AU2001245588A1 - High performance cold plate for electronic cooling - Google Patents

High performance cold plate for electronic cooling

Info

Publication number
AU2001245588A1
AU2001245588A1 AU2001245588A AU4558801A AU2001245588A1 AU 2001245588 A1 AU2001245588 A1 AU 2001245588A1 AU 2001245588 A AU2001245588 A AU 2001245588A AU 4558801 A AU4558801 A AU 4558801A AU 2001245588 A1 AU2001245588 A1 AU 2001245588A1
Authority
AU
Australia
Prior art keywords
high performance
cold plate
electronic cooling
performance cold
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001245588A
Inventor
Kevin J. Donegan
Evgeny N. Holmansky
Douglas L. Johnson
Edward J. Ognibene
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SatCon Technology Corp
Original Assignee
SatCon Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SatCon Technology Corp filed Critical SatCon Technology Corp
Publication of AU2001245588A1 publication Critical patent/AU2001245588A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D7/00—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D7/02—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being helically coiled
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AU2001245588A 2000-03-10 2001-03-09 High performance cold plate for electronic cooling Abandoned AU2001245588A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US18838600P 2000-03-10 2000-03-10
US60188386 2000-03-10
PCT/US2001/007682 WO2001069158A1 (en) 2000-03-10 2001-03-09 High performance cold plate for electronic cooling

Publications (1)

Publication Number Publication Date
AU2001245588A1 true AU2001245588A1 (en) 2001-09-24

Family

ID=22692920

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001245588A Abandoned AU2001245588A1 (en) 2000-03-10 2001-03-09 High performance cold plate for electronic cooling

Country Status (7)

Country Link
US (1) US6634421B2 (en)
EP (1) EP1261833A4 (en)
JP (1) JP2003527751A (en)
KR (1) KR20020086920A (en)
AU (1) AU2001245588A1 (en)
CA (1) CA2400982A1 (en)
WO (1) WO2001069158A1 (en)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040068991A1 (en) * 1999-10-07 2004-04-15 Ben Banney Heat exchanger for an electronic heat pump
WO2002035666A1 (en) * 2000-10-20 2002-05-02 Mitsubishi Denki Kabushiki Kaisha Cooler, semiconductor laser light source, semiconductor laser light source unit, method for producing semiconductor laser light source unit, and solid laser
KR20010069631A (en) * 2001-04-24 2001-07-25 김태국 Non direction plat type heat pump system
NZ527968A (en) 2003-09-01 2006-07-28 H2Safe Llc Storage vessel
US7044199B2 (en) * 2003-10-20 2006-05-16 Thermal Corp. Porous media cold plate
US7017655B2 (en) 2003-12-18 2006-03-28 Modine Manufacturing Co. Forced fluid heat sink
US6988543B2 (en) * 2004-03-22 2006-01-24 Intel Corporation Annular cold plate with reflexive channels
US20050274489A1 (en) * 2004-06-10 2005-12-15 Brand Joseph H Heat exchange device and method
US7234514B2 (en) 2004-08-02 2007-06-26 Asml Holding N.V. Methods and systems for compact, micro-channel laminar heat exchanging
US8333330B2 (en) * 2004-09-17 2012-12-18 Active Power, Inc. Systems and methods for controlling temperature and pressure of fluids
US20060059937A1 (en) * 2004-09-17 2006-03-23 Perkins David E Systems and methods for providing cooling in compressed air storage power supply systems
US20060059936A1 (en) * 2004-09-17 2006-03-23 Radke Robert E Systems and methods for providing cooling in compressed air storage power supply systems
US7314059B2 (en) * 2004-09-17 2008-01-01 Active Power, Inc. Systems and methods for controlling pressure of fluids
US20090294105A1 (en) * 2005-03-22 2009-12-03 Bharat Heavy Electricals Limited Selectively Grooved Cold Plate for Electronics Cooling
US20070204646A1 (en) * 2006-03-01 2007-09-06 Thomas Gagliano Cold plate incorporating a heat pipe
US7537047B2 (en) * 2006-03-23 2009-05-26 Foxconn Technology Co., Ltd. Liquid-cooling heat sink
CN100584169C (en) * 2006-04-21 2010-01-20 富准精密工业(深圳)有限公司 Liquid-cooled heat radiator
US7476993B2 (en) * 2006-04-28 2009-01-13 Pratt & Whitney Canada Corp. Method of making electric machine winding
US7495916B2 (en) * 2007-06-19 2009-02-24 Honeywell International Inc. Low cost cold plate with film adhesive
JP4557055B2 (en) * 2008-06-25 2010-10-06 ソニー株式会社 Heat transport device and electronic equipment
US8369090B2 (en) 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
US9921000B2 (en) * 2011-07-22 2018-03-20 8 Rivers Capital, Llc Heat exchanger comprising one or more plate assemblies with a plurality of interconnected channels and related method
US20130058043A1 (en) * 2011-09-03 2013-03-07 Weiss-Aug Co. Inc Heat sink with a stack of metal layers having channels therein
US20130069449A1 (en) * 2011-09-15 2013-03-21 Nikon Corporation Modular coil arrays for planar and linear motors
US9275931B2 (en) * 2012-01-12 2016-03-01 Huang-Han Chen Heat dissipating module
WO2013158071A1 (en) * 2012-04-16 2013-10-24 Clustered Systems Company Cold plate with reduced bubble effects
US8867210B2 (en) 2012-10-31 2014-10-21 Deere & Company Cooling apparatus for an electrical substrate
TWM469450U (en) * 2013-01-21 2014-01-01 Huang-Han Chen Condensing rack
EP3450238B1 (en) 2014-10-24 2020-08-26 H2Safe, LLC Fail-safe containment device for containing volatile fluids
US9622377B2 (en) * 2015-03-13 2017-04-11 Lear Corporation Cold plate having separable flow directing baffle
US11732978B2 (en) 2016-04-18 2023-08-22 Qcip Holdings, Llc Laminated microchannel heat exchangers
US10504814B2 (en) 2016-09-13 2019-12-10 International Business Machines Corporation Variable pin fin construction to facilitate compliant cold plates
US10085362B2 (en) 2016-09-30 2018-09-25 International Business Machines Corporation Cold plate device for a two-phase cooling system
US10136550B2 (en) * 2016-09-30 2018-11-20 International Business Machines Corporation Cold plate device for a two-phase cooling system

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR990144A (en) 1944-03-06 1951-09-18 Laminar flow temperature exchanger device
NL80122C (en) 1948-07-24
US3404446A (en) 1965-10-24 1968-10-08 Peerless Of America Method of securing fins in a heat exchanger
GB1334173A (en) 1971-06-02 1973-10-17 Redpoint Ltd Twisted vane heat sink
CA1026013A (en) 1975-03-17 1978-02-07 Everett C. Elgar Heat sink
DE2531450A1 (en) 1975-07-14 1977-01-20 Siemens Ag Semiconductor element heat sink - is block shaped and has lateral cooling ribs divided into groups by transverse slot
FR2500610B1 (en) 1981-02-25 1986-05-02 Inst Francais Du Petrole PERFORATED PLATE HEAT EXCHANGER
SU1161810A1 (en) 1983-09-30 1985-06-15 Одесский Технологический Институт Холодильной Промышленности Plate-type heat exchanger package
US4593446A (en) * 1984-04-18 1986-06-10 Hayner Paul F Method of manufacturing a fluid flow restrictor
US4807342A (en) 1985-05-13 1989-02-28 The Laitram Corporation Method for making an improved heat exchanger
JP2708495B2 (en) 1988-09-19 1998-02-04 株式会社日立製作所 Semiconductor cooling device
US5058665A (en) * 1989-03-28 1991-10-22 Aisin Seiki Kabushiki Kaisha Stacked-plate type heat exchanger
GB8910241D0 (en) * 1989-05-04 1989-06-21 Secretary Trade Ind Brit Heat exchangers
DE4022654A1 (en) * 1990-07-17 1992-01-23 Hoechst Ag CARD OF CERAMIC MATERIAL FOR BUILDING PERMANENT STRUCTURES
JP3122173B2 (en) * 1990-11-09 2001-01-09 株式会社東芝 Heatsink, heatsink, and method of manufacturing heatsink
JPH04234153A (en) 1990-12-28 1992-08-21 Nec Corp Semiconductor package provided with heat sink
JPH0795636B2 (en) 1992-06-16 1995-10-11 昭和アルミニウム株式会社 Manufacturing method of radiator with pin fins
US5419041A (en) 1992-08-04 1995-05-30 Aqty Co., Ltd. Process for manufacturing a pin type radiating fin
JPH0674675A (en) 1992-08-31 1994-03-18 Toshiba Corp Laminate body heat exchanger and manufacture thereof
GB2270862B (en) 1992-09-24 1996-02-28 Imi Marston Ltd Heat sinks
FR2701554B1 (en) * 1993-02-12 1995-05-12 Transcal Heat exchanger for electronic components and electro-technical equipment.
EP0633608B1 (en) 1993-07-08 2000-10-11 Sumitomo Metal Industries, Ltd. Process for producing a pin-finned heat sink
US5447189A (en) 1993-12-16 1995-09-05 Mcintyre; Gerald L. Method of making heat sink having elliptical pins
US5930115A (en) 1996-08-26 1999-07-27 Compaq Computer Corp. Apparatus, method and system for thermal management of a semiconductor device
DE19710783C2 (en) * 1997-03-17 2003-08-21 Curamik Electronics Gmbh Coolers for use as a heat sink for electrical components or circuits
US6273186B1 (en) * 2000-03-13 2001-08-14 Satcon Technology Corporation Low-cost, high density, staggered pin fin array

Also Published As

Publication number Publication date
WO2001069158A1 (en) 2001-09-20
EP1261833A1 (en) 2002-12-04
US20010035285A1 (en) 2001-11-01
CA2400982A1 (en) 2001-09-20
US6634421B2 (en) 2003-10-21
JP2003527751A (en) 2003-09-16
KR20020086920A (en) 2002-11-20
EP1261833A4 (en) 2005-12-28

Similar Documents

Publication Publication Date Title
AU2001245588A1 (en) High performance cold plate for electronic cooling
EP1148547B8 (en) Coolant cooled type semiconductor device
AU2001267968A1 (en) Plate heat exchanger
AU2002345820A1 (en) Graphite-based thermal dissipation component
AU2002230971A1 (en) Temperature compensated magnetic circuit
AU2001280676A1 (en) High temperature circuit structures
AU2001270225A1 (en) High efficiency very-low temperature mixed refrigerant system with rapid cool down
AU2002215790A1 (en) Finned plate heat exchanger
AU2003298199A1 (en) Auxiliary cooling device
TW487293U (en) Cooling module with quick mounting capability
AU2641799A (en) Cooling device of electronic device
AU3940399A (en) Cooling cabinet
AU2002316430A1 (en) Cooler for electronic devices
AU2003221513A1 (en) Coolant condenser
AU2001234939A1 (en) Indirect evaporative cooling mechanism
AUPQ332199A0 (en) Heat exchanger for an electronic heat pump
AU2066801A (en) Cooler for electronic devices
EP1279801A3 (en) Engine cooling system
AU2001248956A1 (en) Device for cooling of heat-generating units
AU2001252473A1 (en) Cooling towers
AU2001246655A1 (en) Plate heat exchanger
AU2001290460A1 (en) Fastener for mounting objects on plates
AU4322400A (en) Computer cooling device
AU4848901A (en) Cooling device
AU2002349378A1 (en) Compact plate heat exchanger