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Application filed by Ngk Insulators LtdfiledCriticalNgk Insulators Ltd
Publication of ZA200107112BpublicationCriticalpatent/ZA200107112B/en
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
H01L2224/732—Location after the connecting process
H01L2224/73201—Location after the connecting process on the same surface
H01L2224/73203—Bump and layer connectors
H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
ZA200107112A2002-01-172001-08-28Honeycomb structure and method for manufacture thereof.
ZA200107112B
(en)