WO2025190095A1 - 支撑装置、加热器和半导体工艺设备 - Google Patents

支撑装置、加热器和半导体工艺设备

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Publication number
WO2025190095A1
WO2025190095A1 PCT/CN2025/080148 CN2025080148W WO2025190095A1 WO 2025190095 A1 WO2025190095 A1 WO 2025190095A1 CN 2025080148 W CN2025080148 W CN 2025080148W WO 2025190095 A1 WO2025190095 A1 WO 2025190095A1
Authority
WO
WIPO (PCT)
Prior art keywords
support
insulating
support device
limiting
limiting portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2025/080148
Other languages
English (en)
French (fr)
Inventor
张云龙
刘红丽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Naura Microelectronics Equipment Co Ltd
Original Assignee
Beijing Naura Microelectronics Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Naura Microelectronics Equipment Co Ltd filed Critical Beijing Naura Microelectronics Equipment Co Ltd
Publication of WO2025190095A1 publication Critical patent/WO2025190095A1/zh
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment

Definitions

  • the present application relates to the technical field of semiconductor equipment, and in particular to a supporting device, a heater and semiconductor process equipment.
  • the heating device mainly adopts a heating body formed by spiral winding, and the heating body is supported by a heating body support device.
  • the heating body support device sets insulating barriers between adjacent spiral segments to ensure the pitch of the heating body.
  • one end of the insulating barrier is connected to the heating body to support the heating body, and the through rod of the heating body support device sequentially passes through the through holes of the other ends of multiple insulating barriers located in the same column (in the direction of the spiral axis of the heating body) to achieve the installation of multiple insulating barriers in the same column.
  • One end of the through rod is fixed, and the other end can be freely extended and retracted.
  • a certain amount of movable margin will be left between the through hole of the through rod and the through hole of the insulating barrier to adapt to the deformation of the through rod due to thermal expansion and contraction.
  • the heating element when heated, the heating element stretches and presses against the edge of the insulating barrier. This causes the through-rod and the through-hole of the insulating barrier to become non-concentric, increasing friction between the through-rod and the through-hole. This prevents the through-rod from absorbing the through-rod's thermal expansion and contraction, which can easily cause the through-rod to deform. After repeated use, the through-rod can become severely deformed, and the deformed through-rod can easily squeeze the heating element, forcing it out of the support area of the insulating barrier. This can easily lead to overlapping short circuits between adjacent spiral segments, rendering the heating device inoperable.
  • the present application discloses a support device, a heater and a semiconductor process equipment to solve the problem in the related art that a heating body support device is prone to deformation of the heating body after deformation due to thermal expansion and contraction.
  • the present application discloses a support device for use with a heater of semiconductor processing equipment to support a heating element of the heater.
  • the support device includes a plurality of support units arranged in a surrounding manner.
  • Each of the support units includes a plurality of insulating support bodies stacked in sequence.
  • a first limit portion is provided at a first end of each insulating support body, and a second limit portion is provided at a second end of the insulating support body opposite to the first end.
  • the first limiting portion of one of any two adjacent insulating support bodies in each of the support units is limitedly matched with the second limiting portion of the other along the first axial direction, and the insulating support body is used to support and cooperate with the heating body, wherein the first axial direction is parallel to the stacking direction of multiple insulating support bodies.
  • the present application further discloses a heater, which comprises a heating body and the supporting device described in the first aspect.
  • the present application further discloses a semiconductor process equipment, which includes a reaction chamber and the heater described in the second aspect, and the heater is used to heat the reaction chamber.
  • each support unit includes a plurality of insulating support bodies, so that the first end of each insulating support body is provided with a first limiting portion, and the second end of the insulating support body opposite to the first end is provided with a second limiting portion, so that the first limiting portion of one of any two adjacent insulating support bodies in each support unit is limitedly matched with the second limiting portion of the other along the first axis, thereby achieving the stacking and interconnection of the plurality of insulating support bodies in each support unit.
  • the embodiment of the present application adopts a connection structure in which the first limiting portion and the second limiting portion are limitedly matched along the first axis, and no longer adopts the structure of connecting the plurality of insulating obstructions by a through rod in the related art, there is no situation in which the through rod deforms and squeezes the heating body to deform, thereby avoiding the problem of the heating body being deformed after the support device is deformed by thermal expansion and contraction.
  • FIG1 is a schematic structural diagram of an insulating support body disclosed in an embodiment of the present application, wherein p represents the first axis direction, q represents the second axis direction, and r represents the third axis direction;
  • FIG2 is a cross-sectional view of FIG1 taken along the dotted line;
  • FIG3 is a schematic diagram of the installation of two adjacent insulating supports disclosed in an embodiment of the present application.
  • FIG4 is a schematic diagram of the cooperation between the insulating support and the mounting rail disclosed in an embodiment of the present application.
  • FIG5 is a top view of the insulating support body and the mounting rail according to an embodiment of the present application.
  • FIG6 is a schematic structural diagram of a heat preservation member disclosed in an embodiment of the present application.
  • FIG7 is a schematic structural diagram of the arc-shaped heat preservation sub-unit disclosed in an embodiment of the present application.
  • FIG8 is a schematic diagram of the cooperation between the sliding support portion and the sliding cooperation portion disclosed in an embodiment of the present application.
  • FIG9 is an enlarged schematic diagram of the cooperation between the sliding support portion and the sliding cooperation portion disclosed in an embodiment of the present application.
  • Figure 10 is a schematic structural diagram of the support base
  • FIG11 is a schematic structural diagram of a support unit installed on a support base
  • FIG12 is a schematic diagram of the structure of the mounting rail installed on the support base
  • FIG13 is a schematic structural diagram of a heater
  • FIG14 is a schematic diagram of FIG13 in a top view
  • FIG15 is a schematic diagram of the support cooperation between the insulating support body and the heating body when the inclination angle of the supporting surface of the insulating support body supporting the heating body is the same as the helical angle of the helical structure.
  • references numerals 100-support unit, 101-deformation gap, 110-insulating support body, 111-first limiting protrusion, 112- First limiting groove, 113-supporting recess, 114-guide rail matching portion, 114a-second limiting groove 200-installation rail, 210-first installation slot, 211-second limiting protrusion, 300-insulation part, 310-arc-shaped insulation subunit, 311-second installation slot, 400-sliding fitting part, 410-sliding hole, 500-support base, 510-annular step structure, 511-step surface, 700-heating body, 800-sliding part, 910-top support, 920-lead terminal.
  • An embodiment of the present application discloses a supporting device, which is applied to a heater of a semiconductor process equipment to support a heating body 700 of the heater.
  • the disclosed support device includes multiple support units 100, which are arranged in a circular pattern.
  • Each support unit 100 includes multiple stacked insulating supports 110.
  • each insulating support 110 has a first stopper at a first end and a second stopper at a second end opposite the first end.
  • the first limiting portion of one of any two adjacent insulating support bodies 110 is limitedly matched with the second limiting portion of the other along the first axial direction (for example, the direction shown by P in Figure 1) to connect the two adjacent insulating support bodies 110 to limit the separation of any two adjacent insulating support bodies 110 along the first axial direction.
  • the insulating support body 110 is used to support and cooperate with the heating body 700, wherein the first axial direction is parallel to the stacking direction of multiple insulating support bodies 110, and the first limiting portion and the second limiting portion can be located at two opposite ends of the insulating support body 110 along the first axial direction, that is, the first end and the second end of the insulating support body 110 are opposite to each other in the first axial direction.
  • the heater 700 typically has a spiral structure or a structure including multiple ring structures.
  • an insulating support 110 is provided between any two adjacent spiral segments or any two adjacent ring structures of the heater 700 to prevent overlapping short circuits between any two adjacent spiral segments or any two adjacent ring structures.
  • the insulating support 110 is used to support the corresponding spiral segments or ring structures.
  • Multiple support units 100 are arranged around the heater 700 to jointly support the heater 700.
  • each support unit 100 includes a structure comprising a plurality of insulating supports 110, so that a first limit portion is provided at the first end of each insulating support 110, and a second limit portion is provided at the second end of the insulating support 110 opposite to the first end.
  • This allows the first limit portion of one of any two adjacent insulating supports 110 in each support unit 100 to cooperate with the second limit portion of the other in a limited manner along the first axis, thereby achieving a stacked connection of the plurality of insulating supports 110 in each support unit.
  • connection structure in which the first limit portion and the second limit portion cooperate in a limited manner along the first axis, rather than employing a through-rod connection structure of the related art that connects a plurality of insulating obstructions, there is no possibility of deformation of the through-rod causing compression of the heater 700, thereby avoiding the problem of deformation of the heater due to thermal expansion and contraction of the support device.
  • one of the first limiting portion and the second limiting portion can be a snap and the other can be a snap-fitting portion.
  • the snap and the snap-fitting portion can both be arranged on the same side of the insulating support body 110.
  • the snap of one of any two adjacent insulating support bodies 110 can be snapped into the snap-fitting portion of the other, so that the two adjacent insulating support bodies 110 are limited and fitted along the first axial direction.
  • one of the first limiting portion and the second limiting portion can be a first limiting protrusion 111, and the other can be a first limiting groove 112.
  • the first limiting protrusion 111 of any two adjacent insulating support bodies 110 in each support unit 100 can be plugged and matched with the first limiting groove 112 of the other, and the limiting cooperation is carried out along the first axis direction.
  • the first limiting protrusion 111 of any two adjacent insulating support bodies 110 in each support unit 100 can be plugged and matched with the first limiting groove 112 of the other in a direction perpendicular to the first axis direction.
  • the first limiting portion and the second limiting portion can also be other structures, and the embodiment of the present application does not impose specific restrictions on the first limiting portion and the second limiting portion.
  • the first limiting portion of one of any two adjacent insulating supports 110 in each support unit 100 is plugged into and mated with the second limiting portion of the other along a second axis direction (e.g., the direction indicated by q in FIG. 1 ).
  • the first limiting portion and the second limiting portion may also be limitedly mated along a third axis direction.
  • the third axis direction may be parallel to the direction in which the corresponding insulating support 110 points toward the center of the plurality of support units 100, such as the direction indicated by r in FIG. 1 . That is, the third axis directions corresponding to different insulating supports 110 in each support unit 100 are different.
  • the first axis direction, the second axis direction, and the third axis direction are perpendicular to each other.
  • the support device disclosed in the embodiment of the present application limits the first limiting portion of one of the two adjacent insulating support bodies 110 and the second limiting portion of the other along the third axis direction, and only plugs and mates along the second axis direction, so that the two adjacent insulating support bodies 110 are limited along the first axis direction and the third axis direction, thereby making the connection of the insulating support bodies 110 in each support unit 100 more stable.
  • first limiting portion of one of the two adjacent insulating support bodies 110 and the second limiting portion of the other can also be limited and matched along the rotation direction around the second axis direction.
  • the support portion of the insulating support body 110 for supporting the heating body 700 can be spaced apart from the first limiting portion along the third axis direction.
  • the support portion of the insulating support body 110 for supporting the heating body 700 can be located on the side of the first limiting portion close to the center of the plurality of support units 100, so that when the heating body 700 relies on its gravity to press down the insulating support body 110, the two adjacent insulating support bodies 110 are limited and matched along the third axis direction and along the rotation direction around the second axis direction through the first limiting portion and the second limiting portion, so that the insulating support body 110 will not move significantly in the third axis direction, and will not rotate significantly in the rotation direction around the second axis direction, so that the insulating support body 110 supports the heating body 700 more stably.
  • the width of the top end of the first limiting protrusion 111 can be greater than the width of the bottom end of the first limiting protrusion 111, and the contour shape of the first limiting groove 112 can be adapted to the shape of the first limiting protrusion 111.
  • the first limiting protrusion 111 and the first limiting groove 112 can be limited and matched along the first axis and the third axis, as well as limited and matched along the rotation direction around the second axis.
  • the first limiting protrusion 111 can be a trapezoidal structure, or a structure formed by stacking and connecting multiple trapezoidal structures, or a special-shaped structure formed by sequentially distributing multiple protrusions and recesses.
  • the embodiments of the present application do not limit the specific structure of the first limiting protrusion 111.
  • the insulating support 110 may have a support recess 113 with an upward opening along the first axis, and the bottom of the support recess 113 may be used to support the heater 700.
  • the support recess 113 may be provided at a first end of the insulating support 110, with the first end of the insulating support 110 being located above a second end of the insulating support 110.
  • the supporting device disclosed in the embodiment of the present application is provided with a supporting recess 113 so that the bottom of the supporting recess 113 is used to support the heating body 700, thereby making the support more stable when the insulating support body 110 supports the heating body 700, and preventing the heating body 700 from separating from the insulating support body 110 after being deformed by heat.
  • the second end of any insulating support body 110 can block the opening of the support recess 113 of the adjacent insulating support body 110, thereby preventing the heating body 700 from detaching from the support recess 113 after being deformed by heat.
  • the support recess 113 can be a strip-shaped recess structure, and the extension direction of the strip-shaped recess structure is parallel to the third axis direction corresponding to the corresponding insulating support body 110, so that the support recess 113 can adapt to the displacement caused by thermal expansion and contraction of the heating body 700 after heating.
  • the heating body 700 has a spiral structure, and the inclination angle of the support surface of the insulating support body 110 supporting the heating body 700 can be the same as the spiral angle of the spiral structure, so that the support surface of the insulating support body 110 supporting the heating body 700 is completely in contact with the heating body 700, thereby increasing the support area of the insulating support body 110 supporting the heating body 700, thereby alleviating the deformation of the heating body 700 under the action of gravity after being heated and deformed.
  • the inclination angle of the support surface of the insulating support body 110 supporting the heating body 700 refers to the inclination angle of the support surface relative to the horizontal plane.
  • the two edges of the support surface along the direction in which the heating body 700 passes are rounded edges, thereby alleviating the problem of concentrated stress when the support surface supports the heating body 700 at the edge position.
  • a deformation gap 101 is provided between the first limiting protrusion 111 and the first limiting groove 112.
  • the support device may also include a mounting rail 200 extending along the first axis direction, and the insulating support 110 may include a rail fitting portion 114.
  • the multiple insulating supports 110 of each support unit 100 can be installed on the same mounting rail 200 along the first axis direction through the rail fitting portion 114, and the rail fitting portion 114 and the mounting rail 200 are limited and matched within a preset plane, wherein the preset plane is perpendicular to the first axis direction.
  • the mounting rail 200 can be made of ceramic material. Of course, the mounting rail 200 can also be made of other materials. The embodiments of the present application do not impose specific restrictions on the material of the mounting rail 200.
  • the support device disclosed in the embodiment of the present application is provided with a mounting rail 200, so that the multiple insulating support bodies 110 of each support unit 100 can be installed on the same mounting rail 200 along the first axis direction through the rail matching portion 114, and the rail matching portion 114 and the mounting rail 200 are limitedly matched within a preset plane, thereby improving the installation stability of the multiple insulating support bodies 110 in the same support unit 100.
  • the guide rail mating portion 114 can be a slot with a guard eave, the guard eave can be located at the slot opening of the slot, the mounting guide rail 200 can be a convex rail extending along the first axial direction, the slot can be sleeved on the convex rail along the first axial direction, and the guard eave and the convex rail can be matched in a limited direction along the slot opening of the slot, so that the convex rail can only move along the slot in the first axial direction.
  • the mounting rail 200 may be provided with a first mounting groove 210 extending along the first axial direction, and the rail mating portion 114 may be plugged into and fitted with the first mounting groove 210 along the first axial direction.
  • the mounting rail 200 may include a third limiting portion, and the rail mating portion 114 may include a fourth limiting portion.
  • the third limiting portion and the fourth limiting portion may be limited and fitted in the direction from the bottom of the first mounting groove 210 to the slot opening of the first mounting groove 210 (i.e., the direction of the slot opening), thereby making the structure of the mounting rail 200 relatively simple.
  • the side wall of the first mounting groove 210 and the guide rail matching portion 114 can be limitedly matched along the second axis direction, and the direction from the bottom of the first mounting groove 210 to the groove mouth of the first mounting groove 210 can be the third axis direction, and the first axis direction, the second axis direction and the third axis direction are perpendicular to each other.
  • one of the side wall of the first mounting groove 210 and the guide rail matching portion 114 can be provided with a second limiting protrusion 211, and the other can be provided with a second limiting groove 114a.
  • the second limiting protrusion 211 or the second limiting groove 114a located on the side wall of the first mounting groove 210 extends along the first axial direction.
  • the second limiting protrusion 211 and the second limiting groove 114a can be slidably matched along the first axial direction, and limitedly matched along the direction from the bottom of the first mounting groove 210 to the groove mouth of the first mounting groove 210; wherein, the third limiting portion includes one of the second limiting protrusion 211 and the second limiting groove 114a, and the fourth limiting portion includes the other of the second limiting protrusion 211 and the second limiting groove 114a.
  • the supporting device disclosed in the embodiment of the present application sets the third limiting portion as one of the second limiting protrusion 211 and the second limiting groove 114a, and sets the fourth limiting portion as the other of the second limiting protrusion 211 and the second limiting groove 114a, so that the structures of the third limiting portion and the fourth limiting portion are relatively simple and the cooperation is relatively stable.
  • the first limiting portion and the second limiting portion can be arranged relative to each other in the direction of the first axis, and both are arranged on the guide rail matching portion 114.
  • the second limiting protrusion 211 or the second limiting groove 114a located on the guide rail matching portion 114 extends to the first limiting portion and the second limiting portion in sequence along the direction of the first axis.
  • the support device disclosed in the embodiment of the present application arranges the first limiting portion and the second limiting portion in the guide rail matching portion 114, so that the first limiting portion and the second limiting portion can be hidden in the mounting guide rail 200, and the mounting guide rail 200 can protect the first limiting portion and the second limiting portion.
  • the support device may further include a heat-insulating member 300.
  • the heat-insulating member 300 may be mounted on the plurality of support units 100, thereby mitigating heat loss from the heating element 700 when heating the reaction chamber.
  • the heat-insulating member 300 may be a rigid structure.
  • the insulation component 300 may include a plurality of arc-shaped insulation sub-units 310 , and a second installation groove 311 extending along the first axis direction may be opened at the position of the arc-shaped insulation sub-unit 310 opposite to the support unit 100 , and each support unit 100 may be located in the corresponding second installation groove 311 .
  • the support device disclosed in the embodiment of the present application facilitates installation of the insulation member 300 by configuring the insulation member 300 to include a plurality of arc-shaped insulation subunits 310. Furthermore, the configuration of the insulation member 300 is more flexible.
  • the second mounting slots 311 are sleeved onto the corresponding support units 100, thereby facilitating installation of the insulation member 300 and improving the compactness of the support device structure.
  • the heater may further include a sliding portion 800.
  • the sliding portion 800 may be connected to the heating body 700.
  • the sliding portion 800 may be welded to the heating body 700.
  • the support device may further include a sliding fitting portion 400.
  • the sliding fitting portion 400 may be provided on the arc-shaped heat-insulating sub-unit 310.
  • the sliding fitting portion 400 may be provided with a sliding hole 410.
  • the sliding portion 800 may be slidably fitted with the sliding hole 410.
  • the sliding portion 800 and the sliding hole 410 may be slidably fitted in the radial direction of the heat-insulating member 300 sleeved on the plurality of support units 100, i.e., the third axis direction in the above-mentioned embodiment.
  • the support device disclosed in the embodiment of the present application is provided with a sliding fitting portion 400, so that the sliding fitting portion 400 can be provided on the arc-shaped heat-insulating sub-unit 310, and a sliding hole 410 is opened, so that the sliding portion 800 connected to the heating body 700 can slide and fit with the sliding hole 410, and can support and fit along the first axis direction, so that the heating body 700 can be better supported, and the support points of the heating body 700 are increased, which can prevent the heating body 700 from undergoing large deformation under the action of gravity.
  • the sliding fitting of the sliding portion 800 and the sliding hole 410 can better adapt to the deformation of the heating body 700 during thermal expansion and contraction.
  • the arc-shaped heat-insulating subunit 310 may have an opening, and the sliding fitting portion 400 may be disposed in the opening.
  • the sliding fitting portion 400 may be bonded to the opening, but the bonding method is not limited thereto.
  • the sliding fitting portion 400 disposed in the opening makes the installation of the sliding fitting portion 400 more stable.
  • the heating body 700 can be in a spiral structure
  • the support device can further include a support base 500.
  • the support base 500 can have an annular step structure 510.
  • the spiral angle formed by the line connecting the center points of the step surface 511 of the annular step structure 510 can be the same as the spiral angle of the spiral structure of the heating body 700.
  • the step surface 511 of the annular step structure 510 is used to support the support unit 100, so that the insulating support body 110 at the same position in multiple support units 100 can better support the same spiral segment of the heating body 700, thereby eliminating the need to set insulating support bodies 110 of different heights to adapt to the spiral structure of the heating body 700, which is conducive to simplifying the structure of the support device.
  • the bottom of the mounting rail 200 is installed in the mounting hole 520 of the support base 500, thereby making the installation of the mounting rail 200 more stable.
  • the support device may further include a top support member 910, through which the tops of the insulating supports 110 of the plurality of support units 100 are connected.
  • the top support member 910 may be made of corundum, thereby increasing the strength and flexural resistance of the top support member 910.
  • the top support member 910 may also be made of other materials, and the present embodiment does not impose any specific restrictions on the material of the top support member 910.
  • the present application also discloses a heater, which includes a heating body 700 and the supporting device disclosed in the above embodiment, so that the disclosed heater can avoid the problem of deformation of the heating body 700 caused by deformation of the supporting device due to thermal expansion and contraction.
  • the heater 700 is first pre-installed on the heater support fixture, which leaves a gap for the insulating support 110.
  • one insulating support 110 is installed from the gap in the heater 700 to a preset position, and then another insulating support 110 is installed in the gap between the adjacent heaters 700.
  • the two insulating supports 110 are then connected by a first stop and a second stop.
  • the guide rail 200 and the insulation member 300 are then installed, and finally the heater support fixture is removed.
  • the present application also discloses a semiconductor process equipment, which includes a reaction chamber and the heater disclosed in the above embodiment, and the heater is used to heat the reaction chamber.
  • the heater may further include a lead terminal 920.
  • One end of the lead terminal 920 is connected to the heating body 700, and the other end is connected to the power supply system.
  • the lead terminal 920 transmits electrical energy to the heating body 700, and the heating body 700 then converts the electrical energy into thermal energy.
  • the semiconductor process equipment disclosed in the embodiment of the present application can avoid the problem of deformation of the heating body caused by thermal expansion and contraction of the support device by providing the heater disclosed in the above embodiment.

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Abstract

本申请公开一种支撑装置、加热器和半导体工艺设备，所公开的支撑装置，应用于半导体工艺设备的加热器，以对加热器的加热体进行支撑，所公开的支撑装置包括多个支撑单元，多个支撑单元环绕设置，每个支撑单元均包括多个依次叠置的绝缘支撑体，每个绝缘支撑体的第一端部均设有第一限位部，绝缘支撑体的与第一端部相背的第二端部设有第二限位部；在每个支撑单元中任意相邻的两个绝缘支撑体中的一者的第一限位部与另一者的第二限位部沿第一轴线方向限位配合，绝缘支撑体用于与加热体支撑配合，其中，第一轴线方向与多个绝缘支撑体的叠置方向平行。上述方案可以解决相关技术中的加热体支撑装置在热胀冷缩变形后容易造成加热体变形的问题。

Description

支撑装置、加热器和半导体工艺设备 技术领域
本申请涉及半导体设备技术领域，尤其涉及一种支撑装置、加热器和半导体工艺设备。
背景技术
在半导体工艺设备(例如立式炉设备)制备集成电路的过程中，通常需要进行各种氧化、退火和薄膜生长等工艺。在进行各种热处理工艺时都需要在一定的温度下进行，因此，半导体工艺设备需要设置加热装置。
在相关技术中，加热装置主要采用螺旋绕制而成的加热体，并通过加热体支撑装置支撑加热体。为了避免加热体在相邻螺旋段之间搭接短路，加热体支撑装置通过在相邻螺旋段之间设置绝缘碍子，以保证加热体的节距。通常情况下，绝缘碍子的一端与加热体连接，以支撑加热体，加热体支撑装置的穿杆依次穿过位于同一列(加热体的螺旋轴线方向)的多个绝缘碍子的另一端的穿孔，以实现同一列的多个绝缘碍子的安装。穿杆的一端固定，另一端可自由伸缩，而且，穿杆与绝缘碍子的穿孔之间会留存一定的活动余量，从而适应穿杆热胀冷缩时的变形。
然而，在加热状态下，加热体会因受热而伸长，从而压在绝缘碍子边缘，这会使得穿杆与绝缘碍子的穿孔不同心，增大穿杆与绝缘碍子的穿孔之间的摩擦，从而无法吸收穿杆的热胀冷缩的变形，从而容易造成穿杆的变形。在多次积累后穿杆会发生严重变形，变形后的穿杆容易挤压加热体变形而使得加热体离开绝缘碍子的支撑区域，容易导致加热体在相邻螺旋段之间发生搭接短路而使得加热装置无法使用。
发明内容
本申请公开一种支撑装置、加热器和半导体工艺设备，以解决相关技术中的加热体支撑装置在热胀冷缩变形后容易造成加热体变形的问题。
为了解决上述技术问题，本申请是这样实现的：
第一方面，本申请公开一种支撑装置，应用于半导体工艺设备的加热器，以对所述加热器的加热体进行支撑，所述支撑装置包括多个支撑单元，所述多个支撑单元环绕设置，每个所述支撑单元均包括多个依次叠置的绝缘支撑体，每个所述绝缘支撑体的第一端部均设有第一限位部，所述绝缘支撑体的与所述第一端部相背的第二端部设有第二限位部；
在每个所述支撑单元中任意相邻的两个所述绝缘支撑体中的一者的所述第一限位部与另一者的所述第二限位部沿沿第一轴线方向限位配合，所述绝缘支撑体用于与所述加热体支撑配合，其中，所述第一轴线方向与多个所述绝缘支撑体的叠置方向平行。
第二方面，本申请还公开一种加热器，所公开的加热器包括加热体和第一方面所述的支撑装置。
第三方面，本申请还公开一种半导体工艺设备，所公开的半导体工艺设备包括反应腔室和第二方面所述的加热器，所述加热器用于对所述反应腔室加热。
本申请采用的技术方案能够达到以下技术效果：
本申请实施例公开的支撑装置通过将每个支撑单元设置为包括多个绝缘支撑体，使得每个绝缘支撑体的第一端部均设有第一限位部，绝缘支撑体的与第一端部相背的第二端部设有第二限位部，从而使得在每个支撑单元中任意相邻的两个绝缘支撑体中的一者的第一限位部与另一者的第二限位部沿第一轴线方向限位配合，从而实现每个支撑单元中的多个绝缘支撑体依次叠置、且相互连接。由于本申请实施例采用的是第一限位部与第二限位部沿第一轴线方向限位配合的连接结构，而不再采用相关技术中的穿杆连接多个绝缘碍子的结构，从而不会存在穿杆变形而挤压加热体变形的情况，进而可以避免支撑装置在热胀冷缩变形后造成加热体变形的问题。
附图说明
图1为本申请实施例公开的绝缘支撑体的结构示意图，其中，p表示第一轴线方向，q表示第二轴线方向，r表示第三轴线方向；
图2为图1在虚线位置处的剖视图；
图3为本申请实施例公开的相邻的两个绝缘支撑体的安装示意图；
图4为本申请实施例公开的绝缘支撑体与安装导轨的配合示意图；
图5为本申请实施例公开的绝缘支撑体与安装导轨配合的俯视图；
图6为本申请实施例公开的保温件的结构示意图；
图7为本申请实施例公开的弧形保温子单元的结构示意图；
图8为本申请实施例公开的滑动支撑部与滑动配合部配合的示意图；
图9为本申请实施例公开的滑动支撑部与滑动配合部配合的放大示意图；
图10为支撑底座的结构示意图；
图11为支撑单元安装于支撑底座的结构示意图；
图12为安装导轨安装于支撑底座的结构示意图；
图13为加热器的结构示意图；
图14为图13在俯视下的示意图；
图15为绝缘支撑体的支撑加热体的支撑面的倾斜角度与螺旋结构的螺旋角相同的情况下，绝缘支撑体与加热体的支撑配合的示意图。
附图标记说明：
100-支撑单元、101-形变间隙、110-绝缘支撑体、111-第一限位凸起、112-
第一限位凹槽、113-支撑凹陷、114-导轨配合部、114a-第二限位凹槽
200-安装导轨、210-第一安装槽、211-第二限位凸起、
300-保温件、310-弧形保温子单元、311-第二安装槽、
400-滑动配合部、410-滑孔、
500-支撑底座、510-环形阶梯结构、511-台阶面、
700-加热体、
800-滑动部、
910-顶部支撑件、920-引线端子。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚，下面将结合本申请具体实施例及相应的附图对本申请技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
以下结合附图，详细说明本申请各个实施例公开的技术方案。
请参考图1至图15，本申请实施例公开一种支撑装置，应用于半导体工艺设备的加热器，以对加热器的加热体700进行支撑。
所公开的支撑装置包括多个支撑单元100，多个支撑单元100环绕设置。每个支撑单元100均包括多个依次叠置的绝缘支撑体110。请参考图1至图3，每个绝缘支撑体110的第一端部均设有第一限位部，绝缘支撑体110的与第一端部相背的第二端部设有第二限位部。
在每个支撑单元100中任意相邻的两个绝缘支撑体110中的一者的第一限位部与另一者的第二限位部沿第一轴线方向(例如图1中的P所示方向)限位配合，以使相邻的两个绝缘支撑体110连接，以限制任意相邻的两个绝缘支撑体110沿第一轴线方向分离。
绝缘支撑体110用于与加热体700支撑配合，其中，第一轴线方向与多个绝缘支撑体110的叠置方向平行，第一限位部和第二限位部可以位于绝缘支撑体110的沿第一轴线方向相背的两个端部，即，绝缘支撑体110的第一端部和第二端部在第一轴线方向相背。
需要说明的是，加热体700通常为螺旋结构或为包括多个环状结构的结构，在每个支撑单元100中，加热体700的任意相邻的两个螺旋段之间或任意相邻的两个环状结构之间均对应设置有绝缘支撑体110，以避免任意相邻的两个螺旋段或任意相邻的两个环状结构之间搭接短路，且绝缘支撑体110用于支撑相应的螺旋段或环状结构。多个支撑单元100环绕加热体700设置，用于共同支撑加热体700。
本申请实施例公开的支撑装置通过将每个支撑单元100设置为包括多个绝缘支撑体110的结构，使得每个绝缘支撑体110的第一端部均设有第一限位部，绝缘支撑体110的与第一端部相背的第二端部设有第二限位部，从而使得在每个支撑单元100中任意相邻的两个绝缘支撑体110中的一者的第一限位部与另一者的第二限位部沿第一轴线方向限位配合，从而实现每个支撑单元中的多个绝缘支撑体110依次叠置连接。由于本申请实施例采用的是第一限位部与第二限位沿第一轴线方向限位配合的连接结构，而不再采用相关技术中的穿杆连接多个绝缘碍子的结构，从而不会存在穿杆变形而挤压加热体700变形的情况，进而可以避免支撑装置在热胀冷缩变形后造成加热体变形的问题。
具体地，第一限位部和第二限位部中的一者可以是卡扣、另一者可以是卡扣配合部，卡扣和卡扣配合部均可以设置于绝缘支撑体110的同一侧边，在每个支撑单元100中任意相邻的两个绝缘支撑体110中的一者的卡扣可以卡接于另一者的卡扣配合部，以使相邻的两个绝缘支撑体110沿第一轴线方向限位配合。
在另一种实施方式中，第一限位部和第二限位部中的一者可以是第一限位凸起111，另一者可以是第一限位凹槽112，在每个支撑单元100中任意相邻的两个绝缘支撑体110中的一者的第一限位凸起111可以与另一者的第一限位凹槽112插接配合，且沿第一轴线方向限位配合，在每个支撑单元100中任意相邻的两个绝缘支撑体110中的一者的第一限位凸起111与另一者的第一限位凹槽112可以在垂直于第一轴线方向的方向上插接配合。当然，第一限位部和第二限位部还可以是其它结构，本申请实施例对第一限位部和第二限位部不做具体限制。
为了使每个支撑单元100中的绝缘支撑体110连接更稳定，在一些实施例中，在每个支撑单元100中任意相邻的两个绝缘支撑体110中的一者的第一限位部与另一者的第二限位部沿第二轴线方向(例如图1中的q所示方向)插接配合，第一限位部与第二限位部还可以沿第三轴线方向限位配合，其中，第三轴线方向可以与相应的绝缘支撑体110指向多个支撑单元100的环绕中心的方向平行，例如图1中的r所示方向，即在每个支撑单元100中的不同绝缘支撑体110对应的第三轴线方向是不同的。第一轴线方向、第二轴线方向和第三轴线方向相互垂直。
本申请实施例公开的支撑装置通过将相邻的两个绝缘支撑体110中的一者的第一限位部与另一者的第二限位部还沿第三轴线方向限位配合，仅沿第二轴线方向插接配合，从而使得相邻的两个绝缘支撑体110沿第一轴线方向与第三轴线方向均被限位，从而使得每个支撑单元100中的绝缘支撑体110连接更稳定。
进一步地，相邻的两个绝缘支撑体110中的一者的第一限位部与另一者的第二限位部还可以沿环绕第二轴线方向的转动方向限位配合，绝缘支撑体110的用于支撑加热体700的支撑部可以与第一限位部在沿第三轴线方向上间隔分布，绝缘支撑体110的用于支撑加热体700的支撑部可以位于第一限位部靠近多个支撑单元100的环绕中心的一侧，从而在加热体700依靠其重力下压绝缘支撑体110时，相邻的两个绝缘支撑体110通过第一限位部与第二限位部沿第三轴线方向限位配合以及沿环绕第二轴线方向的转动方向限位配合，从而使得绝缘支撑体110不会在第三轴线方向发生较大的移动，以及不会沿环绕第二轴线方向的转动方向上发生较大的转动，从而使得绝缘支撑体110对加热体700的支撑更稳定。
例如，在第一限位部和第二限位部中的一者为第一限位凸起111，另一者为第一限位凹槽112的实施方式中，在沿第三轴线方向上，第一限位凸起111的顶端的宽度可以大于第一限位凸起111的底端的宽度，第一限位凹槽112的轮廓形状可以与第一限位凸起111的形状相适配，在第一限位凸起111与第一限位凹槽112沿第二轴线方向插接配合的情况下，第一限位凸起111与第一限位凹槽112可以沿第一轴线方向与第三轴线方向限位配合，以及沿环绕第二轴线方向的转动方向上限位配合。具体地，第一限位凸起111可以是梯形结构，或多个梯形结构叠置、且连接形成的结构，或由多个凸起与凹陷依次分布形成的异形结构，本申请实施例不限制第一限位凸起111的具体结构。
为了更稳定地支撑加热体700，在一些实施例中，绝缘支撑体110沿第一轴线方向可以开设有开口朝上的支撑凹陷113，支撑凹陷113的底部可以用于支撑加热体700。支撑凹陷113可以开设于绝缘支撑体110的第一端部，绝缘支撑体110的第一端部位于绝缘支撑体110的第二端部的上方。
本申请实施例公开的支撑装置通过设置支撑凹陷113，使得支撑凹陷113的底部用于支撑加热体700，从而在绝缘支撑体110支撑加热体700时支撑更稳定，而且可以防止加热体700在受热变形后脱离绝缘支撑体110。
为了防止加热体700在受热变形后从支撑凹陷113中脱离，在一些实施例中，在每个支撑单元100中，任意绝缘支撑体110的第二端部可以封堵相邻的绝缘支撑体110的支撑凹陷113的开口，从而可以防止加热体700在受热变形后从支撑凹陷113中脱离。
为了适应加热体700加热后热胀冷缩变形带来的位移，在一些实施例中，支撑凹陷113可以为条形凹陷结构，条形凹陷结构的延伸方向与相应的绝缘支撑体110对应的第三轴线方向平行，从而使得支撑凹陷113可以适应加热体700加热后热胀冷缩变形带来的位移。
为了增大绝缘支撑体110支撑加热体700的支撑面积，以缓解加热体700加热变形后在重力作用下的变形，在一些实施例中，加热体700呈螺旋结构，绝缘支撑体110的支撑加热体700的支撑面的倾斜角度可以与螺旋结构的螺旋角相同，以使绝缘支撑体110的支撑加热体700的支撑面与加热体700完全贴合，从而可以增大绝缘支撑体110支撑加热体700的支撑面积，进而缓解加热体700在受热变形后在重力作用下的变形。
需要说明的是，绝缘支撑体110的支撑加热体700的支撑面的倾斜角度是指支撑面相对于水平面的倾斜角度。
为了减小支撑面在边缘位置与加热体700支撑时的应力，在一些实施例中，支撑面的沿加热体700穿过的方向上的两个边缘均为圆角边缘，从而可以缓解支撑面在边缘位置与加热体700支撑时应力较集中的问题。
在第一限位部为第一限位凸起111，第二限位部为第一限位凹槽112的情况下，为了使同一支撑单元100中的绝缘支撑体110之间较好地适应热胀冷缩，在一些实施例中，第一限位凸起111与第一限位凹槽112之间具有形变间隙101。
为了提高同一支撑单元100中的多个绝缘支撑体110的安装稳定性，请参考图1、图4至图5，在一些实施例中，支撑装置还可以包括沿第一轴线方向延伸的安装导轨200，绝缘支撑体110可以包括导轨配合部114，每个支撑单元100的多个绝缘支撑体110可以通过导轨配合部114沿第一轴线方向安装于同一安装导轨200，且导轨配合部114与安装导轨200在预设平面内限位配合，其中，预设平面与第一轴线方向相互垂直。也就是说，导轨配合部114相对于安装导轨200在预设平面内的任意方向都不会发生较大运动，而只能沿第一轴线方向移动。安装导轨200可以是陶瓷材料，当然，安装导轨200还可以是其它材料，本申请实施例对安装导轨200的材料不做具体限制。
本申请实施例公开的支撑装置通过设置安装导轨200，使得每个支撑单元100的多个绝缘支撑体110可以通过导轨配合部114沿第一轴线方向安装于同一安装导轨200，且导轨配合部114与安装导轨200在预设平面内限位配合，从而可以提升同一支撑单元100中的多个绝缘支撑体110的安装稳定性。
具体地，导轨配合部114可以是具有挡檐的卡槽，挡檐可以位于卡槽的槽口，安装导轨200可以是沿第一轴线方向延伸的凸轨，卡槽可以沿第一轴线方向套设于凸轨，且挡檐与凸轨可以沿卡槽的槽口朝向限位配合，从而使得凸轨仅可以沿卡槽在第一轴线方向移动。
在另一种实施方式中，安装导轨200可以开设有沿第一轴线方向延伸的第一安装槽210，导轨配合部114与第一安装槽210沿第一轴线方向插接配合，安装导轨200可以包括第三限位部，导轨配合部114可以包括第四限位部，第三限位部与第四限位部可以沿自第一安装槽210的槽底至第一安装槽210的槽口的方向(即槽口的朝向)限位配合，从而使得安装导轨200的结构相对简单。
需要说明的是，第一安装槽210的侧壁与导轨配合部114可以沿第二轴线方向限位配合，自第一安装槽210的槽底至第一安装槽210的槽口的方向可以为第三轴线方向，第一轴线方向、第二轴线方向和第三轴线方向相互垂直。
进一步地，第一安装槽210的侧壁和导轨配合部114中的一者可以设有第二限位凸起211，另一者可以开设有第二限位凹槽114a，位于第一安装槽210的侧壁的第二限位凸起211或第二限位凹槽114a沿第一轴线方向延伸，在导轨配合部114与第一安装槽210沿第一轴线方向插接配合的情况下，第二限位凸起211与第二限位凹槽114a可以沿第一轴线方向滑动配合，且沿自第一安装槽210的槽底至第一安装槽210的槽口的方向限位配合；其中，第三限位部包括第二限位凸起211和第二限位凹槽114a中的一者，第四限位部包括第二限位凸起211和第二限位凹槽114a中的另一者。
本申请实施例公开的支撑装置通过将第三限位部设置为第二限位凸起211和第二限位凹槽114a中的一者，第四限位部设置为第二限位凸起211和第二限位凹槽114a中的另一者，从而使得第三限位部和第四限位部的结构相对简单，且配合也相对稳定。
在一些实施例中，第一限位部与第二限位部可以在第一轴线方向上相对设置，且均设于导轨配合部114，位于导轨配合部114的第二限位凸起211或第二限位凹槽114a沿第一轴线方向依次延伸至第一限位部与第二限位部。
本申请实施例公开的支撑装置通过将第一限位部与第二限位部均设于导轨配合部114，从而使得第一限位部与第二限位部可以隐藏在安装导轨200内，且安装导轨200可以对第一限位部与第二限位部进行防护。
为了缓解加热体700对反应腔室加热时热量的散失，请参考图5至图7，在一些实施例中，支撑装置还可以包括保温件300，保温件300可以套设于多个支撑单元100，从而可以缓解加热体700对反应腔室加热时热量的散失。保温件300可以是硬质结构。
具体地，保温件300可以包括多个弧形保温子单元310，弧形保温子单元310的与支撑单元100相对的位置可以开设有沿第一轴线方向延伸的第二安装槽311，每个支撑单元100可以位于对应的第二安装槽311内。
本申请实施例公开的支撑装置通过将保温件300设置为包括多个弧形保温子单元310的结构，从而便于保温件300的安装，而且保温件300的设置方式也更灵活。通过将第二安装槽311套设于对应的支撑单元100，从而有利于保温件300的安装，以及有利于支撑装置结构的紧凑性。
为了避免保温件300在加热后由于热胀冷缩而带起支撑单元100中多个绝缘支撑体110的移动而影响多个绝缘支撑体110的连接稳定性，在一些实施例中，支撑单元100与第二安装槽311之间可以具有间隙。
为了更好地支撑加热体700，以及防止加热体700在重力作用下发生较大的形变，请参考图8至图9，在一些实施例中，加热器还可以包括滑动部800，滑动部800可以与加热体700连接，例如，滑动部800可以与加热体700焊接。支撑装置还可以包括滑动配合部400，滑动配合部400可以设于弧形保温子单元310，滑动配合部400可以开设有滑孔410，滑动部800可以与滑孔410滑动配合，滑动部800与滑孔410可以在保温件300套设于多个支撑单元100的径向滑动配合，即上述实施例中的第三轴线方向。
本申请实施例公开的支撑装置通过设置滑动配合部400，使得滑动配合部400可以设于弧形保温子单元310，且开设有滑孔410，从而使得连接于加热体700的滑动部800可以与滑孔410滑动配合，且可以沿第一轴线方向支撑配合，从而可以较好地对加热体700支撑，对加热体700增加了支撑点位，可以防止加热体700在重力作用下发生较大的形变，而且，滑动部800与滑孔410滑动配合可以较好地适应加热体700在热胀冷缩时发生的变形。
具体地，弧形保温子单元310可以开设有开孔，滑动配合部400可以设于开孔内，具体滑动配合部400可以是粘接至开孔，但不限制于粘接的方式。滑动配合部400设于开孔内使得滑动配合部400的安装更稳定。
请参考图10至图12，在一些实施例中，加热体700可以呈螺旋结构，支撑装置还可以包括支撑底座500，支撑底座500可以具有环形阶梯结构510，环形阶梯结构510的台阶面511的中心点的连线形成的螺旋角可以与加热体700的螺旋结构的螺旋角相同，环形阶梯结构510的台阶面511用于支撑支撑单元100，从而使得多个支撑单元100中同一位置的绝缘支撑体110可以较好地支撑加热体700的同一螺旋段，从而无需设置不同高度的绝缘支撑体110以适应加热体700的螺旋结构，从而有利于简化支撑装置的结构。
在一些实施例中，在支撑装置包括沿第一轴线方向延伸的安装导轨200的情况下，安装导轨200的底部安装于支撑底座500的安装孔520内，从而使得安装导轨200的安装更稳定。
在一些实施例中，支撑装置还可以包括顶部支撑件910，多个支撑单元100的绝缘支撑体110的顶部通过顶部支撑件910连接，顶部支撑件910可以是刚玉材料，从而可以提高顶部支撑件910的强度，以及提高抗折能力。当然，顶部支撑件910还可以是其它材料，本申请实施例对顶部支撑件910的材料不做具体限制。
本申请还公开一种加热器，所公开的加热器包括加热体700和上述实施例公开的支撑装置，从而使得所公开的加热器可以避免支撑装置在热胀冷缩变形后造成加热体700变形的问题。
一种具体的加热器的组装过程，首先将加热体700提前安装在加热体支撑工装上，加热体支撑工装留有绝缘支撑体110的安装间隙。同一支撑单元100安装时，将一个绝缘支撑体110从加热体700的间隙中安装至预设位置，再将另外一个绝缘支撑体110安装至相邻的加热体700的间隙中，两个绝缘支撑体110再通过第一限位部和第二限位部连接，再安装安装导轨200和保温件300，最后再拆除加热体支撑工装。
本申请还公开一种半导体工艺设备，所公开的半导体工艺设备包括反应腔室和上述实施例公开的加热器，加热器用于对反应腔室加热。
请参考图13，加热器还可以包括引线端子920，引线端子920的一端与加热体700连接，另一端与供电系统连接，引线端子920为加热体700传递电能，加热体700再将电能转化为热能。
本申请实施例公开的半导体工艺设备通过设置上述实施例公开的加热器，可以避免支撑装置在热胀冷缩变形后造成加热体变形的问题。
本申请上文实施例中重点描述的是各个实施例之间的不同，各个实施例之间不同的优化特征只要不矛盾，均可以组合形成更优的实施例，考虑到行文简洁，在此则不再赘述。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (16)

  1. 一种支撑装置，应用于半导体工艺设备的加热器，以对所述加热器的加热体进行支撑，其特征在于，所述支撑装置包括多个支撑单元，所述多个支撑单元环绕设置，每个所述支撑单元均包括多个依次叠置的绝缘支撑体，每个所述绝缘支撑体的第一端部均设有第一限位部，所述绝缘支撑体的与所述第一端部相背的第二端部设有第二限位部；
    在每个所述支撑单元中任意相邻的两个所述绝缘支撑体中的一者的所述第一限位部与另一者的所述第二限位部沿第一轴线方向限位配合，所述绝缘支撑体用于与所述加热体支撑配合，其中，所述第一轴线方向与多个所述绝缘支撑体的叠置方向平行。
  2. 根据权利要求1所述的支撑装置，其特征在于，在每个所述支撑单元中任意相邻的两个所述绝缘支撑体中的一者的所述第一限位部与另一者的所述第二限位部沿第二轴线方向插接配合，所述第一限位部与所述第二限位部还沿第三轴线方向限位配合，其中，所述第三轴线方向与相应的所述绝缘支撑体指向所述多个支撑单元的环绕中心的方向平行，所述第一轴线方向、所述第二轴线方向和所述第三轴线方向相互垂直。
  3. 根据权利要求2所述的支撑装置，其特征在于，所述绝缘支撑体沿所述第一轴线方向开设有开口朝上的支撑凹陷，所述支撑凹陷的底部用于支撑所述加热体。
  4. 根据权利要求3所述的支撑装置，其特征在于，在每个所述支撑单元中，任意所述绝缘支撑体的第二端部封堵相邻的所述绝缘支撑体的所述支撑凹陷的开口。
  5. 根据权利要求3所述的支撑装置，其特征在于，所述支撑凹陷为条形凹陷结构，所述条形凹陷结构的延伸方向与相应的所述绝缘支撑体对应的所述第三轴线方向平行。
  6. 根据权利要求1所述的支撑装置，其特征在于，所述加热体呈螺旋结构，所述绝缘支撑体的支撑所述加热体的支撑面的倾斜角度与所述螺旋结构的螺旋角相同。
  7. 根据权利要求1所述的支撑装置，其特征在于，所述第一限位部为第一限位凸起，所述第二限位部为第一限位凹槽，所述第一限位凸起与所述第一限位凹槽之间具有形变间隙。
  8. 根据权利要求1所述的支撑装置，其特征在于，所述支撑装置还包括沿所述第一轴线方向延伸的安装导轨，所述绝缘支撑体包括导轨配合部，每个所述支撑单元的多个所述绝缘支撑体通过所述导轨配合部沿所述第一轴线方向安装于同一所述安装导轨，且所述导轨配合部与所述安装导轨在预设平面内限位配合，其中，所述预设平面与所述第一轴线方向相互垂直。
  9. 根据权利要求8所述的支撑装置，其特征在于，所述安装导轨开设有沿所述第一轴线方向延伸的第一安装槽，所述安装导轨包括第三限位部，所述导轨配合部包括第四限位部，所述导轨配合部与所述第一安装槽沿所述第一轴线方向插接配合，所述第三限位部与所述第四限位部沿自所述第一安装槽的槽底至所述第一安装槽的槽口的方向限位配合。
  10. 根据权利要求1所述的支撑装置，其特征在于，所述支撑装置还包括保温件，所述保温件套设于多个所述支撑单元。
  11. 根据权利要求10所述的支撑装置，其特征在于，所述保温件包括多个弧形保温子单元，所述弧形保温子单元的与所述支撑单元相对的位置开设有沿所述第一轴线方向延伸的第二安装槽，每个所述支撑单元位于对应的所述第二安装槽内，所述支撑单元与所述第二安装槽之间具有间隙。
  12. 根据权利要求11所述的支撑装置，其特征在于，所述加热器还包括滑动部，所述滑动部与所述加热体连接，所述支撑装置还包括滑动配合部，所述滑动配合部设于所述弧形保温子单元，所述滑动配合部开设有滑孔，所述滑动部与所述滑孔滑动配合。
  13. 根据权利要求1至12任一项所述的支撑装置，其特征在于，所述加热体呈螺旋结构，所述支撑装置还包括支撑底座，所述支撑底座具有环形阶梯结构，所述环形阶梯结构的台阶面的中心点的连线形成的螺旋角与所述加热体的螺旋结构的螺旋角相同，所述环形阶梯结构的台阶面用于支撑所述支撑单元。
  14. 根据权利要求13项所述的支撑装置，其特征在于，在所述支撑装置包括沿所述第一轴线方向延伸的所述安装导轨的情况下，所述安装导轨的底部安装于所述支撑底座的安装孔内。
  15. 一种加热器，其特征在于，包括加热体和权利要求1至14任一项所述的支撑装置。
  16. 一种半导体工艺设备，其特征在于，包括反应腔室和权利要求15所述的加热器，所述加热器用于对所述反应腔室加热。
PCT/CN2025/080148 2024-03-15 2025-03-03 支撑装置、加热器和半导体工艺设备 Pending WO2025190095A1 (zh)

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