CN103335226A - LED (light emitting diode) bulb lamp capable of emitting lights in all directions - Google Patents
LED (light emitting diode) bulb lamp capable of emitting lights in all directions Download PDFInfo
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- CN103335226A CN103335226A CN2013102442651A CN201310244265A CN103335226A CN 103335226 A CN103335226 A CN 103335226A CN 2013102442651 A CN2013102442651 A CN 2013102442651A CN 201310244265 A CN201310244265 A CN 201310244265A CN 103335226 A CN103335226 A CN 103335226A
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- led
- transparent
- bulb lamp
- shell
- light
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
- F21V3/12—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings the coatings comprising photoluminescent substances
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention provides an LED (light emitting diode) bulb lamp capable of emitting lights in all directions, and relates to the field of semiconductor lighting. The LED bulb lamp comprises a light emitting part and an electric connection part, wherein the electric connection part and the light emitting part are connected by an insulation connection component, the light emitting part consists of an upper transparent cover, a transparent bulb shell and an LED light source, the LED light source is arranged between the upper transparent cover and a transparent shell and is formed by adhering an LED chip onto a transparent substrate through transparent silica gel, and blue lights emitted by the LED chip excites fluorescent powder glue coated on the surface of the LED chip or fluorescent ions doped on the upper transparent cover, the transparent bulb shell or the transparent substrate to generate yellow lights, red lights and blue lights to be combined into white lights. According to the LED bulb lamp disclosed by the invention, the light emitting range is close to 360 degrees, higher lighting effect can be obtained, and the defects that the electric connection is poor, the thermal conductivity is poor and the light emitting angle is small in the traditional large-angle light-emitting bulb lamp are effectively overcome; and the LED bulb lamp is suitable for large-scale popularization.
Description
Technical field
The present invention relates to field of semiconductor illumination, particularly a kind of LED bulb lamp of omnirange bright dipping.
Background technology
As a kind of energy-conservation, environmental protection light source, LED be known as after incandescent lamp, fluorescent lamp and high-pressure discharge lamp the 4th generation light source, along with people to the further investigation of III-V compound material and reaching its maturity of metal-organic chemical vapor deposition equipment (MOCVD) growing technology, developed super bright great power LED, the particularly appearance of highlighted GaN blue-ray LED, yttrium aluminium garnet fluorescent powder (YAG:Ce3+) in conjunction with high conversion efficiency has made the dual base color white light LEDs, and LED is skelped to lighting field.The white light LEDs of commercialization has at present reached 100lm/w, and the laboratory level of Cree company has reached 276lm/w.
LED with the III-V compound semiconductor (as GaAs, GaP or GaN etc.) material is substrate, in with semiconductor, half mixes III family element and forms P-type material, second half mixes V group element and forms n type material, electronics is spread to the P district by the N district, the hole is spread to the N district by the P district, border between two halves forms PN junction, produce a potential barrier simultaneously and stop the further diffusion in electronics and hole, reach poised state, when PN junction added a forward bias voltage, the PN junction potential barrier reduced, N district electronics injects to the P district, meets compound at the PN junction place and the form of unnecessary energy with photon discharged in electronics and hole.The frequency of outgoing photon determines by the semiconductor energy gap, therefore, the LED that adopts the different material of energy gap to make, issued light wavelength difference, the light that LED sends is arrowband monochromatic light, therefore single led chip can't obtain white light.
According to the research to visible light, the white light that people's eyes can be seen can be mixed by two or more monochromatic light.Based on this principle, there are three kinds of methods to obtain white light LEDs, first kind is can be by blue-light excited yellow fluorescent powder in the coating of blue led chip, the complementary white light that forms of the gold-tinted that the blue light that chip sends and fluorescent material send; Second kind at blue led chip coating green and red fluorescence powder, green glow and the compound white light that obtains of ruddiness that the blue light that sends by chip and fluorescent material send; The third is the fluorescent material in purple light or ultraviolet leds chip coating three primary colours or multiple color, utilizes long wave ultraviolet light (370nm-380nm) or the purple light (380nm-410nm) of this chip emission to come excitated fluorescent powder, thereby realizes the white light emission.
The white light LEDs of prior art is formed with blue-light LED chip and fluorescent material mostly, and its principle is that the blue-light excited fluorescent material that led chip sends produces gold-tinted, produces white light after blue light and the yellow light mix.Its encapsulation normally is fixed on led chip on the substrate with crystal-bonding adhesive, cover phosphor powder layer at led chip then, yet, the encapsulated LED light source is because the substrate that uses is transparent materials in this way, its lighting angle maximum has only 180 °, this packaged type has following several shortcoming: l. because led chip is 360 ° of illuminators originally, adopt opaque substrate to be connected for optically focused or with metal heat sink, usually in the bottom surface of led chip the reflecting layer is arranged, so being 360 ° illuminator, script is made into 180 ° illuminator, this just makes 180 ° light of directive radiator one side will pass through the outgoing of reflection ability, therefore the reflectivity of substrate surface is very big to the influence of light efficiency, will make the argentum reflecting layer of high reflectance at substrate usually, and expense is expensive and make complicated, cause bulb lamp with high costs, yield rate is lower.2 substrates cause obstruction to the heat radiation of led chip, make that the radiating effect of integrated light source is bad, when utilizing this light source to make light fixture, generally all will consider supporting radiator, have both limited the structural design of light fixture, improve the manufacturing cost of light fixture again.3, for better heat radiation, substrate material generally adopts metal substrate, and the dielectric voltage withstand characteristic of metal substrate is relatively poor, therefore needs to adopt the good solid brilliant primer of insulating properties, but the transmitance of the solid brilliant primer of good insulation preformance is lower, has therefore further influenced the light efficiency of whole system.
To this, a lot of producers consider to adopt transparency carrier to encapsulate bulb lamp, Chinese patent 200510089384.X for example, and it places transmission substance to single led chip hanging shape, makes 360 ° of chips luminous; But it does not solve the heat dissipation problem of chip, and chip does not have the electric lead-out wire reliability on the unsettled placement of gripper shoe, the chip very poor.Also just like patent 201120319651.9,201220184752.4,201010278760.0 and 201010610092.7 etc., the led light source of this class lamp is made with discrete transparency carrier encapsulated LED light-emitting section, the LED light-emitting section passes through the connector vertical fixing in bulb, this bulb is because substrate adopts stem stem to be connected with power shelf, therefore blocked by stem stem can't transmission for some light, and the solder joint of this bulb assembling electric welding is many, and light-emitting section only connects by connector, the less heat dispersion that influences system of the contact area of connector.
In sum, the LED lamp ubiquity light efficiency of the wide-angle bright dipping of prior art is not high, and reliability of electrical connection is poor, assembling flow path complexity, many shortcomings such as it is bad to dispel the heat.
Summary of the invention
Problem at common wide-angle light extracting LED bulb lamp existence, the present invention adopts following technological means to realize: a kind of LED bulb lamp of omnirange bright dipping, comprise luminous component and electrical connections, described electrical connections is by a control circuit, an electric connector, an insulated connecting piece is formed, described control circuit is installed in the electric connector, be connected with luminous component by insulated connecting piece, it is characterized in that: described luminous component is by a transparent upper cover, transparent cell-shell and led light source constitute, led light source is installed between transparent upper cover and the transparent outer cover, transparent upper cover adopts gluing with transparent outer cover or is threaded, described led light source comprises a transparency carrier, a plurality of led chips of a string at least equidirectional series connection are installed on the transparency carrier, the rising angle of described led chip is 360 °, led chip is fixed on the transparency carrier with solid brilliant insulating cement, described led chip surface and the transparency carrier back side cover the fluorescent material glue-line, the part blue light that described fluorescent material is sent out led chip is transformed into gold-tinted, gold-tinted obtains white light with the residue blue light, described transparency carrier, transparent upper cover, can mix the fluorescence ion in the transparent cell-shell, the part blue light that described fluorescence ion is sent out led chip is transformed into ruddiness or gold-tinted, thereby obtain the white light of high color rendering index (CRI), the central evapn of described transparency carrier is coated with transparency electrode, described led chip is realized being electrically connected with electrode by gold thread or aluminum steel, transparency electrode uses lead to be connected with the control power supply, described transparent electrode material can be ITO, Graphene or ZnO, described transparency carrier, the material of transparent upper cover and transparent cell-shell can be the crystalline ceramics with high heat conductance, devitrified glass or monocrystalline, an end of the nearly electric connector of described printing opacity cell-shell is provided with a light reflecting board; Described transparent upper cover can be A-type, G-type, R-type, PAR-type, any in the cell-shell of T-type, candle type or existing bulb.
The LED bulb lamp of omnirange bright dipping of the present invention, led chip sends blue-light excited fluorescent material glue-line and produces gold-tinted, blue light and yellow light mix obtain white light, also can in transparency carrier, transparent upper cover and transparent cell-shell, mix the fluorescence ion and obtain higher colour rendering index, white light can not be blocked in the process of outgoing substantially, go out optical range near 360 °, and the heat that chip produces is by high heat conductive transparent substrate, transparent upper cover and transparent cell-shell can distribute very soon.
Description of drawings
Fig. 1 is the structural representation of the LED bulb lamp of a kind of omnirange bright dipping of the present invention.
Wherein 101 is transparent upper cover, and 102 is led light source, and 103 is transparent cell-shell, and 104 is the reflecting layer, and 105 are the control power supply, and 106 is lead, and 107 is insulated connecting piece, and 108 is electric connector, and 109 is phosphor gel
Fig. 2 is the led light source structural representation of the LED bulb lamp of a kind of omnirange bright dipping of the present invention.
Wherein 201 is transparency electrode, and 202 is led chip, and 203 is gold thread, and 204 is transparency carrier, and 205 is the fluorescent material glue-line.
The specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.
Embodiment one: Fig. 1 is the structural representation of an embodiment of the LED bulb lamp of a kind of omnirange bright dipping of the present invention, to control power supply 105 is installed among the electric connector 108, adopt electric connector 108 and printing opacity cell-shell 103 insulated connecting piece 107 to make up, the led light source 102 of 360 ° of packaged bright dippings is installed among the printing opacity cell-shell 103 afterwards, cover transparent upper cover 101 and use glue sealing, described led light source 102 as shown in Figure 2, led chip 202 is bonded in formation on the transparency carrier 204, adopt high heat conduction crystal-bonding adhesive bonding between led chip 202 and the transparency carrier 204, and be coated with ITO in the evaporation of the center of transparency carrier and form transparency electrode 201, described transparent electrode material is ITO, adopt gold thread 203 welding between transparency electrode 201 and the led chip 202, after finishing, welding covers the phosphor gel 109 for preparing at chip surface and the transparency carrier back side, employing lead 106 is connected between control power supply 105 and the transparency electrode 201, wherein transparent upper cover 101 and transparent cell-shell 103 are devitrified glass, what transparency carrier 204 adopted is the monocrystal material of mixing cerium ion, the whole light of test bulb lamp was imitated 151lm/W after encapsulation was finished, and colour rendering index is 80.
Embodiment two: Fig. 1 is the structural representation of another embodiment of the LED bulb lamp of a kind of omnirange bright dipping of the present invention, to control power supply 105 is installed among the electric connector 108, adopt electric connector 108 and printing opacity cell-shell 103 insulated connecting piece 107 to make up, the led light source 102 of 360 ° of packaged bright dippings is installed among the printing opacity cell-shell 103 afterwards, cover transparent upper cover 101 and use glue sealing, described led light source 102 as shown in Figure 2, led chip 202 is bonded in formation on the transparency carrier 204, adopt high heat conduction crystal-bonding adhesive bonding between led chip 202 and the transparency carrier 204, and be coated with ZnO in the evaporation of the center of transparency carrier and form transparency electrode 201, adopt gold thread 203 welding between transparency electrode 201 and the led chip 202, employing lead 106 is connected between control power supply 105 and the transparency electrode 201, wherein transparent upper cover 101, transparent cell-shell 103 and transparency carrier 204 all adopt two crystalline ceramics of mixing Ce3+ ion and Eu2+ ion, the whole light of test bulb lamp was imitated 117lm/W after encapsulation was finished, and colour rendering index is 90.
Embodiment three: Fig. 1 is the structural representation of another embodiment of the LED bulb lamp of a kind of omnirange bright dipping of the present invention, to control power supply 105 is installed among the electric connector 108, adopt electric connector 108 and printing opacity cell-shell 103 insulated connecting piece 107 to make up, the led light source 102 of 360 ° of packaged bright dippings is installed among the printing opacity cell-shell 103 afterwards, cover transparent upper cover 101 and use glue sealing, described led light source 102 as shown in Figure 2, led chip 202 is bonded in formation on the transparency carrier 204, adopt high heat conduction crystal-bonding adhesive bonding between led chip 202 and the transparency carrier 204, and be coated with ITO in the evaporation of the center of transparency carrier and form transparency electrode 201, adopt gold thread 203 welding between transparency electrode 201 and the led chip 202, after finishing, welding covers the phosphor gel 109 for preparing at chip surface and the transparency carrier back side, employing lead 106 is connected between control power supply 105 and the transparency electrode 201, wherein transparent upper cover 101, all mix the Eu2+ ion in transparent cell-shell 103 and the transparency carrier 204, the whole light of test bulb lamp was imitated 96lm/W after encapsulation was finished, and colour rendering index is 95.
Claims (8)
1. the LED bulb lamp of an omnirange bright dipping, comprise luminous component and electrical connections, described electrical connections is by a control circuit, an electric connector, an insulated connecting piece is formed, described control circuit is installed in the electric connector, be connected with luminous component by insulated connecting piece, it is characterized in that: described luminous component is by a transparent upper cover, transparent cell-shell and led light source constitute, led light source is installed between transparent upper cover and the transparent outer cover, and transparent upper cover adopts gluing with transparent outer cover or is threaded.
2. the LED bulb lamp of a kind of omnirange bright dipping according to claim 1, it is characterized in that: described led light source comprises a transparency carrier, a plurality of led chips of a string at least equidirectional series connection are installed on the transparency carrier, the rising angle of described led chip is 360 °, and led chip is fixed on the transparency carrier with solid brilliant insulating cement.
3. the LED bulb lamp of a kind of omnirange bright dipping according to claim 1, it is characterized in that: described led chip surface and the transparency carrier back side cover the fluorescent material glue-line, the part blue light that described fluorescent material is sent out led chip is transformed into gold-tinted, and gold-tinted obtains white light with the residue blue light.
4. the LED bulb lamp of a kind of omnirange bright dipping according to claim 1, it is characterized in that: can mix the fluorescence ion in described transparency carrier, transparent upper cover, the transparent cell-shell, the part blue light that described fluorescence ion is sent out led chip is transformed into ruddiness or gold-tinted, thereby obtains the white light of high color rendering index (CRI).
5. the LED bulb lamp of a kind of omnirange bright dipping according to claim 1, it is characterized in that: the central evapn of described transparency carrier is coated with transparency electrode, described led chip is realized being electrically connected with electrode by gold thread or aluminum steel, and transparency electrode uses lead to be connected with the control power supply.
6. the LED bulb lamp of a kind of omnirange bright dipping according to claim 1, it is characterized in that: described transparent electrode material can be ITO, Graphene or ZnO.
7. the LED bulb lamp of a kind of omnirange bright dipping according to claim 1, it is characterized in that: the material of described transparency carrier, transparent upper cover and transparent cell-shell can be crystalline ceramics, devitrified glass or the monocrystalline with high heat conductance.
8. the LED bulb lamp of a kind of omnirange bright dipping according to claim 1, it is characterized in that: an end of the nearly electric connector of described printing opacity cell-shell is provided with a light reflecting board; Described transparent upper cover can be A-type, G-type, R-type, PAR-type, any in the cell-shell of T-type, candle type or existing bulb.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102442651A CN103335226A (en) | 2013-06-19 | 2013-06-19 | LED (light emitting diode) bulb lamp capable of emitting lights in all directions |
| PCT/CN2013/083662 WO2014201774A1 (en) | 2013-06-19 | 2013-09-17 | Led bulb lamp capable of emitting lights in all directions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102442651A CN103335226A (en) | 2013-06-19 | 2013-06-19 | LED (light emitting diode) bulb lamp capable of emitting lights in all directions |
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| Publication Number | Publication Date |
|---|---|
| CN103335226A true CN103335226A (en) | 2013-10-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013102442651A Pending CN103335226A (en) | 2013-06-19 | 2013-06-19 | LED (light emitting diode) bulb lamp capable of emitting lights in all directions |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103335226A (en) |
| WO (1) | WO2014201774A1 (en) |
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| CN104806905A (en) * | 2015-03-31 | 2015-07-29 | 章建 | Light source and power supply integrated all sided light emitting LED lamp high in heat dissipation performance |
| CN104948953A (en) * | 2015-06-16 | 2015-09-30 | 吴明番 | All-illuminating high-illumination LED bulb and assembly method thereof |
| CN105222101A (en) * | 2015-10-23 | 2016-01-06 | 晶阳照明有限公司 | A kind of light-emitting diode lamp-plate and lighting device |
| CN106224799A (en) * | 2016-07-26 | 2016-12-14 | 江门市龙胜光电科技有限公司 | A kind of flying saucer lamp of back side illuminated |
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