ZA721403B - A method of bonding an elastomer layer to a substrate,and means for carrying this method into practice - Google Patents

A method of bonding an elastomer layer to a substrate,and means for carrying this method into practice

Info

Publication number
ZA721403B
ZA721403B ZA721403A ZA721403A ZA721403B ZA 721403 B ZA721403 B ZA 721403B ZA 721403 A ZA721403 A ZA 721403A ZA 721403 A ZA721403 A ZA 721403A ZA 721403 B ZA721403 B ZA 721403B
Authority
ZA
South Africa
Prior art keywords
bonding
practice
substrate
carrying
elastomer layer
Prior art date
Application number
ZA721403A
Other languages
English (en)
Inventor
B Persson
Original Assignee
Trelleborgs Gummifabriks Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trelleborgs Gummifabriks Ab filed Critical Trelleborgs Gummifabriks Ab
Publication of ZA721403B publication Critical patent/ZA721403B/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/022—Mechanical pre-treatments, e.g. reshaping
    • B29C66/0224—Mechanical pre-treatments, e.g. reshaping with removal of material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
ZA721403A 1971-03-12 1972-03-01 A method of bonding an elastomer layer to a substrate,and means for carrying this method into practice ZA721403B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE03183/71A SE350435B (Direct) 1971-03-12 1971-03-12

Publications (1)

Publication Number Publication Date
ZA721403B true ZA721403B (en) 1972-11-29

Family

ID=20261565

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA721403A ZA721403B (en) 1971-03-12 1972-03-01 A method of bonding an elastomer layer to a substrate,and means for carrying this method into practice

Country Status (3)

Country Link
BR (1) BR7201385D0 (Direct)
SE (1) SE350435B (Direct)
ZA (1) ZA721403B (Direct)

Also Published As

Publication number Publication date
SE350435B (Direct) 1972-10-30
BR7201385D0 (pt) 1973-06-14

Similar Documents

Publication Publication Date Title
CA968675A (en) Method of making a semiconductor device
CA964011A (en) Method and apparatus for bonding workpieces
AU4142672A (en) Method of providing internal connections in a semi-conductor device
ZA726203B (en) Peeling machine and method
CA991332A (en) Process for applying and bonding conductor material to substrate
CA971112A (en) Method and apparatus for thin layer chromatography
CA955832A (en) Method of forming semiconductor device with smooth flat surface
GB1374792A (en) Method for surface coating
ZA727392B (en) Thin layer semiconductor device
CS180630B2 (en) Magnetogram layer carrier and method of manufacturing thereof
CA983788A (en) Method of encapsulation by coacervation and the substances obtained
CA948075A (en) Method of depositing a layer of semiconductor material
ZA721403B (en) A method of bonding an elastomer layer to a substrate,and means for carrying this method into practice
CA999224A (en) Methods and means for bonding an elastomer layer to a substrate
AU481368B2 (en) A method of bonding an elastomer layer toa substrate, and means for carrying this method into practice
ZA718560B (en) Method for bonding materials to polyolefin hydrocarbons
AU3983972A (en) A method of bonding an elastomer layer toa substrate, and means for carrying this method into practice
CA977623A (en) Apparatus and method for bonding adhesive seams on can bodies
CA954471A (en) Method of metallizing devices
CA879387A (en) Method of providing a layer of gold on a substrate
CA966040A (en) Method of forming an epitaxial semiconductor layer with smooth surface
AU469642B2 (en) Method of manufacturing a semiconductor device and semiconductor device manufactured by using said method
CA871662A (en) Method of bonding
CA871895A (en) Bonding apparatus and method
ZA722603B (en) Bonding method