CN101355658A - Optical scanner for image system - Google Patents

Abstract

The invention provides an optical scanning module with linear CMOS image sensor, comprising a light source capable of giving out scanning lights, a reflection mirror group, a focus lens group and a linear CMOS image sensor comprising at least one CMOS image sensor unit, and an A/D analog-digital converter, wherein the light source after giving out the light rays is radiated on the object to be scanned, the object to be scanned reflects the light rays which become scanning light rays, and is focalized to the CMOS image sensing unit through the reflection mirror group and the focus lens group as well as is converted into an electronic signal which is converted to the digital signal through the A/D analog-digital converter, a USB signal or an LVDS signal is transmitted to the outside world so as to achieve the high speed scanning and low distortion rate, to have depth of field and to meet the requirement of convenient transportation.

Description

A kind of optical scanner of image system

Technical field

What the present invention relates to is a kind of optical scanner of image system, especially refer to a kind of optic scan module (Opticalscanning module) that utilizes linear complementary formula metal-oxide-semiconductor (MOS) image sensing component (linear CMOS image sensor) to constitute, can be applicable to image system such as scanner or multifunctional paper feeding machine etc.

Background technology

At present in image system (imaging system), be with the light scanning object and convert electronic signal to again and be applied, as scanner (scanner), printer (printer), facsimile machine (fax machine) or integrate xerox, scanning, print, fax for the multifunctional paper feeding machine of one (MPF, multi-function printer) for the most common; These image systems mostly have optic scan module (optical scanning module), its type of action is mainly: be provided with a light source in the scan module, described light source can emit beam and be incident upon on the picture or literal of to be scanned or printing, again by an image sensing component (image sensor, or title image photoreceptor) receives the light of reflection, and obtain corresponding electric signal on pattern; The image sensing component that wherein said optic scan module uses mainly contains two kinds, and the one, photoelectricity coupling image sensing component CCD (Charge CoupledDevice); Another is contact-type image sensing assembly CIS (Contact Image Sensor); From quality of scanning, the CCD image sensing component is because development time is long, technology maturation, can obtain less signal to noise S/N than (signal-to-noise ratio), so the quality of scanning of CCD image sensing component is better than CIS image sensing component; And the CIS image sensing component has characteristics such as cost is low, light and handy and ultra-thin, is adapted at the relatively more crowded environment in space, and need regulate and hot machine, so start faster than CCD image sensing component.

With reference to shown in Figure 1, it is the structural representation of a CCD optic scan module (CCDM) in the background technology, it is the CCD optic scan module (CCDM that constitutes with photoelectric coupling assembly CCD (Charge Coupled Device), CCD module) 1, its light source 11 generally is to use cathode fluorescent tube (CCFL for reaching optimum efficiency, Fluorescent) send white light, be radiated on the object to be scanned 10 via long narrow aperture (Aperture) (not shown), its reverberation can via reflecting optics 12 with focusing lens 13 and focal imaging on CCD image sensing component 16.CCD image sensing component 16 is a kind of of semiconducter IC assembly, adopts semi-conductive making, and its resolution is not influenced by processing procedure more, therefore can make the sensing component of high, medium and low resolution with the need.Because the length of CCD image sensing component 16 is short more a lot of than the width of general object to be scanned 10 (as file or picture), must use reflecting optics 12 and focusing lens 13 that image is dwindled during scanning, could intactly scan.Behind object to be scanned 10 reflection rays for the A4 size, through reflecting optics 12 and focusing lens 13 to CCD image sensing components 16, its focal length (Focus Length) is about 1 meter, though depth of field DOF (depth of focus) can scan the paper of a wrinkle more greatly, relatively also makes the CCDM1 volume bigger; Because CCD image sensing component 16 is compared at object to be scanned 10 for a short time, object to be scanned 10 relative positions need be focused on the CCD image sensing component 16 again, and increase the necessity of in assembling, adjusting; But CCD image sensing component 16 can be accepted low noise than S/N, and is so color is abundanter, disclosed as JP2006-067504, US2004/263915 etc.

In described CCD image sensing component 16 development array CCD (array CCD) and linear CCD (linear CCD) are arranged, these main problems of optic scan module CCDM of utilizing CCD image sensing component 16 to constitute are: described CCD image sensing component 16 needs extra electronic building brick, analog signal after 16 conversions of CCD image sensing component could be changed into digital signal and transfers to extraneous the use, this is called the back-end function that image is got; The assembly that the back-end function of this image capture is required such as Fig. 3, if will be with low-voltage differential (LVDS, Low Voltage Differential Signaling) number format transfers to the external world, and 15 of described A/D analog digital conversion/transmitters comprise: sequential device 14, reflector (Emitter) 153, A/D converting unit 151 and LVDS delivery unit 152; The electronic signal that CCD image sensing component 16 is produced by 14 controls of sequential device is sent analog signal via reflector 153 earlier, and A/D converting unit 151 to be becoming this analog signal conversion digital signal, and LVDS delivery unit 152 transmits via joint 161 signal of this digital signal with the LVDS number format to the external world; Because CCD image sensing component 16 can not accomplish to be integrated into one with the assembly of these image capture rear ends, so increase complexity and reduce reliability, also increase cost relatively, CCDM is hindered in development.

With reference to shown in Figure 2, it is the structural representation of a CIS optic scan module (CISM) in the background technology, it is the CIS optic scan module (CISM that constitutes with contact image sensor CIS (contact image sensor), CIS module) 2, its light source 21 is the linear light sorurce (linear light source) that forms with LED (light-emitting diodes) mostly, LED linear light sorurce 21 is directly led chip uniformly-spaced to be sticked together on a strip printed substrate, after the light that led chip sends reflects via light guide plate (light guide) (not shown), form the uniform linear light sorurce of illumination, penetrate to object 20 to be scanned to guarantee that light can distribute, light is imaged on the CIS image sensing component 23 through a lens pillar (rod lens) 22 earlier via object to be scanned 20 reflection backs again; CIS image sensing component 23 can be transformed into electronic signal with this scanning ray, transfer to extraneous the use via the sequential device that adds 24 and A/D analog digital conversion/transmitter 25 with number format, and obtain correspondence at the picture of object to be scanned 20 or literal is enameled or the electronic digit signal of black and white gray scale variation.As shown in Figure 4, be to be the example explanation with an array CSIM (Array CSIM), A/D analog digital conversion/transmitter 25 is if will transfer to the external world with low-voltage differential (LVDS) number format, and then the assembly of image capture rear end comprises: sequential device 24, horizontal decoding unit 232, vertical decoding unit 233, A/D converting unit 251 and LVDS delivery unit 253; The horizontal decoding unit 232 of clock signal driving that sequential device 24 produces transmits via the signal that A/D converting unit 251 and LVDS delivery unit 253 convert the LVDS number format to the horizontal electronic signal of CIS image sensing component 23 to the external world; In next sequential, the clock signal that sequential device 24 produces drives vertical decoding unit 233 vertical electronic signal is transmitted to the external world via the signal that A/D converting unit 251 and LVDS delivery unit 253 convert the LVDS number format to; As US2005/0145701, US7,166,827, US2003/0076552, US2007/0035785, US6,827,269 is disclosed etc.

On optics is considered, because lens pillar (rod lens) the 22nd is made of a small-bore graded index lens pillar of row (radial gradient index lens), the refractive index of each lens radially changes gradually, makes lens pillar 22 have the function of imaging.Whole lens pillar 22 can be imaged on CIS image sensing component 23 with 1: 1 ratio with the picture of object to be scanned 20 or literal, just the length of CIS image sensing component 23 must with object to be scanned 20 same length; In addition, the advantage of lens pillar 22 imagings is that light path is short, but it is little that shortcoming is the depth of field, when therefore scanning, object to be scanned (as picture or literal object) must paste the specific plane of scanner, also requires the object to be scanned must be more smooth, just when out-of-flatness place (when as the surface of picture or literal object concavo-convex drop being arranged) is arranged on the object to be scanned, then the imaging meeting of interior recess forms the black part, relatively also is difficult to develop into the scanning solid object; Therefore as the camera lens of CN200620175613 development CCDM or CSIM use, as US6,111,244 develop the device of image scanning of the long depth of field, and utilization lens and arrangement of mirrors can be imaged on the CIS image sensing component 23 to have the good depth of field scanning ray.

On the other hand, CIS image sensing component 23 can be made by CMOS (Complementary Metal Oxide Semiconductor) CMOS (Complementary Metal-Oxide-Semiconductor) logic processing procedure, and array CMOS image sensing component (Array CMOS image sensor is arranged, or be called face type CMOS image sensing component AreaCMOS image sensor) with the use of Linear CMOS image sensing component (Linear CMOS image sensor), wherein, array CMOS image sensing component generally is to be applied in phone camera module, and image optic scan module of the present invention does not coexist; And, openly utilize array CMOS image sensing component at image capture unit as US2007/0024926, US2007/0045510 and TW00490977; As US7,113,215, US2005/0145701 and US2003/0146994 openly develop the technology that CMOS is used in image sensing component, but still will add analog-digital converter and transmitter in electronic signal transmission; The open Linear CMOS image sensing component device of US2002/0096623; The method of the open Linear CMOS image sensing component transmission of US2002/0096625 data makes the Linear CMOS image sensing component can be implemented in the sensing of image.

Because the Linear CMOS image sensing component so have only a row photosensory assembly, makes that its running speed is also faster than array CMOS image sensing component because be linear; Add the low power consuming characteristic of Linear CMOS image sensing component, can effectively alleviate the burden of portable electronic product on power; Therefore, development one can solve reduction power consumption, speed height, be convenient to the optic scan module of electronic signal transmission to the external world, is to be active demand.

Moreover, for user demands such as multifunctional paper feeding machines, electronic signal after the scanning is wanted can be convenient, transfer to other use fast, and the Linear CMOS image sensing component can with the function of image capture rear end, as ADC (analog digital conversion), DSP (digital signal processor), decoding (Encoder), interface (Interface) is integrated into a single-chip (SOC, system on chip), help and solving transport interface integration and transmission convenience, therefore should develop one can be simple and easy, high-reliability and the transmission means that can combine, also problem for needing to break through with the Linear CMOS image sensing component.

Summary of the invention

In view of there is the problem that reliability is low, cost is high in the scanning information transmission in prior art at linear CCDM; At CISM in addition use that the CMOS image sensing component has then that the depth of field is little, S/N compare low shortcoming and restriction and transmitted the inconvenience that still will add analog-digital converter and transmitter; Therefore, main purpose of the present invention be to provide a kind of linear complementary formula metal-oxide-semiconductor (MOS) (CMOS) image optic scan module (Optical ScanningModule with Linear CMOS Image Sensor) (hereinafter to be referred as: Linear CMOS M),

For achieving the above object, the technical solution used in the present invention is, a kind of linear complementary formula metal-oxide-semiconductor (MOS) (CMOS) image optic scan module is provided, it is to comprise: one can send the light source of scanning ray, one reflecting optics group, one focusing lens group, with a CMOS image sensing component and wherein comprise linear complementary formula metal-oxide-semiconductor (MOS) (CMOS) image sensing unit (image sensor unit) at least, wherein said light source can use cathode fluorescent tube (CCFL, Fluorescent) or xenon (Xe) gas lamp pipe or straight-down negative light-emitting diode (LED) be arbitrary light source, be radiated on the object to be scanned after light source emits beam, object to be scanned reflects its light becomes scanning ray, again through reflecting optics group and focusing lens group and focus on and be incident upon on the described Linear CMOS image sensing component and convert electronic signal to, the A/D conversion function that is had by described Linear CMOS image sensing unit again, transfer to the external world with versabus (USB) or low-voltage differential (LVDS) signal, to reach high-velocity scanning, the low distortion rate, the tool depth of field with transmit demand easily.

Linear complementary formula metal-oxide-semiconductor (MOS) disclosed in this invention (CMOS) image optic scan module (OpticalScanning Module with Linear CMOS Image Sensor) (hereinafter to be referred as: Linear CMOS M), mainly be by: one can send the light source (light source) of scanning ray, one reflecting optics group (reflection mirrorgroup), one focusing lens group (focus lens group), (linearCMOS image sensor) constitutes with a Linear CMOS image sensing component, and wherein said Linear CMOS image sensing component comprises a linear complementary formula metal-oxide-semiconductor (MOS) image sensing unit (Linear CMOS image sensor unit) at least; Described reflecting optics group and focusing lens group can be according to the light path arrangements, and the focussing force of reflex and focusing lens group by the reflecting optics group, can make is that 1: 1 corresponding Linear CMOS image sensing component that designs effectively dwindles length originally, and depth of field DOF (depth of focus) is strengthened, to improve the identification degree of Linear CMOS image sensing component to scanning ray; Described again Linear CMOS image sensing component can be integrated Linear CMOS image sensing unit and other electronic signal transmission and translation function circuit Cheng Yiyi system-on-a-chip (SOC, SystemOn a Chip) constitutes, just make Linear CMOS image sensing unit and other correlation unit such as timing generation unit, A/D analog and digital signal converting unit, with LVDS conversion transmission unit (LVDS transmission unit) or USB conversion transmission unit (USB transmission unit) or AD conversion transmission unit (AD transmissionunit), be incorporated on the semiconductor chip, so that a described Linear CMOS image sensing component has analog digital conversion (Analog Digital Converter) or versabus USB (Universal Serial Bus) transmission or low-voltage differential interface (LVDS) simultaneously; So, make Linear CMOS M of the present invention reach high-velocity scanning, low distortion rate and transmit demand easily.

Description of drawings

Fig. 1 is the schematic diagram of background technology CCDM;

Fig. 2 is the schematic diagram of background technology CISM;

Fig. 3 is that the functional block of background technology CCDM is separated figure;

Fig. 4 is that the functional block of background technology CISM is separated figure;

Fig. 5 is the schematic diagram of embodiments of the invention;

Fig. 6 is that embodiments of the invention use the functional block of LVDS transmission to separate figure;

Fig. 7 is that embodiments of the invention use the functional block of USB transmission to separate figure;

Fig. 8 is that embodiments of the invention use the functional block of AD transmission to separate figure;

Fig. 9 is the sequential chart of embodiments of the invention;

Figure 10 is the schematic diagram of the second embodiment of the present invention.

Description of reference numerals: 3-optic scan module (Linear CMOS M); 31-light source (light source); 311-light (light); 312-scanning ray (scanning light); 32-reflecting optics group (reflection mirrorgroup); 321,322,323-reflecting optics (reflection mirror); 33-focusing lens group (focus lensgroup); 331,332,333-optical lens (focus lens); 34-Linear CMOS image sensing component (linearCMOS image sensor); 341-Linear CMOS image sensing unit (linear CMOS image sensorunit); 342-timing generation unit (timing generator unit); 343-A/D analog and digital signal converting unit (A/D analog-digital converter); 344-LVDS changes transmission unit (LVDS transmissionunit); 345-USB changes transmission unit (USB transmission unit); 346-AD changes transmission unit (ADtransmission unit); 35-autozoom camera lens (AF zooming lens); 351-AF control unit (AFcontroller).

Embodiment

Below in conjunction with accompanying drawing, be described in more detail with other technical characterictic and advantage the present invention is above-mentioned.

With reference to shown in Figure 5, linear complementary formula metal-oxide-semiconductor (MOS) of the present invention (CMOS) image optic scan module (Optical Scanning Module with Linear CMOS Image Sensor) (hereinafter to be referred as: Linear CMOS M) 3, mainly comprise: a light source 31,311 (Light) and directive object to be scanned 30 can emit beam, if be applied in the purpose of scanning, be basically send white light but also be not limited to white light; When light 311 is radiated on the object to be scanned 30 and is reflected into scanning ray 312 (Reflected scanning light); One reflecting optics group (reflection mirror group) 32, form by one or 321,322,323 of several reflecting optics (reflectionmirror) reflecting optics as shown, so that advance and the follow-up focusing lens group 33 of directive according to predetermined light path by the scanning ray 312 of object to be scanned 30 reflections; One focusing lens group (focuslens group) 33 is made up of one or several lens, so that focused on by the scanning ray 312 of reflecting optics group 32 outgoing; One Linear CMOS image sensing component (linear CMOS image sensor unit) 34 is transformed into electronic signal with the scanning ray after line focus lens set 33 is focused on, and described electronic signal is converted to number format transfers to extraneous the use; To reach the purpose of dwindling optic scan module volume, raising resolution, reducing distortion rate (Optical Distortion).

With reference to Fig. 6, Fig. 7 or shown in Figure 8, because can designing with single-chip, described Linear CMOS image sensing component (linear CMOSimage sensor) 34 constitutes, so described Linear CMOS image sensing component (linearCMOS image sensor) 34 further can comprise: a Linear CMOS image sensing unit (linear CMOSimage sensor unit) 341, one sequential generation unit (timing generator unit) 342, one A/D analog and digital signal converting unit (A/D analog-digital converter) 343, with a LVDS (low-voltage differential) conversion transmission unit (LVDS transmission unit) 344 (as shown in Figure 6) or a USB (USB) conversion transmission unit (USB transmission unit) 345 (as shown in Figure 7) or 346 (as shown in Figure 8) of A/D (analog digital) conversion transmission unit (A/D transmission unit); Wherein, Linear CMOS image sensing unit 341 converts electronic signal in order to the scanning ray 312 with imaging; Timing generation unit 342 is taken a sample with control Linear CMOS image sensing component 341 in order to produce sequential; A/D analog and digital signal converting unit 343 is in order to convert the electronic signal after the described sampling to digital signal; And dissimilar conversion transmission units, as LVDS conversion transmission unit 344 (as shown in Figure 6) or USB conversion transmission unit 345 (as shown in Figure 7) or A/D conversion transmission unit 346 (as shown in Figure 8), in order to described digital signal is changed into number format to transfer to the external world; Described again Linear CMOS image sensing component 34 is to constitute with single-chip (SOC), can reach reduce cost, the effect of reduced volume, high manufacturing, high-reliability, so, object to be scanned is become the signal of number format, can be storage, prints or throw the original appearance of picture with the reduction object to be scanned.

＜the first embodiment 〉

With reference to shown in Figure 5, it is that optic scan module of the present invention (Linear CMOS M) 3 is used in a file scanning machine, object to be scanned 30 is the file of an A4 size, put on the glass plate of scanning machine, be provided with Linear CMOS M3 of the present invention in the scanning machine, mainly comprise: a CCFL light source 31,311 (light) and being radiated on the object 30 to be scanned of can emitting beam are reflected into scanning ray 312 (scanning light) via object to be scanned 30; Reflecting optics group 32 is made up of one or several reflecting optics, and the reflecting optics group 32 described in the present embodiment is made up of first speculum 321, second speculum 322 and the 3rd speculum 323; Scanning ray 312 is radiated at first speculum 321 earlier, first speculum 321 reflects described scanning ray 312 at second speculum 322, second speculum 322 reflects described scanning ray 312 at the 3rd speculum 323 again, and scanning ray 312 can be advanced according to predetermined light path; By the arrangement of described reflecting optics group 32, actual light path can be advanced, in the confined space to dwindle the volume of optic scan module of the present invention (Linear CMOS M) 3; Scanning ray 312 can expose to focusing lens group 33 after advancing with predetermined light path via reflecting optics group 32 again; Described focusing lens group 33 can one or several optical lenses form, to cause different multiplying, constituted by three optical lenses at present embodiment, be to be combined as focusing lens group 33 by two glass lens and a slice glass lens, with the resolution specification of 600dpi, design reflectivity lens set 32 focuses on scanning ray 312 with octuple rate to ten multiplying power; Because focusing lens group 33 can shorten its length with scanning ray 312, also can revise aberration and imaging on Linear CMOS image sensing component 34; The length of this imaging can be less than the width of A4 file and can not reduced resolution again; And Linear CMOS image sensing component 34 can be transformed into electronic signal with the scanning ray after the imaging 312.

With reference to shown in Figure 6, Linear CMOS image sensing component (linear CMOS image sensor) the 34th is by a Linear CMOS image sensing unit (linear CMOS image sensor unit) 341, one sequential generation unit 342, an A/D analog and digital signal converting unit 343, constituted with LVDS conversion transmission unit 344; Described timing generation unit 342 is taken a sample with control Linear CMOS image sensing unit 341 in order to produce sequential; In different application, described timing generation unit 342 can be replaced by the sequential of outside input, just uses the outside sequential of importing to control Linear CMOS image sensing unit 341 and takes a sample; A/D analog and digital signal converting unit 343 converts the electronic signal after the described sampling to digital signal; LVDS conversion transmission unit 344 can change into described digital signal the LVDS number format and transfer to the external world; Linear CMOS image sensing component 34 can constitute by single-chip, so that Linear CMOS image sensing unit 341, timing generation unit 342, A/D analog and digital signal converting unit 343, LVDS conversion transmission unit 344 are incorporated on the semiconductor chip, form a single-chip (SOC).

With reference to shown in Figure 9, CLK is the clock signal that timing generation unit 342 produces, GBST is overall startup drive signal (Global start pulse), SO is end of scan drive signal (End of Scan pulse), VOUT is the signal of analog image output voltage (Analog video output voltage), in the present embodiment, use AMI Semiconductor ' s product P I6050D, it is the Linear CMOS image sensing unit of 600dpi resolution; For example, when sequential generation unit 342 produces sequential (or outside input timing signal) the 55th sequential, start image sensing, these suitable 110 no effect pixels (inactive pixel); Start back 172 sequential and carry out image sensing, these suitable 344 effect pixels (active pixel); Just produce two pixels in the time a sequential.

Use for other, as shown in Figure 7, above-mentioned LVDS conversion transmission unit 344 also can be changed to USB conversion transmission unit 345, then USB conversion transmission unit 345 can convert described digital signal to the USB number format and transfer to the external world; Or as shown in Figure 8, above-mentioned LVDS conversion transmission unit 344 also can be changed to A/D conversion transmission unit 346, then A/D conversion transmission unit 346 can change into described digital signal the A/D number format and transfer to the external world.

In the present embodiment, because focusing lens group 33 is made up of three lens, first lens can be the aspheric surface glass lens, second lens can be the spherical glass eyeglass, the 3rd lens can be the sphere glass lens, to constitute the focal distance ratio of about octuple multiplying power, make former 1: 1 scanning ray can be by reflecting optics group 32 with focusing lens group 33 and reduced width, in order to do using also little Linear CMOS image sensing unit 341; In the present embodiment, scanning object is the file of an A4 size, and its width is 297mm, if with existing CISM, the device length of the CIS image sensing component of its use is at least 297mm; If to have the focusing lens group 33 of the octuple reduction magnification that reflecting optics group 32 that three reflecting optics are formed and three focusing lens formed, the length of then described Linear CMOS image sensing unit 341 can be contracted to below the 60mm; Effectively to dwindle the length of the Linear CMOS image sensing unit 341 described in the Linear CMOS image sensing component 34 of the present invention, and because of several reflecting optics of use reflecting optics group 3 make the light path refraction can effectively dwindle the volume of optic scan module, this is one of effect of the present invention.

When being reflective object for object to be scanned 30, scanning ray 311 is radiated at object back reflection to be scanned and becomes scanning ray 312, after more than 32 reflection of reflecting optics group, its about two sides have the optics potential difference, this moment is if the optical lens of focusing lens group 33 can utilize the lens of short back focal length (short back focal length) ratio to form, described optics potential difference can be revised, become the scanning approaching with object to be scanned, can improve the resolution of scanning, this is another effect of the present invention.

In the present embodiment, Linear CMOS image sensing unit 341 can be by processing procedure manufacturings such as CMOS logic OR DRAM, it is made up of many photodiodes, each photodiode can be accepted light and change into electronic signal, can be described as picture element (pixel), when photodiode single be area the more, its picture element is height more; Owing to photodiode is to be subjected to the light power to send electronic signal, intensity or the light and shade of injecting light directly influence the discriminating degree of sending electronic signal respectively, also are the quality of picture element; When the aberration of the scanning ray 312 of injecting Linear CMOS image sensing unit 341 is little, the electronic signal deviation that reflects is just little, and promptly picture element resolution (resolution) is also just high; The present invention utilizes a focusing lens group 33 to cooperate composition with a Linear CMOS image sensing component 34, scanning ray 312 can be focused on imaging on the Linear CMOS image sensing component 34, can not dwindle because of imaging, the aberration distortion, and forfeiture resolution, can improve prior art and cause the shortcoming that the depth of field is little, resolution is low because of utilizing the CIS image sensing component, this is the present invention's effect again.

In addition in the present embodiment, Linear CMOS image sensing component 34 can be integrated into a single-chip (SOC, System on Chip) encapsulation with Linear CMOS image sensing unit 341, timing generation unit 342, A/D analog and digital signal converting unit 343, conversion transmission unit (344,345 or 346), can improve the reliability of assembly and reduce cost, and simple and easy electronic signal with scanning transfer to other device use with number format with LVDS, USB or A/D number format, this is the another effect of the present invention.

＜the second embodiment 〉

With reference to shown in Figure 10, optic scan module of the present invention (Linear CMOS M) 3 can further also be changed to described focusing lens group 33 by an automatic focusing lens set (AF zooming lens) 35 and one AF control unit 351 and constitute, by described AF control unit 351 with focus the automatically focus point of lens set (AFzooming lens) 35 of automatic adjustment, to promote the convenience that Linear CMOS M3 uses, also can avoid surface irregularity distortion because of object to be scanned 30 (solid object as shown in the figure).Automatically focusing lens set 35 comprises at least two lens groups, wherein at least one lens group is removable, and moving via described AF control unit 351 (AF Controller) control lens group, the variation of the spacing that produces that relatively moves between the scioptics group is to focus scanning ray 312 in focus point and imaging on Linear CMOS image sensing unit 341 automatically.The automatic focusing lens set that the present invention uses can be designed to two lens groups, and its first lens group is negative dioptric, and the eyeglass that comprises two negative dioptrics is to constitute first lens group; Second lens group is positive dioptric, comprises two positive ametropia lens to constitute second lens group; Can change focal length by moving of second lens group, scanning ray 312 be adjusted focused on, be imaged on Linear CMOS image sensing unit 341 with optimization, so arrangement can scan three-dimensional object to be scanned.

When scanning the object to be scanned of irregular file or solid, light 311 is radiated at the object to be scanned surface of different distance, the position of its reflection is also different, after the reflection of scanning ray 312 via reflecting optics group 32, the position of imaging can produce and become also on Linear CMOS image sensing unit 341; Automatically focusing lens set (AFzooming lens) 35 can be by the controlled function of AF control unit 351, scanning ray 312 its focus points of control with this different scanning position, and still can be at Linear CMOS image sensing unit 341 blur-free imagings, this is an applicable effect of the present invention.

＜the three embodiment 〉

The employed light source 31 of Linear CMOS M3 of the present invention can't be restricted as the light source of existing CCDM or CISM, described light source 31 can select to use cathode fluorescent tube CCFL, or be light source among xenon (Xe) gas lamp or the straight-down negative LED, this is applicable another effect of the present invention.

When selection was light source 31 with cathode fluorescent tube (CCFL), described light source 31 was to comprise a CCFL fluorescent tube and a long narrow aperture (aperture), and the length of light source 31 can be made as the scanning width (scanning width) of object to be scanned; Described CCFL fluorescent tube is the mercury discharge lamp pipe, when being applied in light source of the present invention, its structure is the fluorescer that coating can be sent white light in fluorescent tube, and seal a little inert gas and mercury up for safekeeping, when lamp tube ends feeds electric current, the mercury molecule just can be produced ultraviolet ray by electronic impact, and fluorescer can send white light after absorbing ultraviolet ray; The light that described long narrow aperture (aperture) can make CCFL send passes through to form the light of fine strip shape, and described light is the scanning width of object to be scanned; Irradiate light focuses on via reflecting optics group 32 and focusing lens group 33 on object to be scanned and be reflected into scanning ray again, converts electronic signal to by Linear CMOS image sensing component 34 again.

When selection was light source 31 with xenon (Xe) gas lamp, described light source 31 was to comprise an xenon (Xe) gas lamp and a long narrow aperture (aperture), and light source 31 length can be the scanning width (scanningwidth) of object to be scanned; Xenon (Xe) gas lamp is often with mist He: Xe: NF3=100: be the inert gas of filling at 2: 1, and exportable 500 pulses in 1 second also are that average power can reach 500w, and efficient is higher; The light that described long narrow aperture (aperture) can make xenon (Xe) gas lamp send passes through to form the light of fine strip shape, described light is radiated on the object to be scanned again and is reflected into scanning ray, focus on via reflecting optics group 32 and focusing lens group 33 again, convert electronic signal to by Linear CMOS image sensing component 34 again.

When selection is light source 31 with LED, described light source 31 can be the linear LED of a straight-down negative, the linear LED linearity of straight-down negative is that one or several led chips are directly sticked together on the printed substrate of a strip in mode uniformly-spaced, described led chip is to utilize electric energy to be converted into the principle of luminous energy, anode and cathode terminals applies voltage in semiconductor, when electric current passes through, when electronics was combined with electric hole, dump energy just discharged with the form of light; After light sends via the LED linear luminous body, can adopt straight (or a certain orientation) down penetrates to object to be scanned, be reflected into scanning ray through object to be scanned, focus on via reflecting optics group 32 and focusing lens group 33 again, be transformed into electronic signal by Linear CMOS image sensing component 34 again.

The Linear CMOS M that the present invention uses Linear CMOS image sensing component and optical module to be constituted compares with existing CCDM or CISM, can reach following advantage at least:

＜1 〉, Linear CMOS M of the present invention and existing CISM relatively, Linear CMOS M of the present invention have reduce cost, volume is little, high-resolution, lower distortion (Optical Distortion), high manufacturing (high productivity), with the advantage of high-reliability (Scanning Reliability).

＜2 〉, Linear CMOS M of the present invention and existing CISM relatively, Linear CMOS M of the present invention has the also high advantage of electronic signal transmission, but and elasticity use Different Light, just use the selection of light source more unrestricted.

＜3 〉, Linear CMOS M of the present invention compares with the existing CISM that is provided with lens pillar (rod lens), because the scanning ray of described existing CISM is imaged on (as shown in Figure 2) on the CIS image sensing component earlier again via object to be scanned reflection back through a lens pillar (rod lens), and do not have depth of field DOF (depth of focus) efficient because of described lens pillar causes described existing CISM, the service efficiency of the existing CISM of influence, Linear CMOS M of the present invention then has the depth of field (DOF) efficient.

＜4 〉, in existing CSIM, when using linear LED, must use light guide plate (lightguide) as light source, the light that led chip is sent reflects to form the uniform linear light sorurce of illumination via described light guide plate earlier, to guarantee that light can evenly distribute outgoing to object to be scanned, but because of using light guide plate can reduce the led light source utilization rate relatively, just light can reduce brightness after described light guide plate, and causing influences sweep speed; Yet if desire to add fast scan speed, the brightness of led light source must be strengthened (strengthening the power of led light source), and the relatively easy heat that produces causes the use puzzlement of existing CSIM; And Linear CMOS M of the present invention can utilize light and imaging on the Linear CMOS image sensing component to fill part by the optical design of wherein reflecting optics group and focusing lens group, therefore can omit the light guide plate among the existing CISM, further improve the light source utilance, and reach the purpose that sweep speed promotes.

The above only is preferred embodiment of the present invention, only is illustrative for the purpose of the present invention, and nonrestrictive; Those skilled in the art is understood, and can carry out many changes, modification even equivalence to it and become also in the spirit and scope that claim of the present invention limited, but all will fall within the scope of protection of the present invention.

Claims (12)

1, a kind of linear complementary formula metal-oxide-semiconductor (MOS) image optic scan module, it is characterized in that: it comprises:

One light source is in order to emit beam to object to be scanned;

One reflecting optics group in order to the scanning ray after the object reflection to be scanned, forms predetermined light path;

One focusing lens group is in order to reflecting optics group scanning ray focal imaging;

One linear metal-oxide-semiconductor (MOS) image sensing component is in order to be converted into the scanning ray after the imaging digital electronic signal and to transfer to the external world with number format;

Wherein said reflecting optics group also comprises a slice reflecting optics at least, and scanning ray is changed its light path through reflecting optics;

Wherein said focusing lens group also comprises a slice optical lens at least, scanning ray is focused on and revises the aberration of scanning ray;

Wherein said linear metal-oxide-semiconductor (MOS) image sensing component device comprises: a linear metal-oxide-semiconductor (MOS) image sensing unit, a sequential generation unit, an analog/digital signal conversion unit and a conversion transmission unit, and be to be integrated into a single-chip;

Scanning ray after wherein said linear metal-oxide-semiconductor (MOS) image sensing unit will focus on is transformed into electronic signal;

Wherein said timing generation unit produces clock signal to control linear metal-oxide-semiconductor (MOS) image sensing unit;

Wherein said analog/digital signal conversion unit changes into digital signal with the electronic signal that linear metal-oxide-semiconductor (MOS) image sensing unit produces;

The digital signal that wherein said conversion transmission unit changes into the analog/digital signal conversion unit changes into default transfer scheme and transmits.

2, linear complementary formula according to claim 1 metal-oxide-semiconductor (MOS) image optic scan module is characterized in that: described light source is to be produced by cathode fluorescent tube, can a directional illumination at object to be scanned.

3, linear complementary formula according to claim 1 metal-oxide-semiconductor (MOS) image optic scan module is characterized in that: described light source is to be produced by xenon lamp, can a directional illumination at object to be scanned.

4, linear complementary formula according to claim 1 metal-oxide-semiconductor (MOS) image optic scan module, it is characterized in that: described light source is to be produced by linear light-emitting diode, described linear light-emitting diode is made of at least one light-emitting diode, the light that described linear light-emitting diode sends with a directional illumination at object to be scanned.

5, linear complementary formula according to claim 1 metal-oxide-semiconductor (MOS) image optic scan module is characterized in that: the transfer scheme of described linear metal-oxide-semiconductor (MOS) image sensing component is any or its combination of AD signal conveys form, LVDS signal conveys form or usb signal transfer scheme.

6, linear complementary formula according to claim 1 metal-oxide-semiconductor (MOS) image optic scan module, it is characterized in that: described focusing lens group further can be made up of an autozoom camera lens and an AF control unit, the focal length that it is characterized in that described AF control unit may command autozoom camera lens, with the scanning ray to diverse location make it be adjusted into same focus point and on linear metal-oxide-semiconductor (MOS) image sensing unit blur-free imaging.

7, a kind of linear complementary formula metal-oxide-semiconductor (MOS) image optic scan module, it is characterized in that: it comprises:

One light source is in order to emit beam to object to be scanned;

One reflecting optics group in order to the scanning ray after the object reflection to be scanned, forms predetermined light path;

One focusing lens group is in order to reflecting optics group scanning ray focal imaging;

One linear metal-oxide-semiconductor (MOS) image sensing component is in order to be converted into the scanning ray after the imaging digital electronic signal and to transfer to the external world with number format;

Wherein said reflecting optics group also comprises at least one reflecting optics, and scanning ray is changed its light path through reflecting optics;

Wherein said focusing lens group also comprises a slice optical lens at least, scanning ray is focused on and revises the aberration of scanning ray;

Wherein said linear metal-oxide-semiconductor (MOS) image sensing component comprises: a linear metal-oxide-semiconductor (MOS) image sensing unit, an analog/digital signal conversion unit and a conversion transmission unit, and be to be integrated into a single-chip;

Wherein said linear metal-oxide-semiconductor (MOS) image sensing unit is accepted the clock signal of outside input and clock signal according to this, and the scanning ray after focusing on is transformed into electronic signal;

Wherein said analog/digital signal conversion unit changes into digital signal with the electronic signal that linear metal-oxide-semiconductor (MOS) image sensing unit produces;

The digital signal that wherein said conversion transmission unit changes into the analog/digital signal conversion unit changes into default transfer scheme and transmits.

8, linear complementary formula according to claim 7 metal-oxide-semiconductor (MOS) image optic scan module is characterized in that: described light source is to be produced by cathode fluorescent tube, can a directional illumination at object to be scanned.

9, linear complementary formula according to claim 7 metal-oxide-semiconductor (MOS) image optic scan module is characterized in that: described light source is to be produced by xenon lamp, can a directional illumination at object to be scanned.

10, linear complementary formula according to claim 7 metal-oxide-semiconductor (MOS) image optic scan module, it is characterized in that: described light source is to be produced by linear light-emitting diode, described linear light-emitting diode is made of at least one light-emitting diode, the light that described linear light-emitting diode sends with a directional illumination at object to be scanned.

11, linear complementary formula according to claim 7 metal-oxide-semiconductor (MOS) image optic scan module is characterized in that: the transfer scheme of described linear metal-oxide-semiconductor (MOS) image sensing component is any or its combination of AD signal conveys form, LVDS signal conveys form or usb signal transfer scheme.

12, linear complementary formula according to claim 7 metal-oxide-semiconductor (MOS) image optic scan module, it is characterized in that: described focusing lens group further can be made up of an autozoom camera lens and an AF control unit, the focal length that it is characterized in that described AF control unit may command autozoom camera lens, with the scanning ray to diverse location make it be adjusted into same focus point and on linear metal-oxide-semiconductor (MOS) image sensing unit blur-free imaging.

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