WO2024137355A1 - Methods and systems for single-side etching glass-based substrates - Google Patents

Methods and systems for single-side etching glass-based substrates Download PDF

Info

Publication number
WO2024137355A1
WO2024137355A1 PCT/US2023/084158 US2023084158W WO2024137355A1 WO 2024137355 A1 WO2024137355 A1 WO 2024137355A1 US 2023084158 W US2023084158 W US 2023084158W WO 2024137355 A1 WO2024137355 A1 WO 2024137355A1
Authority
WO
WIPO (PCT)
Prior art keywords
glass
based substrate
etching
aspects
adhesive
Prior art date
Application number
PCT/US2023/084158
Other languages
French (fr)
Inventor
Jonas Bankaitis
Chelsea Ann BENNETT
Yuhui Jin
Meng SHANG
Original Assignee
Corning Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Incorporated filed Critical Corning Incorporated
Publication of WO2024137355A1 publication Critical patent/WO2024137355A1/en

Links

Definitions

  • the present disclosure relates to methods and systems for single-side etching of a glass-based substrate for use in various industries, for example, consumer electronics, transportation, architecture, defense, medicine, and packaging. Even more specifically, the present disclosure relates to methods of single-side etching glass-based substrates for cover glass applications, for example, curved glass-based substrates.
  • cover glasses that can function as display covers.
  • display covers are made of a curved glass-based substrate. Curved glass-based substrates can be challenging to etch using conventional processes. Therefore, a continuing need exists for systems and methods for etching curved glass-based substrates.
  • the present disclosure is directed to methods for etching a glass-based substrate.
  • the methods can be designed to more efficiently etch substrates by simultaneously etching two different substrates.
  • the methods can comprise laminating two glass-based substrates such that only a single side of each substrate is exposed, etching the substrates on the exposed sides, and separating the substrates to form two single-side etched substrates.
  • the substrates are curved glass-based substrates.
  • the present disclosure is also directed to systems for etching curved glass-based substrates without leaving marks on the surface of the curved substrate. This improves surface quality of the substrates that improve surface quality of the substrates etched.
  • a first aspect (1) of the present application is directed to a method, comprising applying an adhesive to a first side of a first glass substrate, the first glass substrate comprising a second side opposite the first side; coupling the first glass substrate to a second glass substrate at an interface between the first side of the first glass substrate and a first side of the second glass substrate to form a laminated structure comprising the first glass substrate, the second glass substrate, and the adhesive, the second glass substrate comprising a second side opposite the first side of the second glass substrate; after coupling the first glass substrate to the second glass substrate, etching the second side of the first glass substrate and the second side of the second glass substrate with an etchant; and separating the first glass substrate and the second glass substrate after the etching.
  • the etching according to the first aspect (1) comprises simultaneous etching of the second side of the first glass substrate and the second side of the second glass substrate.
  • the first glass substrate and the second glass substrate according to either the first aspect (1) or the second aspect (2) are both curved glass substrates comprising a portion where both the first and second sides have a radius of curvature of greater than 0 m and less than or equal to 10 m.
  • the method according to any one of aspects (1) - (3) further comprises applying an adhesive to at least one of the second side of the first glass substrate or the second side of the second glass substrate after separating the first and second glass substrate; coupling the first glass substrate to the second glass substrate at an interface between the second side of the first glass substrate and the second side of second glass substrate to form a second laminated structure.
  • coupling the first glass substrate to a second glass substrate comprises curing a first portion of the adhesive, wherein the first portion is less than all of the adhesive; and curing a second portion of the adhesive after curing the first portion.
  • the first portion of the adhesive according to the fifth aspect (5) is located at a center of the first side of the first glass substrate and a center of the first side of the second glass substrate.
  • the adhesive according to any one of aspects (1) - (5) is a UV-curable adhesive, and the curing comprises exposing the adhesive to UV light.
  • the etchant according to any one of aspects (1) - (7) comprises hydrofluoric acid, sodium hydroxide, potassium hydroxide, or a combination thereof.
  • the etching according to any one of aspects (1) - (8) removes a surface layer of the first glass substrate at the second side of the first glass substrate, the surface layer comprising a thickness of greater than or equal to about 100 pm.
  • the etching according to any one of aspects (1) - (9) imparts a surface texture on a surface of the first glass substrate at the second side of the first glass substrate, the surface texture comprising an Ra surface roughness of greater than or equal to about 0.1 pm to less than or equal to about 2 pm.
  • the etching according to any one of aspects (1) - (10) comprises exposing the second side of the first glass substrate and the second side of the second glass substrate to an etchant by placing the laminated structure in an etchant bath.
  • the etching according to the eleventh aspect (11) comprises placing the laminated structure in an etching fixture, the etching fixture comprising a top wall, a bottom wall, and side walls; wherein the top wall, the bottom wall, and the side walls comprise a mesh comprising holes comprising an effective diameter of greater than or equal to about 1 mm to less than or equal to about 40 mm.
  • the etching fixture according to the twelfth aspect (12) is made of at least one of polyethylene, polypropylene, polytetrafluoroethylene, or stainless steel.
  • the etching according to either the twelfth aspect (12) or the thirteenth aspect (13) comprises agitating the etching fixture at a speed of greater than or equal to about 10 mm/s to less than or equal to about 250 mm/s.
  • separating the first glass substrate and the second glass substrate comprises exposing the adhesive to UV light and submerging the laminated structure in water having a temperature of greater than or equal to about 90 °C; and applying a pulling force in opposing directions to separate the first glass substrate and the second glass substrate.
  • the first side of the first glass substrate comprises a concave surface and the second side of the first glass substrate comprises a convex surface
  • the first side of the second glass substrate comprises a concave surface and the second side of the second glass substrate comprises a convex surface
  • a seventeenth aspect (17) of the present application is directed to a method, comprising layering a first glass substrate, a second glass substrate, and a spacer, wherein the first glass substrate comprises a first side and a second side opposite the first side, wherein the second glass substrate comprises a first side and a second side opposite the first side, and wherein the spacer is disposed between the first side of the first glass substrate and the first side of the second glass substrate; forming a laminated structure by filling an adhesive into a volume defined by the spacer, the first glass substrate, and the second glass substrate to couple the first glass substrate, the spacer, and the second glass substrate; after forming the laminated structure, etching the second side of the first glass substrate and the second side of the second glass substrate with an etchant; and separating the first glass substrate, the second glass substrate, and the spacer after the etching.
  • the first glass substrate and the second glass substrate according to the seventeenth aspect (17) are both curved glass substrates comprising a portion where both the first and second sides have a radius of curvature of greater than 0 meters and less than or equal to 10 meters.
  • the forming the laminated structure according to either the seventeenth aspect (17) or the eighteenth aspect (18) comprises injecting the adhesive into the volume defined by the spacer, the first glass substrate, and the second glass substrate.
  • the method according any one of aspects (17) - (19) comprises curing a first portion of the adhesive, wherein the first portion is less than all of the adhesive; and curing a second portion of the adhesive after curing the first portion.
  • the method according to any one of aspects (17) — (20) comprises applying, after the separating, an adhesive to at least one of the second side of the first glass substrate or the second side of the second glass substrate; coupling the first glass substrate to the second glass substrate at an interface between the second side of the first glass substrate and the second side of the second glass substrate to form a second laminated structure.
  • a twenty-second aspect (22) of the present application is directed to an etching fixture assembly comprising an etching fixture comprising a volume defined by a top wall, a bottom wall, and side walls; and a glass substrate disposed in the volume, wherein the top wall, the bottom wall, and the side walls comprise a mesh comprising holes comprising an effective diameter of greater than or equal to about 1 mm to less than or equal to about 40 mm, and wherein the bottom wall is configured to move from a first position to a second position, wherein, in the first portion, the bottom wall is tilted at a first angle relative to the top wall, and in the second position, the bottom wall is tilted at a second angle relative to the top wall.
  • the etching fixture according to the twenty- second aspect (22) is made of at least one of polyethylene, polypropylene, polytetrafluoroethylene, or stainless steel.
  • the glass substrate according to either the twenty-second aspect (22) or the twenty-third aspect (23) comprises a portion where both a first side and a second side of the glass-based substrate have a radius of curvature of greater than 0 meters and less than or equal to 10 meters.
  • the bottom wall according to any one of aspects (22) - (24) is parallel to the top wall in the first position.
  • FIGS. 1A-1C illustrate methods and systems for single-side etching substrates according to aspects.
  • FIG. 2 A illustrates a fixture for etching a substrate.
  • FIG. 2B illustrates a planar substrate etched using the fixture illustrated in FIG.
  • FIG. 3 A illustrates the fixture illustrated in FIG. 2A with a curved glass-based substrate.
  • FIG. 3B illustrates a curved substrate etched using the fixture illustrated in FIG. 2A.
  • FIG. 4 illustrates an etching fixture assembly according to aspects.
  • FIG. 5 A illustrates a front view of the etching fixture assembly of FIG. 4.
  • FIG. 5B illustrates a side view of the etching fixture assembly of FIG. 4.
  • FIG. 5C illustrates a top-down view of the etching fixture assembly of FIG. 4.
  • FIG. 6 illustrates an etching fixture assembly with a titled wall according to aspects.
  • FIG. 7 illustrates a substrate without fixture marks.
  • FIG. 8 illustrates a substrate with fixture marks.
  • FIG. 9 illustrates a substrate with fixture marks.
  • FIG. 10 is a flow chart illustrating methods according to aspects.
  • FIG. 11 illustrates a spacer according to aspects.
  • Glass-based substrates are commonly used in consumer products, for example smart phones, tablets, portable media players, personal computers, and cameras. In some applications, it is desirable to etch (for example, etch to texturize or thin) only one side of a glass-based substrate.
  • Existing systems and methods often use a post-polish process to achieve single-side etching, which can increase cost and complexity of the process.
  • Some existing methods use a protective film on one side of the substrate and etch the other side of the substrate. But such protective films typically must be removed following etching, which increases process complexity and waste.
  • these existing systems can be less effective when single-side etching a curved glass-based substrate. And these existing systems etch only one piece of glassbased substrate at a time, which can increase process time and costs for etching multiple glassbased substrates. For example, some processes for etching planar glass-based substrates can cause etching marks on surfaces of curved glass-based substrates that make the marked areas unsuitable for an end product. Although some fixture marks can be removed by polishing, this increases the complexity and cost of the manufacturing. In some cases, these fixture marks cannot be removed by polishing.
  • aspects of the present application are directed to methods and systems for single-side etching of a glass-based substrate, such as a curved glass-based substrate.
  • the single-side etching can comprise laminating two glass-based substrates such that only one side of each glass-based substrate is exposed, etching the laminated structure such that only the exposed sides are etched, and separating the glass-based substrates to form two single-side etched glass-based substrates.
  • glass-based is meant to include any material made at least partially of glass, including glass and glass-ceramics.
  • Glass-ceramics include materials produced through controlled crystallization of glass.
  • One or more nucleating agents for example, titanium oxide (TiO?), zirconium oxide (ZrO?), sodium oxide (Na2O), and phosphorus oxide (P2O5) may be added to a glass-ceramic composition to facilitate homogenous crystallization.
  • one or both glass-based substrates can exhibit an amorphous microstructure and can be substantially free of crystals or crystallites.
  • the glass-based substrate(s) in these aspects exclude glass-ceramic materials.
  • one or both glass-based substrates can be a glass-ceramic substrate.
  • the glass-based substrate can be a curved glass-based substrate.
  • a “curved glass-based substrate” means a substrate comprising at least portion where both the first and second sides have a radius of curvature of greater than 0 meters.
  • the first and second sides can have a radius of curvature of greater than 0 meters and less than or equal to 10 meters.
  • the radius of curvature of the first and second sides can be greater than 0 meters and less than or equal to 10 meters, greater than or equal to about 50 mm to less than or equal to about 200 mm, greater than or equal to about 100 mm to less than or equal to about 150 mm, greater than or equal to about 1 meter to less than or equal to about 8 meters, greater than or equal to about 2 meters to less than or equal to about 5 meters, or within a range having any two of these values as endpoints.
  • a curved glass-based substrate (for example, substrate 110, substrate 120, or both) can comprise a first portion comprising first and second sides with a first radius of curvature and a second portion comprising first and second sides with a second radius of curvature that is greater than first radius of curvature.
  • FIGS. 1 A-1C illustrates methods of etching glass-based substrates according to aspects.
  • first glass-based substrate 110 and second glass-based substrate 120 can be laminated to form laminated structure 100.
  • first glass-based substrate 110 comprises first side 112 and second side 114.
  • second side 114 is opposite first side 112.
  • first glass-based substrate 110 can be a curved glass-based substrate.
  • second glass-based substrate 120 comprises first side 122 and second side 124.
  • second side 124 is opposite first side 122.
  • second glass-based substrate 120 can be a curved glass-based substrate.
  • second side 114 of first glassbased substrate 110 can define a top surface of laminated structure 100.
  • second side 124 of second glass-based substrate 120 can define a bottom surface of laminated structure 100.
  • first glass-based substrate 110 and second glass-based substrate 120 can be laminated using adhesive 130.
  • adhesive 130 can be a UV-curable adhesive. In such aspects, adhesive 130 can be cured by exposing adhesive 130 to UV light.
  • Adhesive 130 can be applied to first side 112 of first substrate 110, to first side 122 of second substrate 120, or to both. In aspects, adhesive 130 can be applied to both first side 112 of first glassbased substrate 110 and first side 122 of second glass-based substrate 120. In aspects, adhesive 130 can be applied using, for example, a brush, a sprayer, a dispenser, a coating machine, or a combination therefore. After applying adhesive 130, first glass-based substrate 110 and second glass-based substrate 120 can be assembled with adhesive disposed between first side 112 and first side 122 to form laminate structure 100.
  • an excess amount of adhesive 130 can be applied to ensure all areas of first side 112 and first side 122 are covered by adhesive 130.
  • adhesive 130 can be applied in an amount of greater than or equal to about 5 grams to less than or equal to about 20 grams, including subranges.
  • adhesive 130 can be applied in an amount of greater than or equal to about 5 grams to less than or equal to about 20 grams, of greater than or equal to about 6 grams to less than or equal to about 18 grams, of greater than or equal to about 8 grams to less than or equal to about 16 grams, or of greater than or equal to about 10 grams to less than or equal to about 14 grams, or within a range having any two of these values as endpoints.
  • the adhesive 130 can be applied in an amount from about 10 grams to about 14 grams.
  • adhesive 130 can be cured.
  • adhesive 130 can be fully cured or spot cured using, for example, a UV light source.
  • Spot curing can comprise fully or partially curing a targeted portion of adhesive 130 while leaving the remaining adhesive uncured.
  • spot curing can target areas where leakage is most likely to occur (for example, at the peak of a curvature for a glass-based substrate, at an edge of the glass-based substrate, etc.).
  • the spot curing can be achieved by first curing, fully or partially, a first portion of adhesive 130 that is less than all of adhesive 130 applied to glass-based substrates 110 and 120.
  • the first portion of adhesive 130 can be proximate to a center of the first side 112 of the first glass-based substrate 110 and a center of the first side 122 of the second glass-based substrate 120. In such aspects, after the first portion of adhesive 130 is cured, the remaining uncured adhesive 130 can spread out from the first portion towards the edges of glass-based substrates 110 and 120. In aspects, after the first portion of adhesive 130 is cured, the uncured adhesive 130 proximate to edges of glass-based substrates 110 and 120 can be spot cured. In aspects, the first portion of adhesive 130 can be located at an area of the first glass-based substrate 110 and/or an area of the second glass-based substrate 120 having the smallest radius of curvature.
  • the remaining uncured adhesive 130 can spread out from the area having the smallest radius of curvature.
  • the uncured adhesive 130 in other areas can be spot cured.
  • the first portion of adhesive 130 can be at a perimeter edge of first side 112 of the first glass-based substrate 110 and a perimeter edge of the first side 122 of the second glass-based substrate 120. In such aspects, after the edges are cured, the adhesive 130 between the first portion and the edges can be spot cured.
  • the spot curing can comprise exposing the first portion and/or edges to a UV light source for about 1 second to about 10 seconds. Additionally or alternatively, in aspects, after spot curing portions of adhesive 130, laminated structure 100 can be exposed to a UV light source for about 3 minutes to about 4 minutes to fully cure all adhesive 130 between glass-based substrates 110 and 120. In aspects, during spot curing, glass-based substrates 110 and 120 can be rotated or titled to allow gravity to direct uncured adhesive flow to specific areas.
  • spot curing is discussed in terms of the glass-based substrate shapes shown in FIG. 1A, the spot curing can be done by curing different areas and in different sequences depending on the specific shape and curvature of glass-based substrates.
  • the edges can be spot cured before a center area.
  • adhesive 130 can be cured using a UV light source that emits light at an appropriate power level and at an appropriate wavelength for a particular adhesive.
  • adhesive 130 can be cured using a UV light source that delivers about 5 W/cm 2 of power to the adhesive 130.
  • adhesive 130 can be cured using a UV light source comprising one or more 362 nm wavelength-producing bulbs.
  • first glass-based substrate 110 and second side 124 of second glass-based substrate 120 are exposed. These exposed sides of glass-based substrates 110 and 120 can be exposed to an etchant during an etching process.
  • the adhesive 130 creates a fluid-tight seal at the edges of glassbased substrates 110 and 120 such that first side 112 of first glass-based substrate 110 and first side 122 of second glass-based substrate 120 are not exposed to an etchant during an etching process.
  • first thickness Ti can be less than second thickness T2. In aspects, first thickness Ti can be greater than second thickness T2.
  • thickness Ti can range from greater than or equal to about 0.5 mm to less than or equal to about 0.8 mm.
  • thickness T2 can range from greater than or equal to about 0.7 mm to less than or equal to about 1.2 mm.
  • the ratio of first thickness Ti to second thickness T2 can range from about 2: 1 to about 1 :2. In aspects, the ratio of first thickness T 1 to second thickness T2 can be about 1 :2.
  • the lateral space between first glass-based substrate 110 and second glass-based substrate 120 filed with adhesive 130 can be consistent across the width of laminated structure 100.
  • the adhesive 130 can have a constant thickness between the first side 112 of the first glass-based substrate 110 and the first side 122 of the second glass-based substrate 120.
  • a spacer 150 can be used between first glassbased substrate 110 and second glass-based substrate 120.
  • adhesive 130 can be filled into the spacer 150.
  • adhesive 130 can be injected into the spacer 150.
  • spacer 150 can define a volume where adhesive 130 can be injected.
  • adhesive 130 can fill the volume defined by spacer 150.
  • the spacer 150 can be configured to prevent leakage of adhesive 130 before curing.
  • spacer 150 can form a seal between first side 112 of first glass-based substrate HO and first side 122 of second glass-based substrate 120.
  • spacer 150 can prevent adhesive 130 from leaking before curing.
  • spacer 150 can comprise at least one of a UV-curable adhesive, a rubber, a polymer, metal, ceramic, paper, or combinations thereof.
  • spacer 150 can comprise polytetrafluoroethylene.
  • spacer 150 can be made of a material that does not leave particulates or marks on the surface of the substrate when in contact therewith.
  • spacer 150 can be made of a UV-curable adhesive.
  • spacer 150 can be made of adhesive 130.
  • spacer 150 can comprise an inlet port 156 through which adhesive 130 can be injected prior to curing.
  • spacer 150 can define a gasket around the perimeter of glass-based substrate 110 and/or glass-based substrate 120, which when glassbased substrate 110 and glass-based substrate 120 are assembled, defines a volume between glass-based substrate 110 and glass-based substrate 120 where adhesive 130 can be injected.
  • spacer 150 can have an outlet port 158 that can be used to apply a vacuum to spacer 150 to draw adhesive 130 through spacer 150 as it is introduced into the inlet port 156.
  • spacer 150 can be shaped to follow the contour of the glass-based substrates.
  • spacer 150 can have a convex side 152 and a concave side 154.
  • the convex side 152 is shaped to follow the concave shape of first side 112 of first glass-based substrate 110
  • the concave side 154 is shaped to follow the convex shape of first side 122 of second glass-based substrate 120.
  • spacer 150 can be made by applying a UV-curable adhesive to a glass-based substrate 110 or 120 that is then partially or fully cured to form spacer 150. This can result in a spacer 150 that conforms to the shape of a glass-based substrate such that when glass-based substrates 110 and 120 are assembled, the spacer 150 can create a fluid tight seal at the edges of glass-based substrates 110 and 120.
  • spacer 150 can have various shapes and sizes.
  • spacer 150 can form a strip around a perimeter of a glass-based substrate, which when assembled with a second glass-based substrate, forms a volume defined by the glass-based substrates and spacer 150.
  • adhesive 130 can be filled or injected in the volume when adhesive 130 is applied to the glass-based substrates.
  • spacer 150 can comprise a spiral shape defining a flow path through which adhesive 130 can be injected when adhesive 130 is applied.
  • spacer 150 can comprise multiple separate components that together form spacer 150.
  • the thickness of spacer 150 can be selected based on the geometry of spacer 150.
  • spacer 150 can have a maximum uncompressed thickness greater than or equal to about 0.1 mm to less than or equal to about 2 mm, or greater than or equal to about 0.5 mm to less than or equal to about 0.8 mm.
  • spacer 150 can be compressible.
  • spacer 150 can compress to about 50% of its uncompressed thickness when assembled between first glass-based substrate 110 and second glass-based substrate 120.
  • spacer 150 can aid in defining a suitable volume between glass-based substrates 110 and 120 for filling with adhesive 130.
  • glass-based substrates 110 and 120 can be laminated without the use of spacer 150.
  • laminated structure 100 can be etched using one or more etchants.
  • the etchant can comprise an acid and/or a base, for example, hydrofluoric acid, sodium hydroxide, potassium hydroxide, or a combination thereof.
  • the etchant can comprise an acid (e.g., hydrofluoric acid).
  • the etchant can comprise hydrofluoric acid at a concentration of greater than or equal to about 1 vol% to less than or equal to about 10 vol%.
  • the etchant can comprise a base (e.g., sodium hydroxide and/or potassium hydroxide).
  • the etchant can comprise sodium hydroxide at a concentration of greater than or equal to about 30 vol% to less than or equal to about 70 vol%. In aspects, the etchant can comprise potassium hydroxide at a concentration of about 30 vol% to about 70 vol%.
  • laminated structure 100 can be etched in an etchant bath.
  • laminated strategycture 100 can be etched using spray etching. The etching can texturize and/or thin glass-based substrates 110 and 120.
  • the etching can impart a surface texture on a surface of the first glassbased substrate 110 at the second side 114 of the first glass-based substrate 110.
  • the surface texture can comprise an Ra surface roughness from greater than or equal to about 0.1 pm (microns) to less than or equal about 10 pm.
  • the surface texture can comprise an Ra surface roughness from greater than or equal to about 0.1 pm to less than or equal to about 10 pm, from greater than or equal to about 0.5 pm to less than or equal to about 8 pm, from greater than or equal to about 1 pm to less than or equal to about 5 pm, from greater than or equal to about 2 pm to less than or equal to about 4 pm, or within a range having any two of these values as endpoints.
  • the surface texture can comprise an Ra roughness from about 0.1 pm to about 2 pm.
  • the texture can be an antiglare texture.
  • the etching can impart a surface texture on a surface of the second glass-based substrate at the second side 124 of the second glass-based substrate.
  • the surface texture can comprise an Ra surface roughness from greater than or equal to about 0.1 pm (microns) to less than or equal about 10 pm.
  • the surface texture can comprise an Ra surface roughness from greater than or equal to about 0.1 pm to less than or equal to about 10 pm, from greater than or equal to about 0.5 pm to less than or equal to about 8 pm, from greater than or equal to about 1 pm to less than or equal to about 5 pm, from greater than or equal to about 2 pm to less than or equal to about 4 pm, or within a range having any two of these values as endpoints.
  • the surface texture can comprise a roughness from about 0.1 pm to about 2 pm.
  • the texture can be an antiglare texture.
  • the etching can thin glass-based substrate 110 and/or glass-based substrate 120 by removing a surface layer at the second side 114 of first glass-based substrate 110, at the second side 124 of the second glass-based substrate 120, or both.
  • the etching can thin the glass-based substrate(s) 110/120 to remove a surface layer having a thickness from greater than or equal to about 50 pm to less or equal to about 1000 pm.
  • the surface layer removed can have a thickness from greater than or equal to about 50 pm to less than or equal to about 1000 pm, from greater than or equal to about 100 pm to less than or equal to about 700 pm, from greater than or equal to about 200 pm to less than or equal to about 500 pm, from greater than or equal to about 300 pm to less than or equal to about 400 pm, or within a range having any two of these values as endpoints.
  • the etching can simultaneously etch second side 114 of first glassbased substrate 110 and second side 124 of second glass-based substrate 120.
  • second side 114 and second side 124 can be simultaneously textured, thinned, or both.
  • the etching process can comprise placing laminated structure 100 in an etching fixture.
  • laminated structure 100 is exposed to the etchant while disposed within the etching fixture.
  • laminated structure 100 can be placed in etching fixture 400 discussed below and shown in FIGS. 4-6.
  • the etching process can comprise agitation of fixture 400 to minimize contact between laminated structure 100 and the etching fixture (for example, etching fixture 400) during etching.
  • the etching process can alternatively or additionally comprise recirculation of etchant to minimize contact between laminated structure 100 and the etching fixture (for example, etching fixture 400) during etching.
  • the etching process does not include agitation.
  • the etching process can comprise agitation, and the agitation speed can be less than or equal to about 300 mm/s (millimeters per second).
  • the agitation speed can be from greater than or equal to about 1 mm/s to less than or equal to about 300 mm/s, from greater than or equal to about 5 mm/s to less than or equal to about 275 mm/s, from greater than or equal to about 10 mm/s to less than or equal to about 250 mm/s, from greater than or equal to about 30 mm/s to less than or equal to about 225 mm/s, from greater than or equal to about 50 mm/s to less than or equal to about 200 mm/s, from greater than or equal to about 75 mm/s to less than or equal to about 150 mm/s, or within a range having any two of these values as endpoints.
  • the agitation speed can be less than or equal to about 250 mm/s.
  • the term “agitation speed” means the speed at which a fixture (for example, fixture 400) moves up and down. As a non-limiting example, if the agitation speed is 50 mm/s, the fixture moves 50 millimeters up or down in one second.
  • the etching process comprises agitation, and the up-down agitation distance for the fixture can be less than or equal to about 100 mm.
  • the up-down agitation distance can be from greater than or equal to about 1 mm to less than or equal to about 100 mm, from greater than or equal to about 5 mm to less than or equal to about 100 mm, from greater than or equal to about 10 mm to less than or equal to about 100 mm, from greater than or equal to about 25 mm to less than or equal to about 100 mm, from greater than or equal to about 40 mm to less than or equal to about 100 mm, or within a range having any two of these values as endpoints.
  • the agitation can comprise agitating the fixture using an orbital shake plate with a shake distance greater than 0 mm to less than or equal to about 200 mm.
  • the orbital shake plate can have a shake distance from greater than or equal to about 1 mm to less than or equal to about 200 mm, from greater than or equal to about 5 mm to less than or equal to about 200 mm, from greater than or equal to about 25 mm to less than or equal to about 200 mm, from greater than or equal to about 50 mm to less than or equal to about 200 mm, from greater than or equal to about 75 mm to less than or equal to about 200 mm, or within a range having any two of these values as endpoints.
  • the term “shake distance” means the distance from the center of the orbital shake plate to the maximum shake location.
  • the orbital shake plate can shake at a rate of about 0 rpm to less than or equal to about 500 rpm. In aspects, the orbital shake plate can shake at a rate from greater than or equal to about 1 rpm to less than or equal to about 500 rpm, from greater than or equal to about 50 rpm to less than or equal to about 500 rpm, from greater than or equal to about 100 rpm to less than or equal to about 500 rpm, from greater than or equal to about 200 rpm to less than or equal to about 500 rpm, or within a range having any two of these values as endpoints.
  • the etching process can comprise recirculation of the etchant at a rate of greater than 0 m 3 /min (meters cubed per minute) to less than or equal to about 10 m 3 /min.
  • the recirculation rate can be from greater than or equal to about 1 m 3 /min to less than or equal to about 7 m 3 /min, from greater than or equal to about 2 m 3 /min to less than or equal to about 5 m 3 /min, from greater than or equal to about 3 m 3 /min to less than or equal to about 4 m 3 /min, or within a range having any two of these values as endpoints.
  • first glass-based substrate 110 and second glass-based substrate 120 can be separated, as illustrated in FIG. IB.
  • the separation can compri se exposing laminated structure 100 to a UV light source to weaken the adhesive 130.
  • the UV light source used to separate laminated structure 100 can be the same UV light source used to cure adhesive 130.
  • the UV light source used to separate laminated structure 100 can be different than the UV light source used to cure adhesive 130.
  • the separation can comprise exposing laminate structure 100 to water.
  • laminated structure 100 can be exposed to water having a temperature of about 85 °C to about 100 °C (for example, about 85 °C to about 98 °C).
  • exposing laminate structure 100 to water can comprise submerging laminate structure 100 in the water.
  • the separation can comprise exposing laminated structure 100 to a UV light source and exposing laminated structure 100 to water.
  • laminated structure 100 can be exposed to water having a temperature of about 85 °C to about 100 °C (for example, about 85 °C to about 98 °C).
  • laminated structure 100 can be submerged in water for about 2 minutes to about 10 minutes (for example, about 3 minutes to about 8 minutes).
  • first glass-based substrate 110 and second glass-based substrate 120 can be separated by applying a pulling force to one or both of first glass-based substrate 110 and second glass-based substrate 120.
  • any remaining adhesive 130 on first side 112 or first side 122 can be removed, and glass-based substrates 110 and 120 can be cleaned.
  • glass-based substrates 110 and 120 can be used in the manufacture of a consumer product (e.g., a displaydevice, etc.) after separation and cleaning. In such aspects, glass-based substrates 110 and 120 can be further processed as needed for manufacture of the consumer product.
  • spacer 150 can also be removed after separating glass-based substrates 110 and 120.
  • glass-based substrates 110 and 120 can be re-laminated such that the un-etched sides (for example, sides 112 and 122) are exposed.
  • glass-based substrates 1 10 and 120 can be re-laminated to form second laminated structure 102.
  • laminated structure 102 comprises adhesive 140 disposed between etched surfaces of glass-based substrates 110 and 120 (e.g., second side 114 and second side 124).
  • adhesive 140 can be the same adhesive type as adhesive 130.
  • adhesive 140 can be a different adhesive type than adhesive 130.
  • adhesive 140 can be a UV-curable adhesive.
  • adhesive 140 can applied to glass-based substrates 110 and 120 as described for adhesive 130, except that adhesive 140 is applied to second side 1 14 of first glass-based substrate 110 and/or to second side 124 of second glass-based substrate 120.
  • adhesive 140 can be cured as described above for adhesive 130.
  • laminated structure 102 can be used in the manufacture a consumer product (e.g., a display device). In such aspects, laminated structure 102 can be further processed as needed for manufacture of the consumer product.
  • etching fixtures for etching of glass-based substrates can comprise a first plate 202 and a second plate 204 with recesses 206 and projections 208 configured to hold glass-based substrates during etching.
  • etching fixture 200 can present challenges with single-side etching.
  • the structure of fixture may require that a glass-based substrate include a protective film on one side of the substrate to restrict etching to one side.
  • FIG. 2A illustrates a planar glass-based substrate 300 in etching fixture 200.
  • edges of the glass can be in contact with fixture 200.
  • FIG. 2B illustrates planar glass-based substrate 300 after etching, and as shown in FIG. 2B, side 302 of planar glass-based substrate 300 contains no fixture marks.
  • etching fixture 200 may be capable of etching a planar glass-based substrate with limited or no fixture marks
  • etching curved glass-based substrates such as glassbased substrates 110 and 120 or laminated structure 100
  • side 312 of a curved glass-based substrate 310 can contact protrusions 208 during etching.
  • This can create significant fixture marks, for example marks 316 shown in FIG. 3B at points of contact between side 312 and protrusions 208.
  • fixture marks 316 created by etching curved glass-based substrate 310 in fixture 200 can have a height of 5 pm or greater.
  • the resulting fixture marks can be too large to efficiently remove by polishing without disrupting desired surface characteristics created during etching.
  • marks 316 can be located away from the edges of curved glass-based substrate 310. Accordingly, although the area that includes the marks 316 could be cut away, this would require the use of an additional cutting step and discarding a significant portion of the etched curved glass-based substrate 310.
  • a “fixture mark” is a bump or ridge on a surface of a glass-based substrate that has a peak height of at least 1 pm and is caused by contact with an etching fixture.
  • glass-based substrate 310 may be loosely secured in etching fixture 200 such that glass-based substrate 310 is susceptible to slipping out of etching fixture 200 during etching.
  • glass-based substrate 310 due to the loose fit of glass-based substrate 310 in etching fixture 200, during agitation, glass-based substrate 310 can slip out of etching fixture 200.
  • substrates for example, glass-based substrates 110 and 120 or laminated structure 100
  • substrates can be etched using etching fixture 400.
  • Etching fixture 400 can be designed to improve surface quality of etched curved substrates by minimizing or eliminating scratches and fixture marks created during etching. This can be especially helpful for softer glass-based substrates that are sensitive to touch and susceptible to scratches and marks.
  • etching fixture 400 comprises walls 410 that together define a volume within which a glass-based substrate (for example, substrate 110, substrate 120, or laminated structure 100) can be disposed for etching.
  • walls 410 can define a top wall 414, a bottom wall 416, and sides of etching fixture 400.
  • one or more of walls 410 can comprise a mesh 401.
  • two or more walls 410 can comprise a mesh 401.
  • all of walls 410 can comprise a mesh 401.
  • one or more walls 410 can be defined, in whole or in part, by a mesh 401.
  • two or more walls 410 can be defined, in whole or in part, by a mesh 401.
  • all of walls 410 can be defined, in whole or in part, by a mesh 401.
  • walls 410 can define the volume within which a glass-based substrate can be disposed for etching.
  • walls 410 can define top wall 414, bottom wall 416, and sides that together define the volume.
  • the mesh 401 can comprise openings 404 defined by strands 402 of material. As shown in FIGS. 4-6, strands 402 can form a grid that defines the mesh 401. Strands 402 can be made of a material that is resistant to etching. In aspects, strands 402 can be made of at least one of polyethylene, polypropylene, polytetrafluoroethylene, or stainless steel.
  • Openings 404 can have various shapes and sizes. In aspects, openings 404 can be circles or rectangles. In aspects, as shown in FIG. 5A, openings 404 can be the same shape and size. For example, as shown in FIG. 5 A, openings 404 can be a square having dimensions Di x Di. In aspects, as shown in FIG. 5B, openings 404 can be different shapes and sizes. In aspects, as shown in FIGS. 5B and 6, openings 404 can be rectangles. In aspects, as shown in FIG. 5B, openings 404 can have different sizes, with some openings 404 being be smaller than others. For example, some openings 404 can have dimensions D2 x D3 or D2 x D4. In aspects, D3 is greater than D4. In aspects, D2 is greater than each of D3 and D4.
  • Each of Di, D2, D3, and D4 can be from greater than or equal to about 1 mm to less than or equal to about 40 mm. In aspects, each of Di, D2, D3, and D4, can be from greater than or equal to about 1 mm to less than or equal to about 40 mm, from greater than or equal to about 5 mm to less than or equal to about 30 mm, from less than or equal to about 10 mm to less than or equal to about 20 mm, or within a range having any two of these values as endpoints.
  • openings 404 of the mesh 401 can have a size defined by an effective diameter of the openings 404.
  • the term “effective diameter” is utilized to describe the size of a hole or opening, but this term should not be interpreted as requiring a hole or opening to have a circular diameter or shape. Instead, holes or openings may have noncircular shapes, and in such aspects, the term “effective diameter” is intended to refer to the maximum cross-sectional dimension of the shape.
  • the “effective diameter” of a hole or opening having an elliptical cross-sectional shape would be the length of the major axis of the elliptical shape. For a hole or opening having an effective diameter that varies along the depth of the hole or opening, the effective diameter is the largest effective diameter.
  • the effective diameter of openings 404 can be from greater than or equal to about 1 mm to less than or equal to about 40 mm. In aspects, the effective diameter can be from greater than or equal to about 1 mm to less than or equal to about 40 mm, from greater than or equal to about 5 mm to less than or equal to about 30 mm, from greater than or equal to about 10 mm to less than or equal to about 20 mm, or within a range having any two of these values as endpoints.
  • etching fixture 400 is shown throughout the figures as a cuboid, etching fixture 400 can have various shapes, such as a cylinder, conic section, or a cube.
  • etching a substrate can comprise placing the substrate in etching fixture 400.
  • etching can comprise exposing one or more substrates disposed inside etching fixture 400 to an etchant.
  • etching can comprise placing etching fixture 400, with one or more substrates disposed inside etching fixture 400, in the etchant bath.
  • etching with etching fixture 400 can comprise agitation and/or recirculation, as discussed herein.
  • agitation can be used during etching, and the agitation speed can be adjusted such that the contact been the substrate and any walls of etching fixture 400 can be reduced or eliminated.
  • laminated structure 100 can be effectively suspended within etching fixture 400 during etching by the agitation and/or recirculation.
  • laminated structure 100 can be etched without causing any significant fixture marks on a surface of laminated structure 100.
  • FIG. 7 illustrates laminated structure 100 without any etching marks.
  • fixture marks for example fixture marks 116 illustrated in FIG. 8 can be reduced or eliminated.
  • substrates etched using etching fixture 400 have minimal or no fixture marks.
  • substrates (for example, glass-based substrates 110 and 120, or laminated structure 100) etched using etching fixture 400 have no fixture marks.
  • the etched substrate can be used for manufacture of a consumer product without requiring cutting or removing a significant portion of the substrate.
  • etching fixture 400 can comprise a floor 420 configured to move between a first position and a second position.
  • floor 420 in the first position, floor 420 can be tilted at a first angle relative to top wall 414 of fixture 400.
  • the first angle can be 0 degrees (i.e., floor 420 is parallel to top wall 414).
  • floor 420 in the second position, floor 420 can be tilted at a second angle (A) relative to top wall 414.
  • the second angle (A) can be any angle between about 1 degree and about 75 degrees relative to top wall 414.
  • second angle (A) can be from greater than or equal to about 1 degree to less than or equal to about 75 degrees relative to top wall 414.
  • second angle (A) can be from greater than or equal to about 5 degrees to less than or equal to about 60 degrees, from greater than or equal to about 10 degrees to less than or equal to about 45 degrees, from greater than or equal to about 15 degrees to less than or equal to about 30 degrees, or within a range having any two of these values as endpoints.
  • floor 420 can be bottom wall 416 of etching fixture 400.
  • floor 420 can be moved from the first position to the second position manually.
  • fixture 400 can comprise a mechanical mechanism configured to move floor 420 from the first position to the second position.
  • a tilted floor 420 as described herein can help limit fixture marks to a specific or targeted area of a substrate etched within etching fixture 400, leaving the remainder of the substrate without fixture marks.
  • FIG. 9 illustrates fixture marks 116 that can result from etching while floor 420 is tilted at the second angle.
  • floor 420 can be titled to the second angle as discussed above, and agitation and/or recirculation can be used to help position the substrate within etching fixture 400 during etching.
  • etching fixture 400 can be used to simultaneously etch two or more substrates (for example two or more glass-based substrates 110 and 120, or two or more laminated structures 100).
  • substrates for example two or more glass-based substrates 110 and 120, or two or more laminated structures 100.
  • numerous glass-based substrates 110/120 or laminated structures 100 can be placed in etching fixture 400 for simultaneous etching.
  • Etching fixture 400 can be used for either single-side etching discussed herein, or for double-sided etching.
  • one or more laminated structures 100 can be placed within etching fixture 400 for single-side etching discussed related to FIGS. 1 A-1C.
  • one or more substrates e.g., glass-based substrates 110 and 120
  • one or more substrates (e.g., glass-based substrates 110 and 120) without protective film can be etched in etching fixture 400 for double-side etching.
  • FIG. 10 illustrates a method 1000 of etching substrates (e.g., glass-based substrates 110 and 120) according to aspects.
  • an adhesive can be applied to a first side of a first substrate.
  • step 1010 comprises applying adhesive 130 to first side 112 of first glass-based substrate 110.
  • step 1020 an adhesive can be applied to a first side of a second substrate.
  • step 1020 comprises applying adhesive 130 to first side 122 of second glass-based substrate 120.
  • the first and second substrates are layered with the adhesive between the first and second substrates.
  • step 1030 comprises layering first glass-based substrate 110 and second glass-based substrate 120 such that adhesive 130 is between first side 112 and first side 122.
  • step 1020 is optional and adhesive is applied to only one surface before layering in step 1030.
  • first glass-based substrate 110, second glass-based substrate 120, and adhesive 130 can be layered at step 1030 immediately after adhesive is applied to a first side of a first substrate at step 1010.
  • spacer 150 can be applied in step 1010 and/or step 1020.
  • the adhesive 130 is cured to form a laminated structure 100.
  • step 1040 comprises curing adhesive 130 using a spot curing method as discussed herein.
  • step 1050 the exposed sides of the laminated structure are etched to texturize or thin the two laminated substrates.
  • step 1050 comprises etching second side 114 of first glass-based substrate 110 and second side 124 of second glass-based substrate 120 as discussed herein.
  • step 1060 the first and second substrates 110 and 120 can be separated.
  • step 1060 can comprise exposing the adhesive 130 to a UV light source and/or water as described herein.
  • step 1070 the substrates can be re-laminated such that the unetched surfaces are exposed.
  • step 1070 can comprise applying adhesive 140 to one or more of second side 114 of first glass-based substrate 110 and second side 124 of second glass-based substrate 120, layering first glass-based substrate 110 and second glass-based substrate 120 with adhesive 140 disposed between, and curing adhesive 140 to form laminated structure 102.
  • “comprising” is an open-ended transitional phrase.
  • a list of elements following the transitional phrase “comprising” is a non-exclusive list, such that elements in addition to those specifically recited in the list may also be present.
  • “consisting essentially of’ or “composed essentially of’ limits the composition of a material to the specified materials and those that do not materially affect the basic and novel character! stic(s) of the material.
  • “consisting of’ or “composed entirely of’ limits the composition of a material to the specified materials and excludes any material not specified.
  • the term “about” refers to a value that is within ⁇ 5% of the value stated.
  • about 100 mm can include any number between 95 mm and 105 mm. That said, if a percentage is listed and the value of that percentage cannot go above 100%, for example 100 wt% or 99 wt%, “about” does not modify the percentage to include values over 100%.

Landscapes

  • Surface Treatment Of Glass (AREA)

Abstract

Methods and systems for etching a glass-based substrate. In aspects, the method can comprise applying an adhesive to a first glass-based substrate and a second glass-based substrate, coupling the first glass-based substrate to the second glass-based substrate to form a laminated structure, etching the exposed sides of the laminated structure with an etchant, and separating the first glass-based substrate and the second glass-based substrate after the etching. Systems for etching a glass-based substrate can comprise a mesh etching fixture that can be used to minimize or eliminate fixture marks on the glass-based substrate during etching.

Description

METHODSAND SYSTEMS FOR SINGLE-SIDE ETCHING GLASSBASED SUBSTRATES
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit of priority under 35 U.S.C. § 119 of U.S. Provisional Application Serial No. 63/434620 filed on December 22, 2022, the content of which is relied upon and incorporated herein by reference in its entirety.
FIELD
[0002] The present disclosure relates to methods and systems for single-side etching of a glass-based substrate for use in various industries, for example, consumer electronics, transportation, architecture, defense, medicine, and packaging. Even more specifically, the present disclosure relates to methods of single-side etching glass-based substrates for cover glass applications, for example, curved glass-based substrates.
BACKGROUND
[0003] Many consumer products, for example smart phones, tablets, portable media players, personal computers, and cameras, incorporate cover glasses that can function as display covers. Often these display covers are made of a curved glass-based substrate. Curved glass-based substrates can be challenging to etch using conventional processes. Therefore, a continuing need exists for systems and methods for etching curved glass-based substrates.
BRIEF SUMMARY
[0004] The present disclosure is directed to methods for etching a glass-based substrate. The methods can be designed to more efficiently etch substrates by simultaneously etching two different substrates. The methods can comprise laminating two glass-based substrates such that only a single side of each substrate is exposed, etching the substrates on the exposed sides, and separating the substrates to form two single-side etched substrates. In aspects, the substrates are curved glass-based substrates. The present disclosure is also directed to systems for etching curved glass-based substrates without leaving marks on the surface of the curved substrate. This improves surface quality of the substrates that improve surface quality of the substrates etched. [0005] A first aspect (1) of the present application is directed to a method, comprising applying an adhesive to a first side of a first glass substrate, the first glass substrate comprising a second side opposite the first side; coupling the first glass substrate to a second glass substrate at an interface between the first side of the first glass substrate and a first side of the second glass substrate to form a laminated structure comprising the first glass substrate, the second glass substrate, and the adhesive, the second glass substrate comprising a second side opposite the first side of the second glass substrate; after coupling the first glass substrate to the second glass substrate, etching the second side of the first glass substrate and the second side of the second glass substrate with an etchant; and separating the first glass substrate and the second glass substrate after the etching.
[0006] In a second aspect (2), the etching according to the first aspect (1) comprises simultaneous etching of the second side of the first glass substrate and the second side of the second glass substrate.
[0007] In a third aspect (3), the first glass substrate and the second glass substrate according to either the first aspect (1) or the second aspect (2) are both curved glass substrates comprising a portion where both the first and second sides have a radius of curvature of greater than 0 m and less than or equal to 10 m.
[0008] In a fourth aspect (4), the method according to any one of aspects (1) - (3) further comprises applying an adhesive to at least one of the second side of the first glass substrate or the second side of the second glass substrate after separating the first and second glass substrate; coupling the first glass substrate to the second glass substrate at an interface between the second side of the first glass substrate and the second side of second glass substrate to form a second laminated structure.
[0009] In a fifth aspect (5), coupling the first glass substrate to a second glass substrate according to any one of aspects (1) - (4) comprises curing a first portion of the adhesive, wherein the first portion is less than all of the adhesive; and curing a second portion of the adhesive after curing the first portion.
[0010] In a sixth aspect (6), the first portion of the adhesive according to the fifth aspect (5) is located at a center of the first side of the first glass substrate and a center of the first side of the second glass substrate.
[0011] In a seventh aspect (7), the adhesive according to any one of aspects (1) - (5) is a UV-curable adhesive, and the curing comprises exposing the adhesive to UV light. [0012] In an eighth aspect (8), the etchant according to any one of aspects (1) - (7), comprises hydrofluoric acid, sodium hydroxide, potassium hydroxide, or a combination thereof.
[0013] In a ninth aspect (9), the etching according to any one of aspects (1) - (8) removes a surface layer of the first glass substrate at the second side of the first glass substrate, the surface layer comprising a thickness of greater than or equal to about 100 pm. [0014] In a tenth aspect (10), the etching according to any one of aspects (1) - (9) imparts a surface texture on a surface of the first glass substrate at the second side of the first glass substrate, the surface texture comprising an Ra surface roughness of greater than or equal to about 0.1 pm to less than or equal to about 2 pm.
[0015] In an eleventh aspect (11), the etching according to any one of aspects (1) - (10) comprises exposing the second side of the first glass substrate and the second side of the second glass substrate to an etchant by placing the laminated structure in an etchant bath.
[0016] In a twelfth aspect (12), the etching according to the eleventh aspect (11) comprises placing the laminated structure in an etching fixture, the etching fixture comprising a top wall, a bottom wall, and side walls; wherein the top wall, the bottom wall, and the side walls comprise a mesh comprising holes comprising an effective diameter of greater than or equal to about 1 mm to less than or equal to about 40 mm.
[0017] In a thirteenth aspect (13), the etching fixture according to the twelfth aspect (12) is made of at least one of polyethylene, polypropylene, polytetrafluoroethylene, or stainless steel.
[0018] In a fourteenth aspect (14), the etching according to either the twelfth aspect (12) or the thirteenth aspect (13) comprises agitating the etching fixture at a speed of greater than or equal to about 10 mm/s to less than or equal to about 250 mm/s.
[0019] In a fifteenth aspect (15), separating the first glass substrate and the second glass substrate according to any one of aspects (1) - (14) comprises exposing the adhesive to UV light and submerging the laminated structure in water having a temperature of greater than or equal to about 90 °C; and applying a pulling force in opposing directions to separate the first glass substrate and the second glass substrate.
[0020] In a sixteenth aspect (16), in the method according to any one of aspects (1) - (15), the first side of the first glass substrate comprises a concave surface and the second side of the first glass substrate comprises a convex surface, and the first side of the second glass substrate comprises a concave surface and the second side of the second glass substrate comprises a convex surface. [0021] A seventeenth aspect (17) of the present application is directed to a method, comprising layering a first glass substrate, a second glass substrate, and a spacer, wherein the first glass substrate comprises a first side and a second side opposite the first side, wherein the second glass substrate comprises a first side and a second side opposite the first side, and wherein the spacer is disposed between the first side of the first glass substrate and the first side of the second glass substrate; forming a laminated structure by filling an adhesive into a volume defined by the spacer, the first glass substrate, and the second glass substrate to couple the first glass substrate, the spacer, and the second glass substrate; after forming the laminated structure, etching the second side of the first glass substrate and the second side of the second glass substrate with an etchant; and separating the first glass substrate, the second glass substrate, and the spacer after the etching.
[0022] In an eighteenth aspect (18), the first glass substrate and the second glass substrate according to the seventeenth aspect (17) are both curved glass substrates comprising a portion where both the first and second sides have a radius of curvature of greater than 0 meters and less than or equal to 10 meters.
[0023] In a nineteenth aspect (19), the forming the laminated structure according to either the seventeenth aspect (17) or the eighteenth aspect (18) comprises injecting the adhesive into the volume defined by the spacer, the first glass substrate, and the second glass substrate.
[0024] In a twentieth aspect (20), the method according any one of aspects (17) - (19) comprises curing a first portion of the adhesive, wherein the first portion is less than all of the adhesive; and curing a second portion of the adhesive after curing the first portion.
[0025] In a twenty-first aspect (21), the method according to any one of aspects (17) — (20) comprises applying, after the separating, an adhesive to at least one of the second side of the first glass substrate or the second side of the second glass substrate; coupling the first glass substrate to the second glass substrate at an interface between the second side of the first glass substrate and the second side of the second glass substrate to form a second laminated structure.
[0026] A twenty-second aspect (22) of the present application is directed to an etching fixture assembly comprising an etching fixture comprising a volume defined by a top wall, a bottom wall, and side walls; and a glass substrate disposed in the volume, wherein the top wall, the bottom wall, and the side walls comprise a mesh comprising holes comprising an effective diameter of greater than or equal to about 1 mm to less than or equal to about 40 mm, and wherein the bottom wall is configured to move from a first position to a second position, wherein, in the first portion, the bottom wall is tilted at a first angle relative to the top wall, and in the second position, the bottom wall is tilted at a second angle relative to the top wall.
[0027] In a twenty -third aspect (23), the etching fixture according to the twenty- second aspect (22) is made of at least one of polyethylene, polypropylene, polytetrafluoroethylene, or stainless steel.
[0028] In a twenty-fourth aspect (24), the glass substrate according to either the twenty-second aspect (22) or the twenty-third aspect (23) comprises a portion where both a first side and a second side of the glass-based substrate have a radius of curvature of greater than 0 meters and less than or equal to 10 meters.
[0029] In a twenty-fifth aspect (25), the bottom wall according to any one of aspects (22) - (24) is parallel to the top wall in the first position.
BRIEF DESCRIPTION OF THE DRA WINGS
[0030] The accompanying figures, which are incorporated herein, form part of the specification and illustrate aspects of the present disclosure. Together with the description, the figures further serve to explain the principles of and to enable a person skilled in the relevant art(s) to make and use the disclosed aspects. These figures are intended to be illustrative, not limiting. Although the disclosure is generally described in the context of these aspects, it should be understood that it is not intended to limit the scope of the disclosure to these particular aspects. In the drawings, like reference numbers indicate identical or functionally similar elements.
[0031] FIGS. 1A-1C illustrate methods and systems for single-side etching substrates according to aspects.
[0032] FIG. 2 A illustrates a fixture for etching a substrate.
[0033] FIG. 2B illustrates a planar substrate etched using the fixture illustrated in FIG.
2A.
[0034] FIG. 3 A illustrates the fixture illustrated in FIG. 2A with a curved glass-based substrate.
[0035] FIG. 3B illustrates a curved substrate etched using the fixture illustrated in FIG. 2A.
[0036] FIG. 4 illustrates an etching fixture assembly according to aspects.
[0037] FIG. 5 A illustrates a front view of the etching fixture assembly of FIG. 4. [0038] FIG. 5B illustrates a side view of the etching fixture assembly of FIG. 4.
[0039] FIG. 5C illustrates a top-down view of the etching fixture assembly of FIG. 4.
[0040] FIG. 6 illustrates an etching fixture assembly with a titled wall according to aspects.
[0041] FIG. 7 illustrates a substrate without fixture marks.
[0042] FIG. 8 illustrates a substrate with fixture marks.
[0043] FIG. 9 illustrates a substrate with fixture marks.
[0044] FIG. 10 is a flow chart illustrating methods according to aspects.
[0045] FIG. 11 illustrates a spacer according to aspects.
DETAILED DESCRIPTION
[0046] The following examples are illustrative, but not limiting, of the present disclosure. Other suitable modifications and adaptations of the variety of conditions and parameters normally encountered in the field, and which would be apparent to those skilled in the art, are within the spirit and scope of the disclosure.
[0047] Glass-based substrates are commonly used in consumer products, for example smart phones, tablets, portable media players, personal computers, and cameras. In some applications, it is desirable to etch (for example, etch to texturize or thin) only one side of a glass-based substrate. Existing systems and methods often use a post-polish process to achieve single-side etching, which can increase cost and complexity of the process. Some existing methods use a protective film on one side of the substrate and etch the other side of the substrate. But such protective films typically must be removed following etching, which increases process complexity and waste.
[0048] What is more, these existing systems can be less effective when single-side etching a curved glass-based substrate. And these existing systems etch only one piece of glassbased substrate at a time, which can increase process time and costs for etching multiple glassbased substrates. For example, some processes for etching planar glass-based substrates can cause etching marks on surfaces of curved glass-based substrates that make the marked areas unsuitable for an end product. Although some fixture marks can be removed by polishing, this increases the complexity and cost of the manufacturing. In some cases, these fixture marks cannot be removed by polishing.
[0049] Aspects of the present application are directed to methods and systems for single-side etching of a glass-based substrate, such as a curved glass-based substrate. In aspects, the single-side etching can comprise laminating two glass-based substrates such that only one side of each glass-based substrate is exposed, etching the laminated structure such that only the exposed sides are etched, and separating the glass-based substrates to form two single-side etched glass-based substrates.
[0050] As used herein, the term “glass-based” is meant to include any material made at least partially of glass, including glass and glass-ceramics. “Glass-ceramics” include materials produced through controlled crystallization of glass. One or more nucleating agents, for example, titanium oxide (TiO?), zirconium oxide (ZrO?), sodium oxide (Na2O), and phosphorus oxide (P2O5) may be added to a glass-ceramic composition to facilitate homogenous crystallization. In aspects, one or both glass-based substrates can exhibit an amorphous microstructure and can be substantially free of crystals or crystallites. In other words, the glass-based substrate(s) in these aspects exclude glass-ceramic materials. In other aspects, one or both glass-based substrates can be a glass-ceramic substrate.
[0051] In aspects, the glass-based substrate can be a curved glass-based substrate. As used herein, a “curved glass-based substrate” means a substrate comprising at least portion where both the first and second sides have a radius of curvature of greater than 0 meters. In aspects, the first and second sides can have a radius of curvature of greater than 0 meters and less than or equal to 10 meters. In aspects, the radius of curvature of the first and second sides can be greater than 0 meters and less than or equal to 10 meters, greater than or equal to about 50 mm to less than or equal to about 200 mm, greater than or equal to about 100 mm to less than or equal to about 150 mm, greater than or equal to about 1 meter to less than or equal to about 8 meters, greater than or equal to about 2 meters to less than or equal to about 5 meters, or within a range having any two of these values as endpoints. In aspects, a curved glass-based substrate (for example, substrate 110, substrate 120, or both) can comprise a first portion comprising first and second sides with a first radius of curvature and a second portion comprising first and second sides with a second radius of curvature that is greater than first radius of curvature.
[0052] FIGS. 1 A-1C illustrates methods of etching glass-based substrates according to aspects. As illustrated in FIG. 1A, first glass-based substrate 110 and second glass-based substrate 120 can be laminated to form laminated structure 100. In aspects, first glass-based substrate 110 comprises first side 112 and second side 114. In aspects, second side 114 is opposite first side 112. In aspects, first glass-based substrate 110 can be a curved glass-based substrate. In aspects, second glass-based substrate 120 comprises first side 122 and second side 124. In aspects, second side 124 is opposite first side 122. In aspects, second glass-based substrate 120 can be a curved glass-based substrate. In aspects, second side 114 of first glassbased substrate 110 can define a top surface of laminated structure 100. In aspects, second side 124 of second glass-based substrate 120 can define a bottom surface of laminated structure 100.
[0053] In aspects, first glass-based substrate 110 and second glass-based substrate 120 can be laminated using adhesive 130. In aspects, adhesive 130 can be a UV-curable adhesive. In such aspects, adhesive 130 can be cured by exposing adhesive 130 to UV light. Adhesive 130 can be applied to first side 112 of first substrate 110, to first side 122 of second substrate 120, or to both. In aspects, adhesive 130 can be applied to both first side 112 of first glassbased substrate 110 and first side 122 of second glass-based substrate 120. In aspects, adhesive 130 can be applied using, for example, a brush, a sprayer, a dispenser, a coating machine, or a combination therefore. After applying adhesive 130, first glass-based substrate 110 and second glass-based substrate 120 can be assembled with adhesive disposed between first side 112 and first side 122 to form laminate structure 100.
[0054] In aspects, an excess amount of adhesive 130 can be applied to ensure all areas of first side 112 and first side 122 are covered by adhesive 130. In aspects, adhesive 130 can be applied in an amount of greater than or equal to about 5 grams to less than or equal to about 20 grams, including subranges. For example, in aspects, adhesive 130 can be applied in an amount of greater than or equal to about 5 grams to less than or equal to about 20 grams, of greater than or equal to about 6 grams to less than or equal to about 18 grams, of greater than or equal to about 8 grams to less than or equal to about 16 grams, or of greater than or equal to about 10 grams to less than or equal to about 14 grams, or within a range having any two of these values as endpoints. In aspects, the adhesive 130 can be applied in an amount from about 10 grams to about 14 grams.
[0055] In aspects, after adhesive 130 is applied and glass-based substrates 110 and 120 are assembled, adhesive 130 can be cured. In aspects, adhesive 130 can be fully cured or spot cured using, for example, a UV light source. Spot curing can comprise fully or partially curing a targeted portion of adhesive 130 while leaving the remaining adhesive uncured. For example, in aspects, spot curing can target areas where leakage is most likely to occur (for example, at the peak of a curvature for a glass-based substrate, at an edge of the glass-based substrate, etc.). [0056] In aspects, the spot curing can be achieved by first curing, fully or partially, a first portion of adhesive 130 that is less than all of adhesive 130 applied to glass-based substrates 110 and 120. In aspects, the first portion of adhesive 130 can be proximate to a center of the first side 112 of the first glass-based substrate 110 and a center of the first side 122 of the second glass-based substrate 120. In such aspects, after the first portion of adhesive 130 is cured, the remaining uncured adhesive 130 can spread out from the first portion towards the edges of glass-based substrates 110 and 120. In aspects, after the first portion of adhesive 130 is cured, the uncured adhesive 130 proximate to edges of glass-based substrates 110 and 120 can be spot cured. In aspects, the first portion of adhesive 130 can be located at an area of the first glass-based substrate 110 and/or an area of the second glass-based substrate 120 having the smallest radius of curvature. In such aspects, after the first portion of adhesive 130 is cured, the remaining uncured adhesive 130 can spread out from the area having the smallest radius of curvature. In aspects, after the first portion of adhesive 130 is cured, the uncured adhesive 130 in other areas can be spot cured. In aspects, the first portion of adhesive 130 can be at a perimeter edge of first side 112 of the first glass-based substrate 110 and a perimeter edge of the first side 122 of the second glass-based substrate 120. In such aspects, after the edges are cured, the adhesive 130 between the first portion and the edges can be spot cured.
[0057] In aspects, the spot curing can comprise exposing the first portion and/or edges to a UV light source for about 1 second to about 10 seconds. Additionally or alternatively, in aspects, after spot curing portions of adhesive 130, laminated structure 100 can be exposed to a UV light source for about 3 minutes to about 4 minutes to fully cure all adhesive 130 between glass-based substrates 110 and 120. In aspects, during spot curing, glass-based substrates 110 and 120 can be rotated or titled to allow gravity to direct uncured adhesive flow to specific areas.
[0058] Although spot curing is discussed in terms of the glass-based substrate shapes shown in FIG. 1A, the spot curing can be done by curing different areas and in different sequences depending on the specific shape and curvature of glass-based substrates. For example, in aspects, the edges can be spot cured before a center area.
[0059] In aspects, adhesive 130 can be cured using a UV light source that emits light at an appropriate power level and at an appropriate wavelength for a particular adhesive. For example, adhesive 130 can be cured using a UV light source that delivers about 5 W/cm2 of power to the adhesive 130. As another example, adhesive 130 can be cured using a UV light source comprising one or more 362 nm wavelength-producing bulbs.
[0060] After adhesive 130 is fully cured, only second side 1 14 of first glass-based substrate 110 and second side 124 of second glass-based substrate 120 are exposed. These exposed sides of glass-based substrates 110 and 120 can be exposed to an etchant during an etching process. In aspects, the adhesive 130 creates a fluid-tight seal at the edges of glassbased substrates 110 and 120 such that first side 112 of first glass-based substrate 110 and first side 122 of second glass-based substrate 120 are not exposed to an etchant during an etching process.
[0061] As illustrated in FIG. 1A, in aspects, because of the curvature of first glassbased substrate 110 and second glass-based substrate 120, the lateral space between first glassbased substrate 110 and second glass-based substrate 120 filed with adhesive 130 can vary across the width of laminated structure 100. In aspects, adhesive 130 can have a first thickness, Ti, between a center of the first side 112 of the first glass-based substrate 110 and a center of the first side 122 of the second glass-based substrate 120, and a second thickness, T2, between an edge of the first glass-based substrate 110 and an edge of the second glass-based substrate 120. In aspects, as shown in FIG. 1A, first thickness Ti can be less than second thickness T2. In aspects, first thickness Ti can be greater than second thickness T2. In aspects, thickness Ti can range from greater than or equal to about 0.5 mm to less than or equal to about 0.8 mm. In aspects, thickness T2 can range from greater than or equal to about 0.7 mm to less than or equal to about 1.2 mm. In aspects, the ratio of first thickness Ti to second thickness T2 can range from about 2: 1 to about 1 :2. In aspects, the ratio of first thickness T 1 to second thickness T2 can be about 1 :2.
[0062] In other aspects, the lateral space between first glass-based substrate 110 and second glass-based substrate 120 filed with adhesive 130 can be consistent across the width of laminated structure 100. In such aspects, the adhesive 130 can have a constant thickness between the first side 112 of the first glass-based substrate 110 and the first side 122 of the second glass-based substrate 120.
[0063] In aspects, as illustrated in FIG. 11, a spacer 150 can be used between first glassbased substrate 110 and second glass-based substrate 120. In aspects, adhesive 130 can be filled into the spacer 150. In aspects, adhesive 130 can be injected into the spacer 150. In aspects spacer 150 can define a volume where adhesive 130 can be injected. In aspects, adhesive 130 can fill the volume defined by spacer 150. In aspects, the spacer 150 can be configured to prevent leakage of adhesive 130 before curing. In aspects, spacer 150 can form a seal between first side 112 of first glass-based substrate HO and first side 122 of second glass-based substrate 120. In aspects, spacer 150 can prevent adhesive 130 from leaking before curing.
[0064] In aspects, spacer 150 can comprise at least one of a UV-curable adhesive, a rubber, a polymer, metal, ceramic, paper, or combinations thereof. In aspects, spacer 150 can comprise polytetrafluoroethylene. In aspects, spacer 150 can be made of a material that does not leave particulates or marks on the surface of the substrate when in contact therewith. In aspects, spacer 150 can be made of a UV-curable adhesive. In aspects, spacer 150 can be made of adhesive 130.
[0065] In aspects, spacer 150 can comprise an inlet port 156 through which adhesive 130 can be injected prior to curing. In aspects, spacer 150 can define a gasket around the perimeter of glass-based substrate 110 and/or glass-based substrate 120, which when glassbased substrate 110 and glass-based substrate 120 are assembled, defines a volume between glass-based substrate 110 and glass-based substrate 120 where adhesive 130 can be injected. In aspects, spacer 150 can have an outlet port 158 that can be used to apply a vacuum to spacer 150 to draw adhesive 130 through spacer 150 as it is introduced into the inlet port 156.
[0066] In aspects, spacer 150 can be shaped to follow the contour of the glass-based substrates. For example, as illustrated in FIG. 11, spacer 150 can have a convex side 152 and a concave side 154. In aspects, the convex side 152 is shaped to follow the concave shape of first side 112 of first glass-based substrate 110, and the concave side 154 is shaped to follow the convex shape of first side 122 of second glass-based substrate 120.
[0067] In aspects, spacer 150 can be made by applying a UV-curable adhesive to a glass-based substrate 110 or 120 that is then partially or fully cured to form spacer 150. This can result in a spacer 150 that conforms to the shape of a glass-based substrate such that when glass-based substrates 110 and 120 are assembled, the spacer 150 can create a fluid tight seal at the edges of glass-based substrates 110 and 120.
[0068] In aspects, spacer 150 can have various shapes and sizes. In aspects, spacer 150 can form a strip around a perimeter of a glass-based substrate, which when assembled with a second glass-based substrate, forms a volume defined by the glass-based substrates and spacer 150. In such aspects, adhesive 130 can be filled or injected in the volume when adhesive 130 is applied to the glass-based substrates. In aspects, spacer 150 can comprise a spiral shape defining a flow path through which adhesive 130 can be injected when adhesive 130 is applied. In aspects, spacer 150 can comprise multiple separate components that together form spacer 150.
[0069] In aspects, the thickness of spacer 150 can be selected based on the geometry of spacer 150. In aspects, spacer 150 can have a maximum uncompressed thickness greater than or equal to about 0.1 mm to less than or equal to about 2 mm, or greater than or equal to about 0.5 mm to less than or equal to about 0.8 mm. In aspects, spacer 150 can be compressible. For example, in aspects, spacer 150 can compress to about 50% of its uncompressed thickness when assembled between first glass-based substrate 110 and second glass-based substrate 120. [0070] In aspects comprising spacer 150, spacer 150 can aid in defining a suitable volume between glass-based substrates 110 and 120 for filling with adhesive 130. In aspects, glass-based substrates 110 and 120 can be laminated without the use of spacer 150.
[0071] After adhesive 130 is cured, laminated structure 100 can be etched using one or more etchants. The etchant can comprise an acid and/or a base, for example, hydrofluoric acid, sodium hydroxide, potassium hydroxide, or a combination thereof. In aspects, the etchant can comprise an acid (e.g., hydrofluoric acid). In aspects, the etchant can comprise hydrofluoric acid at a concentration of greater than or equal to about 1 vol% to less than or equal to about 10 vol%. In aspects, the etchant can comprise a base (e.g., sodium hydroxide and/or potassium hydroxide). In aspects, the etchant can comprise sodium hydroxide at a concentration of greater than or equal to about 30 vol% to less than or equal to about 70 vol%. In aspects, the etchant can comprise potassium hydroxide at a concentration of about 30 vol% to about 70 vol%.
[0072] In aspects, laminated structure 100 can be etched in an etchant bath. In aspects, laminated stiucture 100 can be etched using spray etching. The etching can texturize and/or thin glass-based substrates 110 and 120.
[0073] In aspects, the etching can impart a surface texture on a surface of the first glassbased substrate 110 at the second side 114 of the first glass-based substrate 110. In such aspects, the surface texture can comprise an Ra surface roughness from greater than or equal to about 0.1 pm (microns) to less than or equal about 10 pm. In aspects, the surface texture can comprise an Ra surface roughness from greater than or equal to about 0.1 pm to less than or equal to about 10 pm, from greater than or equal to about 0.5 pm to less than or equal to about 8 pm, from greater than or equal to about 1 pm to less than or equal to about 5 pm, from greater than or equal to about 2 pm to less than or equal to about 4 pm, or within a range having any two of these values as endpoints. In aspects, the surface texture can comprise an Ra roughness from about 0.1 pm to about 2 pm. In aspects, the texture can be an antiglare texture.
[0074] In aspects, the etching can impart a surface texture on a surface of the second glass-based substrate at the second side 124 of the second glass-based substrate. In such aspects, the surface texture can comprise an Ra surface roughness from greater than or equal to about 0.1 pm (microns) to less than or equal about 10 pm. In aspects, the surface texture can comprise an Ra surface roughness from greater than or equal to about 0.1 pm to less than or equal to about 10 pm, from greater than or equal to about 0.5 pm to less than or equal to about 8 pm, from greater than or equal to about 1 pm to less than or equal to about 5 pm, from greater than or equal to about 2 pm to less than or equal to about 4 pm, or within a range having any two of these values as endpoints. In aspects, the surface texture can comprise a roughness from about 0.1 pm to about 2 pm. In aspects, the texture can be an antiglare texture.
[0075] In aspects, the etching can thin glass-based substrate 110 and/or glass-based substrate 120 by removing a surface layer at the second side 114 of first glass-based substrate 110, at the second side 124 of the second glass-based substrate 120, or both. In aspects, the etching can thin the glass-based substrate(s) 110/120 to remove a surface layer having a thickness from greater than or equal to about 50 pm to less or equal to about 1000 pm. In aspects, the surface layer removed can have a thickness from greater than or equal to about 50 pm to less than or equal to about 1000 pm, from greater than or equal to about 100 pm to less than or equal to about 700 pm, from greater than or equal to about 200 pm to less than or equal to about 500 pm, from greater than or equal to about 300 pm to less than or equal to about 400 pm, or within a range having any two of these values as endpoints.
[0076] In aspects, the etching can simultaneously etch second side 114 of first glassbased substrate 110 and second side 124 of second glass-based substrate 120. In such aspects, second side 114 and second side 124 can be simultaneously textured, thinned, or both.
[0077] In aspects, the etching process can comprise placing laminated structure 100 in an etching fixture. In such aspects, laminated structure 100 is exposed to the etchant while disposed within the etching fixture. In aspects, laminated structure 100 can be placed in etching fixture 400 discussed below and shown in FIGS. 4-6.
[0078] In aspects, the etching process can comprise agitation of fixture 400 to minimize contact between laminated structure 100 and the etching fixture (for example, etching fixture 400) during etching. In aspects, the etching process can alternatively or additionally comprise recirculation of etchant to minimize contact between laminated structure 100 and the etching fixture (for example, etching fixture 400) during etching. In aspects, the etching process does not include agitation.
[0079] In aspects, the etching process can comprise agitation, and the agitation speed can be less than or equal to about 300 mm/s (millimeters per second). For example, in aspects, the agitation speed can be from greater than or equal to about 1 mm/s to less than or equal to about 300 mm/s, from greater than or equal to about 5 mm/s to less than or equal to about 275 mm/s, from greater than or equal to about 10 mm/s to less than or equal to about 250 mm/s, from greater than or equal to about 30 mm/s to less than or equal to about 225 mm/s, from greater than or equal to about 50 mm/s to less than or equal to about 200 mm/s, from greater than or equal to about 75 mm/s to less than or equal to about 150 mm/s, or within a range having any two of these values as endpoints. In aspects, the agitation speed can be less than or equal to about 250 mm/s. As used herein, the term “agitation speed” means the speed at which a fixture (for example, fixture 400) moves up and down. As a non-limiting example, if the agitation speed is 50 mm/s, the fixture moves 50 millimeters up or down in one second.
[0080] In aspects, the etching process comprises agitation, and the up-down agitation distance for the fixture can be less than or equal to about 100 mm. For example, in aspects, the up-down agitation distance can be from greater than or equal to about 1 mm to less than or equal to about 100 mm, from greater than or equal to about 5 mm to less than or equal to about 100 mm, from greater than or equal to about 10 mm to less than or equal to about 100 mm, from greater than or equal to about 25 mm to less than or equal to about 100 mm, from greater than or equal to about 40 mm to less than or equal to about 100 mm, or within a range having any two of these values as endpoints.
[0081] In aspects, the agitation can comprise agitating the fixture using an orbital shake plate with a shake distance greater than 0 mm to less than or equal to about 200 mm. In aspects, the orbital shake plate can have a shake distance from greater than or equal to about 1 mm to less than or equal to about 200 mm, from greater than or equal to about 5 mm to less than or equal to about 200 mm, from greater than or equal to about 25 mm to less than or equal to about 200 mm, from greater than or equal to about 50 mm to less than or equal to about 200 mm, from greater than or equal to about 75 mm to less than or equal to about 200 mm, or within a range having any two of these values as endpoints. As used herein, the term “shake distance” means the distance from the center of the orbital shake plate to the maximum shake location.
[0082] In aspects, the orbital shake plate can shake at a rate of about 0 rpm to less than or equal to about 500 rpm. In aspects, the orbital shake plate can shake at a rate from greater than or equal to about 1 rpm to less than or equal to about 500 rpm, from greater than or equal to about 50 rpm to less than or equal to about 500 rpm, from greater than or equal to about 100 rpm to less than or equal to about 500 rpm, from greater than or equal to about 200 rpm to less than or equal to about 500 rpm, or within a range having any two of these values as endpoints. [0083] In aspects, the etching process can comprise recirculation of the etchant at a rate of greater than 0 m3/min (meters cubed per minute) to less than or equal to about 10 m3/min. In aspects, the recirculation rate can be from greater than or equal to about 1 m3/min to less than or equal to about 7 m3/min, from greater than or equal to about 2 m3/min to less than or equal to about 5 m3/min, from greater than or equal to about 3 m3/min to less than or equal to about 4 m3/min, or within a range having any two of these values as endpoints.
[0084] After etching, first glass-based substrate 110 and second glass-based substrate 120 can be separated, as illustrated in FIG. IB. In aspects, the separation can compri se exposing laminated structure 100 to a UV light source to weaken the adhesive 130. In aspects, the UV light source used to separate laminated structure 100 can be the same UV light source used to cure adhesive 130. In aspects, the UV light source used to separate laminated structure 100 can be different than the UV light source used to cure adhesive 130.
[0085] In aspects, the separation can comprise exposing laminate structure 100 to water. In such aspects, laminated structure 100 can be exposed to water having a temperature of about 85 °C to about 100 °C (for example, about 85 °C to about 98 °C). In aspects, exposing laminate structure 100 to water can comprise submerging laminate structure 100 in the water. [0086] In aspects, the separation can comprise exposing laminated structure 100 to a UV light source and exposing laminated structure 100 to water. In such aspects, after exposing laminated structure 100 to a UV light source, laminated structure 100 can be exposed to water having a temperature of about 85 °C to about 100 °C (for example, about 85 °C to about 98 °C). In aspects, laminated structure 100 can be submerged in water for about 2 minutes to about 10 minutes (for example, about 3 minutes to about 8 minutes).
[0087] After exposing laminated structure 100 to a UV light source, water, or both, first glass-based substrate 110 and second glass-based substrate 120 can be separated by applying a pulling force to one or both of first glass-based substrate 110 and second glass-based substrate 120.
[0088] After separation, any remaining adhesive 130 on first side 112 or first side 122 can be removed, and glass-based substrates 110 and 120 can be cleaned. In aspects, glass-based substrates 110 and 120 can be used in the manufacture of a consumer product (e.g., a displaydevice, etc.) after separation and cleaning. In such aspects, glass-based substrates 110 and 120 can be further processed as needed for manufacture of the consumer product.
[0089] In aspects comprising spacer 150, spacer 150 can also be removed after separating glass-based substrates 110 and 120.
[0090] In aspects, after separating glass-based substrates 110 and 120, glass-based substrates 110 and 120 can be re-laminated such that the un-etched sides (for example, sides 112 and 122) are exposed. For example, as illustrated in FIG. 1C, glass-based substrates 1 10 and 120 can be re-laminated to form second laminated structure 102. In aspects, laminated structure 102 comprises adhesive 140 disposed between etched surfaces of glass-based substrates 110 and 120 (e.g., second side 114 and second side 124). In aspects, adhesive 140 can be the same adhesive type as adhesive 130. In aspects, adhesive 140 can be a different adhesive type than adhesive 130. In aspects, adhesive 140 can be a UV-curable adhesive. In aspects, adhesive 140 can applied to glass-based substrates 110 and 120 as described for adhesive 130, except that adhesive 140 is applied to second side 1 14 of first glass-based substrate 110 and/or to second side 124 of second glass-based substrate 120. In aspects, adhesive 140 can be cured as described above for adhesive 130. In aspects, laminated structure 102 can be used in the manufacture a consumer product (e.g., a display device). In such aspects, laminated structure 102 can be further processed as needed for manufacture of the consumer product.
[0091] Some etching fixtures for etching of glass-based substrates (for example, etching fixture 200 shown in FIGS. 2A and 3A) can comprise a first plate 202 and a second plate 204 with recesses 206 and projections 208 configured to hold glass-based substrates during etching. In some cases, etching fixture 200 can present challenges with single-side etching. For example, the structure of fixture may require that a glass-based substrate include a protective film on one side of the substrate to restrict etching to one side. FIG. 2A illustrates a planar glass-based substrate 300 in etching fixture 200. For a planar substrate, such as planar glass-based substrate 300, edges of the glass can be in contact with fixture 200. And it is possible that neither a first side 302 nor a second side 304 of substrate 300 is in contact with etching fixture 200 during etching. This can produce a substrate with a first side 302 and a second side 304 that are free of any fixture marks resulting from contact between fixture 200 and first side 302 and/or second side 304 substrate 300 during etching. For example, FIG. 2B illustrates planar glass-based substrate 300 after etching, and as shown in FIG. 2B, side 302 of planar glass-based substrate 300 contains no fixture marks.
[0092] Although etching fixture 200 may be capable of etching a planar glass-based substrate with limited or no fixture marks, etching curved glass-based substrates, such as glassbased substrates 110 and 120 or laminated structure 100 can be challenging. For example, as shown in FIG. 3 A, side 312 of a curved glass-based substrate 310 can contact protrusions 208 during etching. This can create significant fixture marks, for example marks 316 shown in FIG. 3B at points of contact between side 312 and protrusions 208. For example, fixture marks 316 created by etching curved glass-based substrate 310 in fixture 200 can have a height of 5 pm or greater. In some cases, the resulting fixture marks can be too large to efficiently remove by polishing without disrupting desired surface characteristics created during etching. Additionally, as shown for example, in FIG. 3B, marks 316 can be located away from the edges of curved glass-based substrate 310. Accordingly, although the area that includes the marks 316 could be cut away, this would require the use of an additional cutting step and discarding a significant portion of the etched curved glass-based substrate 310. As discussed herein, a “fixture mark” is a bump or ridge on a surface of a glass-based substrate that has a peak height of at least 1 pm and is caused by contact with an etching fixture.
[0093] Additionally, due to the curvature of glass-based substrate 310, glass-based substrate 310 may be loosely secured in etching fixture 200 such that glass-based substrate 310 is susceptible to slipping out of etching fixture 200 during etching. For example, due to the loose fit of glass-based substrate 310 in etching fixture 200, during agitation, glass-based substrate 310 can slip out of etching fixture 200.
[0094] In aspects, substrates (for example, glass-based substrates 110 and 120 or laminated structure 100) can be etched using etching fixture 400. Etching fixture 400 can be designed to improve surface quality of etched curved substrates by minimizing or eliminating scratches and fixture marks created during etching. This can be especially helpful for softer glass-based substrates that are sensitive to touch and susceptible to scratches and marks.
[0095] As illustrated in FIGS. 4-6, etching fixture 400 comprises walls 410 that together define a volume within which a glass-based substrate (for example, substrate 110, substrate 120, or laminated structure 100) can be disposed for etching. In aspects, walls 410 can define a top wall 414, a bottom wall 416, and sides of etching fixture 400. In aspects, one or more of walls 410 can comprise a mesh 401. In aspects, two or more walls 410 can comprise a mesh 401. In aspects, all of walls 410 can comprise a mesh 401.
[0096] In aspects, one or more walls 410 can be defined, in whole or in part, by a mesh 401. In aspects, two or more walls 410 can be defined, in whole or in part, by a mesh 401. In aspects, all of walls 410 can be defined, in whole or in part, by a mesh 401. In aspects, walls 410 can define the volume within which a glass-based substrate can be disposed for etching. In aspects, as illustrated in FIG. 4-6, walls 410 can define top wall 414, bottom wall 416, and sides that together define the volume.
[0097] In aspects, the mesh 401 can comprise openings 404 defined by strands 402 of material. As shown in FIGS. 4-6, strands 402 can form a grid that defines the mesh 401. Strands 402 can be made of a material that is resistant to etching. In aspects, strands 402 can be made of at least one of polyethylene, polypropylene, polytetrafluoroethylene, or stainless steel.
[0098] Openings 404 can have various shapes and sizes. In aspects, openings 404 can be circles or rectangles. In aspects, as shown in FIG. 5A, openings 404 can be the same shape and size. For example, as shown in FIG. 5 A, openings 404 can be a square having dimensions Di x Di. In aspects, as shown in FIG. 5B, openings 404 can be different shapes and sizes. In aspects, as shown in FIGS. 5B and 6, openings 404 can be rectangles. In aspects, as shown in FIG. 5B, openings 404 can have different sizes, with some openings 404 being be smaller than others. For example, some openings 404 can have dimensions D2 x D3 or D2 x D4. In aspects, D3 is greater than D4. In aspects, D2 is greater than each of D3 and D4.
[0099] Each of Di, D2, D3, and D4, can be from greater than or equal to about 1 mm to less than or equal to about 40 mm. In aspects, each of Di, D2, D3, and D4, can be from greater than or equal to about 1 mm to less than or equal to about 40 mm, from greater than or equal to about 5 mm to less than or equal to about 30 mm, from less than or equal to about 10 mm to less than or equal to about 20 mm, or within a range having any two of these values as endpoints.
[0100] In aspects, openings 404 of the mesh 401 can have a size defined by an effective diameter of the openings 404. As used herein, the term “effective diameter” is utilized to describe the size of a hole or opening, but this term should not be interpreted as requiring a hole or opening to have a circular diameter or shape. Instead, holes or openings may have noncircular shapes, and in such aspects, the term “effective diameter” is intended to refer to the maximum cross-sectional dimension of the shape. For example, the “effective diameter” of a hole or opening having an elliptical cross-sectional shape would be the length of the major axis of the elliptical shape. For a hole or opening having an effective diameter that varies along the depth of the hole or opening, the effective diameter is the largest effective diameter.
[0101] In aspects, the effective diameter of openings 404 can be from greater than or equal to about 1 mm to less than or equal to about 40 mm. In aspects, the effective diameter can be from greater than or equal to about 1 mm to less than or equal to about 40 mm, from greater than or equal to about 5 mm to less than or equal to about 30 mm, from greater than or equal to about 10 mm to less than or equal to about 20 mm, or within a range having any two of these values as endpoints.
[0102] While etching fixture 400 is shown throughout the figures as a cuboid, etching fixture 400 can have various shapes, such as a cylinder, conic section, or a cube.
[0103] In aspects, etching a substrate (for example, glass-based substrates 110 or 120, or laminated structure 100) can comprise placing the substrate in etching fixture 400. In aspects, etching can comprise exposing one or more substrates disposed inside etching fixture 400 to an etchant. In aspects, etching can comprise placing etching fixture 400, with one or more substrates disposed inside etching fixture 400, in the etchant bath.
[0104] In aspects, etching with etching fixture 400 can comprise agitation and/or recirculation, as discussed herein. In aspects, agitation can be used during etching, and the agitation speed can be adjusted such that the contact been the substrate and any walls of etching fixture 400 can be reduced or eliminated. For example, as illustrated in FIGS. 5 A and 5B, laminated structure 100 can be effectively suspended within etching fixture 400 during etching by the agitation and/or recirculation. At the appropriate agitation speed, laminated structure 100 can be etched without causing any significant fixture marks on a surface of laminated structure 100. FIG. 7 illustrates laminated structure 100 without any etching marks. By correctly controlling the agitation and/or recirculation, fixture marks, for example fixture marks 116 illustrated in FIG. 8 can be reduced or eliminated.
[0105] In aspects, substrates etched using etching fixture 400 have minimal or no fixture marks. In aspects, substrates (for example, glass-based substrates 110 and 120, or laminated structure 100) etched using etching fixture 400 have no fixture marks. In such aspects, the etched substrate can be used for manufacture of a consumer product without requiring cutting or removing a significant portion of the substrate.
[0106] In aspects, etching fixture 400 can comprise a floor 420 configured to move between a first position and a second position. In aspects, in the first position, floor 420 can be tilted at a first angle relative to top wall 414 of fixture 400. In aspects, the first angle can be 0 degrees (i.e., floor 420 is parallel to top wall 414). In aspects, in the second position, floor 420 can be tilted at a second angle (A) relative to top wall 414. The second angle (A) can be any angle between about 1 degree and about 75 degrees relative to top wall 414. In aspects, second angle (A) can be from greater than or equal to about 1 degree to less than or equal to about 75 degrees relative to top wall 414. In aspects, second angle (A) can be from greater than or equal to about 5 degrees to less than or equal to about 60 degrees, from greater than or equal to about 10 degrees to less than or equal to about 45 degrees, from greater than or equal to about 15 degrees to less than or equal to about 30 degrees, or within a range having any two of these values as endpoints. In aspects, floor 420 can be bottom wall 416 of etching fixture 400.
[0107] In aspects, floor 420 can be moved from the first position to the second position manually. In aspects, fixture 400 can comprise a mechanical mechanism configured to move floor 420 from the first position to the second position.
[0108] A tilted floor 420 as described herein can help limit fixture marks to a specific or targeted area of a substrate etched within etching fixture 400, leaving the remainder of the substrate without fixture marks. For example, FIG. 9 illustrates fixture marks 116 that can result from etching while floor 420 is tilted at the second angle. When floor 420 is tilted to the second angle, as shown for example in FIG. 6, only a small portion of laminated structure 100 may contact etching fixture 400 during etching. In aspects, floor 420 can be titled to the second angle as discussed above, and agitation and/or recirculation can be used to help position the substrate within etching fixture 400 during etching. [0109] In aspects, etching fixture 400 can be used to simultaneously etch two or more substrates (for example two or more glass-based substrates 110 and 120, or two or more laminated structures 100). In such aspects, numerous glass-based substrates 110/120 or laminated structures 100 can be placed in etching fixture 400 for simultaneous etching.
[0110] Etching fixture 400 can be used for either single-side etching discussed herein, or for double-sided etching. For example, one or more laminated structures 100 can be placed within etching fixture 400 for single-side etching discussed related to FIGS. 1 A-1C. In aspects, one or more substrates (e.g., glass-based substrates 110 and 120) can comprise a protective film on one side, and can be etched in etching fixture 400 for single-side etching. In aspects, one or more substrates (e.g., glass-based substrates 110 and 120) without protective film can be etched in etching fixture 400 for double-side etching.
[OHl] FIG. 10 illustrates a method 1000 of etching substrates (e.g., glass-based substrates 110 and 120) according to aspects. In aspects, at step 1010, an adhesive can be applied to a first side of a first substrate. In aspects, step 1010 comprises applying adhesive 130 to first side 112 of first glass-based substrate 110. In aspects, at step 1020, an adhesive can be applied to a first side of a second substrate. In aspects, step 1020 comprises applying adhesive 130 to first side 122 of second glass-based substrate 120. In aspects, at step 1030, the first and second substrates are layered with the adhesive between the first and second substrates. In aspects, step 1030 comprises layering first glass-based substrate 110 and second glass-based substrate 120 such that adhesive 130 is between first side 112 and first side 122. In aspects, step 1020 is optional and adhesive is applied to only one surface before layering in step 1030. For example, in aspects, first glass-based substrate 110, second glass-based substrate 120, and adhesive 130 can be layered at step 1030 immediately after adhesive is applied to a first side of a first substrate at step 1010. In aspects including spacer 150, spacer 150 can be applied in step 1010 and/or step 1020.
[0112] In aspects, at step 1040, the adhesive 130 is cured to form a laminated structure 100. In aspects, step 1040 comprises curing adhesive 130 using a spot curing method as discussed herein. In aspects, at step 1050, the exposed sides of the laminated structure are etched to texturize or thin the two laminated substrates. In aspects, step 1050 comprises etching second side 114 of first glass-based substrate 110 and second side 124 of second glass-based substrate 120 as discussed herein. In aspects, at step 1060, the first and second substrates 110 and 120 can be separated. In aspects, step 1060 can comprise exposing the adhesive 130 to a UV light source and/or water as described herein. [0113] In aspects, at step 1070, the substrates can be re-laminated such that the unetched surfaces are exposed. In aspects, step 1070 can comprise applying adhesive 140 to one or more of second side 114 of first glass-based substrate 110 and second side 124 of second glass-based substrate 120, layering first glass-based substrate 110 and second glass-based substrate 120 with adhesive 140 disposed between, and curing adhesive 140 to form laminated structure 102.
[0114] While various aspects have been described herein, they have been presented by way of example, and not limitation. It should be apparent that adaptations and modifications are intended to be within the meaning and range of equivalents of the disclosed aspects, based on the teaching and guidance presented herein. It therefore will be apparent to one skilled in the art that various changes in form and detail can be made to the aspects disclosed herein without departing from the spirit and scope of the present disclosure. The elements of aspects presented herein are not necessarily mutually exclusive, but may be interchanged to meet various situations as would be appreciated by one of skill in the art.
[0115] Aspects of the present disclosure are described in detail herein with reference to aspects thereof as illustrated in the accompanying drawings, in which like reference numerals are used to indicate identical or functionally similar elements. References to “aspects” or “an aspect” indicate that the aspect described may include a particular feature, structure, or characteristic, but every aspect may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same aspect. Further, when a particular feature, structure, or characteristic is described in connection with an aspect, it is submitted that it is within the knowledge of one skilled in the art to affect such feature, structure, or characteristic in connection with other aspects whether or not explicitly described. [0116] The examples are illustrative, but not limiting, of the present disclosure. Other suitable modifications and adaptations of the variety of conditions and parameters normally encountered in the field, and which would be apparent to those skilled in the art, are within the spirit and scope of the disclosure.
[0117] The indefinite articles “a” and “an” to describe an element or component means that one or more than one of these elements or components is present. Although these articles are conventionally employed to signify that the modified noun is a singular noun, as used herein the articles “a” and “an” also include the plural, unless otherwise stated in specific instances. Similarly, the definite article “the,” as used herein, also signifies that the modified noun may be singular or plural, again unless otherwise stated in specific instances. [0118] Directional terms as used herein - for example up, down, right, left, front, back, top, bottom, inward, outward — are made only with reference to the figures as drawn and are not intended to imply absolute orientation.
[0119] As used in the claims, “comprising” is an open-ended transitional phrase. A list of elements following the transitional phrase “comprising” is a non-exclusive list, such that elements in addition to those specifically recited in the list may also be present. As used in the claims, “consisting essentially of’ or “composed essentially of’ limits the composition of a material to the specified materials and those that do not materially affect the basic and novel character! stic(s) of the material. As used in the claims, “consisting of’ or “composed entirely of’ limits the composition of a material to the specified materials and excludes any material not specified.
[0120] Where a range of numerical values is recited herein, comprising upper and lower values, unless otherwise stated in specific circumstances, the range is intended to include the endpoints thereof, and all integers and fractions within the range. It is not intended that the scope of the claims be limited to the specific values recited when defining a range. Further, when an amount, concentration, or other value or parameter is given as a range, one or more preferred ranges or a list of upper preferable values and lower preferable values, this is to be understood as specifically disclosing all ranges formed from any pair of any upper range limit or preferred value and any lower range limit or preferred value, regardless of whether such pairs are separately disclosed. Finally, when the term “about” is used in describing a value or an end-point of a range, the disclosure should be understood to include the specific value or end-point referred to. Whether or not a numerical value or end-point of a range recites “about,” the numerical value or end-point of a range is intended to include two aspects: one modified by “about,” and one not modified by “about.”
[0121] As used herein, the term “about” refers to a value that is within ± 5% of the value stated. For example, about 100 mm can include any number between 95 mm and 105 mm. That said, if a percentage is listed and the value of that percentage cannot go above 100%, for example 100 wt% or 99 wt%, “about” does not modify the percentage to include values over 100%.
[0122] It is to be understood that the phraseology or terminology used herein is for the purpose of description and not of limitation. The breadth and scope of the present disclosure should not be limited by any of the above-described exemplary aspects, but should be defined in accordance with the following claims and their equivalents.

Claims

WHAT IS CLAIMED IS:
1. A method, comprising: applying an adhesive to a first side of a first glass-based substrate, the first glassbased substrate comprising a second side opposite the first side; coupling the first glass-based substrate to a second glass-based substrate at an interface between the first side of the first glass-based substrate and a first side of the second glass-based substrate to form a laminated structure comprising the first glass-based substrate, the second glass-based substrate, and the adhesive, the second glass-based substrate comprising a second side opposite the first side of the second glass-based substrate; after coupling the first glass-based substrate to the second glass-based substrate, etching the second side of the first glass-based substrate and the second side of the second glass-based substrate with an etchant; and separating the first glass-based substrate and the second glass-based substrate after the etching.
2. The method of claim 1, wherein the etching comprises simultaneous etching of the second side of the first glass-based substrate and the second side of the second glass-based substrate.
3. The method of claim 1, wherein the first glass-based substrate and the second glassbased substrate are both curved glass-based substrates comprising a portion where both the first and second sides have a radius of curvature of greater than 0 meters and less than or equal to 10 meters.
4. The method of claim 1, further comprising: applying an adhesive to at least one of the second side of the first glass-based substrate or the second side of the second glass-based substrate after separating the first and second glass-based substrate; coupling the first glass-based substrate to the second glass-based substrate at an interface between the second side of the first glass-based substrate and the second side of second glass-based substrate to form a second laminated structure.
5. The method of any claim 1, wherein coupling the first glass-based substrate to a second glass-based substrate comprises: curing a first portion of the adhesive, wherein the first portion is less than all of the adhesive; and curing a second portion of the adhesive after curing the first portion.
6. The method of claim 5, wherein the first portion of the adhesive is located at a center of the first side of the first glass-based substrate and a center of the first side of the second glass-based substrate.
7. The method of claim 5, wherein the adhesive is a UV-curable adhesive, and wherein the curing comprises exposing the adhesive to UV light.
8. The method of any one of claims 1 to 7, wherein the etchant comprises hydrofluoric acid, sodium hydroxide, potassium hydroxide, or a combination thereof.
9. The method of any one of claims 1 to 7, wherein the etching removes a surface layer of the first glass-based substrate at the second side of the first glass-based substrate, the surface layer comprising a thickness of greater than or equal to about 100 pm.
10. The method of any one of claims 1 to 7, wherein the etching imparts a surface texture on a surface of the first glass-based substrate at the second side of the first glass-based substrate, the surface texture comprising an Ra surface roughness of greater than or equal to about 0.1 pm to less than or equal to about 2 pm.
11. The method of any one of claims 1 to 7, wherein the etching comprises: exposing the second side of the first glass-based substrate and the second side of the second glass-based substrate to an etchant by placing the laminated structure in an etchant bath.
12. The method of any one of claims 1 to 7, wherein the etching comprises: placing the laminated structure in an etching fixture, the etching fixture comprising: a top wall, a bottom wall, and side walls; wherein the top wall, the bottom wall, and the side walls comprise a mesh comprising holes comprising an effective diameter of greater than or equal to about 1 mm to less than or equal to about 40 mm.
13. The method of claim 12, wherein the etching fixture is made of at least one of polyethylene, polypropylene, polytetrafluoroethylene, or stainless steel.
14. The method of claim 12, wherein the etching comprises: agitating the etching fixture at a speed of greater than or equal to about 10 mm/s to less than or equal to about 250 mm/s.
15. The method of any one of claims 1 to 7, wherein separating the first glass-based substrate and the second glass-based substrate comprises: exposing the adhesive to UV light and submerging the laminated structure in water having a temperature of greater than or equal to about 90 °C; and applying a pulling force in opposing directions to separate the first glass-based substrate and the second glass-based substrate.
16. The method of any one of claims 1 to 7, wherein the first side of the first glass-based substrate comprises a concave surface and the second side of the first glass-based substrate comprises a convex surface, and wherein the first side of the second glass-based substrate comprises a concave surface and the second side of the second glass-based substrate comprises a convex surface.
17. A method, comprising: layering a first glass-based substrate, a second glass-based substrate, and a spacer, wherein the first glass-based substrate comprises a first side and a second side opposite the first side, wherein the second glass-based substrate comprises a first side and a second side opposite the first side, and wherein the spacer is disposed between the first side of the first glass-based substrate and the first side of the second glass-based substrate; forming a laminated structure by filling an adhesive into a volume defined by the spacer, the first glass-based substrate, and the second glass-based substrate to couple the first glass-based substrate, the spacer, and the second glass-based substrate; after forming the laminated structure, etching the second side of the first glass-based substrate and the second side of the second glass-based substrate with an etchant; and separating the first glass-based substrate, the second glass-based substrate, and the spacer after the etching.
18. The method of claim 17, wherein the first glass-based substrate and the second glassbased substrate are both curved glass-based substrates comprising a portion where both the first and second sides have a radius of curvature of greater than 0 meters and less than or equal to 10 meters.
19. The method of claim 17, wherein forming the laminated structure comprises injecting the adhesive into the volume defined by the spacer, the first glass-based substrate, and the second glass-based substrate.
20. The method of any one of claims 17 to 19, further comprising: curing a first portion of the adhesive, wherein the first portion is less than all of the adhesive; and curing a second portion of the adhesive after curing the first portion.
21. The method of any one of claims 17 to 19, further comprising: applying, after the separating, an adhesive to at least one of the second side of the first glass-based substrate or the second side of the second glass-based substrate; coupling the first glass-based substrate to the second glass-based substrate at an interface between the second side of the first glass-based substrate and the second side of the second glass-based substrate to form a second laminated structure.
22. An etching fixture assembly, the etching fixture assembly comprising: an etching fixture comprising a volume defined by a top wall, a bottom wall, and side walls; and a glass-based substrate disposed in the volume, wherein the top wall, the bottom wall, and the side walls comprise a mesh comprising holes comprising an effective diameter of greater than or equal to about 1 mm to less than or equal to about 40 mm, and wherein the bottom wall is configured to move from a first position to a second position, wherein, in the first portion, the bottom wall is tilted at a first angle relative to the top wall, and in the second position, the bottom wall is tilted at a second angle relative to the top wall.
23. The etching fixture assembly of claim 22, wherein the etching fixture is made of at least one of polyethylene, polypropylene, polytetrafluoroethylene, or stainless steel.
24. The etching fixture assembly of claim 22, wherein the glass-based substrate comprises a portion where both a first side and a second side of the glass-based substrate have a radius of curvature of greater than 0 meters and less than or equal to 10 meters.
25. The etching fixture assembly of any one of claims 22 to 24, wherein the bottom wall is parallel to the top wall in the first position.
PCT/US2023/084158 2022-12-22 2023-12-15 Methods and systems for single-side etching glass-based substrates WO2024137355A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202263434620P 2022-12-22 2022-12-22
US63/434,620 2022-12-22

Publications (1)

Publication Number Publication Date
WO2024137355A1 true WO2024137355A1 (en) 2024-06-27

Family

ID=91589889

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2023/084158 WO2024137355A1 (en) 2022-12-22 2023-12-15 Methods and systems for single-side etching glass-based substrates

Country Status (1)

Country Link
WO (1) WO2024137355A1 (en)

Similar Documents

Publication Publication Date Title
AU2011212982B2 (en) Enhanced chemical strengthening glass of covers for portable electronic devices
EP2755926B1 (en) Cover glass for electronic devices
KR20130135842A (en) Method of strengthening edge of glass article
JP2018088546A (en) Concave nodule sponge brush
WO2011034898A1 (en) Glass and display having anti-glare properties
CN112390536A (en) Ultrathin glass cover plate, ultrathin strengthened glass cover plate and preparation method thereof
CN110461606B (en) Method for processing substrate
WO2016065802A1 (en) Method for attaching first panel and second panel and display device
WO2024137355A1 (en) Methods and systems for single-side etching glass-based substrates
TW201414686A (en) Method for manufacturing glass substrate having arched surface
KR101543832B1 (en) Glass substrate and glass substrate production method
JP2022502246A (en) Equipment and methods for processing substrates
TW201741128A (en) Unitary optical film assembly
TW201544468A (en) Abrasive jet forming laminated glass structures
TWI378084B (en) Method for flattening glass substrate
JP2010161238A (en) Fluororesin coating plate and suction stage
KR101795831B1 (en) Conductive Film and Method of Preparing the Same
JP7191320B2 (en) cover glass
US11655178B2 (en) Methods and apparatus for manufacturing a glass-based article
KR20230084536A (en) How to form a foldable device
TW201420724A (en) Foam etchant and methods for etching glass
US20230064818A1 (en) Methods for etching glass-based substrates
TWM494962U (en) Cover plate
KR101473174B1 (en) Method for manufacturing liquid crystal display protection film
TWI461379B (en) Method for processing glass