CN102128419A - 一种led光源的防击穿保护方法及led灯具 - Google Patents

一种led光源的防击穿保护方法及led灯具 Download PDF

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CN102128419A
CN102128419A CN2011101016446A CN201110101644A CN102128419A CN 102128419 A CN102128419 A CN 102128419A CN 2011101016446 A CN2011101016446 A CN 2011101016446A CN 201110101644 A CN201110101644 A CN 201110101644A CN 102128419 A CN102128419 A CN 102128419A
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light source
led light
led
pcb board
heat dissipation
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万叶华
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Zhejiang Shenghui Lighting Co Ltd
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Zhejiang Shenghui Lighting Co Ltd
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Publication of CN102128419A publication Critical patent/CN102128419A/zh
Priority to PCT/CN2012/077025 priority patent/WO2012142979A1/zh
Priority to US14/251,095 priority patent/US9279577B2/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/30—Foil or other thin sheet-metal making or treating
    • Y10T29/301—Method
    • Y10T29/302—Clad or other composite foil or thin metal making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

本发明公开了一种LED光源的防击穿保护方法及LED灯具，是将LED光源的一个电极通过导电件连接到金属散热外壳，以形成一个旁路泄放路径来泄放漏电流，对LED光源进行保护，防止击穿；不仅使LED灯能够有效进行高压测试，还保护LED光源不受损坏。这种作法还可以保护LED遭受静电ESD的破坏，特别是在安装或取灯时，可以防止人体的静电对LED光源的损坏。从而有效保护了LED灯在生产过程及使用安装中造成的破坏，避免了不必要的损失。

Description

一种LED光源的防击穿保护方法及LED灯具
技术领域
本发明涉及LED技术领域，特别涉及一种LED光源的防击穿保护方法及采用这种方法制作的LED灯具。
背景技术
LED灯具在出厂前都要经过高压测试，高压测试的目的是检测在极端条件下，LED灯具外壳耐高压的能力如何，人触摸会不会导致电击事故。
传统的测试方法为：在金属散热灯杯外和灯头外各自包裹好一层金属箔纸，然后用电夹子夹住两块金属箔纸，通入1500V～4000V高压电，以检测灯具是否合格。
但在检测中发现，有些LED灯具的LED光源(芯片)会被击穿，造成损坏，是一笔不小的损失，究其原因，是因为在高压测试中，会有少量的漏电小电流在灯头、驱动电源及LED光源间形成回路，而这部分漏电电流如果超出了LED光源的耐受极限，LED光源就会被击穿，造成损坏。
发明内容
本发明克服了上述现有技术中的不足，提供了一种LED光源的防击穿保护方法及采用这种方法制作的LED灯具，所述的方法是将LED光源的一个电极连接到金属散热灯杯，从而可以提供一条泄放路径将这部分漏电流泄放掉，以保护LED光源。
本发明的技术方案是这样实现的：
一种LED光源的防击穿保护方法，将LED光源的正极或负极通过导电件连接到金属散热灯杯，以形成旁路泄放路径。
作为优选，将焊接有LED光源的PCB板通过若干螺丝与金属散热灯杯连接在一起，并且将PCB板上的一个电极与其中一个螺丝的螺丝头相连，这个螺丝的螺纹部分与金属散热灯杯相连。
一种LED灯具，包括灯头，胶座，在胶座内设有驱动电源，在胶座外套有金属散热灯杯，在金属散热灯杯顶部设有散热基板，在散热基板上设有PCB板，在PCB板上焊接有LED光源，PCB板与散热基板通过若干个螺丝相连，驱动电源通过导线与PCB板的电极相连，其中一个螺丝的螺丝头与PCB板上的一个电极相连，这个螺丝的螺纹部分与金属散热灯杯相连。
采用了上述技术方案的本发明的原理及有益效果是：
本发明是将LED光源的一个电极通过导电件连接到金属散热外壳，以形成一个旁路泄放路径来泄放漏电流，对LED光源进行保护，防止击穿；不仅使LED灯能够有效进行高压测试，还保护LED光源不受损坏。
上述作法还可以保护LED遭受静电ESD的破坏，特别是在安装或取灯时，可以防止人体的静电对LED光源的损坏。从而有效保护了LED灯在生产过程及使用安装中造成的破坏，避免了不必要的损失。
附图说明
图1为本发明实施例中LED灯具的爆炸图；
图2为本发明LED灯具的剖视图；
图3为PCB板与螺丝连接的示意图。
具体实施方式
本发明的具体实施方式如下：
实施例：本发明的一种LED光源的防击穿保护方法，是将LED光源的正极或负极通过导电件连接到金属散热灯杯，以形成旁路泄放路径，在高压测试时将漏电流泄放掉。
下面具体举例如下：如图1所示为一种LED灯具，包括灯头1，胶座2，在胶座2内设有驱动电源3，在胶座2顶部设有胶座盖4，在胶座2外套有金属散热灯杯5，在金属散热灯杯5顶部设有散热基板6，在散热基板6上设有PCB板7，PCB板7是由铜箔线路层、绝缘介质层与导热层组成，在上层的铜箔线路层上焊接有多个LED光源9，PCB板整体与散热基板6通过4个螺丝相连，驱动电源3通过导线与铜箔线路层的两电极相连。
如图2、图3所示，在铜箔线路层上的与其中一个螺丝10的螺丝头相接触的部位与铜箔线路层的一个电极之间印制一条导通电路8，当螺丝10旋入金属散热灯杯后，这个螺丝10的螺丝头可以与PCB板7的一个电极11电连接，这个电极11可以是正极，也可以是负极，这个螺丝10的螺纹部分与金属散热灯杯5电连接。这个螺丝既可以起到安装固定的作用，又可以起到泄放漏电流的作用。

Claims (3)

1.一种LED光源的防击穿保护方法，其特征是：将LED光源的正极或负极通过导电件连接到金属散热灯杯，以形成旁路泄放路径。
2.根据权利要求1所述的一种LED光源的防击穿保护方法，其特征在于：将焊接有LED光源的PCB板通过若干螺丝与金属散热灯杯连接在一起，并且将PCB板上的一个电极与其中一个螺丝的螺丝头相连，这个螺丝的螺纹部分与金属散热灯杯相连。
3.一种LED灯具，包括灯头，胶座，在胶座内设有驱动电源，在胶座外套有金属散热灯杯，在金属散热灯杯顶部设有散热基板，在散热基板上设有PCB板，在PCB板上焊接有LED光源，PCB板与散热基板通过若干个螺丝相连，驱动电源通过导线与PCB板的电极相连，其特征在于：其中一个螺丝的螺丝头与PCB板上的一个电极相连，这个螺丝的螺纹部分与金属散热灯杯相连。
CN2011101016446A 2011-04-22 2011-04-22 一种led光源的防击穿保护方法及led灯具 Pending CN102128419A (zh)

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CN2011101016446A CN102128419A (zh) 2011-04-22 2011-04-22 一种led光源的防击穿保护方法及led灯具
PCT/CN2012/077025 WO2012142979A1 (zh) 2011-04-22 2012-06-15 一种led光源的防击穿保护方法及led灯具
US14/251,095 US9279577B2 (en) 2011-04-22 2014-04-11 LED lighting device and method for making the same

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012142979A1 (zh) * 2011-04-22 2012-10-26 浙江生辉照明有限公司 一种led光源的防击穿保护方法及led灯具

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105782913B (zh) * 2014-12-23 2019-04-23 奇想创造事业股份有限公司 形成有转折电极的塑胶灯头及具该塑胶灯头的灯泡
CN106838675B (zh) * 2017-04-06 2022-11-11 佛山市纳迪电子科技有限公司 一种灯杯灯珠及封盖连续固定装置
US10203096B2 (en) * 2017-06-28 2019-02-12 Conservation Technology of Illinois LLC Powering and fastening a light emitting diode or chip-on-board component to a heatsink
CN210891107U (zh) * 2019-11-18 2020-06-30 肯舒摩照明（美国）有限责任公司 Led灯具

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101089461A (zh) * 2007-06-11 2007-12-19 安提亚科技股份有限公司 旋入式发光二极管模块及发光二极管装置
CN101660726A (zh) * 2008-08-29 2010-03-03 富准精密工业(深圳)有限公司 发光二极管组合
CN201696921U (zh) * 2010-05-13 2011-01-05 深圳市旭翔光电科技有限公司 Led照明灯泡
CN202032361U (zh) * 2011-04-22 2011-11-09 浙江生辉照明有限公司 一种防击穿led灯具

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5857767A (en) * 1996-09-23 1999-01-12 Relume Corporation Thermal management system for L.E.D. arrays
JP2001042792A (ja) * 1999-05-24 2001-02-16 Sony Corp Ｌｅｄ表示装置
WO2003016782A1 (en) * 2001-08-09 2003-02-27 Matsushita Electric Industrial Co., Ltd. Led illuminator and card type led illuminating light source
US6999318B2 (en) * 2003-07-28 2006-02-14 Honeywell International Inc. Heatsinking electronic devices
JP4611721B2 (ja) * 2004-11-25 2011-01-12 株式会社小糸製作所 発光デバイス及び車両用灯具
KR20080004003A (ko) * 2006-07-04 2008-01-09 삼성전자주식회사 액정표시장치
CN101680613B (zh) * 2007-05-23 2013-10-16 夏普株式会社 照明装置
JP5037683B2 (ja) * 2007-05-25 2012-10-03 モレックス インコーポレイテド 発熱体及び電源用のヒートシンク
US7837353B2 (en) * 2008-08-28 2010-11-23 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. LED assembly preventing electrostatic accumulation thereon
US7837354B2 (en) * 2008-09-01 2010-11-23 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Method for mounting an LED module on a support
CN201281255Y (zh) * 2008-09-03 2009-07-29 富准精密工业(深圳)有限公司 发光二极管组合
TWI392824B (zh) * 2008-09-19 2013-04-11 Foxconn Tech Co Ltd 發光二極體組合
CN101806398A (zh) * 2009-02-14 2010-08-18 黄建潮 Led灯应用于高压电击防卫手电筒产品
CN101858586A (zh) * 2009-04-07 2010-10-13 璨圆光电股份有限公司 发光二极管电路整合于散热基板的结构
CN101571253B (zh) * 2009-06-15 2011-06-01 金子荔 轨道车厢及船舶用集成半导体个性化平板照明灯
CN201561379U (zh) * 2009-10-29 2010-08-25 福建鸿博光电科技有限公司 Led灯壳
US8727564B2 (en) * 2010-01-26 2014-05-20 Toshiba Lighting & Technology Corporation Illumination apparatus
US20120293985A1 (en) * 2010-01-28 2012-11-22 Sharp Kabushiki Kaisha Lighting device and display device
JP5572890B2 (ja) * 2010-06-08 2014-08-20 ミヨシ電子株式会社 半導体モジュールおよび半導体装置
US8922108B2 (en) * 2011-03-01 2014-12-30 Cree, Inc. Remote component devices, systems, and methods for use with light emitting devices
CN102128419A (zh) * 2011-04-22 2011-07-20 浙江生辉照明有限公司 一种led光源的防击穿保护方法及led灯具

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101089461A (zh) * 2007-06-11 2007-12-19 安提亚科技股份有限公司 旋入式发光二极管模块及发光二极管装置
CN101660726A (zh) * 2008-08-29 2010-03-03 富准精密工业(深圳)有限公司 发光二极管组合
CN201696921U (zh) * 2010-05-13 2011-01-05 深圳市旭翔光电科技有限公司 Led照明灯泡
CN202032361U (zh) * 2011-04-22 2011-11-09 浙江生辉照明有限公司 一种防击穿led灯具

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012142979A1 (zh) * 2011-04-22 2012-10-26 浙江生辉照明有限公司 一种led光源的防击穿保护方法及led灯具

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