AU2003210504A1 - Organic compositions for low dielectric constant materials - Google Patents
Organic compositions for low dielectric constant materialsInfo
- Publication number
- AU2003210504A1 AU2003210504A1 AU2003210504A AU2003210504A AU2003210504A1 AU 2003210504 A1 AU2003210504 A1 AU 2003210504A1 AU 2003210504 A AU2003210504 A AU 2003210504A AU 2003210504 A AU2003210504 A AU 2003210504A AU 2003210504 A1 AU2003210504 A1 AU 2003210504A1
- Authority
- AU
- Australia
- Prior art keywords
- dielectric constant
- low dielectric
- constant materials
- organic compositions
- compositions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02203—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being porous
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Formation Of Insulating Films (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Organic Insulating Materials (AREA)
Applications Claiming Priority (14)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
USNOTGIVEN | 1999-12-23 | ||
US35018702P | 2002-01-15 | 2002-01-15 | |
US60/350,187 | 2002-01-15 | ||
US35055702P | 2002-01-22 | 2002-01-22 | |
US60/350,557 | 2002-01-22 | ||
US35301102P | 2002-01-30 | 2002-01-30 | |
US60/353,011 | 2002-01-30 | ||
US37621902P | 2002-04-29 | 2002-04-29 | |
US60/376,219 | 2002-04-29 | ||
US37842402P | 2002-05-07 | 2002-05-07 | |
US60/378,424 | 2002-05-07 | ||
US10/158,513 US7141188B2 (en) | 2001-05-30 | 2002-05-30 | Organic compositions |
US10/158,513 | 2002-05-30 | ||
PCT/US2003/000948 WO2003060979A2 (en) | 2002-01-15 | 2003-01-14 | Organic compositions for low dielectric constant materials |
Publications (2)
Publication Number | Publication Date |
---|---|
AU2003210504A8 AU2003210504A8 (en) | 2003-07-30 |
AU2003210504A1 true AU2003210504A1 (en) | 2003-07-30 |
Family
ID=27558468
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003210504A Abandoned AU2003210504A1 (en) | 2002-01-15 | 2003-01-14 | Organic compositions for low dielectric constant materials |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1466356A2 (en) |
JP (1) | JP2005516382A (en) |
KR (1) | KR20040104454A (en) |
CN (1) | CN1643669A (en) |
AU (1) | AU2003210504A1 (en) |
WO (1) | WO2003060979A2 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4878779B2 (en) * | 2004-06-10 | 2012-02-15 | 富士フイルム株式会社 | Film forming composition, insulating film and electronic device |
US7491658B2 (en) * | 2004-10-13 | 2009-02-17 | International Business Machines Corporation | Ultra low k plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality |
US7531209B2 (en) | 2005-02-24 | 2009-05-12 | Michael Raymond Ayers | Porous films and bodies with enhanced mechanical strength |
JP4659486B2 (en) * | 2005-03-01 | 2011-03-30 | 富士フイルム株式会社 | Insulating film for electronic device, electronic device, and method for producing insulating film for electronic device |
JP2006257212A (en) * | 2005-03-16 | 2006-09-28 | Fuji Photo Film Co Ltd | Film-forming composition, insulation film using it and electronic device |
JP2007031663A (en) * | 2005-07-29 | 2007-02-08 | Fujifilm Corp | Film-forming composition and insulating film and electron device formed by using the same |
JP2007314778A (en) * | 2006-04-26 | 2007-12-06 | Fujifilm Corp | Film forming composition, insulation film formed by using the composition and electronic device |
US7790234B2 (en) | 2006-05-31 | 2010-09-07 | Michael Raymond Ayers | Low dielectric constant materials prepared from soluble fullerene clusters |
WO2007143025A2 (en) | 2006-05-31 | 2007-12-13 | Roskilde Semiconductor Llc | Porous inorganic solids for use as low dielectric constant materials |
US7883742B2 (en) | 2006-05-31 | 2011-02-08 | Roskilde Semiconductor Llc | Porous materials derived from polymer composites |
WO2007143026A2 (en) | 2006-05-31 | 2007-12-13 | Roskilde Semiconductor Llc | Linked periodic networks of alternating carbon and inorganic clusters for use as low dielectric constant materials |
US20100069578A1 (en) * | 2006-11-17 | 2010-03-18 | Rudolf Faust | Functional Hydrocarbon Polymers and Process for Producing Same |
JP2008231259A (en) * | 2007-03-20 | 2008-10-02 | Sumitomo Bakelite Co Ltd | Organic insulating material |
JP2009013116A (en) | 2007-07-05 | 2009-01-22 | Daicel Chem Ind Ltd | Ethynylphenylbiadamantane derivative |
GB2451865A (en) | 2007-08-15 | 2009-02-18 | Univ Liverpool | Microporous polymers from alkynyl monomers |
US20240087880A1 (en) * | 2022-08-26 | 2024-03-14 | Applied Materials, Inc. | Systems and methods for depositing low-k dielectric films |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3415741B2 (en) * | 1997-03-31 | 2003-06-09 | 東レ・ダウコーニング・シリコーン株式会社 | Composition for forming electrically insulating thin film and method for forming electrically insulating thin film |
IL143207A0 (en) * | 1998-11-24 | 2002-04-21 | Dow Chemical Co | A composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom |
JP3483500B2 (en) * | 1999-05-28 | 2004-01-06 | 富士通株式会社 | Insulating film forming material, insulating film forming method, and semiconductor device |
JP2001192539A (en) * | 2000-01-13 | 2001-07-17 | Jsr Corp | Thermosetting resin composition, its cured item, and circuit board including the cured item |
US6509415B1 (en) * | 2000-04-07 | 2003-01-21 | Honeywell International Inc. | Low dielectric constant organic dielectrics based on cage-like structures |
JP4651774B2 (en) * | 2000-04-11 | 2011-03-16 | 新日鐵化学株式会社 | Aromatic oligomer, phenol resin composition containing the same, epoxy resin composition and cured product thereof |
JP2002003683A (en) * | 2000-06-26 | 2002-01-09 | Hitachi Chem Co Ltd | Resin composition low in both hygroscopic property and birefringence and forming material, sheet of film and optical parts obtained from the resin composition |
TW588072B (en) * | 2000-10-10 | 2004-05-21 | Shipley Co Llc | Antireflective porogens |
US20030006477A1 (en) * | 2001-05-23 | 2003-01-09 | Shipley Company, L.L.C. | Porous materials |
JP2003131001A (en) * | 2001-05-25 | 2003-05-08 | Shipley Co Llc | Porous optical materials |
US7049005B2 (en) * | 2001-05-30 | 2006-05-23 | Honeywell International Inc. | Organic compositions |
-
2003
- 2003-01-14 CN CNA03805938XA patent/CN1643669A/en active Pending
- 2003-01-14 EP EP03729654A patent/EP1466356A2/en not_active Withdrawn
- 2003-01-14 KR KR10-2004-7010994A patent/KR20040104454A/en not_active Application Discontinuation
- 2003-01-14 WO PCT/US2003/000948 patent/WO2003060979A2/en not_active Application Discontinuation
- 2003-01-14 JP JP2003560974A patent/JP2005516382A/en active Pending
- 2003-01-14 AU AU2003210504A patent/AU2003210504A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2005516382A (en) | 2005-06-02 |
KR20040104454A (en) | 2004-12-10 |
EP1466356A2 (en) | 2004-10-13 |
AU2003210504A8 (en) | 2003-07-30 |
WO2003060979A2 (en) | 2003-07-24 |
WO2003060979A3 (en) | 2004-07-15 |
CN1643669A (en) | 2005-07-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |