AU2001278067A1 - A mem sensor and a method of making same - Google Patents
A mem sensor and a method of making sameInfo
- Publication number
- AU2001278067A1 AU2001278067A1 AU2001278067A AU7806701A AU2001278067A1 AU 2001278067 A1 AU2001278067 A1 AU 2001278067A1 AU 2001278067 A AU2001278067 A AU 2001278067A AU 7806701 A AU7806701 A AU 7806701A AU 2001278067 A1 AU2001278067 A1 AU 2001278067A1
- Authority
- AU
- Australia
- Prior art keywords
- making same
- mem sensor
- mem
- sensor
- making
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/0015—Cantilevers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0292—Sensors not provided for in B81B2201/0207 - B81B2201/0285
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/03—Bonding two components
- B81C2203/033—Thermal bonding
- B81C2203/036—Fusion bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H59/00—Electrostatic relays; Electro-adhesion relays
- H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/629,684 US6630367B1 (en) | 2000-08-01 | 2000-08-01 | Single crystal dual wafer, tunneling sensor and a method of making same |
US09629684 | 2000-08-01 | ||
PCT/US2001/023797 WO2002011188A2 (en) | 2000-08-01 | 2001-07-27 | A mem sensor and a method of making same |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001278067A1 true AU2001278067A1 (en) | 2002-02-13 |
Family
ID=24524052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001278067A Abandoned AU2001278067A1 (en) | 2000-08-01 | 2001-07-27 | A mem sensor and a method of making same |
Country Status (6)
Country | Link |
---|---|
US (2) | US6630367B1 (en) |
EP (1) | EP1305640A2 (en) |
JP (1) | JP2004504951A (en) |
AU (1) | AU2001278067A1 (en) |
TW (1) | TW504488B (en) |
WO (1) | WO2002011188A2 (en) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6580138B1 (en) * | 2000-08-01 | 2003-06-17 | Hrl Laboratories, Llc | Single crystal, dual wafer, tunneling sensor or switch with silicon on insulator substrate and a method of making same |
US6563184B1 (en) * | 2000-08-01 | 2003-05-13 | Hrl Laboratories, Llc | Single crystal tunneling sensor or switch with silicon beam structure and a method of making same |
US7381630B2 (en) * | 2001-01-02 | 2008-06-03 | The Charles Stark Draper Laboratory, Inc. | Method for integrating MEMS device and interposer |
EP1717195B1 (en) * | 2001-11-09 | 2011-09-14 | WiSpry, Inc. | Trilayered beam MEMS switch and related method |
US7253488B2 (en) * | 2002-04-23 | 2007-08-07 | Sharp Laboratories Of America, Inc. | Piezo-TFT cantilever MEMS |
US20030234994A1 (en) * | 2002-06-19 | 2003-12-25 | Pan Shaoher X. | Reflective spatial light modulator |
US7206110B2 (en) * | 2002-06-19 | 2007-04-17 | Miradia Inc. | Memory cell dual protection |
US6992810B2 (en) * | 2002-06-19 | 2006-01-31 | Miradia Inc. | High fill ratio reflective spatial light modulator with hidden hinge |
US7034984B2 (en) * | 2002-06-19 | 2006-04-25 | Miradia Inc. | Fabrication of a high fill ratio reflective spatial light modulator with hidden hinge |
US20040069742A1 (en) * | 2002-06-19 | 2004-04-15 | Pan Shaoher X. | Fabrication of a reflective spatial light modulator |
US6908201B2 (en) * | 2002-06-28 | 2005-06-21 | Silicon Light Machines Corporation | Micro-support structures |
US6955745B1 (en) * | 2002-08-01 | 2005-10-18 | University Of Florida Research Foundation, Inc. | Method of spark-processing silicon and resulting materials |
US7551048B2 (en) * | 2002-08-08 | 2009-06-23 | Fujitsu Component Limited | Micro-relay and method of fabricating the same |
US6647809B1 (en) * | 2002-08-29 | 2003-11-18 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Silicon carbide high temperature anemometer and method for assembling the same |
AU2003901914A0 (en) * | 2003-04-22 | 2003-05-08 | Quantum Precision Instruments Pty Ltd | Quantum tunnelling transducer device |
US7026695B2 (en) * | 2003-11-19 | 2006-04-11 | Miradia Inc. | Method and apparatus to reduce parasitic forces in electro-mechanical systems |
US7449284B2 (en) * | 2004-05-11 | 2008-11-11 | Miradia Inc. | Method and structure for fabricating mechanical mirror structures using backside alignment techniques |
US20050255666A1 (en) * | 2004-05-11 | 2005-11-17 | Miradia Inc. | Method and structure for aligning mechanical based device to integrated circuits |
US7042619B1 (en) * | 2004-06-18 | 2006-05-09 | Miradia Inc. | Mirror structure with single crystal silicon cross-member |
US7068417B2 (en) * | 2004-07-28 | 2006-06-27 | Miradia Inc. | Method and apparatus for a reflective spatial light modulator with a flexible pedestal |
US7199918B2 (en) * | 2005-01-07 | 2007-04-03 | Miradia Inc. | Electrical contact method and structure for deflection devices formed in an array configuration |
US7298539B2 (en) * | 2005-06-01 | 2007-11-20 | Miradia Inc. | Co-planar surface and torsion device mirror structure and method of manufacture for optical displays |
US7202989B2 (en) | 2005-06-01 | 2007-04-10 | Miradia Inc. | Method and device for fabricating a release structure to facilitate bonding of mirror devices onto a substrate |
US7184195B2 (en) | 2005-06-15 | 2007-02-27 | Miradia Inc. | Method and structure reducing parasitic influences of deflection devices in an integrated spatial light modulator |
US7190508B2 (en) | 2005-06-15 | 2007-03-13 | Miradia Inc. | Method and structure of patterning landing pad structures for spatial light modulators |
US7382513B2 (en) * | 2005-10-13 | 2008-06-03 | Miradia Inc. | Spatial light modulator with multi-layer landing structures |
US7502158B2 (en) | 2005-10-13 | 2009-03-10 | Miradia Inc. | Method and structure for high fill factor spatial light modulator with integrated spacer layer |
EP2002511A4 (en) * | 2006-03-08 | 2012-02-29 | Wispry Inc | Tunable impedance matching networks and tunable diplexer matching systems |
US8635765B2 (en) * | 2011-06-15 | 2014-01-28 | International Business Machines Corporation | Method of forming micro-electrical-mechanical structure (MEMS) |
US8916407B1 (en) | 2012-03-29 | 2014-12-23 | Sitime Corporation | MEMS device and method of manufacturing same |
US10160638B2 (en) * | 2013-01-04 | 2018-12-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for a semiconductor structure |
US9038269B2 (en) * | 2013-04-02 | 2015-05-26 | Xerox Corporation | Printhead with nanotips for nanoscale printing and manufacturing |
US10145739B2 (en) | 2014-04-03 | 2018-12-04 | Oto Photonics Inc. | Waveguide sheet, fabrication method thereof and spectrometer using the same |
US11078075B2 (en) * | 2015-12-31 | 2021-08-03 | Taiwan Semiconductor Manufacturing Company Ltd. | Packaging method and associated packaging structure |
US10850976B2 (en) * | 2018-09-21 | 2020-12-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of making ohmic contact on low doped bulk silicon for optical alignment |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5265470A (en) * | 1987-11-09 | 1993-11-30 | California Institute Of Technology | Tunnel effect measuring systems and particle detectors |
US5210714A (en) | 1988-10-14 | 1993-05-11 | International Business Machines Corporation | Distance-controlled tunneling transducer and direct access storage unit employing the transducer |
US5015850A (en) | 1989-06-20 | 1991-05-14 | The Board Of Trustees Of The Leland Stanford Junior University | Microfabricated microscope assembly |
DE69102590T2 (en) | 1990-05-18 | 1994-10-06 | British Aerospace | Inertial sensors. |
JP3069923B2 (en) | 1991-06-17 | 2000-07-24 | キヤノン株式会社 | Cantilever probe, atomic force microscope, information recording / reproducing device |
US5313835A (en) | 1991-12-19 | 1994-05-24 | Motorola, Inc. | Integrated monolithic gyroscopes/accelerometers with logic circuits |
DE4305033A1 (en) | 1992-02-21 | 1993-10-28 | Siemens Ag | Micro-mechanical relay with hybrid drive - has electrostatic drive combined with piezoelectric drive for high force operation and optimum response |
JP3152005B2 (en) * | 1993-03-17 | 2001-04-03 | 株式会社村田製作所 | Manufacturing method of semiconductor acceleration sensor |
EP0619495B1 (en) | 1993-04-05 | 1997-05-21 | Siemens Aktiengesellschaft | Process for manufacturing tunnel effect sensors |
US5354985A (en) * | 1993-06-03 | 1994-10-11 | Stanford University | Near field scanning optical and force microscope including cantilever and optical waveguide |
US5475318A (en) * | 1993-10-29 | 1995-12-12 | Robert B. Marcus | Microprobe |
US5666190A (en) | 1994-04-12 | 1997-09-09 | The Board Of Trustees Of The Leland Stanford, Jr. University | Method of performing lithography using cantilever array |
US6075585A (en) * | 1994-04-12 | 2000-06-13 | The Board Of Trustees Of The Leland Stanford, Jr. University | Vibrating probe for a scanning probe microscope |
US5596194A (en) | 1994-08-19 | 1997-01-21 | Hughes Aircraft Company | Single-wafer tunneling sensor and low-cost IC manufacturing method |
US5646348A (en) | 1994-08-29 | 1997-07-08 | The Charles Stark Draper Laboratory, Inc. | Micromechanical sensor with a guard band electrode and fabrication technique therefor |
JP3182301B2 (en) | 1994-11-07 | 2001-07-03 | キヤノン株式会社 | Microstructure and method for forming the same |
US5883387A (en) * | 1994-11-15 | 1999-03-16 | Olympus Optical Co., Ltd. | SPM cantilever and a method for manufacturing the same |
JP2897671B2 (en) | 1995-01-25 | 1999-05-31 | 日本電気株式会社 | Field emission cold cathode |
US5659195A (en) * | 1995-06-08 | 1997-08-19 | The Regents Of The University Of California | CMOS integrated microsensor with a precision measurement circuit |
GB9524241D0 (en) | 1995-11-28 | 1996-01-31 | Smiths Industries Plc | Rate sensors |
US5894090A (en) | 1996-05-31 | 1999-04-13 | California Institute Of Technology | Silicon bulk micromachined, symmetric, degenerate vibratorygyroscope, accelerometer and sensor and method for using the same |
US5992233A (en) | 1996-05-31 | 1999-11-30 | The Regents Of The University Of California | Micromachined Z-axis vibratory rate gyroscope |
US5747804A (en) | 1996-09-13 | 1998-05-05 | Raytheon Company | Method and apparatus for sensing infrared radiation utilizing a micro-electro-mechanical sensor |
JPH10178183A (en) * | 1996-12-17 | 1998-06-30 | Mitsubishi Materials Corp | Semiconductor inertial sensor and manufacture thereof |
JP3639684B2 (en) | 1997-01-13 | 2005-04-20 | キヤノン株式会社 | Evanescent wave detection microprobe and method for manufacturing the same, probe including the microprobe and method for manufacturing the same, evanescent wave detection device including the microprobe, near-field scanning optical microscope, and information reproducing device |
JP3493974B2 (en) * | 1997-10-01 | 2004-02-03 | オムロン株式会社 | Electrostatic micro relay |
US5929497A (en) | 1998-06-11 | 1999-07-27 | Delco Electronics Corporation | Batch processed multi-lead vacuum packaging for integrated sensors and circuits |
US6078103A (en) * | 1998-10-29 | 2000-06-20 | Mcdonnell Douglas Corporation | Dimpled contacts for metal-to-semiconductor connections, and methods for fabricating same |
US6091125A (en) | 1998-12-02 | 2000-07-18 | Northeastern University | Micromechanical electronic device |
US6229190B1 (en) | 1998-12-18 | 2001-05-08 | Maxim Integrated Products, Inc. | Compensated semiconductor pressure sensor |
US6174820B1 (en) | 1999-02-16 | 2001-01-16 | Sandia Corporation | Use of silicon oxynitride as a sacrificial material for microelectromechanical devices |
US6337027B1 (en) | 1999-09-30 | 2002-01-08 | Rockwell Science Center, Llc | Microelectromechanical device manufacturing process |
-
2000
- 2000-08-01 US US09/629,684 patent/US6630367B1/en not_active Expired - Fee Related
-
2001
- 2001-07-04 TW TW090116340A patent/TW504488B/en active
- 2001-07-27 AU AU2001278067A patent/AU2001278067A1/en not_active Abandoned
- 2001-07-27 JP JP2002516816A patent/JP2004504951A/en active Pending
- 2001-07-27 EP EP01956027A patent/EP1305640A2/en not_active Withdrawn
- 2001-07-27 WO PCT/US2001/023797 patent/WO2002011188A2/en not_active Application Discontinuation
-
2003
- 2003-05-06 US US10/429,988 patent/US6730978B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6630367B1 (en) | 2003-10-07 |
WO2002011188A2 (en) | 2002-02-07 |
US6730978B2 (en) | 2004-05-04 |
WO2002011188A3 (en) | 2002-05-02 |
EP1305640A2 (en) | 2003-05-02 |
US20030207487A1 (en) | 2003-11-06 |
TW504488B (en) | 2002-10-01 |
JP2004504951A (en) | 2004-02-19 |
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