WO2024131464A1 - 一种设备移动的方法、装置、设备及存储介质 - Google Patents

一种设备移动的方法、装置、设备及存储介质 Download PDF

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Publication number
WO2024131464A1
WO2024131464A1 PCT/CN2023/134562 CN2023134562W WO2024131464A1 WO 2024131464 A1 WO2024131464 A1 WO 2024131464A1 CN 2023134562 W CN2023134562 W CN 2023134562W WO 2024131464 A1 WO2024131464 A1 WO 2024131464A1
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Prior art keywords
cutting tool
speed
height
stage
moving
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PCT/CN2023/134562
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English (en)
French (fr)
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陈阳
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苏州镁伽科技有限公司
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Publication of WO2024131464A1 publication Critical patent/WO2024131464A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor

Definitions

  • the present application relates to the field of wafer cutting technology, and in particular to a method, device, equipment and storage medium for moving equipment.
  • a wafer cutting device is generally composed of a cutting tool and a stage, wherein the cutting tool is placed above the stage. Before wafer cutting, the cutting tool needs to be moved down until it contacts the stage, so the distance between the cutting tool and the stage needs to be measured.
  • the preparation work before wafer cutting is mainly divided into two stages.
  • the blade moves down quickly for the first distance; in the second stage, the blade moves down slowly until it contacts the table.
  • the existing equipment movement method mainly adopts the idea of "measure once, use forever", that is, the distance between the cutting tool and the stage is measured for the first time, and the result of this measurement is used all the time. Since the cutting tool will produce a certain amount of loss in the process of cutting the wafer, and the existing measurement technology does not take into account the loss of the cutting tool during the cutting process, it will cause the problem of difficulty in setting the first distance. If the first distance is set too small, it will lead to low wafer cutting efficiency; if the first distance is set too large, there will not be enough distance for the blade to slowly descend, resulting in damage to the blade or the table.
  • the present application provides a method, apparatus, device and storage medium for moving a device to improve the efficiency of moving the device.
  • the present application provides a method for moving a device, the method comprising:
  • the total height between the cutting tool and the stage is reduced by a first distance at a first speed to a first height, wherein the first height is determined according to the total height and a cutting tool loss value;
  • the first height between the cutting tool and the stage is reduced at a second speed until the cutting tool contacts the stage, wherein the first speed is different from the second speed.
  • the first speed is greater than the second speed.
  • the first speed is greater than the second speed.
  • the method further comprises:
  • a second height between the cutting tool and the stage is reduced at a fourth speed until the cutting tool contacts the stage.
  • the second speed is the same as the fourth speed.
  • the second height is determined based on a second speed and a time from the first height until the cutting tool contacts the stage.
  • the cutting tool loss value is 0.1 mm.
  • the present application provides a device for moving a device, the device comprising: a first moving module, a second moving module;
  • the first moving module is used to reduce the total height between the cutting tool and the stage to a first height at a first speed by a first distance, wherein the first height is determined according to the total height and the cutting tool loss value;
  • the second moving module is used to reduce a first height between the cutting tool and the carrier at a second speed until the cutting tool contacts the carrier, wherein the first speed is different from the second speed.
  • the first speed is greater than the second speed.
  • a third mobile module is
  • the third moving module is used to move the cutting tool and the stage away from each other at a third speed until the cutting tool and the stage are at a second height;
  • a second height between the cutting tool and the stage is reduced at a fourth speed until the cutting tool contacts the stage.
  • the second speed is the same as the fourth speed.
  • the second height is determined based on a second speed and a time from the first height until the cutting tool contacts the stage.
  • the cutting tool loss value is 0.1 mm.
  • the present application provides an electronic device, the device comprising: a memory, a processor;
  • the memory is used to store computer programs
  • the processor is used to implement the steps of the method for moving a device as described in any one of the first aspects when executing the computer program.
  • the present application provides a computer-readable storage medium, characterized in that a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, the steps of the method for moving a device as described in any one of the first aspects are implemented.
  • the present application provides a method for moving an equipment, wherein first, the total height between a cutting tool and a carrier is reduced by a first distance to a first height at a first speed, wherein the first height is determined based on the total height and a loss value of the cutting tool; then, the first height between the cutting tool and the carrier is reduced at a second speed until the cutting tool contacts the carrier, wherein the first speed and the second speed are different.
  • the above method determines the first height through the total height and the loss value of the cutting tool, which has the following beneficial effects: first, it maximally compresses the distance moved at the second speed (slow), reduces the time consumed in the second stage and thus improves the efficiency of wafer cutting; second, by subtracting the loss value of the cutting tool from the total height, the distance moved at the second speed is fixed and thus ensures the safety of the device, that is, the cutting tool is in contact with the stage at the second speed (slow).
  • FIG1 is a flow chart of a method for moving a device provided in an embodiment of the present application.
  • FIG2a is a schematic diagram corresponding to a method for moving a device provided in an embodiment of the present application.
  • FIG2b is a schematic diagram corresponding to a method for moving a device provided in an embodiment of the present application.
  • FIG3 is a schematic diagram of the structure of an apparatus for moving equipment provided in an embodiment of the present application.
  • words such as “exemplary” or “for example” are used to indicate examples, illustrations or descriptions. Any embodiment or design described as “exemplary” or “for example” in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as “exemplary” or “for example” is intended to present related concepts in a specific way.
  • the existing equipment movement method mainly adopts the idea of "one measurement, permanent use", that is, the distance between the cutting tool and the stage is measured for the first time, and the result of this measurement is used all the time. Since the cutting tool will produce a certain amount of loss in the process of cutting the wafer, and the existing measurement technology does not take into account the loss of the cutting tool in the cutting process, it will cause the problem of difficulty in setting the first distance. If the first distance is set too small, it will lead to low wafer cutting efficiency; if the first distance is set too large, there will be insufficient distance for the blade to slowly descend, causing damage to the blade or the table.
  • subtracting the loss value of the cutting tool from the total height can maximize the distance of slow movement, reduce the time spent on slow movement, and thus improve the efficiency of wafer cutting; in addition, by subtracting the loss value of the cutting tool from the total height, the distance of the second speed movement is fixed, thereby ensuring the safety of the device, that is, the cutting tool and the stage are in contact at a slow speed.
  • the present application provides a method for moving an equipment, wherein first, the total height between the cutting tool and the worktable is reduced by a first distance to a first height at a first speed, and the first height is determined based on the total height and the cutting tool loss value; then, the first height between the cutting tool and the worktable is reduced at a second speed until the cutting tool contacts the worktable, wherein the first speed and the second speed are different.
  • Figure 1 is a flow chart of a device moving method provided in an embodiment of the present application.
  • the method includes:
  • S101 The total height between the cutting tool and the stage is reduced by a first distance at a first speed to a first height, where the first height is determined based on the total height and a cutting tool loss value.
  • the cutting tool may be a blade or other device having a cutting function.
  • the total height can be the distance between the center of the cutting tool and the worktable.
  • the reference point can be the worktable or the center of the cutting tool, and the specific height is further determined by the actual situation.
  • the movement of the cutting tool or the movement of the stage is accomplished by a motor, that is, the controller sends corresponding instructions to control the movement of the cutting tool or the stage, and the present application does not impose any limitation on the motor and the controller.
  • the loss value of the cutting tool may be 0.1 mm, which is an estimated value obtained based on a large amount of data statistics, that is, it is estimated that the loss value of the cutting tool is 0.1 mm for each cutting action.
  • the cutting tool may be moved while the stage remains fixed. Specifically, the cutting tool moves a first distance toward the stage at a first speed to reach a first height, and the first height is determined based on the total height and the loss value of the cutting tool. At this time, the reference point is the stage.
  • the stage may be moved and the cutting tool may be fixed. Specifically, the stage moves a first distance at a first speed toward the cutting tool to reach a first height, and the first height is determined based on the total height and the loss value of the cutting tool. At this time, the reference point is the center of the cutting tool.
  • the stage can be moved or the cutting tool can be moved. Therefore, during the equipment installation process, a suitable method can be selected according to the actual situation on site, which can effectively improve the flexibility of equipment installation.
  • the wafer cutting process is a multi-cycle process, that is, each time the cutting equipment is started, multiple cuttings need to be completed. Therefore, the total height is also a constantly changing value, that is, the current total height is the relative height between the center of the cutting tool and the stage after the last cutting was completed.
  • the stage may move, and the cutting tool may remain fixed. Specifically, the stage moves toward the cutting tool at the second speed until the stage contacts the cutting tool.
  • the cutting tool may move while the stage remains fixed. Specifically, the cutting tool moves toward the stage at the second speed until the stage contacts the cutting tool.
  • the first speed is greater than the second speed.
  • the present application provides a method for moving an equipment, wherein first, the total height between a cutting tool and a carrier is reduced by a first distance to a first height at a first speed, wherein the first height is determined based on the total height and a loss value of the cutting tool; then, the first height between the cutting tool and the carrier is reduced at a second speed until the cutting tool contacts the carrier, wherein the first speed and the second speed are different.
  • the above method determines the first height through the total height and the loss value of the cutting tool, which has the following beneficial effects: first, it maximally compresses the distance moved at the second speed (slow), reduces the time consumed in the second stage and thus improves the efficiency of wafer cutting; second, by subtracting the loss value of the cutting tool from the total height, the distance moved at the second speed is fixed and thus ensures the safety of the device, that is, the cutting tool is in contact with the stage at the second speed (slow).
  • the method provided in this application also includes:
  • the cutting tool and the stage are moved away from each other at a third speed until the cutting tool and the stage are at a second height;
  • the second height between the cutting tool and the stage is reduced at a fourth speed until the cutting tool contacts the stage.
  • the cutting tool moves and the stage remains stationary. Specifically, the cutting tool moves away from the stage at a third speed until the cutting tool and the stage are at a second height, and the cutting tool moves toward the stage at a fourth speed until the cutting tool contacts the stage.
  • the stage moves and the cutting tool remains stationary. Specifically, the stage moves away from the cutting tool at a third speed until the stage and the cutting tool are at a second height, and the stage moves toward the cutting tool at a fourth speed until the stage and the cutting tool are in contact.
  • the second speed is equal to the fourth speed.
  • FIG. 3 is a schematic diagram of the structure of a device moving apparatus provided in an embodiment of the present application.
  • the device includes: a first moving module 301 , a second moving module 302 ;
  • a first moving module 301 used for reducing the total height between the cutting tool and the stage to a first height at a first speed by a first distance, wherein the first height is determined according to the total height and a loss value of the cutting tool;
  • the second moving module 302 is used to reduce a first height between the cutting tool and the stage at a second speed until the cutting tool contacts the stage, wherein the first speed is different from the second speed.
  • the device further comprises: a third moving module
  • the third moving module is used to move the cutting tool and the worktable away from each other at a third speed until the cutting tool and the worktable are at a second height; and to reduce the second height between the cutting tool and the worktable at a fourth speed until the cutting tool contacts the worktable.
  • the second speed and the fourth speed are the same.
  • the second height is determined based on the second speed and the time from the first height until the cutting tool contacts the stage.
  • the cutting tool loss value is 0.1 mm.
  • the present application provides a device for moving equipment, the device comprising a first moving module and a second moving module.
  • the first moving module is used to reduce the total height between the cutting tool and the stage to a first height at a first speed, the first height being determined according to the total height and the loss value of the cutting tool;
  • the second moving module is used to reduce the first height between the cutting tool and the stage at a second speed until the cutting tool contacts the stage, the first speed being The second speed is different.
  • the above-mentioned device has the following beneficial effects: first, the distance moved at the second speed (slow speed) is compressed to the maximum extent, thereby reducing the time consumed in the second stage and improving the efficiency of wafer cutting; second, by subtracting the loss value of the cutting tool from the total height, the distance moved at the second speed is fixed and the safety of the device is ensured, that is, the cutting tool and the stage are in contact at the second speed (slow speed).
  • An embodiment of the present application provides a computer-readable storage medium having a computer program stored thereon.
  • the program is executed by a processor, the method for moving a device described in the embodiment of the present application is implemented.
  • the computer-readable storage medium can adopt any combination of one or more computer-readable media.
  • the computer-readable medium can be a computer-readable signal medium or a computer-readable storage medium.
  • the computer-readable storage medium can be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, or any combination of the above.
  • Non-exhaustive list of computer-readable storage media include: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above.
  • the computer-readable storage medium can be any tangible medium containing or storing a program, which can be used by an instruction execution system, device or device or used in combination with it.
  • Computer-readable signal media may include data signals propagated in baseband or as part of a carrier wave, which carry computer-readable program code. Such propagated data signals may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. Computer-readable signal media may also be any computer-readable medium other than a computer-readable storage medium, which may send, propagate, or transmit a program for use by or in conjunction with an instruction execution system, apparatus, or device.
  • the program code embodied on the computer readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.
  • Computer program code for performing the operations of the present invention may be written in one or more programming languages or a combination thereof, including object-oriented programming languages such as Java, Smalltalk, C++, and conventional procedural programming languages such as "C" or similar programming languages.
  • the program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server.
  • the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).
  • LAN local area network
  • WAN wide area network
  • Internet service provider e.g., via the Internet using an Internet service provider
  • the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can refer to each other, and each embodiment focuses on the differences from other embodiments.
  • the description is relatively simple, and the relevant parts can refer to the partial description of the method embodiment.
  • the device embodiment described above is merely schematic, in which the units described as separate components may or may not be physically separated, and the components indicated as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. A person of ordinary skill in the art will Employees can understand and implement it without any creative work.

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Abstract

一种设备移动的方法，包括：切割工具与载物台之间的总高度以第一速度减少第一距离至第一高度，第一高度是根据总高度以及切割工具损耗值确定的；以第二速度减少切割工具与载物台之间的第一高度，直至切割工具接触到载物台，其中，第一速度与第二速度是不同的。压缩以第二速度移动的距离，降低第二阶段所耗费的时间进而提高晶圆切割的效率。还涉及设备移动的装置、电子设备及存储介质。

Description

一种设备移动的方法、装置、设备及存储介质
本发明要求于2022年12月20日提交中华人民共和国国家知识产权局、申请号为202211640897.5、申请名称为“一种设备移动的方法、装置、设备及存储介质”的中国专利申请的优先权，其全部内容通过引用结合在本发明中。
技术领域
本申请涉及晶圆切割技术领域，特别是涉及一种设备移动的方法、装置、设备及存储介质。
背景技术
在晶圆切割装置中，一般由切割工具与载物台构成，其中切割工具置于载物台的上方，进行晶圆切割之前，需要将切割工具下移直至与载物台相接触，所以需要对切割工具与载物台之间的距离进行测量。
晶圆切割前的准备工作主要分为两个阶段，第一阶段刀片快速下移第一距离；第二阶段刀片慢速下移直至与台面相接触。现有的设备移动方法主要采用“一次测量，永久使用”的思想，即对切割工具与载物台之间的距离进行初次测量，之后一直使用该次测量的结果。由于在切割晶圆的过程中，切割工具会产生一定的损耗，而现有的测量技术中没有考虑到切割过程中切割工具的损耗，会造成第一距离难以设定的问题，若第一距离设置过小，将导致晶圆切割效率低；若第一距离设置过大，将导致没有足够的距离用以刀片慢速下降致使刀片或台面损坏。
发明内容
基于上述问题，本申请提供了一种设备移动的方法、装置、设备及存储介质，提高设备移动的效率。
本申请实施例公开了如下技术方案：
第一方面，本申请提供一种设备移动的方法，该方法包括：
切割工具与载物台之间的总高度以第一速度减少第一距离至第一高度，所述第一高度是根据总高度以及切割工具损耗值确定的；
以第二速度减少所述切割工具与所述载物台之间的第一高度，直至所述切割工具接触到所述载物台，其中，第一速度与第二速度是不同的。可选地，所述第一速度大于所述第二速度。
可选地，所述第一速度大于所述第二速度。
可选地，在所述切割工具接触到所述载物台后，所述方法还包括：
使所述切割工具与所述载物台以第三速度远离彼此，直至所述切割工具与所述载物台相距第二高度；
以第四速度减少所述切割工具与所述载物台之间的第二高度，直至所述切割工具接触到所述载物台。
通过使切割工具与载物台远离彼此至第二高度，再以第四速度相向移动，省略了以第一速度移动的过程，从而有效提高了晶圆切割的效率。
可选地，所述第二速度与所述第四速度是相同的。
可选地，所述第二高度是根据第二速度以及从所述第一高度直至所述切割工具接触到所述载物台的时间来确定的。
可选地，所述切割工具损耗值为0.1mm。
第二方面，本申请提供一种设备移动的装置，该装置包括：第一移动模块，第二移动模块；
所述第一移动模块，用于切割工具与载物台之间的总高度以第一速度减少第一距离至第一高度，所述第一高度是根据总高度以及切割工具损耗值确定的；
所述第二移动模块，用于以第二速度减少所述切割工具与所述载物台之间的第一高度，直至所述切割工具接触到所述载物台，其中，第一速度与第二速度是不同的。
可选地，所述第一速度大于所述第二速度。
可选地，第三移动模块；
所述第三移动模块，用于使所述切割工具与所述载物台以第三速度远离彼此，直至所述切割工具与所述载物台相距第二高度；
以第四速度减少所述切割工具与所述载物台之间的第二高度，直至所述切割工具接触到所述载物台。
可选地，所述第二速度与所述第四速度是相同的。
可选地，所述第二高度是根据第二速度以及从所述第一高度直至所述切割工具接触到所述载物台的时间来确定的。
可选地，所述切割工具损耗值为0.1毫米。
第三方面，本申请提供了一种电子设备，所述设备包括：存储器、处理器；
所述存储器，用于存储计算机程序；
所述处理器，用于执行所述计算机程序时实现如第一方面任一项所述的设备移动的方法的步骤。
第四方面，本申请提供了一种计算机可读存储介质，其特征在于，所述计算机可读存储介质上存储有计算机程序，所述计算机程序被处理器执行时实现如第一方面任一项所述的设备移动的方法的步骤。
本申请提供一种设备移动的方法，首先，切割工具与载物台之间的总高度以第一速度减少第一距离至第一高度，第一高度是根据总高度以及切割工具损耗值确定的；然后，以第二速度减少所述切割工具与载物台之间的第一高度，直至切割工具接触到载物台，其中，第一速度与第二速度是不同的。
上述方法通过总高度以及切割工具的损耗值确定第一高度有以下有益效果：其一，最大限度的压缩以第二速度(慢速)移动的距离，降低第二阶段所耗费的时间进而提高晶圆切割的效率；其二，通过在总高度的基础之上减去切割工具的损耗值，第二速度移动的距离固定进而保证了装置的安全性，即切割工具与载物台是以第二速度(慢速)相接触的。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的一种设备移动的方法的流程图；
图2a为本申请实施例提供的一种设备移动的方法对应的示意图；
图2b为本申请实施例提供的一种设备移动的方法对应的示意图；
图3为本申请实施例提供的一种设备移动的装置的结构示意图。
具体实施方式
本申请说明书和权利要求书及附图说明中的术语“第一”、“第二”和“第三”等是用于区别不同对象，而不是用于限定特定顺序。
在本申请实施例中，“示例性的”或者“例如”等词用于表示作例子、例证或说明。本申请实施例中被描述为“示例性的”或者“例如”的任何实施例或设计方案不应被解释为比其它实施例或设计方案更优选或更具优势。确切而言，使用“示例性的”或者“例如”等词旨在以具体方式呈现相关概念。
正如前文描述，现有的设备移动方法主要采用“一次测量，永久使用”的思想，即对切割工具与载物台之间的距离进行初次测量，之后一直使用该次测量的结果。由于在切割晶圆的过程中，切割工具会产生一定的损耗，而现有的测量技术中没有考虑到切割过程中切割工具的损耗，会造成第一距离难以设定的问题，若第一距离设置过小，将导致晶圆切割效率低；若第一距离设置过大，将导致没有足够的距离用以刀片慢速下降致使刀片或台面损坏。经过研究，将总高度减去切割工具的损耗值，可以最大限度的压缩以慢速移动的距离，降低慢速移动所耗费的时间进而提高晶圆切割的效率；除此之外，通过在总高度的基础之上减去切割工具的损耗值，第二速度移动的距离固定进而保证了装置的安全性，即切割工具与载物台是以慢速相接触的。
有鉴于此，本申请提供一种设备移动的方法，首先，切割工具与载物台之间的总高度以第一速度减少第一距离至第一高度，第一高度是根据总高度以及切割工具损耗值确定的；然后，以第二速度减少所述切割工具与载物台之间的第一高度，直至切割工具接触到载物台，其中，第一速度与第二速度是不同的。
为了使本技术领域的人员更好地理解本申请方案，下面将结合本申请实施例中的附图， 对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
参见图1，该图为本申请实施例提供的一种设备移动方法的流程图。
如图1所示，该方法包括：
S101：切割工具与载物台之间的总高度以第一速度减少第一距离至第一高度，第一高度是根据总高度以及切割工具损耗值确定的。
作为示例，切割工具可以是刀片或其他具备切割功能的设备。
作为示例，总高度可以切割工具圆心处相对于载物台的距离，其参考点可以为载物台，也可以为切割工具圆心处，具体由实际情况进行进一步地确定。
作为示例，切割工具的移动或载物台的移动均是通过电机来完成的。即，通过控制器下发相应的指令控制切割工具或载物台发生移动，本申请不对电机以及控制器进行任何形式的限定。
作为示例，切割工具的损耗值可以为0.1mm，该损耗值是根据大量数据统计而来的估计值，即估计每次切割动作，切割工具的损耗值为0.1mm。
作为一种可能的实现方式，如图2a所示，可以是切割工具移动，载物台保持固定。具体地，切割工具以第一速度向载物台移动第一距离到达第一高度，第一高度是根据总高度以及切割工具的损耗值来进行确定的。此时，参考点为载物台。
作为一种可能的实现方式，如图2b所示，可以是载物台移动，切割工具保持固定。具体地，载物台以第一速度向切割工具移动第一距离到达第一高度，第一高度是根据总高度以及切割工具的损耗值来进行确定的。此时，参考点为切割工具的圆心。
通过上述两种可能的实现方式，可以是载物台发生移动也可以是切割工具发生移动。所以，在进行设备安装的过程中，可根据现场的实际情况选择合适的方式，可以有效提高设备安装的灵活性。
需要注意的是，晶圆切割过程是一个循环多次的过程，即每一次切割设备的启动，需要完成多次切割。所以，总高度也是一个不断发生变化的值，即当前的总高度为上一次完成切割之后切割工具圆心与载物台之间的相对高度。
S102：以第二速度减少切割工具与载物台之间的第一高度，直至切割工具接触到载物台，其中，第一速度与第二速度是不同的。
作为一种可能的实现方式，可以是载物台移动，切割工具保持固定。具体地，载物台以第二速度向切割工具移动直至载物台与切割工具相接触。
作为一种可能的实现方式，可以是切割工具移动，载物台保持固定。具体地，切割工具以第二速度向载物台移动直至载物台与切割工具相接触。
可选地，第一速度大于第二速度。
本申请提供一种设备移动的方法，首先，切割工具与载物台之间的总高度以第一速度减少第一距离至第一高度，第一高度是根据总高度以及切割工具损耗值确定的；然后，以第二速度减少所述切割工具与载物台之间的第一高度，直至切割工具接触到载物台，其中，第一速度与第二速度是不同的。
上述方法通过总高度以及切割工具的损耗值确定第一高度有以下有益效果：其一，最大限度的压缩以第二速度(慢速)移动的距离，降低第二阶段所耗费的时间进而提高晶圆切割的效率；其二，通过在总高度的基础之上减去切割工具的损耗值，第二速度移动的距离固定进而保证了装置的安全性，即切割工具与载物台是以第二速度(慢速)相接触的。
除此之外，本申请所提供的方法还包括：
切割完成之后，使切割工具与所述载物台以第三速度远离彼此，直至切割工具与载物台相距第二高度；
以第四速度减少切割工具与载物台之间的第二高度，直至切割工具接触到载物台。
作为一种可能的实现方式，切割工具移动，载物台保持不动。具体地，切割工具以第三速度远离载物台，直至切割工具与载物台之间相距第二高度，切割工具以第四速度向载物台移动直至切割工具与载物台相接触。
作为一种可能的实现方式，载物台移动，切割工具保持不动。具体地，载物台以第三速度远离切割工具，直至载物台与切割工具之间相距第二高度，载物台以第四速度向切割工具移动直至载物台与切割工具相接触。
作为示例，第二速度与所述第四速度是相等。
作为示例，第二高度可以根据第二速度以及从第一高度直至切割工具接触到载物台的时间来确定的，例如，以第二速度从第一高度直至切割工具与载物台发生接触的时间为t1，第二速度为v2，则第二高度＝t1*v2。
通过使切割工具与载物台远离彼此至第二高度，再以第四速度相向移动，省略了以第一速度移动的过程，从而有效提高了晶圆切割的效率。
参见图3，该图为本申请实施例提供的一种设备移动装置的结构示意图。
如图3所示，该装置包括：第一移动模块301，第二移动模块302；
第一移动模块301，用于切割工具与载物台之间的总高度以第一速度减少第一距离至第一高度，第一高度是根据总高度以及切割工具损耗值确定的；
第二移动模块302，用于以第二速度减少所述切割工具与所述载物台之间的第一高度，直至切割工具接触到载物台，其中，第一速度与第二速度是不同的。
可选地，该装置还包括：第三移动模块；
第三移动模块，用于使切割工具与载物台以第三速度远离彼此，直至切割工具与载物台相距第二高度；以第四速度减少切割工具与载物台之间的第二高度，直至切割工具接触到载物台。
可选地，第二速度与第四速度是相同的。
可选地，第二高度是根据第二速度以及从第一高度直至切割工具接触到载物台的时间来确定的。
可选地，切割工具损耗值为0.1mm。
本申请提供一种设备移动的装置，该装置包括第一移动模块以及第二移动模块。其中，第一移动模块，用于切割工具与载物台之间的总高度以第一速度减少第一距离至第一高度，第一高度是根据总高度以及切割工具损耗值确定的；第二移动模块，用于以第二速度减少所述切割工具与载物台之间的第一高度，直至切割工具接触到载物台，其中，第一速度与 第二速度是不同的。
上述装置有以下有益效果：其一，最大限度的压缩以第二速度(慢速)移动的距离，降低第二阶段所耗费的时间进而提高晶圆切割的效率；其二，通过在总高度的基础之上减去切割工具的损耗值，第二速度移动的距离固定进而保证了装置的安全性，即切割工具与载物台是以第二速度(慢速)相接触的。
本申请实施例提供一种计算机可读存储介质，其上存储有计算机程序，该程序被处理器执行时实现本申请实施例所述的设备移动的方法。
在实际应用中，所述计算机可读存储介质可以采用一个或多个计算机可读的介质的任意组合。计算机可读介质可以是计算机可读信号介质或者计算机可读存储介质。计算机可读存储介质例如可以是但不限于电、磁、光、电磁、红外线、或半导体的系统、装置或器件，或者任意以上的组合。计算机可读存储介质的更具体的例子(非穷举的列表)包括：具有一个或多个导线的电连接、便携式计算机磁盘、硬盘、随机存取存储器(RAM)、只读存储器(ROM)、可擦式可编程只读存储器(EPROM或闪存)、光纤、便携式紧凑磁盘只读存储器(CD-ROM)、光存储器件、磁存储器件、或者上述的任意合适的组合。在本实施例中，计算机可读存储介质可以是任何包含或存储程序的有形介质，该程序可以被指令执行系统、装置或者器件使用或者与其结合使用。
计算机可读的信号介质可以包括在基带中或者作为载波一部分传播的数据信号，其中承载了计算机可读的程序代码。这种传播的数据信号可以采用多种形式，包括但不限于电磁信号、光信号或上述的任意合适的组合。计算机可读的信号介质还可以是计算机可读存储介质以外的任何计算机可读介质，该计算机可读介质可以发送、传播或者传输用于由指令执行系统、装置或者器件使用或者与其结合使用的程序。
计算机可读介质上包含的程序代码可以用任何适当的介质传输，包括但不限于无线、电线、光缆、RF等等，或者上述的任意合适的组合。
可以以一种或多种程序设计语言或其组合来编写用于执行本发明操作的计算机程序代码，所述程序设计语言包括面向对象的程序设计语言—诸如Java、Smalltalk、C++，还包括常规的过程式程序设计语言—诸如“C”语言或类似的程序设计语言。程序代码可以完全地在用户计算机上执行、部分地在用户计算机上执行、作为一个独立的软件包执行、部分在用户计算机上部分在远程计算机上执行、或者完全在远程计算机或服务器上执行。在涉及远程计算机的情形中，远程计算机可以通过任意种类的网络——包括局域网(LAN)或广域网(WAN)—连接到用户计算机，或者，可以连接到外部计算机(例如利用因特网服务提供商来通过因特网连接)。
需要说明的是，本说明书中的各个实施例均采用递进的方式描述，各个实施例之间相同相似的部分互相参见即可，每个实施例重点说明的都是与其他实施例的不同之处。尤其，对于装置实施例而言，由于其基本相似于方法实施例，所以描述得比较简单，相关之处参见方法实施例的部分说明即可。以上所描述的装置实施例仅仅是示意性的，其中作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元提示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部模块来实现本实施例方案的目的。本领域普通技术人 员在不付出创造性劳动的情况下，即可以理解并实施。
以上所述，仅为本申请的一种具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到的变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应该以权利要求的保护范围为准。

Claims (10)

  1. 一种设备移动的方法，其特征在于，所述方法包括：
    切割工具与载物台之间的总高度以第一速度减少第一距离至第一高度，所述第一高度是根据总高度以及切割工具损耗值确定的；
    以第二速度减少所述切割工具与所述载物台之间的第一高度，直至所述切割工具接触到所述载物台，其中，第一速度与第二速度是不同的。
  2. 如权利要求1所述的方法，其特征在于，所述第一速度大于所述第二速度。
  3. 如权利要求1所述的方法，其特征在于，在所述切割工具接触到所述载物台后，所述方法还包括：
    使所述切割工具与所述载物台以第三速度远离彼此，直至所述切割工具与所述载物台相距第二高度；
    以第四速度减少所述切割工具与所述载物台之间的第二高度，直至所述切割工具接触到所述载物台。
  4. 如权利要求3所述的方法，其特征在于，所述第二速度与所述第四速度是相同的。
  5. 如权利要求4所述的方法，其特征在于，所述第二高度是根据第二速度以及从所述第一高度直至所述切割工具接触到所述载物台的时间来确定的。
  6. 如权利要求1所述的方法，其特征在于，所述切割工具损耗值为0.1毫米。
  7. 一种设备移动的装置，其特征在于，所述装置包括：第一移动模块，第二移动模块；
    所述第一移动模块，用于切割工具与载物台之间的总高度以第一速度减少第一距离至第一高度，所述第一高度是根据总高度以及预设值确定的；
    所述第二移动模块，用于以第二速度减少所述切割工具与所述载物台之间的第一高度，直至所述切割工具接触到所述载物台，其中，第一速度与第二速度是不同的。
  8. 如权利要求7所述的装置，其特征在于，所述装置还包括：第三移动模块；
    所述第三移动模块，用于使所述切割工具与所述载物台以第三速度远离彼此，直至所述切割工具与所述载物台相距第二高度；
    以第四速度减少所述切割工具与所述载物台之间的第二高度，直至所述切割工具接触到所述载物台。
  9. 一种电子设备，其特征在于，包括：存储器，处理器，及存储在所述存储器上并可在所述处理器上运行的计算机程序，所述处理器执行所述计算机程序时，实现如权利要求1至6任一项所述的设备移动的方法。
  10. 一种计算机可读存储介质，其特征在于，所述计算机可读存储介质中存储有指令，当所述指令在终端设备上运行时，使得所述终端设备执行如权利要求1至6任一项所述的设备移动的方法。
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