GB1334173A - Twisted vane heat sink - Google Patents

Twisted vane heat sink

Info

Publication number
GB1334173A
GB1334173A GB1334173DA GB1334173A GB 1334173 A GB1334173 A GB 1334173A GB 1334173D A GB1334173D A GB 1334173DA GB 1334173 A GB1334173 A GB 1334173A
Authority
GB
United Kingdom
Prior art keywords
heat sink
fins
blank
edges
june
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
REDPOINT Ltd
Original Assignee
REDPOINT Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by REDPOINT Ltd filed Critical REDPOINT Ltd
Publication of GB1334173A publication Critical patent/GB1334173A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacture Of Motors, Generators (AREA)

Abstract

1334173 Bending cutters REDPOINT Ltd 1 June 1972 [2 June 1971] 18683/71 Heading B3W [Also in Division H1] The fins 2 of a heat sink for a semi-conductor device are formed by a series of slits along the edge of a metal blank and are simultaneously twisted to reduce the degree of cross-radiation between fins while minimizing the amount of metal removed from the heat sink. Preferably the fins 2 are then bent out of the plane of the blank, and as shown this may be done on two edges to provide a U-shaped heat sink. Fins 2 may similarly be provided on four or more edges of a heat sink, and two such sinks may be nested together. The fins are formed by placing the blank on two spaced dies having saw-toothed profiles and pressing a mating pair of dies down on to the blank to slit and twist its edges.
GB1334173D 1971-06-02 1971-06-02 Twisted vane heat sink Expired GB1334173A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1868371 1971-06-02

Publications (1)

Publication Number Publication Date
GB1334173A true GB1334173A (en) 1973-10-17

Family

ID=10116629

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1334173D Expired GB1334173A (en) 1971-06-02 1971-06-02 Twisted vane heat sink

Country Status (1)

Country Link
GB (1) GB1334173A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4095253A (en) * 1975-11-29 1978-06-13 Hitachi, Ltd. Single in-line high power resin-packaged semiconductor device having an improved heat dissipator
US4209798A (en) * 1976-10-21 1980-06-24 Sgs-Ates Componenti Elettronici S.P.A. Module for integrated circuits
US4345267A (en) * 1980-03-31 1982-08-17 Amp Incorporated Active device substrate connector having a heat sink
US4481525A (en) * 1982-08-12 1984-11-06 Anthony D. Calabro Heat dissipator for integrated circuit chips
GB2199775A (en) * 1987-01-15 1988-07-20 Marston Palmer Ltd Heat sink
US6273186B1 (en) 2000-03-13 2001-08-14 Satcon Technology Corporation Low-cost, high density, staggered pin fin array
US6634421B2 (en) 2000-03-10 2003-10-21 Satcon Technology Corporation High performance cold plate for electronic cooling
US7017655B2 (en) 2003-12-18 2006-03-28 Modine Manufacturing Co. Forced fluid heat sink
US7159649B2 (en) 2004-03-11 2007-01-09 Thermal Corp. Air-to-air heat exchanger

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4095253A (en) * 1975-11-29 1978-06-13 Hitachi, Ltd. Single in-line high power resin-packaged semiconductor device having an improved heat dissipator
US4209798A (en) * 1976-10-21 1980-06-24 Sgs-Ates Componenti Elettronici S.P.A. Module for integrated circuits
US4345267A (en) * 1980-03-31 1982-08-17 Amp Incorporated Active device substrate connector having a heat sink
US4481525A (en) * 1982-08-12 1984-11-06 Anthony D. Calabro Heat dissipator for integrated circuit chips
GB2199775A (en) * 1987-01-15 1988-07-20 Marston Palmer Ltd Heat sink
US6634421B2 (en) 2000-03-10 2003-10-21 Satcon Technology Corporation High performance cold plate for electronic cooling
US6273186B1 (en) 2000-03-13 2001-08-14 Satcon Technology Corporation Low-cost, high density, staggered pin fin array
US7017655B2 (en) 2003-12-18 2006-03-28 Modine Manufacturing Co. Forced fluid heat sink
US7159649B2 (en) 2004-03-11 2007-01-09 Thermal Corp. Air-to-air heat exchanger

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Legal Events

Date Code Title Description
PS Patent sealed
PE20 Patent expired after termination of 20 years