AU2001294275A1 - Position detection method, position detection device, exposure method, exposure system, control program, and device production method - Google Patents

Position detection method, position detection device, exposure method, exposure system, control program, and device production method

Info

Publication number
AU2001294275A1
AU2001294275A1 AU2001294275A AU9427501A AU2001294275A1 AU 2001294275 A1 AU2001294275 A1 AU 2001294275A1 AU 2001294275 A AU2001294275 A AU 2001294275A AU 9427501 A AU9427501 A AU 9427501A AU 2001294275 A1 AU2001294275 A1 AU 2001294275A1
Authority
AU
Australia
Prior art keywords
position detection
exposure
control program
exposure system
production method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001294275A
Inventor
Shin-Ichi Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of AU2001294275A1 publication Critical patent/AU2001294275A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7092—Signal processing
AU2001294275A 2000-10-19 2001-10-19 Position detection method, position detection device, exposure method, exposure system, control program, and device production method Abandoned AU2001294275A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000319002 2000-10-19
JP2000-319002 2000-10-19
PCT/JP2001/009219 WO2002033351A1 (en) 2000-10-19 2001-10-19 Position detection method, position detection device, exposure method, exposure system, control program, and device production method

Publications (1)

Publication Number Publication Date
AU2001294275A1 true AU2001294275A1 (en) 2002-04-29

Family

ID=18797535

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001294275A Abandoned AU2001294275A1 (en) 2000-10-19 2001-10-19 Position detection method, position detection device, exposure method, exposure system, control program, and device production method

Country Status (7)

Country Link
US (1) US20030176987A1 (en)
EP (1) EP1333246A4 (en)
JP (1) JP3932039B2 (en)
KR (1) KR20030067677A (en)
CN (1) CN1229624C (en)
AU (1) AU2001294275A1 (en)
WO (1) WO2002033351A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004000749A1 (en) * 2002-06-19 2003-12-31 Frewitt Printing Sa A method and a device for depositing a wipe-proof and rub-proof marking onto transparent glass
WO2005008753A1 (en) * 2003-05-23 2005-01-27 Nikon Corporation Template creation method and device, pattern detection method, position detection method and device, exposure method and device, device manufacturing method, and template creation program
US7271907B2 (en) * 2004-12-23 2007-09-18 Asml Netherlands B.V. Lithographic apparatus with two-dimensional alignment measurement arrangement and two-dimensional alignment measurement method
US7751047B2 (en) * 2005-08-02 2010-07-06 Asml Netherlands B.V. Alignment and alignment marks
KR100714280B1 (en) 2006-04-27 2007-05-02 삼성전자주식회사 Equipment for inspecting overlay pattern in semiconductor device and method used the same
US7630059B2 (en) * 2006-07-24 2009-12-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8248591B2 (en) * 2010-11-18 2012-08-21 Quality Vision International, Inc. Through-the-lens illuminator for optical comparator
JP2016100366A (en) * 2014-11-18 2016-05-30 キヤノン株式会社 Lithographic apparatus and manufacturing method of article
KR102240649B1 (en) * 2019-12-11 2021-04-15 (주)유아이엠디 Imaging method of optical apparatus for observing sample of cell
CN112230709B (en) * 2020-10-16 2023-12-12 南京大学 Photoelectric computing device capable of realizing high-precision optical input and calibration method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0147493B1 (en) * 1983-12-28 1988-09-07 International Business Machines Corporation Process and equipment for the automatic alignment of an object in respect of a reference
US4644172A (en) * 1984-02-22 1987-02-17 Kla Instruments Corporation Electronic control of an automatic wafer inspection system
US4955062A (en) * 1986-12-10 1990-09-04 Canon Kabushiki Kaisha Pattern detecting method and apparatus
JP2833908B2 (en) * 1992-03-04 1998-12-09 山形日本電気株式会社 Positioning device in exposure equipment
KR100300618B1 (en) * 1992-12-25 2001-11-22 오노 시게오 EXPOSURE METHOD, EXPOSURE DEVICE, AND DEVICE MANUFACTURING METHOD USING THE DEVICE
JPH10223517A (en) * 1997-01-31 1998-08-21 Nikon Corp Focusing unit, viewer equipped with focusing unit, and aligner equipped with viewer
JPH1197512A (en) * 1997-07-25 1999-04-09 Nikon Corp Positioning apparatus and method and storage medium capable of computer-reading of positioning programs
JPH11288867A (en) * 1998-04-02 1999-10-19 Nikon Corp Alignment method, formation of alignment mark, and aligner and method for exposure
WO2000030163A1 (en) * 1998-11-18 2000-05-25 Nikon Corporation Exposure method and device
EP1182508B1 (en) * 2000-08-14 2012-12-12 Vistec Electron Beam GmbH Method of exposing a layout comprising several levels on a wafer

Also Published As

Publication number Publication date
CN1469990A (en) 2004-01-21
WO2002033351A1 (en) 2002-04-25
JPWO2002033351A1 (en) 2004-02-26
JP3932039B2 (en) 2007-06-20
CN1229624C (en) 2005-11-30
KR20030067677A (en) 2003-08-14
US20030176987A1 (en) 2003-09-18
EP1333246A1 (en) 2003-08-06
EP1333246A4 (en) 2008-04-16

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