CN103202690B - Flexible epicardium electrocardio-electrode chip and preparation method thereof - Google Patents
Flexible epicardium electrocardio-electrode chip and preparation method thereof Download PDFInfo
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
- A61B5/6846—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive
- A61B5/6867—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive specially adapted to be attached or implanted in a specific body part
- A61B5/6869—Heart
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
- A61B5/25—Bioelectric electrodes therefor
- A61B5/279—Bioelectric electrodes therefor specially adapted for particular uses
- A61B5/28—Bioelectric electrodes therefor specially adapted for particular uses for electrocardiography [ECG]
- A61B5/283—Invasive
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/02—Details of sensors specially adapted for in-vivo measurements
- A61B2562/0209—Special features of electrodes classified in A61B5/24, A61B5/25, A61B5/283, A61B5/291, A61B5/296, A61B5/053
- A61B2562/0215—Silver or silver chloride containing
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/16—Details of sensor housings or probes; Details of structural supports for sensors
- A61B2562/166—Details of sensor housings or probes; Details of structural supports for sensors the sensor is mounted on a specially adapted printed circuit board
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Abstract
The invention relates to a flexible epicardium electrocardio-electrode chip. The chip comprises a flexible substrate, electrode units, electrode leads, lead connection points and insulating layers, wherein electrode units, electrode leads and lead connection points are arranged on the flexible substrate and are connected with one another electrically, insulating layers are arranged on the flexible substrate and cover electrode leads, and insulating layers are not arranged on surfaces of electrode units and lead connection points. The invention also relates to a preparation method of the flexible epicardium electrocardio-electrode chip. According to the electrode chip, a plurality of electrode units are arranged to form an electrode array, so that the minimum micron-scale spatial resolution can be achieved, the electrode chip is good in flexibility and deformation capability, can be attached to the surface of a heart and can be adapted to changes of the outline of the surface of the heart, the electrode is well attached to a target area on the surface of the heart, and damages such as extrusion and scratching, which are caused by the electrode during movement of the heart, can be effectively avoided. The chip can be used for qualitative diagnoses of heart diseases and accurate positioning of nidi and can provide objective evidences for targeted treatment.
Description
Technical field
The present invention relates to field of medical device, particularly relate to a kind of flexible epicardium electrocardio-electrchip chip.
Background technology
Conventional electrocardiographic examination 9 from hands, foot, front etc. positions arrangement electrodes obtain macroscopical body surface ecg analyzed and judge heart disease.But due to systemic asymmetric, irregular, heterogeneity, there is decay, distortion and filter effect in the signal of telecommunication that heart produces in external conductive process.The electrocardiosignal of body surface has obvious difference with the Potential distribution of heart surface in amplitude and phase place in addition, and many electro physiology events might not arrive at surface observation.As cardiac muscle occur simultaneously multiple excitement point time, several map superpositions body surface potential will be made to be difficult to determine.Body surface ecg can only qualitative observation, can not carry out the accurate location of focus, thus causes the accuracy diagnosed limited.The heart disease that arrhythmia, myocardial ischemia etc. are complicated is then needed to carry out directly checking ability positioning and qualitative to heart, thus carries out immunotherapy targeted autoantibody.
Visceral pericardium electrocardio is as a kind of method of accurate measurement and observation analysis cardiac electrical activity, and check different from routine electrocardiogram, it can not only draw diagnosis on a macro scale, can also determine the exact position of pathological changes, for immunotherapy targeted autoantibody provides objective basis.It utilizes multi-electrode system to cover epicardial surface to carry out Multipoint synchronous record to cardiac electric excitement.Because electrod-array directly contacts with epicardial, and the synchronized sampling to electrocardiosignal, therefore can be objective and react the origin of electrocardio excitement and the process of propagation accurately.
In the U.S., have 5,000,000 heart failure patients nearly, and annual newly-increased patient diagnosed's number is up to 550,000.With present case, in developed countries such as the U.S. using heart failure as the disease of main cause, its M & M is mainly not enough from the myocardial infarction that alternative dry is cell-mediated.
Compared to surface electrocardiogram record, visceral pericardium multi lead electro cardiograph drawing system can provide the ventricular bipolar information of asymmetry, and very useful to the change of monitor ECG in cardiac regeneration.The data obtaining more accurate myocardial activation order and distribution with more electrode points is all made every effort in visceral pericardium electrocardio research external at present.Numerous due to electrode number, data volume is large, is thus all adopt the method for off-line analysis to carry out electrophysiologic study mostly, is difficult to be applied to clinical.
In biomedical information extracts, electrode plays the effect of transducer, and the bio electricity change that living organism can produce by it guides, and change ion current is electronic current.The earliest for electrocardiogram acquisition is needle electrode, but needle electrode is only limitted to local record, and afterwards along with research is goed deep into, visceral pericardium electrocardio mainly adopted the pellet electrode of handled easily.
Major bases material at present for epicardial lead sheet mostly is silicone rubber and thermoplastic, is convenient to realize multidigit point and detects.The base material of electrode should have good pliability and compliance, can adapt to contraction and the diastole of heart, and the size of electrode and relative spacing must meet the requirement of measurement, also will prevent from causing damage to visceral pericardium simultaneously.Although silicone rubber and thermoplastic are substrate can meet above-mentioned requirement, along with increasing of electrode, contact conductor easily chaotic, fracture, increase the difficulty making and use, also can affect electrode points and epicardial attaching simultaneously.The hospital gauze that soaks into normal saline of somebody is as the base material of electrode in addition, preoperative electrode to be evenly sewn on gauze, the diameter of electrode reaches 1mm, spacing is 3mm, the material of conventional electrode points generally adopts silver (diameter 0.2mm filamentary silver) or rustless steel (stainless steel silk of diameter 1.5mm), and the die opening of existing epicardial lead is generally 1-5.6mm.But in use also can there is same problem.
Also have recently research to be that electrode points is uniformly distributed and is produced on flexible printed circuit board by electrode design, electrode points surface exposes Copper Foil and also does chemical gilding process.The lead-out wire of each electrode and flexible board form an entirety, and the raw material of electrode slice adopts polyimides, strengthen the row that reclines by reducing thickness to micro-meter scale.And electrode points adopts that copper outside is gold-plated to be reached long-time and place not oxidizable, ensure good contact simultaneously.But be subject to the restriction of the performance of material own, Kapton can not stretch and fold, local tolerance degree of strain is less than 1%.Even if the pliability of microelectrode array can be improved by the thickness constantly reducing Kapton, but add the difficulty of processing of electrode like this, because the restriction being subject to technique has to increase the processing dimension of electrode, thus cause the resolution of electrode to decline, polyimides substrate thickness is thinning in addition, also makes the mechanical strength of microelectrode array and operability decline thereupon.
Summary of the invention
Based on this, be necessary, for traditional epicardial lead sheet Problems existing, to provide a kind of flexible epicardium electrocardio-electrchip chip.
A kind of flexible epicardium electrocardio-electrchip chip, comprise: flexible substrates, electrode unit, contact conductor, lead-in wire junction point and insulating barrier, described electrode unit, contact conductor and lead-in wire junction point form electrode assemblie jointly, described electrode assemblie is located in described flexible substrates, described electrode unit is connected to lead-in wire junction point via contact conductor, realize electrical connection, described insulating barrier to be located in described flexible substrates and to be covered described contact conductor, described electrode unit is for being electrically connected heart surface, and the material of described flexible substrates and insulating barrier is polydimethylsiloxane.
Wherein in an embodiment, described electrode assemblie comprises electrode layer, and the material of described electrode layer is the one in gold, titanium, copper
Wherein in an embodiment, described electrode assemblie also comprises prime coat, and described electrode layer is located on described prime coat, and the material of described prime coat is titanium, chromium, or comprises one or both the alloy in these two kinds of elements.
Wherein in an embodiment, described electrode unit also comprises decorative layer, described decorative layer is located at the surface of electrode unit described flexible substrates dorsad, the material of described decorative layer is platinum, iridium, or one or both the alloy comprised in these two kinds of elements or compound, or the one in polypyrrole, poly-(3,4-rthylene dioxythiophene), polyaniline.
Wherein in an embodiment, described flexible substrates is positioned at the thickness of thickness much smaller than other region of flexible substrates of electrode unit part.
Wherein in an embodiment, the cross section of described flexible substrates is rectangle, described electrode unit and lead-in wire junction point one_to_one corresponding, described electrode assemblie comprises about axisymmetric two row of described rectangular perpendicular bisector, described electrode unit and corresponding lead-in wire junction point are positioned at the same side of perpendicular bisector, described electrode unit is located at the position near described perpendicular bisector, corresponding lead-in wire junction point is positioned at the position near rectangle one side parallel with described perpendicular bisector, one side in described insulating barrier dorsad in the middle part of described flexible epicardium electrocardio-electrchip chip forms inside depression.
There is a need to the preparation method that a kind of flexible epicardium electrocardio-electrchip chip is provided.
A preparation method for flexible nerve tract electrode, comprises the following steps: step one, rigid basement arranges polydimethylsiloxane and forms flexible substrates; Step 2, described flexible substrates forms electrode assemblie, and described electrode assemblie comprises lead-in wire junction point, for being electrically connected the electrode unit of heart surface and being electrically connected the contact conductor of described lead-in wire junction point and electrode unit; Step 3, described flexible substrates arranges the polydimethylsiloxane covering described electrode assemblie and forms insulating barrier, and forms opening at the electrode unit of described insulating barrier with lead-in wire junction point position, exposes described electrode unit and lead-in wire junction point; Step 4, is separated described flexible substrates from rigid basement, obtains described flexible epicardium electrocardio-electrchip chip.
Wherein in an embodiment, described step 2 comprises: prepare the mask that a piece is formed with the pierced pattern of described electrode assemblie shape; Described mask is adhere well in described flexible substrates; Deposit prime coat in the flexible substrates being pasted with described mask; Deposit one deck electrode layer on described prime coat; Described mask is removed in flexible substrates.
Wherein in an embodiment, the step of described electrode unit plated surface one deck decorative layer is also included in after described step 3, the material of described decorative layer is platinum, iridium, or one or both the alloy comprised in these two kinds of elements or compound, or the one in polypyrrole, poly-(3,4-rthylene dioxythiophene), polyaniline.
Wherein in an embodiment, described rigid basement is glass boss.
Above-mentioned flexible epicardium electrocardio-electrchip chip has good pliability and deformability, record position accurately, contact tight, reproducible.In addition while the micro-meter scale machining accuracy ensureing electrod-array and spatial resolution, the one-dimensional deformation of 90% and the two-dimensional deformation of 20% can be realized, do not need significantly to reduce substrate thickness and just can realize good conformal effect, realize the identical attaching of microelectrode array and heart surface, improve sensitivity.Meanwhile, the flexible matching performance good with heart, effectively can reduce chip causes damage risk to visceral pericardium.In addition, chip still can keep good electric property under folding, distortion and stretching condition, thus improves the matching with heart.
Accompanying drawing explanation
Fig. 1 is the structural representation of flexible epicardium electrocardio-electrchip chip in an embodiment;
Fig. 2 is the sectional view along dotted line 6 shown in Fig. 1;
Fig. 3 is the flow chart of the preparation method of flexible epicardium electrocardio-electrchip chip in an embodiment;
Fig. 4 is the flow chart of the preparation method of flexible epicardium electrocardio-electrchip chip in embodiment 1;
Fig. 5 is the structural representation of flexible epicardium electrocardio-electrchip chip in embodiment 2;
Fig. 6 is the sectional view along dotted line 12 shown in Fig. 5;
Fig. 7 is the application schematic diagram of flexible epicardium electrocardio-electrchip chip in embodiment 2;
Fig. 8 is the flow chart of the preparation method of flexible epicardium electrocardio-electrchip chip in embodiment 2.
Detailed description of the invention
For enabling object of the present invention, feature and advantage more become apparent, and are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.
Embodiment 1:
Fig. 1 is the structural representation of flexible epicardium electrocardio-electrchip chip in embodiment 1, and flexible epicardium electrocardio-electrchip chip comprises flexible substrates 1, insulating barrier 2, electrode unit 3, contact conductor 4 and lead-in wire junction point 5.Contact conductor 4 electrode electrically connected unit 3 and lead solder-joint 5, electrode unit 3, contact conductor 4 and an a lead solder-joint 5 composition electrode assemblie jointly.Electrode assemblie is located in flexible substrates 1, and insulating barrier 2 to be located in flexible substrates 1 and coated electrode lead-in wire 4.Electrode unit 3 is for being electrically connected heart, and lead-in wire junction point 5 is for realizing the connection of electrocardioelectrode and external circuit.Fig. 2 is the sectional view along dotted line 6 shown in Fig. 1, and in this embodiment, electrode unit 3 and lead-in wire junction point 5 expose to the open air in the external world, and insulating barrier is not established in surface.Electrode unit quantity is 10, becomes the matrix distribution of 2*5.Understandable, the size of electrode unit 3, spacing, quantity can adjust based on the actual application requirements.The live width of contact conductor 4, spacing, cabling mode can adjust in the rational situation of wiring taking into full account.Size and the spacing of lead-in wire junction point 5 can adjust based on the actual application requirements.Lead-in wire junction point 5 and electrode unit 3 one_to_one corresponding, quantity is identical.
The material of flexible substrates 1 and insulating barrier 2 is polydimethylsiloxane (polydimethylsiloxane).Polydimethylsiloxane has good pliability and deformability and good biocompatibility, and can ensure machining accuracy and the spatial resolution of flexible epicardium electrocardio-electrchip chip.
Above-mentioned flexible epicardium electrocardio-electrchip chip is arranged by multiple electrode unit 3 and forms electrod-array, the minimum spatial resolution to micro-meter scale can be realized, there is good pliability and deformability, heart surface can be attached to, adapt to the change of heart surface profile, can ensure that electrode and heart surface target area form good attaching, effectively can avoid again the infringement such as extruding and scuffing caused by electrode in heart movement process.Can be used for the etiologic diagnosis of heart disease and focus is accurately located, for immunotherapy targeted autoantibody provides objective basis.
Fig. 3 is the flow chart of the preparation method of flexible epicardium electrocardio-electrchip chip in an embodiment, comprises the following steps:
S110, rigid basement arranges polydimethylsiloxane and forms flexible substrates 1.
Rigid basement can select glass, silicon chip etc., mainly plays a part to support.In the present embodiment, rigid basement adopts silicon chip (can be any crystal orientation), and adopts the mode of spin coating that polydimethylsiloxane is arranged on silicon chip surface.The method wherein changing flexible substrates 1 thickness mainly contains two kinds: one changes spin speed, and another is the concentration changing polydimethylsiloxane.
S120, flexible substrates 1 is formed electrode unit 3, contact conductor 4 and lead-in wire junction point 5.
Micro fabrication (comprising thin film preparation process, photoetching process, etching technics etc.) is adopted to make in flexible substrates 1.An electrode unit 3, contact conductor 4 and a lead-in wire junction point 5 form an electrode assemblie, and electrode unit 3 and lead-in wire junction point 5 are electrically connected by contact conductor 4.Wherein in an embodiment, electrode assemblie at least comprises electrode layer, and the material of electrode layer is the one in gold, titanium, copper.Wherein in an embodiment, electrode assemblie also comprises prime coat, and electrode layer is located on prime coat, and the material of prime coat is titanium, chromium, or comprises one or both the alloy in these two kinds of elements.Wherein in an embodiment, electrode unit 3 also comprises decorative layer, decorative layer is located at the surface of electrode unit 3 flexible substrates 1 dorsad, the material of decorative layer is platinum, iridium, or one or both the alloy comprised in these two kinds of elements or compound, or the one in polypyrrole, poly-(3,4-rthylene dioxythiophene), polyaniline.
S130, the polydimethylsiloxane that flexible substrates 1 arranges coated electrode assembly forms insulating barrier 2, and forms opening at the electrode unit 3 of insulating barrier 2 with lead-in wire junction point 5 position, electrode unit 3 and lead-in wire junction point 5 is exposed.
Insulating barrier 2 can be arranged by the method for spin coating equally, and the thickness of insulating barrier 2 also can be adjusted by the method for the concentration changing spin speed or change polydimethylsiloxane.
S140, is separated flexible substrates 1 from rigid basement, obtains flexible epicardium electrocardio-electrchip chip.
The flexible nerve tract electrode adopting the preparation method of above-mentioned flexible nerve tract electrode to prepare, has good size adaptability, is easy to the normalization design realizing device.
Reoffer the preparation method of the flexible epicardium electrocardio-electrchip chip in a kind of embodiment 1, see Fig. 4, comprise the following steps:
S210, on the silicon chip in any crystal orientation, spin coating one deck polydimethylsiloxane is as flexible substrates 1.
S220, prepares one piece of mask, mask is formed the pierced pattern of electrode assemblie, be placed in by mask in flexible substrates 1, is formed and closely attaches.
S230, adopts the method for electron beam evaporation in flexible substrates 1, first to deposit one deck titanium film as prime coat, and then adopts the method for thermal evaporation on prime coat, to deposit one deck gold film as electrode layer.
Prime coat and electrode layer are subject to the pierced pattern restriction of mask, form the shape of electrode assemblie.
S240, removes mask.
S250, adopts thicker photoresist to carry out photoetching, and photoetching glue victim layer is prepared in the position of electrode unit 3 with the position of lead-in wire junction point 5.
S260, spin coating one deck polydimethylsiloxane is as insulating barrier 2.
Wherein the thickness of insulating barrier 2 should far below the thickness of thicker photoetching glue victim layer.
S270, removes photoetching glue victim layer, forms insulating layer openings, come out by the electrode assemblie of relevant position in the position of sacrifice layer.
S280, carries out finishing to electrode unit 3.
Namely the plated surface one deck platinum black exposed at electrode unit 3 or yttrium oxide as decorative layer, to reduce impedance.
In other embodiments, the material of decorative layer can be platinum, iridium, or one or both the alloy comprised in these two kinds of elements or compound, or polypyrrole, poly-(3,4-rthylene dioxythiophene), one in polyaniline.
Embodiment 2:
Fig. 5 is the structural representation of flexible epicardium electrocardio-electrchip chip in embodiment 2, and flexible epicardium electrocardio-electrchip chip is made up of flexible substrates 7, insulating barrier 8, electrode unit 9, contact conductor 10 and lead-in wire junction point 11 5 part equally.Be to which employs a kind of stepped electrode structure with the electrode structure difference in embodiment 1 in this embodiment, the stepped design of thickness of flexible substrates 7.Although polydimethylsiloxane itself has good elastic performance, its dynamic stretchable ability, pliability and attaching thereof are still closely bound up with its thickness.In order to better adapt to contraction and the diastole of heart, avoiding producing damage to visceral pericardium, can carry out thinning to the flexible substrates 7 of the position (mainly concentrating on electrode unit array and part routing region) that electrode paste is attached on heart.Concrete, in one embodiment, be positioned at the thickness of thickness much smaller than other region of flexible substrates 7 of the flexible substrates 7 below electrode unit 9, much smaller than referring generally to less than 1/10th.In the present embodiment, below flexible substrates 7 local reduction to 5 μm electrode paste being attached to the position on heart, and peripheral leads junction point 11 part can remain on a thicker horizontal 50-500 μm, the flexibility of device can be ensured like this, also ensure that the operability in its encapsulation and operation process simultaneously.
In example 2, the thickness of the part that flexible substrates 7 is positioned at below lead-in wire junction point 11 is positioned at the thickness of the part of the below of electrode unit 9 and contact conductor 10 much larger than flexible substrates 7, the one side that flexible substrates 7 is provided with electrode assemblie is plane.Fig. 6 is the sectional view along dotted line 12 shown in Fig. 5.Fig. 7 is its application schematic diagram, and comprising heart 13, wire 14, wire 14 is for realizing the connection of lead-in wire junction point 11 and external circuit.
In example 2, the cross section of flexible substrates 7 is rectangle, electrode unit 9 and lead-in wire junction point 11 one_to_one corresponding.Electrode assemblie comprises about axisymmetric two row of rectangular perpendicular bisector, the lead-in wire junction point 11 of electrode unit 9 and its correspondence is positioned at the same side of perpendicular bisector, electrode unit 9 is located at the position near perpendicular bisector, corresponding lead-in wire junction point 11 be positioned near rectangle parallel with perpendicular bisector position.One side in insulating barrier 8 dorsad in the middle part of flexible epicardium electrocardio-electrchip chip forms inside depression.
Reoffer the preparation method of the flexible epicardium electrocardio-electrchip chip in a kind of embodiment 2, see Fig. 8, comprise the following steps:
S310, is having the polydimethylsiloxane flexible substrates 7 of ledge structure with preparation in the substrate of glass of boss structure.
Boss structure is right angle boss in the present embodiment, also can be oblique angle boss in other embodiments.
S320, adopts (lift-off) technology of stripping, the reversal photoresist pattern of the required electrode unit 9 of preparation, contact conductor 10 and lead-in wire junction point 11 on flexible substrates 7.
S330, adopts the mode of electron beam evaporation to deposit layer of metal titanium film in flexible substrates 7.
S340, remove photoresist and on metal titanium membrane, directly formed required for electrode unit 9, contact conductor 10 and go between junction point 11.
S350, in the flexible substrates preparing electrode unit 9, contact conductor 10 and lead-in wire junction point 11, spin coating one deck polydimethylsiloxane is as insulating barrier 8.
S360, adopts the method for cut to cut at electrode unit 9 and lead-in wire junction point 11 correspondence position, removes the insulating barrier on electrode unit 9 and lead-in wire junction point 11 surface, realize opening.
S370, carries out finishing to electrode unit 9.
Namely the plated surface one deck platinum black exposed at electrode unit 9 or yttrium oxide as decorative layer, to reduce impedance.
As the electrode chip of a kind of accurate measurement and observation analysis cardiac electrical activity, flexible epicardium electrocardio-electrchip chip is different from routine electrocardiogram electrode, it can not only draw diagnosis on a macro scale, the exact position of pathological changes can also be determined, can be immunotherapy targeted autoantibody and objective basis is provided, the curative effect of medicine can also be observed more intuitively.
Compared with prior art, the present invention has effect useful as follows:
1. this flexible epicardium electrocardio-electrchip chip adopts the material with organism with good biocompatibility to prepare, and can use for a long time in vivo.
2. electrode chip adopts flexible material to make, more can adapt to the differently contoured of heart surface and can with heart movement synchronization telescope and not being shifted.
3. electrode chip adopts automatic laminating, avoids to be sewn to and cardiac muscle causes wound and produces injury potential, affect signals collecting precision.
4. the junction point that goes between adopts flexible design, ensures that each electrode points contacts well with visceral pericardium, avoids rigid electrode contacts and cause the phenomenon of switch-on and-off to occur.
5. electrode chip can change spatial resolution as required, disturbs little between electrod-array, easy to use, without the need to sewing up.
6. can according to the memorization COMS clip pattern of cardiac structure design ap-plication in different parts, can placement location many, displacement rate is low, can not produce complication.
7. electrode chip still keeps good electric property under the condition of folding, distortion and stretching, improves the operability of implantation, reduces operation risk.
8. this electrode chip can also be used to observe curative effect of medication intuitively.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (5)
1. a flexible epicardium electrocardio-electrchip chip, it is characterized in that, comprise: flexible substrates, electrode unit, contact conductor, lead-in wire junction point and insulating barrier, described electrode unit, contact conductor and lead-in wire junction point form electrode assemblie jointly, described electrode assemblie is located in described flexible substrates, described electrode unit is connected to lead-in wire junction point via contact conductor, realize electrical connection, described insulating barrier to be located in described flexible substrates and to be covered described contact conductor, described electrode unit is for being electrically connected heart surface, the material of described flexible substrates and insulating barrier is polydimethylsiloxane, described flexible substrates is positioned at the thickness of thickness much smaller than other region of flexible substrates of electrode unit part, described much smaller than finger less than 1/10th.
2. flexible epicardium electrocardio-electrchip chip according to claim 1, is characterized in that, described electrode assemblie comprises electrode layer, and the material of described electrode layer is the one in gold, titanium, copper.
3. flexible epicardium electrocardio-electrchip chip according to claim 2, it is characterized in that, described electrode assemblie also comprises prime coat, and described electrode layer is located on described prime coat, the material of described prime coat is titanium, chromium, or comprises one or both the alloy in these two kinds of elements.
4. the flexible epicardium electrocardio-electrchip chip according to Claims 2 or 3, it is characterized in that, described electrode unit also comprises decorative layer, described decorative layer is located at the surface of electrode unit described flexible substrates dorsad, the material of described decorative layer is platinum, iridium, or one or both the alloy comprised in these two kinds of elements or compound, or polypyrrole, poly-(3,4-rthylene dioxythiophene), one in polyaniline.
5. flexible epicardium electrocardio-electrchip chip according to claim 1, it is characterized in that, the cross section of described flexible substrates is rectangle, described electrode unit and lead-in wire junction point one_to_one corresponding, described electrode assemblie comprises about axisymmetric two row of described rectangular perpendicular bisector, described electrode unit and corresponding lead-in wire junction point are positioned at the same side of perpendicular bisector, described electrode unit is located at the position near described perpendicular bisector, corresponding lead-in wire junction point is positioned at the position near rectangle one side parallel with described perpendicular bisector, one side in described insulating barrier dorsad in the middle part of described flexible epicardium electrocardio-electrchip chip forms inside depression.
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| CN201310082091.3A CN103202690B (en) | 2013-03-14 | 2013-03-14 | Flexible epicardium electrocardio-electrode chip and preparation method thereof |
| PCT/CN2013/074306 WO2014139194A1 (en) | 2013-03-14 | 2013-04-17 | Flexible epicardial ecg electrode chip and preparation method thereof |
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| CN201310082091.3A CN103202690B (en) | 2013-03-14 | 2013-03-14 | Flexible epicardium electrocardio-electrode chip and preparation method thereof |
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| CN103462601B (en) * | 2013-09-24 | 2016-06-15 | 深圳先进技术研究院 | Electrode for medical service pastes and preparation method thereof |
| CN104095628A (en) * | 2014-07-04 | 2014-10-15 | 李若斌 | Flexible medical electrode, medical electrode sheet, detecting instrument, treatment instrument and application |
| CN104739403B (en) * | 2015-04-10 | 2017-08-25 | 中国科学院重庆绿色智能技术研究院 | Graphene nano wall flexibility electrocardioelectrode and preparation method thereof |
| CN104880206B (en) * | 2015-06-09 | 2018-03-06 | 中国科学院深圳先进技术研究院 | Resistance strain gage and resistance strain type sensor |
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| CN107920740B (en) * | 2015-08-20 | 2020-11-24 | 波士顿科学医学有限公司 | Flexible electrodes for cardiac sensing and methods of making the same |
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| CN102544052A (en) * | 2012-03-08 | 2012-07-04 | 中国科学院深圳先进技术研究院 | Flexible intracranial cortex microelectrode chip, and preparation method and packaging method and packaging structure thereof |
| CN102764479A (en) * | 2012-07-13 | 2012-11-07 | 中国科学院深圳先进技术研究院 | Flexible nerve tract electrode and preparation method thereof |
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