CN100397173C - Liquid crystal display panel module and its flexible printed circuit board - Google Patents
Liquid crystal display panel module and its flexible printed circuit board Download PDFInfo
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- CN100397173C CN100397173C CNB2005101269891A CN200510126989A CN100397173C CN 100397173 C CN100397173 C CN 100397173C CN B2005101269891 A CNB2005101269891 A CN B2005101269891A CN 200510126989 A CN200510126989 A CN 200510126989A CN 100397173 C CN100397173 C CN 100397173C
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- flexible printed
- panel module
- wiring board
- printed wiring
- lcd panel
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Abstract
The present invention relates to a liquid crystal display panel module and a flexible printed circuit board thereof, wherein the liquid crystal display panel module comprises a glass substrate and a flexible printed circuit board engaged with the glass substrate; the flexible printed circuit comprises a base, a conducting wire, a protective layer and an insulating layer, wherein the conducting wire is arranged on the base and provided with a first end part and a second end part, the protective layer is covered on the conducting wire, the first end part is at least exposed, and the insulating layer is arranged on a junction between the protective layer and the first end part and covered on a part of the protective layer and a part of the first end part.
Description
Technical field
The present invention relates to a kind of LCD panel module and flexible printed wiring board thereof, particularly relate to a kind of flexible printed wiring board of easy fracture not in the bending process of the lead on it of guaranteeing.
Background technology
(chip on glass, COG) LCD panel module generally uses flexible printed wiring board (FPC) to existing glass flip chip type in the binding of glass substrate and printed circuit board (PCB) (PCB).
Fig. 1 shows a kind of existing glass flip chip type LCD panel module 100, comprise a glass substrate 110, a flexible printed wiring board 120 and a printed circuit board (PCB) 140, wherein glass substrate 110 and printed circuit board (PCB) 140 engage with flexible printed wiring board 120 by glue material 130 respectively.
The formation of flexible printed wiring board 120 shown in Fig. 2 a, 2b as, comprise a substrate 121, many leads 122 and a protective seam 123, because flexible printed wiring board 120 requires planarization, so on the protective seam 123 of lead 122, adopt polyimide (polyimide for a long time, PI) material, but because the PI material is harder, cause stress to concentrate at glass substrate 110 and protective seam 123 intersections (shown in A among Fig. 1 and B part) easily, in bending process repeatedly, produce lead 122 fractures of flexible printed wiring board 120; In addition, because the thickness of protective seam 123 reaches 12～25 μ m, hard and tolerance minimax reaches 400 μ m,, cause foreign matter to fall into the generation short circuit easily so have a segment distance from glass substrate 110 edges.
Therefore, lead how to guarantee flexible printed wiring board easy fracture not in bending process repeatedly for glass flip chip type LCD panel module, is a problem that anxious desire solves.
At United States Patent (USP) the 6th; 657; in No. 606; disclose a kind of can guardwire in bending process repeatedly the flexible printed wiring board of easy fracture not; yet; its be applied to the membrane of flip chip type (chip on film, COF) in the LCD panel module, with the present invention's desire at glass flip chip type LCD panel module and inequality.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of LCD panel module and flexible printed wiring board thereof, it can guarantee lead on it easy fracture not in the bending process.
According to the present invention; a kind of LCD panel module is provided; comprise a glass substrate and the flexible printed wiring board that engages with glass substrate; wherein flexible printed wiring board comprises a substrate, a lead, a protective seam, one first insulation course; lead is arranged in the substrate; and have a first end and a second end; protective seam covers lead and exposes first end at least; first insulation course is arranged at the intersection of protective seam and first end; and the protective seam of cover part and first end partly, wherein this protective seam of the hardness ratio of this first insulation course is low.
In a preferred embodiment, LCD panel module also comprises a glue material, be arranged between glass substrate and the flexible printed wiring board, with junction of glass substrate and flexible printed wiring board, wherein the glue material can with or do not contact, and can be anisotropy conducting film (ACF), non-conductive film (NCF), anisotropy conductive paste (ACP), non-conductive cream (NCP) with first insulation course.
The hardness ratio protective seam that it should be noted first insulation course is low, and protective seam is made by polyimide, and first insulation course is formed from a resin, and resin can be anti-welding material (solder resist) or photo anti-corrosion agent material (photo resist); Again, lead can be become by cathode copper or calendering copper.
In another preferred embodiment; LCD panel module also comprises a printed circuit board (PCB); engage with flexible printed wiring board; wherein flexible printed wiring board also comprises one second insulation course; be arranged at the intersection of the second end of protective seam and lead, and the protective seam of cover part and the second end partly.
Again, LCD panel module also comprises a glue material, be arranged between printed circuit board (PCB) and the flexible printed wiring board, wherein the glue material can with or do not contact with second insulation course, and the hardness ratio protective seam of second insulation course is low.
Will be appreciated that LCD panel module is a glass flip chip type LCD panel module.
Again in the present invention; a kind of flexible printed wiring board is provided; comprise a substrate, a lead, a protective seam, an insulation course; wherein lead is arranged in the substrate; and have a first end and a second end; protective seam covers lead and exposes first end at least, and insulation course is arranged at the intersection of protective seam and first end, and the protective seam of cover part and first end partly.
For above and other objects of the present invention, feature and advantage can be become apparent, following conjunction with figs. and preferred embodiment are to illustrate in greater detail the present invention.
Description of drawings
Fig. 1 is a kind of synoptic diagram of existing glass flip chip type LCD panel module;
Fig. 2 a is the synoptic diagram of the flexible printed wiring board in Fig. 1;
Fig. 2 b is another synoptic diagram of the flexible printed wiring board in Fig. 1;
Fig. 3 is the synoptic diagram of an embodiment of LCD panel module of the present invention;
Fig. 4 a is the synoptic diagram of the flexible printed wiring board in Fig. 3;
Fig. 4 b is another synoptic diagram of the flexible printed wiring board in Fig. 3;
Fig. 5 is the synoptic diagram of another embodiment of LCD panel module of the present invention; And
Fig. 6 is the synoptic diagram of the variation of flexible printed wiring board.
The simple symbol explanation
1,1 ', 100 LCD panel modules
10,110 glass substrates
20,20 ', 20 ", 120 flexible printed wiring boards
21,21 ', 121 substrates
22,22 ', 122 leads
The 22a first end
The 22b the second end
23,123 protective seams
24,24 ' first insulation course
25 second insulation courses
26 adhesive coatings
30,130 glue materials
40,140 printed circuit board (PCB)s
Embodiment
With reference to figure 3, one embodiment of LCD panel module 1 of the present invention comprises a glass substrate 10, a flexible printed wiring board 20 and a printed circuit board (PCB) 40, and wherein glass substrate 10 and printed circuit board (PCB) 40 all engage with flexible printed wiring board 20 by glue material 30.
With reference to figure 4a, 4b, flexible printed wiring board 20 comprises a substrate 21, many leads 22, a protective seam 23, one first insulation course 24 and one second insulation courses 25, wherein each lead 22 is arranged in the substrate 21, and has a first end 22a and a second end 22b respectively; Protective seam 23 covers each lead 22 and exposes first end 22a and the second end 22b at least, and is made by polyimide.
Refer again to Fig. 3, glue material 30 is arranged between glass substrate 10 and the flexible printed wiring board 20 respectively and between printed circuit board (PCB) 40 and the flexible printed wiring board 20, with junction of glass substrate 10 and flexible printed wiring board 20 and printed circuit board (PCB) 40 and flexible printed wiring board 20, wherein glue material 30 can be anisotropy conducting film, non-conductive film, anisotropy conductive paste, non-conductive cream.
It should be noted in Fig. 3, glue material 30 does not contact with second insulation course 25 with first insulation course 24, but be not limited to this, as also can LCD panel module 1 ' as shown in Figure 5, glue material 30 ' is contacted with first insulation course 24 ', can prevent more really that by this foreign matter from falling to nuditing wire 22 and causing short circuit; Again,, only show that first insulation course contacts with the glue material, be not limited to this, the also visual situation of second insulation course and contacting with the glue material though will be appreciated that in Fig. 5.
In addition,, be not limited to this, also visual situation and only in a side setting though in Fig. 3, be equipped with insulation course at the both ends of lead; Again, flexible printed wiring board is not limited to the structure shown in Fig. 4 a, for example, also can be flexible printed wiring board 20 as shown in Figure 6 ", between substrate 21 ' and protective seam 22 ', can be provided with an adhesive coating 26.Again, the LCD panel module that will be appreciated that present embodiment is a glass flip chip type LCD panel module.
As above-mentioned, by intersection the lower insulation course of hardness is set at lead and protective seam, not only can reduce flexible printed wiring board in edge because be bent to form that stress is concentrated the situation that causes wire fracture, and can under the situation that does not influence the flatness that flexible printed wiring board requires originally, increase the number of times of anti-bending of lead; Again, owing to can reduce wire fracture, lead can not limit by the calendering copper, and can use the lower copper material of price, for example, and cathode copper.
Though the present invention discloses as above with preferred embodiment; yet it is not in order to limit the present invention; those skilled in the art can do a little change and retouching without departing from the spirit and scope of the present invention, thus protection scope of the present invention should with accompanying Claim the person of being defined be as the criterion.
Claims (24)
1. LCD panel module comprises:
One substrate; And
One flexible printed wiring board engages with this substrate;
Wherein this flexible printed wiring board comprises:
One substrate;
One lead is arranged in this substrate, and has a first end and a second end;
One protective seam covers this lead and exposes this first end at least; And
One first insulation course is arranged at the intersection of this protective seam and this first end, and this first end of this protective seam of cover part and part, and wherein this protective seam of the hardness ratio of this first insulation course is low.
2. LCD panel module as claimed in claim 1 also comprises a glue material, is arranged between this substrate and this flexible printed wiring board, to engage this substrate and this flexible printed wiring board.
3. LCD panel module as claimed in claim 2, wherein this glue material contacts with this first insulation course.
4. LCD panel module as claimed in claim 2, wherein this glue material does not contact with this first insulation course.
5. LCD panel module as claimed in claim 1, wherein this protective seam is made by polyimide.
6. LCD panel module as claimed in claim 1, wherein this first insulation course is formed from a resin.
7. LCD panel module as claimed in claim 6, wherein this resin is anti-welding material or photo anti-corrosion agent material.
8. LCD panel module as claimed in claim 1; also comprise a printed circuit board (PCB); engage with this flexible printed wiring board; wherein this flexible printed wiring board also comprises one second insulation course; be arranged at the intersection of the second end of this protective seam and this lead, and this protective seam of cover part and this second end partly.
9. LCD panel module as claimed in claim 8 also comprises a glue material, is arranged between this printed circuit board (PCB) and this flexible printed wiring board, to engage this printed circuit board (PCB) and this flexible printed wiring board.
10. LCD panel module as claimed in claim 9, wherein this glue material contacts with this second insulation course.
11. LCD panel module as claimed in claim 9, wherein this glue material does not contact with this second insulation course.
12. LCD panel module as claimed in claim 8, wherein this protective seam is made by polyimide.
13. LCD panel module as claimed in claim 8, wherein this protective seam of the hardness ratio of this second insulation course is low.
14. LCD panel module as claimed in claim 8, wherein this second insulation course is formed from a resin.
15. LCD panel module as claimed in claim 14, wherein this resin is anti-welding material or photo anti-corrosion agent material.
16. LCD panel module as claimed in claim 1, wherein this LCD panel module is a glass flip chip type LCD panel module.
17. a flexible printed wiring board comprises:
One substrate;
One lead is arranged in this substrate, and has a first end and a second end;
One protective seam covers this lead and exposes this first end at least; And
One first insulation course is arranged at the intersection of this protective seam and this first end, and this first end of this protective seam of cover part and part, and wherein this protective seam of the hardness ratio of this first insulation course is low.
18. flexible printed wiring board as claimed in claim 17, wherein this first insulation course is formed from a resin.
19. flexible printed wiring board as claimed in claim 18, wherein this resin is anti-welding material or photo anti-corrosion agent material.
20. flexible printed wiring board as claimed in claim 17, wherein this protective seam is made by polyimide.
21. flexible printed wiring board as claimed in claim 17 also comprises one second insulation course, is arranged at the intersection of the second end of this protective seam and this lead, and this protective seam of cover part and this second end partly.
22. flexible printed wiring board as claimed in claim 21, wherein this protective seam of the hardness ratio of this second insulation course is low.
23. flexible printed wiring board as claimed in claim 21, wherein this second insulation course is formed from a resin.
24. flexible printed wiring board as claimed in claim 23, wherein this resin is anti-welding material or photo anti-corrosion agent material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101269891A CN100397173C (en) | 2005-11-29 | 2005-11-29 | Liquid crystal display panel module and its flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101269891A CN100397173C (en) | 2005-11-29 | 2005-11-29 | Liquid crystal display panel module and its flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1776493A CN1776493A (en) | 2006-05-24 |
| CN100397173C true CN100397173C (en) | 2008-06-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101269891A Active CN100397173C (en) | 2005-11-29 | 2005-11-29 | Liquid crystal display panel module and its flexible printed circuit board |
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| Country | Link |
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| CN (1) | CN100397173C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101247697B (en) * | 2007-02-14 | 2011-04-13 | 英华达股份有限公司 | Reusable flexible printed circuit board |
| CN101304632B (en) * | 2007-05-09 | 2012-04-11 | 奇美电子股份有限公司 | Pliability circuit board and uses thereof |
| KR102008901B1 (en) * | 2011-12-06 | 2019-08-09 | 엘지디스플레이 주식회사 | Liquid crystal display device |
| TWI643537B (en) * | 2018-02-07 | 2018-12-01 | 易華電子股份有限公司 | Bendable soft circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1335530A (en) * | 2000-07-20 | 2002-02-13 | 三星电子株式会社 | Liquid crystal display device with flexible circuit board |
| CN1368718A (en) * | 2001-02-07 | 2002-09-11 | 三星电子株式会社 | Liquid crystal display and its making method |
| US20020135727A1 (en) * | 2001-03-26 | 2002-09-26 | Hiroaki Nakaminami | Display module, flexible wire board and flexible wire board connecting method |
| US20030094305A1 (en) * | 2001-10-29 | 2003-05-22 | Advanced Display Inc. | Pressure-welded structure of flexible circuit boards |
-
2005
- 2005-11-29 CN CNB2005101269891A patent/CN100397173C/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1335530A (en) * | 2000-07-20 | 2002-02-13 | 三星电子株式会社 | Liquid crystal display device with flexible circuit board |
| CN1368718A (en) * | 2001-02-07 | 2002-09-11 | 三星电子株式会社 | Liquid crystal display and its making method |
| US20020135727A1 (en) * | 2001-03-26 | 2002-09-26 | Hiroaki Nakaminami | Display module, flexible wire board and flexible wire board connecting method |
| US20030094305A1 (en) * | 2001-10-29 | 2003-05-22 | Advanced Display Inc. | Pressure-welded structure of flexible circuit boards |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1776493A (en) | 2006-05-24 |
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