CN103531715B - Flexible photoelectric device substrate, flexible photoelectric device and preparation method - Google Patents
Flexible photoelectric device substrate, flexible photoelectric device and preparation method Download PDFInfo
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- CN103531715B CN103531715B CN201310099161.6A CN201310099161A CN103531715B CN 103531715 B CN103531715 B CN 103531715B CN 201310099161 A CN201310099161 A CN 201310099161A CN 103531715 B CN103531715 B CN 103531715B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The present invention discloses a kind of flexible photoelectric device substrate, flexible photoelectric device and preparation method, described flexible photoelectric device substrate comprises glass substrate and the metallic film for cushioning swell increment difference between macromolecule membrane and glass substrate, comes off from glass substrate to prevent macromolecule membrane; Described metallic film is arranged at the fringe region of described glass baseplate surface, and described metallic film encloses the panel forming region formed for processing described flexible photoelectric device at described glass baseplate surface.Described flexible photoelectric device substrate, for the preparation of flexible photoelectric device, adopts described flexible photoelectric device substrate can prevent macromolecule membrane from coming off from glass substrate.The flexible photoelectric device substrate that the present invention proposes, except the preparation being applicable to OLED, also can be applicable in OLED illumination, Electronic Paper display, touch-screen and other non-display technology.
Description
Technical field
The present invention relates to flexible photoelectric device preparation field, particularly relate to a kind of flexible photoelectric device substrate, flexible photoelectric device and preparation method.
Background technology
Organic luminescent device (hereinafter referred to as OLED) is mainly used in the screen of less than 5 inches small size smart mobile phones at present, is just challenging the large size panel of more than 10 inches simultaneously.So far the maximum OLED screen curtain that the mankind make reaches more than 50 inches, as: 56 inches of OLEDTV of 55 inches of Samsung, LG and Sony, Panasonic.But in large scale display screen field, LCD(liquid crystal display) be the product of current main flow, because LCD outclass OLED in cost performance, make OLED be difficult to come into the market.And Flexible Displays is one of Main way of OLED and LCD product differentiation.OLED is active luminescent device, and thickness of detector is generally less than 0.2 μm, as long as therefore select the substrate of suitable material and thickness, just can produce ultra-thin flexible photoelectric device.
The manufacture method of active-matrix mode (AM:ActiveMatrix) flexible photoelectric device is the earliest: be adhered on carrier by plastic substrate by adhesive, making devices on plastic substrate, after element manufacturing completes, be separated plastic substrate and carrier, obtain flexible photoelectric device.Adopt the shortcoming having following three aspects in this way: 1. contraposition difficulty in manufacturing process; 2. there is cull phenomenon after being separated with carrier in plastic substrate; 3.TFT-array(liquid crystal layer) engineering is temperature limited, directly causes the mobility of TFT (Thin Film Transistor (TFT)) device less.
In order to overcome the above problems, a kind of high temperature-resistant polymer film (as: PI(polyimides) is researched and developed in this area), and develop the technique adopting the method for coating to form macromolecule membrane on the glass substrate.The method that current employing fire resistant polymer film makes flexible photoelectric device is mainly classified as two large classes, one is as shown in Figure 1, apply separating layer 20 (DBL:DebondingLayer), by the method for cutting, macromolecule membrane 30 is separated with glass substrate 10, obtains flexible photoelectric device.Another kind method is as shown in Figure 2, deposit sacrifice layer 32(sacrifice layer is formed by a-Si, metal oxide or metal alloy on the glass substrate 10), sacrifice layer 32 applies macromolecule membrane 30, making devices on macromolecule membrane layer 30, after element manufacturing completes, irradiated the chemical bond rupture made between macromolecule membrane 30 and sacrifice layer 32 by laser, macromolecule membrane 30 is separated from glass substrate 10, obtains flexible photoelectric device.
Flexible photoelectric device can be made on the product line that glass substrate size is less by above method, but because the thermal coefficient of expansion between macromolecule membrane (>15ppm/ DEG C) with glass substrate (3ppm/ DEG C) differs larger, through repeatedly variations in temperature in TFT-array manufacture process, polymeric membrane occurs protruding, especially in the phenomenon that substrate surrounding generation macromolecule membrane comes off.And substrate repeatedly contacts with the liquid soup such as various acid (as: nitric acid, acetic acid, phosphoric acid etc.), stripper (60 ~ 70 DEG C), dilution of pure water, developer solution, etching series in TFT-array engineering process, be difficult to ensure that macromolecule membrane is adhered closely on the glass substrate all the time in whole engineering process.Once breach occurs in somewhere, macromolecule membrane will be peeled off from glass substrate from indentation, there, and before TFT-array engineering terminates, macromolecule membrane is likely peeled off completely from glass substrate, is therefore difficult to produce in batches.This phenomenon more easily occurs on large-sized glass substrate, and even more serious.Due to above reason, although industry is goed deep into and studied flexible display technologies widely, also succeed in volume production.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of flexible photoelectric device substrate, flexible photoelectric device and preparation method, described flexible photoelectric device substrate is for the preparation of flexible photoelectric device, adopt described flexible photoelectric device substrate can prevent macromolecule membrane from coming off from flexible photoelectric device substrate in preparation process, be intended to solve macromolecule membrane in the preparation process of existing flexible photoelectric device and easily peel off from glass substrate and cause producing failed problem.
Technical scheme of the present invention is as follows:
A kind of flexible photoelectric device substrate, described flexible photoelectric device substrate is for the preparation of flexible photoelectric device, preparing in flexible photoelectric device process, flexible photoelectric device substrate can form one deck macromolecule membrane, wherein, described flexible photoelectric device substrate comprises glass substrate and the metallic film for cushioning swell increment difference between macromolecule membrane and glass substrate, comes off from glass substrate to prevent macromolecule membrane; Described metallic film is arranged at the fringe region of described glass baseplate surface, and described metallic film encloses the panel forming region formed for processing described flexible photoelectric device at described glass baseplate surface.
Described flexible photoelectric device substrate, wherein, described metallic film adopts thermal coefficient of expansion to be 5 × 10
-6~ 20 × 10
-6the metal material of mm/ DEG C is formed.
Described flexible photoelectric device substrate, wherein, described metal material is copper, chromium, molybdenum, tungsten or albronze.
Described flexible photoelectric device substrate, wherein, comprises the non-panel bond regions formed between multiple unit panel forming region for the preparation of single flexible photoelectric device and multiple unit panel forming region in described panel forming region; Described non-panel bond regions is provided with the metallic film for alleviating swell increment difference between macromolecule membrane and glass substrate.
Described flexible photoelectric device substrate, wherein, the thickness of described metallic film is 100 ~ 500nm.
Described flexible photoelectric device substrate, wherein, the surface deposition of described glass substrate forms one deck sacrifice layer; Described sacrifice layer is arranged between described glass substrate and metallic film.
A preparation method for flexible photoelectric device substrate as above, wherein, comprises the following steps:
Thermal coefficient of expansion is selected to be situated between and metal material between macromolecule membrane and glass substrate, described metal material is adopted to sputter layer of metal layer on described glass substrate, through photoresist coating, exposure, development, etching, the fringe region of described glass baseplate surface forms layer of metal film.
The preparation method of described glass substrate, wherein, before described glass substrate sputters layer of metal layer, further comprising the steps of:
On described glass substrate, deposit forms sacrifice layer.
A preparation method for flexible photoelectric device, wherein, the preparation of described flexible photoelectric device comprises the preparation process of flexible photoelectric device substrate, and described flexible photoelectric device substrate adopts the preparation method of flexible photoelectric device substrate as above to prepare.
A kind of flexible photoelectric device, wherein, described flexible photoelectric device adopts flexible photoelectric device substrate as above.
Beneficial effect: a kind of new flexible photoelectric device substrate provided by the present invention, for the preparation of flexible photoelectric device, can effectively prevent macromolecule membrane from coming off from described flexible photoelectric device substrate.The inventive method is not only suitable for the preparation of large scale flexible photoelectric device, is also applicable to make multiple flexible photoelectric device on large scale flexible photoelectric device substrate.The flexible photoelectric device substrate that the present invention proposes, except the display preparation being applicable to OLED, also can be applicable in OLED illumination, Electronic Paper display, touch-screen and other non-display technology.
Accompanying drawing explanation
Fig. 1 adopts patterning method to prepare the schematic diagram of flexible photoelectric device in prior art.
Fig. 2 adopts laser irradiation to prepare the schematic diagram of flexible photoelectric device in prior art.
Fig. 3 is in the preparation method of flexible photoelectric device of the present invention, forms the planar structure schematic diagram after metal film on the glass substrate.
Fig. 4 is the planar structure schematic diagram of multiple metal film and the complementation of unit panel forming region on large scale flexible photoelectric device substrate.
Fig. 5 is in the preparation method of flexible photoelectric device of the present invention, forms the sectional view after metal film and separating layer on the glass substrate.
Fig. 6 is in the preparation method of flexible photoelectric device of the present invention, and flexible photoelectric device substrate is formed the sectional view after macromolecule membrane layer.
Fig. 7 is in the preparation method of flexible photoelectric device of the present invention, the sectional view after encapsulation.
Fig. 8 is in the preparation method of flexible photoelectric device of the present invention, by flexible base, board cutting and with the sectional view of separation layer.
Fig. 9 is the sectional view be separated with sedimentary deposit by macromolecule membrane layer in another embodiment of the present invention.
Embodiment
The invention provides a kind of flexible photoelectric device substrate, flexible photoelectric device and preparation method, for making object of the present invention, technical scheme and effect clearly, clearly, the present invention is described in more detail below.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The present invention is in the process of characteristic between research macromolecular material and various metallic surface, confirm, between some metal material and macromolecule membranes, there is good adhesiveness by experiment, thus flexible photoelectric device substrate of a kind of flexible photoelectric device making and preparation method thereof is proposed, described flexible photoelectric device substrate is not only suitable for the preparation of large scale flexible photoelectric device, is also applicable to make multiple flexible photoelectric device on large-sized flexible photoelectric device substrate.
Particularly, the present invention by sputtering layer of metal layer on the glass substrate of glass substrate or deposit sacrifice layer (as: a-Si, metal oxide or metal alloy), through photoresist coating, exposure, development, etching process, the metal film that a layer thickness is 100 ~ 500nm is formed in glass baseplate surface surrounding, obtain described flexible photoelectric device substrate, then at described flexible photoelectric device substrate coating organic polymer solution, after drying and forming macromolecule membrane, form light-emitting electronic devices (as: OLED) thereon.Because the coefficient of expansion between macromolecule membrane with metal film differs less, and adhesion strength is strong, and the macromolecule membrane formed can not be stripped in the process of preparation TFT technique, thus can ensure the preparation successfully completing flexible photoelectric device.After all engineerings terminate, original method (cutting or laser irradiate) is adopted to be peeled off from carrier by flexible photoelectric device.In the method, flexible photoelectric device substrate is put into organic solvent after peeling off by flexible photoelectric device, and remove macromolecule membrane, former sputtering has the flexible photoelectric device substrate of metal (or alloy) still can reuse.
Therefore, a kind of flexible photoelectric device substrate is provided in the present invention, described flexible photoelectric device substrate is for the preparation of flexible photoelectric device, as shown in Figure 3, described flexible photoelectric device substrate comprises glass substrate 1 and the metallic film 11 for cushioning swell increment difference between macromolecule membrane and glass substrate, prevents macromolecule membrane from coming off from glass substrate; Described metallic film is arranged at the fringe region on described glass substrate 1 surface, and described metallic film encloses the panel forming region 111 formed for processing described flexible photoelectric device on described glass substrate 1 surface.Alternatively embodiment, described flexible photoelectric device substrate also comprises one deck sacrifice layer, described sacrifice layer is arranged between described glass substrate and described metallic film, is the panel forming region defined on the surface of described sacrifice layer for processing described flexible photoelectric device.Like this, described metallic film is poor for cushioning swell increment between macromolecule membrane and glass substrate exactly, prevents macromolecule membrane from coming off from sacrifice layer.
Wherein, described metallic film adopts its thermal coefficient of expansion Jie and the metal material between macromolecule membrane and glass substrate to be formed, and the thermal coefficient of expansion of described metal material is 5 × 10
-6~ 20 × 10
-6mm/ DEG C (20 DEG C).Described metal material can be copper, chromium, molybdenum, tungsten or albronze etc.
When large-sized flexible photoelectric device substrate makes flexible photoelectric device, due to can include in the panel forming region 111 of glass substrate 1 multiple unit panel forming region for the preparation of single flexible photoelectric device and and multiple unit panel forming region between the non-panel viewing area that formed, therefore, coefficient of expansion difference between the macromolecule membrane of non-panel viewing area and underlying contact layers (glass substrate or sacrifice layer) is larger, on glass substrate 1, macromolecule membrane can produce projection, has an impact to subsequent device technique and device property.In order to solve the problem, metal film for alleviating swell increment difference between macromolecule membrane and glass substrate can be formed in non-panel viewing area on described glass substrate or sacrifice layer, the region that metal material is formed becomes complementary with unit panel forming region, the metal film pattern formed as shown in Figure 4, can alleviate the damage of the macromolecule membrane caused by coefficient of expansion difference so effectively.In order to easy, in Fig. 4, only draw 4 unit panel forming region, for the situation of more multiple unit panel forming region, the like.Therefore, also provide a kind of flexible optoelectronic display in the present invention, described flexible optoelectronic display adopts flexible photoelectric device substrate provided by the present invention as display base plate.
The preparation method of described flexible photoelectric device substrate is also provided: select thermal coefficient of expansion to be situated between and metal material between macromolecule membrane and glass substrate in the present invention, adopt described metal material vacuum sputtering layer of metal layer on described glass substrate, through photoresist coating, exposure, development, etching, the fringe region of described glass baseplate surface forms the metallic film of one deck.Alternatively embodiment, before described glass substrate sputters layer of metal layer, further comprising the steps of: deposit forms sacrifice layer on the glass substrate.
The application of described flexible photoelectric device substrate is also provided in the present invention, described glass substrate is used for the preparation of flexible photoelectric device and luminescent device.Further, also provide described flexible photoelectric device substrate for the preparation of concrete preparation method during flexible photoelectric device in the present invention, the preparation of described flexible photoelectric device comprises the preparation process of flexible photoelectric device substrate, and described flexible photoelectric device substrate adopts the preparation method of flexible photoelectric device substrate as above to prepare.
Particularly, the preparation method of flexible photoelectric device substrate of the present invention, specifically comprises the following steps:
Glass substrate 1 is formed the metal film 11 being used for auxiliary fixing macromolecule membrane, i.e. flexible photoelectric device substrate of the present invention, as shown in Figure 3, described metal film 11 is arranged in the fringe region of described glass substrate 1, and described metallic film 11 encloses the panel forming region 111 formed for processing described flexible photoelectric device on described glass substrate 1 surface;
Separating layer (DBL) 2 is formed, as shown in Figure 5 in described panel forming region 111;
The one side of glass substrate 1 with metal film 11 is coated with organic polymer liquid medicine, forms smooth macromolecule membrane layer 3, as shown in Figure 6;
Described macromolecule membrane layer 3 processes electronic device 4, as shown in Figure 7;
Encapsulation, as shown in Figure 7, wherein this encapsulation process be electronic device 4 and around the surface of macromolecule membrane layer 3 be stained with a flexible package film 5 for preventing device from contacting with air; Described flexible package film 5 can be one piece of flexible package lid or other encapsulating material (as package adhesive tape);
On flexible package film 5, along the edge cuts of the size of flexible photoelectric device, as shown in Figure 8, by the flexible base, board of described macromolecule membrane layer 3(and flexible photoelectric device) peel off with described glass substrate 1, whole flexible photoelectric device is come off, forms flexible photoelectric device.
Finally, the flexible photoelectric device substrate with residue macromolecule membrane layer 3 is put into organic solvent, and remove macromolecule membrane, former sputtering has the flexible photoelectric device substrate of metal film still can reuse.
The preparation method of another kind of flexible photoelectric device is also provided in the present invention, as shown in Figure 9, specifically comprises the following steps:
On glass substrate 1, deposit forms sacrifice layer 22;
Sacrifice layer 22 is formed the metal film 11 being used for auxiliary fixing macromolecule membrane, i.e. flexible photoelectric device substrate of the present invention, described metal film 11 is arranged in the fringe region of described sacrifice layer 22, described metal film 11 is annular, forms the panel forming region being used for processing flexibility photoelectric device device in the metal film 11 of described annular;
The one side of glass substrate 1 with metal film 11 is coated with organic polymer liquid medicine, forms smooth macromolecule membrane layer 23;
Described macromolecule membrane layer 23 processes electronic device 24;
Encapsulation, wherein this encapsulation process be electronic device 24 and around the surface of macromolecule membrane layer 23 be stained with a flexible package film 25 for preventing device from contacting with air;
Laser irradiation is carried out to described glass substrate 1, the flexible base, board by described macromolecule membrane layer 23(and flexible photoelectric device) with described flexible photoelectric device substrate desquamation, whole flexible photoelectric device is come off, forms flexible photoelectric device.
The inventive method material and progress used continues to use the existing material and technology of current TFT-array production line completely, therefore need not additionally increase equipment and material category, and technique is simple, controls easily.The preparation method of the flexible photoelectric device that the present invention proposes, except being applicable to OLED display preparation, also can be applicable in the manufacturing process of OLED lighting apparatus, and in TFT, Electronic Paper display, touch-screen and other non-display technology.
The method proposed in the present invention, material therefor and technique continue to use the existing material and technology of current TFT-array production line completely, technique is simple, control easily, but also can be implemented on large scale flexible photoelectric device substrate and make flexible device, sputtering simultaneously has the flexible photoelectric device substrate of metallic film to reuse.
Should be understood that, application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection range that all should belong to claims of the present invention.
Claims (10)
1. a flexible photoelectric device substrate, described flexible photoelectric device substrate is for the preparation of flexible photoelectric device, preparing in flexible photoelectric device process, flexible photoelectric device substrate can form one deck macromolecule membrane, it is characterized in that, described flexible photoelectric device substrate comprises glass substrate and the metallic film for cushioning swell increment difference between macromolecule membrane and glass substrate, comes off from glass substrate to prevent macromolecule membrane; Described metallic film is arranged at the fringe region of described glass baseplate surface, and described metallic film encloses the panel forming region formed for processing described flexible photoelectric device at described glass baseplate surface.
2. flexible photoelectric device substrate according to claim 1, is characterized in that, described metallic film adopts thermal coefficient of expansion to be 5 × 10
-6~ 20 × 10
-6the metal material of mm/ DEG C is formed.
3. flexible photoelectric device substrate according to claim 2, is characterized in that, described metal material is copper, chromium, molybdenum, tungsten or albronze.
4. flexible photoelectric device substrate according to claim 1, is characterized in that, comprises the non-panel bond regions formed between multiple unit panel forming region for the preparation of single flexible photoelectric device and multiple unit panel forming region in described panel forming region; Described non-panel bond regions is provided with the metallic film for alleviating swell increment difference between macromolecule membrane and glass substrate.
5. flexible photoelectric device substrate according to claim 1, is characterized in that, the thickness of described metallic film is 100 ~ 500nm.
6., according to the arbitrary described flexible photoelectric device substrate of claim 1 ~ 5, it is characterized in that, the surface deposition of described glass substrate forms one deck sacrifice layer; Described sacrifice layer is arranged between described glass substrate and metallic film.
7. a preparation method for flexible photoelectric device substrate as claimed in claim 1, is characterized in that, comprise the following steps:
Select thermal coefficient of expansion metal material between macromolecule membrane and glass substrate, described metal material is adopted to sputter layer of metal layer on described glass substrate, through photoresist coating, exposure, development, etching, the fringe region of described glass baseplate surface forms layer of metal film.
8. the preparation method of flexible photoelectric device substrate according to claim 7, is characterized in that, before described glass substrate sputters layer of metal layer, further comprising the steps of:
On described glass substrate, deposit forms sacrifice layer.
9. the preparation method of a flexible photoelectric device, it is characterized in that, the preparation of described flexible photoelectric device comprises the preparation process of flexible photoelectric device substrate, and described flexible photoelectric device substrate adopts the preparation method of flexible photoelectric device substrate as claimed in claim 7 to prepare.
10. a flexible photoelectric device, is characterized in that, described flexible photoelectric device adopts flexible photoelectric device substrate as claimed in claim 1.
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| CN103779390B (en) | 2014-02-11 | 2016-08-17 | 京东方科技集团股份有限公司 | A kind of flexible display substrates and preparation method thereof |
| CN104332416A (en) * | 2014-08-21 | 2015-02-04 | 京东方科技集团股份有限公司 | Preparation method of flexible display and flexible display |
| CN104332394B (en) * | 2014-10-20 | 2017-04-19 | 深圳市华星光电技术有限公司 | Method of manufacturing flexible substrate |
| CN104505467B (en) * | 2014-12-05 | 2017-09-19 | 上海天马微电子有限公司 | A kind of composite base plate, the manufacture method of flexible display and flexible display |
| CN104614947B (en) * | 2015-01-26 | 2017-12-05 | 天津大学 | Flexible, stretchable, deformable surface Lithographic template and photolithography method and device |
| CN105932079B (en) * | 2016-07-08 | 2017-09-29 | 天津三安光电有限公司 | Flexible multijunction solar cell and preparation method thereof |
| CN108336227B (en) * | 2018-01-19 | 2022-01-25 | 云谷（固安）科技有限公司 | Substrate structure of display screen, flexible display device, manufacturing method of flexible display device and display screen |
| WO2020090053A1 (en) * | 2018-10-31 | 2020-05-07 | シャープ株式会社 | Method for producing display device |
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| CN1409373A (en) * | 2001-08-10 | 2003-04-09 | 株式会社半导体能源研究所 | Stripping method and method for producing semiconductor device |
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