BR0016660A - Método para formar um transistor, transistor, e circuito lógico e dispositivo de exibição ou de memória - Google Patents

Método para formar um transistor, transistor, e circuito lógico e dispositivo de exibição ou de memória

Info

Publication number
BR0016660A
BR0016660A BR0016660-0A BR0016660A BR0016660A BR 0016660 A BR0016660 A BR 0016660A BR 0016660 A BR0016660 A BR 0016660A BR 0016660 A BR0016660 A BR 0016660A
Authority
BR
Brazil
Prior art keywords
transistor
forming
display
memory device
logic circuit
Prior art date
Application number
BR0016660-0A
Other languages
English (en)
Inventor
Henning Sirringhaus
Richard Henry Friend
Takeo Kawase
Original Assignee
Plastic Logic Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GBGB9930217.6A external-priority patent/GB9930217D0/en
Application filed by Plastic Logic Ltd filed Critical Plastic Logic Ltd
Publication of BR0016660A publication Critical patent/BR0016660A/pt

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105After-treatment
    • H01L21/311Etching the insulating layers by chemical or physical means
    • H01L21/31127Etching organic layers
    • H01L21/31133Etching organic layers by chemical means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40Organic transistors
    • H10K10/46Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462Insulated gate field-effect transistors [IGFETs]
    • H10K10/464Lateral top-gate IGFETs comprising only a single gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40Organic transistors
    • H10K10/46Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462Insulated gate field-effect transistors [IGFETs]
    • H10K10/466Lateral bottom-gate IGFETs comprising only a single gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40Organic transistors
    • H10K10/46Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462Insulated gate field-effect transistors [IGFETs]
    • H10K10/468Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
    • H10K10/471Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics the gate dielectric comprising only organic materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/12Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/191Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60Forming conductive regions or layers, e.g. electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K19/00Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
    • H10K19/10Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00 comprising field-effect transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/30Doping active layers, e.g. electron transporting layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Thin Film Transistor (AREA)
  • Non-Volatile Memory (AREA)
  • Dram (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

"MéTODO PARA FORMAR UM TRANSISTOR,TRANSISTOR, E CIRCUITO LóGICO E DISPOSITIVO DE EXIBIçãO OU DE MEMóRIA". Um método para formar um transistor compreende: depositar um primeiro material proveniente de solução em um primeiro solvente para formar uma primeira camada do transistor, e subseq³entemente enquanto o primeiro material permanece solúvel no primeiro solvente, formar uma segunda camada do transistor depositando sobre o primeiro material um segundo material proveniente de solução em um segundo solvente no qual o primeiro material é substancialmente insolúvel.
BR0016660-0A 1999-12-21 2000-12-21 Método para formar um transistor, transistor, e circuito lógico e dispositivo de exibição ou de memória BR0016660A (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB9930217.6A GB9930217D0 (en) 1999-12-21 1999-12-21 Solutiion processed transistors
GBGB0009911.9A GB0009911D0 (en) 1999-12-21 2000-04-20 Solution processed devices
PCT/GB2000/004934 WO2001047043A1 (en) 1999-12-21 2000-12-21 Solution processed devices

Publications (1)

Publication Number Publication Date
BR0016660A true BR0016660A (pt) 2003-02-25

Family

ID=26244154

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0016660-0A BR0016660A (pt) 1999-12-21 2000-12-21 Método para formar um transistor, transistor, e circuito lógico e dispositivo de exibição ou de memória

Country Status (8)

Country Link
US (2) US6905906B2 (pt)
EP (1) EP1243034A1 (pt)
JP (1) JP2003518754A (pt)
CN (1) CN100483774C (pt)
AU (1) AU781584B2 (pt)
BR (1) BR0016660A (pt)
CA (1) CA2394881A1 (pt)
WO (1) WO2001047043A1 (pt)

Families Citing this family (155)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5167569B2 (ja) * 1999-06-21 2013-03-21 ケンブリッジ・エンタープライズ・リミテッド トランジスタの製造方法
WO2002045868A2 (en) * 2000-12-06 2002-06-13 Cambridge University Technical Services Limited Patterned deposition using compressed carbon dioxide
GB2393578B (en) 2001-07-09 2005-10-26 Plastic Logic Ltd Lamellar polymer architecture
GB2379083A (en) 2001-08-20 2003-02-26 Seiko Epson Corp Inkjet printing on a substrate using two immiscible liquids
US6946676B2 (en) 2001-11-05 2005-09-20 3M Innovative Properties Company Organic thin film transistor with polymeric interface
KR100949304B1 (ko) 2001-12-19 2010-03-23 메르크 파텐트 게엠베하 유기 절연체를 포함하는 유기 전계 효과 트랜지스터
GB0130485D0 (en) 2001-12-21 2002-02-06 Plastic Logic Ltd Self-aligned printing
FR2836263B1 (fr) * 2002-02-19 2005-02-04 Banque De France Document de securite a circuit integre
GB0207134D0 (en) 2002-03-27 2002-05-08 Cambridge Display Tech Ltd Method of preparation of organic optoelectronic and electronic devices and devices thereby obtained
NL1020312C2 (nl) * 2002-04-05 2003-10-07 Otb Groep B V Werkwijze en inrichting voor het vervaardigen van een display, zoals bijvoorbeeld een polymere OLED display, een display en een substraat ten gebruike bij de werkwijze.
US6784017B2 (en) * 2002-08-12 2004-08-31 Precision Dynamics Corporation Method of creating a high performance organic semiconductor device
EP1544905A4 (en) 2002-09-25 2009-11-18 Konica Minolta Holdings Inc ELECTRICAL SWITCHING, THIN FILM TRANSISTOR, METHOD FOR PRODUCING ELECTRICAL SWITCHING AND METHOD FOR PRODUCING A THIN FILM TRANSISTOR
GB0224871D0 (en) * 2002-10-25 2002-12-04 Plastic Logic Ltd Self-aligned doping of source-drain contacts
US7317048B2 (en) 2003-01-06 2008-01-08 E.I. Du Pont De Nemours And Company Variable resistance poly(3,4-ethylenedioxythiophene)/poly(styrene sulfonate) for use in electronic devices
US7005088B2 (en) 2003-01-06 2006-02-28 E.I. Du Pont De Nemours And Company High resistance poly(3,4-ethylenedioxythiophene)/poly(styrene sulfonate) for use in high efficiency pixellated polymer electroluminescent devices
JP4549866B2 (ja) * 2003-02-05 2010-09-22 株式会社半導体エネルギー研究所 表示装置の製造方法
KR101069333B1 (ko) * 2003-02-05 2011-10-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시장치의 제조방법
EP1592053B1 (en) * 2003-02-05 2011-08-24 Semiconductor Energy Laboratory Co., Ltd. Wiring fabricating method
EP1592052A4 (en) * 2003-02-05 2014-04-23 Semiconductor Energy Lab PROCESS FOR DISPLAY PRODUCTION
KR101186919B1 (ko) * 2003-02-06 2012-10-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시장치의 제조 방법
KR101193015B1 (ko) * 2003-02-06 2012-10-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 플라즈마 장치
WO2004070821A1 (ja) * 2003-02-06 2004-08-19 Semiconductor Energy Laboratory Co., Ltd. 表示装置の作製方法
CN100472731C (zh) * 2003-02-06 2009-03-25 株式会社半导体能源研究所 半导体制造装置
JP2004327857A (ja) * 2003-04-25 2004-11-18 Pioneer Electronic Corp 有機トランジスタの製造方法および有機トランジスタ
JP3823981B2 (ja) * 2003-05-12 2006-09-20 セイコーエプソン株式会社 パターンと配線パターン形成方法、デバイスとその製造方法、電気光学装置、電子機器及びアクティブマトリクス基板の製造方法
DE10323889A1 (de) * 2003-05-27 2004-12-16 Ehrfeld Mikrotechnik Ag Wälzlager mit Polymerelektronik
JP2004351272A (ja) * 2003-05-27 2004-12-16 Seiko Epson Corp 薄膜パターンの形成方法及びデバイスの製造方法、電気光学装置及び電子機器
KR100995451B1 (ko) * 2003-07-03 2010-11-18 삼성전자주식회사 다층 구조의 게이트 절연막을 포함하는 유기 박막 트랜지스터
GB0320491D0 (en) * 2003-09-02 2003-10-01 Plastic Logic Ltd Multi-level patterning
GB0321383D0 (en) * 2003-09-12 2003-10-15 Plastic Logic Ltd Polymer circuits
DE112004001737B4 (de) * 2003-09-17 2016-08-11 The Regents Of The University Of California Verfahren umfassend lösliche, konjugierte Polymere zur Ausbildung benachbarter Schichten auf einem Substrat oder zum Hinzufügen einer Polymerschicht zu einem Substrat, mehrschichtige elektronische Vorrichtung und Verwendung in elektronischen Bauteilen
US20050067949A1 (en) * 2003-09-30 2005-03-31 Sriram Natarajan Solvent mixtures for an organic electronic device
CN100568457C (zh) * 2003-10-02 2009-12-09 株式会社半导体能源研究所 半导体装置的制造方法
WO2005041286A1 (en) 2003-10-28 2005-05-06 Semiconductor Energy Laboratory Co., Ltd. Method for forming wiring, method for manufacturing thin film transistor and droplet discharging method
JP4415653B2 (ja) 2003-11-19 2010-02-17 セイコーエプソン株式会社 薄膜トランジスタの製造方法
EP1691340A4 (en) * 2003-11-28 2012-06-27 Tadahiro Ohmi INTEGRATED THIN FILM TRANSISTOR SWITCHING DEVICE, ACTIVE MATRIX DISPLAY EQUIPMENT AND MANUFACTURING METHOD THEREFOR
US7767998B2 (en) * 2003-12-04 2010-08-03 Alcatel-Lucent Usa Inc. OFETs with active channels formed of densified layers
KR20060123368A (ko) * 2003-12-22 2006-12-01 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 비휘발성 메모리 장치 및 그 제조 방법
GB0400997D0 (en) * 2004-01-16 2004-02-18 Univ Cambridge Tech N-channel transistor
US20050170643A1 (en) * 2004-01-29 2005-08-04 Semiconductor Energy Laboratory Co., Ltd. Forming method of contact hole, and manufacturing method of semiconductor device, liquid crystal display device and EL display device
JP4266842B2 (ja) * 2004-02-02 2009-05-20 セイコーエプソン株式会社 電気光学装置用基板の製造方法及び電気光学装置の製造方法
JP2005223107A (ja) * 2004-02-05 2005-08-18 Hitachi Ltd 電界効果型トランジスタ及びその製造方法
JP4100351B2 (ja) 2004-02-09 2008-06-11 セイコーエプソン株式会社 薄膜トランジスタの製造方法
EP1564827A1 (en) * 2004-02-10 2005-08-17 Université Libre De Bruxelles Method for the manufacturing of multilayer mesogenic components
KR100592503B1 (ko) * 2004-02-10 2006-06-23 진 장 유기 반도체의 선택적 증착을 통한 박막트랜지스터 어레이제조 방법
JP4407311B2 (ja) 2004-02-20 2010-02-03 セイコーエプソン株式会社 薄膜トランジスタの製造方法
JP4661065B2 (ja) * 2004-03-22 2011-03-30 セイコーエプソン株式会社 相補型有機半導体装置
US7572718B2 (en) * 2004-04-19 2009-08-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US7067841B2 (en) * 2004-04-22 2006-06-27 E. I. Du Pont De Nemours And Company Organic electronic devices
US7416977B2 (en) * 2004-04-28 2008-08-26 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing display device, liquid crystal television, and EL television
GB0410921D0 (en) * 2004-05-14 2004-06-16 Plastic Logic Ltd Self-aligned active layer island
US20060001021A1 (en) * 2004-06-30 2006-01-05 Motorola, Inc. Multiple semiconductor inks apparatus and method
JP4207860B2 (ja) * 2004-07-14 2009-01-14 セイコーエプソン株式会社 層形成方法、配線基板、電気光学装置、および電子機器
US7105375B2 (en) * 2004-07-30 2006-09-12 Xerox Corporation Reverse printing
KR101003868B1 (ko) 2004-08-20 2010-12-30 파나소닉 주식회사 유기 적층막을 형성하기 위한 도포액, 전계 효과트랜지스터의 제조 방법, 및 전계 효과 트랜지스터
DE112005002103T5 (de) * 2004-09-03 2007-07-26 The Regents Of The University Of California, Oakland Lösliche konjugierte Polymere verwendende Verfahren und Vorrichtungen
US7285501B2 (en) * 2004-09-17 2007-10-23 Hewlett-Packard Development Company, L.P. Method of forming a solution processed device
WO2006040530A1 (en) 2004-10-11 2006-04-20 Cambridge Display Technology Limited Polar semiconductive hole transporting material
GB0423006D0 (en) 2004-10-15 2004-11-17 Cambridge Display Tech Ltd Organic transistor
JP4341529B2 (ja) * 2004-11-05 2009-10-07 セイコーエプソン株式会社 電子デバイス、電子デバイスの製造方法および電子機器
JP4865999B2 (ja) * 2004-11-19 2012-02-01 株式会社日立製作所 電界効果トランジスタの作製方法
US7719496B2 (en) * 2004-11-23 2010-05-18 Samsung Mobile Display Co., Ltd. Organic thin film transistor, method of manufacturing the same, and flat panel display device with the organic thin film transistor
GB0426563D0 (en) 2004-12-03 2005-01-05 Plastic Logic Ltd Alignment tolerant patterning on flexible substrates
WO2006059162A1 (en) 2004-12-03 2006-06-08 Plastic Logic Limited Alignment tolerant patterning on flexible substrates
WO2006061658A1 (en) 2004-12-06 2006-06-15 Plastic Logic Limited Electrode patterning
US7102156B1 (en) * 2004-12-23 2006-09-05 Spansion Llc Advanced Micro Devices, Inc Memory elements using organic active layer
JP4966203B2 (ja) 2004-12-24 2012-07-04 シーディーティー オックスフォード リミテッド 発光装置
TW200628938A (en) * 2005-02-02 2006-08-16 Quanta Display Inc Substrate of a liquid crystal display and method of forming an alignment layer
KR101102222B1 (ko) * 2005-02-04 2012-01-05 삼성전자주식회사 전기장 처리를 이용한 유기 박막 트랜지스터의 제조방법
WO2006094101A1 (en) * 2005-03-01 2006-09-08 The Regents Of The University Of California Multilayer polymer light-emitting diodes for solid state lighting applications
WO2006098416A1 (ja) * 2005-03-15 2006-09-21 Pioneer Corporation 有機薄膜トランジスタ及びその製造方法
WO2006097566A1 (en) * 2005-03-18 2006-09-21 Avantone Oy Methods and arrangements for acquiring and utilising enhanced electronic conduction in an organic thin film transistor
JP2006269709A (ja) * 2005-03-24 2006-10-05 Hitachi Ltd 有機薄膜トランジスタを有する半導体装置の製造方法
US7265380B2 (en) * 2005-03-25 2007-09-04 Osaka University Ambipolar organic thin-film field-effect transistor and making method
JP4636921B2 (ja) 2005-03-30 2011-02-23 セイコーエプソン株式会社 表示装置の製造方法、表示装置および電子機器
GB2424759A (en) * 2005-04-01 2006-10-04 Seiko Epson Corp Inkjet deposition of polythiophene semiconductor material dissolved in halogenated aromatic solvents
US7670882B2 (en) * 2005-04-05 2010-03-02 Hewlett-Packard Development Company, L.P. Electronic device fabrication
GB0506899D0 (en) 2005-04-05 2005-05-11 Plastic Logic Ltd Multiple conductive layer TFT
GB0506896D0 (en) 2005-04-05 2005-05-11 Plastic Logic Ltd Stack ablation
US20060231908A1 (en) * 2005-04-13 2006-10-19 Xerox Corporation Multilayer gate dielectric
DE102005017655B4 (de) * 2005-04-15 2008-12-11 Polyic Gmbh & Co. Kg Mehrschichtiger Verbundkörper mit elektronischer Funktion
GB2425654B (en) * 2005-04-29 2010-03-17 Seiko Epson Corp A method of fabricating a heterojunction of organic semiconducting polymers
KR20060116534A (ko) * 2005-05-10 2006-11-15 삼성에스디아이 주식회사 박막 트랜지스터, 그 제조 방법 및 이를 구비한 평판 표시장치
JP4200983B2 (ja) * 2005-05-24 2008-12-24 セイコーエプソン株式会社 膜パターンの形成方法、アクティブマトリクス基板、電気光学装置、及び電子機器
US7750350B2 (en) * 2005-05-25 2010-07-06 Samsung Mobile Display Co., Ltd. Organic thin film transistor, flat panel display apparatus having the same, method of producing the organic thin film transistor and shadow mask used in the method
EP1727219B1 (en) 2005-05-25 2014-05-07 Samsung SDI Germany GmbH Organic thin film transistor and method for producing the same
KR100647695B1 (ko) * 2005-05-27 2006-11-23 삼성에스디아이 주식회사 유기 박막 트랜지스터 및 그의 제조방법과 이를 구비한평판표시장치
GB0511132D0 (en) 2005-06-01 2005-07-06 Plastic Logic Ltd Layer-selective laser ablation patterning
US20060273303A1 (en) * 2005-06-07 2006-12-07 Xerox Corporation. Organic thin film transistors with multilayer electrodes
KR101137862B1 (ko) * 2005-06-17 2012-04-20 엘지디스플레이 주식회사 평판표시소자의 제조방법
US20070007510A1 (en) * 2005-07-05 2007-01-11 Spansion Llc Stackable memory device and organic transistor structure
KR100953652B1 (ko) * 2005-08-18 2010-04-20 삼성모바일디스플레이주식회사 유기 박막 트랜지스터 및 그 제조 방법
US7482619B2 (en) * 2005-09-07 2009-01-27 Samsung Electronics Co., Ltd. Charge trap memory device comprising composite of nanoparticles and method of fabricating the charge trap memory device
GB2430178A (en) * 2005-09-20 2007-03-21 Seiko Epson Corp Method of producing a substrate having areas of different hydrophilicity and/or oleophilicity on the same surface
GB2430547A (en) * 2005-09-20 2007-03-28 Seiko Epson Corp A method of producing a substrate having areas of different hydrophilicity and/or oleophilicity on the same surface
US20070068404A1 (en) * 2005-09-29 2007-03-29 Edwin Hirahara Systems and methods for additive deposition of materials onto a substrate
US7569415B2 (en) * 2005-09-30 2009-08-04 Alcatel-Lucent Usa Inc. Liquid phase fabrication of active devices including organic semiconductors
US20070075365A1 (en) * 2005-10-03 2007-04-05 Peter Mardilovich Thin-film transistor and method of making the same
US7498662B2 (en) * 2005-11-18 2009-03-03 3M Innovative Properties Company Dielectric media including surface-treated metal oxide particles
US20070146426A1 (en) * 2005-12-28 2007-06-28 Nelson Brian K All-inkjet printed thin film transistor
DE102006055067B4 (de) 2005-12-29 2017-04-20 Lg Display Co., Ltd. Organische Dünnfilmtransistoren und Verfahren zu deren Herstellung
JP5066848B2 (ja) 2006-02-10 2012-11-07 コニカミノルタホールディングス株式会社 薄膜トランジスタの製造方法
JP5230597B2 (ja) 2006-03-29 2013-07-10 プラスティック ロジック リミテッド 自己整合電極を有する電子デバイス
JP4733005B2 (ja) * 2006-04-20 2011-07-27 エルジー ディスプレイ カンパニー リミテッド 有機半導体物質を利用した液晶表示装置用アレイ基板及びその製造方法
JP2007311377A (ja) * 2006-05-16 2007-11-29 Sony Corp 薄膜トランジスタの製造方法および薄膜トランジスタならびに表示装置
GB0611452D0 (en) 2006-06-12 2006-07-19 Plastic Logic Ltd Page refreshing e-reader
JP4802933B2 (ja) * 2006-08-17 2011-10-26 セイコーエプソン株式会社 半導体装置、電子装置及び電子機器
US7709307B2 (en) * 2006-08-24 2010-05-04 Kovio, Inc. Printed non-volatile memory
US7736936B2 (en) * 2006-08-29 2010-06-15 Semiconductor Energy Laboratory Co., Ltd. Method of forming display device that includes removing mask to form opening in insulating film
GB2441355B (en) * 2006-08-31 2009-05-20 Cambridge Display Tech Ltd Organic electronic device
GB0619548D0 (en) 2006-10-03 2006-11-15 Plastic Logic Ltd Distortion tolerant processing
GB2442724B (en) * 2006-10-10 2009-10-21 Cdt Oxford Ltd Light emissive device
US20080187651A1 (en) * 2006-10-24 2008-08-07 3M Innovative Properties Company Conductive ink formulations
US7557049B2 (en) * 2006-10-30 2009-07-07 Nitto Denko Corporation Producing method of wired circuit board
JP2008147418A (ja) * 2006-12-11 2008-06-26 Hitachi Ltd 薄膜トランジスタ装置、画像表示装置およびその製造方法
FI20070063A0 (fi) * 2007-01-24 2007-01-24 Ronald Oesterbacka Orgaaninen kenttävaikutustransistori
JP5152493B2 (ja) * 2007-03-26 2013-02-27 国立大学法人大阪大学 有機電界効果トランジスター及びその製造方法
EP1976019B1 (en) * 2007-03-29 2011-06-15 Korea Advanced Institute of Science and Technology Thin film transistor including titanium oxides as active layer and method of manufacturing the same
US7795614B2 (en) * 2007-04-02 2010-09-14 Xerox Corporation Device with phase-separated dielectric structure
GB0709093D0 (en) * 2007-05-11 2007-06-20 Plastic Logic Ltd Electronic device incorporating parylene within a dielectric bilayer
JP5111949B2 (ja) 2007-06-18 2013-01-09 株式会社日立製作所 薄膜トランジスタの製造方法及び薄膜トランジスタ装置
WO2009013291A2 (en) * 2007-07-25 2009-01-29 Basf Se Field effect elements
US8134233B2 (en) * 2007-07-30 2012-03-13 Motorola Solutions, Inc. Method and apparatus for providing electrically isolated closely spaced features on a printed circuit board
GB2454032A (en) 2007-10-24 2009-04-29 Plastic Logic Ltd Edgeless document viewer
GB0722750D0 (en) * 2007-11-20 2008-01-02 Cambridge Display Technology O Organic thin film transistors active matrix organic optical devices and emthods of making the same
GB0724774D0 (en) * 2007-12-19 2008-01-30 Cambridge Display Tech Ltd Organic thin film transistors, active matrix organic optical devices and methods of making the same
WO2009129912A1 (en) * 2008-04-24 2009-10-29 Merck Patent Gmbh Electronic device
JP5325465B2 (ja) * 2008-06-03 2013-10-23 株式会社日立製作所 薄膜トランジスタおよびそれを用いた装置
CN102119185A (zh) * 2008-08-11 2011-07-06 巴斯夫欧洲公司 聚苯并噻吩聚合物及其制备方法
GB2463266B (en) 2008-09-05 2011-07-27 Plastic Logic Ltd Electronic document reader
FR2950366A1 (fr) * 2009-09-23 2011-03-25 Commissariat Energie Atomique Procede de cristallisation de materiaux
GB0916806D0 (en) 2009-09-24 2009-11-04 Plastic Logic Ltd Touch screen displays
US8564870B2 (en) 2009-10-05 2013-10-22 Acreo Ab Active-matrix electrochromic display device and method for producing the same
GB2474689B (en) 2009-10-23 2015-08-26 Plastic Logic Ltd Electronic document reading devices
GB0920684D0 (en) 2009-11-26 2010-01-13 Plastic Logic Ltd Display systems
GB2476671B (en) 2010-01-04 2014-11-26 Plastic Logic Ltd Touch-sensing systems
GB201000021D0 (en) 2010-01-04 2010-02-17 Plastic Logic Ltd Electronic document reading devices
GB2483082B (en) 2010-08-25 2018-03-07 Flexenable Ltd Display control mode
GB2485828B (en) 2010-11-26 2015-05-13 Plastic Logic Ltd Electronic devices
GB201106350D0 (en) 2011-04-14 2011-06-01 Plastic Logic Ltd Display systems
GB2504141B (en) 2012-07-20 2020-01-29 Flexenable Ltd Method of reducing artefacts in an electro-optic display by using a null frame
GB2505440B (en) 2012-08-30 2018-05-30 Flexenable Ltd Electronic device with a flexible display
CN102881828A (zh) * 2012-10-10 2013-01-16 上海交通大学 一种短沟道有机薄膜晶体管的制备方法
WO2015008009A1 (en) 2013-07-16 2015-01-22 Plastic Logic Limited Assembly of multiple flexible displays
US20160199832A1 (en) * 2013-08-30 2016-07-14 Advanced Liquid Logic France Sas Manipulation of droplets on hydrophilic or variegated-hydrophilic surfaces
KR20160011666A (ko) * 2013-09-19 2016-02-01 가부시키가이샤 제이올레드 유기 발광 소자의 제조 방법 및 표시 장치의 제조 방법
JPWO2015076334A1 (ja) * 2013-11-21 2017-03-16 株式会社ニコン トランジスタの製造方法およびトランジスタ
GB201321285D0 (en) 2013-12-03 2014-01-15 Plastic Logic Ltd Pixel driver circuit
DE102014111276B4 (de) 2014-08-07 2021-09-02 Pictiva Displays International Limited Verfahren zur Herstellung von organischen funktionellen Schichten und zur Herstellung eines organischen elektronischen Bauelements
GB201418610D0 (en) * 2014-10-20 2014-12-03 Cambridge Entpr Ltd Transistor devices
KR20180071277A (ko) * 2015-10-16 2018-06-27 다우 글로벌 테크놀로지스 엘엘씨 유기 전하 수송 막을 제조하는 방법
WO2017162222A1 (de) * 2016-03-23 2017-09-28 Forschungszentrum Jülich GmbH Verfahren zur herstellung eines speichers, speicher sowie verwendung des speichers
US10153333B1 (en) 2017-07-24 2018-12-11 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Method for manufacturing an OLED backplate and method for manufacturing an OLED panel
CN107565063B (zh) * 2017-07-24 2019-04-30 武汉华星光电半导体显示技术有限公司 Oled背板的制作方法与oled面板的制作方法
KR102240669B1 (ko) * 2019-05-08 2021-04-16 (주)플렉솔루션 유기 전기화학 트랜지스터 소자 및 그 제조방법

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4943471A (en) * 1986-05-20 1990-07-24 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Patterned thin film and process for preparing the same
CA1302675C (en) * 1986-05-20 1992-06-09 Masakazu Uekita Thin film and device having the same
JPS63258672A (ja) * 1987-04-16 1988-10-26 Nippon Paint Co Ltd 2コ−ト1ベ−ク塗装系による塗膜形成方法
US6331356B1 (en) * 1989-05-26 2001-12-18 International Business Machines Corporation Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
US5140158A (en) * 1990-10-05 1992-08-18 The United States Of America As Represented By The United States Department Of Energy Method for discriminative particle selection
JP3117511B2 (ja) * 1991-10-16 2000-12-18 旭硝子株式会社 塗料用組成物および塗装方法
JPH0619144A (ja) * 1992-06-30 1994-01-28 Mita Ind Co Ltd 電子写真感光体およびその製造方法
JP3246189B2 (ja) * 1994-06-28 2002-01-15 株式会社日立製作所 半導体表示装置
JPH0983040A (ja) * 1995-09-12 1997-03-28 Sharp Corp 薄膜トランジスタ及びその製造方法
JPH09203803A (ja) * 1996-01-25 1997-08-05 Asahi Glass Co Ltd カラーフィルタの製造方法及びそれを用いた液晶表示素子
US6326640B1 (en) * 1996-01-29 2001-12-04 Motorola, Inc. Organic thin film transistor with enhanced carrier mobility
JP3339334B2 (ja) 1996-12-05 2002-10-28 松下電器産業株式会社 反射型液晶表示素子
JP3552466B2 (ja) * 1997-06-12 2004-08-11 日産自動車株式会社 自動車内板用塗膜形成方法
WO1999010939A2 (en) * 1997-08-22 1999-03-04 Koninklijke Philips Electronics N.V. A method of manufacturing a field-effect transistor substantially consisting of organic materials
GB2330451B (en) * 1997-10-14 2002-11-20 Thin Film Technology Method of forming an electronic device
WO1999021233A1 (en) * 1997-10-17 1999-04-29 The Regents Of The University Of California Process for fabricating organic semiconductor devices using ink-jet printing technology and device and system employing same
CN100550472C (zh) * 1998-03-17 2009-10-14 精工爱普生株式会社 薄膜构图的衬底及其表面处理
GB9808061D0 (en) * 1998-04-16 1998-06-17 Cambridge Display Tech Ltd Polymer devices
EP1151484A1 (en) * 1999-01-15 2001-11-07 The Dow Chemical Company Semiconducting polymer field effect transistor
JP2000269504A (ja) * 1999-03-16 2000-09-29 Hitachi Ltd 半導体装置、その製造方法及び液晶表示装置
JP5167569B2 (ja) * 1999-06-21 2013-03-21 ケンブリッジ・エンタープライズ・リミテッド トランジスタの製造方法
BR0016670A (pt) * 1999-12-21 2003-06-24 Plastic Logic Ltd Métodos para formar um circuito integrado e para definir um circuito eletrônico, e, dispositivo eletrônico
KR20020049630A (ko) * 2000-12-19 2002-06-26 임지순 전계방출 에미터
US7439096B2 (en) * 2001-02-21 2008-10-21 Lucent Technologies Inc. Semiconductor device encapsulation
US7026643B2 (en) * 2001-05-04 2006-04-11 International Business Machines Corporation Organic n-channel semiconductor device of N,N' 3,4,9,10 perylene tetracarboxylic diimide
GB2393578B (en) * 2001-07-09 2005-10-26 Plastic Logic Ltd Lamellar polymer architecture
US20030227014A1 (en) * 2002-06-11 2003-12-11 Xerox Corporation. Process for forming semiconductor layer of micro-and nano-electronic devices
US6784017B2 (en) * 2002-08-12 2004-08-31 Precision Dynamics Corporation Method of creating a high performance organic semiconductor device
KR100572926B1 (ko) * 2002-12-26 2006-04-24 삼성전자주식회사 폴리티에닐티아졸 유도체 및 이를 이용한 유기박막트랜지스터
KR100995451B1 (ko) * 2003-07-03 2010-11-18 삼성전자주식회사 다층 구조의 게이트 절연막을 포함하는 유기 박막 트랜지스터
US6927108B2 (en) * 2003-07-09 2005-08-09 Hewlett-Packard Development Company, L.P. Solution-processed thin film transistor formation method
US7063994B2 (en) * 2003-07-11 2006-06-20 Organic Vision Inc. Organic semiconductor devices and methods of fabrication including forming two parts with polymerisable groups and bonding the parts
US6861664B2 (en) * 2003-07-25 2005-03-01 Xerox Corporation Device with n-type semiconductor
US6867081B2 (en) * 2003-07-31 2005-03-15 Hewlett-Packard Development Company, L.P. Solution-processed thin film transistor formation method

Also Published As

Publication number Publication date
WO2001047043A1 (en) 2001-06-28
AU2206601A (en) 2001-07-03
US20050274986A1 (en) 2005-12-15
CN100483774C (zh) 2009-04-29
EP1243034A1 (en) 2002-09-25
CN1425201A (zh) 2003-06-18
CA2394881A1 (en) 2001-06-28
JP2003518754A (ja) 2003-06-10
US7635857B2 (en) 2009-12-22
AU781584B2 (en) 2005-06-02
US6905906B2 (en) 2005-06-14
US20030059975A1 (en) 2003-03-27

Similar Documents

Publication Publication Date Title
BR0016660A (pt) Método para formar um transistor, transistor, e circuito lógico e dispositivo de exibição ou de memória
BR0011888A (pt) Processo para formar um dispositivo eletrônico, dispositivo eletrônico, circuito lógico, visor de matriz ativa, e, transistor de polímero
BR0016661A (pt) Método para formar um dispositivo eletrônico, dispositivo eletrônico, circuito lógico e dispositivo de exibição e dispositivo eletrônico
DE69942991D1 (de) Hochgeschwindigkeits-"Flip-Chip"-Abgabevorrichtung
PT1227802E (pt) Prepacao de pelicula para libertacao bifasica de substancias farmacologicamente activas ou outras
AR023228A1 (es) Composiciones en espuma estables
DE59707812D1 (de) Opioidantagonisthaltige galenische formulierung
MA25681A1 (fr) Systeme d'administration de compositions orales de soins comprenant une resine d'organosiloxane utilisant une bandelette de soutien amovible.
FR2663188B1 (fr) Dispositif de ramassage de paillage sous forme de film plastique.
BR0010166A (pt) Composto modulador de ace-2, composto inibidor de ace-2, métodos para o tratamento de um estado associado a ace-2 em um paciente e para inibir a hidrólise de um peptìdeo de marcação de ace-2, e, composição farmacêutica
DE59812646D1 (de) Laminare Arzneiform
BRPI0405450A (pt) Agente de revestimento
ATE226096T1 (de) Knochensiegel
DK0612234T3 (da) Hygiejnebindssvøb og klæbelapskonstruktion
BR9908235A (pt) Processo e dispositivo para encher caixas de papelão
EE05415B1 (et) Ravimi manustamise vahend, eriti androgeenide manustamiseks
CO5670360A2 (es) Dispositivo de retencion gastrico expandible
FR2792506B1 (fr) Dispositif bloqueur de lacets pour la fermeture d'articles du type chaussures, sacs, vetements
ITMI20000062A0 (it) Supporto a nastro per bga e dispositivo a semiconduttore utilizzante lo stesso
ITTO20000243A0 (it) Macchina per l'applicazione su contenitori flessibili sigillati di dispositivi di apertura sostanzialmente in forma di nastrini.
ATE239647T1 (de) Vorrichtung zur verbesserten entnahmefähigkeit von beutelinhalten
BR0011586B1 (pt) processo e dispositivo para a fabricaÇço de um produto a partir de uma fita adesiva, em particular um produto que contÉm uma substÂncia ativa e/ou medicinal.
DE59506049D1 (de) Kindersichere verpackung für wirkstoffpflaster
DE60006371D1 (de) Verbesserte elastische dreidimensionale folie mit schrägen kapillarperforationen, sowie absorbierender artikel mit äusserer schicht mit dieser folie
FR2776608B1 (fr) Dispositif d'asservissement, notamment de servofrein

Legal Events

Date Code Title Description
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]

Free format text: INDEFIRO O PEDIDO DE ACORDO COM O ART .8O COMBINADO COM ART. 13 DA LPI

B12B Appeal against refusal [chapter 12.2 patent gazette]
B25D Requested change of name of applicant approved

Owner name: FLEXENABLE LIMITED (GB)

B25G Requested change of headquarter approved

Owner name: FLEXENABLE LIMITED (GB)

B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 25/09/2018, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 21A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2649 DE 13-10-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.