WO2025002946A1 - Electronic assembly and high voltage box with an electronic assembly - Google Patents

Electronic assembly and high voltage box with an electronic assembly Download PDF

Info

Publication number
WO2025002946A1
WO2025002946A1 PCT/EP2024/067108 EP2024067108W WO2025002946A1 WO 2025002946 A1 WO2025002946 A1 WO 2025002946A1 EP 2024067108 W EP2024067108 W EP 2024067108W WO 2025002946 A1 WO2025002946 A1 WO 2025002946A1
Authority
WO
WIPO (PCT)
Prior art keywords
main surface
thermally conductive
electronic
substrate
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2024/067108
Other languages
French (fr)
Inventor
Sri Gautham Elangovan
Gerald Reichl
Jens Reiter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vitesco Technologies Germany GmbH
Original Assignee
Vitesco Technologies Germany GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vitesco Technologies Germany GmbH filed Critical Vitesco Technologies Germany GmbH
Priority to CN202480037211.4A priority Critical patent/CN121336502A/en
Publication of WO2025002946A1 publication Critical patent/WO2025002946A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling

Definitions

  • the present invention relates to an electronic assembly and a high-voltage box for an electrically driven vehicle comprising such an assembly.
  • Active or passive cooling concepts are known, wherein active cooling concepts often include a liquid cooler, which comprises a cooling liquid circling in cooling channels in thermal contact with the components to be cooled.
  • an electronic assembly comprising a substrate having a first main surface and a second main surface and comprising at least one electronic component having a first main surface and a second main surface.
  • the electronic component is arranged with its second main surface on the first main surface of the substrate and external contacts on the second main surface of the electronic component are electrically conductively connected to contact surfaces on the first main surface of the substrate.
  • the electronic assembly further comprises a cooling structure comprising a liquid cooler having a housing in which at least one cooling channel is formed in which a cooling liquid is guided.
  • the housing has a first main surface and a second main surface. Its first main surface is disposed adjacent to the second main surface of the substrate.
  • the cooling structure further comprises a thermally conductive body disposed on the first main surface of the at least one electronic component.
  • the thermally conductive body may be disposed directly on the first main surface of the at least one electronic component.
  • TIM thermal interface material
  • the thermally conductive body is thermally conductively, but electrically insulatingly connected to the first main surface of the electronic component.
  • the thermally conductive body is in contact with at least one thermally conductive spacer, said thermally conductive spacer extending through said substrate into said housing of the liquid cooler.
  • the spacer By the spacer extending through the substrate into the housing of the liquid cooler it is understood that at least a part of the spacer is surrounded by material of the housing and thus in close thermal contact with the housing. It is possible to provide a bore or an opening in the housing into which a part of the spacer extends.
  • the electronic assembly has the advantage that it enables cooling of the at least one electronic component not only from one main surface, but from both main surfaces.
  • the first main surface of the component is also connected to the cooling liquid via the cooling structure, while the second main surface is connected via the substrate to the liquid cooler.
  • Heat is thus not only dissipated via the second main surface of the electronic component, which is electrically conductive and thermally connected to the substrate via metallic contact surfaces that conduct heat well. Rather, a second heat conduction path to the liquid cooler is provided via the first main surface of the electronic component.
  • the first main surface and second main surface are typically referred to here as opposing main surfaces of a cuboid or rather sheet-like body.
  • the thermally conductive body is formed as a metal sheet. It may be formed of aluminum alloy. Such a metal sheet is easy to manufacture, easy to assemble and conducts heat well.
  • a plurality of electronic components is disposed on the first main surface of the substrate, and the thermally conductive body is in contact with a plurality of electronic components.
  • the thermally conductive body provides a heat path not only for one electronic component, but for several electronic components on the same substrate.
  • a thermal interface material is disposed between the main surface of the at least one electronic component and the thermally conductive body.
  • Thermal interface materials are used to improve the heat transfer from an electronic component to an adjacent element. They may be applied in the form of e.g. a paste or a tape or an adhesive film or a pad. In addition to increasing the heat transfer, they also compensate for tolerances between components.
  • An electrically insulating film may be disposed between the first main surface of the at least one electronic component and the thermally conductive body.
  • the electrically insulating film provides electric isolation between the electronic component and the thermally conductive body and is advantageous in particular with power components.
  • the thermal interface material may be applied directly to the first main surface of the at least one electronic component, while the electrically insulating film may be applied to the second main surface of the thermally conductive body which is then brought into contact with the thermal interface material on the surface of the electronic component.
  • the thermally conductive spacer may be formed of a metal, in particular of an aluminum alloy, which conducts heat very well and is relatively lightweight.
  • the thermally conductive spacer comprises a screw and a rod having an upper end and a lower end, the lower end extending into the housing of the liquid cooler and the rod having an axial bore at the upper end into which this screw is threadable so that the screw extends through an opening in the thermally conductive body into the rod.
  • the axial bore at the upper end may comprise an internal thread corresponding to a thread of the screw.
  • the bore does not comprise an internal thread, but if a self-tapping, in particular a thread-cutting screw is used. This has the advantage, that, if the bore has the same diameter as the lower end, the lower end of one rod is prevented from threading itself into the bore at the upper end of the next rod in a feeding line.
  • the screw can be used to fasten the thermally conductive body to the rod.
  • the screw is also used to press the thermally conductive body towards the electronic components and bring the thermally conductive body into close contact with the at least one electronic component.
  • a further substrate having a first main surface and the second main surface is arranged with its first main surface on the second main surface of the liquid cooler, and further electronic components are arranged on a second main surface of the further substrate.
  • both sides of the liquid cooler are used to mount electronic components.
  • This arrangement can be advantageous, if a larger number of components should be cooled.
  • the electronic components arranged on the further substrate may also be cooled from their second side as described above for the first substrate.
  • the at least one electronic component is configured as a power semiconductor component or as an electromechanical component. These kinds of components might have high losses and therefore generate a comparatively large amount of heat during operation.
  • a high-voltage box for an electrically driven vehicle comprising at least one electronic assembly as described above, wherein the at least one electronic component is designed as a component of a DC/DC converter or an on-board charger of the vehicle.
  • FIG. 1 The only figure shows a cross-section through an electronic assembly according to an embodiment of the invention.
  • the electronic assembly 1 comprises two electronic components 5 with a first main surface 6 and a second main surface 7 which are arranged with their second main surfaces 7 on a first main surface 3 of a substrate 2.
  • the electronic components 5 have external contacts which are not shown in the figure and which are electrically conductively connected to contact surfaces on the first main surface 3 of the substrate 2.
  • the substrate 2 is arranged with its second main surface 4 on the first main surface 23 of the housing 9 of a liquid cooler 8.
  • a further substrate with electronic components may be arranged on a second main surface 24 of the housing 9.
  • At least one cooling channel 10 is formed through which a cooling liquid is guided.
  • the housing 9 of the liquid cooler aids may be of a diecast aluminium alloy.
  • the electronic components 5 are arranged with their second main surfaces 7 on the housing 9 of the liquid cooler 8, the second main surfaces 7 of the electronic components 5 are cooled by the liquid cooler 8.
  • the electronic assembly 1 further comprises a cooling structure comprising a thermally conductive body 11 arranged on the first main surface 6 of the electronic components 5 and thermally connecting the first main surfaces 6 of the electronic components 5 to the liquid cooler 8.
  • the cooling structure comprises the thermally conductive body 11 having a first main surface 21 and a second main surface 22.
  • a thermal interface material 16 is arranged on the first main surfaces 6 of the electronic components 5.
  • an electrically insulating film 17 is provided on the second main surface 22 of the thermally conductive body 11 .
  • the thermally conductive body 11 is thermally, but not electrically, coupled to the first main surfaces 6 of the electronic components 5.
  • the thermally conductive body 11 is in thermal contact with the liquid cooler 8 via a thermally conductive spacer 20 comprising a rod 12 and a screw 15.
  • the rod 12 has an upper end 13 with an axial bore 26, into which the screw 15 is threadable to fasten the thermally conductive body 11 to the rod 12 and to press the thermally conductive body 11 towards the electronic components 5.
  • the screw 15 is a thread-cutting screw which cuts an internal thread into the bore 26 when first threaded into the bore 26.
  • the rod 12 On the lower end 14, the rod 12 has a thread which corresponds to a threaded bore 25 in the housing 9 of the liquid cooler 8.
  • the rod 12 of the spacer 20 extends into the housing 9 of the liquid cooler 8 and provides a thermal path to transfer heat from the first main surfaces 6 of the electronic components 5 into the liquid cooler 8.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

An electronic assembly (1) comprising - a substrate (2) having a first main surface (3) and a second main surface (4), - at least one electronic component (5) having a first main surface (6) and a second main surface (7), the electronic component (5) being arranged with its second main surface (7) on the first main surface (3) of the substrate (2), and external contacts on the second main surface (7) of the at least one electronic component (5) being electrically conductively connected to contact surfaces on the first main surface (3) of the substrate (2); - a cooling structure comprising a liquid cooler (8) having a housing (9) in which at least one cooling channel (10) is formed in which a cooling liquid is guided, the housing (9) having a first main surface (23) and a second main surface (24) and its first main surface (23) being disposed adjacent to the second main surface (4) of the substrate (2), the cooling structure further comprising a thermally conductive body (11) disposed on the first main surface (6) of the at least one electronic component (5), wherein the thermally conductive body (11) is thermally conductively, but electrically insulatedly connected to the first main surface (6) of the electronic component (5), said thermally conductive body (11) being in contact with at least one thermally conductive spacer (20), said thermally conductive spacer (20) extending through said substrate (2) into said housing (9) of the liquid cooler (8).

Description

Specification
Electronic assembly and high voltage box with an electronic assembly
The present invention relates to an electronic assembly and a high-voltage box for an electrically driven vehicle comprising such an assembly.
In the case of electronic assemblies which experience high losses during operation, for example because they comprise power semiconductor components and/or electromechanical components, efficient cooling is often important. Active or passive cooling concepts are known, wherein active cooling concepts often include a liquid cooler, which comprises a cooling liquid circling in cooling channels in thermal contact with the components to be cooled.
There is a need for cooling concepts for different arrangements of electronic components.
It is therefore a task of the present invention to specify an electronic assembly in which electronic components with particularly high cooling requirements are connected to cooling structures in a particularly effective manner.
Advantageous embodiments and further embodiments are subjects of the dependent claims.
According to an aspect of the invention, an electronic assembly is disclosed comprising a substrate having a first main surface and a second main surface and comprising at least one electronic component having a first main surface and a second main surface. The electronic component is arranged with its second main surface on the first main surface of the substrate and external contacts on the second main surface of the electronic component are electrically conductively connected to contact surfaces on the first main surface of the substrate.
The electronic assembly further comprises a cooling structure comprising a liquid cooler having a housing in which at least one cooling channel is formed in which a cooling liquid is guided. The housing has a first main surface and a second main surface. Its first main surface is disposed adjacent to the second main surface of the substrate. The cooling structure further comprises a thermally conductive body disposed on the first main surface of the at least one electronic component. The thermally conductive body may be disposed directly on the first main surface of the at least one electronic component. However, it is often advantageous to provide a thermal interface material (TIM) and/or an electric isolation between the thermally conductive body and the at least one electronic component as described below.
The thermally conductive body is thermally conductively, but electrically insulatingly connected to the first main surface of the electronic component. The thermally conductive body is in contact with at least one thermally conductive spacer, said thermally conductive spacer extending through said substrate into said housing of the liquid cooler.
By the spacer extending through the substrate into the housing of the liquid cooler it is understood that at least a part of the spacer is surrounded by material of the housing and thus in close thermal contact with the housing. It is possible to provide a bore or an opening in the housing into which a part of the spacer extends.
The electronic assembly has the advantage that it enables cooling of the at least one electronic component not only from one main surface, but from both main surfaces. For this purpose, the first main surface of the component is also connected to the cooling liquid via the cooling structure, while the second main surface is connected via the substrate to the liquid cooler. Heat is thus not only dissipated via the second main surface of the electronic component, which is electrically conductive and thermally connected to the substrate via metallic contact surfaces that conduct heat well. Rather, a second heat conduction path to the liquid cooler is provided via the first main surface of the electronic component.
The first main surface and second main surface are typically referred to here as opposing main surfaces of a cuboid or rather sheet-like body.
According to an embodiment of the invention, the thermally conductive body is formed as a metal sheet. It may be formed of aluminum alloy. Such a metal sheet is easy to manufacture, easy to assemble and conducts heat well.
According to the embodiments of the invention, a plurality of electronic components is disposed on the first main surface of the substrate, and the thermally conductive body is in contact with a plurality of electronic components. According to this embodiment, the thermally conductive body provides a heat path not only for one electronic component, but for several electronic components on the same substrate.
According to an embodiment of the invention, a thermal interface material (TIM) is disposed between the main surface of the at least one electronic component and the thermally conductive body. Thermal interface materials are used to improve the heat transfer from an electronic component to an adjacent element. They may be applied in the form of e.g. a paste or a tape or an adhesive film or a pad. In addition to increasing the heat transfer, they also compensate for tolerances between components.
An electrically insulating film may be disposed between the first main surface of the at least one electronic component and the thermally conductive body. The electrically insulating film provides electric isolation between the electronic component and the thermally conductive body and is advantageous in particular with power components.
If a thermal interface material and an electrically insulating film are combined, the thermal interface material may be applied directly to the first main surface of the at least one electronic component, while the electrically insulating film may be applied to the second main surface of the thermally conductive body which is then brought into contact with the thermal interface material on the surface of the electronic component.
The thermally conductive spacer may be formed of a metal, in particular of an aluminum alloy, which conducts heat very well and is relatively lightweight.
According to an embodiment of the invention, the thermally conductive spacer comprises a screw and a rod having an upper end and a lower end, the lower end extending into the housing of the liquid cooler and the rod having an axial bore at the upper end into which this screw is threadable so that the screw extends through an opening in the thermally conductive body into the rod.
The axial bore at the upper end may comprise an internal thread corresponding to a thread of the screw. However, it may be advantageous if the bore does not comprise an internal thread, but if a self-tapping, in particular a thread-cutting screw is used. This has the advantage, that, if the bore has the same diameter as the lower end, the lower end of one rod is prevented from threading itself into the bore at the upper end of the next rod in a feeding line.
According to these embodiments, the screw can be used to fasten the thermally conductive body to the rod. The screw is also used to press the thermally conductive body towards the electronic components and bring the thermally conductive body into close contact with the at least one electronic component.
According to an embodiment of the invention, a further substrate having a first main surface and the second main surface is arranged with its first main surface on the second main surface of the liquid cooler, and further electronic components are arranged on a second main surface of the further substrate.
In this case, both sides of the liquid cooler are used to mount electronic components. This arrangement can be advantageous, if a larger number of components should be cooled. The electronic components arranged on the further substrate may also be cooled from their second side as described above for the first substrate.
According to an embodiment of the invention, the at least one electronic component is configured as a power semiconductor component or as an electromechanical component. These kinds of components might have high losses and therefore generate a comparatively large amount of heat during operation.
According to an aspect of the invention, a high-voltage box for an electrically driven vehicle is provided, comprising at least one electronic assembly as described above, wherein the at least one electronic component is designed as a component of a DC/DC converter or an on-board charger of the vehicle.
Exemplary embodiments are shown in the figure. The only figure shows a cross-section through an electronic assembly according to an embodiment of the invention.
The electronic assembly 1 comprises two electronic components 5 with a first main surface 6 and a second main surface 7 which are arranged with their second main surfaces 7 on a first main surface 3 of a substrate 2. The electronic components 5 have external contacts which are not shown in the figure and which are electrically conductively connected to contact surfaces on the first main surface 3 of the substrate 2.
The substrate 2 is arranged with its second main surface 4 on the first main surface 23 of the housing 9 of a liquid cooler 8. A further substrate with electronic components may be arranged on a second main surface 24 of the housing 9.
In the housing 9 of the liquid cooler 8, at least one cooling channel 10 is formed through which a cooling liquid is guided. The housing 9 of the liquid cooler aids may be of a diecast aluminium alloy. As the electronic components 5 are arranged with their second main surfaces 7 on the housing 9 of the liquid cooler 8, the second main surfaces 7 of the electronic components 5 are cooled by the liquid cooler 8.
In order to provide cooling of the first main surface 6 of the electronic components 5, the electronic assembly 1 further comprises a cooling structure comprising a thermally conductive body 11 arranged on the first main surface 6 of the electronic components 5 and thermally connecting the first main surfaces 6 of the electronic components 5 to the liquid cooler 8.
The cooling structure comprises the thermally conductive body 11 having a first main surface 21 and a second main surface 22. On the first main surfaces 6 of the electronic components 5, a thermal interface material 16 is arranged. Adjacent to the thermal interface material 16, an electrically insulating film 17 is provided on the second main surface 22 of the thermally conductive body 11 . Hence, the thermally conductive body 11 is thermally, but not electrically, coupled to the first main surfaces 6 of the electronic components 5.
The thermally conductive body 11 is in thermal contact with the liquid cooler 8 via a thermally conductive spacer 20 comprising a rod 12 and a screw 15. The rod 12 has an upper end 13 with an axial bore 26, into which the screw 15 is threadable to fasten the thermally conductive body 11 to the rod 12 and to press the thermally conductive body 11 towards the electronic components 5. The screw 15 is a thread-cutting screw which cuts an internal thread into the bore 26 when first threaded into the bore 26.
On the lower end 14, the rod 12 has a thread which corresponds to a threaded bore 25 in the housing 9 of the liquid cooler 8. Thus, the rod 12 of the spacer 20 extends into the housing 9 of the liquid cooler 8 and provides a thermal path to transfer heat from the first main surfaces 6 of the electronic components 5 into the liquid cooler 8.
Hence, the spacer 20 extends through an opening 18 in the thermally conductive body 11 and a further opening in the substrate 2 into the housing 9. In the figure, only one spacer 20 is shown. However, the electronic assembly 1 may comprise a plurality of spacers 20 disposed next to the electronic components 5.

Claims

Patent claims
1 . An electronic assembly (1 ) comprising
- a substrate (2) having a first main surface (3) and a second main surface (4),
- at least one electronic component (5) having a first main surface (6) and a second main surface (7), the electronic component (5) being arranged with its second main surface (7) on the first main surface (3) of the substrate (2), and external contacts on the second main surface (7) of the at least one electronic component (5) being electrically conductively connected to contact surfaces on the first main surface (3) of the substrate (2);
- a cooling structure comprising a liquid cooler (8) having a housing (9) in which at least one cooling channel (10) is formed in which a cooling liquid is guided, the housing (9) having a first main surface (23) and a second main surface (24) and its first main surface (23) being disposed adjacent to the second main surface (4) of the substrate (2), the cooling structure further comprising a thermally conductive body (11 ) disposed on the first main surface (6) of the at least one electronic component
(5), wherein the thermally conductive body (11 ) is thermally conductively, but electrically insulatedly connected to the first main surface (6) of the electronic component (5), said thermally conductive body (11 ) being in contact with at least one thermally conductive spacer (20), said thermally conductive spacer (20) extending through said substrate (2) into said housing (9) of the liquid cooler (8).
2. Electronic assembly (1 ) according to claim 1 , wherein the thermally conductive body (11 ) is formed as a metal sheet.
3. Electronic assembly (1 ) according to claim 1 or 2, wherein a plurality of electronic components (5) is disposed on the first main surface (3) of the substrate (2), and the thermally conductive body (11 ) is in contact with a plurality of electronic components (5).
4. Electronic assembly (1 ) according to any one of claims 1 to 3, wherein a TIM (16) is disposed between the first main surface (6) of the at least one electronic component (5) and the thermally conductive body (11 ).
5. Electronic assembly (1 ) according to any one of claims 1 to 4, wherein an electrically insulating film (17) is disposed between the first main surface
(6) of the at least one electronic component (5) and the thermally conductive body 6. Electronic assembly (1 ) according to any of claims 1 to 5, wherein the thermally conductive spacer (20) is formed of metal.
7. Electronic assembly (1 ) according to any one of claims 1 to 6, wherein the thermally conductive spacer (20) comprises a screw (15) and a rod (12) having an upper end (13) and a lower end (14), the lower end (14) extending into the housing (9) of the liquid cooler (8) and the rod (12) having an axial bore (26) at the upper end (13) into which the screw (15) is threadable so that the screw (15) extends through an opening (18) in the thermally conductive body (11 ) into the rod (12).
8. Electronic assembly (1 ) according to claim 7, wherein the screw (15) is a self-tapping screw.
9. Electronic assembly (1 ) according to any one of claims 1 to 8, wherein a further substrate having a first main surface and a second main surface is arranged with its first main surface on the second main surface (24) of the liquid cooler (8), and further electronic components are arranged on a second main surface of the further substrate.
10. Electronic assembly (1 ) according to any one of claims 1 to 9, wherein the at least one electronic component (5) is configured as a power semiconductor component or as an electromechanical component.
11 . A high-voltage box for an electrically driven vehicle, comprising at least one electronic assembly (1 ) according to any one of claims 1 to 10, wherein the at least one electronic component (5) is designed as a component of a DC/DC converter or an on-board charger.
PCT/EP2024/067108 2023-06-28 2024-06-19 Electronic assembly and high voltage box with an electronic assembly Ceased WO2025002946A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202480037211.4A CN121336502A (en) 2023-06-28 2024-06-19 Electronic components and high-voltage boxes with electronic components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102023206084.1 2023-06-28
DE102023206084.1A DE102023206084B3 (en) 2023-06-28 2023-06-28 Electronic arrangement and high-voltage box with an electronic arrangement

Publications (1)

Publication Number Publication Date
WO2025002946A1 true WO2025002946A1 (en) 2025-01-02

Family

ID=91621321

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2024/067108 Ceased WO2025002946A1 (en) 2023-06-28 2024-06-19 Electronic assembly and high voltage box with an electronic assembly

Country Status (3)

Country Link
CN (1) CN121336502A (en)
DE (1) DE102023206084B3 (en)
WO (1) WO2025002946A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010033477A1 (en) * 2000-04-19 2001-10-25 Seiji Inoue Coolant cooled type semiconductor device
US20190179381A1 (en) * 2017-12-07 2019-06-13 Toyota Motor Engineering & Manufacturing North America, Inc. Integrated pcu and gpu cooling system

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002098454A (en) 2000-07-21 2002-04-05 Mitsubishi Materials Corp Liquid-cooled heat sink and method of manufacturing the same
US7746653B2 (en) 2008-01-02 2010-06-29 Harman International Industries Incorporated Clamp for electrical devices

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010033477A1 (en) * 2000-04-19 2001-10-25 Seiji Inoue Coolant cooled type semiconductor device
US20190179381A1 (en) * 2017-12-07 2019-06-13 Toyota Motor Engineering & Manufacturing North America, Inc. Integrated pcu and gpu cooling system

Also Published As

Publication number Publication date
DE102023206084B3 (en) 2024-10-31
CN121336502A (en) 2026-01-13

Similar Documents

Publication Publication Date Title
JP5326760B2 (en) Power converter
US9147634B2 (en) Semiconductor device, and on-board power conversion device
US11044839B2 (en) Electric power inverter
CN111817580A (en) DC link capacitor cooling system
US11062972B2 (en) Electronic module for power control and method for manufacturing an electronic module power control
JP6945671B2 (en) Power converter
US10135356B2 (en) Power conversion apparatus
JP7526672B2 (en) Power conversion device for vehicle and vehicle
US20220264769A1 (en) Power converter and method for manufacturing power converter
JP2018190965A (en) Power electronics device with DC voltage connection element
US11770915B2 (en) Electrical equipment comprising a busbar cooled by two faces of a heatsink
WO2014038299A1 (en) Power semiconductor module
JP7544878B2 (en) Battery system for an electrically or semi-electrically powered vehicle
US6940164B1 (en) Power module
US10438865B2 (en) Semiconductor device
US11870224B2 (en) High-voltage junction box for an electrically driven vehicle and electrically driven vehicle
EP1028439A1 (en) A power capacitor
US20240097417A1 (en) Electrical junction box
US12477694B2 (en) Circuit device
US20240282665A1 (en) Power semiconductor device
US20060175630A1 (en) Electronic power module comprising a rubber seal and corresponding production method
CN121336502A (en) Electronic components and high-voltage boxes with electronic components
US20240096727A1 (en) Power Semiconductor Device
CN117641833A (en) Intermediate circuit assembly
JP2023032753A (en) power converter

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 24735223

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 24735223

Country of ref document: EP

Kind code of ref document: A1