CN102576625A - Hybrid relay - Google Patents

Hybrid relay Download PDF

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Publication number
CN102576625A
CN102576625A CN2010800478742A CN201080047874A CN102576625A CN 102576625 A CN102576625 A CN 102576625A CN 2010800478742 A CN2010800478742 A CN 2010800478742A CN 201080047874 A CN201080047874 A CN 201080047874A CN 102576625 A CN102576625 A CN 102576625A
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CN
China
Prior art keywords
switch
temperature
mentioned
mechanical contact
power supply
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CN2010800478742A
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Chinese (zh)
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CN102576625B (en
Inventor
住野安弘
柴田究
大和弘治
工藤弘行
三浦启
中埜进
松宫桂
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Panasonic Intellectual Property Management Co Ltd
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Matsushita Electric Industrial Co Ltd
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Publication of CN102576625A publication Critical patent/CN102576625A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H47/00Circuit arrangements not adapted to a particular application of the relay and designed to obtain desired operating characteristics or to provide energising current
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H47/00Circuit arrangements not adapted to a particular application of the relay and designed to obtain desired operating characteristics or to provide energising current
    • H01H47/002Monitoring or fail-safe circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/54Circuit arrangements not adapted to a particular application of the switching device and for which no provision exists elsewhere
    • H01H9/541Contacts shunted by semiconductor devices
    • H01H9/542Contacts shunted by static switch means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H47/00Circuit arrangements not adapted to a particular application of the relay and designed to obtain desired operating characteristics or to provide energising current
    • H01H47/02Circuit arrangements not adapted to a particular application of the relay and designed to obtain desired operating characteristics or to provide energising current for modifying the operation of the relay
    • H01H2047/025Circuit arrangements not adapted to a particular application of the relay and designed to obtain desired operating characteristics or to provide energising current for modifying the operation of the relay with taking into account of the thermal influences, e.g. change in resistivity of the coil or being adapted to high temperatures

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  • Relay Circuits (AREA)

Abstract

Provided is a hybrid relay wherein a semiconductor switch can be prevented from reaching a high temperature. The hybrid relay comprises a mechanical contact switch (12) the contact of which is opened/closed by a driving unit, and a semiconductor switch (13) that is connected in parallel with the mechanical contact switch (12). The hybrid relay also has a first power feeding comprising the mechanical contact switch (12) and a second power feeding path comprising the semiconductor switch (13) connected in parallel, as power feeding paths for supplying power to a load from a power supply. The hybrid relay also comprises a thermal fuse (F1), for example, as a safety circuit section for opening the power feeding path when the temperature of the semiconductor switch becomes equal to or more than a prescribed temperature.

Description

Hybrid relay
Technical field
The present invention relates to a kind of hybrid relay that possesses mechanical contact switch and semiconductor switch.
Background technology
In the past, in order to switch between the electric that possesses the negative circuit of carrying out anti-phase control at illumination utensil etc. and the outage, used the hybrid relay of the structure that mechanical contact switch and semiconductor switch are connected in parallel.In addition, in the load that possesses negative circuit, set up jumbo smmothing capacitor, to convert alternating voltage into direct voltage, when by AC power load being switched on, big electric current flows into this smmothing capacitor.Therefore, generation flows to shoving of load.Particularly under the situation of supply voltage height, high capacity, flow into shoving of load and become big, therefore also flow in the hybrid relay that is connected between load and the AC power based on this big electric current that shoves.
Therefore, with hybrid relay that this load is connected in, can be when opening and carry out the switching of semiconductor switch and mechanical contact switch during stable state.At first, be after conducting (ON) makes the inflow semiconductor switch that shoves only making semiconductor switch, when the electric current that offers load became stable state, making mechanical contact switch was closed (ON) (with reference to patent documentation 1).Through carrying out such action, can suppress big electric current and flow through the mechanical contact switch in the hybrid relay, therefore can avoid causing contact weld to producing electric arc before the contact soon by the contact.Like this, hybrid relay is made as possesses semiconductor switch to prevent the structure of the contact weld in the mechanical contact switch, making mechanical contact switch is ON and to make semiconductor switch be by (OFF), begins electric.
Patent documentation 1: japanese kokai publication hei 11-238441 communique
Summary of the invention
The problem that invention will solve
Like this; The hybrid relay that possesses mechanical contact switch and semiconductor switch is as the hybrid relay of patent documentation 1; In order to prevent the contact weld of mechanical contact switch, under the situation of power supply, making semiconductor switch earlier is ON, and making semiconductor switch after under the situation of outage is OFF.Therefore, when the unlatching of carrying out hybrid relay, closing motion, shove and all can flow through semiconductor switch, therefore compare the lifetime of semiconductor switch with mechanical contact switch.Have following situation: when this semiconductor switch reaches the life-span and when being short-circuited, semiconductor switch is continuous "on" position, so semiconductor switch is in Gao Re and becomes reason on fire.
The present invention In view of the foregoing accomplishes, and its purpose is to provide a kind of hybrid relay that can prevent the high heat of semiconductor switch.
The scheme that is used to deal with problems
In order to reach above-mentioned purpose, hybrid relay of the present invention possesses: mechanical contact switch, its contact are disconnected through drive division or are closed; And semiconductor switch; Itself and this mechanical contact switch is connected in parallel, and wherein, first power supply circuits that utilize mechanical contact switch to form are connected in parallel with second power supply circuits that utilize semiconductor switch to form to be used as by the power supply circuits of power supply to electric; This hybrid relay is characterised in that; Also possessing safety circuit portion, is set point of temperature when above in the temperature of semiconductor switch, the control of supplying power of this safety circuit portion.
In addition, the present invention also comprises following characteristic, and in above-mentioned hybrid relay, safety circuit portion is a temperature fuse, is set point of temperature when above in the temperature of semiconductor switch, and this temperature fuse breaks off.
In addition, the present invention also comprises following characteristic, and in above-mentioned hybrid relay, temperature fuse is set on second power supply circuits.
In addition, the present invention also comprises following characteristic, and in above-mentioned hybrid relay, safety circuit portion is a temperature switch, is set point of temperature when above in the temperature of semiconductor switch, and this temperature switch makes the drive division action come the contact of closed mechanical contact switch.
In addition, the present invention also comprises following characteristic, and in the promptly above-mentioned hybrid relay, safety circuit portion possesses: temperature sensor, and its temperature to semiconductor switch detects; And control part, be set point of temperature when above in temperature by the detected semiconductor switch of temperature sensor, this control part makes the drive division action come the contact of closed mechanical contact switch.
In addition; The present invention also comprises following characteristic; In above-mentioned hybrid relay; Above-mentioned mechanical contact switch possesses first mechanical contact switch and second mechanical contact switch, and the contact of this first mechanical contact switch and second mechanical contact switch is closed through drive division or breaks off, and second power supply circuits are constituted by the power supply circuits of power supply to electric with first power supply circuits that utilize first mechanical contact switch to form parallelly connectedly; Wherein, these second power supply circuits are connected in series by second mechanical contact switch and semiconductor switch and form.
In addition; The present invention also comprises following characteristic, in above-mentioned hybrid relay, is provided with temperature switch; In the temperature of semiconductor switch is set point of temperature when above, and this temperature switch makes the drive division action of first mechanical contact switch come the contact of closed first mechanical contact switch.
In addition, the present invention also comprises following characteristic, in above-mentioned hybrid relay, safety circuit portion be set at semiconductor switch packaging body protuberance above.
In addition, the present invention also comprises following characteristic, and in above-mentioned hybrid relay, safety circuit portion is a temperature fuse, and the middle heart that a lead terminal of temperature fuse is closely attached on the packaging body of semiconductor switch is configured.
In addition, the present invention also comprises following characteristic, in above-mentioned hybrid relay, also possesses notice portion, is set point of temperature when above in the temperature of semiconductor switch, and this notice portion is unusual to external notification.
The effect of invention
In the structure that possesses above-mentioned safety circuit portion, can when semiconductor switch is the abnormal temperature more than the set point of temperature, cut off power supply circuits, so semiconductor switch can not burn because of being further heated, on fire.
Description of drawings
Fig. 1 is the summary circuit diagram of internal structure of the hybrid relay of expression execution mode 1 of the present invention.
(a) of Fig. 2, (b) of Fig. 2 are respectively the summary circuit diagrams of internal structure of variation of the hybrid relay of expression execution mode 1 of the present invention.
Fig. 3 is the summary circuit diagram of internal structure of the hybrid relay of expression execution mode 2 of the present invention.
Fig. 4 is the summary circuit diagram of internal structure of the hybrid relay of expression execution mode 3 of the present invention.
(a) of Fig. 5, (b) of Fig. 5 are respectively the summary circuit diagrams of internal structure of the hybrid relay of expression execution mode 4 of the present invention.
(a) of Fig. 6, (b) of Fig. 6 are respectively the summary circuit diagrams of internal structure of variation of the hybrid relay of expression execution mode 4 of the present invention.
(a) of Fig. 7, (b) of Fig. 7 are respectively the summary circuit diagrams of internal structure of other variation of the hybrid relay of expression execution mode 4 of the present invention.
(a) of Fig. 8, (b) of Fig. 8 are respectively the summary circuit diagrams of internal structure of the hybrid relay of expression execution mode 5 of the present invention.
Fig. 9 is the summary circuit diagram of internal structure of the hybrid relay of expression execution mode 6 of the present invention.
Figure 10 is the summary circuit diagram of internal structure of the hybrid relay of expression execution mode 7 of the present invention.
Figure 11 is the summary circuit diagram of internal structure of the hybrid relay of expression execution mode 8 of the present invention.
Figure 12 is that the semiconductor switch to the hybrid relay of execution mode 9 of the present invention is provided with temperature fuse F1 respectively and the vertical view of the printed circuit board (PCB) that obtains.
Figure 13 is the figure of major part of the hybrid relay of expression execution mode 9 of the present invention, and (a) of Figure 13 is the vertical view of semiconductor switch and temperature fuse, and (b) of Figure 13 is the end view of semiconductor switch and temperature fuse.
Embodiment
Hybrid relay with reference to the description of drawings embodiment of the present invention.
(execution mode 1)
Fig. 1 is the summary circuit diagram of the internal structure of expression execution mode.
As shown in Figure 1; This hybrid relay 1 is characterised in that; First power supply circuits that utilize mechanical contact switch 12 to form and second power supply circuits that utilize semiconductor switch 13 to form are connected in parallel, and these second power supply circuits possess temperature fuse F1, and to be used as temperature at semiconductor switch 13 be that set point of temperature is closed the safety circuit portion of power supply circuits when above.
This hybrid relay 1 through being connected with terminal 10,11 with AC power 2 and load 3 formation closed-loop paths, this terminal 10,11 is respectively the AC power 2 that is connected in series and an end of load 3.That is, switch on and cut off the power supply through hybrid relay 1 is decided by 2 pairs of loads 3 of AC power for conducting (ON) or by (OFF).At this, for example AC power 2 is made as source power supply of 100V etc., load 3 for example is to comprise the ligthing paraphernalia of fluorescent lamp, incandescent lamp or air exhauster etc.
That is, this hybrid relay 1 possesses: terminal 10, and it is connected with an end of AC power 2, and the other end of this AC power 2 is connected with an end of load 3; Terminal 11, its other end with load 3 is connected; Mechanical contact switch 12 and semiconductor switch 13, their two ends are connected and their parallel with one another connections with terminal 10,11; And signal processing circuit 15.And this mechanical contact switch 12 has the S1 of contact portion.In addition, semiconductor switch 13 has three terminal bidirectional switch S 2, through two ends being connected with mechanical contact switch 12 and terminal 10,11 and being connected in parallel with the S1 of contact portion.And, the conducting (ON) of the closure (ON) of 15 pairs of mechanical contact switch 12 of this signal processing circuit/disconnection (OFF) and semiconductor switch 13/control by (OFF).Mechanical contact switch 12 is made up of S1 of contact portion and solenoid L1, and this solenoid L1 produces and the S1 of contact portion broken off or closed electromagnetic force.The end of solenoid L1 is applied in power supply potential, and the other end is connected with the drain electrode of transistor Tr 1.The base electrode of transistor Tr 1 is transfused to the control signal from signal processing circuit 15, and grounded emitter.Like this, utilize signal processing circuit 15 and be attached thereto the transistor Tr 1 that connects and as drive division mechanical contact switch 12 broken off or closed.
Semiconductor switch 13 possesses three terminal bidirectional switch S 2 and photoelectricity three terminal bidirectional switch coupler 14.An electrode of this three terminal bidirectional switch S 2 is connected with terminal 10 via temperature fuse F1, and another electrode is connected with terminal 11.Photoelectricity three terminal bidirectional switch coupler 14 has the photoelectricity three terminal bidirectional switch S 3 of zero-based and to the light-emitting diode LD of these photoelectricity three terminal bidirectional switch S 3 incident optical signals.The photoelectricity three terminal bidirectional switch S 3 of zero-based is connected between another electrode and gate electrode of three terminal bidirectional switch S 2.And, the anode electrode of this light-emitting diode LD is applied power supply potential, and cathode electrode is connected with drain electrode as the npn transistor npn npn Tr2 of switch element.In addition, the base electrode of this transistor Tr 2 is transfused to the control signal from signal processing circuit 15, and grounded emitter.
Below, to hybrid relay 1 carry out by 2 pairs of loads of AC power 3 energising and outage respectively the time action explain simply.At first, under situation, apply control signal, make transistor Tr 2 be conducting state (ON) from the base electrode of 15 pairs of transistor Tr 2 of signal processing circuit by 2 pairs of loads of AC power 3 energising.Thus, in semiconductor switch 13, incided photoelectricity three terminal bidirectional switch S 3, make photoelectricity three terminal bidirectional switch S 3 be conducting (ON) from the light signal of light-emitting diode LD.Therefore in addition, photoelectricity three terminal bidirectional switch S 3 possesses the zero passage function, and when detecting alternating voltage from AC power 2 and be center voltage (reference voltage), making photoelectricity three terminal bidirectional switch S 3 is ON.
Make from the alternating current of the AC power 2 photoelectricity three terminal bidirectional switch S 3 of flowing through through this photoelectricity three terminal bidirectional switch S 3 of conducting, therefore the gate electrode to three terminal bidirectional switch S 2 provides electric current, and photoelectricity three terminal bidirectional switch S 3 is ON.Thus, load 3 is electrically connected with AC power 2 via the semiconductor switch 13 in the hybrid relay 1, therefore can utilize 2 pairs of loads of AC power, 3 energisings.Like this; Three terminal bidirectional switch S 2 in making semiconductor switch 13 is connected after the power supply from AC power 2 load 3 for ON; The base electrode of 15 pairs of transistor Tr 1 of signal processing circuit applies control signal, makes transistor Tr 1 be ON, and L1 provides drive current to solenoid.Thus, solenoid L1 produces electromagnetic force, and the S1 of contact portion becomes closure (ON) state.
And; When the S1 of contact portion that utilizes AC power 2 via this mechanical contact switch 12 begins load 3 power supplies; In order to cut off the power supply circuits in the semiconductor switch 13, signal processing circuit 15 makes transistor Tr 2 be cut-off state (OFF), stops to light-emitting diode LD electric current being provided.Therefore, light-emitting diode LD stops luminous action, stops photoelectricity three terminal bidirectional switch S 3 incident optical signals, and therefore when the alternating voltage from AC power 2 was center voltage (reference voltage), photoelectricity three terminal bidirectional switch S 3 stopped action and becomes OFF.And when photoelectricity three terminal bidirectional switch S 3 was OFF, no longer the gate electrode to three terminal bidirectional switch S 2 provided electric current, therefore made three terminal bidirectional switch S 2 be cut-off state, made semiconductor switch 13 be OFF.
On the other hand; Under the situation of cut-out by the power supply of 2 pairs of loads 3 of AC power; The base electrode of 15 pairs of transistor Tr 2 of signal processing circuit applies control signal, makes transistor Tr 2 be ON, to the light signal of photoelectricity three terminal bidirectional switch S 3 incidents from light-emitting diode LD.Thus; Through making photoelectricity three terminal bidirectional switch S 3 be ON for ON makes three terminal bidirectional switch S 2; Except the power supply circuits (first power supply circuits) that utilize mechanical contact switch 12 formation, also in hybrid relay 1, form the power supply circuits (second power supply circuits) that utilize semiconductor switch 13 to constitute.And signal processing circuit 15 makes transistor Tr 1 be OFF, stops to solenoid L1 drive current being provided, and makes the S1 of contact portion for breaking off (OFF) state.Thus, the power supply circuits (first power supply circuits) that can cut off main power supply circuits, promptly utilize mechanical contact switch 12 to form.Afterwards, signal processing circuit 15 makes transistor Tr 2 be OFF, stops to light-emitting diode LD electric current being provided, and makes photoelectricity three terminal bidirectional switch S 3 be OFF thus.Thus,, therefore can cut off the power supply circuits that utilize semiconductor switch 13 to form, therefore can cut off power supply by 2 pairs of loads 3 of AC power owing to make three terminal bidirectional switch S 2 be OFF.
Temperature fuse F1 be fixed on three terminal bidirectional switch S 2 the surface or near, to bring into play function as the detector unit of the abnormal temperature that detects three terminal bidirectional switch S 2.When the temperature of three terminal bidirectional switch S 2 is the abnormal temperature more than the operating temperature; For example when inflow three terminal bidirectional switch S 2 or three terminal bidirectional switch S 2 such as shove owing to reaching the life-span when being short-circuited; This temperature fuse F1 breaks off, and can cut off provides electric current to three terminal bidirectional switch S 2 and photoelectricity three terminal bidirectional switch S 3.Describe about literary composition after the configuration of this temperature fuse F1, but not apply the mechanicalness load and to be configured near the mode of semiconductor switch 13.At this, temperature fuse F1 is configured to make a lead terminal of temperature fuse to be closely attached on the center of the packaging body of semiconductor switch 13 on the protuberance of the packaging body of semiconductor switch 13.
Thus, can protect three terminal bidirectional switch S 2 and photoelectricity three terminal bidirectional switch S 3 to avoid heat damage, can prevent fire etc.At this; The power supply circuits that utilize temperature fuse F1 to cut off are merely the power supply circuits (second power supply circuits) that utilize semiconductor switch 13 to form; Owing to can make and utilize main contacts, be that the power supply circuits (first power supply circuits) that mechanical contact switch 12 forms switch on and off; Even therefore after temperature fuse breaks off, also can carry out load 3 power supplies and outage through the disconnection or the closure of control mechanical contact switch 12.
In addition; In the above-described embodiment; Structure between the connected node of three terminal bidirectional switch S 2 and photoelectricity three terminal bidirectional switch S 3 and terminal 10, being connected with temperature fuse F1 is illustrated; But as variation, also can be made as the structure as Fig. 2 (a), promptly, the temperature fuse F2 that will detect the abnormal temperature of three terminal bidirectional switch S 2 is connected between the electrode and terminal 10 of three terminal bidirectional switch S 2.In addition, also can be made as shown in Fig. 2 (b) such structure, promptly, between an electrode of electrode of photoelectricity three terminal bidirectional switch S 3 and three terminal bidirectional switch S 2 the temperature fuse F3 of the abnormal temperature of joint detection three terminal bidirectional switch S 2.And; When (a) that constitute Fig. 1, Fig. 2 or Fig. 2 (b) such structure; Can adjust allocation position, make it possible to utilize temperature fuse F1, F2 not only to detect the abnormal temperature of three terminal bidirectional switch S 2, also detect the abnormal temperature of photoelectricity three terminal bidirectional switch S 3.
(execution mode 2)
Then, with reference to description of drawings execution mode 2 of the present invention.Fig. 3 is the summary circuit diagram of internal structure of the hybrid relay of expression execution mode 2.In addition, to the part additional phase identical with the hybrid relay of execution mode 1 shown in Figure 1 with Reference numeral, omit its detailed explanation.
As shown in Figure 3, this hybrid relay is following structure: remove temperature fuse F1 from the structure of execution mode shown in Figure 11, be provided with and be connected in the emitter of transistor Tr 1 and the temperature switch S4 between the collector electrode.Thus, different with the relay switch of execution mode 1 shown in Figure 1 aspect the action of only being carried out at temperature switch S4, and other structure, action are identical with the execution mode of Fig. 1, therefore omit its detailed content.Below, the action based on temperature switch S4 is described.
Temperature switch S4 is as bimetal release etc.; The switch that carries out closure or off action by detected temperature is reacted constitutes; With the hybrid relay of the execution mode 1 of Fig. 1 likewise; For the temperature to the three terminal bidirectional switch S 2 in the semiconductor switch 13 detects, this temperature switch S4 be fixed on three terminal bidirectional switch S 2 the surface or near.
As long as three terminal bidirectional switch S 2 is in set point of temperature, then temperature switch S4 is for breaking off the state of (OFF), and ON through transistor Tr 1 or OFF come the drive current that provides or cut off solenoid L1 is controlled.On the other hand, if the temperature of three terminal bidirectional switch S 2 is the temperature that is higher than set point of temperature, then temperature switch S4 is the state of closed (ON), and solenoid L1 is forced to provide drive current.Thus; Produce electromagnetic force by solenoid L1; Make the contact S1 of mechanical contact switch 12 become ON by the strong hand; Therefore form the power supply circuits that utilize this mechanical contact switch 12 to form and be used as main power supply circuits, consequently, can the magnitude of current that flow through the power supply circuits that utilize semiconductor switch 13 formation be suppressed.Thereby the three terminal bidirectional switch S 2 of the formation of flowing through respectively semiconductor switch 13 and the magnitude of current of photoelectricity three terminal bidirectional switch S 3 descend, and therefore can prevent to produce high heat by semiconductor switch 13.
And, with reference to other execution mode of description of drawings.Fig. 4 is the summary circuit diagram of the internal structure of other execution mode of expression.In addition, to the part additional phase identical Reference numeral together, and omit its detailed explanation with the execution mode of Fig. 1.
(execution mode 3)
Then, the hybrid relay to execution mode 3 of the present invention describes.As shown in Figure 4; In this example; Be following structure: remove temperature fuse F1 from the hybrid relay of execution mode as shown in Figure 11, and the temperature sensor T1 of the temperature of measuring semiconductor switch is set and when the temperature of semiconductor switch 13 is abnormal temperature to the notice portion 16 of external notification.Thus, to the structure additional phase identical with the hybrid relay of the execution mode of Fig. 1 with Reference numeral and omit explanation, below, temperature sensor is described.
Temperature sensor T1 is made up of the temperature-sensing element of that kind such as thermistor; With temperature fuse F1 in the hybrid relay of the execution mode of Fig. 1 likewise; For the temperature to the three terminal bidirectional switch S 2 in the semiconductor switch 13 detects, with temperature sensor T1 be fixed on three terminal bidirectional switch S 2 the surface or near.And the measurement of the every regulation of temperature sensor T1 is notified the temperature of the semiconductor switch of measuring 13 to signal processing part 15 constantly.
Signal processing part 15 is connected with notice portion 16; Come to take place to external notification semiconductor switch 13 unusual, this notice portion 16 by sounding bodies such as loud speaker or buzzer, LED (Light Emitting Diode: light-emitting diode) or display unit such as LCD constitute.
That is, by temperature sensor T1 the temperature of semiconductor switch 13 is detected, if abnormal temperature then drives notice portion 16, taking place to external notification should be unusual.
At this moment, signal processing part 15 can be following structure: the base electrode to transistor Tr 1 applies control signal, makes transistor Tr 1 be ON, thereby makes mechanical contact switch 12 closures.Through like this, can form the power supply circuits that constitute by mechanical contact switch 12 by the strong hand and be used as main power supply circuits, thereby can the magnitude of current that flow through the power supply circuits that utilize semiconductor switch 13 formation be suppressed.Thus, can make and flow through the three terminal bidirectional switch S 2 that constitutes semiconductor switch 13 respectively and the magnitude of current of photoelectricity three terminal bidirectional switch S 3 descends, thereby can prevent that semiconductor switch 13 from producing high heat.In addition, through by the 16 exercise notices action of notice portion, can be abnormal temperature to external notification semiconductor switch 13, can inform the life-span of user's semiconductor switch 13 as early as possible.
In addition, in this case, also can use the temperature fuse F1 of execution mode 1 simultaneously.In addition, the temperature the when temperature that can utilize temperature sensor T 1 that temperature fuse F1 is taken place to fuse this moment is set at than driving notice portion 16 is high, and it is high hot to come prior notice to produce thus.
(execution mode 4)
Then, with reference to the hybrid relay of description of drawings execution mode 4 of the present invention.Fig. 5 is the summary circuit diagram of internal structure of the hybrid relay of expression execution mode 4.In addition, to the part additional phase identical with the hybrid relay of execution mode 1 shown in Figure 1 with Reference numeral and omit its detailed explanation.
Shown in Fig. 5 (a), the hybrid relay of execution mode 4 of the present invention is the structures of in the basic structure of the hybrid relay 1 of execution mode shown in Figure 11, having added second mechanical contact switch 17.
That is, in this execution mode, possess: terminal 10, it is connected with an end of AC power 2, and the other end of this AC power 2 is connected with an end of load 3; Terminal 11, its other end with load 3 is connected; First mechanical contact switch 12, it has the S1 of contact portion that two ends are connected with terminal 10,11; Second mechanical contact switch 17, it has the S5 of contact portion that an end is connected with the connected node of a terminal 10 and the end of the S1 of contact portion; Semiconductor switch 13, it has photoelectricity three terminal bidirectional switch S 3, and an electrode of this photoelectricity three terminal bidirectional switch S 3 is connected with the other end of the S5 of contact portion, and another electrode is connected with terminal 11; And signal processing circuit 15, it is to the closure separately (ON) of first mechanical contact switch 12, second mechanical contact switch 17 and semiconductor switch 13 and break off (OFF) and control.Below; In circuit with two mechanical contact switch; Be made as first mechanical contact switch 12 and second mechanical contact switch 17, but it is identical to be made as the employed mechanical contact switch of first mechanical contact switch 12 and above-mentioned execution mode 12, and additional phase with Reference numeral.
The structure of first mechanical contact switch 12 shown in Fig. 5 (a), second mechanical contact switch 17 is identical with mechanical contact switch 12 shown in Figure 1.In addition, the structure of the semiconductor switch 13 among Fig. 5 is identical with semiconductor switch 13 among Fig. 1, but an electrode of photoelectricity three terminal bidirectional switch S 3 is connected with the other end of the S5 of contact portion of second mechanical contact switch 17 via temperature fuse F1.
Promptly; The hybrid relay of this execution mode possesses that the contact is disconnected through drive division or closed first mechanical contact switch 12 and second mechanical contact switch 17 and the semiconductor switch 13 that is connected in parallel with this second mechanical contact switch; In this hybrid relay; The parallelly connected power supply circuits that electric power is provided by 2 pairs of loads 3 of AC power that constitute of first power supply circuits that utilize first mechanical contact switch 12 to form with second power supply circuits; Wherein, 13 series connection constitute these second power supply circuits with semiconductor switch by second mechanical contact switch 17, and temperature fuse F1 is set on second power supply circuits, and this temperature fuse F1 is that set point of temperature is broken off when above in the temperature of semiconductor switch 13.The effect of temperature fuse F1, effect are identical with the hybrid relay of execution mode of the present invention 1 shown in Figure 1.
Hybrid relay shown in Fig. 5 (b) is the variation of the hybrid relay shown in Fig. 5 (a), and the structure of first mechanical contact switch 12, second mechanical contact switch 17 and semiconductor switch 13 is different.
That is, first mechanical contact switch 12 is locking type mechanical contact switch, possesses: solenoid L3, and its generation is used for the S1 of contact portion is switched to the electromagnetic force of closure (ON); And solenoid L4, its generation is used for the S1 of contact portion is switched to the electromagnetic force of disconnection (OFF).The end of solenoid L3 is via preventing that the diode D1 that adverse current is used is connected other end ground connection with signal processing circuit 15.On the other hand, the end of solenoid L4 is via preventing that the diode D3 that adverse current is used is connected other end ground connection with signal processing circuit 15.The diode D2 that is connected in parallel with solenoid L3 and with diode D4 that solenoid L4 is connected in parallel be the diode that bypass is used.
On the other hand, second mechanical contact switch 17 possesses solenoid L5.The end of solenoid L5 is via preventing that the diode D5 that adverse current is used is connected other end ground connection with signal processing circuit 15.The diode D6 that is connected in parallel with solenoid L5 is the diode that bypass is used.
Semiconductor switch 13 is by constituting with lower component: three terminal bidirectional switch S 2; Resistance R 1 and capacitor C1, they are connected in parallel between the electrode and gate electrode of three terminal bidirectional switch S 2; Resistance R 2, the one of which end is connected with another electrode of three terminal bidirectional switch S 2; And photoelectricity three terminal bidirectional switch coupler 14, it possesses photoelectricity three terminal bidirectional switch S 3, and an electrode of this photoelectricity three terminal bidirectional switch S 3 is connected with the other end of resistance R 2.Photoelectricity three terminal bidirectional switch coupler 14 is following structures: also possess the light-emitting diode LD that is connected with signal processing circuit 15 via resistance R 3, to the light signal of photoelectricity three terminal bidirectional switch S 3 incidents from light-emitting diode LD.In addition; Photoelectricity three terminal bidirectional switch S 3 is the thyristors that possess the zero passage function; When during from the light signal of light-emitting diode LD, being detected center voltage (reference voltage) these photoelectricity three terminal bidirectional switch S 3 just conductings (ON) afterwards of the alternating voltage of AC power 2 an electrode side by incident.
Temperature fuse F1 be fixed on photoelectricity three terminal bidirectional switch S 3 the surface or near, to bring into play function as the detector unit of photoelectricity three terminal bidirectional switch S 3.In addition, in execution mode 9, as after state, be arranged on through main part temperature fuse F1 photoelectricity three terminal bidirectional switch S 3 packaging body protuberance above come to bring into play more efficiently function.
In addition; In this execution mode; Shown in Fig. 5 (a), will be that the temperature fuse F1 that set point of temperature is broken off when above is arranged on second power supply circuits in the temperature of semiconductor switch 13, between second mechanical contact switch 17 and the semiconductor switch 13, but be not limited to this position.For example shown in Fig. 6 (a), also can this temperature fuse F1 be arranged on second power supply circuits near connected node one side of second power supply circuits and first power supply circuits.In addition, shown in Fig. 6 (b), also can be arranged on this temperature fuse F1 between the AC power 2 and first mechanical contact switch 12, promptly on first power supply circuits.
In addition, shown in Fig. 5 (b),, can change the position of temperature fuse F1 too first mechanical contact switch 12 being made as the locking type mechanical contact switch, adding solenoid L5 and constitute under the situation of second mechanical contact switch 17.For example shown in Fig. 7 (a), also can this temperature fuse F1 be arranged on second power supply circuits near connected node one side of second power supply circuits and first power supply circuits.In addition, shown in Fig. 7 (b), also can be arranged on this temperature fuse F1 between the AC power 2 and first mechanical contact switch 12, promptly on first power supply circuits.
(execution mode 5)
The hybrid relay of execution mode 5 of the present invention then, is described.Hybrid relay shown in (a) of Fig. 8, (b) of Fig. 8 all is the variation of the hybrid relay of the execution mode 4 shown in (a) of Fig. 5.In (a) of Fig. 8, the temperature fuse F2 that will detect the abnormal temperature of three terminal bidirectional switch S 2 is arranged between the electrode and second mechanical contact switch 17 of three terminal bidirectional switch S 2.In addition, in (b) of Fig. 8, temperature fuse F2 is arranged between the electrode and second mechanical contact switch 17 of photoelectricity three terminal bidirectional switch S 3.Even so also can obtain the identical effect of hybrid relay of the execution mode shown in (a) with Fig. 5.
(execution mode 6)
The hybrid relay of execution mode 6 of the present invention then, is described.Fig. 9 is the figure of internal structure of the hybrid relay of expression execution mode 6.In this example, hybrid relay is following structure: from the hybrid relay of the execution mode 4 shown in Fig. 5 (a), remove temperature fuse F1, and temperature switch S4 is set, this temperature switch S4 is connected between the emitter and collector electrode of transistor Tr 1.The effect of temperature switch S4 is identical with execution mode 2 shown in Figure 3 with effect.
(execution mode 7)
The hybrid relay of execution mode 7 of the present invention then, is described.Figure 10 is the figure of internal structure of the hybrid relay of expression execution mode 7.In this example; Hybrid relay is following structure: from the hybrid relay of the execution mode 4 shown in Fig. 5 (a), remove temperature fuse F1, and the temperature sensor T1 of the temperature of measuring semiconductor switch 13 is set and when the temperature of semiconductor switch 13 is abnormal temperature to the notice portion 16 of external notification.The effect of temperature sensor T1, notice portion 16, effect are identical with the relay switch of execution mode 3 shown in Figure 4.
(execution mode 8)
The hybrid relay of execution mode 8 of the present invention then, is described.In the execution mode of above explanation; Safety circuit portions such as temperature fuse are set on second power supply circuits that utilize semiconductor switch formation, but also can safety circuit portions such as temperature fuse be arranged on first power supply circuits that utilize mechanical switch formation.Figure 11 shows a wherein example.In this example, in the structure of the hybrid relay of execution mode 1, temperature fuse F1 is arranged on first power supply circuits, promptly utilizes on the power supply circuits that mechanical switch forms.According to this structure,, also can cut off power supply circuits and keep safety even under the situation that causes generating heat owing to mechanical switch generation misoperation.But, in this case, have the problem that power supply circuits cause stopping load being provided electric current of having cut off.
Like this, though temperature fuse F1 is arranged on first power supply circuits, also can temperature fuse F1 be arranged on first power supply circuits and second power supply circuits.In this case, can the fusing-off temperature of temperature fuse be set as the fusing-off temperature height of the temperature fuse of the first power supply circuits side.That is, be higher than the security control temperature of semiconductor switch side through the security control temperature that makes the mechanical switch side, thereby, first power supply circuits broken off, cut off electric current supply load in case mechanical switch is a set point of temperature.
In addition, in above execution mode 1 to 3 or execution mode 4 to 8, serviceability temperature fuse F 1, F2, F3 or temperature sensor, temperature switch simultaneously.In this case, can change design temperature through constituting, carry out security control step by step, can carry out security control more efficiently.
(execution mode 9)
Then, as execution mode 9 of the present invention, the circuit arrangement of this hybrid relay is described.
Figure 12 is provided with temperature fuse F1 respectively and the vertical view of the printed circuit board (PCB) 100 that obtains on the semiconductor switch of four hybrid relaies.(a) of Figure 13 and (b) of Figure 13 are the front view and the end view of semiconductor switch and temperature fuse.In this example, the main part 301 of temperature fuse F1 is set on the protuberance 202 of the packaging body 201 of the photoelectricity three terminal bidirectional switch S 3 that constitutes semiconductor switch 13.And the middle heart that a lead terminal 302 in the lead terminal 302,303 of temperature fuse F1 is closely attached on the packaging body 201 of photoelectricity three terminal bidirectional switch S 3 is configured.Installing space W about temperature fuse F1 and photoelectricity three terminal bidirectional switch S 3 2, distance is made as W when between the lead terminal of temperature fuse F1 1The time, make lead terminal 302 bendings so that W 2>W 1The height at the center of temperature fuse F1 is made as H 1, the height of main part is made as H 2
According to this structure, to the main part 301 of temperature fuse F1 being abutted to the protuberance 202 of the packaging body 201 of photoelectricity three terminal bidirectional switch S 3 from the stress of top, position that thus can fixed temperature fuse F 1.In addition, can guarantee the insulation distance between lead terminal 302,303 and other parts, can provide for the firm hybrid relay of load through guaranteeing this position.
In addition, be configured, can utilize photoelectricity three terminal bidirectional switch S 3 to prevent toppling over of temperature fuse F1 through the middle heart that a lead terminal in the lead terminal 302,303 of temperature fuse F1 is closely attached on the packaging body 201 of photoelectricity three terminal bidirectional switch S 3.In addition, can also prevent that photoelectricity three terminal bidirectional switch S 3 to temperature fuse F1 inclination.Like this, temperature fuse F1 and photoelectricity three terminal bidirectional switch S 3 support each other, can keep the angle with respect to real estate.Consequently, not only can guarantee the insulation distance between temperature fuse F1 and the photoelectricity three terminal bidirectional switch S 3, can also guarantee the insulation distance between the two and other parts, can further improve reliability.
That kind as described above, hybrid relay of the present invention comprises the parts that possess following structure.
Hybrid relay of the present invention possesses: mechanical contact switch, and its contact is closed through drive division or breaks off; And semiconductor switch; Itself and this mechanical contact switch is connected in parallel; Wherein, first power supply circuits that utilize this mechanical contact switch to form and second power supply circuits that utilize semiconductor switch to form are constituted by the power supply circuits of power supply to electric parallelly connectedly, this hybrid relay is characterised in that; On second power supply circuits, temperature fuse is set, this temperature fuse is that set point of temperature is broken off when above in the temperature of semiconductor switch.
In addition, hybrid relay of the present invention possesses: mechanical contact switch, and its contact is closed through drive division or breaks off; And semiconductor switch; Itself and this mechanical contact switch is connected in parallel; First power supply circuits that utilize above-mentioned mechanical contact switch to form and second power supply circuits that utilize above-mentioned semiconductor switch to form are constituted by the power supply circuits of power supply to electric parallelly connectedly, and this hybrid relay is characterised in that, temperature switch is set; In the temperature of semiconductor switch is set point of temperature when above, and this temperature switch makes the drive division action come the contact of closed mechanical contact switch.
In addition, hybrid relay of the present invention possesses: mechanical contact switch, and its contact is closed through drive division or breaks off; And semiconductor switch; Itself and this mechanical contact switch is connected in parallel; First power supply circuits that utilize above-mentioned mechanical contact switch to form and second power supply circuits that utilize above-mentioned semiconductor switch to form are constituted by the power supply circuits of power supply to electric parallelly connectedly; This hybrid relay is characterised in that also possess: temperature sensor, and its temperature to above-mentioned semiconductor switch detects; And control part, be set point of temperature when above in the temperature of the above-mentioned semiconductor switch that goes out by the said temperature sensor, this control part makes above-mentioned drive division action come the contact of closed above-mentioned mechanical contact switch.
In addition, hybrid relay of the present invention possesses: first mechanical contact switch and second mechanical contact switch, and the contact of this first mechanical contact switch and second mechanical contact switch is closed through drive division or breaks off; And semiconductor switch; Itself and this mechanical contact switch is connected in parallel; Second power supply circuits are constituted by the power supply circuits of power supply to electric with first power supply circuits that utilize this first mechanical contact switch to form parallelly connectedly; Wherein, these second power supply circuits in series are made up of above-mentioned second mechanical contact switch and above-mentioned semiconductor switch, and this hybrid relay is characterised in that; On above-mentioned second power supply circuits, temperature fuse is set, this temperature fuse is that set point of temperature is broken off when above in the temperature of above-mentioned semiconductor switch.
In addition, hybrid relay of the present invention possesses: first mechanical contact switch and second mechanical contact switch, and the contact of this first mechanical contact switch and second mechanical contact switch is closed through drive division or breaks off; And semiconductor switch; Itself and this mechanical contact switch is connected in parallel; Second power supply circuits are constituted by the power supply circuits of power supply to electric with first power supply circuits that utilize above-mentioned first mechanical contact switch to form parallelly connectedly, and wherein, these second power supply circuits are connected in series by above-mentioned second mechanical contact switch and above-mentioned semiconductor switch and form; This hybrid relay is characterised in that; Temperature switch is set, and is set point of temperature when above in the temperature of above-mentioned semiconductor switch, and this temperature switch makes the drive division action of above-mentioned first mechanical contact switch come the contact of closed above-mentioned first mechanical contact switch.
In addition, hybrid relay of the present invention possesses: first mechanical contact switch and second mechanical contact switch, and the contact of this first mechanical contact switch and second mechanical contact switch is closed through drive division or breaks off; And semiconductor switch; Itself and this mechanical contact switch is connected in parallel, and second power supply circuits are constituted by the power supply circuits of power supply to electric, wherein with first power supply circuits that utilize above-mentioned first mechanical contact switch to form parallelly connectedly; These second power supply circuits are connected in series by above-mentioned second mechanical contact switch and above-mentioned semiconductor switch and form; This hybrid relay is characterised in that also possess: temperature sensor, and its temperature to above-mentioned semiconductor switch detects; And control part, be set point of temperature when above in the temperature of the above-mentioned semiconductor switch that goes out by the said temperature sensor, this control part makes the drive division action of above-mentioned first mechanical contact switch come the contact of closed above-mentioned first mechanical contact switch.
In possessing the structure of temperature fuse as above-mentioned safety circuit portion; When semiconductor switch is the abnormal temperature more than the set point of temperature; Temperature fuse breaks off, and cuts off second power supply circuits, thus semiconductor switch can not burn because of being further heated, on fire.
In addition; In possessing the structure of temperature switch as above-mentioned safety circuit portion; When semiconductor switch is the abnormal temperature more than the set point of temperature; Utilize the closed by the strong hand contact that constitutes the mechanical contact switch of first power supply circuits of temperature switch, the magnitude of current of second power supply circuits of therefore flowing through reduces.Therefore, semiconductor switch can not burn because of being further heated, on fire.
In addition; Possessing temperature sensor and be the control part that set point of temperature makes the closing of contact of the mechanical contact switch that constitutes first power supply circuits when above in temperature by the detected semiconductor switch of this temperature sensor; Be used as in the structure of above-mentioned safety circuit portion; When semiconductor switch is the abnormal temperature more than the set point of temperature, the closed by the strong hand contact that constitutes the mechanical contact switch of first power supply circuits of control part, the magnitude of current of second power supply circuits of therefore flowing through reduces.Therefore, semiconductor switch can not burn because of being further heated, on fire.
In addition, in the structure that possesses notice portion, can notify the life-span of semiconductor switch to the user.
In addition, above-mentioned hybrid relay can also possess notice portion, is set point of temperature when above in the temperature of above-mentioned semiconductor switch, and this notice portion is unusual to external notification.
The Japanese patent application (special hope 2010-204786) of Japanese patent application that the application applied on October 27th, 2009 (special hope 2009-246239) and application on September 13rd, 2010 is the basis, and at this, its content is introduced into the present invention as reference.
Description of reference numerals
1: hybrid relay; 2: AC power; 3: load; 10,11: terminal; 12: mechanical contact switch (first mechanical contact switch); 13: semiconductor switch; 14: photoelectricity three terminal bidirectional switch coupler; 15: signal processing circuit; 16: notice portion; F1~F3: temperature fuse; S2: three terminal bidirectional switch; S3: photoelectricity three terminal bidirectional switch; S4: temperature switch; S5: contact portion; T1: temperature sensor; 201: packaging body; 202: protuberance; 301: main part; 302,303: lead terminal.

Claims (10)

1. hybrid relay possesses:
Mechanical contact switch, its contact are disconnected through drive division or are closed; And
Semiconductor switch, itself and above-mentioned mechanical contact switch are connected in parallel,
Wherein, first power supply circuits that utilize above-mentioned mechanical contact switch to form are connected in parallel with second power supply circuits that utilize above-mentioned semiconductor switch to form to be used as by the power supply circuits of power supply to electric,
This hybrid relay also possesses safety circuit portion, is set point of temperature when above in the temperature of above-mentioned semiconductor switch, the control of supplying power of this safety circuit portion.
2. hybrid relay according to claim 1 is characterized in that,
Above-mentioned safety circuit portion is a temperature fuse, is set point of temperature when above in the temperature of above-mentioned semiconductor switch, and this temperature fuse breaks off.
3. hybrid relay according to claim 2 is characterized in that,
The said temperature fuse is set on above-mentioned second power supply circuits.
4. hybrid relay according to claim 1 is characterized in that,
Above-mentioned safety circuit portion is a temperature switch, is set point of temperature when above in the temperature of above-mentioned semiconductor switch, and this temperature switch makes above-mentioned drive division action come the contact of closed above-mentioned mechanical contact switch.
5. hybrid relay according to claim 1 is characterized in that,
Above-mentioned safety circuit portion possesses:
Temperature sensor, its temperature to above-mentioned semiconductor switch detects; And
Control part is set point of temperature when above in the temperature of the above-mentioned semiconductor switch that is gone out by the said temperature sensor, and this control part makes above-mentioned drive division action come the contact of closed above-mentioned mechanical contact switch.
6. according to each the described hybrid relay in the claim 1 to 5, it is characterized in that,
Above-mentioned mechanical contact switch possesses first mechanical contact switch and second mechanical contact switch, and the contact of this first mechanical contact switch and this second mechanical contact switch is closed through drive division or breaks off,
Second power supply circuits are constituted by the power supply circuits of above-mentioned power supply to electric with first power supply circuits that utilize above-mentioned first mechanical contact switch to form parallelly connectedly; Wherein, these second power supply circuits are connected in series by above-mentioned second mechanical contact switch and above-mentioned semiconductor switch and form.
7. hybrid relay according to claim 6 is characterized in that,
Being provided with temperature switch, is set point of temperature when above in the temperature of above-mentioned semiconductor switch, and this temperature switch makes the drive division action of above-mentioned first mechanical contact switch come the contact of closed above-mentioned first mechanical contact switch.
8. hybrid relay according to claim 1 is characterized in that,
Above-mentioned safety circuit portion be set at above-mentioned semiconductor switch packaging body protuberance above.
9. hybrid relay according to claim 8 is characterized in that,
Above-mentioned safety circuit portion is a temperature fuse, and the middle heart that a lead terminal of said temperature fuse is closely attached on the packaging body of above-mentioned semiconductor switch is configured.
10. according to each the described hybrid relay in the claim 1 to 9, it is characterized in that,
Also possessing notice portion, is set point of temperature when above in the temperature of above-mentioned semiconductor switch, and this notice portion is unusual to external notification.
CN201080047874.2A 2009-10-27 2010-10-26 Hybrid relay Expired - Fee Related CN102576625B (en)

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JP2009-246239 2009-10-27
JP2009246239 2009-10-27
JP2010204786A JP5669086B2 (en) 2009-10-27 2010-09-13 Hybrid relay
JP2010-204786 2010-09-13
PCT/JP2010/068999 WO2011052606A1 (en) 2009-10-27 2010-10-26 Hybrid relay

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