WO2025001635A1 - 弹性波滤波器电热学性能实时仿真方法、系统及相关设备 - Google Patents

弹性波滤波器电热学性能实时仿真方法、系统及相关设备 Download PDF

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WO2025001635A1
WO2025001635A1 PCT/CN2024/094381 CN2024094381W WO2025001635A1 WO 2025001635 A1 WO2025001635 A1 WO 2025001635A1 CN 2024094381 W CN2024094381 W CN 2024094381W WO 2025001635 A1 WO2025001635 A1 WO 2025001635A1
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wave filter
elastic wave
real
simulation
heat transfer
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French (fr)
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周温涵
朱玉泉
关鹏
郭嘉帅
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Lansus Technologies Inc
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/10—Geometric CAD
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/36—Circuit design at the analogue level
    • G06F30/367—Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T17/00—Three-dimensional [3D] modelling for computer graphics
    • G06T17/20—Finite element generation, e.g. wire-frame surface description, tesselation
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/08—Thermal analysis or thermal optimisation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation

Definitions

  • the present invention is applicable to the fields of thermal simulation and wireless communication, and in particular relates to a method and system for real-time simulation of electrothermal performance of elastic wave filters and related equipment.
  • MEMS piezoelectric filters are constantly developing towards high frequency, low loss, high power tolerance, etc.
  • the higher the communication distance and quality requirements of the RF signal the greater the input power that the MEMS piezoelectric filter needs to withstand.
  • the power loss of the device during operation is almost dissipated in the form of heat, that is, the power loss is similar to the heat generation power.
  • establishing a thermal analysis model close to the real device to predict the thermal characteristics of the MEMS filter is an important means to optimize its power tolerance design.
  • the power tolerance simulation of the filter is actually to obtain the temperature distribution on the filter after the electrical energy lost during operation is converted into heat energy. Through design optimization, the maximum temperature does not reach the threshold of electrode damage under the specified input power.
  • the present invention provides a real-time simulation method, system and related equipment for the electrothermal performance of an elastic wave filter, aiming to solve the problem that the prior art does not take into account the impact of the packaging environment on the resonator when it is heated and the thermal crosstalk between the resonators, resulting in the inability to make a reasonable comparison with the results obtained from the actual elastic wave filter power test, thereby failing to provide optimization suggestions for the iterative design of the elastic wave filter.
  • the present invention provides an elastic wave filter with electrothermal performance
  • the real-time simulation method comprises the following steps:
  • the elastic wave filter includes at least one resonator
  • the environmental heat transfer tensor of the elastic wave filter is calculated according to the heat transfer tensor calculation formula
  • An equivalent circuit model of the elastic wave filter is established, and the environmental heat transfer amount is coupled with the equivalent circuit model to obtain the real-time electrothermal performance of the elastic wave filter.
  • the steps of establishing an equivalent circuit model of the elastic wave filter, coupling the environmental heat transfer tensor with the equivalent circuit model, and obtaining the real-time electrothermal performance of the elastic wave filter specifically include: establishing an equivalent circuit model of the elastic wave filter, and then electrically simulating the equivalent circuit model to obtain the heating power of the elastic wave filter; coupling the environmental heat transfer tensor with the heating power to obtain the real-time temperature of each of the resonators, and obtaining the real-time electrothermal performance of the elastic wave filter based on the real-time temperature of each of the resonators.
  • the finite element simulation heat transfer three-dimensional model of the elastic wave filter is established by finite element simulation software.
  • the preset method comprises the following steps:
  • the real-time temperatures of the n resonators are respectively defined as T1n, satisfying the following relationship:
  • the equivalent circuit model is an mBVD equivalent circuit model.
  • the present invention further provides a real-time simulation system for the electrothermal performance of an elastic wave filter, comprising the following modules:
  • a model building module used to build a finite element simulation heat transfer three-dimensional model of the elastic wave filter, wherein the elastic wave filter includes at least one resonator;
  • a thermal simulation module used to respectively assign heating boundary conditions to each of the resonators, and to perform thermal simulation on each of the resonators in turn according to a preset method through the finite element simulation heat transfer three-dimensional model, so as to obtain a power input matrix and a temperature change matrix of all the resonators;
  • a heat transfer tensor calculation module used to calculate the environmental heat transfer tensor of the elastic wave filter according to the temperature change matrix and the power input matrix according to the heat transfer tensor calculation formula
  • the equivalent circuit module is used to establish an equivalent circuit model of the elastic wave filter, couple the environmental heat transfer amount with the equivalent circuit model, and obtain the real-time electrothermal performance of the elastic wave filter.
  • the present invention further provides a computer-readable storage medium, on which is stored a real-time simulation program for the electrothermal performance of an elastic wave filter.
  • a real-time simulation program for the electrothermal performance of an elastic wave filter is executed by a processor, the steps of the real-time simulation method for the electrothermal performance of an elastic wave filter as described in any one of the above embodiments are implemented.
  • the beneficial effect achieved by the present invention is that the environmental heat transfer tensor of the elastic wave filter is obtained through temperature simulation, and it is brought into the mBVD equivalent circuit model of the elastic wave filter, coupled with the heating power of the equivalent circuit, so that the temperature of each resonator on the elastic wave filter can be obtained by real-time simulation while designing the elastic wave filter through the equivalent circuit, which simplifies the temperature simulation steps and greatly shortens the design cycle of the elastic wave filter.
  • FIG. 1 is a flowchart of a method for real-time simulation of electrothermal performance of an elastic wave filter provided by an embodiment of the present invention
  • FIG. 2 is a schematic diagram of a three-dimensional heat transfer model of an elastic wave filter finite element simulation according to a method for real-time simulation of electrothermal performance of an elastic wave filter provided in an embodiment of the present invention
  • FIG. 3 is a schematic diagram of the topological structure of an equivalent circuit of an elastic wave filter according to a method for real-time simulation of electrothermal performance of an elastic wave filter provided by an embodiment of the present invention
  • FIG. 4 is an electric simulation diagram of a method for real-time simulation of electrothermal performance of an elastic wave filter provided by an embodiment of the present invention. Schematic diagram of the temperature change of the resonator in real time;
  • FIG. 5 is a schematic diagram of a real-time simulation system for electrothermal performance of an elastic wave filter provided in an embodiment of the present invention
  • FIG6 is a schematic diagram of a computer device for real-time simulation of electrothermal performance of an elastic wave filter provided by an embodiment of the present invention.
  • FIG. 1 is a flowchart of a method for real-time simulation of electrothermal performance of an elastic wave filter provided by an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of a three-dimensional heat transfer model of an elastic wave filter finite element simulation of an elastic wave filter in a real-time simulation method of electrothermal performance of an elastic wave filter provided by an embodiment of the present invention
  • a finite element simulation heat transfer three-dimensional model of the elastic wave filter is established by finite element simulation software, such as finite element simulation software COMSOL or lcepek, and the elastic wave filter in the embodiment of the present invention includes five resonators, namely resonator S1, resonator S2, resonator S3, resonator S4 and resonator S5, which are only exemplary here, and the number of resonators in the elastic wave filter can be adjusted according to actual conditions.
  • the established finite element simulation heat transfer three-dimensional model is shown in FIG2.
  • the heating boundary condition is the heating power of the resonator.
  • the above heating powers can be given randomly and do not have to conform to the actual heating powers. Then perform a thermal simulation. During the thermal simulation, one resonator is heated in turn, and the heating power of other resonators is set to 0. The temperature change of each resonator is obtained to establish the corresponding temperature change matrix T1, T2, T3, T4 and T5.
  • the heating power P1 is set to 0.3W for resonator S1, and the heating power of other resonators is 0, and the temperature on each resonator is obtained, then the temperature change matrix T1 of resonator S1 is [161.2 36.182 20.776 24.121 23.028], and the power input matrix of resonator S1 is [0.3 0 0 0 0];
  • the temperature change matrix T is obtained by calculating the temperature change matrix of each resonator.
  • a represents the ambient temperature when the elastic wave filter is working
  • R represents the ambient heat transfer tensor
  • FIG. 3 is a schematic diagram of the topological structure of an equivalent circuit of an elastic wave filter in a real-time simulation method for electrothermal performance of an elastic wave filter provided by an embodiment of the present invention
  • an mBVD (Modified Butterworth-Van Dyke) equivalent circuit model is used to establish a corresponding equivalent circuit model for the elastic wave filter.
  • the mBVD equivalent circuit model can be used to describe the equivalent circuit of the resonator, thereby helping to design and analyze the performance of the resonator.
  • the equivalent topological structure of the established equivalent circuit model is shown in Figure 3, where port 1 is the signal input terminal, port 2 is the signal output terminal, and port 3 and port 4 are ground terminals. Then, electrical simulation is performed using the RF simulation software ADS (Advanced Design System).
  • the electric power consumed by each resonator that is, the heating power of the resonator
  • the heating power of the resonator can be obtained by calculating the current and voltage on each resistor.
  • the heating powers corresponding to the resonators S1-S5 can be obtained as P11, P12, P13, P14 and P15 respectively.
  • the real-time temperatures of the n resonators are respectively defined as T1n satisfying the following relationship:
  • the ambient heat transfer tensor R obtained in step S103 and the mBVD obtained in step S104 are combined.
  • the temperatures T11, T12, T13, T14 and T15 corresponding to the resonators S1-S5 can be obtained in real time.
  • the real-time temperatures of the resonators S1-S5 satisfy the following relationship:
  • T11 (1412*P11)/3+(2697*P12)/50+(517*P13)/200+(4121*P14)/300+ (2019*P15)/200;
  • T12 (2697*P11)/50+(9223*P12)/20+(7129*P13)/400+(1201*P14)/75+ (11407*P15)/200;
  • T13 (194*P11)/75+(891*P12)/50+(19199*P13)/40+(789*P14)/100+ (2157*P15)/200;
  • T14 (4121*P11)/300+(3203*P12)/200+(789*P13)/100+(3347*P14)/5+ (447*P15)/200;
  • T15 (757*P11)/75+(
  • the above data are coupled to radio frequency simulation software, and the real-time electrothermal performance of the elastic wave filter is obtained according to the real-time temperature of each resonator.
  • FIG. 4 is a schematic diagram of the temperature change of the resonator during the electrical simulation of the real-time simulation method for the electrothermal performance of the elastic wave filter provided by an embodiment of the present invention
  • RFfreq represents the operating frequency of the elastic wave filter
  • HB.T14 represents the resonator temperature
  • HB.T14 4.382.
  • the present invention substitutes the environmental heat transfer tensor obtained by temperature simulation into the mBVD equivalent circuit model of the elastic wave filter by means of electrothermal coupling, so as to realize real-time prediction of the temperature distribution of the elastic filter under different input powers during design.
  • the beneficial effect achieved by the present invention is that the environmental heat transfer tensor of the elastic wave filter is obtained through temperature simulation, and it is brought into the mBVD equivalent circuit model of the elastic wave filter, coupled with the heating power of the equivalent circuit, so that the temperature of each resonator on the elastic wave filter can be obtained by real-time simulation while designing the elastic wave filter through the equivalent circuit, which simplifies the temperature simulation steps and greatly shortens the design cycle of the elastic wave filter.
  • the embodiment of the present invention further provides a real-time simulation system for the electrothermal performance of an elastic wave filter.
  • FIG. 5 is a schematic diagram of the structure of the real-time simulation system 200 for the electrothermal performance of an elastic wave filter provided by the embodiment of the present invention, which includes:
  • a model building module used to build a finite element simulation heat transfer three-dimensional model of the elastic wave filter; the elastic wave filter includes at least one resonator.
  • a finite element simulation heat transfer three-dimensional model of the elastic wave filter is established by finite element simulation software, such as finite element simulation software COMSOL or lcepek. And the number of resonators in the elastic wave filter can be adjusted according to actual conditions.
  • a thermal simulation module used to assign heating boundary conditions to each of the resonators respectively, and to perform thermal simulation on each of the resonators in turn according to a preset method through the finite element simulation heat transfer three-dimensional model to obtain a power input matrix and a temperature change matrix of all the resonators.
  • the heating boundary condition is the heating power of the resonator.
  • the heating power of each resonator is set, and the heating power can be randomly given and does not necessarily have to conform to the actual heating power.
  • a thermal simulation is performed.
  • one of the resonators is heated in turn, and the heating power of the other resonators is set to 0, so as to obtain the temperature change of each resonator, thereby establishing a corresponding temperature change matrix and a corresponding power input matrix.
  • the first resonator is defined as S1
  • the heating power is set to P1
  • the temperature matrix is T1.
  • a heat transfer tensor calculation module configured to calculate the environmental heat transfer tensor of the elastic wave filter according to the temperature change matrix and the power input matrix and a heat transfer tensor calculation formula.
  • a represents the ambient temperature when the elastic wave filter is working
  • R represents the ambient heat transfer tensor
  • P represents the temperature change matrix
  • T represents the power input matrix
  • An equivalent circuit module used for establishing an equivalent circuit model of the elastic wave filter, coupling the ambient heat transfer with the equivalent circuit model, and obtaining real-time electrothermal performance of the elastic wave filter.
  • the equivalent circuit model is an mBVD equivalent circuit model, and then the electrical simulation is performed by the radio frequency simulation software ADS (Advanced Design System).
  • ADS Advanced Design System
  • the radio frequency simulation software performs the electrical simulation, the electric power consumed by each resonator, that is, the heating power of the resonator, can be obtained by calculating the current and voltage on each resistor.
  • the real-time temperatures of the n resonators are respectively defined as T1n, satisfying the following relationship:
  • P0 represents the heat generation power of the elastic wave filter
  • the elastic wave filter electrothermal performance real-time simulation system 200 can implement the steps in the elastic wave filter electrothermal performance real-time simulation method in the above embodiment, and can achieve the same technical effects. Please refer to the description in the above embodiment and will not be repeated here.
  • An embodiment of the present invention further provides a computer device.
  • the computer device 300 includes: a memory 302, a processor 301, and a real-time simulation program for the electrothermal performance of an elastic wave filter stored in the memory 302 and executable on the processor 301.
  • the computer device 300 provided in the embodiment of the present invention can implement the steps in the real-time simulation method of the electrothermal performance of the elastic wave filter in the above embodiment, and can achieve the same technical effect. Please refer to the description in the above embodiment and will not be repeated here.
  • the embodiment of the present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a real-time simulation program for the electrothermal performance of an elastic wave filter.
  • the real-time simulation program is executed by the processor, each process and step in the real-time simulation method for the electrothermal performance of the elastic wave filter provided in the embodiment of the present invention is implemented, and the same technical effect can be achieved. To avoid repetition, it will not be described here.
  • the storage medium can be a disk, an optical disk, a read-only memory (ROM) or a random access memory (RAM).
  • the technical solution of the present invention can be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, a magnetic disk, or an optical disk), and includes a number of instructions for enabling a terminal (which can be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) to execute the methods described in each embodiment of the present invention.
  • a storage medium such as ROM/RAM, a magnetic disk, or an optical disk
  • a terminal which can be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.

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Abstract

本发明提供了一种弹性波滤波器电热学性能实时仿真方法、系统及相关设备，包括如下步骤：建立弹性波滤波器的有限元仿真传热三维模型；设置每一谐振器的发热边界条件，对每一谐振器进行热仿真；计算弹性波滤波器的环境传热张量；建立弹性波滤波器的等效电路模型，再对等效电路模型进行电仿真，得到弹性波滤波器的发热功率；将环境传热张量与发热功率耦合，最终得到弹性波滤波器的实时电热学性能。本发明所达到的有益效果在于通过温度仿真获得弹性波滤波器的环境传热张量与发热功率相耦合，实现通过等效电路设计弹性波滤波器的同时能实时仿真得到弹性波滤波器上每个谐振器的温度，简化了温度仿真步骤，极大缩短弹性波滤波器的设计周期。

Description

弹性波滤波器电热学性能实时仿真方法、系统及相关设备 技术领域
本发明适用于热仿真、无线通讯领域，尤其涉及一种弹性波滤波器电热学性能实时仿真方法、系统及相关设备。
背景技术
随着通信技术的发展，MEMS压电滤波器不断向着高频化、低损耗、高功率耐受等方向发展。一般地，射频信号的通信距离、质量要求越高，MEMS压电滤波器需要承受的输入功率越大。
器件工作中的损耗功率几乎都在以热量的形式耗散，也就是说损耗功率近似于发热功率，基于这一规则，建立接近真实器件的热分析模型来预测MEMS滤波器的热学特性是优化其功率耐受性设计的重要手段。滤波器的功率耐受性仿真实际就是获取其在工作时损耗掉的电学能量转化为热能后在滤波器上的温度分布，通过设计优化使其在规定输入功率下最高温度不达到电极损毁的阈值。
因此，有必要需要寻找合理的计算模型将仿真结果与测试结果有机结合，实时监控仿真时滤波器上的温度变化情况，实现对滤波器输入能量耐受性能的准确预测。
发明内容
本发明提供一种弹性波滤波器电热学性能实时仿真方法、系统及相关设备，旨在解决现有技术中没有考虑谐振器发热时受到的封装环境影响以及谐振器之间的热串扰，导致无法与实际弹性波滤波器功率测试得到的结果进行合理比较，从而无法对弹性波滤波器的迭代设计提供优化建议的问题。
为达到上述目的，第一方面，本发明提供了一种弹性波滤波器电热学性能 实时仿真方法，包括以下步骤：
建立所述弹性波滤波器的有限元仿真传热三维模型；所述弹性波滤波器包括至少一个谐振器；
分别赋予每一所述谐振器的发热边界条件，通过所述有限元仿真传热三维模型依次对每一所述谐振器按预设方法进行热仿真，得到所有所述谐振器的功率输入矩阵和温度变化矩阵；
根据所述温度变化矩阵和所述功率输入矩阵，按照传热张量计算公式计算得到所述弹性波滤波器的环境传热张量；
建立所述弹性波滤波器的等效电路模型，将所述环境传热量与所述等效电路模型耦合，得到所述弹性波滤波器的实时电热学性能。
优选的，建立所述弹性波滤波器的等效电路模型，将所述环境传热和量与所述等效电路模型耦合，得到所述弹性波滤波器的实时电热学性能的步骤中，具体包括：建立所述弹性波滤波器的等效电路模型，再对所述等效电路模型进行电仿真，得到所述弹性波滤波器的发热功率；将所述环境传热张量与所述发热功率耦合，得到每一所述谐振器的实时温度，并根据每一所述谐振器的所述实时温度得到所述弹性波滤波器的实时电热学性能。
优选的，建立所述弹性波滤波器的有限元仿真传热三维模型的步骤中，通过有限元仿真软件建立所述弹性波滤波器的所述有限元仿真传热三维模型。
优选的，所述预设方法包括如下步骤：
定义所述谐振器S包括n个，所述谐振器的发热边界条件为P；其中，n为正整数；对第1个所述谐振器S1设置发热边界条件为P1，其它所述谐振器设置发热边界条件为0，进得热仿真得到每个所述谐振器的温度集合T1：
T1＝[a1 a2 a3 a4 a5]；
重复上一步骤依次对第2个所述谐振器S2至第n个所述谐振器Sn设置发热边界条件后进行热仿真处理，分别得到每个所述谐振器S的温度集合T2～Tn；最终得到所述功率输入矩阵P和所述温度变化矩阵T：

优选的，所述传热张量计算公式满足下列关系式：
T-a＝P·R；
其中，R表示所述环境传热张量，a表示所述弹性波滤波器工作时的环境温度。
优选的，n个所述谐振器的实时温度分别定义为T1n，满足下列关系式：
其中，P0表示所述发热功率，表示n个所述谐振器的实时温度。
优选的，所述等效电路模型为mBVD等效电路模型。
第二方面，本发明还提供一种弹性波滤波器电热学性能实时仿真系统，包括以下模块：
模型建立模块，用于建立所述弹性波滤波器的有限元仿真传热三维模型，所述弹性波滤波器包括至少一个谐振器；
热仿真模块，用于分别赋予每一所述谐振器的发热边界条件，通过所述有限元仿真传热三维模型依次对每一所述谐振器按预设方法进行热仿真，得到所有所述谐振器的功率输入矩阵和温度变化矩阵；
传热张量计算模块，用于根据所述温度变化矩阵和所述功率输入矩阵，按照传热张量计算公式计算所述弹性波滤波器的环境传热张量；
等效电路模块，用于建立所述弹性波滤波器的等效电路模型，将所述环境传热量与所述等效电路模型耦合，得到所述弹性波滤波器的实时电热学性能。
第三方面，本发明还提供一种计算机设备，包括：存储器、处理器及存储在所述存储器上并可在所述处理器上运行的弹性波滤波器电热学性能实时仿真程序，所述处理器执行所述弹性波滤波器电热学性能实时仿真程序时实现如上述实施例中任意一项所述的弹性波滤波器电热学性能实时仿真方法中的步骤。
第四方面，本发明还提供一种计算机可读存储介质，所述计算机可读存储介质上存储有弹性波滤波器电热学性能实时仿真程序，所述弹性波滤波器电热学性能实时仿真程序被处理器执行时实现如上述实施例中任意一项所述的弹性波滤波器电热学性能实时仿真方法中的步骤。
与现有技术相比，本发明所达到的有益效果，在于通过温度仿真获得弹性波滤波器的环境传热张量，将其带入到弹性波滤波器的mBVD等效电路模型中，与等效电路的发热功率相耦合，实现通过等效电路设计弹性波滤波器的同时能实时仿真得到弹性波滤波器上每个谐振器的温度，简化了温度仿真步骤，极大缩短弹性波滤波器的设计周期。
附图说明
图1是本发明实施例提供的弹性波滤波器电热学性能实时仿真方法的流程框图；
图2是本发明实施例提供的弹性波滤波器电热学性能实时仿真方法的弹性波滤波器有限元仿真传热三维模型示意图；
图3是本发明实施例提供的弹性波滤波器电热学性能实时仿真方法的弹性波滤波器等效电路拓扑结构示意图；
图4是本发明实施例提供的弹性波滤波器电热学性能实时仿真方法的电仿 真时谐振器温度变化示意图；
图5是本发明实施例提供的弹性波滤波器电热学性能实时仿真系统示意图；
图6是本发明实施例提供的弹性波滤波器电热学性能实时仿真计算机设备示意图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
(实施例一)
请参照图1，是本发明实施例提供的弹性波滤波器电热学性能实时仿真方法的流程框图。
S101、建立所述弹性波滤波器的有限元仿真传热三维模型，所述弹性波滤波器包括至少一个谐振器。
请参照图2，图2是本发明实施例提供的弹性波滤波器电热学性能实时仿真方法的弹性波滤波器有限元仿真传热三维模型示意图；
在本发明实施例中，通过有限元仿真软件建立所述弹性波滤波器的有限元仿真传热三维模型，例如有限元仿真软件COMSOL或lcepek，并且本发明实施例中的所述弹性波滤波器包括谐振器S1、谐振器S2、谐振器S3、谐振器S4以及谐振器S5的五个谐振器，在此仅为示例性的，所述弹性波滤波器中所述谐振器的数量是可根据实际情况调整的。建立的有限元仿真传热三维模型如图2所示。
S102、分别赋予每一所述谐振器的发热边界条件，通过所述有限元仿真传热三维模型依次对每一所述谐振器按预设方法进行热仿真，得到所有所述谐振器的功率输入矩阵和温度变化矩阵。
在本发明实施例中，发热边界条件即谐振器的发热功率。示例性的，设置 谐振器S1、S2、S3、S4以及S5对应的发热功率分别为P1、P2、P3、P4以及P5，并且有P1＝0.3W、P2＝0.2W、P3＝0.4W、P4＝0.3W以及P5＝0.2W，以上发热功率可以随机给定，不一定要符合实际发热功率。然后进行热仿真，在进行热仿真时，依次使一个谐振器发热，其他谐振器发热功率设置为0，获得每个谐振器的温度变化从而建立对应的温度变化矩阵T1、T2、T3、T4以及T5。
例如：对谐振器S1设置发热功率P1＝0.3W，其他谐振器发热功率为0，得到每个谐振器上的温度，则有所述谐振器S1的温度变化矩阵T1＝[161.2 36.182 20.776 24.121 23.028]，所述谐振器S1的功率输入矩阵为[0.3 0 0 0 0]；对谐振器S2赋予发热功率P2＝0.2W，其他谐振器发热功率为0，得到每个谐振器上的温度，则有谐振器S2的温度变化矩阵T2＝[30.788 112.23 23.564 23.203 31.407]，所述谐振器S2的功率输入矩阵为[0 0.2 0 0 0]。
有n个谐振器，就进行热仿真n次，在本发明实施例中n＝5，最终将每一所述谐振器的功率输入矩阵计算得到功率输入矩阵P，
将每一所述谐振器的温度变化矩阵计算得到温度变化矩阵T，
S103、根据所述温度变化矩阵和所述功率输入矩阵，按照传热张量计算公式计算所述弹性波滤波器的环境传热张量。
在本发明实施例中，所述传热张量计算公式满足下列关系式：
T-a＝P·R；
其中，a表示所述弹性波滤波器工作时的环境温度，R表示环境传热张量。示例性的，当所述弹性波滤波器工作时的环境温度为20摄氏度即a＝20℃，并 将步骤S102中的温度变化矩阵P以及功率输入矩阵T代入关系式，则有：
S104、建立所述弹性波滤波器的等效电路模型，将所述环境传热量与所述等效电路模型耦合，得到所述弹性波滤波器的实时电热学性能。
请参照图3，图3是本发明实施例提供的弹性波滤波器电热学性能实时仿真方法的弹性波滤波器等效电路拓扑结构示意图；
在本发明实施例中，采用mBVD(Modified Butterworth-Van Dyke)等效电路模型对所述弹性波滤波器建立对应的等效电路模型，所述mBVD等效电路模型可以用于描述谐振器的等效电路，从而帮组设计和分析谐振器的性能。建立的所述等效电路模型的等效拓扑结构如图3所示，其中端口1为信号输入端，端口2为信号输出端，端口3和端口4为接地端。再通过射频仿真软件ADS(Advanced Design System)进行电学仿真。在所述射频仿真软件进行电学仿真时，可以通过计算每个电阻上的电流电压来获取每个所述谐振器上消耗的电功率即所述谐振器的发热功率。示例性的，输入弹性波滤波器的功率后，可以得到所述谐振器S1-S5对应的发热功率分别为P11、P12、P13、P14以及P15，定义弹性波滤波器的发热功率为P0，则有P0＝[P11，P12，P13，P14，P15]。
在本发明实施例中，所述谐振器的数量为n个时，则n个所述谐振器的实时温度分别定义为T1n满足下列关系式：
其中，表示n个所述谐振器的实时温度。
示例性的，将步骤S103得到的环境传热张量R与步骤S104得到的mBVD 等效电路中的发热功率P0进行换算，可以实时得到谐振器S1-S5对应的温度T11、T12、T13、T14以及T15。所述谐振器S1-S5的实时温度满足下列关系式：
将步骤S103得到的环境传热张量R与步骤S104得到的发热功率P0代入，可以求得：
T11＝(1412*P11)/3+(2697*P12)/50+(517*P13)/200+(4121*P14)/300+
(2019*P15)/200；
T12＝(2697*P11)/50+(9223*P12)/20+(7129*P13)/400+(1201*P14)/75+
(11407*P15)/200；
T13＝(194*P11)/75+(891*P12)/50+(19199*P13)/40+(789*P14)/100+
(2157*P15)/200；
T14＝(4121*P11)/300+(3203*P12)/200+(789*P13)/100+(3347*P14)/5+
(447*P15)/200；
T15＝(757*P11)/75+(11407*P12)/200+(4313*P13)/400+(67*P14)/30+
(6827*P15)/10。
并将上述数据耦合射频仿真软件中，并根据每一所述谐振器的所述实时温度得到所述弹性波滤波器的实时电热学性能。
请参照图4，图4是本发明实施例提供的弹性波滤波器电热学性能实时仿真方法的电仿真时谐振器温度变化示意图；
在射频仿真软件进行电学仿真时，无论等效电路怎么设计或优化，都可以实时得到每个所述谐振器的发热功率。并且通过所述谐振器的实时温度关系式；可以随时得到所述谐振器S1-S5在不同输入功率、不同工作频率下的发热温度T11-T15。示例性的，如图4所示，定义弹性波滤波器输入功率为Pin，当Pin＝32mW时谐振器S1-S5的温度变化，弹性波滤波器插损曲线下方的五条曲线分别表示弹性波滤波器在不同的工作频率时，谐振器S1-S5的温度变化。其中RFfreq表示弹性波滤波器工作频率，HB.T14表示谐振器温度，m2点表示弹性波滤波器工作频率RFfreq＝1.829E9时，该谐振器温度变化HB.T14＝4.918，m3点表示弹性波滤波器工作频率RFfreq＝1.905E9时，该谐振器温度变化 HB.T14＝4.382。本发明通过电热耦合的方式，将温度仿真得到的环境传热张量代入到弹性波滤波器的mBVD等效电路模型，实现在设计时实时预测弹性滤波器在不同输入功率下的温度分布情况。
与现有技术相比，本发明所达到的有益效果，在于通过温度仿真获得弹性波滤波器的环境传热张量，将其带入到弹性波滤波器的mBVD等效电路模型中，与等效电路的发热功率相耦合，实现通过等效电路设计弹性波滤波器的同时能实时仿真得到弹性波滤波器上每个谐振器的温度，简化了温度仿真步骤，极大缩短弹性波滤波器的设计周期。
(实施例二)
本发明实施例还提供一种弹性波滤波器电热学性能实时仿真系统，请参照图5，图5是本发明实施例提供的弹性波滤波器电热学性能实时仿真系统200的结构示意图，其包括：
201、模型建立模块，用于建立所述弹性波滤波器的有限元仿真传热三维模型；所述弹性波滤波器包括至少一个谐振器。
在本发明实施例中，通过有限元仿真软件建立所述弹性波滤波器的有限元仿真传热三维模型，例如有限元仿真软件COMSOL或lcepek。并且所述弹性波滤波器中谐振器的数量可根据实际情况调整。
202、热仿真模块，用于分别赋予每一所述谐振器的发热边界条件，通过所述有限元仿真传热三维模型依次对每一所述谐振器按预设方法进行热仿真，得到所有所述谐振器的功率输入矩阵和温度变化矩阵。
在本发明实施例中，发热边界条件即谐振器的发热功率。设置每一所述谐振器的发热功率，并且所述发热功率可以随机给定，不一定要符合实际发热功率。然后进行热仿真，在进行热仿真时，依次使一个所述谐振器发热，其他所述谐振器发热功率设置为0，从而获得每个所述谐振器的温度变化从而建立对应的温度变化矩阵并建立对应的功率输入矩阵。示例性的，例如：当谐振器数量为5个时，定义第一个谐振器为S1，设置发热功率为P1，温度矩阵为T1。 设置发热功率P1＝0.3W，其他谐振器发热功率为0，得到每个谐振器上的温度，则有所述谐振器S1的温度矩阵T1＝[161.2 36.182 20.776 24.121 23.028]，所述谐振器S1的功率输入矩阵为[0.3 0 0 0 0]。再根据每一所述谐振器的功率输入矩阵建立温度变化矩阵，每一所述谐振器的温度变化矩阵建立功率输入矩阵。
203、传热张量计算模块，用于根据所述温度变化矩阵和所述功率输入矩阵，按照传热张量计算公式计算得到所述弹性波滤波器的环境传热张量。
在本发明实施例中，所述传热张量计算公式满足下列关系式：
T-a＝P·R；
其中，a表示所述弹性波滤波器工作时的环境温度，R表示环境传热张量，P表示温度变化矩阵，T表示功率输入矩阵。
204、等效电路模块，用于建立所述弹性波滤波器的等效电路模型，将所述环境传热量与所述等效电路模型耦合，得到所述弹性波滤波器的实时电热学性能。
在本发明实施例中，等效电路模型为mBVD等效电路模型，再通过射频仿真软件ADS(Advanced Design System)进行电学仿真。在所述射频仿真软件进行电学仿真时，可以通过计算每个电阻上的电流电压来获取每个所述谐振器上消耗的电功率即所述谐振器的发热功率。
在本发明实施例中，所述谐振器的数量为n个时，则n个所述谐振器的实时温度分别定义为T1n，满足下列关系式：
其中，P0表示弹性波滤波器的发热功率，表示n个所述谐振器的实时温度。
所述弹性波滤波器电热学性能实时仿真系统200能够实现如上述实施例中的弹性波滤波器电热学性能实时仿真方法中的步骤，且能实现同样的技术效果，参上述实施例中的描述，此处不再赘述。
(实施例三)
本发明实施例还提供一种计算机设备，请参照图6，图6是本发明实施例提供的计算机设备的结构示意图，所述计算机设备300包括：存储器302、处理器301及存储在所述存储器302上并可在所述处理器301上运行的弹性波滤波器电热学性能实时仿真程序。
所述处理器301调用所述存储器302存储的弹性波滤波器电热学性能实时仿真程序，执行本发明实施例提供的弹性波滤波器电热学性能实时仿真方法中的步骤，请结合图1，具体包括以下步骤：
S101、建立所述弹性波滤波器的有限元仿真传热三维模型；所述弹性波滤波器包括至少一个谐振器；
S102、分别赋予每一所述谐振器的发热边界条件，通过所述有限元仿真传热三维模型依次对每一所述谐振器按预设方法进行热仿真，得到所有所述谐振器的功率输入矩阵和温度变化矩阵；
S103、根据所述温度变化矩阵和所述功率输入矩阵，按照传热张量计算公式计算得到所述弹性波滤波器的环境传热张量；
S104、建立所述弹性波滤波器的等效电路模型，将所述环境传热量与所述等效电路模型耦合，得到所述弹性波滤波器的实时电热学性能。
本发明实施例提供的计算机设备300能够实现如上述实施例中的弹性波滤波器电热学性能实时仿真方法中的步骤，且能实现同样的技术效果，参上述实施例中的描述，此处不再赘述。
(实施例四)
本发明实施例还提供一种计算机可读存储介质，所述计算机可读存储介质上存储有弹性波滤波器电热学性能实时仿真程序，该弹性波滤波器电热学性能 实时仿真程序被处理器执行时实现本发明实施例提供的弹性波滤波器电热学性能实时仿真方法中的各个过程及步骤，且能实现相同的技术效果，为避免重复，这里不再赘述。
本领域普通技术人员可以理解实现上述实施例方法中的全部或部分流程，是可以通过计算机程序来指令相关的硬件来完成，所述的程序可存储于一计算机可读取存储介质中，该程序在执行时，可包括如上述各方法的实施例的流程。其中，所述的存储介质可为磁碟、光盘、只读存储记忆体(Read-Only Memory，ROM)或随机存取存储器(Random Access Memory，简称RAM)等。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。
通过以上的实施方式的描述，本领域的技术人员可以清楚地了解到上述实施例方法可借助软件加必需的通用硬件平台的方式来实现，当然也可以通过硬件，但很多情况下前者是更佳的实施方式。基于这样的理解，本发明的技术方案本质上或者说对现有技术做出贡献的部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质(如ROM/RAM、磁碟、光盘)中，包括若干指令用以使得一台终端(可以是手机，计算机，服务器，空调器，或者网络设备等)执行本发明各个实施例所述的方法。
上面结合附图对本发明的实施例进行了描述，所揭露的仅为本发明较佳实施例而已，但是本发明并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本发明的启示下，在不脱离本发明宗旨和权利要求所保护的范围情况下，还可做出很多形式用等同变化，均属于本发明的保护之内。

Claims (10)

  1. 一种弹性波滤波器电热学性能实时仿真方法，其特征在于，所述弹性波滤波器电热学性能实时仿真方法包括以下步骤：
    建立所述弹性波滤波器的有限元仿真传热三维模型；所述弹性波滤波器包括至少一个谐振器；
    分别赋予每一所述谐振器的发热边界条件，通过所述有限元仿真传热三维模型依次对每一所述谐振器按预设方法进行热仿真，得到所有所述谐振器的功率输入矩阵和温度变化矩阵；
    根据所述温度变化矩阵和所述功率输入矩阵，按照传热张量计算公式计算得到所述弹性波滤波器的环境传热张量；
    建立所述弹性波滤波器的等效电路模型，将所述环境传热量与所述等效电路模型耦合，得到所述弹性波滤波器的实时电热学性能。
  2. 如权利要求1所述的弹性波滤波器电热学性能实时仿真方法，其特征在于，建立所述弹性波滤波器的等效电路模型，将所述环境传热和量与所述等效电路模型耦合，得到所述弹性波滤波器的实时电热学性能的步骤中，具体包括：
    建立所述弹性波滤波器的等效电路模型，再对所述等效电路模型进行电仿真，得到所述弹性波滤波器的发热功率；
    将所述环境传热张量与所述发热功率耦合，得到每一所述谐振器的实时温度，并根据每一所述谐振器的所述实时温度得到所述弹性波滤波器的实时电热学性能。
  3. 如权利要求1所述的弹性波滤波器电热学性能实时仿真方法，其特征在于，建立所述弹性波滤波器的有限元仿真传热三维模型的步骤中，通过有限元仿真软件建立所述弹性波滤波器的所述有限元仿真传热三维模型。
  4. 如权利要求2所述的弹性波滤波器电热学性能实时仿真方法，其特征在于，所述预设方法包括如下步骤：
    定义所述谐振器S包括n个，所述谐振器的发热边界条件为P；其中，n 为正整数；
    对第1个所述谐振器S1设置发热边界条件为P1，其它所述谐振器设置发热边界条件为0，进得热仿真得到每个所述谐振器的温度集合T1：
    T1＝[a1 a2 a3 a4 a5]；
    重复上一步骤依次对第2个所述谐振器S2至第n个所述谐振器Sn设置发热边界条件后进行热仿真处理，分别得到每个所述谐振器S的温度集合T2～Tn；最终得到所述功率输入矩阵P和所述温度变化矩阵T：

  5. 如权利要求4所述的弹性波滤波器电热学性能实时仿真方法，其特征在于，所述传热张量计算公式满足下列关系式：
    T-a＝P·R；
    其中，R表示所述环境传热张量，a表示所述弹性波滤波器工作时的环境温度。
  6. 如权利要求5所述的弹性波滤波器电热学性能实时仿真方法，其特征在于，n个所述谐振器的实时温度分别定义为T1n，满足下列关系式：
    其中，P0表示所述发热功率，表示n个所述谐振器的实时温度。
  7. 如权利要求1所述的弹性波滤波器电热学性能实时仿真方法，其特征在于，所述等效电路模型为mBVD等效电路模型。
  8. 一种弹性波滤波器电热学性能实时仿真系统，其特征在于，包括以下模块：
    模型建立模块，用于建立所述弹性波滤波器的有限元仿真传热三维模型，所述弹性波滤波器包括至少一个谐振器；
    热仿真模块，用于分别赋予每一所述谐振器的发热边界条件，通过所述有限元仿真传热三维模型依次对每一所述谐振器按预设方法进行热仿真，得到所有所述谐振器的功率输入矩阵和温度变化矩阵；
    传热张量计算模块，用于根据所述温度变化矩阵和所述功率输入矩阵，按照传热张量计算公式计算所述弹性波滤波器的环境传热张量；
    等效电路模块，用于建立所述弹性波滤波器的等效电路模型，将所述环境传热量与所述等效电路模型耦合，得到所述弹性波滤波器的实时电热学性能。
  9. 一种计算机设备，其特征在于，包括：存储器、处理器及存储在所述存储器上并可在所述处理器上运行的弹性波滤波器电热学性能实时仿真程序，所述处理器执行所述弹性波滤波器电热学性能实时仿真程序时实现如权利要求1-7中任意一项所述的弹性波滤波器电热学性能实时仿真方法中的步骤。
  10. 一种计算机可读存储介质，其特征在于，所述计算机可读存储介质上存储有弹性波滤波器电热学性能实时仿真程序，所述弹性波滤波器电热学性能实时仿真程序被处理器执行时实现如权利要求1-7中任意一项所述的弹性波滤波器电热学性能实时仿真方法中的步骤。
PCT/CN2024/094381 2023-06-27 2024-05-21 弹性波滤波器电热学性能实时仿真方法、系统及相关设备 Ceased WO2025001635A1 (zh)

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