WO2024258166A1 - 결정 구조 분석 장치 및 방법 - Google Patents
결정 구조 분석 장치 및 방법 Download PDFInfo
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
- G01N23/20058—Measuring diffraction of electrons, e.g. low energy electron diffraction [LEED] method or reflection high energy electron diffraction [RHEED] method
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
- G01N23/203—Measuring back scattering
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/05—Investigating materials by wave or particle radiation by diffraction, scatter or reflection
- G01N2223/053—Investigating materials by wave or particle radiation by diffraction, scatter or reflection back scatter
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/05—Investigating materials by wave or particle radiation by diffraction, scatter or reflection
- G01N2223/056—Investigating materials by wave or particle radiation by diffraction, scatter or reflection diffraction
- G01N2223/0565—Investigating materials by wave or particle radiation by diffraction, scatter or reflection diffraction diffraction of electrons, e.g. LEED
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/30—Accessories, mechanical or electrical features
- G01N2223/345—Accessories, mechanical or electrical features mathematical transformations on beams or signals, e.g. Fourier
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/40—Imaging
- G01N2223/401—Imaging image processing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/40—Imaging
- G01N2223/403—Imaging mapping with false colours
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/40—Imaging
- G01N2223/408—Imaging display on monitor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/40—Imaging
- G01N2223/414—Imaging stereoscopic system
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/604—Specific applications or type of materials monocrystal
Definitions
- the disclosure relates to a device and method for analyzing a crystal structure.
- EBSD Electro Backscatter Diffraction
- EBSD can analyze the crystal structure in the investigated area using the diffraction pattern measured from each crystal.
- the position of the electron beam can be controlled through a computer system, the pattern generated in the area of the specimen where the electron beam stays can be recorded through a camera, and the recorded pattern can be automatically analyzed to derive crystallographic information of the corresponding area of the specimen.
- the task to be solved is to provide a crystal structure analysis device and method capable of effectively analyzing the crystal structure of a solid material from EBSD data for the solid material.
- a crystal structure analysis device may include: an EBSD (Electron Backscatter Diffraction) data acquisition module for acquiring EBSD data for a solid material; an image generation module for generating a first image including a plurality of pixels, wherein a shape of the solid material is represented by a plurality of pixels; a clustering module for performing clustering on the plurality of pixels using the EBSD data, such that the first image includes a plurality of clusters, each of which represents a first indicator of the crystal in a first color; an image processing module for generating a second image by processing the first image such that a second indicator associated with the first indicator is displayed as a shape overlapping the plurality of clusters; and a rendering module for rendering the second image on a display area.
- EBSD Electro Backscatter Diffraction
- the first indicator is defined as a value of a sine square function for an acute angle between a first vector and a second vector, wherein the first vector comprises a one-way vector of the decision at a pixel location corresponding to the decision on the first image, and the second vector comprises a vector pointing from the center of the entire particle to the pixel location in an outward direction.
- the first color may include at least one of an RGB color, an HSL color, an HSV color, a CMYK color, and a grayscale color.
- the display area includes a first display area and a second display area positioned adjacent to one side of the first display area
- the rendering module is capable of rendering the second image on the first display area and rendering a first color bar that matches a value of the first indicator with the first color on the second display area.
- the first vector may be defined in a three-dimensional space defined by a first axis, a second axis, and a third axis that are perpendicular to each other
- the second indicator may be defined as a direction in which the first vector is projected onto a plane defined by the first axis and the second axis.
- the shape is an arrow-shaped shape
- the second indicator may be displayed so as to overlap the plurality of clusters in the direction of the arrow head.
- the image processing module may process the first image to represent a third indicator associated with the second indicator in a second color within the shape.
- the third indicator may be defined as an angle formed by the first vector with a plane formed by the first axis and the second axis.
- the second color may include at least one of an RGB color, an HSL color, an HSV color, a CMYK color, and a grayscale color.
- the display area includes a first display area and a third display area positioned adjacent to one side of the first display area, and the rendering module can render the second image on the first display area and render a second color bar that matches a value of the third indicator with the second color on the third display area.
- the first indicator is defined as a Degree of Alignment (DoA) value calculated at a pixel location corresponding to the decision on the first image, and the DoA value can be calculated according to the following mathematical formula:
- L is the major axis vector of the crystal corresponding to the pixel position
- S is the minor axis vector of the crystal corresponding to the pixel position
- C is the value of the cosine function for L and the vector pointing from the center of the entire particle to the pixel position in the outward direction.
- the first color may include at least one of an RGB color, an HSL color, an HSV color, a CMYK color, and a grayscale color.
- the display area includes a first display area and a second display area positioned adjacent to one side of the first display area, and the rendering module can render the second image on the first display area and render a first color bar that matches a value of the first indicator and the first color to be displayed on the third display area.
- the second indicator is defined as a major axis vector of a decision corresponding to the pixel location
- the shape is an arrow-shaped shape
- the second indicator can be displayed so as to overlap on the plurality of clusters in the direction of the arrow head.
- a method for analyzing a crystal structure may include: obtaining EBSD data for a solid material; generating a first image including a plurality of pixels representing a shape of the solid material; performing clustering on the plurality of pixels using the EBSD data such that the first image includes a plurality of clusters each representing a first indicator of the crystal in a first color; processing the first image such that a second indicator associated with the first indicator is displayed as a shape overlapping the plurality of clusters to generate a second image; and rendering the second image on a display area.
- the first indicator is defined as a value of a sine square function for an acute angle between a first vector and a second vector, wherein the first vector comprises a one-way vector of the decision at a pixel location corresponding to the decision on the first image, and the second vector comprises a vector pointing from the center of the entire particle to the pixel location in an outward direction.
- the first vector may be defined in a three-dimensional space defined by a first axis, a second axis, and a third axis that are perpendicular to each other
- the second indicator may be defined as a direction in which the first vector is projected onto a plane defined by the first axis and the second axis.
- the step of generating the second image may include the step of processing the first image to represent a third indicator associated with the second indicator in a second color within the shape to generate the second image.
- the first indicator is defined as a Degree of Alignment (DoA) value calculated at a pixel location corresponding to the decision on the first image, and the DoA value can be calculated according to the following mathematical formula:
- L is the major axis vector of the crystal corresponding to the pixel position
- S is the minor axis vector of the crystal corresponding to the pixel position
- C is the value of the cosine function for L and the vector pointing from the center of the entire particle to the pixel position in the outward direction.
- the second indicator is defined as a major axis vector of a decision corresponding to the pixel location
- the shape is an arrow-shaped shape
- the second indicator can be displayed so as to overlap on the plurality of clusters in the direction of the arrow head.
- a computer-readable medium may be recorded with a program that causes a computer including a processor executing a program or command stored in a memory or storage device to execute the steps of: obtaining EBSD data for a solid material; generating a first image including a plurality of pixels as a shape of the solid material; performing clustering on the plurality of pixels using the EBSD data such that the first image includes a plurality of clusters each representing a first indicator of a crystal in a first color; processing the first image such that a second indicator associated with the first indicator is displayed as a shape overlapping the plurality of clusters to generate a second image; and rendering the second image on a display area.
- the crystal structure of a solid material can be effectively analyzed from EBSD data for the solid material.
- the crystal orientations are visually expressed by cluster and the user changes a desired crystal plane, the result is immediately reflected visually, so that the connection pattern of the crystal orientations can be explored in a short period of time in a general computing environment.
- FIG. 1 is a block diagram illustrating a crystal structure analysis device according to one embodiment.
- FIGS. 2 to 4 are drawings for explaining an implementation example of a crystal structure analysis device according to one embodiment.
- FIGS. 5 and 6 are drawings for explaining an implementation example of a crystal structure analysis device according to one embodiment.
- Figure 7 is a flowchart illustrating a crystal structure analysis method according to one embodiment.
- FIG. 8 is a drawing for explaining an implementation example of a crystal structure analysis device according to one embodiment.
- FIGS. 9 to 13 are drawings for explaining implementation examples of a crystal structure analysis device according to one embodiment.
- FIG. 14 is a drawing for explaining a computing device according to one embodiment.
- Terms such as “part,” “unit,” “module,” etc., described in the specification may mean a unit capable of processing at least one function or operation described in the specification, and this may be implemented by hardware or a circuit, software, or a combination of hardware or a circuit and software.
- FIG. 1 is a block diagram illustrating a crystal structure analysis device according to one embodiment.
- a crystal structure analysis device (10) can analyze a crystal structure for a solid material.
- the crystal structure analysis device (10) can extract and visualize information on how crystal directions are distributed for all particles with respect to data collected from an EBSD system.
- the crystal structure analysis device (10) can be a server that services a web application, which is software that runs on a web browser. Accordingly, the crystal structure analysis device (10) can enable users to easily analyze a crystal structure for a solid material using only a web browser without having to install separate software on their computers.
- the scope of the present invention is not limited thereto, and the functions provided by the crystal structure analysis device (10) can be implemented as various arbitrary forms of software.
- the decision structure analysis device (10) may include an EBSD data acquisition module (110), an image generation module (120), a clustering module (130), an image processing module (140), and a rendering module (150).
- the EBSD data acquisition module (110) can acquire EBSD data for a solid material.
- the EBSD data can include spatially linked crystallographic orientation and phase information, and the EBSD data acquisition module (10) can acquire data in various formats collected from an external EBSD system.
- the EBSD data can be a file generated to follow the CSV (Comma Separated Values) format as two-dimensional data distinguished by a delimiter such as a comma.
- the EBSD data can be in the form of a compressed file that is a collection of multiple CSV files.
- the EBSD data can be data that has undergone data cleaning in specific software (e.g., AZtecCrystal) that processes data collected using EBSD.
- the image generation module (120) can generate the shape of a solid material that is the subject of the crystal structure analysis as a first image.
- the first image can be in the form of a pixel image including a plurality of pixels.
- the image generation module (120) can generate the first image as a two-dimensional image that can be displayed on a display device that is electrically connected to the crystal structure analysis device (10).
- the clustering module (130) can perform clustering on a plurality of pixels included in the first image using the EBSD data acquired by the EBSD data acquisition module (110).
- the clustering module (130) can adopt a density-based clustering algorithm to perform clustering.
- the clustering module (130) can adopt, for example, DBSCAN (Density-based spatial clustering of applications with noise).
- the density-based clustering algorithm can operate in a way that clusters parts where data points are densely packed together.
- the clustering module (130) can use the EBSD data to cause the first image to include a plurality of clusters, each cluster representing a first indicator of a decision in a first color.
- EBSD data may include data on crystal orientation of crystal grains.
- the data on crystal orientation may be a plurality of crystal orientation data collected for each crystal unit of a predetermined size forming a solid material to be analyzed.
- the crystal unit is not determined to a specific size, but may be a unit having a predetermined size that can correspond to at least one included in the first image, considering the resolution according to the environment that the crystal structure analysis device according to the embodiments can display.
- the clustering module (130) may perform clustering on a plurality of pixels expressing the first image using a plurality of angle data.
- the image processing module (140) can generate a second image representing the result of clustering performed by the clustering module (130). That is, the image processing module (140) can process the first image generated by the image generating module (120) so that the first image is displayed in different colors for each cluster, or can process the first image so that the second indicator associated with the first indicator is displayed in a shape overlapping multiple clusters and output the result as a second image.
- the color can include at least one of an RGB color, an HSL color, an HSV color, a CMYK color, and a grayscale color.
- An RGB color is a color expressed using red, green, and blue
- an HSL (or HSB) color can be a color expressed using hue, saturation, and lightness (or brightness).
- HSV color is a color expressed using Hue, Saturation, and Value
- CMYK color can be a color expressed using Cyan, Magenta, Yellow, and Black.
- the rendering module (150) can render the second image generated by the image processing module (140) onto a display area provided on the display device. Accordingly, by expressing the second image in different colors for each pixel or each cluster, or by expressing some indicator for the crystal as a shape overlapping the cluster, the crystal characteristics for the entire particle can be visualized so that the user can grasp them at a glance, thereby effectively analyzing the crystal structure from EBSD data collected in an unintuitive form.
- the first indicator may be defined as a value of a sine square function for an acute angle between the first vector and the second vector.
- the first vector may include a one-way vector of the crystal at a pixel location corresponding to the crystal on the first image
- the second vector may include a vector pointing from the center of the entire particle to the pixel location in an outward direction.
- the clustering module (130) may perform clustering so that each cluster included in the first image may represent the first indicator as a first color. At this time, the first color may be calculated for each pixel forming each cluster, and thus, one cluster may be expressed as a gradient color.
- the one-way vector of the crystal may be a vector corresponding to one of the lattice vectors of the crystal.
- the lattice vector of the crystal may include the a-axis, the b-axis, and the c-axis, and the one-way vector of the crystal may include a vector corresponding to the c-axis of the crystal.
- the first color can include at least one of an RGB color, an HSL color, an HSV color, a CMYK color, and a grayscale color.
- An RGB color is a color expressed using Red, Green, and Blue
- an HSL (or HSB) color can be a color expressed using Hue, Saturation, and Lightness (or Brightness).
- An HSV color is a color expressed using Hue, Saturation, and Value
- a CMYK color can be a color expressed using Cyan, Magenta, Yellow, and Black.
- the first vector is defined in a three-dimensional space defined by a first axis (e.g., x-axis), a second axis (e.g., y-axis), and a third axis (e.g., z-axis) that are perpendicular to each other
- the second indicator can be defined as a direction in which the first vector is projected onto a plane formed by the first axis and the second axis.
- the image processing module (140) can process the first image to generate a second image so that the second indicator is displayed as a shape that overlaps each cluster included in the first image.
- the shape may include an arrow-shaped shape
- the second indicator may be displayed so as to overlap on a plurality of clusters in the direction of the arrow head.
- the image processing module (140) may process the first image to display a third indicator associated with the second indicator in a second color within the shape.
- the third indicator may be defined as an angle formed by the first vector with the plane formed by the first axis and the second axis.
- the second color can include at least one of an RGB color, an HSL color, an HSV color, a CMYK color, and a grayscale color.
- An RGB color is a color expressed using Red, Green, and Blue
- an HSL (or HSB) color can be a color expressed using Hue, Saturation, and Lightness (or Brightness).
- An HSV color is a color expressed using Hue, Saturation, and Value
- a CMYK color can be a color expressed using Cyan, Magenta, Yellow, and Black.
- FIGS. 2 to 4 are drawings for explaining an example of an implementation of a crystal structure analysis device according to one embodiment.
- FIG. 2 illustrates a second image (IMG1) expressed by a rendering module (150), and
- FIGS. 3 and 4 are drawings for explaining definitions of the first to third indices.
- the second image (IMG1) represents the entire particle, with the center of the particle being displayed at its center.
- the center of the particle is represented as a circle with a black border, but the scope of the present invention is not limited thereto.
- the first indicator is the first vector ( ) and the second vector ( ) can be defined as the value of the sine square function for the acute angle between the first vector ( ) is a crystal direction at a pixel location among the decisions expressed in the first image, for example, it can be a vector corresponding to one direction vector of the decision, the c-axis.
- the second vector ( ) may be a vector pointing from the center of the entire particle to the corresponding pixel position in the outer direction of the particle. Accordingly, for each pixel forming each cluster, a value corresponding to the first indicator (e.g., a real value between 0 and 1) may be displayed in a first color.
- the second indicator is the first vector ( ) can be defined as a direction projected onto a plane formed by the first axis (e.g., the x-axis) and the second axis (e.g., the y-axis). Accordingly, the first vector ( ) can be displayed by overlapping a shape (e.g., an arrow) indicating the direction projected onto the plane formed by the first axis (e.g., the x-axis) and the second axis (e.g., the y-axis) on the cluster.
- a shape e.g., an arrow
- the third indicator is the first vector ( ) can be defined as an angle formed by a plane formed by a first axis (e.g., x-axis) and a second axis (e.g., y-axis). Accordingly, the interior of a shape displayed overlapped on each cluster can be displayed in a second color corresponding to the angle value (e.g., a value expressed as -90 degrees to 90 degrees).
- the first to third indices as described can be visually identified for the entire particle, thereby effectively analyzing the crystal structure from EBSD data collected in an unintuitive form.
- the first metric may be defined as a Degree of Alignment (DoA) value computed at a pixel location corresponding to the decision on the first image.
- DoA value may be computed according to the following mathematical formula:
- L may be a major axis vector of a decision corresponding to a pixel position
- S may be a minor axis vector of a decision corresponding to a pixel position
- C may be a value of a cosine function for L and a vector directed from the center of the entire particle to the outer edge toward the pixel position.
- the clustering module (130) may perform clustering so that each cluster included in the first image may represent the first index with a first color.
- the first color can include at least one of an RGB color, an HSL color, an HSV color, a CMYK color, and a grayscale color.
- An RGB color is a color expressed using Red, Green, and Blue
- an HSL (or HSB) color can be a color expressed using Hue, Saturation, and Lightness (or Brightness).
- An HSV color is a color expressed using Hue, Saturation, and Value
- a CMYK color can be a color expressed using Cyan, Magenta, Yellow, and Black.
- the second indicator may be defined as a major axis vector of a decision corresponding to a pixel position.
- the image processing module (140) may process the first image to generate a second image so that the second indicator is displayed as a shape that overlaps each cluster included in the first image.
- the shape may include an arrow-shaped shape, and the second indicator may be displayed so as to overlap a plurality of clusters in the direction of the arrow head.
- the direction of the arrow head may correspond to the direction in which the major axis vector faces, and the length of the arrow may be determined as a value that has a correlation according to the length of the major axis.
- FIGS. 5 and 6 are drawings for explaining an example of an implementation of a crystal structure analysis device according to one embodiment.
- FIG. 5 illustrates a second image (IMG2) expressed by a rendering module (150)
- FIG. 6 is a drawing for explaining definitions of a first index and a second index.
- the second image (IMG1) represents the entire particle, with the center of the particle being displayed at its center.
- the center of the particle is represented as a circle with a black border, but the scope of the present invention is not limited thereto.
- the first index may be defined as a DoA (Degree of Alignment) value calculated at a pixel location corresponding to a decision on the first image.
- the DoA value may be calculated according to the following mathematical formula.
- L is the major axis vector of the decision corresponding to the pixel position ( )
- S is the short-axis vector of the decision corresponding to the pixel position
- C is the vector pointing to the pixel position from the center of the entire particle to the outer direction with L ( ) can be the value of the cosine function for the DoA.
- DoA is the value when an elongated particle is oriented from the center to the outside, that is, the long axis direction is a vector ( ) has a value of 1, and if the long-shaped particle is cultured vertically, i.e., the long-axis direction is vector ( ) can be set to a value of 0 if it is perpendicular to the direction of the line.
- the second indicator is the major axis vector of the decision corresponding to the pixel position ( ) can be defined as. Accordingly, the direction of the arrow head that is displayed to overlap on the cluster is the major axis vector ( ) can correspond to the direction in which the arrow is facing, and the length of the arrow can be determined as a value that is related to the length of the major axis (for example, a value proportional to the length of the major axis).
- a third metric may be additionally computed from the first metric.
- the third metric may be referred to as "Area weighted DoA", which represents DoA that considers the area of the decision as a weight, and may be computed according to the following mathematical formula:
- i is the index of the decision
- a i can represent the area of the ith decision.
- the corresponding value can be a value that quantifies the overall morphological alignment of the primary particle within the given secondary particle by reflecting the area.
- the first to third indices as described can be visually identified for the entire particle, thereby effectively analyzing the crystal structure from EBSD data collected in an unintuitive form.
- Figure 7 is a flowchart illustrating a crystal structure analysis method according to one embodiment.
- a crystal structure analysis method may include a step of obtaining EBSD data for a solid material (S701), a step of generating a first image including a plurality of pixels representing a shape of the solid material (S702), a step of performing clustering on the plurality of pixels using the EBSD data so that the first image includes a plurality of clusters each representing a first indicator of the crystal in a first color (S703), a step of processing the first image so that a second indicator associated with the first indicator is displayed as a shape overlapping the plurality of clusters so as to generate a second image (S704), and a step of rendering the second image on a display area (S705).
- FIG. 8 is a drawing for explaining an implementation example of a crystal structure analysis device according to one embodiment.
- the rendering module (150) can render the second image generated by the image processing module (140) on the display area (30) provided on the display device.
- the display area (30) includes a first display area (31), a second display area (32), and a third display area (33), and the second display area (32) or the third display area (33) can be arranged adjacent to one side of the first display area (30).
- the rendering module (150) can render the second image on the first display area (31) and render a first color bar that matches the value of the first indicator and the first color on the second display area. Accordingly, convenience can be provided so that a user can visually compare the entire particles before and after clustering.
- the rendering module (150) can render the second image on the first display area (31) and render the second color bar that matches the value of the third indicator and the second color on the third display area. Meanwhile, referring to FIG. 8 and FIG. 5 together, the rendering module (150) can render the second image on the first display area (31) and render the first color bar that matches the value of the first indicator and the first color on the third display area.
- This screen layout configuration allows for visualization of various indices of the decision across the entire particle, effectively enabling analysis of crystal structures from EBSD data collected in an unintuitive manner.
- FIGS. 9 to 13 are drawings for explaining implementation examples of a crystal structure analysis device according to one embodiment.
- the crystal structure analysis device can output, in addition to the visual screen described above, an angle histogram exemplarily illustrated in FIG. 9, a DoA histogram exemplarily illustrated in FIG. 10, a DoA determination histogram exemplarily illustrated in FIG. 11, an aspect ratio histogram exemplarily illustrated in FIG. 12, and a diameter histogram exemplarily illustrated in FIG. 13.
- the angle histogram in Fig. 9 is the first vector ( ) and the second vector ( ) shows a plot showing the value of the angle between the first vector ( ) and the second vector ( ) represents the probability for the angle between the first vector ( ) and the second vector ( ) is represented as a DoA determination of the sine square function of the angle between the two.
- the aspect ratio histogram in Fig. 12 shows the count values for the aspect ratio.
- the diameter histogram in Fig. 13 shows a plot of the calculated diameter of a circle having the same area as the determination.
- the first vector ( ) and the second vector ( ) is related to a certain property
- analysis can be performed by linking the distribution of the angular values with the corresponding property, or it can be utilized for parameterization of the product.
- analysis can be performed by linking the movement of the particle and the direction of the crystal.
- the visualized data or statistical distributions exemplified in FIGS. 9 to 13 can be utilized to provide convenience for quantitative analysis.
- FIG. 14 is a drawing for explaining a computing device according to one embodiment.
- the crystal structure analysis device and method according to the embodiments can be implemented using a computing device (50).
- the computing device (50) may include at least one of a processor (510), a memory (530), a user interface input device (540), a user interface output device (550), and a storage device (560) that communicate via a bus (520).
- the computing device (50) may also include a network interface (570) that is electrically connected to a network (40).
- the network interface (570) may transmit or receive signals to or from other entities via the network (40).
- the processor (510) may be implemented in various types such as an MCU (Micro Controller Unit), an AP (Application Processor), a CPU (Central Processing Unit), a GPU (Graphic Processing Unit), an NPU (Neural Processing Unit), etc., and may be any semiconductor device that executes instructions stored in a memory (530) or a storage device (560).
- the processor (510) may be configured to implement the functions and methods described above with respect to FIGS. 1 to 13.
- the memory (530) and storage device (560) may include various forms of volatile or non-volatile storage media.
- the memory may include a read-only memory (ROM) (531) and a random access memory (RAM) (532).
- the memory (530) may be located inside or outside the processor (510), and the memory (530) may be connected to the processor (510) through various means already known.
- At least some of the components or functions of the crystal structure analysis devices and methods according to the embodiments may be implemented as a program or software running on a computing device (50), and the program or software may be stored on a computer-readable medium.
- At least some of the components or functions of the crystal structure analysis devices and methods according to the embodiments may be implemented using hardware or circuitry of the computing device (50), or may be implemented as separate hardware or circuitry that can be electrically connected to the computing device (50).
- the crystal structure of a solid material can be effectively analyzed from EBSD data for the solid material.
- the crystal directions are visually expressed by cluster and the user changes the desired crystal plane, the result is immediately reflected visually, so that the connection pattern of the crystal directions can be explored in a short time in a general computing environment.
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Abstract
Description
Claims (21)
- 고체 재료에 대한 EBSD(Electron Backscatter Diffraction) 데이터를 획득하는 EBSD 데이터 획득 모듈;상기 고체 재료의 형상을 복수의 픽셀을 포함하는 제1 이미지로 생성하는 이미지 생성 모듈;상기 EBSD 데이터를 이용하여, 상기 제1 이미지가 각각 결정의 제1 지표를 제1 색상으로 나타내는 복수의 클러스터를 포함하도록, 상기 복수의 픽셀에 대해 클러스터링을 수행하는 클러스터링 모듈;상기 제1 지표와 연관된 제2 지표가 상기 복수의 클러스터 상에 오버랩되는 도형으로 표시되도록 상기 제1 이미지를 처리하여 제2 이미지를 생성하는 이미지 처리 모듈; 및상기 제2 이미지를 디스플레이 영역에 렌더링하는 렌더링 모듈을 포함하는결정 구조 분석 장치.
- 제1항에 있어서,상기 제1 지표는 제1 벡터와 제2 벡터 사이의 예각에 대한 사인(sine) 제곱 함수의 값으로서 정의되고,상기 제1 벡터는, 상기 제1 이미지 상의 상기 결정에 대응하는 픽셀 위치에서 상기 결정의 일 방향 벡터를 포함하고,상기 제2 벡터는, 전체 입자의 중심으로부터 외곽 방향으로 상기 픽셀 위치를 향하는 벡터를 포함하는, 결정 구조 분석 장치.
- 제2항에 있어서,상기 제1 색상은 RGB 색상, HSL 색상, HSV 색상, CMYK 색상 및 그레이 스케일 색상 중 적어도 하나를 포함하는, 결정 구조 분석 장치.
- 제2항에 있어서,상기 디스플레이 영역은 제1 디스플레이 영역과, 상기 제1 디스플레이 영역의 일 측에 인접하도록 배치되는 제2 디스플레이 영역을 포함하고,상기 렌더링 모듈은,상기 제2 이미지를 상기 제1 디스플레이 영역에 렌더링하고,상기 제1 지표의 값과 상기 제1 색상을 매치하여 표시하는 제1 컬러바를 상기 제2 디스플레이 영역에 렌더링하는, 결정 구조 분석 장치.
- 제2항에 있어서,상기 제1 벡터는 서로 수직인 제1 축, 제2 축 및 제3 축으로 정의되는 3차원 공간에서 정해지고,상기 제2 지표는, 상기 제1 벡터가 상기 제1 축과 상기 제2 축이 이루는 평면에 투영된 방향으로서 정의되는, 결정 구조 분석 장치.
- 제5항에 있어서,상기 도형은 화살표 형상의 도형이고, 상기 제2 지표는 화살표 머리의 방향으로 상기 복수의 클러스터 상에 오버랩되도록 표시되는, 결정 구조 분석 장치.
- 제5항에 있어서,상기 이미지 처리 모듈은, 상기 제2 지표와 연관된 제3 지표를 상기 도형 내부의 제2 색상으로 나타내도록 상기 제1 이미지를 처리하는, 결정 구조 분석 장치.
- 제7항에 있어서,상기 제3 지표는, 상기 제1 벡터가 상기 제1 축과 상기 제2 축이 이루는 평면과 이루는 각도로서 정의되는, 결정 구조 분석 장치.
- 제7항에 있어서,상기 제2 색상은 RGB 색상, HSL 색상, HSV 색상, CMYK 색상 및 그레이 스케일 색상 중 적어도 하나를 포함하는, 결정 구조 분석 장치.
- 제7항에 있어서,상기 디스플레이 영역은 제1 디스플레이 영역과, 상기 제1 디스플레이 영역의 일 측에 인접하도록 배치되는 제3 디스플레이 영역을 포함하고,상기 렌더링 모듈은,상기 제2 이미지를 상기 제1 디스플레이 영역에 렌더링하고,상기 제3 지표의 값과 상기 제2 색상을 매치하여 표시하는 제2 컬러바를 상기 제3 디스플레이 영역에 렌더링하는, 결정 구조 분석 장치.
- 제11항에 있어서,상기 제1 색상은 RGB 색상, HSL 색상, HSV 색상, CMYK 색상 및 그레이 스케일 색상 중 적어도 하나를 포함하는, 결정 구조 분석 장치.
- 제11항에 있어서,상기 디스플레이 영역은 제1 디스플레이 영역과, 상기 제1 디스플레이 영역의 일 측에 인접하도록 배치되는 제2 디스플레이 영역을 포함하고,상기 렌더링 모듈은,상기 제2 이미지를 상기 제1 디스플레이 영역에 렌더링하고,상기 제1 지표의 값과 상기 제1 색상을 매치하여 표시하는 제1 컬러바를 상기 제3 디스플레이 영역에 렌더링하는, 결정 구조 분석 장치.
- 제11항에 있어서,상기 제2 지표는, 상기 픽셀 위치에 대응하는 결정의 장축 벡터로서 정의되고,상기 도형은 화살표 형상의 도형이고,상기 제2 지표는 화살표 머리의 방향으로 상기 복수의 클러스터 상에 오버랩되도록 표시되는, 결정 구조 분석 장치.
- 고체 재료에 대한 EBSD 데이터를 획득하는 단계;상기 고체 재료의 형상을 복수의 픽셀을 포함하는 제1 이미지로 생성하는 단계;상기 EBSD 데이터를 이용하여, 상기 제1 이미지가 각각 결정의 제1 지표를 제1 색상으로 나타내는 복수의 클러스터를 포함하도록, 상기 복수의 픽셀에 대해 클러스터링을 수행하는 단계;상기 제1 지표와 연관된 제2 지표가 상기 복수의 클러스터 상에 오버랩되는 도형으로 표시되도록 상기 제1 이미지를 처리하여 제2 이미지를 생성하는 단계; 및상기 제2 이미지를 디스플레이 영역에 렌더링하는 단계를 포함하는결정 구조 분석 방법.
- 제15항에 있어서,상기 제1 지표는 제1 벡터와 제2 벡터 사이의 예각에 대한 사인(sine) 제곱 함수의 값으로서 정의되고,상기 제1 벡터는, 상기 제1 이미지 상의 상기 결정에 대응하는 픽셀 위치에서 상기 결정의 일 방향 벡터를 포함하고,상기 제2 벡터는, 전체 입자의 중심으로부터 외곽 방향으로 상기 픽셀 위치를 향하는 벡터를 포함하는, 결정 구조 분석 방법.
- 제16항에 있어서,상기 제1 벡터는 서로 수직인 제1 축, 제2 축 및 제3 축으로 정의되는 3차원 공간에서 정해지고,상기 제2 지표는, 상기 제1 벡터가 상기 제1 축과 상기 제2 축이 이루는 평면에 투영된 방향으로서 정의되는, 결정 구조 분석 방법.
- 제17항에 있어서,상기 제2 이미지를 생성하는 단계는,상기 제2 지표와 연관된 제3 지표를 상기 도형 내부의 제2 색상으로 나타내도록 상기 제1 이미지를 처리하여 상기 제2 이미지를 생성하는 단계를 포함하는, 결정 구조 분석 방법.
- 제19항에 있어서,상기 제2 지표는, 상기 픽셀 위치에 대응하는 결정의 장축 벡터로서 정의되고,상기 도형은 화살표 형상의 도형이고,상기 제2 지표는 화살표 머리의 방향으로 상기 복수의 클러스터 상에 오버랩되도록 표시되는, 결정 구조 분석 방법.
- 메모리 또는 저장 장치에 저장된 프로그램 또는 명령을 실행하는 프로세서를 포함하는 컴퓨터에,고체 재료에 대한 EBSD 데이터를 획득하는 단계;상기 고체 재료의 형상을 복수의 픽셀을 포함하는 제1 이미지로 생성하는 단계;상기 EBSD 데이터를 이용하여, 상기 제1 이미지가 각각 결정의 제1 지표를 제1 색상으로 나타내는 복수의 클러스터를 포함하도록, 상기 복수의 픽셀에 대해 클러스터링을 수행하는 단계;상기 제1 지표와 연관된 제2 지표가 상기 복수의 클러스터 상에 오버랩되는 도형으로 표시되도록 상기 제1 이미지를 처리하여 제2 이미지를 생성하는 단계; 및상기 제2 이미지를 디스플레이 영역에 렌더링하는 단계를 실행시키기 위한 프로그램을 기록한컴퓨터로 읽을 수 있는 매체.
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| EP24823684.6A EP4711750A1 (en) | 2023-06-12 | 2024-06-12 | Apparatus and method for analyzing crystal structure |
| CN202480038856.XA CN121359020A (zh) | 2023-06-12 | 2024-06-12 | 用于分析晶体结构的装置和方法 |
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| KR10-2023-0074914 | 2023-06-12 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101301684B1 (ko) * | 2011-12-06 | 2013-08-30 | 한국기계연구원 | 전자후방산란회절을 이용한 이상조직강의 상분석 방법 |
| KR20200080409A (ko) * | 2018-12-19 | 2020-07-07 | 주식회사 포스코 | 미세 조직 분석 장치 |
| EP3702766A1 (en) * | 2017-10-25 | 2020-09-02 | Nippon Steel Corporation | Crystal orientation map generation device, charged particle radiation device, crystal orientation map generation method, and program |
| JP2023007646A (ja) * | 2021-07-02 | 2023-01-19 | 日本製鉄株式会社 | 鋼板中の磁区観察方法 |
| KR20230054246A (ko) * | 2021-10-15 | 2023-04-24 | 삼성전자주식회사 | 딥러닝 기반 다결정 소재의 결정 구조 및 배향 자동 맵핑법 |
-
2023
- 2023-06-12 KR KR1020230074914A patent/KR20240175155A/ko active Pending
-
2024
- 2024-06-12 EP EP24823684.6A patent/EP4711750A1/en active Pending
- 2024-06-12 WO PCT/KR2024/008011 patent/WO2024258166A1/ko not_active Ceased
- 2024-06-12 CN CN202480038856.XA patent/CN121359020A/zh active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101301684B1 (ko) * | 2011-12-06 | 2013-08-30 | 한국기계연구원 | 전자후방산란회절을 이용한 이상조직강의 상분석 방법 |
| EP3702766A1 (en) * | 2017-10-25 | 2020-09-02 | Nippon Steel Corporation | Crystal orientation map generation device, charged particle radiation device, crystal orientation map generation method, and program |
| KR20200080409A (ko) * | 2018-12-19 | 2020-07-07 | 주식회사 포스코 | 미세 조직 분석 장치 |
| JP2023007646A (ja) * | 2021-07-02 | 2023-01-19 | 日本製鉄株式会社 | 鋼板中の磁区観察方法 |
| KR20230054246A (ko) * | 2021-10-15 | 2023-04-24 | 삼성전자주식회사 | 딥러닝 기반 다결정 소재의 결정 구조 및 배향 자동 맵핑법 |
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| EP4711750A1 (en) | 2026-03-18 |
| KR20240175155A (ko) | 2024-12-19 |
| CN121359020A (zh) | 2026-01-16 |
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