorted together, so electrode pin 340B can be electrically connected through connector 5, pin 350A and 350B and live wire L, thereby has realized equally the power supply of external power source to LED driving power.
Fig. 5 A is the wiring diagram of common fluorescent lamp that adopts electric ballast, wiring diagram when Fig. 5 B is common fluorescent lamp shown in LED fluorescent lamp alternate figures 5A embodiment illustrated in fig. 1.
As shown in Figure 5A, live wire L and the zero line N of external ac power source are electrically connected to electric ballast 6, and socket A, B, C and the D of lamp socket is electrically connected with the lead-out terminal of electric ballast 6.After installation, two pairs of pins of common fluorescent lamp 2 respectively with socket A, B and socket C and D electrical connection.Compared with Fig. 5 A, under the mode of connection shown in Fig. 5 B, electric ballast 6 is removed, and be directly connected, and another is electrically connected to respectively live wire L and the zero line N of external ac power source to socket C and D between socket B and D.Equally, in Fig. 5 B, no matter the pin of connecting electrode pin is positioned at hot side (with socket A and B electrical connection) or neutral side (with socket C and D electrical connection), and external ac power source can be to LED fluorescent lamp 1 normal power supply.If for example electrode pin 340A and 340B are electrically connected with socket A and B respectively, pin 350A and 350B are electrically connected with socket C and D respectively, electrode pin 340A and live wire L electrical connection, meanwhile, electrode pin 340B is electrically connected to zero line N through pin 350A and 350B, has realized thus the power supply of external power source to LED driving power.On the other hand, if electrode pin 340A and 340B are electrically connected with socket C and D respectively, pin 350A and 350B are electrically connected with socket A and B respectively, electrode pin 340A is electrically connected to zero line N, and electrode pin 340B can be through pin 350A and 350B and live wire L electrical connection, thereby realize equally the power supply of external power source to LED driving power.
Although it is pointed out that the components and parts of drive circuit module 330 are arranged on the two ends of substrate 310 as shown in Figure 2, it is also feasible that these components and parts are only arranged on to one end.Also it is to be noted, also can be arranged on the two ends of substrate 310 as the pin 340A of LED driving power electrode and 340B, under this set layout, pin 340A and 330B be live wire and the zero line electrical connection of the pin on different end caps and external ac power source respectively.
Driving power module 330 can adopt the circuit of various topological structures, for example, include but not limited to non-isolated buck-type topological circuit structure, reverse exciting topological circuit structure and half-bridge LLC topological circuit structure etc.Can be referring to " LED illumination driving power source and Design of Luminaires " book of the 1st edition in People's Telecon Publishing House's May in 2011 about the detailed description of driving power module, this publication in full way of reference comprises in this manual.
Driving power module 330 can multiple type of drive (mode such as such as constant voltage power supply, constant current-supplying and constant pressure and flow power supply) provide suitable curtage to LED unit, it can be made up of one or more independently parts.In the LED driving power shown in Fig. 2, one or more parts of driving power module are realized with the form of wafer or packaged chip.
The circuit theory diagrams that Fig. 6 is a kind of drive circuit module of comprising in the driving power of LED shown in Fig. 2.
Drive circuit module 330 shown in Fig. 6 comprises bridge rectifier filter unit 331, DC-DC boosting inverter unit 332 and feedback unit 333, below unit is further described.
As shown in Figure 4, bridge rectifier filter unit 331 comprises full-bridge rectifier BR1, capacitor C1, C2, C3, piezoresistor R1 and inductor L1.Alternating current (for example civil power) is exported all-wave pulsating volage after full-bridge rectifier BR1 rectification on positive terminal 1.Filter condenser C1, C2, C3, piezoresistor R1 and inductor L1 form EMI filter circuit, and it suppresses the impact on drive circuit of High-frequency Interference in AC network on the one hand, suppresses on the other hand the electromagnetic interference of drive circuit to AC network.
It is worthy of note, although shown here is way of full-wave rectification, halfwave rectifier is also available.
Referring to Fig. 6, filter condenser C1 and piezoresistor R1 are connected in parallel between the ac input end B3 and B4 of full-bridge rectifier BR1, and wherein piezoresistor R1 clamps down on the input voltage of full-bridge rectifier BR1 in predetermined level by suppressing the abnormal overvoltage occurring in circuit.Filter condenser C2, C3 and inductor L1 composition π type filter circuit and electrical connection are between the positive terminal B1 and negative pole end B2 of full-bridge rectifier BR1, so that the pulsating volage of full-bridge rectifier BR1 output is carried out to LPF.
The multiple LEDs unit 320 of DC-DC boosting inverter unit 332 together with being also the series coupled in the driving power of LED shown in Fig. 2 with bridge rectifier filter unit 331, feedback unit 333 with LED load LED1-LEDn() electrical connection, its pulsating volage that bridge rectifier filter unit 331 is exported is promoted to required voltage and current level and offers LED load.In addition, DC-DC boosting inverter unit 332 also with feedback unit 333 collaborative works so that offer the electric current of LED load and voltage keeps constant and realizes power factor correcting function.Under typical application scenario, the total voltage after multiple LED units in series is designed to exceed the voltage peak of electrical network input, and therefore the lifting of voltage is essential.220V alternating current take fluctuation range as ± 10% is as example, and its ceiling voltage is about 342V, and LED series voltage will exceed 342V.
In the driving power module shown in Fig. 6, DC-DC boosting inverter unit 332 comprises inductor L2, switching diode D1, capacitor C6 and switch adjuster U1.
Preferably, can adopt the IC chip that is integrated with pulsewidth modulation (PWM) controller and metal oxide semiconductor field effect tube (below again referred to as metal-oxide-semiconductor) as switch adjuster U1, wherein the output of PWM controller and the grid of metal-oxide-semiconductor are electrically connected to realize the control to metal-oxide-semiconductor turn-on and turn-off.In concrete switch adjuster chip, in order to simplify the adjusting of dutycycle, the switching frequency that can keep metal-oxide-semiconductor is definite value (for example about 1MHz), and the turn-off time of metal-oxide-semiconductor is adjustable; Or the turn-off time that can keep metal-oxide-semiconductor is definite value (for example about 320ns), and the switching frequency of metal-oxide-semiconductor is adjustable.Typically, this class switch adjuster chip generally all configure the feedback pin being electrically connected with the drain lead of the drain electrode electrical connection of metal-oxide-semiconductor, with the control end of PWM controller.CW12L30 and CW12L40 chip etc. that the example of above-mentioned switch adjuster is produced including, but not limited to Chinese Pu Xinda Electronics Co., Ltd..
As shown in Figure 6, inductor L2 and switching diode D1 are connected between bridge rectifier filter unit 331 and LED load, the wherein positive pole of switching diode D1 and inductor L2 electrical connection, and negative pole is connected with LED load electrical.Preferably, can adopt speed is fast, pressure drop is little Schottky diode as switching diode D1.Continue referring to Fig. 6, the drain lead D of switch adjuster U1 is electrically connected between inductor L2 and the positive pole of switching diode D1, and feedback pin FB and feedback unit 333 are electrically connected.In addition, in the circuit shown in Fig. 6, the negative pole that capacitor C6 and LED load are connected to switching diode D1 altogether with in the time that switching diode D1 ends to LED load discharge.
Referring to Fig. 6, switch adjuster U1 comprises power pins VCC and grounding pin GND, and wherein power pins VCC is through capacitor C4 ground connection.
Feedback unit 333 comprises transistor Q1, resistor R2, R3 and capacitor C5.As shown in Figure 6, transistor Q1 adopts the type of attachment of common emitter amplifying circuit, wherein, colelctor electrode is electrically connected to the feedback pin of switch adjuster U1 feedback signal is provided to switch adjuster U1 through resistor R3, its emitter-base bandgap grading and ground connection are electrically connected using the common ground end as input circuit and output loop, and the loop of base stage access LED load is to extract detection signal.Resistor R2 is electrically connected between base stage and ground connection to form input circuit.In addition, the feedback pin FB of switch adjuster U1 is also through capacitor C5 ground connection.
The operation principle of drive circuit module 330 shown in Fig. 6 is below described.
In the time connecting AC power, bridge rectifier filter unit 331 is transformed to pulsating volage by the alternating current of input and exports the inductor L2 of DC-DC boosting inverter unit 332 to.The metal-oxide-semiconductor of switch adjuster U1 inside under the control of PWM controller signals with very high frequency turn-on and turn-off.
In the time of MOS conducting, under the effect of the output voltage of bridge rectifier filter unit 331, electric current flow through inductor L2 and metal-oxide-semiconductor, switching diode D1 ends because of the voltage on capacitor C6.Along with the electric current of the inductor L2 that flows through constantly increases, in inductor, the energy of storage is also on the increase.Now, LED load is powered by capacitor C6, and it relies on the discharge current work of capacitor C6.
In the time that metal-oxide-semiconductor switches to off state, the electric current of the inductor L2 that flows through starts to reduce, thereby brings out induced electromotive force at the two ends of inductor L2, and its polarity is that the upper positive right side is negative.The superimposed rear output voltage that promotes bridge rectifier filter unit 331 of output voltage of induced electromotive force and bridge rectifier filter unit 331.Now, the voltage of stack is higher than the voltage on capacitor C6, and therefore switching diode D1 enters conducting state, and LED load changes by inductor L2 powers, and capacitor C6 is also charged by inductor L2 and until metal-oxide-semiconductor switches to conducting state once again.In the present embodiment, the size of induced electromotive force depends on the dutycycle of metal-oxide-semiconductor, therefore can promote amplitude by regulating the dutycycle of PWM controller output signal to obtain desirable voltage.
In the time that metal-oxide-semiconductor is switched back to conducting state once again, the superimposed voltage at switching diode D1 place starts to reduce and by again lower than the voltage on capacitor C6, therefore switching diode D1 enters cut-off state, LED load changes the power voltage supply to promote by capacitor C6, and inductor L2 starts storage of electrical energy.
Therefore under the control of PWM controller, metal-oxide-semiconductor constantly switches between above-mentioned turn-on and turn-off state, thereby makes the voltage on LED load positive pole remain at higher voltage levvl.
Referring to Fig. 6, LED load and resistor R4, R5 are connected in parallel between the negative pole and resistor R2 of switching diode D1, and the negative pole of LED load is electrically connected to the base stage of transistor Q1.In the time there is fluctuation in the electric current of the LED load of flowing through and/or voltage, the electric current of base stage of transistor Q1 of flowing through also can change, feedback signal after transistor Q1 amplifies exports the feedback pin of switch adjuster U1 to through resistor R3 from colelctor electrode, PWM controller can be adjusted the dutycycle of output signal according to feedback signal thus, makes thus the electric current and the voltage that offer LED load keep constant.
In the embodiment shown in fig. 6, the feedback pin FB of switch adjuster U1 is also through jumbo capacitor C5 ground connection, and this can make the response of feedback control loop slow down, feedback level in the alternating current transmission line half period close to constant.Substantially invariable feedback level is illustrated in electric current in metal-oxide-semiconductor corresponding to be sent to the average energy in LED load within the half period of alternating current circuit.Due to switch adjuster, U1 works in fixed frequency, and before metal-oxide-semiconductor ON time finishes, the increase of electric current can not exceed certain scope.By reduce the switching current of the metal-oxide-semiconductor of flowing through in the time that the alternating voltage of input increases, and in the time that reducing, the alternating voltage of input increases the switching current of the metal-oxide-semiconductor of flowing through, make the corrugated minimum of LED load input terminal, and exchange input current and can follow the tracks of the variation of AC-input voltage the moment, thereby realize the function of power factor correcting.
It is to be noted, in the embodiment shown in fig. 6, PWM controller and metal-oxide-semiconductor are integrated in same IC chip, in order further to improve integrated level, it is also conceivable that transistor Q1, PWM controller and metal-oxide-semiconductor three are integrated in same IC chip.
Alternatively, PWM controller and metal-oxide-semiconductor also can be provided in according in LED driving power embodiment illustrated in fig. 2 with the form of discrete component.Drive circuit module shown in Fig. 7 shows an example of this form, wherein adopts identical label to represent with same or analogous unit in Fig. 6.
Drive circuit module 330 shown in Fig. 7 comprises bridge rectifier filter unit 331, DC-DC boosting inverter unit 332 and feedback unit 333 equally.Bridge rectifier filter unit 331 and feedback unit 333 adopt form same as shown in Figure 3 and structure, repeat no more herein.
Referring to Fig. 7, DC-DC boosting inverter unit 332 comprises inductor L2, switching diode D1, capacitor C6, PWM controller U2 and metal-oxide-semiconductor T1, wherein, inductor L2 and switching diode D1 are connected between bridge rectifier filter unit 331 and LED load, the positive pole of switching diode D1 and inductor L2 electrical connection, negative pole is connected with LED load electrical.In the present embodiment, the drain D of metal-oxide-semiconductor T1 is electrically connected between inductor L2 and the positive pole of switching diode D1, and source S is electrically connected to ground connection, and grid G is connected with the output P of PWM controller U2.PWM controller U2 generally provides with the form of IC chip, and its control end FB and feedback unit 333 are electrically connected.As shown in Figure 4, capacitor C6 be electrically connected between the negative pole of switching diode D1 and LED load with in the time that switching diode D1 ends to LED load discharge.
Feedback unit 133 comprises transistor Q1, resistor R2, R3 and capacitor C5 equally.Transistor Q1 adopts the type of attachment of common emitter amplifying circuit, wherein, colelctor electrode is electrically connected to the control end FB of PWM controller U2 feedback signal is offered to PWM controller U2 through resistor R3, its emitter-base bandgap grading and ground connection are electrically connected using the common ground end as input circuit and output loop, and the loop of base stage access LED load is to extract detection signal.The control end FB of PWM controller is also through capacitor C5 ground connection.
Similar to shown in Fig. 6 of the operation principle of drive circuit module shown in Fig. 7 therefore repeats no more herein.
Alternatively, the circuit of all right other function of integration realization in the driving power module shown in above-mentioned Fig. 6 and 7, such as adjusting control circuit, sensing circuit, intelligent lighting control circuit, telecommunication circuit and holding circuit etc.These circuit can be integrated in same semiconductor wafer or packaged chip with driving governor, or these circuit can provide with the form of semiconductor wafer or packaged chip individually, or some or all in these circuit can be combined and provide with the form of semiconductor wafer or packaged chip.
Although represented and aspects more of the present invention be discussed, but those skilled in the art are to be appreciated that and can change aspect above-mentioned under the condition that does not deviate from the principle of the invention and spirit, therefore scope of the present invention will be limited by claim and the content that is equal to.

Claims (10)

1. a LED fluorescent lamp, is characterized in that, comprising:
Glass inner tube;
Be enclosed within the glass outer tube outside described glass inner tube;
Seal described glass inner tube two ends end cap, on it, be provided with the pin of adaptive daylight lamp holder;
LED driving power, comprising:
Be fixed on the strip substrate of described glass inner tube inside;
Multiple LED unit that are arranged on described strip substrate;
Drive circuit module, it is disposed in the one or both ends of described strip substrate and is electrically connected with described LED unit and described pin.
2. LED fluorescent lamp as claimed in claim 1, wherein, the outer surface of described glass outer tube end inwardly shrinks.
3. LED fluorescent lamp as claimed in claim 1, wherein, the inner surface of described glass inner tube and/or outer surface are the surface through frosted processing.
4. LED fluorescent lamp as claimed in claim 1, wherein, the inner surface of described glass outer tube covers light spread powder.
5. LED fluorescent lamp as claimed in claim 1, wherein, described LED unit is coupled with series, parallel or series-parallel connection mode.
6. LED fluorescent lamp as claimed in claim 1, wherein, described drive circuit module comprises:
Bridge rectifier filter unit;
DC-DC boosting inverter unit, comprise inductor, switching diode, PWM controller and metal-oxide-semiconductor, wherein, described inductor and switching diode are connected between described bridge rectifier filter unit and LED load, the drain electrode of described metal-oxide-semiconductor is electrically connected between described inductor and the positive pole of switching diode, the output electrical connection of grid and described PWM controller; And
Feedback unit, comprises transistor, and its base stage is electrically connected to the loop of described LED unit, and colelctor electrode is electrically connected to the control end of described PWM controller.
7. LED fluorescent lamp as claimed in claim 1, wherein, described drive circuit module also comprises the pair of electrodes pin of the first end that is arranged on described strip substrate, it is electrically connected with live wire and the zero line of external ac power source respectively through described pin.
8. LED fluorescent lamp as claimed in claim 7, wherein, described drive circuit module also comprises a pair of directly connected pin, it is arranged on second end relative with described first end.
9. the installation method of LED fluorescent lamp as claimed in claim 8, lamp socket comprises first pair of socket and second pair of socket, it is characterized in that, between one of them socket in one of them socket in described first pair of socket and described second pair of socket, electrical connection has connector, another socket in described first pair of socket is electrically connected to the live wire of external ac power source, and another socket in described second pair of socket is electrically connected to the zero line of external ac power source through Inductive ballast.
10. installation method as claimed in claim 9, wherein, described connector be removable and comprise with described Inductive ballast on the Interface Terminal that matches of starter socket.
CN201210583504.1A 2012-12-28 2012-12-28 LED fluorescent lamp and installation method thereof Pending CN103899939A (en)

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Application publication date: 20140702