ZA879534B - A process for bonding non-transparent substrates and adhesive systems useable in this process - Google Patents

A process for bonding non-transparent substrates and adhesive systems useable in this process

Info

Publication number
ZA879534B
ZA879534B ZA879534A ZA879534A ZA879534B ZA 879534 B ZA879534 B ZA 879534B ZA 879534 A ZA879534 A ZA 879534A ZA 879534 A ZA879534 A ZA 879534A ZA 879534 B ZA879534 B ZA 879534B
Authority
ZA
South Africa
Prior art keywords
transparent substrates
adhesive systems
bonding non
systems useable
useable
Prior art date
Application number
ZA879534A
Other languages
English (en)
Inventor
Artiga Gonzalez Rene-Andres
Nicolaisen Heinz-Christian
Ruhnke Anja
Original Assignee
Henkel Kommanditgesellschaft Auf Aktien
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Kommanditgesellschaft Auf Aktien filed Critical Henkel Kommanditgesellschaft Auf Aktien
Publication of ZA879534B publication Critical patent/ZA879534B/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0012—Processes making use of the tackiness of the photolithographic materials, e.g. for mounting; Packaging for photolithographic material; Packages obtained by processing photolithographic materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
ZA879534A 1986-12-19 1987-12-18 A process for bonding non-transparent substrates and adhesive systems useable in this process ZA879534B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863643400 DE3643400A1 (de) 1986-12-19 1986-12-19 Verfahren zum kleben nichttransparenter substrate und dazu verwendbare klebesysteme

Publications (1)

Publication Number Publication Date
ZA879534B true ZA879534B (en) 1988-06-20

Family

ID=6316562

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA879534A ZA879534B (en) 1986-12-19 1987-12-18 A process for bonding non-transparent substrates and adhesive systems useable in this process

Country Status (4)

Country Link
EP (1) EP0272558A3 (fr)
JP (1) JPS63162779A (fr)
DE (1) DE3643400A1 (fr)
ZA (1) ZA879534B (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4539644B2 (ja) * 1993-07-29 2010-09-08 日立化成工業株式会社 回路接続材料とその接続材料を用いた回路の接続方法
JP4228652B2 (ja) * 1993-07-29 2009-02-25 日立化成工業株式会社 回路接続材料とその接続材料を用いた回路の接続方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4069054A (en) * 1975-09-02 1978-01-17 Minnesota Mining And Manufacturing Company Photopolymerizable composition containing a sensitized aromatic sulfonium compound and a cationacally polymerizable monomer
US4318766A (en) * 1975-09-02 1982-03-09 Minnesota Mining And Manufacturing Company Process of using photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials
US4356050A (en) * 1979-12-11 1982-10-26 General Electric Company Method of adhesive bonding using visible light cured epoxies
US4518676A (en) * 1982-09-18 1985-05-21 Ciba Geigy Corporation Photopolymerizable compositions containing diaryliodosyl salts

Also Published As

Publication number Publication date
DE3643400A1 (de) 1988-07-07
JPS63162779A (ja) 1988-07-06
EP0272558A2 (fr) 1988-06-29
EP0272558A3 (fr) 1990-02-21

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