ZA835093B - Thermoplastic-modified epoxy resin systems - Google Patents
Thermoplastic-modified epoxy resin systemsInfo
- Publication number
- ZA835093B ZA835093B ZA835093A ZA835093A ZA835093B ZA 835093 B ZA835093 B ZA 835093B ZA 835093 A ZA835093 A ZA 835093A ZA 835093 A ZA835093 A ZA 835093A ZA 835093 B ZA835093 B ZA 835093B
- Authority
- ZA
- South Africa
- Prior art keywords
- thermoplastic
- epoxy resin
- modified epoxy
- resin systems
- systems
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US39796382A | 1982-07-14 | 1982-07-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
ZA835093B true ZA835093B (en) | 1984-04-25 |
Family
ID=23573423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ZA835093A ZA835093B (en) | 1982-07-14 | 1983-07-13 | Thermoplastic-modified epoxy resin systems |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0099338B1 (en) |
JP (1) | JPS5927916A (en) |
AU (1) | AU1680683A (en) |
BR (1) | BR8303755A (en) |
DE (1) | DE3363507D1 (en) |
IL (1) | IL69209A (en) |
ZA (1) | ZA835093B (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5936156A (en) * | 1982-08-23 | 1984-02-28 | Toray Ind Inc | Thermoplastic resin composition |
EP0159482A3 (en) * | 1984-03-28 | 1987-02-25 | American Cyanamid Company | Resin matrix composites with controlled flow and tack |
US4892901A (en) * | 1987-12-31 | 1990-01-09 | General Electric Company | Polyetherimide ester elastomer |
JPH0234656A (en) * | 1988-07-23 | 1990-02-05 | Matsushita Electric Works Ltd | Molding resin material for sealing |
US5242748A (en) * | 1989-01-04 | 1993-09-07 | Basf Aktiengesellschaft | Toughened thermosetting structural materials |
JP2643518B2 (en) * | 1989-02-10 | 1997-08-20 | 東レ株式会社 | Prepreg |
ATE151098T1 (en) * | 1989-08-10 | 1997-04-15 | Fiberite Inc | EPOXY MATTRICE HARDENED WITH POLYIMIDE THERMOPLASTIC RESIN |
US5108825A (en) * | 1989-12-21 | 1992-04-28 | General Electric Company | Epoxy/polyimide copolymer blend dielectric and layered circuits incorporating it |
JP3415144B2 (en) * | 1989-12-21 | 2003-06-09 | ロックヒード マーティン コーポレーション | Epoxy / polyimide copolymer blend dielectric and multilayer circuit using the same |
JP2689709B2 (en) * | 1990-09-17 | 1997-12-10 | ヤマハ株式会社 | Electronic musical instrument |
ES2127803T3 (en) * | 1992-08-11 | 1999-05-01 | Hexcel Corp | THERMOSTABLE RESINS HARDENED WITH SULPHONE POLYMERS. |
JPH06202628A (en) * | 1993-06-01 | 1994-07-22 | Casio Comput Co Ltd | Acoustic signal modulating device |
KR100412080B1 (en) * | 1996-07-08 | 2004-05-24 | 삼성에스디아이 주식회사 | Compound for forming orientation film of lcd |
DE19932274A1 (en) | 1999-07-05 | 2001-01-18 | Inst Polymerforschung Dresden | Fiber composite material and process for its manufacture |
JP4732001B2 (en) * | 2005-05-26 | 2011-07-27 | 株式会社タムラ製作所 | Thermosetting resin composition for buildup substrate interlayer insulation material, resin film, product with film, and interlayer insulation material for buildup substrate |
JP7176551B2 (en) * | 2020-07-28 | 2022-11-22 | 味の素株式会社 | Resin composition, adhesive film, prepreg, printed wiring board and semiconductor device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3856752A (en) * | 1973-10-01 | 1974-12-24 | Ciba Geigy Corp | Soluble polyimides derived from phenylindane diamines and dianhydrides |
US4118535A (en) * | 1975-11-03 | 1978-10-03 | General Electric Company | Novel polyetheramide-imide epoxy resin blends |
DE2900560A1 (en) * | 1979-01-09 | 1980-07-17 | Bayer Ag | MIXTURES OF POLYAMIDIMIDE RESINS AND EPOXY COMPOUNDS |
US4277583A (en) * | 1979-12-03 | 1981-07-07 | Plastics Engineering Company | Oxirane polyimide copolymers |
-
1983
- 1983-07-08 DE DE8383810313T patent/DE3363507D1/en not_active Expired
- 1983-07-08 EP EP83810313A patent/EP0099338B1/en not_active Expired
- 1983-07-12 IL IL69209A patent/IL69209A/en unknown
- 1983-07-13 ZA ZA835093A patent/ZA835093B/en unknown
- 1983-07-13 AU AU16806/83A patent/AU1680683A/en not_active Abandoned
- 1983-07-13 BR BR8303755A patent/BR8303755A/en unknown
- 1983-07-14 JP JP58128698A patent/JPS5927916A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
AU1680683A (en) | 1984-01-19 |
JPS5927916A (en) | 1984-02-14 |
IL69209A (en) | 1986-12-31 |
DE3363507D1 (en) | 1986-06-19 |
EP0099338A1 (en) | 1984-01-25 |
IL69209A0 (en) | 1983-11-30 |
EP0099338B1 (en) | 1986-05-14 |
BR8303755A (en) | 1984-02-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB2121045B (en) | Epoxy resin composition | |
GB2131440B (en) | Thermoplastic resin compostion | |
DE3361897D1 (en) | Preextension catalysts for epoxy resins | |
GB8301930D0 (en) | Epoxy resin | |
GB8408124D0 (en) | Preparing epoxy resins | |
DE3367399D1 (en) | Epoxy resin composition | |
GB2055108B (en) | Epoxy resin-polyisocyanate resin system | |
GB8403917D0 (en) | Curing agents for epoxy resins | |
ZA835093B (en) | Thermoplastic-modified epoxy resin systems | |
GB8306758D0 (en) | Thermosetting resin composition | |
GB8401586D0 (en) | Epoxy resins | |
GB8431315D0 (en) | Epoxy resins | |
EP0138209A3 (en) | Epoxy resin composition | |
ZA837244B (en) | Synthetic resin lens system | |
DE3362453D1 (en) | Heat-curable epoxy resin mixtures | |
DE3270282D1 (en) | Solid epoxide resin | |
DE3364191D1 (en) | Epoxy resin composition | |
GB8322029D0 (en) | Hydrolyzing epoxy resins | |
DE3464056D1 (en) | Curable epoxy resins | |
GB8306014D0 (en) | Epoxy resin derivatives | |
GB2115424B (en) | Adhesive epoxy resin composition | |
DE3265840D1 (en) | Epoxy resin composition | |
GB2092594B (en) | Transparencies produced from epoxy resins | |
GB8404583D0 (en) | Resin for lens | |
GB8313297D0 (en) | Flexibilising epoxy resins |