CN102623625A

CN102623625A - Novel LED (light-emitting diode) device

Info

Publication number: CN102623625A
Application number: CN2012100998860A
Authority: CN
Inventors: 朱晓飚; 郑群亮; 隋晓斌
Original assignee: ZHEJIANG Z-LIGHT OPTOELECTRONICS Co Ltd
Current assignee: ZHEJIANG Z-LIGHT OPTOELECTRONICS Co Ltd
Priority date: 2012-04-06
Filing date: 2012-04-06
Publication date: 2012-08-01

Abstract

The invention discloses a novel LED (light-emitting diode) device which comprises a packaged support carrier, wherein the support carrier is provided with a plurality of individual reflection cups; each reflection cup is internally provided with at least one LED light-emitting wafer of wafer-fixing bonding wires and bonding plates corresponding to the wafer-fixing bonding wires; and colloid is covered on the surfaces of the light-emitting wafers. According to the invention, the LED application functions are intensified, the service life of an LED is prolonged, the light emergent efficiency is high, and the package of multiple types of white light colors is realized.

Description

The New LED device

Technical field

The present invention relates to a kind of New LED device.

Background technology

Because LED has energy-saving and environmental protection, in light weight, plurality of advantages such as the life-span is long, volume is little, stable performance, obtains a lot of extensive applications; Along with the development of whole industry, LED in the application of lighting field more and more widely and has multiple advantage, is regarded as one of main light source of following illumination, will play an important role at lighting field.

The packing forms of present LED; Normally on metallic support or substrate, penetrate PPA or engineering plastics; Form an optics bowl cup (reflector); At one or more LED wafers of optics bowl cup internal fixation, and carry out the wafer connection in series-parallel in optics bowl cup inside through plain conductor and connect, in optics bowl cup, fill the colloid that is mixed with fluorescent material then.This packing forms can only be realized the color of single white light in single LEDs, and heat is too concentrated and each wafer does not have independent passage of heat in plurality of LEDs wafer package process, and during polycrystalline sheet encapsulation simultaneously, bright dipping is disturbed mutually between wafer and the wafer.So strengthening the application function of LED will be following important topic with the life-span, the light extraction efficiency that improve LED.

Summary of the invention

When overcoming in the prior art encapsulation of polycrystalline sheet, the problem that bright dipping is disturbed mutually between wafer and the wafer, the present invention provides a kind of New LED device.

The technical scheme that the present invention adopts is:

The New LED device; It is characterized in that: comprise a package support carrier; Said support carrier is provided with a plurality of independently reflectors; At least be provided with in said each reflector a solid brilliant bonding wire the LED luminescent wafer and with the said solid corresponding pad of brilliant bonding wire, said luminescent wafer surface coverage has colloid.

Further, the wavelength of the luminescent wafer in said each reflector can be different.

Further, said pad can be gone here and there in said reflector inside and connects according to design demand.

Further, low pattern between senior middle school around the final light-emitting window of said reflector can be designed to.

Further, be coated with colloid in the low centre between senior middle school around said, can realize that the abundant mixed light of the light that is sent in each reflector realizes the uniformity and the soften of hot spot, can improve the whole light extraction efficiency of the LED in all reflectors simultaneously.

Further, the wavelength of the luminescent wafer in said each reflector can be any wavelength in all band scope.

Further, the colloid of said luminescent wafer surface coverage coats all plain conductors in LED wafer and the reflector.

Beneficial effect of the present invention is embodied in: during the encapsulation of polycrystalline sheet, bright dipping is not disturbed mutually between wafer and the wafer, has strengthened the application function of LED, and the life-span, the light extraction efficiency that have improved LED are high.

Description of drawings

Fig. 1 is the embodiment of the invention two structural representations.

Fig. 2 is the embodiment of the invention three structural representations.

Fig. 3 is the embodiment of the invention four structural representations.

Embodiment

Embodiment one

The New LED device; Comprise a package support carrier; Said support carrier is provided with a plurality of independently reflectors, be provided with at least in said each reflector a solid brilliant bonding wire the LED luminescent wafer and with the said solid corresponding pad of brilliant bonding wire, said luminescent wafer surface coverage has colloid.

Embodiment two

As shown in Figure 1; The New LED device; Comprise a package support carrier 100, said support carrier is provided with two independently

reflectors

40,41, is fixed on the LED

luminescent wafer

30,32 in the said reflector; The LED luminescent wafer adopts the heat-conducting glue hydropexis in said

reflector

40,41, and the heat that in work, produced of

luminescent wafer

30,32 can externally conduct through support pin 10 independently.

Fluorescent glue

50,51 covers on the

luminescent wafer

30,32, and

luminescent wafer

30,32 is can wavelength different; Can allocate corresponding

fluorescent glue

50,51 according to the wavelength of

luminescent wafer

30,32, fluorescent glue can adopt the mode of spraying, the mode that point is annotated, the mode of printing to cover on the

luminescent wafer

30,32 simultaneously.

During use; Can pass through

luminescent wafer

30,32 corresponding pins 10; Light

luminescent wafer

30,32 respectively and excite the

fluorescent glue

50,51 that covers in the reflector on the

luminescent wafer sheet

30,32 40,41; Realize that two kinds of white light color LED are luminous, when lighting luminescent wafer 30,32 simultaneously,

luminescent wafer

30,32 excites simultaneously and covers the

fluorescent glue

50,51 in the

reflector

40,41 on the

luminescent wafer

30,32;

Luminescent wafer

30,32 excites and covers the light that the fluorescent glues in the reflector on the

luminescent wafer

30,32 40,41 were sent at 50,51 o'clock and carry out mixed light, realizes that other a kind of white light color LED is luminous.Therefore, this kind encapsulating structure can be implemented in the LED device package of multiple white light color on single LEDs support carrier.

Embodiment three

As shown in Figure 2, the embodiment three of the LED device that provides for the embodiment of the invention, wherein identical parts adopt identical reference numerals to represent with embodiment two, the difference of embodiment three and embodiment two be in:

On package support carrier 100, set up reflector 42, in reflector 42, can fix and the different luminescent wafer 31 of

reflector

40,41 wavelength, luminescent wafer 31 can be any wafer in the visible wavelength range.

In use; Control

luminescent wafer

30,31,32 corresponding pins 10 respectively; Light

luminescent wafer

30,31,32 respectively and excite the

fluorescent glue

51,52,50 that covers in the reflector on the

luminescent wafer

30,31,32 41,42,40, realize that the LED of multiple color is luminous.

In the embodiment of the invention, when putting the luminescent wafer 31 of non-blue wave band admittedly in the reflector 42, the fluorescent glues 52 that cover in the optics reflector on the luminescent wafer 31 42 will be the transparent colloids that does not mix fluorescent material.

In the embodiment of the invention; When in reflector 42, putting the luminescent wafer 31 of red wave band admittedly; Its luminescent wafer 31 can be distinguished mixed lights with

luminescent wafer

30,32; Realize the white light LEDs of high light efficiency, high color rendering index (CRI), solve in the conventional package mode red spectral band wafer and blue wave band wafer are placed on the low problem of light efficiency that is packaged into white-light LED with high color rendering index in the same optical reflection cup admittedly.

In the embodiment of the invention; When the luminescent wafer 31 of in the anti-body cup 42 of optics, putting yellow wave band admittedly; On luminescent wafer 31, cover the transparent colloid that does not mix fluorescent material in the optics reflector 42; Realize the encapsulation of the yellow led of low colour temperature, solve blue wafer excitated fluorescent powder and encapsulate the low problem of light efficiency when hanging down colour temperature.

Embodiment four

As shown in Figure 3, the embodiment four of the LED device that provides for the embodiment of the invention, wherein identical parts adopt identical reference numerals to represent with embodiment two, three, the difference of embodiment four and embodiment two, three be in:

Set up a reflector 60 on the package support carrier 100 again, reflector 60 is in the periphery of

reflector

40,41,42, and promptly

reflector

40,41,42 is arranged on the inside of reflector 60.

In the embodiment of the invention; The reflector 60 inner colloids 20 that have scattering particles that cover; The light that can the luminescent wafers 32,30,31 in the

reflector

40,41,42 be sent carry out mixed light, and the light that finally sends in the reflector 60 is more even, soft, simultaneously with the colloid 20 of scattering particles; Can improve the output of light, strengthen the light extraction efficiency of this encapsulating structure.

The described content of this specification embodiment only is enumerating the way of realization of inventive concept; Should not being regarded as of protection scope of the present invention only limits to the concrete form that embodiment states, protection scope of the present invention also reach in those skilled in the art conceive according to the present invention the equivalent technologies means that can expect.

Claims

1. New LED device; It is characterized in that: comprise a package support carrier; Said support carrier is provided with a plurality of independently reflectors; At least be provided with in said each reflector a solid brilliant bonding wire the LED luminescent wafer and with the said solid corresponding pad of brilliant bonding wire, said luminescent wafer surface coverage has colloid.

2. New LED device as claimed in claim 1 is characterized in that: the wavelength of the luminescent wafer in said each reflector can be different.

3. New LED device as claimed in claim 2 is characterized in that: said pad can be gone here and there in said reflector inside and connects according to design demand.

4. New LED device as claimed in claim 3 is characterized in that: low pattern between senior middle school around the final light-emitting window of said reflector can be designed to.

5. New LED device as claimed in claim 4 is characterized in that: be coated with colloid in the low centre between senior middle school around said.

6. New LED device as claimed in claim 5 is characterized in that: the wavelength of the luminescent wafer in said each reflector can be any wavelength in all band scope.

7. New LED device as claimed in claim 6 is characterized in that: the colloid of said luminescent wafer surface coverage coats all plain conductors in LED wafer and the reflector.