WO2024202401A1 - 積層セラミック電子部品 - Google Patents

積層セラミック電子部品 Download PDF

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Publication number
WO2024202401A1
WO2024202401A1 PCT/JP2024/000952 JP2024000952W WO2024202401A1 WO 2024202401 A1 WO2024202401 A1 WO 2024202401A1 JP 2024000952 W JP2024000952 W JP 2024000952W WO 2024202401 A1 WO2024202401 A1 WO 2024202401A1
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WO
WIPO (PCT)
Prior art keywords
spacer
reinforcing material
multilayer ceramic
spacers
laminate
Prior art date
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Ceased
Application number
PCT/JP2024/000952
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English (en)
French (fr)
Japanese (ja)
Inventor
智規 北川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to CN202480022080.2A priority Critical patent/CN120883302A/zh
Priority to JP2025509777A priority patent/JPWO2024202401A1/ja
Publication of WO2024202401A1 publication Critical patent/WO2024202401A1/ja
Priority to US19/324,328 priority patent/US20260011502A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals

Definitions

  • the present invention relates to multilayer ceramic electronic components such as multilayer ceramic capacitors.
  • Multilayer ceramic electronic components such as multilayer ceramic capacitors are widely used in a variety of electronic devices, including mobile terminal devices such as mobile phones and personal computers.
  • a multilayer ceramic capacitor comprises a rectangular parallelepiped laminate in which dielectric layers and internal electrode layers are alternately stacked, and external electrodes formed on both opposing ends of the laminate.
  • a multilayer ceramic capacitor has an inner layer in which dielectric layers and internal electrodes are alternately stacked. Dielectric layers are then placed on the top and bottom of the inner layer as outer layers to form a rectangular parallelepiped laminate, and external electrodes are provided on both longitudinal end faces of the laminate to form the capacitor body.
  • a multilayer ceramic capacitor that includes a spacer formed on the side of the capacitor body that is mounted on the board so as to cover part of the external electrode.
  • the spacer may peel off, and the durability of the capacitor when mounted is insufficient.
  • the objective of the present invention is to provide a multilayer ceramic capacitor that has a high adhesion between the capacitor body and the spacer and has excellent durability when mounted.
  • the present invention provides a multilayer ceramic electronic component comprising: a laminate in which dielectric layers and internal electrode layers are alternately laminated, and which has two main surfaces facing each other in the lamination direction, two end surfaces facing each other in a length direction intersecting the lamination direction, and two side surfaces facing each other in a width direction intersecting the lamination direction and the length direction; and two external electrodes disposed on each of the two end surfaces, connected to the internal electrode layers, and extending to the two main surfaces and covering a part of the main surfaces and the two side surfaces and covering a part of the side surfaces; two spacers disposed on one end surface side and the other end surface side of one main surface side or one side surface side of the capacitor body, respectively, with the external electrodes sandwiched between them, covering the part of the main surface or the part of the side surfaces; and a reinforcing material disposed between the two spacers, wherein the reinforcing material covers 50% or more of the central spacer end surface that faces each other between the two spacer
  • the present invention aims to provide a multilayer ceramic capacitor that has a high adhesion between the capacitor body and the spacer and has excellent durability when mounted.
  • FIG. 1 is a schematic perspective view of a multilayer ceramic capacitor 1.
  • FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor 1 taken along line II-II in FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor 1 taken along line III-III in FIG.
  • FIG. 3 is an enlarged view of a spacer 4 portion in the cross-sectional view of the multilayer ceramic capacitor 1 in FIG. 2 .
  • 2 is a flowchart illustrating a method for manufacturing the multilayer ceramic capacitor 1.
  • 3A to 3C are diagrams illustrating a laminate manufacturing step S1 and an external electrode forming step S2.
  • 11A to 11C are diagrams illustrating a spacer arranging step S3.
  • FIG. 11 is a diagram illustrating a reinforcing material placement step S4.
  • a multilayer ceramic capacitor 1 will be described as an embodiment of a multilayer ceramic electronic component of the present invention, but the present invention is not limited thereto.
  • the drawings may be drawn in a schematic and simplified manner in order to explain the contents of the invention, and the dimensional ratios of the depicted components or between the components may not match those dimensional ratios described in the specification.
  • components described in the specification may be omitted in the drawings, or may be drawn with the number of components omitted.
  • FIG. 1 is a schematic perspective view of a multilayer ceramic capacitor 1 according to an embodiment.
  • FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor 1 according to an embodiment taken along line II-II in FIG. 1.
  • FIG. 3 is a cross-sectional view of the multilayer ceramic capacitor 1 according to an embodiment taken along line III-III in FIG. 1.
  • the multilayer ceramic capacitor 1 is substantially rectangular and includes a capacitor body 1A having a laminate 2 and a pair of external electrodes 3 provided at both ends of the laminate 2, a spacer 4 attached to the capacitor body 1A, and a reinforcing material 5 disposed between the two spacers 4.
  • the laminate 2 also includes an inner layer 11 in which a dielectric layer 14 and an internal electrode layer 15 are laminated.
  • the terms used to indicate the orientation of the multilayer ceramic capacitor 1 are the length direction L, which is the direction in which the pair of external electrodes 3 are provided in the multilayer ceramic capacitor 1.
  • the direction in which the dielectric layers 14 and the internal electrode layers 15 are stacked is the stacking direction T.
  • the direction that intersects both the length direction L and the stacking direction T is the width direction W. Note that in this embodiment, the width direction W is perpendicular to both the length direction L and the stacking direction T.
  • Outer surface of laminate 2 Among the six outer surfaces of the laminate 2, a pair of outer surfaces facing each other in the stacking direction T is referred to as a first main surface A1 and a second main surface A2, a pair of outer surfaces facing each other in the width direction W is referred to as a first side surface B1 and a second side surface B2, and a pair of outer surfaces facing each other in the length direction L is referred to as a first end surface C1 and a second end surface C2.
  • first main surface A1 and the second main surface A2 When it is not necessary to distinguish between the first main surface A1 and the second main surface A2, they will be collectively referred to as a main surface A, when it is not necessary to distinguish between the first side surface B1 and the second side surface B2, they will be collectively referred to as a side surface B, and when it is not necessary to distinguish between the first end surface C1 and the second end surface C2, they will be collectively referred to as an end surface C.
  • the laminate 2 preferably has rounded ridges R1, including the corners.
  • the ridges R1 are the intersections of two surfaces of the laminate 2, i.e., the main surface A and the side surface B, the main surface A and the end surface C, or the side surface B and the end surface C.
  • the laminate 2 comprises an inner layer portion 11 that forms a capacitance, an outer layer portion 12 that is arranged to sandwich the inner layer portion 11 in the stacking direction T, and a side gap portion 16 that is arranged to sandwich the inner layer portion 11 and the outer layer portion 12 in the width direction W.
  • the inner layer portion 11 includes dielectric layers 14 and internal electrode layers 15 that are alternately stacked along a stacking direction T.
  • the dielectric layer 14 is made of a ceramic material, such as a dielectric ceramic containing BaTiO3 as a main component.
  • the internal electrode layer 15 includes a plurality of first internal electrode layers 15a and a plurality of second internal electrode layers 15b.
  • the first internal electrode layers 15a and the second internal electrode layers 15b are alternately arranged.
  • the first internal electrode layer 15a includes a first opposing portion 152a facing the second internal electrode layer 15b, and a first lead portion 151a drawn from the first opposing portion 152a to the first end face C1 side. An end of the first lead portion 151a is exposed to the first end face C1 and is electrically connected to the first external electrode 3a described later.
  • the second internal electrode layer 15b includes a second opposing portion 152b facing the first internal electrode layer 15a, and a second lead portion 151b drawn from the second opposing portion 152b to the second end face C2. An end of the second lead portion 151b is electrically connected to the second external electrode 3b described later. Charges are stored in the first opposing portions 152a of the first internal electrode layers 15a and the second opposing portions 152b of the second internal electrode layers 15b.
  • the internal electrode layer 15 is preferably formed from a metal material such as nickel (Ni), copper (Cu), silver (Ag), palladium (Pd), a silver-palladium (Ag-Pd) alloy, or gold (Au).
  • a metal material such as nickel (Ni), copper (Cu), silver (Ag), palladium (Pd), a silver-palladium (Ag-Pd) alloy, or gold (Au).
  • the outer layer portion 12 can be formed of the same material as the dielectric layer 14 of the inner layer portion 11 .
  • the multilayer ceramic capacitor 1 includes a first side gap portion 16a that is disposed so as to sandwich the inner layer portion 11 and the outer layer portion 12 in the width direction W and that forms a first side surface B1 of the multilayer ceramic capacitor 1, and a second side gap portion 16b that forms a second side surface B2 of the multilayer ceramic capacitor 1.
  • the side gap portion 16 can be formed of the same material as the dielectric layer 14.
  • the external electrode 3 includes a first external electrode 3a provided on the first end face C1 and a second external electrode 3b provided on the second end face C2.
  • the external electrode 3 covers not only the end face C but also a part of the main face A and the side face B continuing from the end face C.
  • the end of the first extension portion 151a of the first internal electrode layer 15a is exposed to the first end face C1 and is electrically connected to the first external electrode 3a.
  • the end of the second extension portion 151b of the second internal electrode layer 15b is exposed to the second end face C2 and is electrically connected to the second external electrode 3b.
  • the external electrode 3 also includes, for example, a base electrode layer 30 and a plating layer 31. However, it is not necessarily required that the external electrode 3 has such a layered structure.
  • the base electrode layer 30 is formed, for example, by applying and baking a conductive paste containing copper (Cu).
  • the base electrode layer 30 may also contain glass or a ceramic material. However, the configuration of the base electrode layer 30 is not limited to this.
  • the plating layer 31 includes a nickel (Ni) plating layer 31a disposed on the surface of the base electrode layer 30, and a tin (Sn) plating layer 31b disposed on the surface of the nickel (Ni) plating layer 31a. Note that the configuration of the plating layer 31 is not limited to this.
  • the spacer 4 includes a pair of a first spacer 4a and a second spacer 4b.
  • the first spacer 4a is disposed on one end face C1 side in the length direction L on the second main surface A2 side, which is the substrate mounting surface of the capacitor body 1A, and the second spacer 4b is disposed on the other end face C2 side.
  • Each spacer 4 is disposed so as to connect with a portion of the external electrode 3 disposed on the second main surface A2.
  • the first spacer 4a is disposed on one end face C1 side in the length direction L on the first side surface B1 side, which is the substrate mounting surface of the capacitor body 1A, and the second spacer 4b is disposed on the other end face C2 side.
  • spacer main surfaces SA the two surfaces that face the stacking direction T are referred to as spacer main surfaces SA
  • spacer end surfaces SC the two surfaces that face the length direction L are referred to as spacer end surfaces SC
  • spacer side surfaces SB the two surfaces that face the width direction W are referred to as spacer side surfaces SB.
  • the spacer end face SC closer to the center of the length direction L of the capacitor body 1A will be described as the central spacer end face SC1
  • the spacer end face SC on the outside of the length direction L of the laminate 2 will be described as the outer spacer end face SC2.
  • the spacer main surface SA on the capacitor body 1A side will be described as the body-side spacer main surface SA1
  • the spacer main surface SA on the other side will be described as the mounting-side spacer main surface SA2.
  • the board mounting surface of the capacitor body 1A is the first side surface B1
  • the spacer side surface SB on the capacitor body 1A side will be described as the body-side spacer side surface SB1
  • the spacer side surface SB on the other side will be described as the mounting-side spacer main surface SB2.
  • the external electrode 3 is composed of the base electrode layer 30 and the plating layer 31 covering it, and the spacer 4 is disposed on the surface of the plating layer 31.
  • the spacer 4 may be disposed on the surface of the base electrode layer 30, and a second plating layer may be disposed to cover the spacer 4 and the base electrode layer 30. By disposing the second plating layer, the adhesive strength between the spacer 4 and the base electrode layer 30 is improved.
  • the spacer 4 contains either copper (Cu) or nickel (Ni) and tin (Sn) as metal powder.
  • the copper (Cu) and nickel (Ni) may be coated with silver (Ag).
  • the spacer 4 may further contain silver (Ag) as a metal constituting an intermetallic compound.
  • Intermetallic compounds formed by adding tin (Sn) to either copper (Cu) or nickel (Ni) have a melting point that does not melt even when soldering is performed when mounting the multilayer ceramic capacitor 1 on a wiring board, and do not deform due to heat. Therefore, the shape of the spacer 4 can be reliably maintained, and it is possible to arrange it while maintaining the desired shape even during soldering.
  • intermetallic compounds formed by adding tin (Sn) to an alloy of copper (Cu) and nickel (Ni) are preferable as components for forming the spacer 4.
  • Phenol resin may be included in the metal region MP formed by the metal powder.
  • the phenol resin coats the particles of the intermetallic compound and is scattered so as to fill the gaps between the particles.
  • the phenol resin may not completely coat the particles of the intermetallic compound.
  • the amount of gas generated during the heat treatment for forming the spacer 4 can be reduced, thereby reducing voids within the spacer 4.
  • the phenol resin may be exposed on the surface of the spacer 4 and coat at least a portion of the surface of the spacer 4. By coating the surface of the spacer 4 with the phenol resin, the smoothness of the surface of the spacer 4 is improved, and the mechanical strength of the spacer 4 can be increased.
  • phenolic resins include novolac-type phenolic resins such as phenol novolac resin, phenol aralkyl resin, cresol novolac resin, Tcrt-butylphenol novolac resin, and nonylphenol novolac resin, resol-type phenolic resin, and polyoxystyrene such as polyparaoxystyrene.
  • the area ratio of the phenolic resin in the spacer 4 is preferably 1% to 20% in the LT cross section perpendicular to the width direction W of the spacer 4, and more preferably 5% to 15%. If it is less than 1%, the effect of the phenolic resin cannot be fully exerted, and if it exceeds 20%, the adhesive strength of the spacer to the external electrode may decrease.
  • the percentage (%) of the area occupied by the phenolic resin in the spacer 4 can be calculated, for example, by polishing the spacer 4 in the width direction W up to the center of the width direction W, enlarging the polished surface with a microscope (BX-51) at a total magnification of 50 times, and photographing it with a digital camera for microscopes (Olympus DP22).
  • the photographed image obtained is binarized to separate it into metal regions MP and resin regions RP, and the percentage (%) of the area occupied by the phenolic resin can be calculated from the areas of the metal regions MP, metal powder MF, resin regions RP, and voids P using the formula: (area of resin regions RP) / (area of metal regions MP + area of metal powder MF + area of resin regions RP + area of voids P) x 100.
  • FIG. 4 is an enlarged view of the spacer 4 portion in the cross-sectional view of the multilayer ceramic capacitor 1 in FIG. 2.
  • metal powder MF may be included in the resin region RP formed by the phenolic resin. The metal powder MF can inhibit the shrinkage of the phenolic resin, thereby reducing the shrinkage stress caused by the phenolic resin.
  • the spacer 4 preferably has a porosity of 20% or less in the region Z up to 5 ⁇ m from the interface with the external electrode 3. By keeping the porosity low, the bonding area of the spacer 4 that is bonded to the external electrode 3 increases, improving the bonding strength with the external electrode 3.
  • a void P is formed inside the spacer 4, and the maximum diameter of the void P is preferably 1/2 or less of the maximum dimension of the thickness of the spacer 4 in the stacking direction T. If it is greater than 1/2, cracks are more likely to occur starting from the void P, reducing the strength of the spacer 4.
  • the maximum diameter of the void P formed inside the spacer 4 is preferably 1/2 or less of the maximum dimension of the thickness of the spacer 4 in the width direction W.
  • the present invention is not limited to this and may contain other metal components, or may contain a resin other than the phenolic resin, such as an epoxy resin or rosin, or a glass component.
  • the spacer may also be formed without containing a resin.
  • the terminal may be manufactured from a material containing copper, such as copper or a copper alloy, and may be arranged to be connected via Ni plating and solder.
  • the direction discrimination means indicates the direction for facing the second main surface A2 or the first side surface B1 on which the spacer 4 is arranged to the wiring board when mounting the multilayer ceramic capacitor 1 on the wiring board, and can be a means for coloring the spacer 4 in a color different from the external electrode 3, a means for printing a direction identification mark for identifying the direction such as a QR code (registered trademark), or a means for providing a recess in a part of the laminate.
  • the phenolic resin contained in the spacer 4 may be exposed on the surface of the spacer 4 so that it has a color different from that of the external electrode 3.
  • the direction discrimination mark may be provided not only on the spacer 4 but also on the laminate 2. Even if the spacer 4 is larger than the external electrode 3, a direction discrimination means may be provided.
  • the spacer 4 and the external electrode 3 have the same color, it is difficult to tell which side the spacer 4 is attached to when viewed from above, which can lead to errors in image processing.
  • providing a direction identification mark can prevent such errors in image processing.
  • the reinforcing material 5 is disposed between the two spacers 4 so as to cover the second main surface side of the capacitor body 1A.
  • the reinforcing material 5 is disposed between the two spacers 4 so as to cover the first side surface side of the capacitor body 1A.
  • the reinforcing material 5 includes an insulating resin, and in the embodiment, the reinforcing material 5 is mainly made of an insulating resin.
  • the surface of the insulating resin may be coated with a water repellent agent.
  • the insulating resin may contain ceramics, glass, etc.
  • the reinforcing material 5 has a higher adhesion strength with the laminate 2 than an intermetallic compound.
  • the reinforcing material 5 is mainly composed of an epoxy resin, and a phenolic resin can be combined with this as a hardener.
  • a phenolic resin can be combined with this as a hardener.
  • hardeners such as acid anhydride-based, amine-based, and ester-based hardeners can be used.
  • a hardening accelerator may be further added to the epoxy resin. It may be formed only from a water repellent agent.
  • the reinforcing material 5 is disposed continuously in the length direction L between the center spacer end face SC1 of one spacer 4 and the center spacer end face SC1 of the other spacer 4, and covers the second main surface A2 side of the capacitor body 1A (laminate 2) and each of the center spacer end faces SC1 of the two spacers 4.
  • the reinforcing material 5 covers the first side surface B1 side of the capacitor body 1A (laminate 2) and each of the center spacer end faces SC1 of the two spacers 4.
  • the reinforcing material 5 does not necessarily have to be continuous between the first spacer 4a and the second spacer 4b.
  • the reinforcing material 5 may be divided into two parts, one covering the central spacer end face SC1 of the first spacer 4a and a part on the second main surface A2 side of the capacitor body 1A (laminate 2) and the other covering the central spacer end face SC1 of the second spacer 4b and a part on the second main surface A2 side of the capacitor body 1A (laminate 2), and may be arranged discontinuously.
  • the reinforcing material 5 may be divided into two parts, one covering the central spacer end face SC1 of the first spacer 4a and a part on the first side surface B1 side of the capacitor body 1A (laminate 2), and the other covering the central spacer end face SC1 of the second spacer 4b and a part on the first side surface B1 side of the capacitor body 1A (laminate 2), and may be arranged discontinuously.
  • the reinforcing material 5 is fixed to the spacer 4 over 50% or more of the area of the central spacer end face SC1, so the reinforcing material 5 can be fixed to the spacer 4 with a strong force.
  • the length (thickness) Tc of the reinforcing material 5 in the stacking direction T at the portion connected to the spacer 4 is thicker than the length (thickness) Tm in the stacking direction T at the approximate center in the length direction L between the two spacers 4, and it is preferable that Tm ⁇ Tc.
  • the reinforcing material 5 may be in an arch shape whose thickness decreases smoothly from the portion with thickness Tc connected to the spacer 4 to the portion with thickness Tm at the center when viewed from one side in the width direction W.
  • the reinforcing material 5 may have a U-shaped cross section in which the thickness changes suddenly from a portion of thickness Tc connected to the spacer 4 to a portion of thickness Tm in the central portion. In this manner, by having the longitudinal center portion of the reinforcing material 5 recessed such that Tm ⁇ Tc, the possibility of contact between the substrate and the reinforcing material 5 is reduced even when the substrate is distorted.
  • the spacer 4 when viewed in a cross section passing through the length direction L and the stacking direction T, the spacer 4 does not protrude from the external electrode 3 toward the center in the length direction L.
  • the entire area of the second main surface A2 of the laminate 2 exposed in the capacitor body 1A is covered with the reinforcing material 5. Therefore, the adhesive strength between the reinforcing material 5 and the laminate 2 can be maximized.
  • the spacer 4 when viewed on a plane passing through the length direction L and stacking direction T, the spacer 4 protrudes from the external electrode 3 toward the center in the length direction L, and if there is a gap between the spacer 4 and a portion of the second main surface A2 of the laminate 2 where the external electrode 3 is not arranged, the reinforcing material 5 may be arranged so as to enter the gap. If the reinforcing material 5 enters the gap, the bonding area between the reinforcing material 5 and the spacer 4 increases, and the bonding force increases. Note that if the gap is not completely filled with the reinforcing material 5, the gap can mitigate the propagation of vibration.
  • the surface roughness Sa of the spacer 4 is 0.3 ⁇ m or more.
  • the adhesive strength between the spacer 4 and the reinforcing material 5 can be increased by the anchor effect. Note that if the surface roughness is too large, the fillet formed by the reinforcing material 5 will not rise sufficiently, so it is preferable that the surface roughness is 7.0 ⁇ m or less.
  • the measurement of the length (thickness) of the reinforcing material 5 in the stacking direction T described above can be performed, for example, as follows.
  • the multilayer ceramic capacitor 1 joined to the wiring board by solder is polished in the width direction W to the LT cross section position where the multilayer ceramic capacitor 1 and the reinforcing material 5 can be seen.
  • the length of the reinforcing material 5 in the lamination direction T is measured by appropriately adjusting the magnification to, for example, 100 to 500 times.
  • (Method of Manufacturing Multilayer Ceramic Capacitor 1) 5 is a flow chart illustrating a method for manufacturing the multilayer ceramic capacitor 1.
  • the method for manufacturing the multilayer ceramic capacitor 1 includes a laminate manufacturing step S1, an external electrode forming step S2, a spacer arranging step S3, and a reinforcing material arranging step S4.
  • FIG. 6 is a diagram illustrating the laminate manufacturing step S1 and the external electrode forming step S2.
  • FIG. 7 is a diagram illustrating the spacer arrangement step S3.
  • FIG. 8 is a diagram illustrating the reinforcing material arrangement step S4.
  • a ceramic slurry containing ceramic powder, a binder, and a solvent is formed into a sheet shape on the surface of a carrier film using a die coater, a gravure coater, a microgravure coater, or the like to prepare a laminated ceramic green sheet 101 that will become the dielectric layer 14.
  • a conductive paste is printed in stripes on the laminated ceramic green sheet 101 by screen printing, inkjet printing, gravure printing, or the like, and a conductive pattern 102 that will become the internal electrode layer 15 is printed on the surface of the laminated ceramic green sheet 101 to prepare a material sheet 103.
  • multiple material sheets 103 are stacked so that the conductive patterns 102 face the same direction and are offset, for example, by half a pitch in the length direction L between adjacent material sheets 103. Furthermore, outer layer ceramic green sheets 112 that will become the outer layer 12 are stacked on both sides of the multiple stacked material sheets 103.
  • the stacked material sheets 103 and the outer layer ceramic green sheets 112 are pressed together using a hydrostatic press or the like to create the mother block 110 shown in Figure 6(b).
  • the mother block 110 is cut along the cutting line X shown in FIG. 6(b) and along the cutting line Y that intersects with the cutting line X to produce a plurality of laminates 2 shown in FIG. 6(c).
  • Example electrode formation step S2 Next, a conductive paste containing copper (Cu) is applied to the end faces C of the laminate 2 and baked to form the base electrode layer 30.
  • the base electrode layer 30 is formed not only on the end faces C on both sides of the laminate 2 but also on the other end faces C on both sides of the laminate 2. , extending to the main surface A and side surface B of the laminate 2 and covering a portion of the end surface C of the main surface A.
  • a nickel (Ni) plating layer 31a and a tin (Sn) plating layer 31b disposed on the surface of the nickel (Ni) plating layer 31a are formed as plating layers 31 on the surface of the base electrode layer 30, and the resulting structure is shown in FIG.
  • a capacitor body 1A shown in (d) is manufactured.
  • Spacer placement step S3 A spacer manufacturing paste 41 used for manufacturing the spacers is prepared.
  • the spacer manufacturing paste 41 contains metals made of copper (Cu), nickel (NI), tin (Sn), and silver (Ag), a phenol resin, a solvent, and an additive.
  • rosin may be contained instead of the phenol resin.
  • phenolic resins include novolac-type phenolic resins such as phenol novolac resin, phenol aralkyl resin, cresol novolac resin, Tcrt-butylphenol novolac resin, and nonylphenol novolac resin, resol-type phenolic resin, and polyoxystyrene such as polyparaoxystyrene.
  • FIG. 7 is a diagram illustrating the spacer arrangement step S3. As shown in FIG. 7A, first, a spacer manufacturing paste 41 is placed on a holding substrate 40 by a screen printing method, a dispense method, or the like.
  • the capacitor body 1A is mounted on the upper surface of the holding substrate 40 with the second main surface A2 facing the holding substrate 40. At this time, the external electrode 3 of the capacitor body 1A and the spacer manufacturing paste 41 are aligned, and the spacer manufacturing paste 41 adheres to the capacitor body 1A.
  • the heating process is carried out.
  • the metal in the paste produces an intermetallic compound and the metal region MP is formed
  • some of the phenolic resin is taken into the metal region MP and some is expelled from the metal region MP, while hardening, forming a spacer 4 bonded to the capacitor body 1A.
  • an example of the spacer material is shown to include an intermetallic compound and phenolic resin, but the material is not limited to this and may include other types of metal components, or may include resins such as epoxy resins or rosin, or glass components, in addition to phenolic resin. It may also be formed without including resin.
  • the capacitor body 1A is separated from the holding substrate 40 together with the spacer 4.
  • the spacer may be formed by placing a spacer manufacturing paste in a desired shape directly on the surface of the capacitor body 1A and performing a heat treatment.
  • (Reinforcement material placement process S4) 8A and 8B are diagrams illustrating the reinforcing material arrangement step S4.
  • the surface of the capacitor body 1A on which the spacer 4 is arranged is cleaned with a solvent.
  • FIG. 8A after the cleaning is completed, The capacitor body 1A with the spacers 4 disposed thereon is aligned so that the spacers 4 face upward.
  • an insulating resin layer that will become the reinforcing material 5 is formed between the first spacer 4a and the second spacer 4b using a dispenser or squeegee printing on the capacitor body 1A on which the spacer 4 is arranged.
  • the amount of insulating resin that is wetted onto the center spacer end face SC1 can be changed by changing the amount of insulating resin.
  • the insulating resin When the insulating resin is to be inserted into the interface between the spacer 4 and the laminate 2, the insulating resin can be inserted by evacuating the space after the insulating resin is placed. The amount of insertion can be controlled by changing the time and pressure of the evacuation. Through the above steps, the multilayer ceramic capacitor 1 of the embodiment is manufactured.
  • the spacer 4 is attached to the capacitor body 1A, so that the spacer 4 can cushion the vibrations generated in the capacitor body 1A and suppress the vibrations transmitted to the mounting board.
  • the reinforcing material 5 is attached between the spacers 4. This makes it possible to strengthen the adhesive force between the capacitor body 1A and the spacer 4, and to prevent the spacer 4 from peeling off from the capacitor body 1A. Furthermore, resistance to cracks that may occur in the multilayer ceramic capacitor 1 when bending, etc., occurs in the mounting substrate, i.e., substrate bending resistance, is improved.
  • the reinforcing material 5 covers 50% or more of the central spacer end surface SC1 of each of the two spacers 4, ensuring a high adhesive strength between the reinforcing material 5 and the spacers 4.
  • the reinforcing material 5 By forming the reinforcing material 5 from insulating resin, its strength against bending is improved, and by coating it with a water-repellent agent, its moisture resistance can be further improved.
  • the surface roughness of the spacer 4 at the joint with the reinforcing material 5 is 0.3 ⁇ m or more, so the anchor effect can increase the adhesive strength between the spacer 4 and the reinforcing material 5.
  • the thickness Tc of the reinforcing material 5 in the stacking direction T at the central spacer end face SC1 connected to the spacer 4 and the thickness Tm in the stacking direction T at the central portion in the longitudinal direction L between the two spacers 4 are such that Tm ⁇ Tc. Therefore, since the central portion in the longitudinal direction of the reinforcing material 5 is recessed, the possibility of contact between the mounting board and the reinforcing material 5 is reduced even when the multilayer ceramic capacitor 1 is warped.
  • the reinforcing material 5 When a gap is provided between the spacer 4 and the second main surface A2 of the laminate 2, it is preferable to place the reinforcing material 5 in the gap. In this case, when the reinforcing material 5 enters the gap, the bonding area between the reinforcing material 5 and the spacer 4 increases, and the bonding force can be strengthened. On the other hand, if the gap is not completely filled with the reinforcing material 5, the gap can mitigate the propagation of vibration.
  • the present invention is not limited to the embodiment, and can be embodied in various forms without departing from the gist of the present invention.
  • the present invention includes the following combinations:
  • a multilayer ceramic electronic component comprising: a capacitor body in which dielectric layers and internal electrode layers are alternately stacked, the laminate having two main surfaces facing each other in the stacking direction, two end faces facing each other in a length direction intersecting the stacking direction, and two side surfaces facing each other in a width direction intersecting the stacking direction and the length direction; and two external electrodes disposed on each of the two end faces, connected to the internal electrode layers, and extending to the two main surfaces to cover a portion of the main surfaces; two spacers disposed on one end face side and the other end face side of one main surface side of the capacitor body, sandwiching the external electrodes that cover the portion of the main surfaces, and a reinforcing material disposed between the two spacers, the reinforcing material covering 50% or more of the center spacer end face that faces each other between the two spacers, of the two spacer end faces facing each other in the length direction.
  • ⁇ 3> A multilayer ceramic electronic component according to ⁇ 1> or ⁇ 2>, in which the reinforcing material is arranged continuously in the longitudinal direction.
  • ⁇ 4> A multilayer ceramic electronic component according to any one of ⁇ 1> to ⁇ 3>, in which the surface roughness Sa of the spacer at the joint with the reinforcing material is 0.3 ⁇ m or more.
  • ⁇ 5> A multilayer ceramic electronic component according to any one of ⁇ 1> to ⁇ 4>, in which the thickness Tm of the reinforcing material 5 in the stacking direction at the portion connected to the spacer is Tc, where Tm is the thickness in the stacking direction at the center portion in the length direction L between the two spacers, and Tc is Tm ⁇ Tc.
  • ⁇ 6> A multilayer ceramic electronic component according to any one of ⁇ 1> to ⁇ 5>, in which a gap is provided between the spacer and the main surface of the laminate, and the reinforcing material is disposed in the gap.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
PCT/JP2024/000952 2023-03-30 2024-01-16 積層セラミック電子部品 Ceased WO2024202401A1 (ja)

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US19/324,328 US20260011502A1 (en) 2023-03-30 2025-09-10 Laminated ceramic electronic component

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018101405A1 (ja) * 2016-12-01 2018-06-07 株式会社村田製作所 チップ型電子部品
JP2018190952A (ja) * 2017-05-04 2018-11-29 サムソン エレクトロ−メカニックス カンパニーリミテッド． 積層型電子部品及びその実装基板
JP2022099069A (ja) * 2020-12-22 2022-07-04 株式会社村田製作所 積層セラミックコンデンサ及び積層セラミックコンデンサの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018101405A1 (ja) * 2016-12-01 2018-06-07 株式会社村田製作所 チップ型電子部品
JP2018190952A (ja) * 2017-05-04 2018-11-29 サムソン エレクトロ−メカニックス カンパニーリミテッド． 積層型電子部品及びその実装基板
JP2022099069A (ja) * 2020-12-22 2022-07-04 株式会社村田製作所 積層セラミックコンデンサ及び積層セラミックコンデンサの製造方法

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