CN117641833A - Intermediate circuit assembly - Google Patents
Intermediate circuit assembly Download PDFInfo
- Publication number
- CN117641833A CN117641833A CN202311120270.1A CN202311120270A CN117641833A CN 117641833 A CN117641833 A CN 117641833A CN 202311120270 A CN202311120270 A CN 202311120270A CN 117641833 A CN117641833 A CN 117641833A
- Authority
- CN
- China
- Prior art keywords
- intermediate circuit
- circuit assembly
- cooler
- capacitor
- assembly according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims abstract description 78
- 238000001816 cooling Methods 0.000 claims abstract description 20
- 238000004382 potting Methods 0.000 claims description 19
- 230000003071 parasitic effect Effects 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 7
- WWTBZEKOSBFBEM-SPWPXUSOSA-N (2s)-2-[[2-benzyl-3-[hydroxy-[(1r)-2-phenyl-1-(phenylmethoxycarbonylamino)ethyl]phosphoryl]propanoyl]amino]-3-(1h-indol-3-yl)propanoic acid Chemical compound N([C@@H](CC=1C2=CC=CC=C2NC=1)C(=O)O)C(=O)C(CP(O)(=O)[C@H](CC=1C=CC=CC=1)NC(=O)OCC=1C=CC=CC=1)CC1=CC=CC=C1 WWTBZEKOSBFBEM-SPWPXUSOSA-N 0.000 description 7
- 229940126208 compound 22 Drugs 0.000 description 7
- 238000013461 design Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- HEZMWWAKWCSUCB-PHDIDXHHSA-N (3R,4R)-3,4-dihydroxycyclohexa-1,5-diene-1-carboxylic acid Chemical compound O[C@@H]1C=CC(C(O)=O)=C[C@H]1O HEZMWWAKWCSUCB-PHDIDXHHSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/12—Arrangements for reducing harmonics from ac input or output
- H02M1/123—Suppression of common mode voltage or current
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/44—Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Electromagnetism (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to an intermediate circuit assembly (1) of an electronic device (10), comprising a capacitor component (2) and a cooler (3) for cooling the capacitor component (2), wherein the capacitor component (2) is fastened directly to the cooler (3).
Description
Technical Field
The present invention relates to an intermediate circuit assembly and an electronic device including the intermediate circuit assembly.
Background
Power semiconductors in power electronics typically conduct high currents that can lead to high heat losses. Intermediate circuit capacitors are often used as energy buffers or accumulators for switching processes. Cooling of such intermediate circuit capacitors is often necessary, for example, to avoid damage due to overheating. For example, liquid cooling or air cooling can be used for this purpose.
Disclosure of Invention
The intermediate circuit assembly according to the invention with the features of claim 1 offers the advantage of a particularly simple and inexpensive construction with optimized electrical properties. Particularly good efficiency in terms of interference cancellation of the electronic circuit can be provided. Furthermore, improved cooling can be achieved. This is achieved according to the invention by an intermediate circuit assembly of an electronic device, which comprises a capacitor component and a cooler, which is designed to cool the capacitor component. The capacitor component is preferably fastened directly to the cooler by means of potting compound. That is, no further components, like for example a base plate for mounting and/or fixing, are arranged between the capacitor component and the cooler.
For example, materials which are present in a liquid or flowable state when the intermediate circuit capacitor is installed and which harden, for example, after installation, in order to obtain a fixed connection can be regarded as potting compound. In particular, a fixed mechanical connection between the capacitor component and the cooler can be provided by means of the potting compound.
The intermediate circuit capacitor thus offers the advantage of a structure with only few components. Thereby, on the one hand material and weight can be saved, for example due to the omission of the substrate. Furthermore, assembly can be simplified by saving of processing steps. The intermediate circuit assembly can thus be provided particularly cost-effectively.
Furthermore, the intermediate circuit capacitor offers the advantage that a high and very low induced parasitic capacitance, i.e. a disturbance-free capacitance of in particular class Y, i.e. a high Cy capacitance, which thus acts in a wide frequency range, can be provided by the direct arrangement of the capacitor element on the cooler. Preferably, the Cy capacitance is located between the capacitor element and the cooler. By arranging the capacitor component and the cooler next to one another, a series connection of a plurality of parasitic capacitances can be avoided, so that a particularly simple calculation and design of the total parasitic capacitance of the intermediate circuit assembly can be achieved. Thus, electromagnetic interference can flow back to the source of interference on a path of very low impedance, whereby the intermediate circuit assembly operates particularly efficiently. Furthermore, discrete filter elements can be saved by a particularly efficient parasitic Cy capacitance. Furthermore, the intermediate circuit assembly offers the advantage of particularly effective cooling by the immediate arrangement of the capacitor component and the cooler next to each other. In particular, heat conduction can be designed particularly directly and thus effectively.
The content of the dependent claims is a preferred development of the invention.
Preferably, the cooler and the capacitor component are designed such that together a predetermined parasitic capacitance is formed. In particular, the capacitance of the components of the intermediate circuit assembly, which is unavoidable and is caused by components, is regarded as parasitic capacitance. Such parasitic capacitances can be used in particular to reduce common mode interference, so-called CM interference, on systems for powering electronic components. By means of the common design of the cooler and the capacitor component, the electrical interference-free properties of the intermediate circuit assembly can be adapted particularly precisely to the respective purpose of use, in order to be able to provide an optimum efficiency of the intermediate circuit assembly.
It is particularly preferred that the capacitor means comprises a plurality of intermediate circuit capacitors. In particular, the intermediate circuit capacitors can be arranged next to one another on the upper side of the cooler and can be held relative to one another and/or relative to the cooler, for example by means of a potting compound. In this way, a particularly simple and efficient construction of the intermediate circuit capacitor can be provided.
Preferably, the intermediate circuit capacitor is designed as a film capacitor. This can provide, for example, particularly high electrical resistance and temperature resistance and high reliability of the capacitor component.
Preferably, the intermediate circuit capacitor further comprises an insulating element arranged on the side of the capacitor member facing the cooler. The insulating element can be configured, for example, as an insulating film. In particular, the insulating element is formed from an electrically insulating material. Preferably, the insulating element is held on the capacitor component by means of potting compound. Alternatively, the capacitor component and the insulating element can preferably be poured together into the potting compound. In this way, an advantageous electromechanical structure or design of the intermediate circuit assembly can be provided.
It is further preferred that the capacitor component is fastened directly to the cooler by means of potting compound. In particular, the potting compound is formed from a dielectric. Weakly or electrically non-conductive substances are regarded as dielectrics in particular. As the dielectric, for example, a gas, a liquid, or a solid can be used. In particular, a certain electrical insulation between the capacitor component and the cooler is thereby brought about by the potting compound. The choice of the dielectric, in particular thus for Epsilon R, can be used to design a parasitic Cy capacitance.
It is particularly preferred that the intermediate circuit assembly further comprises a heat conducting element arranged between the capacitor and the cooler. Preferably, the heat conducting element is a heat conducting glue. In particular, the heat-conducting element is designed to provide good heat conduction between the capacitor component and the cooler. Particularly effective cooling of the capacitor component can thereby be achieved. At the same time, the thermally conductive paste has a high Epsilon R coefficient, which in turn contributes to a high parasitic Cy interference-free capacitance.
The cooler is preferably designed in a deep-drawn manner in the direction of the capacitor component. In particular, the cooler is here at least partially formed as a sheet metal part. For example, the cooler can be formed from aluminum or an aluminum alloy for easy and cost-effective production. In particular, a geometrically advantageous arrangement of the components of the intermediate circuit assembly can be provided by means of the deep-drawing design of the cooler. For example, an optimal placement of the cooler in the vicinity of the capacitor component can thereby be achieved for providing optimal cooling. In this way, an intermediate circuit assembly with a flexible geometry can be produced in a particularly simple and cost-effective manner.
As an alternative or in addition to the deep drawn region, the cooler can preferably have a spreading (Aufdeckung) in the region of the capacitor component. Thereby, an optimal positioning or arrangement of the cooler and the capacitor component can also be provided.
Preferably, the intermediate circuit assembly further comprises a housing inside which the capacitor member and at least a part of the cooler are arranged. In particular, the housing can be designed to protect components of the intermediate circuit assembly from environmental influences and the like. The housing can be formed, for example, from plastic or metal.
Preferably, the intermediate circuit assembly further comprises two bus bars, wherein one of the two bus bars is arranged on each side of the capacitor element. Thereby, the two busbars are arranged on opposite sides of the capacitor member. For example, the busbar can be constructed at least in part in the form of a metal plate. In particular, the busbar is poured together into the potting compound. It is particularly preferred that the busbar is preferably connected to an intermediate circuit capacitor of the capacitor component.
It is particularly preferred that the cooler is designed to cool the capacitor component and/or the entire intermediate circuit assembly by means of liquid cooling and/or by means of thermal conduction. In the case of liquid cooling, the cooler can be flowed through, for example, by a cooling liquid for heat removal. This enables particularly efficient cooling. For cooling by means of heat conduction, the cooler can be composed of a material with high thermal conductivity, such as aluminum, for example. For example, heat can be removed in this case by means of air cooling outside the intermediate circuit assembly.
Furthermore, the invention relates to an electronic device comprising components of the power electronics and the described intermediate circuit assembly. In particular, the components of the power electronics and the intermediate circuit assembly are arranged spatially close to one another, so that the intermediate circuit assembly is designed to achieve electromagnetic interference suppression of the electronic device. In particular, an optimum operation of the components of the power electronics can be achieved thereby.
Preferably, the components of the power electronics are inverters, such as high-voltage drive converters, high-voltage DCDC converters, cooling and ventilation devices or other components of industrial drives, etc.
Drawings
The invention is described below with the aid of examples in connection with the accompanying drawings. In the drawings, functionally identical components are denoted by the same reference numerals, respectively. Here:
fig. 1 shows a simplified schematic diagram of an electronic device according to a preferred embodiment of the invention.
Detailed Description
Fig. 1 shows a simplified schematic diagram of an electronic device 10 according to the invention. The electronic device 10 comprises semiconductor components (not shown) of a power electronics. Preferably, the electronic device 10 is part of an inverter.
The electronic device 10 comprises an intermediate circuit assembly 1 which is provided for electromagnetic interference cancellation when the semiconductor components of the power electronics are in operation.
The intermediate circuit assembly 1 here comprises a plurality of intermediate circuit capacitors 21 which are provided to prevent electromagnetic interference from possibly leaving the system and possibly interfering with other systems. The intermediate circuit capacitor 21 is connected to the bus bars 71, 72 on both sides. The first busbar 71 is provided for a first potential, for example a negative electrode, and the second busbar 72 is provided for a second potential, for example a positive electrode.
The intermediate circuit capacitor 21 is configured as a film capacitor. Preferably, all intermediate circuit capacitors 21 are identically constructed.
The intermediate circuit capacitors 21 are jointly inserted, for example, into the potting compound 22. The potting compound 22 is formed from a material that serves as a dielectric. For example, the potting compound 22 can comprise a resin.
Additionally, the two bus bars 71, 72 are embedded in the potting compound 22.
Furthermore, the intermediate circuit assembly 1 comprises an insulating element 4, which is designed as an insulating film and is composed of an electrically insulating material. The insulating element 4 is arranged on the side of the second busbar 72 opposite the intermediate circuit capacitor 21. The insulating element 4 is likewise embedded in the potting compound 22.
The composite structure formed by the intermediate circuit capacitor 21, the busbars 71, 72, the insulating element 4 and the potting compound 22 together form the capacitor component 2.
Furthermore, the intermediate circuit assembly 1 comprises a cooler 3 which is provided for cooling the capacitor component 2. In particular, the intermediate circuit capacitor 21, which may generate significant heat during operation of the intermediate circuit assembly 1, should be cooled.
The cooler 3 is preferably designed to remove heat from the intermediate circuit assembly 1 by means of liquid cooling. Alternatively or additionally, the cooler 3 can be designed to remove heat from the intermediate circuit assembly 1 by means of heat conduction.
On the upper side facing the capacitor component 2, the cooler 3 has a heat-conducting element 5, which is in particular embodied as a heat-conducting glue, for enabling particularly good heat conduction and thus particularly good cooling.
The capacitor component 2 is fastened directly to the cooler 3, i.e. to one side of the heat-conducting element 5, by means of the potting compound 22. This gives rise to the following advantages, namely: particularly efficient heat removal can be achieved by means of the direct mechanical connection.
The following advantages are also produced: by means of the direct connection of the capacitor component 2 to the cooler 3, a structure can be provided with fewer components and thus fewer materials and weight, in particular because, for example, a base plate for fastening the individual components can be dispensed with.
A further advantage is that a high parasitic Cy capacitance of the intermediate circuit assembly 1 can be provided by the closely arranged arrangement of the capacitor element 2 and the cooler 3, whereby a particularly high interference suppression of the intermediate circuit assembly 1 can be achieved. By arranging the capacitor component 2 and the cooler 3 next to one another, a series connection of a plurality of parasitic capacitances can be avoided, as a result of which the overall parasitic capacitance of the intermediate circuit assembly 1 can be designed and calculated particularly easily.
The capacitor component 2 and the cooler 3 are designed in such a way that they together form a predetermined parasitic capacitance. Thanks to the above-mentioned advantageous direct arrangement and design of the intermediate circuit assembly 1 with few components, this can be achieved in a particularly simple and efficient manner, whereby the intermediate circuit assembly 1 can be provided particularly cost-effectively.
For an advantageous mechanical and geometric design of the intermediate circuit assembly 1, the cooler 3 is designed as a deep-drawn component, wherein the deep-drawn region of the cooler 3 is directed in the direction of the capacitor component 2. As a result, the cooler 3 and the cooling medium can be brought closer to the intermediate circuit, whereby better heat dissipation and a higher parasitic Cy capacitance can be present by a smaller distance between the cooler 3 and the busbar 72.
The housing 6 is designed in particular to protect the capacitor component 2 from environmental influences.
Claims (13)
1. An intermediate circuit assembly of an electronic device (10), the intermediate circuit assembly comprising:
-a capacitor member (2)
A cooler (3) for cooling the capacitor element (2),
-wherein the capacitor member (2) is directly fastened to the cooler (3).
2. Intermediate circuit assembly according to claim 1, wherein the cooler (3) and the capacitor means (2) are designed for together forming a predetermined parasitic capacitance.
3. Intermediate circuit assembly according to any of the preceding claims, wherein the capacitor means (2) comprises a plurality of intermediate circuit capacitors (21).
4. An intermediate circuit assembly according to claim 3, wherein the intermediate circuit capacitor (21) is configured as a film capacitor.
5. Intermediate circuit assembly according to any of the preceding claims, further comprising an insulating element (4) on the side of the capacitor member (2) facing the cooler (3).
6. Intermediate circuit assembly according to any of the preceding claims, wherein the capacitor member (2) is fastened on the cooler (3) by means of a potting compound (22), and wherein the potting compound (22) is formed of a dielectric.
7. Intermediate circuit assembly according to any of the preceding claims, further comprising a heat conducting element (5) arranged between the capacitor member (2) and the cooler (3).
8. Intermediate circuit assembly according to any of the preceding claims, wherein the cooler (3) is configured in a deep-drawn manner in the direction of the capacitor component (2).
9. Intermediate circuit assembly according to any of the preceding claims, further comprising a housing (6), at least a part of the cooler (3) and the capacitor member (2) being arranged inside the housing.
10. Intermediate circuit assembly according to any of the preceding claims, further comprising buss bars (71, 72) on opposite sides of the capacitor member (2), respectively.
11. Intermediate circuit assembly according to any of the preceding claims, wherein the cooler (3) is set up for cooling by means of liquid cooling and/or by means of heat conduction.
12. An electronic device, comprising:
component of a power electronic device
-an intermediate circuit assembly (1) according to any of the preceding claims.
13. The electronic device of claim 12, wherein the component of the power electronics is an inverter.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102022209102.7A DE102022209102A1 (en) | 2022-09-01 | 2022-09-01 | DC link arrangement |
| DE102022209102.7 | 2022-09-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117641833A true CN117641833A (en) | 2024-03-01 |
Family
ID=89905354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311120270.1A Pending CN117641833A (en) | 2022-09-01 | 2023-08-31 | Intermediate circuit assembly |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN117641833A (en) |
| DE (1) | DE102022209102A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009055376A1 (en) | 2009-12-29 | 2011-06-30 | Robert Bosch GmbH, 70469 | power capacitor |
| DE102011007315A1 (en) | 2011-04-13 | 2012-10-18 | Robert Bosch Gmbh | Storage unit for storing electrical energy with a cooling element |
| DE102011077924A1 (en) | 2011-06-21 | 2012-12-27 | Robert Bosch Gmbh | Storage unit for storing electrical energy with a heat pipe |
| CN108701541A (en) | 2016-02-25 | 2018-10-23 | 松下知识产权经营株式会社 | Capacitor |
| DE102019129783A1 (en) | 2019-11-05 | 2021-05-06 | Bayerische Motoren Werke Aktiengesellschaft | Highly integrated capacitor arrangement |
-
2022
- 2022-09-01 DE DE102022209102.7A patent/DE102022209102A1/en active Pending
-
2023
- 2023-08-31 CN CN202311120270.1A patent/CN117641833A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE102022209102A1 (en) | 2024-03-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10498250B2 (en) | Power converter | |
| CN111566927B (en) | Power converter for electric vehicle drive system | |
| US8547698B2 (en) | Cooling structure of capacitor and inverter device | |
| US6215679B1 (en) | Alternator power converter | |
| CN107863891B (en) | Power conversion device | |
| CN106712460B (en) | Power converter | |
| JP6458444B2 (en) | Power converter | |
| CN106953504B (en) | Electronic circuit unit | |
| JPH11274001A (en) | Electric power storage device and electric power conversion device using the same | |
| JP2009225612A (en) | Power module | |
| US20160150662A1 (en) | Electrical Circuit and Method for Producing an Electrical Circuit for Activating a Load | |
| WO2014038299A1 (en) | Power semiconductor module | |
| JP2018067998A (en) | Power converter | |
| JPWO2016189658A1 (en) | Mechanical and electric integrated rotating electrical machine | |
| US9923478B2 (en) | Capacitor arrangement and method for operating a capacitor arrangement | |
| WO2019208406A1 (en) | Power conversion device | |
| JP4538474B2 (en) | Inverter device | |
| CN108235785B (en) | Power conversion device | |
| JP2019195250A (en) | Power conversion device | |
| CN109313985B (en) | Electrode cooled capacitor assembly | |
| US20210273575A1 (en) | Power conversion device | |
| CN112106455A (en) | Power converter device for vehicle and vehicle | |
| KR102572440B1 (en) | DC capacitors and discharge resistors of vehicle inverter | |
| JP6070581B2 (en) | Terminal block and power conversion device including the terminal block | |
| CN114788432A (en) | Inverter with compact structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication |