WO2025246789A1 - 显示模组及其制作方法、显示装置 - Google Patents

显示模组及其制作方法、显示装置

Info

Publication number
WO2025246789A1
WO2025246789A1 PCT/CN2025/092323 CN2025092323W WO2025246789A1 WO 2025246789 A1 WO2025246789 A1 WO 2025246789A1 CN 2025092323 W CN2025092323 W CN 2025092323W WO 2025246789 A1 WO2025246789 A1 WO 2025246789A1
Authority
WO
WIPO (PCT)
Prior art keywords
display
cover plate
layer
heat
display module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2025/092323
Other languages
English (en)
French (fr)
Inventor
梁海涛
王涛
范荣坤
王家林
曾飞
孟雪
蒲强
孟永松
周伟
林梁东
甘宇
张旭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Beijing BOE Technology Development Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Beijing BOE Technology Development Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd, Beijing BOE Technology Development Co Ltd filed Critical BOE Technology Group Co Ltd
Publication of WO2025246789A1 publication Critical patent/WO2025246789A1/zh
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/87—Arrangements for heating or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • This disclosure relates to the field of display technology, specifically to a display module and its manufacturing method, and a display device.
  • a composite heat dissipation layer is typically provided on the backlight side of the display substrate.
  • the heat dissipation effect at the edges of the display substrate in display modules is relatively poor.
  • This disclosure aims to solve at least one of the technical problems existing in the prior art, and proposes a display module and its manufacturing method, as well as a display device.
  • this disclosure provides a display module, including:
  • a display substrate and a cover plate are disposed opposite to each other;
  • the display substrate includes a display portion, the display portion including a display surface facing the cover plate, a non-display surface facing away from the cover plate, and a side surface connecting the display surface and the non-display surface;
  • a thermally conductive layer comprising a first thermally conductive portion and a second thermally conductive portion, wherein the first thermally conductive portion is located on the side of the display unit opposite to the cover plate, and the orthographic projection of the first thermally conductive portion on the cover plate covers the orthographic projection of the display unit on the cover plate; at least a portion of the second thermally conductive portion is disposed opposite to at least a portion of the side surface of the display unit; and
  • An electromagnetic shielding layer is located on the side of the thermally conductive layer opposite to the cover plate.
  • the orthographic projection of the electromagnetic shielding layer on the cover plate covers the orthographic projection of the first heat-conducting part on the cover plate.
  • the orthographic projection of the second heat-conducting part on the cover plate is located outside the orthographic projection of the display part on the cover plate, and the width of the second heat-conducting part is between 50 and 100 micrometers.
  • the cover plate includes a main body region disposed opposite to the heat-conducting layer and an edge region surrounding the main body region;
  • the display module also includes an edge sealing adhesive, which comprises a first part and a second part.
  • the first part is located on the side of the electromagnetic shielding layer away from the cover plate, and the second part is located in the edge area and surrounds the display substrate, the electromagnetic shielding layer and the thermal conductive layer.
  • the display module further includes a frame, the frame including a retaining wall portion and a supporting portion, the supporting portion being located on the side of the edge sealant away from the cover plate and bonded to the edge sealant; the retaining wall portion surrounding the edge sealant and the cover plate and bonded to the edge sealant and the cover plate.
  • the orthographic projection of the sealing adhesive on the cover plate is annular, and the distance between its outer edge and the orthographic projection of the display substrate on the cover plate is between 0.4 and 0.6 mm.
  • the thickness of the first portion is between 0.2 and 0.3 mm.
  • the display substrate is a rigid display substrate, wherein at least a portion of the second heat-conducting portion is disposed opposite to all sides of the display portion.
  • the display module further includes a back film located between the thermally conductive layer and the display portion.
  • the display substrate is a flexible display substrate, and the display substrate further includes a driving portion and a bent portion connected between the driving portion and the display portion, the driving portion being located on the side of the electromagnetic shielding layer opposite to the cover plate.
  • At least a portion of the second heat-conducting portion is disposed opposite to all the other sides of the display portion except for the side where the curved portion is located.
  • the display module further includes: a back film disposed between the thermally conductive layer and the display portion, and between the electromagnetic shielding layer and the driving portion.
  • this disclosure also provides a method for manufacturing a display module, including:
  • the display substrate includes a display portion, which includes a display surface facing the cover plate, a non-display surface facing away from the cover plate, and a side surface connecting the display surface and the non-display surface.
  • a heat-conducting layer is formed, the heat-conducting layer including a first heat-conducting part and a second heat-conducting part, the first heat-conducting part being located on the side of the display part away from the cover plate, and the orthographic projection of the first heat-conducting part on the cover plate covering the orthographic projection of the display part on the cover plate; at least a portion of the second heat-conducting part is disposed opposite to at least a portion of the side surface of the display part;
  • An electromagnetic shielding layer is formed on the side of the heat-conducting layer away from the cover plate, and the first heat-conducting part and the second heat-conducting part are integrally formed.
  • both the thermally conductive layer and the electromagnetic shielding layer are formed using a printing process.
  • the cover plate includes a main body region disposed opposite to the heat-conducting layer and an edge region surrounding the main body region; the manufacturing method further includes:
  • An edge sealing adhesive is formed, comprising a first part and a second part.
  • the first part is located on the side of the electromagnetic shielding layer away from the cover plate, and the second part is located in the edge area and surrounds the display substrate, the electromagnetic shielding layer and the thermal conductive layer.
  • the edge-sealing adhesive is formed by a printing process.
  • the manufacturing method further includes:
  • a frame is provided, the frame including a retaining wall portion and a load-bearing portion;
  • the supporting part is disposed on the side of the edge sealant away from the cover plate, the retaining wall part is disposed around the edge sealant and the cover plate, and the supporting part is bonded to the edge sealant, and the retaining wall part is bonded to the edge sealant and the cover plate.
  • first part and the second part are integrally formed, and the retaining wall part and the load-bearing part are integrally formed.
  • this disclosure also provides a display device including the aforementioned display module.
  • Figure 1 is a schematic diagram of a display module provided in some embodiments.
  • Figure 2 is a schematic diagram of a display module provided in some other embodiments.
  • Figure 3 is a plan view of the display substrate and cover plate in the display module provided in some embodiments of this disclosure.
  • Figure 4 is a cross-sectional view of a display module provided in some embodiments of this disclosure.
  • Figure 5 is a planar schematic diagram of the display substrate, cover plate and frame in a display module provided in some other embodiments of this disclosure.
  • Figure 6 is a cross-sectional view of a display module provided in some other embodiments of this disclosure.
  • Figure 7 is another cross-sectional view of the display module provided in some other embodiments of this disclosure.
  • Figure 8 is a cross-sectional view of a display module provided in some embodiments of this disclosure.
  • Figure 9 is another cross-sectional view of the display module provided in some embodiments of this disclosure.
  • Figure 10 is a schematic diagram of a display section provided in some embodiments of this disclosure.
  • Figure 11 is a schematic diagram of the manufacturing process of the display module provided in some embodiments of this disclosure.
  • parallel and perpendicular include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system).
  • parallel includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°
  • perpendicular includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°.
  • a layer or element when referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.
  • FIG. 1 is a schematic diagram of a display module provided in some embodiments
  • Figure 2 is a schematic diagram of a display module provided in other embodiments.
  • the display module includes a display substrate 10, a cover plate 20, a heat dissipation layer, and a frame 40.
  • the cover plate 20 is disposed on the light-emitting side of the display substrate 10
  • the heat dissipation layer is disposed on the backlight side of the display substrate 10
  • the frame 40 is connected to the edge of the cover plate 20 and surrounds the display substrate 10.
  • the heat dissipation layer includes a first adhesive layer 31, a flexible buffer layer 32, and a metal layer 33 sequentially disposed along a direction away from the display substrate 10.
  • the thickness of the first adhesive layer 31 is between 20 and 40 micrometers, for example, 30 micrometers; the thickness of the flexible buffer layer 32 is between 80 and 120 micrometers, for example, 100 micrometers; and the thickness of the metal layer 33 is between 20 and 40 micrometers, for example, 30 micrometers.
  • the heat dissipation layer includes a second adhesive layer 34 and a metal layer 33 sequentially disposed along a direction away from the display substrate 10.
  • the thickness of the second adhesive layer 34 is between 120 and 140 micrometers, such as 130 micrometers; the thickness of the metal layer 33 is between 20 and 40 micrometers, such as 30 micrometers.
  • the metal layer 33 can be made of copper.
  • the heat dissipation layer can dissipate heat from the display substrate 10, and the metal layer 33 can be grounded, thereby providing electromagnetic shielding and reducing the influence of external static electricity on the display substrate 10.
  • the heat dissipation layer is obtained by die-cutting a whole heat dissipation film and then bonding the die-cut heat dissipation layer to the display substrate 10. Due to tolerances in both the die-cutting and bonding processes, a certain distance d1 needs to be maintained between the edge of the heat dissipation layer and the edge of the display substrate 10 during the design process. For example, d1 is between 0.25 and 0.4 mm; the distance d2 between the edge of the display substrate 10 and the edge of the cover plate 20 is between 0.8 and 1.2 mm. This results in poor heat dissipation and electromagnetic shielding effects in the edge area of the display substrate 10.
  • Figure 3 is a plan view of the display substrate and cover plate in a display module provided in some embodiments of this disclosure
  • Figure 4 is a cross-sectional view of the display module provided in some embodiments of this disclosure
  • Figure 4 is a cross-sectional view of the display module shown in Figure 3 along the A-A' section line.
  • the display module includes: a display substrate 10, a cover plate 20, a thermally conductive layer 50, and an electromagnetic shielding layer 60.
  • the display substrate 10 includes a display portion 101 for displaying an image.
  • the display portion 101 and the cover plate 20 are disposed opposite to each other and fixedly connected.
  • the display portion 101 includes a display surface facing the cover plate 20, a non-display surface facing away from the cover plate 20, and a side surface connecting the display surface and the non-display surface.
  • the display substrate 10 can be a rigid display substrate, in which case the entire display substrate 10 can serve as the display portion 101; or, the display substrate 10 can be a flexible display substrate, with a portion bent to the backlight side. In this case, the display substrate 10 includes other parts besides the display portion 101, which will be described in detail below.
  • the heat-conducting layer 50 includes a first heat-conducting part 51 and a second heat-conducting part 52.
  • the first heat-conducting part 51 is located on the side of the display part away from the cover plate 20, and the orthographic projection of the first heat-conducting part 51 on the cover plate 20 covers the orthographic projection of the display part 101 on the cover plate 20.
  • At least a portion of the second heat-conducting part 52 is disposed opposite to the side of the display part 101.
  • "distributed opposite" means that the two components are disposed face to face and in contact with or joined together.
  • the heat generated by the display substrate 10 can be dissipated through the thermal conductive layer 50 and the electromagnetic shielding layer 60.
  • the first thermal conductive part 51 of the thermal conductive layer 50 covers the display part 101, thereby dissipating heat from the entire area of the display part 101; and the second thermal conductive part 52 is disposed opposite to the side of the display part 101, thereby dissipating heat from the side of the display part 101, thereby improving the heat dissipation effect of the display substrate.
  • the thermally conductive layer 50 can be made of silicone material. Specifically, the silicone material can be printed using a printing process and then cured to form the thermally conductive layer 50. This method makes it easier to control the local thickness of the thermally conductive layer 50, thereby meeting the diverse needs of the product. For example, when the display module is used in a mobile phone or tablet computer, the thickness of the thermally conductive layer 50 can be smaller at the location of the camera.
  • the thickness of the first thermally conductive portion 51 of the thermally conductive layer 50 is between 50 and 100 micrometers, thereby ensuring thermal conductivity while preventing the display module from becoming too thick, which is beneficial for the thinner and lighter design of the display product.
  • the thickness of the first thermally conductive portion 51 is 50 micrometers, or 60 micrometers, or 70 micrometers, or 80 micrometers, or 90 micrometers, or 100 micrometers.
  • the orthographic projection of the second heat-conducting portion 52 on the cover plate 20 is outside the orthographic projection of the display portion 101 on the cover plate 20.
  • the second heat-conducting portion 52 can be a ring structure surrounding the display portion 101, thereby improving the heat conduction effect of the heat-conducting layer 50.
  • the second heat-conducting portion 52 can be provided on the remaining sides of the display substrate 10.
  • the width W of the second heat-conducting portion 52 is between 50 and 100 micrometers, thereby ensuring that the heat-conducting layer 50 can cover all areas of the display substrate 10 under the condition of process tolerance, so as to ensure the heat conduction effect of the heat-conducting layer 50 on the display substrate 10.
  • the width W of the second heat-conducting portion 52 is 50 micrometers, or 60 micrometers, or 70 micrometers, or 80 micrometers, or 90 micrometers, or 100 micrometers.
  • the orthographic projection of the electromagnetic shielding layer 60 on the cover plate 20 overlaps with the orthographic projection of the first heat-conducting part 51 on the cover plate 20, thereby ensuring electromagnetic shielding effect over the entire area of the display substrate 10.
  • the orthographic projection of the electromagnetic shielding layer 60 on the cover plate 20 overlaps with the orthographic projection of the second heat-conducting part 52 on the cover plate 20.
  • the orthographic projections of the electromagnetic shielding layer 60 and the heat-conducting layer 50 on the cover plate 20 coincide or substantially coincide.
  • the electromagnetic shielding layer 60 can be made of a material with good thermal and electrical conductivity, such as silver.
  • the thickness of the electromagnetic shielding layer 60 is between 5 and 10 micrometers, for example, the thickness can be 5 micrometers, 7 micrometers, 9 micrometers, or 10 micrometers.
  • the cover plate 20 includes a main body region 21 disposed opposite to the heat-conducting layer 50 and the display substrate 10, and an edge region 22 surrounding the main body region 21.
  • the display module also includes an edge sealing adhesive 70, which includes a first portion 71 and a second portion 72.
  • the first portion 71 and the second portion 72 are connected as an integral structure.
  • the first portion 71 is located on the side of the electromagnetic shielding layer 60 away from the cover plate 20, wherein the edge sealing adhesive 70 on the side of the electromagnetic shielding layer 60 away from the cover plate 20 can serve as the first portion 71.
  • the second portion 72 is located in the edge region 22 and surrounds the display substrate 10, the electromagnetic shielding layer 60, and the heat-conducting layer 50.
  • the edge sealing adhesive 70 when the display product is subjected to external impact, the pressure of the structure on the back side of the display substrate 10 on the display substrate 10 can be buffered, thus providing a protective effect; and it can also reduce the entry of external moisture into the interior of the display substrate 10, thereby improving the reliability of the display substrate 10.
  • the thickness D of the first portion 71 of the sealing adhesive 70 is between 0.2 and 0.3 mm, thereby ensuring the protective effect of the sealing adhesive 70 on the display substrate 10 while preventing the display module from becoming too thick, which is beneficial for the thinner and lighter design of the display product.
  • the thickness of the first portion 71 can be 0.2 mm, 0.25 mm, or 0.3 mm.
  • the surface of the first portion 71 facing away from the cover plate 20 can be non-planar, and the thickness of the first portion 71 refers to the maximum thickness of the first portion 71.
  • the orthographic projection of the sealing adhesive 70 on the cover plate 20 is annular, and the distance d between the outer edge of the orthographic projection of the sealing adhesive 70 and the orthographic projection of the display substrate 10 on the cover plate 20 is between 0.4 and 0.6 mm, thereby improving the sealing and protection effect on the display substrate 10.
  • d can be 0.4 mm, 0.45 mm, 0.5 mm, 0.55 mm, or 0.6 mm.
  • the edge banding adhesive 70 can be an acrylic material.
  • Figure 5 is a plan view of the display substrate, cover plate, and frame in a display module provided in some other embodiments of this disclosure.
  • Figure 6 is a cross-sectional view of the display module provided in some other embodiments of this disclosure.
  • Figure 7 is another cross-sectional view of the display module provided in some other embodiments of this disclosure.
  • Figure 6 is a cross-sectional view of the display module shown in Figure 5 along the B-B' section line.
  • Figure 7 is a cross-sectional view of the display module shown in Figure 5 along the C-C' section line.
  • the display module may further include a frame 40, which is connected to the cover plate 20 and the edge sealing adhesive 70.
  • the frame 40 may include a retaining wall portion 42 and a supporting portion 41.
  • the retaining wall portion 42 and the supporting portion 41 are connected as an integral structure.
  • the supporting portion 41 is located on the side of the edge sealing adhesive 70 away from the cover plate 20 and is bonded to the edge sealing adhesive 70.
  • the retaining wall portion 42 is disposed around the edge sealing adhesive 70 and the cover plate 20 and is bonded to the edge sealing adhesive 70 and the cover plate 20.
  • adhesive 83 is provided between the bearing part 41 and the edge sealant 70, between the retaining wall part 42 and the edge sealant 70, and between the retaining wall part 42 and the side of the cover plate 20.
  • the edge sealing adhesive 70 is not provided in the display module (as shown in Figures 1 and 2), the distance between the bezel 40 and the display substrate 10 will be reduced, and the support part 41 may even squeeze the display substrate 10.
  • the edge sealing adhesive 70 is provided between the display substrate 10 and the bezel 40, the pressure on the bezel 40 will not act on the display substrate 10 due to the spacing and buffering effect of the edge sealing adhesive 70, which is beneficial to the realization of the narrow bezel 40.
  • the bezel 40 is bonded to the side of the cover plate 20 and the surface of the cover plate 20 facing the display substrate 10.
  • the bezel 40 is bonded to the side of the cover plate 20, the side of the edge sealing adhesive 70, and the surface of the edge sealing adhesive 70 away from the cover plate 20.
  • the bonding area of the bezel 40 in Figures 6 and 7 is longer, which can extend the path for external moisture to enter the display module and improve the sealing performance of the display module.
  • the edge sealing adhesive 70 includes a first surface facing the retaining wall portion 42 and a second surface facing the supporting portion 41. At least one of the first and second surfaces is a curved surface, thereby further extending the path for external moisture to enter the display module and further improving the sealing performance of the display module.
  • the curved surface can be a convex surface, a concave surface, a free-form surface, or a wavy surface with multiple protrusions and/or multiple recesses.
  • at least one of the first and second surfaces has multiple protrusions and/or multiple recesses, thereby improving the connection stability between the edge sealing adhesive 70 and the frame 40 while simultaneously improving the sealing performance of the display module.
  • the display substrate 10 is a flexible display substrate, which, in addition to the display section 101, also includes a driving section 103 and a bent section 102 connecting the driving section 103 and the display section 101.
  • the display section 101 includes a substrate and structures such as a driving circuit layer and a light-emitting structure layer disposed on the substrate.
  • the bent section 102 includes a substrate and connecting lines disposed on the substrate.
  • the driving section 103 is located on the side of the electromagnetic shielding layer 60 away from the cover plate 20, and the driving section 103 includes a substrate and pads disposed on the substrate. The pads are used to connect the flexible circuit board, thereby providing driving signals to the display section 101 for image display.
  • the thermally conductive layer 50 can cover the three sides of the display portion 101, while the second portion 72 of the sealing adhesive 70 can still surround the display substrate 10, the thermally conductive layer 50, and the electromagnetic shielding layer 60.
  • a portion of the second portion 72 is located inside the bending portion 102, and a portion is located outside the bending portion 102.
  • Figure 8 is a cross-sectional view of a display module provided in some embodiments of the present disclosure
  • Figure 9 is another cross-sectional view of a display module provided in some embodiments of the present disclosure
  • Figure 8 is a cross-sectional view of the display module shown in Figure 5 along the B-B' section line
  • Figure 9 is a cross-sectional view of the display module shown in Figure 5 along the C-C' section line.
  • the display modules shown in Figures 8 and 9 are similar to those in Figures 6 and 7, except that in Figures 8 and 9, the display module also includes a back film 90.
  • the back film 90 is provided between the thermally conductive adhesive and the display part 101, and between the electromagnetic shielding layer 60 and the driving part 103, thereby supporting the display substrate 10.
  • FIG 10 is a schematic diagram of a display unit provided in some embodiments of this disclosure.
  • the display substrate 10 can be an OLED display substrate, and the display unit 101 includes a driving circuit layer 12 disposed on a substrate 11, a light-emitting structure layer 13 disposed on the driving circuit layer 12, and an encapsulation layer 14 disposed on the light-emitting structure layer 13.
  • the display substrate 10 may include other film layers, which are not limited herein.
  • the substrate 11 may be a flexible substrate or a rigid substrate.
  • the flexible substrate may include a first flexible material layer, a first inorganic material layer, a semiconductor layer, a second flexible material layer, and a second inorganic material layer stacked together.
  • the materials of the first and second flexible material layers may be polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer film, etc.
  • the materials of the first and second inorganic material layers may be silicon nitride (SiNx) or silicon oxide (SiOx), etc., to improve the substrate's resistance to water and oxygen.
  • the material of the semiconductor layer may be amorphous silicon (a-Si).
  • the driving circuit layer 12 may include transistors and storage capacitors constituting pixel circuits.
  • FIG10 shows only one transistor and one storage capacitor in each pixel circuit.
  • the transistor includes an active layer 122, a gate electrode 121, a source electrode 123, and a drain electrode 124.
  • the driving circuit layer 12 of each sub-pixel may include: a buffer layer BFL disposed on a substrate 11, an active layer 122 disposed on the buffer layer BFL, a first gate insulating layer GI1 covering the active layer 122, a gate electrode 121 and a first capacitor electrode 125 disposed on the first gate insulating layer GI1, a second gate insulating layer GI2 covering the gate electrode 121 and the first capacitor electrode 125, a second capacitor electrode 126 disposed on the second gate insulating layer GI2, and an interlayer insulating layer ILD covering the second capacitor electrode 126.
  • a via is formed in the interlayer insulating layer ILD, and the via exposes the active layer 122.
  • Source electrode 123 and drain electrode 124 are disposed on the interlayer insulating layer (ILD), and are connected to the active layer 122 via vias.
  • a planarization layer (PLN) is located on the side of the source electrode 123 and drain electrode 124 away from the substrate 11.
  • a first capacitor electrode 125 and a second capacitor electrode 126 form a storage capacitor.
  • the buffer layer (BFL), the first gate insulating layer (GI1), the second gate insulating layer (GI2), and the interlayer insulating layer (ILD) can be any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and can be a single layer, multiple layers, or a composite layer.
  • the gate electrode 121, source electrode 123, drain electrode 124, first capacitor electrode 125, and second capacitor electrode 126 can be made of metallic materials, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or alloys of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb). They can be single-layer structures or multi-layer composite structures, such as Ti/Al/Ti.
  • the active layer 122 can be made of amorphous indium gallium zinc oxide (a-IGZO), zinc oxynitride (ZnON), indium zinc tin oxide (IZTO), amorphous silicon (a-Si), polycrystalline silicon (p-Si), hexathiophene, or polythiophene, etc. That is, this disclosure applies to transistors manufactured based on oxide technology, silicon technology, or organic technology.
  • a-IGZO amorphous indium gallium zinc oxide
  • ZnON zinc oxynitride
  • IZTO indium zinc tin oxide
  • a-Si amorphous silicon
  • p-Si polycrystalline silicon
  • hexathiophene hexathiophene
  • polythiophene etc. That is, this disclosure applies to transistors manufactured based on oxide technology, silicon technology, or organic technology.
  • the active layer 122 based on oxide technology can be an oxide containing indium and tin, an oxide containing tungsten and indium, an oxide containing tungsten, indium and zinc, an oxide containing titanium and indium, an oxide containing titanium, indium and tin, an oxide containing indium and zinc, an oxide containing silicon, indium and tin, an oxide containing indium, gallium and zinc, etc.
  • the light-emitting structure layer 13 may include an anode 131, a pixel definition layer PDL, an organic light-emitting layer 133, and a cathode 132.
  • the anode 131 is disposed on a planarization layer PLN and is connected to a drain electrode 124 through a via formed in the planarization layer PLN.
  • the pixel definition layer PDL is disposed on the anode 131 and the planarization layer PLN, and has a pixel opening that exposes the anode 131.
  • the organic light-emitting layer 133 is disposed within the pixel opening, and the cathode 132 is disposed on the organic light-emitting layer 133.
  • the organic light-emitting layer 133 emits light of a corresponding color under the action of a voltage applied to the anode 131 and the cathode 132.
  • the organic light-emitting layer 133 may include at least a stacked hole injection layer (HIL), hole transport layer (HTL), emission layer (EML), electron transport layer (ETL), and electron injection layer (EIL).
  • HIL hole injection layer
  • HTL hole transport layer
  • EML emission layer
  • ETL electron transport layer
  • EIL electron injection layer
  • the hole injection layer and hole transport layer may be collectively referred to as the hole layer
  • the electron transport layer and electron injection layer may be collectively referred to as the electron layer.
  • the encapsulation layer 14 may include a first encapsulation layer 141, a second encapsulation layer 142, and a third encapsulation layer 143 stacked together.
  • the first encapsulation layer 141 and the third encapsulation layer 143 may be made of inorganic materials, while the second encapsulation layer 142 may be made of organic materials.
  • the second encapsulation layer 142 is disposed between the first encapsulation layer 141 and the third encapsulation layer 143, which can ensure that external moisture cannot enter the light-emitting structure layer 13.
  • This disclosure also provides a method for manufacturing a display module, including:
  • Step S10 The display substrate and the cover plate are arranged opposite to each other.
  • the display substrate includes a display part, which includes a display surface facing the cover plate, a non-display surface facing away from the cover plate, and a side surface connecting the display surface and the non-display surface.
  • Step S20 Form a heat-conducting layer.
  • the heat-conducting layer includes a first heat-conducting part and a second heat-conducting part.
  • the first heat-conducting part is located on the side of the display part away from the cover plate, and the orthographic projection of the first heat-conducting part on the cover plate covers the orthographic projection of the display part on the cover plate.
  • At least a portion of the second heat-conducting part is disposed opposite to at least a portion of the side surface of the display part.
  • Step S30 An electromagnetic shielding layer is formed on the side of the heat-conducting layer away from the cover plate.
  • FIG 11 is a schematic diagram of the manufacturing process of the display module provided in some embodiments of this disclosure. The manufacturing process of the display module will be described in detail below with reference to Figure 11.
  • the display substrate 10 and the cover plate 20 are arranged opposite to each other.
  • the display substrate 10 includes a display portion 101 for image display, a display surface facing the cover plate 20, a non-display surface facing away from the cover plate 20, and a side surface connecting the display surface and the non-display surface.
  • the cover plate 20 includes a main body region arranged opposite to the heat-conducting layer 50 and an edge region surrounding the main body region.
  • step S20 a thermally conductive layer 50 is formed.
  • the thermally conductive layer 50 is formed using a printing process, such as electrohydrodynamic inkjet (EHD) printing.
  • a printing process such as electrohydrodynamic inkjet (EHD) printing.
  • step S20 includes: printing a thermally conductive silicone layer on the display substrate 10 using a printing process.
  • the viscosity of the silicone layer can be between 5000 and 10000 cps, and the thickness can be between 50 and 100 micrometers.
  • a portion of the silicone layer is located on the side of the display portion 101 facing away from the cover plate 20, and another portion is located around the display portion 101. Then, the silicone layer is cured to form the thermally conductive layer 50.
  • Curing can be performed by heating, with a curing temperature between 50 and 65°C and a curing time between 0.5 and 1 hour.
  • the cured silicone layer on the side of the display portion 101 facing away from the cover plate 20 serves as the first thermally conductive portion 51, and the cured silicone layer around the display portion 101 serves as the second thermally conductive portion 52.
  • step S30 an electromagnetic shielding layer 60 is formed on the side of the heat-conducting layer 50 away from the cover plate 20.
  • the electromagnetic shielding layer 60 is formed using a printing process, such as electrohydrodynamic inkjet printing.
  • step S30 specifically includes printing a conductive layer with a thickness of 5–10 ⁇ m onto the surface of the thermally conductive silicone layer.
  • This conductive layer uses a nano-silver paste material with a viscosity between 10,000 and 20,000 cps.
  • the conductive layer is then cured to form the electromagnetic shielding layer 60. Curing can be performed by heating at a temperature between 50 and 65°C for a time between 0.5 and 1 hour.
  • the manufacturing process of the display module also includes steps S40 to S50.
  • edge sealing adhesive 70 is formed.
  • Edge sealing adhesive 70 includes a first part 71 and a second part 72.
  • the first part 71 is located on the side of the electromagnetic shielding layer 60 away from the cover plate 20, and the second part 72 is located in the edge area and surrounds the electromagnetic shielding layer 60 and the thermal conductive layer 50.
  • the edge-sealing adhesive 70 can be formed using a printing process.
  • step S40 includes: printing the edge-sealing adhesive 70 material, which is, for example, an acrylic material with a viscosity between 10,000 and 15,000 cps; and then curing the edge-sealing adhesive 70 material to form the final desired edge-sealing adhesive 70.
  • the edge-sealing adhesive 70 material can be photocured using ultraviolet light, with the wavelength of the curing light between 355 and 375 nm, for example, 365 nm, and the curing energy between 4000 and 6000 mJ/ cm2 .
  • a frame 40 including a retaining wall portion 42 and a supporting portion 41 is provided.
  • the supporting portion 41 is disposed on the side of the edge sealant 70 away from the cover plate 20.
  • the retaining wall portion 42 of the frame 40 is disposed around the edge sealant 70 and the cover plate 20.
  • the supporting portion 41 is bonded to the edge sealant 70, and the retaining wall portion 42 is bonded to the edge sealant 70 and the cover plate 20.
  • adhesive 83 is first applied to one of the frame 40 and the edge sealant 70, and then the frame 40 is bonded to the edge sealant 70.
  • this article only uses a quadrilateral display substrate as an example, this application is not limited to this. Those skilled in the art should understand that the technical solution of this application is applicable to display substrates of various shapes, such as irregularly shaped display substrates, such as circular, polygonal and other irregularly shaped display substrates.
  • the display device can include any device or product with display functionality.
  • the display device can be a smartphone, mobile phone, e-book reader, desktop computer (PC), laptop PC, netbook PC, personal digital assistant (PDA), portable multimedia player (PMP), digital audio player, mobile medical device, camera, wearable device (e.g., head-mounted device, electronic clothing, electronic bracelet, electronic necklace, electronic accessory, electronic tattoo, or smartwatch), etc.

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Abstract

公开一种显示模组及其制作方法、显示装置，显示模组包括：相对设置的显示基板和盖板；所述显示基板包括显示部，所述显示部包括朝向所述盖板的显示面、背离所述盖板的非显示面、以及连接在所述显示面与所述非显示面之间的侧面；导热层，所述导热层包括第一导热部和第二导热部，所述第一导热部位于所述显示部背离所述盖板的一侧，且所述第一导热部在所述盖板上的正投影覆盖所述显示部在所述盖板上的正投影；所述第二导热部的至少部分与所述显示部的至少部分侧面相对设置；电磁屏蔽层，位于所述导热层背离所述盖板的一侧。

Description

显示模组及其制作方法、显示装置
相关申请的交叉引用
本申请要求于2024年5月31日在中国知识产权局提交的中国专利申请No.2024107028586的优先权，其公开内容以引用方式整体并入本文中。
技术领域
本公开涉及显示技术领域，具体涉及一种显示模组及其制作方法、显示装置。
背景技术
在OLED(Organic Light-Emitting Diode，有机电致发光二极管)显示模组中，显示基板的背光侧通常设置有复合散热层。目前的显示模组中，对显示基板边缘的散热效果较差。
发明内容
本公开旨在至少解决现有技术中存在的技术问题之一，提出了一种显示模组及其制作方法、显示装置。
第一方面，本公开提供一种显示模组，包括：
相对设置的显示基板和盖板；所述显示基板包括显示部，所述显示部包括朝向所述盖板的显示面、背离所述盖板的非显示面、以及连接在所述显示面与所述非显示面之间的侧面；
导热层，所述导热层包括第一导热部和第二导热部，所述第一导热部位于所述显示部背离所述盖板的一侧，且所述第一导热部在所述盖板上的正投影覆盖所述显示部在所述盖板上的正投影；所述第二导热部的至少部分与所述显示部的至少部分侧面相对设置；以及
电磁屏蔽层，位于所述导热层背离所述盖板的一侧。
在一些实施例中，所述电磁屏蔽层在所述盖板上的正投影覆盖所述第一导热部在盖板上的正投影。
在一些实施例中，所述第二导热部在所述盖板上的正投影位于所述显示部在所述盖板上的正投影之外，所述第二导热部的宽度在50～100微米之间。
在一些实施例中，所述盖板包括与所述导热层相对设置的主体区以及环绕所述主体区的边缘区；
所述显示模组还包括封边胶，所述封边胶包括第一部分和第二部分，所述第一部分位于所述电磁屏蔽层背离所述盖板的一侧，所述第二部分位于所述边缘区，且环绕所述显示基板、所述电磁屏蔽层和所述导热层。
在一些实施例中，所述显示模组还包括边框，所述边框包括挡墙部和承载部，所述承载部位于所述封边胶背离所述盖板的一侧，并与所述封边胶粘结；所述挡墙部环绕所述封边胶和所述盖板，并与所述封边胶和所述盖板粘结。
在一些实施例中，所述封边胶在所述盖板上的正投影为环形，其外边缘与所述显示基板在所述盖板上的正投影之间的距离在0.4～0.6mm之间。
在一些实施例中，所述第一部分的厚度在0.2～0.3mm之间。
在一些实施例中，所述显示基板是刚性显示基板，其中，所述第二导热部的至少部分与所述显示部的所有侧面相对设置。
在一些实施例中，所述的显示模组还包括：背膜，位于所述导热层和所述显示部之间。
在一些实施例中，所述显示基板是柔性显示基板，并且所述显示基板还包括驱动部以及连接在所述驱动部与所述显示部之间的弯曲部，所述驱动部位于所述电磁屏蔽层背离所述盖板的一侧。
在一些实施例中，所述第二导热部的至少部分与所述显示部的所有侧面中除了所述弯曲部所在的侧面之外的其余所有侧面相对设置。
在一些实施例中，所述的显示模组还包括：背膜，分别设置在所述导热层与所述显示部之间，以及所述电磁屏蔽层和所述驱动部之间。
第二方面，本公开还提供一种显示模组的制作方法，包括：
将显示基板与盖板相对设置，所述显示基板包括显示部，所述显示部包括朝向所述盖板的显示面、背离所述盖板的非显示面、以及连接在所述显示面与所述非显示面之间的侧面；
形成导热层，所述导热层包括第一导热部和第二导热部，所述第一导热部位于所述显示部背离所述盖板的一侧，且所述第一导热部在所述盖板上的正投影覆盖所述显示部在所述盖板上的正投影；所述第二导热部的至少部分与所述显示部的至少部分侧面相对设置；
在所述导热层背离所述盖板的一侧形成电磁屏蔽层，且所述第一导热部和第二导热部一体成型。
在一些实施例中，所述导热层和所述电磁屏蔽层均采用打印工艺形成。
在一些实施例中，所述盖板包括与所述导热层相对设置的主体区以及环绕所述主体区的边缘区；所述制作方法还包括：
形成封边胶，所述封边胶包括第一部分和第二部分，所述第一部分位于所述电磁屏蔽层背离所述盖板的一侧，所述第二部分位于所述边缘区，且环绕所述显示基板、所述电磁屏蔽层和所述导热层。
在一些实施例中，所述封边胶通过打印工艺形成。
在一些实施例中，所述制作方法还包括：
提供边框，所述边框包括挡墙部和承载部；
将所述承载部设置在所述封边胶背离所述盖板的一侧，将所述挡墙部环绕所述封边胶和所述盖板设置，并将所述承载部与所述封边胶粘结，将所述挡墙部与所述封边胶和所述盖板粘结。
在一些实施例中，所述第一部分和所述第二部分一体成型，且所述挡墙部和承载部一体成型。
第三方面，本公开还提供一种显示装置，包括上述的显示模组。
附图说明
附图是用来提供对本公开的进一步理解，并且构成说明书的一部分，与下面的具体实施方式一起用于解释本公开，但并不构成对本公开的限制。在附图中：
图1为一些实施例中提供的显示模组的示意图。
图2为另一些实施例中提供的显示模组的示意图。
图3为本公开一些实施例中提供的显示模组中显示基板和盖板的平面示意图。
图4为本公开一些实施例中提供的显示模组的剖视图。
图5为本公开另一些实施例中提供的显示模组中显示基板、盖板和边框的平面示意图。
图6为本公开另一些实施例中提供的显示模组的剖视图。
图7为本公开另一些实施例中提供的显示模组的另一剖视图。
图8为本公开再一些实施例中提供的显示模组的剖视图。
图9为本公开再一些实施例中提供的显示模组的另一剖视图。
图10为本公开一些实施例中提供的显示部的示意图。
图11为本公开一些实施例中提供的显示模组的制作过程示意图。
具体实施方式
以下结合附图对本公开的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本公开，并不用于限制本公开。
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另作定义，本公开实施例使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
如本文所使用的那样，“平行”、“垂直”包括所阐述的情况以及与所阐述的情况相近似的情况，该相近似的情况的范围处于可接受偏差范围内，其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨论的测量以及与特定量的测量相关的误差(即，测量系统的局限性)所确定。例如，“平行”包括绝对平行和近似平行，其中近似平行的可接受偏差范围例如可以是5°以内偏差；“垂直”包括绝对垂直和近似垂直，其中近似垂直的可接受偏差范围例如也可以是5°以内偏差。
应当理解的是，当层或元件被称为在另一层或基板上时，可以是该层或元件直接在另一层或基板上，或者也可以是该层或元件与另一层或基板之间存在中间层。
本文参照作为理想化示例性附图的剖视图和/或平面图描述了示例性实施方式。在附图中，为了清楚，放大了层和区域的厚度。因此，可设想到由于例如制造技术和/或公差引起的相对于附图的形状的变动。因此，示例性实施方式不应解释为局限于本文示出的区域的形状，而是包括因例如制造而引起的形状偏差。因此，附图中所示的区域本质上是示意性的，且它们的形状并非旨在示出设备的区域的实际形状，并且并非旨在限制示例性实施方式的范围。
图1为一些实施例中提供的显示模组的示意图，图2为另一些实施例中提供的显示模组的示意图，如图1和图2所示，显示模组包括显示基板10、盖板20、散热层、边框40。其中，盖板20设置在显示基板10的出光侧，散热层设置在显示基板10的背光侧，边框40与盖板20的边缘连接，并环绕显示基板10设置。在一些实施例中，如图1所示，散热层包括沿远离显示基板10的方向依次设置的第一粘结层31、柔性缓冲层32和金属层33。示例性的，第一粘结层31的厚度在20～40微米之间，例如为30微米；柔性缓冲层32的厚度在80～120微米之间，例如为100微米；金属层33的厚度在20～40微米之间，例如为30微米。在另一些实施例中，散热层包括沿远离显示基板10的方向依次设置的第二粘结层34和金属层33。示例性的，第二粘结层34的厚度在120～140微米之间，例如为130微米；金属层33的厚度在20～40微米之间，例如为30微米。在图1和图2中，金属层33可以采用铜制成。散热层可以起到对显示基板10进行散热的作用，并且，金属层33可以接地，从而可以起到电磁屏蔽的效果，减少外部静电对显示基板10的影响。
其中，图1和图2中的散热层是对整层的散热膜进行模切工艺后得到，并将模切得到的散热层贴合至显示基板10上。由于在模切工艺和贴合工艺中均存在公差，因此在设计时，需要将散热层的边缘与显示基板10的边缘之间留有一定的间距d1，例如，d1在0.25～0.4mm之间；显示基板10的边缘与盖板20的边缘之间的间距d2在0.8～1.2mm之间。这种情况下，将导致显示基板10边缘区域的散热效果以及电磁屏蔽效果均较差。
图3为本公开一些实施例中提供的显示模组中显示基板和盖板的平面示意图，图4为本公开一些实施例中提供的显示模组的剖视图，图4为图3所示的显示模组沿A-A’剖视线的截面图，如图3和图4所示，显示模组包括：显示基板10、盖板20、导热层50、电磁屏蔽层60。其中，显示基板10包括用于显示画面的显示部101，显示部101和盖板20相对设置并固定连接，显示部101包括朝向盖板20的显示面、背离盖板20的非显示面、以及连接在显示面与非显示面之间的侧面。其中，显示基板10可以为刚性显示基板，这种情况下，整个显示基板10可以作为显示部101；或者，显示基板10为柔性显示基板，且一部分弯折至背光侧，这种情况下，显示基板10除了包括显示部101，还包括其他部分，具体在下文进行介绍。
导热层50包括第一导热部51和第二导热部52，第一导热部51位于显示部背离盖板20的一侧，且第一导热部51在盖板20上的正投影覆盖显示部101在盖板20上的正投影；第二导热部52的至少部分与所述显示部101的侧面相对设置，本文中“相对设置”指的是两个部件面对面设置并相互接触或接合在一起。
在本公开实施例中，显示基板10产生的热量可以经导热层50和电磁屏蔽层60散热出去，与图1和图2所示的结构相比，图4所示的显示模组中，导热层50的第一导热部51覆盖显示部101，从而可以对显示部101的整个区域进行散热；并且，第二导热部52与显示部101的侧面相对设置，从而可以从显示部101的侧面进行散热，进而提高显示基板的散热效果。
在一些实施例中，导热层50可以采用硅胶材料制成。具体地，可以采用打印工艺打印硅胶材料，之后进行固化形成导热层50。这种方式更容易控制导热层50的局部厚度，从而满足产品的多样化需求。例如，当显示模组用于手机、平板电脑时，在摄像头的位置，导热层50的厚度可以较小。
在一些实施例中，导热层50的第一导热部51的厚度在50～100微米之间，从而在保证导热效果的同时，防止显示模组的厚度过大，有利于显示产品的轻薄化设计。例如，第一导热部51的厚度为50微米，或60微米，或70微米，或80微米，或90微米或100微米。
在一些实施例中，第二导热部52在盖板20上的正投影位于显示部101在盖板20上的正投影之外，例如，当显示基板10整体作为显示部101时，第二导热部52可以为环绕显示部101的环形结构，从而提高导热层50的导热效果；当显示基板10的一侧弯折至背光侧时，则可以在显示基板10的其余侧设置第二导热部52。其中，如图4所示，第二导热部52的宽度W在50～100微米之间，从而在存在工艺公差的情况下，保证导热层50能够覆盖显示基板10的所有区域，以保证导热层50对显示基板10的导热效果。例如，第二导热部52的宽度W为50微米，或60微米，或70微米，或80微米，或90微米或100微米。
在一些实施例中，电磁屏蔽层60在盖板20上的正投影覆盖第一导热部51在盖板20上的正投影，从而保证对显示基板10整个区域的电磁屏蔽效果。在一个示例中，电磁屏蔽层60在盖板20上的正投影与第二导热部52在盖板20上的正投影存在交叠。例如电磁屏蔽层60与导热层50在盖板20上的正投影重合或基本重合。
在一个示例中，电磁屏蔽层60可以采用导热性和导电性较好的材料制作，例如，采用银制作。
在一个示例中，电磁屏蔽层60的厚度在5～10微米之间，例如厚度可以为5微米，7微米，9微米，10微米。
在一些实施例中，如图4所示，盖板20包括与导热层50和显示基板10相对设置的主体区21以及环绕主体区21的边缘区22。显示模组还包括封边胶70，封边胶70包括第一部分71和第二部分72，例如，第一部分71和第二部分72连接为一体结构。第一部分71位于电磁屏蔽层60背离盖板20的一侧，其中，电磁屏蔽层60所在面背离盖板20一侧的封边胶70可以作为第一部分71。第二部分72位于边缘区22，且环绕显示基板10、电磁屏蔽层60和导热层50。通过封边胶70的设置，可以在显示产品受到外界碰撞的时候，可以缓冲显示基板10背侧的结构对显示基板10的压力，起到保护效果；并且可以减少外界水汽进入显示基板10内部，提高显示基板10的信赖性。
在一些实施例中，封边胶70的第一部分71的厚度D在0.2～0.3mm之间，从而可以在保证封边胶70对显示基板10的保护效果的同时，防止显示模组的厚度过大，有利于显示产品的轻薄化设计。例如，第一部分71的厚度可以为0.2mm，或0.25mm，或0.3mm。第一部分71背离盖板20的表面可以为非平面，第一部分71的厚度是指第一部分71的最大厚度。
在一些实施例中，封边胶70在盖板20上的正投影为环形，封边胶70的正投影的外边缘与显示基板10在盖板20上的正投影之间的距离d在0.4～0.6mm之间，从而提高对显示基板10的密封保护效果。例如，d可以为0.4mm，或0.45mm，或0.5mm，或0.55mm，或0.6mm。
在一些示例中，封边胶70可以为丙烯酸酯类材料。
图5为本公开另一些实施例中提供的显示模组中显示基板、盖板和边框的平面示意图，图6为本公开另一些实施例中提供的显示模组的剖视图，图7为本公开另一些实施例中提供的显示模组的另一剖视图，图6为图5所示的显示模组沿B-B’剖切线的截面图，图7为图5所示的显示模组沿C-C’剖切线的截面图，如图5至图7所示，显示模组还可以包括边框40，边框40与盖板20、封边胶70均连接。其中，边框40可以包括挡墙部42和承载部41，例如，挡墙部42和承载部41连接为一体结构。承载部41位于封边胶70背离盖板20的一侧，并与封边胶70粘结；挡墙部42环绕封边胶70和盖板20设置，并与封边胶70和盖板20粘结。例如，如图6和图7所示，承载部41与封边胶70之间、挡墙部42与封边胶70之间、挡墙部42与盖板20的侧面之间均设置有粘结剂83。
当显示模组用于窄边框40的产品中时，若显示模组中未设置封边胶70(如图1和图2所示)，则边框40与显示基板10之间的距离缩小，甚至出现承载部41挤压显示基板10的情况；而本公开实施例在显示基板10与边框40之间设置封边胶70后，在封边胶70的间隔、缓冲作用下，边框40上的压力不会作用于显示基板10上，从而有利于窄边框40的实现。另外，在图1和图2中，边框40与盖板20的侧面以及盖板20朝向显示基板10的表面粘结，而在图6和图7所示的显示模组中，边框40与盖板20的侧面、封边胶70的侧面、封边胶70背离盖板20的表面粘结，与图1和图2相比，图6和图7中边框40的粘结区域更长，从而可以延长外界水汽侵入显示模组的路径，提高显示模组的密封性。
在一些实施例中，封边胶70包括朝向挡墙部42的第一表面以及朝向承载部41的第二表面，第一表面和第二表面中的至少一者为曲面，从而进一步延长外界水汽侵入显示模组的路径，进一步提高显示模组的密封性。其中，这里的曲面可以为凸面、凹面、自由曲面，也可以是具有多个凸起和/或多个凹陷的波浪面，例如，第一表面和第二表面中的至少一者具有多个凸起和/或多个凹陷，从而在提高封边胶70与边框40连接稳定性的同时，提高显示模组的密封性。
如图7所示，在一些实施例中，显示基板10为柔性显示基板，其除了包括显示部101之外，还包括驱动部103以及连接在驱动部103和显示部101之间的弯曲部102，显示部101包括基底以及设置基底上的驱动电路层、发光结构层等结构，弯曲部102包括基底以及设置在基底上的连接线；驱动部103位于电磁屏蔽层60背离盖板20的一侧，且驱动部103包括基底以及设置在基底上的焊盘，焊盘用于连接柔性线路板，从而将驱动信号提供至显示部101进行画面显示。通过将驱动部103弯折至显示部101的背光侧，有利于减小显示模组的边框40。在弯曲部102上还可以设置保护层91，用于对弯曲部102上的走线进行保护。当显示基板10包括驱动部103和弯曲部102时，则导热层50可以包覆显示部101三侧的侧面，而封边胶70的第二部分72仍可以环绕显示基板10、导热层50和电磁屏蔽层60设置。例如，第二部分72中的一部分位于弯曲部102内侧，一部分位于弯曲部102外侧。
图8为本公开再一些实施例中提供的显示模组的剖视图，图9为本公开再一些实施例中提供的显示模组的另一剖视图，图8位图5所示的显示模组沿B-B’剖切线的截面图，图9为图5所示的显示模组沿C-C’剖切线的截面图。图8和图9所示的显示模组与图6和图7类似，区别仅在于，在图8和图9中，显示模组还包括背膜90，其中，导热胶和显示部101之间、电磁屏蔽层60与驱动部103之间均设置有背膜90，从而对显示基板10进行支撑。
图10为本公开一些实施例中提供的显示部的示意图，如图10所示，显示基板10可以为OLED显示基板，显示部101包括设置在基底11上的驱动电路层12、设置在驱动电路层12上的发光结构层13以及设置在发光结构层13上的封装层14。在一些可能的实现方式中，显示基板10可以包括其它膜层，本公开在此不做限定。
在示例性实施方式中，基底11可以是柔性基底，或者可以是刚性基底。柔性基底可以包括叠设的第一柔性材料层、第一无机材料层、半导体层、第二柔性材料层和第二无机材料层，第一柔性材料层和第二柔性材料层的材料可以采用聚酰亚胺(PI)、聚对苯二甲酸乙二酯(PET)或经表面处理的聚合物软膜等材料，第一无机材料层和第二无机材料层的材料可以采用氮化硅(SiNx)或氧化硅(SiOx)等，用于提高基底的抗水氧能力，半导体层的材料可以采用非晶硅(a-si)。
在示例性实施方式中，驱动电路层12可以包括构成像素电路的晶体管和存储电容，图10中仅示出了每个像素电路中的一个晶体管和一个存储电容，晶体管包括有源层122、栅电极121、源电极123和漏电极124。在一些可能的实现方式中，每个子像素的驱动电路层12可以包括：设置在基底11上的缓冲层BFL，设置在缓冲层BFL上的有源层122，覆盖有源层122的第一栅绝缘层GI1，设置在第一栅绝缘层GI1上的栅电极121和第一电容电极125，覆盖栅电极121和第一电容电极125的第二栅绝缘层GI2，设置在第二栅绝缘层GI2上的第二电容电极126，覆盖第二电容电极126的层间绝缘层ILD，层间绝缘层ILD上开设有过孔，过孔暴露出有源层122。源电极123和漏电极124设置在层间绝缘层ILD上，源电极123和漏电极124分别通过过孔与有源层122连接。平坦层PLN位于源电极123和漏电极124远离基底11的一侧。第一电容电极125和第二电容电极126组成存储电容。在一些可能的实现方式中，缓冲层BFL、第一栅绝缘层GI1、第二栅绝缘层GI2和层间绝缘层ILD可以采用硅氧化物(SiOx)、硅氮化物(SiNx)和氮氧化硅(SiON)中的任意一种或多种，可以是单层、多层或复合层。栅电极121、源电极123、漏电极124、第一电容电极125和第二电容电极126可以采用金属材料，如银(Ag)、铜(Cu)、铝(Al)、钛(Ti)和钼(Mo)中的任意一种或多种，或者上述金属的合金材料，如铝钕合金(AlNd)或钼铌合金(MoNb)，可以是单层结构，或者多层复合结构，如Ti/Al/Ti等。有源层122可以采用非晶态氧化铟镓锌材料(a-IGZO)、氮氧化锌(ZnON)、氧化铟锌锡(IZTO)、非晶硅(a-Si)、多晶硅(p-Si)、六噻吩或聚噻吩等材料，即本公开适用于基于氧化物(Oxide)技术、硅技术或有机物技术制造的晶体管。基于氧化物技术的有源层122可以采用包含铟和锡的氧化物、包含钨和铟的氧化物、包含钨和铟和锌的氧化物、包含钛和铟的氧化物、包含钛和铟和锡的氧化物、包含铟和锌的氧化物、包含硅和铟和锡的氧化物、包含铟和镓和锌的氧化物等。
在示例性实施方式中，发光结构层13可以包括阳极131、像素定义层PDL、有机发光层133和阴极132，阳极131设置在平坦层PLN上，通过平坦层PLN上开设的过孔与漏电极124连接，像素定义层PDL设置在阳极131和平坦层PLN上，其中设置有像素开口，像素开口暴露出阳极131，有机发光层133设置在像素开口内，阴极132设置在有机发光层133上，有机发光层133在阳极131和阴极132施加电压的作用下出射相应颜色的光线。
在示例性实施方式中，有机发光层133可以至少包括叠设的空穴注入层(HIL)、空穴传输层(HTL)、发射层(EML)、电子传输层(ETL)和电子注入层(EIL)，空穴注入层和空穴传输层可统称为空穴层，电子传输层和电子注入层可统称为电子层。
在示例性实施方式中，封装层14可以包括叠设的第一封装层141、第二封装层142和第三封装层143，第一封装层141和第三封装层143可采用无机材料，第二封装层142可采用有机材料，第二封装层142设置在第一封装层141和第三封装层143之间，可以保证外界水汽无法进入发光结构层13。
本公开实施例还提供一种显示模组的制作方法，包括：
步骤S10、将显示基板与盖板相对设置，显示基板包括显示部，显示部包括朝向盖板的显示面、背离盖板的非显示面、以及连接在显示面与非显示面之间的侧面。
步骤S20、形成导热层。导热层包括第一导热部和第二导热部，第一导热部位于显示部背离盖板的一侧，且第一导热部在盖板上的正投影覆盖显示部在盖板上的正投影；第二导热部的至少部分与所述显示部的至少部分侧面相对设置。
步骤S30、在导热层背离盖板的一侧形成电磁屏蔽层。
图11为本公开一些实施例中提供的显示模组的制作过程示意图，下面结合图11对显示模组的制作过程进行具体介绍。
在步骤S10，将显示基板10与盖板20相对设置，显示基板10包括用于图像显示的显示部101、朝向盖板20的显示面、背离盖板20的非显示面、以及连接在显示面与非显示面之间的侧面。盖板20包括与导热层50相对设置的主体区以及环绕主体区的边缘区。
在步骤S20，形成导热层50。
在一些示例中，导热层50采用打印工艺形成，该打印工艺例如为电流体动力喷墨(EHD)打印工艺。以导热层50采用硅胶材料为例，步骤S20包括：通过打印工艺在显示基板10上打印导热硅胶层，该硅胶层的粘度可以在5000～10000cps之间，厚度可以在50～100微米之间。硅胶层的一部分位于显示部101背离盖板20的一侧，另一部分位于显示部101周围；之后，对硅胶层进行固化，形成导热层50。其中，可以通过加热的方式进行固化，固化温度在50～65℃之间，固化时间在0.5～1hrs(小时)之间。显示部101背离盖板20一侧的硅胶层固化后作为上述第一导热部51，显示部101周围的硅胶层固化后作为上述第二导热部52。
在步骤S30，在导热层50背离盖板20的一侧形成电磁屏蔽层60。
在一个示例中，电磁屏蔽层60采用打印工艺形成，该打印工艺例如为电流体动力喷墨打印工艺。例如，步骤S30具体包括：在导热硅胶层表面打印厚度为5～10μm的导电层，该导电层采用纳米银浆材料，粘度在10000～20000cps之间。之后，对导电层进行固化，形成电磁屏蔽层60。其中，可以通过加热的方式进行固化，固化温度在50～65℃之间，固化时间在0.5～1hrs(小时)之间。
此外，显示模组的制作过程还包括步骤S40至S50。
在步骤S40，形成封边胶70。封边胶70包括第一部分71和第二部分72，第一部分71位于电磁屏蔽层60背离盖板20的一侧，第二部分72位于边缘区，且环绕电磁屏蔽层60和导热层50。
其中，封边胶70可以采用打印工艺形成。在一个示例中，步骤S40包括：打印封边胶70材料，该封边胶70材料例如为丙烯酸酯类材料，粘度在10000～15000cps之间；之后，对封边胶70材料进行固化，形成最终所需的封边胶70。其中，可以采用紫外光照的方式对封边胶70材料进行光固化，固化光线的波长在355～375nm之间，例如为365nm，固化能量在4000～6000mJ/cm2之间。
在步骤S50，提供包括挡墙部42和承载部41的边框40，将承载部41设置在封边胶70背离盖板20的一侧，将边框40的挡墙部42环绕封边胶70和盖板20设置，并将承载部41与封边胶70粘结，将挡墙部42与封边胶70和盖板20粘结。例如，先在边框40和封边胶70的一者上涂覆粘结剂83，再将边框40与封边胶70粘结。
本文中虽然仅以四边形的显示基板为例进行了说明，但是本申请并不限于此，本领域技术人员应该理解的是，本申请的技术方案适用于各种形状的显示基板，例如异形显示基板，诸如圆形、多边形等不规则形状的显示基板。
本公开实施例还提供一种显示装置，包括上述实施例中的显示模组。该显示装置可以包括任何具有显示功能的设备或产品。例如，所述显示装置可以是智能电话、移动电话、电子书阅读器、台式电脑(PC)、膝上型PC、上网本PC、个人数字助理(PDA)、便携式多媒体播放器(PMP)、数字音频播放器、移动医疗设备、相机、可穿戴设备(例如头戴式设备、电子服饰、电子手环、电子项链、电子配饰、电子纹身、或智能手表)等等。
可以理解的是，以上实施方式仅仅是为了说明本公开的原理而采用的示例性实施方式，然而本公开并不局限于此。对于本领域内的普通技术人员而言，在不脱离本公开的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本公开的保护范围。

Claims (19)

  1. 一种显示模组，其特征在于，包括：
    相对设置的显示基板和盖板；所述显示基板包括显示部，所述显示部包括朝向所述盖板的显示面、背离所述盖板的非显示面、以及连接在所述显示面与所述非显示面之间的侧面；
    导热层，所述导热层包括第一导热部和第二导热部，所述第一导热部位于所述显示部背离所述盖板的一侧，且所述第一导热部在所述盖板上的正投影覆盖所述显示部在所述盖板上的正投影；所述第二导热部的至少部分与所述显示部的至少部分侧面相对设置；以及
    电磁屏蔽层，位于所述导热层背离所述盖板的一侧。
  2. 根据权利要求1所述的显示模组，其特征在于，所述电磁屏蔽层在所述盖板上的正投影覆盖所述第一导热部在盖板上的正投影。
  3. 根据权利要求1所述的显示模组，其特征在于，所述第二导热部在所述盖板上的正投影位于所述显示部在所述盖板上的正投影之外，所述第二导热部的宽度在50～100微米之间。
  4. 根据权利要求1至3中任一项所述的显示模组，其特征在于，所述盖板包括与所述导热层相对设置的主体区以及环绕所述主体区的边缘区；
    所述显示模组还包括封边胶，所述封边胶包括第一部分和第二部分，所述第一部分位于所述电磁屏蔽层背离所述盖板的一侧，所述第二部分位于所述边缘区，且环绕所述显示基板、所述电磁屏蔽层和所述导热层。
  5. 根据权利要求4所述的显示模组，其特征在于，所述显示模组还包括边框，所述边框包括挡墙部和承载部，所述承载部位于所述封边胶背离所述盖板的一侧，并与所述封边胶粘结；所述挡墙部环绕所述封边胶和所述盖板，并与所述封边胶和所述盖板粘结。
  6. 根据权利要求4所述的显示模组，其特征在于，所述封边胶在所述盖板上的正投影为环形，其外边缘与所述显示基板在所述盖板上的正投影之间的距离在0.4～0.6mm之间。
  7. 根据权利要求4所述的显示模组，其特征在于，所述第一部分的厚度在0.2～0.3mm之间。
  8. 根据权利要求1-7中任一项所述的显示模组，其特征在于，所述显示基板是刚性显示基板，其中，所述第二导热部的至少部分与所述显示部的所有侧面相对设置。
  9. 根据权利要求1-8中任一项所述的显示模组，其特征在于，所述显示模组还包括：背膜，位于所述导热层和所述显示部之间。
  10. 根据权利要求1至7中任一项所述的显示模组，其特征在于，所述显示基板是柔性显示基板，并且所述显示基板还包括驱动部以及连接在所述驱动部与所述显示部之间的弯曲部，所述驱动部位于所述电磁屏蔽层背离所述盖板的一侧。
  11. 根据权利要求10所述的显示模组，其特征在于，所述第二导热部的至少部分与所述显示部的所有侧面中除了所述弯曲部所在的侧面之外的其余所有侧面相对设置。
  12. 根据权利要求10或11所述的显示模组，其特征在于，所述显示模组还包括：背膜，分别设置在所述导热层与所述显示部之间，以及所述电磁屏蔽层和所述驱动部之间。
  13. 一种显示模组的制作方法，其特征在于，包括：
    将显示基板与盖板相对设置，所述显示基板包括显示部，所述显示部包括朝向所述盖板的显示面、背离所述盖板的非显示面、以及连接在所述显示面与所述非显示面之间的侧面；
    形成导热层，所述导热层包括第一导热部和第二导热部，所述第一导热部位于所述显示部背离所述盖板的一侧，且所述第一导热部在所述盖板上的正投影覆盖所述显示部在所述盖板上的正投影；所述第二导热部的至少部分与所述显示部的至少部分侧面相对设置；
    在所述导热层背离所述盖板的一侧形成电磁屏蔽层。
  14. 根据权利要求13所述的制作方法，其特征在于，所述导热层和所述电磁屏蔽层均采用打印工艺形成，且所述第一导热部和第二导热部一体成型。
  15. 根据权利要求13所述的制作方法，其特征在于，所述盖板包括与所述导热层相对设置的主体区以及环绕所述主体区的边缘区；所述制作方法还包括：
    形成封边胶，所述封边胶包括第一部分和第二部分，所述第一部分位于所述电磁屏蔽层背离所述盖板的一侧，所述第二部分位于所述边缘区，且环绕所述显示基板、所述电磁屏蔽层和所述导热层。
  16. 根据权利要求15所述的制作方法，其特征在于，所述封边胶通过打印工艺形成。
  17. 根据权利要求15所述的制作方法，其特征在于，所述制作方法还包括：
    提供边框，所述边框包括挡墙部和承载部；
    将所述承载部设置在所述封边胶背离所述盖板的一侧，将所述挡墙部环绕所述封边胶和所述盖板设置，并将所述承载部与所述封边胶粘结，将所述挡墙部与所述封边胶和所述盖板粘结。
  18. 根据权利要求17所述的制作方法，其特征在于，所述第一部分和所述第二部分一体成型，且所述挡墙部和承载部一体成型。
  19. 一种显示装置，其特征在于，包括权利要求1至12中任一项所述的显示模组。
PCT/CN2025/092323 2024-05-31 2025-04-30 显示模组及其制作方法、显示装置 Pending WO2025246789A1 (zh)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050285520A1 (en) * 2004-06-24 2005-12-29 Eastman Kodak Company OLED display having thermally conductive adhesive
JP2006084977A (ja) * 2004-09-17 2006-03-30 Sony Corp 表示装置
WO2010131156A1 (en) * 2009-05-14 2010-11-18 Koninklijke Philips Electronics N. V. Cooling of electroluminescent devices
CN115241398A (zh) * 2022-07-25 2022-10-25 京东方科技集团股份有限公司 一种显示装置、显示装置的制备方法、车灯以及汽车

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050285520A1 (en) * 2004-06-24 2005-12-29 Eastman Kodak Company OLED display having thermally conductive adhesive
JP2006084977A (ja) * 2004-09-17 2006-03-30 Sony Corp 表示装置
WO2010131156A1 (en) * 2009-05-14 2010-11-18 Koninklijke Philips Electronics N. V. Cooling of electroluminescent devices
CN115241398A (zh) * 2022-07-25 2022-10-25 京东方科技集团股份有限公司 一种显示装置、显示装置的制备方法、车灯以及汽车

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