CN102222605B - Wafer conveying device with fragment detection - Google Patents
Wafer conveying device with fragment detection Download PDFInfo
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- CN102222605B CN102222605B CN 201110151640 CN201110151640A CN102222605B CN 102222605 B CN102222605 B CN 102222605B CN 201110151640 CN201110151640 CN 201110151640 CN 201110151640 A CN201110151640 A CN 201110151640A CN 102222605 B CN102222605 B CN 102222605B
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Abstract
A wafer conveying device with fragment detection is used for detecting wafers output by a wafer supporting device, and comprises a drawing device for conveying the wafers, at least one set of wafer conveying device for conveying the wafers, a plurality of fragment detectors and a set of wafer transferring device, wherein the fragment detectors are arranged below both sides of a conveying belt for detecting the wafers conveyed on the conveying belt and judging whether the wafers are broken; then, the wafers on the wafer conveying device after detection are drawn through the wafer drawing device of the wafer transferring device; and the wafers are transferred and distributed on a plurality of sets of output orbits of the wafer transferring device by means of transverse or longitudinal movement.
Description
Technical field
The present invention is about a kind of wafer conveying device with fragmentation detection, and is especially a kind of for the wafer conveying device between wafer bearing device, and fragmentation detects and fragmentation is got rid of and this wafer conveying device more can carry out the wafer of its carrying.
Background technology
Solar cell at present main material is mainly silicon and as GaAs (GaAs), cadmium telluride (CdTe), germanium ... wait element or compound, with raising, solar energy is transferred to the conversion efficiency of electric energy or heat energy.Consider based on different application and can adopt different element or compound, for example: people's livelihood consumer products normally utilize the non-crystal silicon solar cell plate; What use in space is gallium arsenide solar cell; Use polycrystalline silicon solar cell if be used in desert, ocean etc. take generating as large-scale power supplys such as purposes.
In addition, be applied to the solar panel of people's livelihood consumer products, also can be because of different electronic products, and the voltages of the different sizes of output.Simultaneously, also can measure the defective, flaw, fragmentation degree etc. at electrical functionality, the substrate positive back side of solar panel.
be referred to as solar wafer as last forming solar cell, dependence test and classification are carried out in the solar wafer sector-meeting, be no matter between board move or because of the shipment demand, the capital is with the laminated storing of solar wafer, and common wafer bearing device mainly contains two kinds of different designs at present, a kind of is wafer cassette (Gassette), has the top, bottom and left and right sidewall, and be formed with a plurality of flanges on the two side, wafer is from above-mentioned top, bottom and left and right sidewall institute jointly around the side direction gateway pass in and out, and another kind of wafer bearing device is wafer film magazine (magaz ine), that a kind of top is formed with a top and draws the bogey of putting mouthful.
because the mode of two kinds of wafer bearing device institute transfer wafers has very big-difference, belong to two kinds of different bearer devices, therefore in actual user's the process of setting up factories, tend to get its required and voluntarily combination use, and the running transform between of the same race or two kinds of wafer bearing devices is also frequent the appearance, but because of wafer in the process of transporting, be easy to produce because of collision slight structure flaw, even inspect the place that also can't pinpoint the problems easily with naked eyes, but when completing all manufacturing handling processes, situation about will break because of crystal column surface, and cause side circuit to be subject to the impaired impact of indefinite degree,
Therefore, if the fragmentation of can be in the automation testing process or particular demands being set between the different bearer device detects, and there is the wafer of the situation of breaking on property eliminating surface stage by stage, so can effectively avoid unnecessary processing procedure and the test item after processing procedure, to save more manufacturing cost and human cost, should be a best solution.
Summary of the invention
The object of the present invention is to provide a kind of wafer conveying device that fragmentation detects that has, it is easy and simple to handle, carries out fragmentation in the handling process of can input in bogey, exporting and detects, and the wafer of the situation of breaking is arranged with eliminating.
For reaching the foregoing invention purpose, the invention discloses a kind of wafer conveying device that fragmentation detects that has, for detection of the wafer from the output of wafer bogey, this wafer conveying device with fragmentation detection comprises:
One group of drawing device mobile between this wafer bearing device and wafer conveying device position is used for the carrying wafer;
At least one group of wafer conveyance device includes a conveyer belt and a driving mechanism, and this driving mechanism can drive this conveyer belt, so that this wafer can be handled upside down on this conveyer belt;
A plurality of fragmentation detectors are arranged at this conveyer belt down either side, are handled upside down wafer on this conveyer belt in order to detection, and judge whether wafer has the situation of breaking to occur; And
One group of wafer transfer device, be arranged at this conveyer belt other end, this wafer transfer device comprises at least one wafer drawing device, at least one group of transverse shifting track, at least one group and vertically moves track and many group output tracks, wherein this wafer drawing device can be displaced into this transverse shifting track and this vertically moves on track, therefore when this wafer drawing device draws wafer on this wafer conveyance device, can carry out horizontal or vertically move, this wafer transfer is allocated on this many group output tracks.
Wherein, have at least one light receiving terminal and at least one light transmitting terminal on this fragmentation detector, this light transmitting terminal is in order to shining this crystal column surface, and is reflected back this light receiving terminal and receives, and judge wafer, whether the situation generation of breaking arranged.
Wherein, this wafer bearing device is for carrying wafer cassette or the wafer film magazine of wafer.
Also disclose a kind of wafer conveying device that fragmentation detects that has, for detection of the wafer from the output of wafer bogey, this wafer conveying device with fragmentation detection comprises:
One group of drawing device mobile between this wafer bearing device and wafer conveying device position is used for the carrying wafer;
A plurality of fragmentation removers include the cylinder that a conveyer belt, a driving mechanism, are connected in the conveyer belt below, and wherein this cylinder can change through this driving mechanism the location status of this conveyer belt;
Many group wafer conveyance devices include a conveyer belt and a driving mechanism, and wherein this conveyer belt is connected with conveyer belt one end of this fragmentation remover, therefore this driving mechanism can drive this conveyer belt, so that this wafer can be handled upside down on this conveyer belt;
A plurality of fragmentation detectors that are arranged at this conveyer belt down either side; And
One group of wafer transfer device, be arranged at the conveyer belt other end of this fragmentation remover, and this wafer transfer device comprises at least one wafer drawing device, at least one group of transverse shifting track, at least one group and vertically moves track and many group output tracks, wherein this wafer drawing device can be handled upside down in this transverse shifting track and this and vertically move on track, therefore when this wafer drawing device draws wafer on this wafer conveyance device, can carry out horizontal or vertically move, this wafer transfer is allocated on this many group output tracks.
Wherein, at least one sensor is set on the conveyer belt of this fragmentation remover, stretches in order to drive this cylinder that to change this conveyer belt be level or bottom state.
Wherein, have at least one light receiving terminal and at least one light transmitting terminal on this fragmentation detector, this light transmitting terminal is in order to shining this crystal column surface, and is reflected back this light receiving terminal and receives, and judge wafer, whether the situation generation of breaking arranged.
Wherein, this wafer bearing device is for carrying wafer cassette or the wafer film magazine of wafer.
Wherein, can add below the conveyer belt of this fragmentation remover that a waste material container being set, have the wafer that breaks in order to accommodating crystal column surface.
By said structure, the present invention has realized following technique effect:
1. the present invention can carry out the fragmentation detection between the different bearer device, and the handling process that therefore can input in bogey, export is carried out fragmentation and detected, and the wafer of the situation of breaking is arranged with eliminating.
2. the present invention can be with can effectively avoiding unnecessary processing procedure and the test item after processing procedure, to save more manufacturing cost and human cost.
Description of drawings
Fig. 1: the first enforcement configuration diagram that has the wafer conveying device of fragmentation detection for the present invention is a kind of;
Fig. 2: the fragmentation that has the wafer conveying device of fragmentation detection for the present invention is a kind of detects schematic perspective view;
Fig. 3: the fragmentation detection side view that has the wafer conveying device of fragmentation detection for the present invention is a kind of;
Fig. 4: the second enforcement configuration diagram that has the wafer conveying device of fragmentation detection for the present invention is a kind of reaches;
Fig. 5: the fragmentation that has the wafer conveying device of fragmentation detection for the present invention is a kind of is got rid of schematic perspective view;
Fig. 6 A: the fragmentation that has the wafer conveying device of fragmentation detection for the present invention is a kind of is got rid of the enforcement illustration; And
Fig. 6 B: the fragmentation that has the wafer conveying device of fragmentation detection for the present invention is a kind of is got rid of the enforcement illustration.
Embodiment
Relevant for aforementioned and other technology contents, characteristics and effect of the present invention, in the following detailed description that coordinates with reference to graphic preferred embodiment, can clearly present.
See also Fig. 1, Fig. 2 and Fig. 3, the the first enforcement configuration diagram, the fragmentation that have the wafer conveying device of fragmentation detection for the present invention is a kind of detect schematic perspective view and fragmentation detection side view, and this wafer conveying device is for detection of the wafer 3 from 1 output of wafer bogey, by in figure as can be known, this has wafer conveying device that fragmentation detects and comprises:
One group of drawing device 21 is displaced between this wafer bearing device 1 and wafer conveying device position, and this drawing device 21 is used for carrying wafer 3;
At least one group of wafer conveyance device 22 includes a conveyer belt 221 and a driving mechanism 222, and this driving mechanism 222 can drive this conveyer belt 221, so that this wafer 3 can be handled upside down on this conveyer belt 221;
A plurality of fragmentation detectors 23 are arranged at this conveyer belt 221 down either side, are handled upside down wafer 3 on this conveyer belt 221 in order to detection, and judge whether wafer 3 has the situation of breaking to occur;
One group of wafer transfer device 24, be arranged at this conveyer belt 221 other ends, this wafer transfer device 24 comprises at least one wafer drawing device 241, at least one group of transverse shifting track 242, at least one group and vertically moves track 243 and many group output tracks 244, and wherein this wafer drawing device 241 can be displaced into this transverse shifting track 242 and this vertically moves on track 243;
Therefore, when drawing device 21 is carried a wafer 3 on the conveyer belt 221 of this wafer conveyance device 22, the driving mechanism 222 of this wafer conveyance device 22 can drive this conveyer belt 221 and move, so that this wafer 3 is handled upside down movement on this conveyer belt 221, when this wafer 3 moved to this fragmentation detector 23 regional, this fragmentation detector 23 can judge whether this wafer 3 has the situation generation of breaking simultaneously; At last, the wafer drawing device 241 of this wafer transfer device 24 can draw the wafer 3 on this wafer conveyance device 22, this wafer drawing device 241 carries out laterally or vertically moves and can see through this transverse shifting track 242 and vertically move track 243, and again this wafer transfer is allocated on these many group output tracks 244, to carry out follow-up fabrication process.
It is worth mentioning that, as shown in Figure 3, have at least one light receiving terminal 231 and at least one light transmitting terminal 232 on this fragmentation detector 23, this light transmitting terminal 232 is in order to shine this wafer 3 surfaces, and be reflected back this light receiving terminal 231 receptions, whether there is the situation of breaking to occur to judge wafer 3.
It is worth mentioning that, this wafer bearing device 1 can carry the container of wafer for wafer cassette, wafer film magazine etc.
See also Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6 A and Fig. 6 B, the fragmentation that has the wafer conveying device of fragmentation detection for the present invention is a kind of detects schematic perspective view, configuration diagram implemented by fragmentation detection side view, second and fragmentation is got rid of the enforcement illustration, and this wafer conveying device is for detection of the wafer 3 from 1 output of wafer bogey, by in figure as can be known, this has wafer conveying device that fragmentation detects and comprises:
One group of drawing device 21 is displaced between this wafer bearing device 1 and wafer conveying device position, and this drawing device 21 is used for carrying wafer 3;
A plurality of fragmentation removers 25 include the cylinder 253 that a conveyer belt 251, a driving mechanism 252, are connected in conveyer belt 251 belows, and wherein this cylinder 253 can see through the location status that this driving mechanism 252 changes these conveyer belts 251;
Many group wafer conveyance devices 22, include a conveyer belt 221 and a driving mechanism 222, wherein the conveyer belt 221 of this wafer conveyance device 22 is connected with conveyer belt 251 1 ends of this fragmentation remover 25, therefore this driving mechanism 222 can drive this conveyer belt 221, so that this wafer 3 can be handled upside down on this conveyer belt 221;
A plurality of fragmentation detectors 23 are arranged at this conveyer belt down either side, so this fragmentation detector 23 set position can be positioned at conveyer belt 221 down either side of this wafer conveyance device 22 or conveyer belt 251 down either side of this fragmentation remover 25; In this enforcement, fragmentation detector 23 is arranged at conveyer belt 221 down either side of this wafer conveyance device 22;
One group of wafer transfer device 24, be arranged at conveyer belt 251 other ends of this fragmentation remover 25, and this wafer transfer device 24 comprises at least one wafer drawing device 241, at least one group of transverse shifting track 242, at least one group and vertically moves track 243 and many group output tracks 244, and wherein this wafer drawing device 241 can be handled upside down in this transverse shifting track 242 and this and vertically move on track 243;
therefore, when drawing device 21 is carried a wafer 3 on the conveyer belt 221 of this wafer conveyance device 22, the driving mechanism 222 of this wafer conveyance device 22 can drive this conveyer belt 221 and move, so that this wafer 3 is handled upside down movement on this conveyer belt 221, simultaneously when this wafer 3 moves to this fragmentation detector 23 regional, this fragmentation detector 23 can judge whether this wafer 3 has the situation of breaking to occur, and when having the wafer 3 that breaks to pass through this fragmentation remover 25 (as shown in Fig. 6 A and Fig. 6 B), the cylinder 253 of this fragmentation remover 25 can see through this driving mechanism 252 and inwardly shrink, and the conveyer belt 251 that causes being connected with this cylinder 253 presents bottom state, so the wafer 3 that this conveyer belt 251 is carried can directly be excluded,
When if these fragmentation detector 23 these wafers 3 of judgement are normal, this wafer 3 can normally pass through this fragmentation remover 25, and draw this wafer 3 by the wafer drawing device 241 of this wafer transfer device 24 again, this wafer drawing device 241 carries out laterally or vertically moves and can see through this transverse shifting track 242 and vertically move track 243, and again this wafer transfer is allocated on these many group output tracks 244, to carry out follow-up fabrication process.
It is worth mentioning that, at least one sensor 254 is set on the conveyer belt 251 of this fragmentation remover 25, stretch and change this conveyer belt 251 and be level or bottom state in order to drive this cylinder 253.
It is worth mentioning that, as shown in Figure 3, have at least one light receiving terminal 231 and at least one light transmitting terminal 232 on this fragmentation detector 23, this light transmitting terminal 232 is in order to shine this wafer 3 surfaces, and be reflected back this light receiving terminal 231 receptions, whether there is the situation of breaking to occur to judge wafer 3.
It is worth mentioning that, this wafer bearing device 1 can carry the container of wafer for wafer cassette, wafer film magazine etc.
It is worth mentioning that, conveyer belt 251 belows of this fragmentation remover 25 can be added a waste material container (not shown) is set, and have the wafer that breaks in order to accommodating crystal column surface.
A kind of wafer conveying device that fragmentation detects that has provided by the present invention when mutually comparing with other located by prior art, has more and gets the row advantage ready:
1. the present invention can carry out the fragmentation detection between the different bearer device, and the handling process that therefore can input in bogey, export is carried out fragmentation and detected, and the wafer of the situation of breaking is arranged with eliminating.
2. the present invention can be with can effectively avoiding unnecessary processing procedure and the test item after processing procedure, to save more manufacturing cost and human cost.
By the above detailed description of preferred embodiments, hope can be known description feature of the present invention and spirit more, and with above-mentioned disclosed preferred embodiment, category of the present invention is limited.On the contrary, its objective is that hope can contain in the category of the scope of the claims of being arranged in of various changes and tool equality institute of the present invention wish application.
Claims (6)
1. one kind has the wafer conveying device that fragmentation detects, and for detection of the wafer from the output of wafer bogey, this wafer conveying device with fragmentation detection comprises:
One group of drawing device mobile between this wafer bearing device and wafer conveying device position is used for the carrying wafer;
At least one group of wafer conveyance device includes a conveyer belt and a driving mechanism, and this driving mechanism can drive this conveyer belt, so that this wafer can be handled upside down on this conveyer belt;
A plurality of fragmentation detectors, be arranged at this conveyer belt down either side, be handled upside down wafer on this conveyer belt in order to detection, have at least one light receiving terminal and at least one light transmitting terminal on this fragmentation detector, this light transmitting terminal is in order to shine this crystal column surface, and be reflected back this light receiving terminal reception, whether there is the situation of breaking to occur to judge wafer; And
One group of wafer transfer device, be arranged at this conveyer belt other end, this wafer transfer device comprises at least one wafer drawing device, at least one group of transverse shifting track, at least one group and vertically moves track and many group output tracks, wherein this wafer drawing device can be displaced into this transverse shifting track and this vertically moves on track, therefore when this wafer drawing device draws wafer on this wafer conveyance device, can carry out horizontal or vertically move, this wafer transfer is allocated on this many group output tracks.
2. have as claimed in claim 1 the wafer conveying device that fragmentation detects, it is characterized in that, this wafer bearing device is for carrying wafer cassette or the wafer film magazine of wafer.
3. one kind has the wafer conveying device that fragmentation detects, and for detection of the wafer from the output of wafer bogey, this wafer conveying device with fragmentation detection comprises:
One group of drawing device mobile between this wafer bearing device and wafer conveying device position is used for the carrying wafer;
A plurality of fragmentation removers include the cylinder that a conveyer belt, a driving mechanism, are connected in the conveyer belt below, and wherein this cylinder can change through this driving mechanism the location status of this conveyer belt;
Many group wafer conveyance devices include a conveyer belt and a driving mechanism, and wherein this conveyer belt is connected with conveyer belt one end of this fragmentation remover, therefore this driving mechanism can drive this conveyer belt, so that this wafer can be handled upside down on this conveyer belt;
A plurality of fragmentation detectors that are arranged at this conveyer belt down either side, have at least one light receiving terminal and at least one light transmitting terminal on this fragmentation detector, this light transmitting terminal is in order to shining this crystal column surface, and is reflected back this light receiving terminal and receives, and judge wafer, whether the situation generation of breaking arranged; And
One group of wafer transfer device, be arranged at the conveyer belt other end of this fragmentation remover, and this wafer transfer device comprises at least one wafer drawing device, at least one group of transverse shifting track, at least one group and vertically moves track and many group output tracks, wherein this wafer drawing device can be handled upside down in this transverse shifting track and this and vertically move on track, therefore when this wafer drawing device draws wafer on this wafer conveyance device, can carry out horizontal or vertically move, this wafer transfer is allocated on this many group output tracks.
4. having as claimed in claim 3 the wafer conveying device that fragmentation detects, it is characterized in that, at least one sensor is set on the conveyer belt of this fragmentation remover, is level or bottom state in order to drive this cylinder this conveyer belt of change that stretch.
5. have as claimed in claim 3 the wafer conveying device that fragmentation detects, it is characterized in that, this wafer bearing device is for carrying wafer cassette or the wafer film magazine of wafer.
6. have as claimed in claim 3 the wafer conveying device that fragmentation detects, it is characterized in that, can add below the conveyer belt of this fragmentation remover that a waste material container being set, have the wafer that breaks in order to accommodating crystal column surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110151640 CN102222605B (en) | 2011-06-08 | 2011-06-08 | Wafer conveying device with fragment detection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN 201110151640 CN102222605B (en) | 2011-06-08 | 2011-06-08 | Wafer conveying device with fragment detection |
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| CN102222605A CN102222605A (en) | 2011-10-19 |
| CN102222605B true CN102222605B (en) | 2013-05-15 |
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| CN 201110151640 Expired - Fee Related CN102222605B (en) | 2011-06-08 | 2011-06-08 | Wafer conveying device with fragment detection |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI484585B (en) * | 2011-12-20 | 2015-05-11 | Chroma Ate Inc | Substrate transfer equipment |
| CN102679890A (en) * | 2012-04-28 | 2012-09-19 | 亚亚科技股份有限公司 | Crystal column detecting device |
| CN104477634A (en) * | 2014-11-28 | 2015-04-01 | 苏州晟成光伏设备有限公司 | Guide structure of final inspection blanking device |
| CN105609456B (en) * | 2015-12-24 | 2018-07-06 | 中国电子科技集团公司第四十八研究所 | A kind of graphite boat bogey and interconnection type graphite boat loading-unloading plate production line |
| CN106057698A (en) * | 2016-07-21 | 2016-10-26 | 无锡宏纳科技有限公司 | Wafer cracking place skipping method in wafer manufacturing process |
| CN106298567A (en) * | 2016-07-21 | 2017-01-04 | 无锡宏纳科技有限公司 | The device of wafer rent is detected in chip manufacturing proces |
| CN109874309A (en) * | 2018-04-24 | 2019-06-11 | 君泰创新（北京）科技有限公司 | Two-sided coating equipment and its support plate processing unit |
| CN208472186U (en) * | 2018-04-24 | 2019-02-05 | 君泰创新（北京）科技有限公司 | Two-sided coating equipment and its support plate detection unit |
| WO2019205351A1 (en) * | 2018-04-24 | 2019-10-31 | 君泰创新（北京）科技有限公司 | Double-sided coating apparatus and carrier plate processing unit thereof |
| CN109119364B (en) * | 2018-08-27 | 2024-04-16 | 苏州精濑光电有限公司 | Wafer detection equipment |
| CN109597284A (en) * | 2019-02-02 | 2019-04-09 | 东旭（昆山）显示材料有限公司 | A kind of pre- alignment device of exposure machine and exposure machine |
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| JP2005520321A (en) * | 2001-07-16 | 2005-07-07 | アシスト テクノロジーズ インコーポレイテッド | Integrated system for tool front-end workpiece processing |
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| CN1294410A (en) * | 1999-10-26 | 2001-05-09 | 日本电气株式会社 | Semiconductor mfg. appts. |
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