WO2024130438A1

WO2024130438A1 - Micro-led with integrated transportation vehicles sensors

Info

Publication number: WO2024130438A1
Application number: PCT/CA2023/051749
Authority: WO
Inventors: Gholamreza Chaji; John Cronin
Original assignee: Vuereal Inc.
Priority date: 2022-12-23
Filing date: 2023-12-22
Publication date: 2024-06-27

Abstract

The present disclosure provides integrating Micro-LEDs with vehicle sensors in which a Micro-LED unit contains a substrate, a plurality of Micro-LEDs, a memory, a processor, a plurality of vehicle sensors, and a sensor module. The vehicle sensors collect sensor data, and the sensor module stores the data in memory and analyzes the sensor data to determine if there is an action to be performed by the plurality of Micro-LEDs and sends a signal to adjust, alter, or change the light produced by the Micro-LEDs.

Description

MICRO-LED WITH INTEGRATED TRANSPORTATION

VEHICLES SENSORS

BACKGROUND AND FIELD OF THE DISCLOSURE

[1] The present disclosure is generally related to integrating Micro-LEDs with transportation vehicle sensors.

[2] The transportation industry is any industry, business, or establishment operated to convey persons or property from one place to another, whether by rail, highway, air, or water, and all operations and services in connection in addition to that; and also includes storing or warehousing of goods or property, and the repairing, parking, rental, maintenance, or cleaning of vehicles.

[3] Currently, a plurality of sensors are integrated with a vehicle to control or automatically produce notifications or alerts to the driver.

[4] Also, the sensors typically produce alerts to the driver but rarely perform actions based on the data collected, forcing the driver to make decisions while controlling the vehicle.

[5] Thus, there is a need in the prior art to integrate Micro-LEDs with transportation vehicle sensors.

SUMMARY

[6] The present invention relates to a method to use Micro-LED unit integrated with vehicle sensors in a vehicle the method comprising, having a substrate, having a plurality of Micro-LEDs; having a plurality of vehicle sensors, having a memory, having a processor, and having a sensor module, wherein the plurality of vehicle sensors collect sensor data, the sensor module stores the data in memory and analyzes the sensor data to determine if there is an action to be performed by the plurality of Micro-LEDs and sends a signal to adjust, alter, or change the light produced by the Micro-LEDs.

DESCRIPTIONS OF THE DRAWINGS

[7] FIG. 1 : Illustrates an integration of a transferred microdevice with an electro-optical thin film device in a hybrid structure, according to an embodiment.

[8] FIG. 2: Illustrates a Micro-LED integrated with a sensor, according to an embodiment.

[9] FIG. 3: Illustrates a Micro-LED unit integrated with a backup camera, according to an embodiment.

[10] FIG. 4: Illustrates a Micro-LED unit integrated with a touch sensor, according to an embodiment.

[11] FIG. 5: Illustrates a Micro-LED unit integrated with a headlight range sensor, according to an embodiment.

[12] FIG. 6: Illustrates a Micro-LED unit integrated with a depth sensor, according to an embodiment.

DETAILED DESCRIPTION

[13] Embodiments of the present disclosure will be described more fully hereinafter with reference to the accompanying drawings in which like numerals represent like elements throughout the several figures, and in which example embodiments are shown. Embodiments of the claims may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. The examples set forth herein are non-limiting examples and are merely examples among other possible examples. The present disclosure relates to a structure, system and method of use of Micro-LED along with multiple sensors in vehicles.

[14] FIG. 1A shows an example of integrating a transferred microdevice 106 with an electro- optical thin film device 112 in a hybrid structure. This is an example of an integrated Micro-LED tile that is later picked and placed into an array of tiles. It should be obvious to those in the art there are many ways to create Micro-LED tiles and integrate them in an array of tiles, as per US20160218143A1 - Microdevice integration into system substrate. A receiver substrate 102 and contact pads 104 upon which the microdevice 106 arrays are transferred and into which the thin film electro-optical device is integrated in a number of hybrid structure embodiments. Microdevice 106 may be transferred and bonded to the bonding pad 104 of the receiver substrate 100. In one case, a dielectric layer 108 is formed over the substrate 102 to cover the exposed electrodes and conductive layers. Lithography and etching may be used to pattern the dielectric layer 108. Conductive layer 110 is then deposited and patterned to form the bottom electrode of the thin film electro-optical device 112. If there is no risk of unwanted coupling between bottom electrode 110 and other conductive layers in the receiver substrate, the dielectric layer 108 may be eliminated. However, this dielectric layer can also act as a planarization layer to offer better fabrication of electro-optical devices 112. A bank layer 114 is deposited on the substrate 102 to cover the edges of the electrode 110 and the microdevice 106. Thin film electro-optical device 112 is then formed over this structure. Organic LED (OLED) devices are an example of a thin film electro-optical device that may be formed using different techniques such as but not limited to shadow mask, lithography, and printing patterning. Finally, the top electrode 118 of the electro-optical thin film device 112 is deposited and patterned if needed. In an embodiment where the microdevices' 106 thickness is significantly high, cracks or other structural problems may occur within the bottom electrode 110. In these embodiments, a planarization layer may be used in conjunction with or without the dielectric layer 108 to address this issue. In another embodiment, the microdevice 106 can have a device electrode 116. This electrode can be common between other microdevices 106 in the system substrate. In this case, the planarization layer (if present) and/or bank structure 114 covers the electrode 116 to avoid any shorts between the electro-optical device 112 and device electrode 116.

[15] FIG. IB illustrates structures where the device is shared between a few pixels (or subpixels) after post-processing to deposit a common electrode and color conversion layers. Here the microdevice 106 is not fully patterned, but the horizontal condition is engineered so that the contacts 104 define the area allocated to each pixel. The system substrate 102 with contact pads 104 and a donor substrate with microdevices 106. After the microdevices 106 are transferred to system substrate 102, one can do post-processing, such as depositing common electrode 120, color conversion layers 122, color filters, and so on. However, the methods described in this disclosure and other possible methods can be used. It is possible to add the color conversion layers as described into pixel (or sub-pixel) active areas after forming the active area. This can offer a higher fill factor and higher performance and avoid color leaking from the side pixel (or sub-pixel) if the active area of the pixel (or sub-pixel) is covered by reflective layers. The microdevices 106 are grown on a buffer/sacrificial layer in another embodiment.

[16] FIG. 2 (Figures 2A and 2B) illustrates an embodiment of a Micro-LED integrated with a sensor. The basic sensor module 201 may be a Micro-LED unit integrated with a sensor to perform an action of the Micro-LED unit based on the collected sensor data. The basic sensor module 201 may contain a substrate 202, Micro-LED tile 204, sensor tile 206, memory 208, basic sensor module 210, a bus 212, and a processor 214. The substrate 202 may be made of glass, silicon, plastics, or any other commonly used material. The substrate 202 may also have active electronic components such as but not limited to transistors, resistors, capacitors, or any other electronic component commonly used in a system substrate. In some cases, the substrate 202 may be a substrate 202 with electrical signal rows and columns. In one example, the substrate 202 may be a sapphire substrate with LED layers grown monolithically on top of it, and the substrate 202 may be a backplane with circuitry to derive Micro-LED devices. In some embodiments, the substrate 202 may be a flexible or rigid substrate 202. The Micro-LED tile 204 contains a plurality of miniature LED (light emitting diodes) arrays, with each Micro-LED functioning as a pixel and can be driven to emit light. Micro-LEDs comprise several microscopic LEDs, which self-illuminate per display pixel. Micro-LED is a modular technology. For example, panels are made up of a series of tiny red, green, and blue LEDs and are connected together to make one larger whole. In some embodiments, the Micro-LED tile 204 may be produced in a plurality of sizes to increase the width or length of the Micro-LED tile 204. The Micro-LED tiles 204 may include a plurality of connectors which may be an electrochemical device used to create an electrical connection between the plurality of Micro-LED tiles, which create the Micro-LED tile 204. The connectors may receive power, data signals, informational instructions, etc., from the ribbon connector to power and control the individual Micro-LEDs in the Micro-LED tiles 204 that make up the Micro-LED unit. The sensor tile 206 may be a sensor that collects data to indicate which actions of the Micro-LED tile 204 need to be performed, such as turning on or off, adjusting brightness, dimming the brightness, changing or altering the colors of the Micro-LED tile 204, etc. The sensor tile 206 may be a plurality of sensors, such as motion sensors, temperature sensors, humidity sensors, cameras, microphones, radiofrequency receivers, thermal imagers, radar devices, lidar devices, ultrasound devices, a speaker, wearable devices, etc. The memory 208 may include, but is not limited to, fixed (hard) drives, magnetic tape, floppy diskettes, optical disks, Compact Disc Read-Only Memories (CD-ROMs), magneto-optical disks, semiconductor memories, such as ROMs, Random Access Memories (RAMs), Programmable Read-Only Memories (PROMs), Erasable PROMs (EPROMs), Electrically Erasable PROMs (EEPROMs), flash memory, magnetic or optical cards, or another type of media/machine-readable medium suitable for storing electronic instructions. The memory 208 may comprise modules implemented as a program. The basic sensor module 210 may store the data collected from the sensor tile 206, extract the data, analyze the data, and determine an action for the Micro-LED tile 204 that is sent to the processor 214 to activate or deactivate the Micro-LED tile 204. For example, the basic sensor module 210 may be continuously polling to receive the data from the sensor, such as a sensor to detect if it is dark outside. The basic sensor module 210 receives the sensor data from the sensor tile 206, such as the sensor has detected that it is dark outside. The basic sensor module 210 stores the sensor data in memory 208, such as the sensor that is dark outside has been recorded. The basic sensor module 210 extracts the sensor data from the memory 208 and determines if there is an action required by the Micro-LED tile 204. For example, the sensor may be surrounded by a Micro-LED unit that is the headlight or headlamp for the vehicle, and once the sensor detects that it is dark outside, the basic sensor module 210 sends a signal to the processor 214 to activate the Micro-LED unit which is the headlight or headlamp of the vehicle to illuminate the road for the driver. The bus controller 212 may be a computer bus used by the vehicle CPU to communicate with devices contained within the computer through physical connections such as cables or printed circuits. The vehicle CPU transmits various control signals to components and devices to transmit control signals to the CPU using the control bus. One of the main objectives of a bus is to minimize the lines needed for communication. The bus controller 212 may be bidirectional and assists the CPU in synchronizing control signals to internal devices and external components. It comprises interrupt lines, byte enables lines, read/write signals, and status lines. The processor 214 may be configured to decode and execute any instructions received from one or more other electronic devices or server(s). The processor 214 may include one or more general -purpose processors (e.g., INTEL® or Advanced Micro Devices® (AMD) microprocessors) and/or one or more special purpose processors (e.g., digital signal processors or Xilinx® System On Chip (SOC) Field Programmable Gate Array (FPGA) processor). The processor 214 may be configured to execute one or more computer-readable program instructions, such as program instructions, to carry out any of the functions described in this description.

[17] FIG. 3 (Figueres 3 A to 3C) illustrates an embodiment of a Micro-LED unit integrated with a backup camera. The backup camera module 301 may be a Micro-LED unit integrated with a backup camera to perform an action of the Micro-LED unit based on the collected sensor data. The backup camera module 301 may contain a substrate 302, Micro-LED tile 304, backup camera tile 306, memory 308, the backup camera module 310, a bus 312, and a processor 314. The substrate 302 may be made of glass, silicon, plastics, or any other commonly used material. The substrate 302 may also have active electronic components such as but not limited to transistors, resistors, capacitors, or any other electronic component commonly used in a system substrate. In some cases, the substrate 302 may be a substrate 302 with electrical signal rows and columns. In one example, the substrate 302 may be a sapphire substrate with LED layers grown monolithically on top of it, and the substrate 302 may be a backplane with circuitry to derive Micro-LED devices. In some embodiments, the substrate 302 may be a flexible or rigid substrate 302. The Micro-LED tile 304 contains a plurality of miniature LED (light emitting diodes) arrays, with each Micro-LED functioning as a pixel and can be driven to emit light. Micro-LEDs comprise several microscopic LEDs, which self-illuminate per display pixel. Micro-LED is a modular technology. For example, panels are made up of a series of tiny red, green, and blue LEDs and are connected together to make one larger whole. In some embodiments, the Micro-LED tile 304 may be produced in a plurality of sizes to increase the width or length of the Micro-LED tile 304. The Micro-LED tiles 304 may include a plurality of connectors NNN which may be an electrochemical device used to create an electrical connection between the plurality of Micro-LED tiles, which create the Micro- LED tile 304. The connectors may receive power, data signals, informational instructions, etc., from the ribbon connector to power and control the individual Micro-LEDs in the Micro-LED tiles 304 that make up the Micro-LED unit. The backup camera tile 306 may be an integrated vehicle backup camera with the Micro-LED tile 304. The backup camera tile 306 may be a special video camera attached to the rear of a vehicle to aid in backing up, alleviate the rear blind spot, and avoid a backup collision. The backup camera tile 306 may be surrounded by a plurality of Micro-LED tiles 304 to provide additional lighting and improve the driver's image. The Micro-LED tiles 304 may be a plurality of shapes and sizes to increase the effectiveness of the backup camera tile 306, such as a circular, square, or rectangular Micro-LED unit with the backup camera tile 306 located in the middle of the Micro-LED unit. The backup camera tile 306 may use the same connectors, substrate 302, memory 308, bus 312, and processor 314, as the Micro-LED tiles 304. The memory 308 may include, but is not limited to, fixed (hard) drives, magnetic tape, floppy diskettes, optical disks, Compact Disc Read-Only Memories (CD-ROMs), and magneto-optical disks, semiconductor memories, such as ROMs, Random Access Memories (RAMs), Programmable Read-Only Memories (PROMs), Erasable PROMs (EPROMs), Electrically Erasable PROMs (EEPROMs), flash memory, magnetic or optical cards, or another type of media/machine-readable medium suitable for storing electronic instructions. The memory 308 may comprise modules implemented as a program. The backup camera module 310 may store the data collected from the backup camera tile 306, extract the data, analyze the data, and determine an action for the Micro- LED tile 304 that is sent to the processor 314 to activate or deactivate the Micro-LED tile 304. For example, the backup camera module 310 may be continuously polling to receive the data from the backup camera tile 306, such as the video or images collected by the backup camera tile 306. The backup camera module 310 receives the sensor data from the backup camera tile 306, such as the video or images collected by the backup camera tile 306. The backup camera module 310 stores the sensor data in memory 308, such as the images collected by the backup camera module 310. The backup camera module 310 extracts the sensor data from the memory 308 and determines if there is an action required by the Micro-LED tile 304. For example, the backup camera module 310 may analyze the quality of the images recorded by the backup camera tile 306 to determine if the Micro-LED tile 304 needs to produce additional light to improve the image quality, produce less light to improve the image quality, change the color of light produced to improve the image quality, etc. The backup camera module 310 sends the signal to the processor 314 to allow the Micro-LED tile 304 to produce the appropriate light to improve the image quality. The bus controller 312 may be a computer bus used by the vehicle CPU to communicate with devices contained within the computer through physical connections such as cables or printed circuits. The vehicle CPU transmits various control signals to components and devices to transmit control signals to the CPU using the control bus. One of the main objectives of a bus is to minimize the lines needed for communication. The bus controller 312 may be bidirectional and assists the CPU in synchronizing control signals to internal devices and external components. It comprises interrupt lines, byte enables lines, read/write signals, and status lines. The processor 314 may be configured to decode and execute any instructions received from one or more other electronic devices or server(s). The processor 314 may include one or more general -purpose processors (e.g., INTEL® or Advanced Micro Devices® (AMD) microprocessors) and/or one or more special purpose processors (e.g., digital signal processors or Xilinx® System On Chip (SOC) Field Programmable Gate Array (FPGA) processor). The processor 314 may be configured to execute one or more computer-readable program instructions, such as program instructions, to carry out any of the functions described in this description.

[18] FIG. 4 (4A to 4C) illustrates an embodiment of a Micro-LED unit integrated with a touch sensor. The touch control module 401 may be a Micro-LED unit integrated with a touch sensor to perform an action of the Micro-LED unit based on the collected sensor data. The touch control module 401 may contain a substrate 402, Micro-LED tile 404, touch sensor 406, memory 408, touch control module 410, a bus 412, and a processor 414. The substrate 402 may be made of glass, silicon, plastics, or any other commonly used material. The substrate 402 may also have active electronic components such as but not limited to transistors, resistors, capacitors, or any other electronic component commonly used in a system substrate. In some cases, the substrate 402 may be a substrate 402 with electrical signal rows and columns. In one example, the substrate 402 may be a sapphire substrate with LED layers grown monolithically on top of it, and the substrate 402 may be a backplane with circuitry to derive Micro-LED devices. In some embodiments, the substrate 402 may be a flexible or rigid substrate 402. The Micro-LED tile 404 contains a plurality of miniature LED (light emitting diodes) arrays, with each Micro-LED functioning as a pixel and can be driven to emit light. Micro-LEDs comprise several microscopic LEDs, which self-illuminate per display pixel. Micro-LED is a modular technology. For example, panels are made up of a series of tiny red, green, and blue LEDs and are connected together to make one larger whole. In some embodiments, the Micro-LED tile 404 may be produced in a plurality of sizes to increase the width or length of the Micro-LED tile 404. The Micro-LED tiles 404 may include a plurality of connectors which may be an electrochemical device used to create an electrical connection between the plurality of Micro-LED tiles, which create the Micro-LED tile 404. The connectors may receive power, data signals, informational instructions, etc., from the ribbon connector to power and control the individual Micro-LEDs in the Micro-LED tiles 404 that make up the Micro-LED unit. The touch sensor 406 may be an electronic sensor used in detecting and recording physical touch. The touch sensor 406 may be a device that measures information arising from physical interaction with its environment. The touch sensor 406 may be a data acquisition device or transducer designed to sense a diversity of properties via direct physical contact. The touch sensor 406 may be surrounded by a plurality of Micro-LED tiles 404 to provide additional lighting for the driver. The Micro-LED tiles 404 may be a plurality of shapes and sizes to increase the effectiveness of the touch sensor 406, such as a circular, square, or rectangular Micro-LED unit with the touch sensor 406 located in the middle, top, bottom, or edges of the Micro-LED unit. The touch sensor 406 may use the same connectors, substrate 402, memory 408, bus 412, and processor 414, as the Micro-LED tiles 404. The memory 408 may include, but is not limited to, fixed (hard) drives, magnetic tape, floppy diskettes, optical disks, Compact Disc Read-Only Memories (CD-ROMs), and magneto-optical disks, semiconductor memories, such as ROMs, Random Access Memories (RAMs), Programmable Read-Only Memories (PROMs), Erasable PROMs (EPROMs), Electrically Erasable PROMs (EEPROMs), flash memory, magnetic or optical cards, or another type of media/machine-readable medium suitable for storing electronic instructions. The memory 408 may comprise modules implemented as a program. The touch control module 410 may store the data collected from the touch sensor 406, extract the data, analyze the data, and determine an action for the Micro-LED tile 404 that is sent to the processor 414 to activate or deactivate the Micro-LED tile 404. For example, the touch control module 410 may be continuously polling to receive the data from the backup camera tile 406, such as data to determine if the touch sensor 406 has been touched by a user. The touch control module 410 receives the sensor data from the touch sensor 406, such as data to determine if the touch sensor 406 has been touched by a user. The touch control module 410 stores the sensor data in memory 408, such as the images collected by the touch control module 410. The touch control module 410 extracts the sensor data from the memory 408 and determines if there is an action required by the Micro-LED tile 404. For example, the touch control module 410 may determine if the touch sensor 406 has been touched by the user to activate an interior Micro-LED tile 404 or unit or panel to illuminate the vehicle's interior. In some embodiments, there may be a plurality of touch sensors 406 in a series, such as four touch sensors 406 in a row that may be swiped or touched individually, which would determine the brightness of the Micro-LED tiles 404, such as touching the just the first touch sensor 416A would produce a very dim light from the Micro-LED tile 404 but if the user touched all four touch sensors 416A, 416B, 41C and 416D or the fourth touch sensor 416D in the series that would produce a bright light by the Micro-LED tile 404. The touch control module 410 sends the signal to the processor 414 to allow the Micro-LED tile 404 to produce the appropriate light. The bus controller 412 may be a computer bus used by the vehicle CPU to communicate with devices within the computer through physical connections such as cables or printed circuits. The vehicle CPU transmits various control signals to components and devices to transmit control signals to the CPU using the control bus. One of the main objectives of a bus is to minimize the lines needed for communication. The bus controller 412 may be bidirectional and assists the CPU in synchronizing control signals to internal devices and external components. It comprises interrupt lines, byte enables lines, read/write signals, and status lines. The processor 414 may be configured to decode and execute any instructions received from one or more other electronic devices or server(s). The processor 414 may include one or more general -purpose processors (e.g., INTEL® or Advanced Micro Devices® (AMD) microprocessors) and/or one or more special purpose processors (e.g., digital signal processors or Xilinx® System On Chip (SOC) Field Programmable Gate Array (FPGA) processor). The processor 414 may be configured to execute one or more computer-readable program instructions, such as program instructions, to carry out any of the functions described in this description.

[19] FIG. 5 illustrates an embodiment of a Micro-LED unit integrated with a headlight range sensor. The basic headlight module 501 may be a Micro-LED unit integrated with a headlight range sensor 506 to perform an action of the Micro-LED unit based on the collected sensor data. The basic headlight module 501 may contain a substrate 502, Micro-LED tile 504, headlight range sensor 506, memory 508, headlight range module 510, a bus 512, and a processor 514. The substrate 502 may be made of glass, silicon, plastics, or any other commonly used material. The substrate 502 may also have active electronic components such as but not limited to transistors, resistors, capacitors, or any other electronic component commonly used in a system substrate. In some cases, the substrate 502 may be a substrate 502 with electrical signal rows and columns. In one example, the substrate 502 may be a sapphire substrate with LED layers grown monolithically on top of it, and the substrate 502 may be a backplane with circuitry to derive Micro-LED devices. In some embodiments, the substrate 502 may be a flexible or rigid substrate 502. The Micro-LED tile 504 contains a plurality of miniature LED (light emitting diodes) arrays, with each Micro-LED functioning as a pixel and can be driven to emit light. Micro-LEDs comprise several microscopic LEDs, which self-illuminate per display pixel. Micro-LED is a modular technology. For example, panels are made up of a series of tiny red, green, and blue LEDs and are connected together to make one larger whole. In some embodiments, the Micro-LED tile 504 may be produced in a plurality of sizes to increase the width or length of the Micro-LED tile 504. The Micro-LED tiles 504 may include a plurality of connectors which may be an electrochemical device used to create an electrical connection between the plurality of Micro-LED tiles, which create the Micro-LED tile 504. The connectors may receive power, data signals, informational instructions, etc., from the ribbon connector to power and control the individual Micro-LEDs in the Micro-LED tiles 504 that make up the Micro-LED unit. The headlight range sensor 506 may detect the range of the headlights with the aid of a camera, particularly a CCD camera with downstream image processing software and/or a laser, infrared, and/or radar sensor. These sensors detect the illumination range of the headlights produced by the vehicle. A charge-coupled device (CCD) is a light-sensitive integrated circuit that captures images by converting photons to electrons. A CCD sensor breaks the image elements into pixels. Each pixel is converted into an electrical charge whose intensity is related to the intensity of light captured by that pixel. The memory 508 may include, but is not limited to, fixed (hard) drives, magnetic tape, floppy diskettes, optical disks, Compact Disc Read- Only Memories (CD-ROMs), magneto-optical disks, semiconductor memories, such as ROMs, Random Access Memories (RAMs), Programmable Read-Only Memories (PROMs), Erasable PROMs (EPROMs), Electrically Erasable PROMs (EEPROMs), flash memory, magnetic or optical cards, or another type of media/machine-readable medium suitable for storing electronic instructions. The memory 508 may comprise modules implemented as a program. The headlight range sensor 506 may store the data collected from the headlight range sensor 506, extract the data, analyze the data, and determine an action for the Micro-LED tile 504 sent to the processor 514 to activate or deactivate the Micro-LED tile 504. For example, the headlight range sensor 506 may be continuously polling to receive the data from the headlight range sensor 506, such as the illumination distance produced by the headlights. The headlight range sensor 506 receives the sensor data from the headlight range sensor 506, such as the illumination distance produced by the headlights. The headlight range sensor 506 stores the sensor data in memory 508, such as the images collected by the headlight range sensor 506. The headlight range sensor 506 extracts the sensor data from the memory 508 and determines if an action is required by the Micro-LED tile 504. For example, the headlight range sensor 506 may determine the distance in which the headlights, illuminated through a plurality of Micro-LED tiles 504, are illuminating the road. In some embodiments, the headlight range sensor 506 may detect an oncoming vehicle and determine the range of the light the headlights are producing. If it is determined that the headlights are not producing enough light for the driver, such as only producing 10 feet of light, the headlight range module 510 may send a signal to the processor 514 to increase the brightness of the Micro-LED tiles 504. In some embodiments, the range of the lights produced by the headlights may be predetermined thresholds stored in a database in the memory 508 and be compared to the database with the current speed of the vehicle to determine if the headlights are producing adequate lighting for the speed the vehicle is currently maintaining and the lights produced by the Micro-LED tiles 504 may be increased or decreased. The headlight range sensor 506 sends the signal to the processor 514 to allow the Micro-LED tile 504 to either increase or decrease the illumination of the headlights. The bus controller 512 may be a computer bus used by the vehicle CPU to communicate with devices within the computer through physical connections such as cables or printed circuits. The vehicle CPU transmits various control signals to components and devices to transmit control signals to the CPU using the control bus. One of the main objectives of a bus is to minimize the lines needed for communication. The bus controller 512 may be bidirectional and assists the CPU in synchronizing control signals to internal devices and external components. It comprises interrupt lines, byte enables lines, read/write signals, and status lines. The processor 514 may be configured to decode and execute any instructions received from one or more other electronic devices or server(s). The processor 514 may include one or more general -purpose processors (e.g., INTEL® or Advanced Micro Devices® (AMD) microprocessors) and/or one or more special purpose processors (e.g., digital signal processors or Xilinx® System On Chip (SOC) Field Programmable Gate Array (FPGA) processor). The processor 514 may be configured to execute one or more computer-readable program instructions, such as program instructions, to carry out any of the functions described in this description.

[20] FIG. 6 illustrates an embodiment of a Micro-LED unit integrated with a depth sensor. The depth sensor module 601 may be a Micro-LED unit integrated with a depth sensor 606 to perform an action of the Micro-LED unit based on the collected sensor data. The depth sensor module 601 may contain a substrate 602, Micro-LED tile 604, depth sensor tile 606, memory 608, depth sensor module 610, bus 612, and processor 614. The substrate 602 may be made of glass, silicon, plastics, or any other commonly used material. The substrate 602 may also have active electronic components such as but not limited to transistors, resistors, capacitors, or any other electronic component commonly used in a system substrate. In some cases, the substrate 602 may be a substrate 602 with electrical signal rows and columns. In one example, the substrate 602 may be a sapphire substrate with LED layers grown monolithically on top of it, and the substrate 602 may be a backplane with circuitry to derive Micro-LED devices. In some embodiments, the substrate 602 may be a flexible or rigid substrate 602. The Micro-LED tile 604 contains a plurality of miniature LED (light emitting diodes) arrays, with each Micro-LED functioning as a pixel and can be driven to emit light. Micro-LEDs comprise several microscopic LEDs, which self-illuminate per display pixel. Micro-LED is a modular technology. For example, panels are made up of a series of tiny red, green, and blue LEDs and are connected together to make one larger whole. In some embodiments, the Micro-LED tile 604 may be produced in a plurality of sizes to increase the width or length of the Micro-LED tile 604. The Micro-LED tiles 604 may include a plurality of connectors which may be an electrochemical device used to create an electrical connection between the plurality of Micro-LED tiles, which create the Micro-LED tile 604. The connectors may receive power, data signals, informational instructions, etc., from the ribbon connector to power and control the individual Micro-LEDs in the Micro-LED tiles 604 that make up the Micro-LED unit. The depth sensor tile 606 may be a plurality of ultrasonic transducers and ultrasonic sensors, which generate or sense ultrasound energy. The depth sensor tile 606 may include transmitters that convert electrical signals into ultrasound, receivers that convert ultrasound into electrical signals, and/or transceivers that can both transmit and receive ultrasound. The depth sensor tile 606 may produce the ultrasound and receive the ultrasound, and depending on the time the ultrasound is sent to when it is received, it can determine the distance an object is behind a vehicle. The memory 608 may include, but is not limited to, fixed (hard) drives, magnetic tape, floppy diskettes, optical disks, Compact Disc Read-Only Memories (CD-ROMs), and magneto-optical disks, semiconductor memories, such as ROMs, Random Access Memories (RAMs), Programmable Read-Only Memories (PROMs), Erasable PROMs (EPROMs), Electrically Erasable PROMs (EEPROMs), flash memory, magnetic or optical cards, or another type of media/machine-readable medium suitable for storing electronic instructions. The memory 608 may comprise modules implemented as a program. The depth sensor module 610 may store the data collected from the depth sensor tile 606, extract the data, analyze the data, and determine an action for the Micro-LED tile 604 sent to the processor 614 to activate or deactivate the Micro-LED tile 604. For example, the depth sensor module 610 may be continuously polling to receive the data from the depth sensor tile 606, such as adjusting the light color to indicate the distance the vehicle is from an object. The depth sensor module 610 receives the sensor data from the depth sensor tile 606, such as adjusting the color of the light to indicate the distance the vehicle is from an object. The depth sensor module 610 stores the sensor data in memory 608, such as the distance between the vehicle and an object. The depth sensor module 610 extracts the sensor data from the memory 608 and determines if there is an action required by the Micro-LED tile 604. For example, the depth sensor module 606 may determine the distance the vehicle is from an object, such as the object is 10 feet away from the vehicle, the signal sent to the processor 614 is to produce a yellow light to the Micro-LED tile 604 to indicate to the driver that there is an object close by or if there is an object less than two feet away from the vehicle the signal sent to the processor 614 is to produce a flashing red light to the Micro-LED tile 604 to indicate to the driver that there is an object extremely close to the vehicle. The depth sensor module 606 sends the signal to the processor 614 to allow the Micro-LED tile 604 to change the color produced by the Micro-LED tiles 604 to indicate the distance to the driver, pulse, flash, or flicker the lights produced by the Micro-LED tiles 604 to indicate the distance to the driver, etc. The bus controller 612 may be a computer bus used by the vehicle CPU to communicate with devices within the computer through physical connections such as cables or printed circuits. The vehicle CPU transmits various control signals to components and devices to transmit control signals to the CPU using the control bus. One of the main objectives of a bus is to minimize the lines needed for communication. The bus controller 612 may be bidirectional and assists the CPU in synchronizing control signals to internal devices and external components. It comprises interrupt lines, byte enables lines, read/write signals, and status lines. The processor 614 may be configured to decode and execute any instructions received from one or more other electronic devices or server(s). The processor 614 may include one or more general -purpose processors (e.g., INTEL® or Advanced Micro Devices® (AMD) microprocessors) and/or one or more special purpose processors (e.g., digital signal processors or Xilinx® System On Chip (SOC) Field Programmable Gate Array (FPGA) processor). The processor 614 may be configured to execute one or more computer-readable program instructions, such as program instructions, to carry out any of the functions described in this description.

[21] The functions performed in the processes and methods may be implemented in differing orders. Furthermore, the outlined steps and operations are only provided as examples, and some of the steps and operations may be optional, combined into fewer steps and operations, or expanded into additional steps and operations without detracting from the essence of the disclosed embodiments.

Claims

1. A method to use Micro-LED unit integrated with vehicle sensors in a vehicle the method comprising: having a substrate; having a plurality of Micro-LEDs; having a plurality of vehicle sensors; having a memory; having a processor; and having a sensor module, wherein the plurality of vehicle sensors collect sensor data, the sensor module stores the data in memory and analyzes the sensor data to determine if there is an action to be performed by the plurality of Micro-LEDs and sends a signal to adjust, alter, or change the light produced by the Micro-LEDs.

2. The method of claim 1, wherein the sensor module is a Micro-LED unit integrated with a sensor to perform an action of the Micro-LED unit based on a collected sensor data.

3. The method of claim 2, wherein the sensor module contains the substrate, a Micro-LED tile, a sensor tile, a memory, another sensor module, a bus, and the processor.

4. The method of claim 2, wherein the substrate is made of glass, silicon, or plastics wherein further the substrate has active electronic components such as but not limited to transistors, resistors, capacitors, or any other electronic component commonly used in a system substrate.

5. The method of claim 2, wherein the substrate has electrical signal rows and columns.

6. The method of claim 2, wherein the substrate is a sapphire substrate with LED layers grown monolithically on top of it, and the substrate is a backplane with a circuitry to derive Micro-LED devices.

7. The method of claim 2, wherein the substrate is a flexible or rigid substrate.

8. The method of claim 3, wherein Micro-LED tile contains a plurality of miniature LED (light emitting diodes) arrays, with each Micro-LED functioning as a pixel and is driven to emit light.

9. The method of claim 8, wherein the Micro-LEDs comprise several microscopic LEDs, which self-illuminate per display pixel.

10. The method of claim 9, wherein panels are made up of a series of tiny red, green, and blue micro-LEDs and are connected together to make one larger whole.

11. The method of claim 10, wherein the Micro-LED tile is produced in a plurality of sizes to increase a width or a length of the Micro-LED tile.

12. The method of claim 11, wherein, the Micro-LED tiles include a plurality of connectors which are an electrochemical device used to create an electrical connection between the plurality of Micro-LED, which create the Micro-LED tile.

13. The method of claim 12, wherein the connectors receive power, data signals, informational instructions from a ribbon connector to power and control the individual Micro-LEDs in the Micro- LED tiles.

14. The method of claim 13, wherein the sensor tile is a sensor that collects data to indicate which actions of the Micro-LED tile need to be performed, such as turning on or off, adjusting brightness, dimming the brightness, changing, or altering the colors of the Micro-LED tile.

15. The method of claim 14, wherein the sensor tile is a plurality of sensors, such as motion sensors, temperature sensors, humidity sensors, cameras, microphones, radiofrequency receivers, thermal imagers, radar devices, lidar devices, ultrasound devices, a speaker, or wearable devices.