AU2002211706A1 - Sputter targets - Google Patents

Sputter targets

Info

Publication number
AU2002211706A1
AU2002211706A1 AU2002211706A AU1170602A AU2002211706A1 AU 2002211706 A1 AU2002211706 A1 AU 2002211706A1 AU 2002211706 A AU2002211706 A AU 2002211706A AU 1170602 A AU1170602 A AU 1170602A AU 2002211706 A1 AU2002211706 A1 AU 2002211706A1
Authority
AU
Australia
Prior art keywords
sputter targets
sputter
targets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002211706A
Inventor
Jianxing Li
Michael R. Pinter
Chi Tse Wu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of AU2002211706A1 publication Critical patent/AU2002211706A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/342—Hollow targets
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Electrochemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
AU2002211706A 2000-10-13 2001-10-11 Sputter targets Abandoned AU2002211706A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/687,946 2000-10-13
US09/687,946 US6482302B1 (en) 2000-10-13 2000-10-13 Container-shaped physical vapor deposition targets
PCT/US2001/032019 WO2002031218A2 (en) 2000-10-13 2001-10-11 Sputter targets

Publications (1)

Publication Number Publication Date
AU2002211706A1 true AU2002211706A1 (en) 2002-04-22

Family

ID=24762488

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002211706A Abandoned AU2002211706A1 (en) 2000-10-13 2001-10-11 Sputter targets

Country Status (4)

Country Link
US (2) US6482302B1 (en)
AU (1) AU2002211706A1 (en)
TW (1) TW570992B (en)
WO (1) WO2002031218A2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030227068A1 (en) * 2001-05-31 2003-12-11 Jianxing Li Sputtering target
US6482302B1 (en) * 2000-10-13 2002-11-19 Honeywell International Inc. Container-shaped physical vapor deposition targets
US6833058B1 (en) * 2000-10-24 2004-12-21 Honeywell International Inc. Titanium-based and zirconium-based mixed materials and sputtering targets
JP4911744B2 (en) * 2002-09-13 2012-04-04 トーソー エスエムディー，インク． Non-planar sputter target having a crystal orientation that promotes uniform adhesion of sputtered material to a substrate and method of manufacturing the target
US20040123920A1 (en) * 2002-10-08 2004-07-01 Thomas Michael E. Homogenous solid solution alloys for sputter-deposited thin films
JP4794802B2 (en) * 2002-11-21 2011-10-19 Ｊｘ日鉱日石金属株式会社 Copper alloy sputtering target and semiconductor device wiring
US7297247B2 (en) * 2003-05-06 2007-11-20 Applied Materials, Inc. Electroformed sputtering target
US7314650B1 (en) * 2003-08-05 2008-01-01 Leonard Nanis Method for fabricating sputter targets
JP4386694B2 (en) * 2003-09-16 2009-12-16 株式会社日立製作所 Storage system and storage control device
US20050279637A1 (en) * 2004-06-22 2005-12-22 Pinter Michael R Methods of forming target/backing plate assemblies comprising ruthenium, methods of electrolytically processing ruthenium, and container-shaped physical vapor deposition targets comprising ruthenium
US9127362B2 (en) 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
US8647484B2 (en) 2005-11-25 2014-02-11 Applied Materials, Inc. Target for sputtering chamber
US8968536B2 (en) 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
US7901552B2 (en) 2007-10-05 2011-03-08 Applied Materials, Inc. Sputtering target with grooves and intersecting channels
US9920418B1 (en) 2010-09-27 2018-03-20 James Stabile Physical vapor deposition apparatus having a tapered chamber

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4246088A (en) 1979-01-24 1981-01-20 Metal Box Limited Method and apparatus for electrolytic treatment of containers
GB2049737A (en) 1979-06-01 1980-12-31 Gen Eng Radcliffe Sputtering Device Target
JPH0539566A (en) 1991-02-19 1993-02-19 Mitsubishi Materials Corp Sputtering target and its production
BE1007067A3 (en) 1992-07-15 1995-03-07 Emiel Vanderstraeten Besloten SPUTTER CATHOD AND METHOD FOR MANUFACTURING THIS CATHOD
EP0915523A3 (en) * 1997-10-29 2005-11-02 Canon Kabushiki Kaisha A photovoltaic element having a back side transparent and electrically conductive layer with a light incident side surface region having a specific cross section and a module comprising said photovoltaic element
WO2000032347A1 (en) * 1998-12-03 2000-06-08 Tosoh Smd, Inc. Insert target assembly and method of making same
KR20000062587A (en) * 1999-03-02 2000-10-25 로버트 에이. 바쎄트 Method of manufacturing and refilling sputter targets by thermal spray for use and reuse in thin film deposition
US6283357B1 (en) * 1999-08-03 2001-09-04 Praxair S.T. Technology, Inc. Fabrication of clad hollow cathode magnetron sputter targets
DE19953274A1 (en) 1999-11-05 2001-05-10 Cognis Deutschland Gmbh Emulsions
US6482302B1 (en) * 2000-10-13 2002-11-19 Honeywell International Inc. Container-shaped physical vapor deposition targets

Also Published As

Publication number Publication date
US6730198B2 (en) 2004-05-04
WO2002031218B1 (en) 2003-03-20
WO2002031218A2 (en) 2002-04-18
US20030015432A1 (en) 2003-01-23
TW570992B (en) 2004-01-11
WO2002031218A3 (en) 2002-10-10
US6482302B1 (en) 2002-11-19

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