CN102214771A - Lead-frame-type multi-chip bearing module for precast mold molding - Google Patents
Lead-frame-type multi-chip bearing module for precast mold molding Download PDFInfo
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- CN102214771A CN102214771A CN2010101552260A CN201010155226A CN102214771A CN 102214771 A CN102214771 A CN 102214771A CN 2010101552260 A CN2010101552260 A CN 2010101552260A CN 201010155226 A CN201010155226 A CN 201010155226A CN 102214771 A CN102214771 A CN 102214771A
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Abstract
The invention relates to a lead-frame-type multi-chip bearing module for precast mold molding. The module mainly comprises an insulation base plate and a lead frame which is fixedly arranged on the insulation base plate and is provided with a positive electricity input end and a negative electricity input end; and a plurality of light emitting diode chips are electrically connected on the lead frame. Thus the light emitting diode chips can be connected in series or in parallel through the lead frame, and the light emitting diode chips can emit light rays through inputting the power supply of the lead frame, so the chip bearing module provided by the invention has the advantages of saving cost and simplifying process, and the like.
Description
Technical field
The present invention is meant a kind of light-emitting diode chip for backlight unit carrying module that utilizes lead frame to get final product the connection in series-parallel chip especially relevant for a kind of light-emitting diode chip for backlight unit carrying module.
Background technology
Because light-emitting diode Light Emitting Diode, hereinafter to be referred as LED have the life-span long, volume is little, caloric value is low, power consumption is few, reaction speed reaches advantages such as monochromaticjty is luminous soon, so be widely used in advertisement billboard, traffic signal light, automobile lamp, display pannel, communication appliance and all kinds of consumption electronic products.
Existing LED luminescence unit, be earlier the plurality of LEDs street to be bonding on the lead frame abreast, by bonding wire bonding wire the plurality of LEDs chip is electrically connected with this lead frame respectively again, encapsulate each chip one by one with epoxy resin Epoxy then, cut lead frame at last, and finish one one LED luminescence unit packaging body.During use, be in the reflow mode emergence to be gone out the outer lead frame pin of LED luminescence unit packaging body to be welded in printed circuit board (PCB) Printed Circuit Board, on PCB, supply with the luminous required electric power of LED luminescence unit packaging body by the power circuit of this PCB.For the illumination of appropriateness is provided, tend to parallel connection on the circuit board or series connection is provided with many, for example 8 or 16 LEDs luminescence unit packaging bodies, and form a LED illuminating module.
By above statement as can be known, existing LED illuminating module must encapsulate at single led chip earlier, then utilize surface mount technology to be electrically connected to one by one on the PCB and can use, so integrated artistic is quite complicated.Secondly, the high temperature that is produced in the reflow process causes the damage of LED luminescence unit packaging body inner member easily.
Summary of the invention
In view of this, main purpose of the present invention be to provide a kind of need be and need not use PCB by the reflow mode, can supply with the led chip carrying module of the carrying luminous required electric power of led chip thereon.
For reaching above-mentioned purpose, the pre-moldings formed therefrom multicore sheet carrying module of a kind of lead frame pattern provided by the present invention, mainly include an insulated substrate and and be fixedly arranged on this insulated substrate and have a positive electricity and the lead frame of a negative electricity input, this lead frame is used and is electrically connected ground for a plurality of led chips and be provided with thereon.
Because chip bearing module of the present invention can directly be supplied with the luminous required electric power of described LED by this lead frame, so do not need as existing, the led chip packaging body to be welded on the PCB by the reflow step, therefore can avoid led chip impaired because of the high temperature of reflow, and, by lead frame of the present invention can make carrying described led chip thereon connect simultaneously with/or in parallel.
In chip bearing module provided by the present invention, this lead frame can have a positive electrode plate and a negative electrode plate, and wherein this positive electrode plate has aforementioned positive electrical input, and this negative electrode plate have aforementioned negative electricity input and with the insulation of this positive electrode plate.Respectively this led chip is preferable should be arranged on this negative electrode plate, and electrically connects with routing mode and this positive and negative electrode plate.
In addition, aforementioned positive and negative electrode plate can have a plurality of outstanding junctions respectively outwardly, with another chip bearing module of the present invention of connecting.
In chip bearing module provided by the present invention, this lead frame can have a positive electrode plate, a negative electrode plate and is shared battery lead plate, wherein this positive electrode plate has aforementioned positive electrical input, this negative electrode plate has aforementioned negative electricity input and insulate with this positive electrode plate, and this shared electrode plate then insulate with this positive and negative electrode plate.Respectively this led chip is preferable should be arranged on this negative electrode plate and this shared electrode plate, and, be arranged at the aforementioned LED chip on this negative electrode plate, be to electrically connect with routing mode and this shared electrode plate, and be fixedly arranged on aforementioned led chip on this shared electrode plate, then electrically connect with routing mode and this positive electrode plate.
In addition, aforementioned positive and negative electrode plate and shared electrode plate can have a plurality of outstanding junctions respectively outwardly, with another chip bearing module of the present invention of connecting.
Description of drawings
Fig. 1 is a schematic diagram, shows that the chip bearing module of doing according to first embodiment of the invention carries the aspect of led chip;
Fig. 2 is a schematic diagram, shows the employed lead frame of chip bearing module of this first embodiment;
Fig. 3 is a schematic diagram, shows that the lead frame of this first embodiment is embedded at the interior aspect of insulated substrate;
Fig. 4 is the cutaway view along Figure 144 hatching line, shows in the chip bearing module of this first embodiment the aspect that led chip and lead frame electrically connect;
Fig. 5 is a schematic diagram, shows the chip bearing module of doing according to second embodiment of the invention;
Fig. 6 is a schematic diagram, shows that the employed lead frame of chip bearing module of this second embodiment carries the aspect of led chip; And
Fig. 7 is a schematic diagram, shows that led chip carries the aspect of the lead frame of the chip bearing module that is laid in this second embodiment.
[main element symbol description]
10,10 ' chip bearing module, 20 insulated substrates
21 long slot bores, 211 openings
213 openings, 23 depressions
30,30 ' lead frame, 31 positive electrode plates
311 positive electrical input 313 first junctions
315 protuberances, 33 negative electrode plates
331 negative electricity inputs, 333 second junctions
335 recesses, 337 protuberances
35 shared electrode plates, 351 ends
353 the 3rd junctions 355 the 4th junction
357 recesses, 40 light-emitting diode chip for backlight unit
First group of light-emitting diode chip for backlight unit of 40a
Second group of light-emitting diode chip for backlight unit of 40b
41 leads
Embodiment
The detailed construction and the feature thereof of the pre-moldings formed therefrom multicore sheet carrying module of relevant lead frame pattern provided by the present invention, below will enumerate embodiment and cooperate graphicly, and in can making field of the present invention, have and know that usually the knowledgeable can simply implement to describe in the scope of the embodiment of the invention.
The graphic content that following simple declaration the present invention cooperates embodiment to adopt, wherein:
Fig. 1 is a schematic diagram, shows that the chip bearing module of doing according to first embodiment of the invention carries the aspect of led chip;
Fig. 2 is a schematic diagram, shows the employed lead frame of chip bearing module of this first embodiment;
Fig. 3 is a schematic diagram, shows that the lead frame of this first embodiment is embedded at the interior aspect of insulated substrate;
Fig. 4 is the cutaway view along Figure 14-4 hatching line, shows in the chip bearing module of this first embodiment the aspect that led chip and lead frame electrically connect;
Fig. 5 is a schematic diagram, shows that the chip bearing module of doing according to second embodiment of the invention carries the aspect of led chip;
Fig. 6 is a schematic diagram, shows the employed lead frame of chip bearing module of this second embodiment; And
Fig. 7 is a schematic diagram, shows that led chip carries the aspect of the lead frame of the chip bearing module that is laid in this second embodiment.
At first in this explanation, in the following embodiment that will introduce, identical reference number is represented identical or similar elements to the applicant.
Please consult Fig. 1 to Fig. 4 earlier, the chip bearing module 10 that first embodiment of the invention provided mainly includes an insulated substrate 20 and a lead frame 30.Carry 16 light-emitting diode chip for backlight unit (Light Emitting Diode is hereinafter to be referred as led chip) 40 on this lead frame 30.
This insulated substrate 20, be plastic material, and the central authorities of this insulated substrate 20 generally are trumpet-shaped long slot bore 21 (extremely shown in Figure 4 as Fig. 3) along its major axis to offering a section, the purpose that is provided with of this long slot bore 21 is to make packing colloid, is poured into to finish the encapsulation of led chip such as epoxy resin or silicones.Secondly, this insulated substrate 20 is provided with the elliptical openings 213 that a rectangular aperture 211 and that is positioned at these long slot bore 21 tops is positioned at these long slot bore 21 belows in contiguous its major axis respectively to two ora terminalis places.In addition, these insulated substrate 20 major axis to two peripheries have respectively three the depression 23, thus, a screw (not shown) can be locked on desire with this insulated substrate 20 via described depression 23 and install chip bearing module of the present invention 10 places.During actual the manufacturing, the material of this insulated substrate 20 is not subject to aforementioned person, and the quantity of described depression 23 does not also have specific limited.
Then see also Fig. 2, this lead frame 30, cut and make through punching press by a metal sheet (for example copper coin), make this lead frame 30 divide into a positive electrode plate 31 and one and this positive electrode plate 31 be major axis to the negative electrode plate 33 that is provided with at interval, thus, this positive electrode plate 31 is and these negative electrode plate 33 insulation.Wherein, these positive electrode plate 31 major axis to two ora terminalis have the relative outstanding positive electrical input 311 of these negative electrode plate 33 directions on one day respectively, and these negative electrode plate 33 major axis to two ora terminalis also have the outstanding negative electricity input 331 of these positive electrode plate 31 directions relatively on one day respectively.Secondly, the lateral margin of this positive electrode plate 31 has three towards the first outstanding junction 313 of relative these negative electrode plate 33 directions, and the lateral margin of this negative electrode plate 33 has three towards the second outstanding junction 333 of relative these positive electrode plate 31 directions, the position of described first junction 313 and second junction 333 is symmetrical, thus, first junction 313 of this positive electrode plate 31 of chip bearing module 10 of the present invention, can be connected in second junction of the negative electrode plate of another chip bearing module 10 of the present invention, with a plurality of chip bearing modules of the present invention of connecting.In addition, the shape that cooperates punching tool, the lateral margin of these positive electrode plate 31 contiguous these negative electrode plates 33 is wavy, so that form a plurality of protuberances 315, and the lateral margin of these negative electrode plate 33 contiguous these positive electrode plates 31 also is wavy, so that this negative electrode plate 33 has a plurality of recesses 335 that match with these positive electrode plate 31 protuberances 315 respectively.
During manufacturing, this insulated substrate 20 and this lead frame 30 are that the mode with the plastics ejection formation is made into integration, see also Fig. 1, Fig. 3 and Fig. 4, wherein Fig. 3 removes the insulated substrate 20 that is positioned at these lead frame 30 tops, with the aspect between convenient this lead frame 30 of explanation and this insulated substrate 20.As shown in the figure, the positive and negative electrode plate 31 of this lead frame 30,33 are embedded in this insulated substrate 20, and between this positive and negative electrode plate 31,33 are the long slot bore 21 that is positioned at this insulated substrate 20 at interval, and the positive and negative electrical input 311 of the part of this lead frame 30, outside 331 described openings 211,213 via this insulated substrate 20 are exposed to, thus, power supply can directly be supplied to this lead frame 30 with positive and negative electricity by described opening 211,213.
This 16 LEDs chip 40, as Fig. 1 and shown in Figure 4, the adhesive that has conductivity with elargol or tin cream etc. is attached to the position of corresponding its recess 335 on these lead frame 30 negative electrode plates 33, afterwards described led chip 40 is connected to lead 41 by the mode of routing the positive and negative electrode plate 31 of this lead frame 30,33, this led chip 40 and the positive and negative electrode plate 31,33 of this lead frame 30 are electrically connected, in order to 16 LEDs chips 40 simultaneously in parallel on this lead frame 30., again with existing mode epoxy resin, silicones or other well-illuminated packing colloid poured in the long slot bore 21 of this insulated substrate 20, to encapsulate this led chip 40 thereafter.
During actual the use, chip bearing module 10 of the present invention can be locked on desire installing place by the depression 23 of this insulated substrate 20, certainly, the mode that visual demand was taken off in the past a plurality of chip bearing modules 10 of the present invention of connecting, again power supply is passed through this positive and negative electrical input 311 afterwards, 331 are supplied to this lead frame 30, and described LED40 chip is emitted beam.
By above statement as can be known, because can directly accepting power supply, chip bearing module of the present invention supplies with, therefore can provide the carrying luminous required electric power of described led chip thereon, so chip bearing module of the present invention does not need to make the led chip packaging body have pin as existing, also need not utilize reflow process that the led chip packaging body is welded on the printed circuit board (PCB), therefore compared to existing technologies, chip bearing module of the present invention can avoid the high temperature of reflow to damage led chip, and can simplify technology and reduce cost.
On the other hand, because the applicant is in the middle of the process of research and development, find preferable on the lead frame should 32 LEDs chips only in parallel, if surpass aforementioned quantity, the voltage and current stability reduction that lead frame is made because of length is long flow through and be laid in the led chip on the lead frame.
Because foregoing problems, the applicant finishes series-parallel chip bearing module simultaneously with what the essence spirit of first embodiment was developed second embodiment on same lead frame.See also Fig. 5 to Fig. 7, the pre-moldings formed therefrom multicore sheet carrying module 10 ' of the lead frame pattern that second embodiment of the invention provided mainly includes an insulated substrate 20 and a lead frame 30 '.Carry 16 LEDs chips 40 on this lead frame 30 '.
In this embodiment, because the overall structure and aforementioned first embodiment of this insulated substrate 20 are identical, therefore, hold the applicant and do not repeat them here.Below will describe at the different place of present embodiment and aforementioned first embodiment.
As shown in Figure 6, this lead frame 30 ' is identical with first embodiment, be to cut and make through punching press by a metal sheet, make this lead frame 30 ' have a positive electrode plate 31, one and this positive electrode plate be minor axis and be major axis to the shared electrode plate 35 of setting at interval with this positive and negative electrode plate to the negative electrode plate 33 that is provided with at interval and, thus, this positive electrode plate 31, negative electrode plate 33 and this shared electrode plate 35 are state of insulation to each other.These positive electrode plate 31 major axis to external end edge have the relative outstanding positive electrical input 311 of these shared electrode plate 35 directions on one day, and these negative electrode plate 33 major axis to external end edge have the relative outstanding negative electricity input 331 of these shared electrode plate 35 directions on one day, and these shared electrode plate 35 major axis to two ora terminalis have the relative outstanding end 351 of these positive and negative electrode plate 31,33 directions on one day respectively.Secondly, the lateral margin of this positive electrode plate 31 has one towards the first outstanding junction 313 of relative these shared electrode plate 35 directions, and the lateral margin of this negative electrode plate 33 has one towards the second outstanding junction 333 of relative these shared electrode plate 35 directions, and this shared electrode plate 35 has respectively towards this is being just relatively, negative electrode plate 31, the the 3rd and the 4th junction 353 that 33 directions are outstanding, 355, this is first years old, second junction 313,333 respectively with the 3rd, the 4th junction 353,355 position is symmetrical, thus, this of chip bearing module 10 ' of the present invention just, first of negative electrode plate 31,33, second junction 313,331, can be connected to another chip bearing module 10 ' of the present invention the shared electrode plate the 3rd, the 4th junction is with a plurality of chip bearing modules of the present invention of connecting.Similarly, the shape that cooperates punching tool, the lateral margin of these positive and negative electrode plate 31,33 contiguous these shared electrode plates 35 is wavy, so that forms a plurality of protuberances 315,337, and the lateral margin of this shared electrode plate 35 contiguous these positive and negative electrode plates 31,33 also is wavy, therefore have a plurality of respectively with this positive and negative electrode plate 31, the recess 357 that 33 protuberances 315,337 match.
During manufacturing, this insulated substrate 20 also is made into integration in the mode of plastics ejection formation equally with this lead frame 30 ', see also Fig. 5 and Fig. 7, wherein Fig. 7 removes the insulated substrate 20 that is positioned at this lead frame 30 ' top, with the aspect between convenient this lead frame 30 ' of explanation and this insulated substrate 20.The positive and negative electrode plate 31 of this lead frame 30 ', 33 and shared electrode plate 35 identical with first embodiment, be embedded in this insulated substrate 20, and this positive and negative electrode plate 31,33 and this shared electrode plate 35 between the long slot bore that is located at interval at this insulated substrate 20 21 in, and the positive and negative electrical input 311 of the part of this lead frame 30 ', 331 also as outside being exposed to via this opening 211 of this insulated substrate 20 as described in first embodiment, thus, power supply can directly be supplied to this lead frame 30 ' with positive and negative electricity by this opening 211.
This 16 LEDs chip 40 is divided into first group of led chip 40a and second group of led chip 40b, and as shown in Figure 6, described led chip 40 is attached to this lead frame 30 ' by the adhesive with conductivity, wherein on the recess 357 of the cemented protuberance 315 in these shared electrode plate 35 relative these positive electrode plates 31 of first group of led chip 40a, on the protuberance 337 of the then cemented recess 357 in these negative electrode plate 33 relative these shared electrode plates 35 of second group of led chip 40b.The shared electrode plate 35 that afterwards mode of this first group of led chip 40a by routing is connected to lead 41 this lead frame 30 ' is connected to this shared electrode plate 35 and negative electrode plate 33 with positive electrode plate 31 and with this second group of led chip 40b by lead 41, described led chip 40 and this positive and negative electrode plate 31,33 and shared electrode plate 35 are electrically connected.Thus, between the chip of first group of led chip 40a be between the chip of parallel with one another, second group of led chip 40b for parallel with one another, first group of led chip 40a then is the state of connecting with second group of led chip 40b.Certainly, the mode that encapsulates described led chip 40 is afterwards also ditto taken off content.
The actual user mode of the chip bearing module 10 ' of present embodiment and aforementioned first embodiment are all same, so the applicant repeats no more.
To sum up institute is old, because chip bearing module of the present invention can directly be supplied with the carrying luminous required electric power of described led chip thereon, therefore the led chip packaging body need not have pin, so can omit the use of reflow process and printed circuit board (PCB), to simplify technology and to reduce cost, in addition, chip bearing module of the present invention more can make the connection in series-parallel simultaneously of carrying led chip thereon, so a plurality of chip bearing modules of the present invention of not only can connecting on demand, and also can improve the voltage and the current stability of flowing through and being laid in the led chip on the lead frame.
Claims (5)
1. the pre-moldings formed therefrom multicore sheet carrying module of a lead frame pattern in order to the carrying light-emitting diode chip for backlight unit, is characterized in that, the pre-moldings formed therefrom multicore sheet carrying module of this lead frame pattern includes:
One insulated substrate; And
One lead frame is fixedly arranged on this insulated substrate, and this lead frame has a positive electrical input and a negative electricity input, and this lead frame is used for a plurality of light-emitting diode chip for backlight unit and electrically connected the ground setting thereon.
2. the pre-moldings formed therefrom multicore sheet carrying module of lead frame pattern as claimed in claim 1 is characterized in that this lead frame includes:
One positive electrode plate has this positive electrical input, and this positive electrode plate is in order to electrically connect with described light-emitting diode chip for backlight unit; And
One negative electrode plate, have this negative electricity input and with the insulation of this positive electrode plate, this negative electrode plate is to use to electrically connect ground for described light-emitting diode chip for backlight unit and be provided with thereon.
3. the pre-moldings formed therefrom multicore sheet carrying module of lead frame pattern as claimed in claim 2, it is characterized in that, this positive electrode plate has one first junction, this negative electrode plate has one second junction, first junction of this positive electrode plate of aforementioned carrying module is in order to be connected with another second junction that carries the negative electrode plate of module, with aforementioned carrying module and aforementioned another carrying module of connecting.
4. the pre-moldings formed therefrom multicore sheet carrying module of lead frame pattern as claimed in claim 1 is characterized in that this lead frame includes:
One positive electrode plate has this positive electrical input;
One negative electrode plate, have this negative electricity input and with the insulation of this positive electrode plate; And
One shares battery lead plate, is and this positive electrode plate and the insulation of this negative electrode plate;
Described light-emitting diode chip for backlight unit is divided into first group of light-emitting diode chip for backlight unit and second group of light-emitting diode chip for backlight unit, wherein this first group of light-emitting diode chip for backlight unit is arranged on this shared electrode plate and with this positive electrode plate and electrically connects, and this second group of light-emitting diode chip for backlight unit is arranged on this negative electrode plate and with this shared electrode plate and electrically connects.
5. the pre-moldings formed therefrom multicore sheet carrying module of lead frame pattern as claimed in claim 4, it is characterized in that, this positive electrode plate has one first junction, this negative electrode plate has one second junction, this shared electrode plate has one the 3rd junction and one the 4th junction, first junction of this positive electrode plate of aforementioned carrying module is in order to be connected with another the 3rd junction that carries the shared electrode plate of module, second junction of this negative electrode plate of aforementioned carrying module is in order to be connected with another the 4th junction that carries the shared electrode plate of module, with aforementioned carrying module and aforementioned another carrying module of connecting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101552260A CN102214771A (en) | 2010-04-02 | 2010-04-02 | Lead-frame-type multi-chip bearing module for precast mold molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101552260A CN102214771A (en) | 2010-04-02 | 2010-04-02 | Lead-frame-type multi-chip bearing module for precast mold molding |
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| Publication Number | Publication Date |
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| CN102214771A true CN102214771A (en) | 2011-10-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101552260A Pending CN102214771A (en) | 2010-04-02 | 2010-04-02 | Lead-frame-type multi-chip bearing module for precast mold molding |
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| Country | Link |
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| CN (1) | CN102214771A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109065524A (en) * | 2018-07-05 | 2018-12-21 | 代云生 | LED module, flexible filament, light source and LED module manufacturing method |
| WO2020038179A1 (en) * | 2018-08-24 | 2020-02-27 | 宁波舜宇光电信息有限公司 | Circuit board assembly and semi-finished product thereof, flood light, photographing module and application thereof |
| CN111911883A (en) * | 2019-05-07 | 2020-11-10 | 株式会社小糸制作所 | Power supply accessory and lamp unit |
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| CN1679177A (en) * | 2002-08-29 | 2005-10-05 | 氮化物半导体株式会社 | Light-emitting device having light-emitting elements |
| CN101083253A (en) * | 2007-05-23 | 2007-12-05 | 广州南科集成电子有限公司 | Paster type light emitting type and process for manufacturing the same |
| CN101364585A (en) * | 2008-09-25 | 2009-02-11 | 旭丽电子(广州)有限公司 | Support, chip packaging construction having the support and manufacturing method therefor |
| CN201429033Y (en) * | 2009-06-25 | 2010-03-24 | 福建中科万邦光电股份有限公司 | Novel LED series module packaging structure |
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Patent Citations (5)
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| JPH0715045A (en) * | 1992-05-11 | 1995-01-17 | Susumu Kurokawa | Surface light emission illuminating equipment |
| CN1679177A (en) * | 2002-08-29 | 2005-10-05 | 氮化物半导体株式会社 | Light-emitting device having light-emitting elements |
| CN101083253A (en) * | 2007-05-23 | 2007-12-05 | 广州南科集成电子有限公司 | Paster type light emitting type and process for manufacturing the same |
| CN101364585A (en) * | 2008-09-25 | 2009-02-11 | 旭丽电子(广州)有限公司 | Support, chip packaging construction having the support and manufacturing method therefor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109065524A (en) * | 2018-07-05 | 2018-12-21 | 代云生 | LED module, flexible filament, light source and LED module manufacturing method |
| WO2020038179A1 (en) * | 2018-08-24 | 2020-02-27 | 宁波舜宇光电信息有限公司 | Circuit board assembly and semi-finished product thereof, flood light, photographing module and application thereof |
| CN111911883A (en) * | 2019-05-07 | 2020-11-10 | 株式会社小糸制作所 | Power supply accessory and lamp unit |
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Application publication date: 20111012 |