WO2024116693A1

WO2024116693A1 - Resin composition, adhesive, sealing material, die attachment material, cured product and electronic device

Info

Publication number: WO2024116693A1
Application number: PCT/JP2023/039072
Authority: WO
Inventors: 友也中井; 宏樹上地; 陽太内藤
Original assignee: ナミックス株式会社
Priority date: 2022-11-30
Filing date: 2023-10-30
Publication date: 2024-06-06

Abstract

The present invention provides: a resin composition which has a low viscosity and enables the achievement of a cured product that has a high Tg; an adhesive and a sealing material, each of which comprises this resin composition; a die attachment material; a cured product; and an electronic device.　This resin composition is characterized by containing (A) a pentaerythritol tetraglycidyl ether and (B) an epoxy resin other than the component (A), and is also characterized in that the amount of the component (A) is less than 30% by mass in 100% by mass of organic matters that include the component (A) and the component (B).　

Description

Resin composition, adhesive, sealing material, die attach agent, cured product, and electronic device

The present invention relates to a resin composition, an adhesive, a sealing material, a die attachment agent, a cured product, and an electronic device.

Electronic devices and other electronic equipment are expected to be used in various environments, including high temperatures and high humidity. When assembling electronic equipment, the resin composition used to join and seal parts greatly affects the reliability of the electronic equipment, such as moisture resistance and durability. In order to improve the reliability of electronic equipment, even when the electronic equipment is used in harsh environments such as high temperatures and high humidity, the resin composition may be configured so that the glass transition temperature (Tg) of the cured product is high.

By using a compound with multifunctional groups to increase the crosslink density, it is possible to increase the Tg of the resulting cured product. Patent Document 1 proposes a resin composition that uses an epoxy compound that has multifunctional groups and an aromatic ring in the molecule to obtain a cured product, in order to increase reliability in harsh environments such as high temperatures and high humidity. A high Tg is, for example, 80°C or higher.

Japanese Patent Application Laid-Open No. 05-175370

Resin compositions containing aromatic epoxy compounds that have aromatic rings in the molecule tend to have high viscosities. When assembling electronic devices, it may be necessary to join small areas or narrow gaps, and a resin composition that has a low viscosity of, for example, 200 Pa·s or less at 25°C and is easy to handle may be required.

The present invention aims to provide a resin composition that can produce a cured product with a high Tg and has a low viscosity, as well as an adhesive or sealant, die attachment agent, cured product, and electronic device that contain this resin composition.

The means for solving the above problems are as follows, and the present invention includes the following aspects.

[1] A resin composition comprising (A) pentaerythritol tetraglycidyl ether and (B) an epoxy resin other than the component (A), wherein the component (A) accounts for less than 30 mass% of 100 mass% of an organic substance comprising the components (A) and (B).
[2] The resin composition according to [1] above, wherein the component (B) contains an epoxy resin having an aromatic ring and an epoxy group having two or more functionalities.
[3] The resin composition according to [1] or [2], wherein the component (B) contains an epoxy resin having an epoxy equivalent of 90 to 500 g/eq.
[4] The resin composition according to any one of [1] to [3] above, further comprising a filler (C).
[5] An adhesive or sealant comprising the resin composition according to any one of [1] to [4] above.
[6] A die attachment agent comprising the resin composition according to any one of [1] to [4] above.
[7] A cured product obtained by curing the resin composition described in any one of [1] to [4] above, the adhesive or sealant described in [5] above, or the die attachment agent described in [6] above.
[8] An electronic device comprising the cured product according to [7] above.

The present invention makes it possible to obtain a cured product with a high Tg, and to provide a resin composition with low viscosity, an adhesive or sealant containing this resin composition, a die attachment agent, a cured product, and an electronic device.

Hereinafter, the resin composition according to the present disclosure, an adhesive or encapsulant containing the resin composition, a die attachment agent, a cured product obtained by curing the resin composition, the adhesive, the encapsulant or the die attachment agent, and an electronic device containing the cured product will be described based on the embodiments. However, the embodiments shown below are examples for embodying the technical idea of the present invention, and the present invention is not limited to the following resin composition, the adhesive, the encapsulant or the die attachment agent containing the resin composition, the cured product obtained by curing it, and the electronic device containing the cured product.
In this specification, following the convention in the field of synthetic resins, a name including the term "resin", which normally refers to a polymer (particularly a synthetic polymer), may be used for a component that constitutes a curable resin composition before curing, even though the component is not a polymer.

Resin Composition The resin composition according to a first embodiment of the present invention contains (A) pentaerythritol tetraglycidyl ether (hereinafter also referred to as "component (A)"), and (B) an epoxy resin other than the component (A) (hereinafter also referred to as "component (B)"), and the amount of component (A) is less than 30 mass% in 100 mass% of organic matter containing components (A) and (B) in the resin composition.

Component (A), pentaerythritol tetraglycidyl ether (hereinafter, also referred to as “PETG”), is a compound represented by the following formula (1).

Since component (A) PETG is a multifunctional epoxy compound having four epoxy groups, each epoxy group can react to increase the crosslink density, and the resin composition containing component (A) can be made into a cured product having a high Tg of, for example, 80°C or higher. Furthermore, since component (A) PETG does not have an aromatic ring in the compound, the viscosity of the resin composition can be reduced. Component (A) PETG is liquid. In this specification, a substance being "liquid" means that the substance is in a liquid state at 20°C or higher and 30°C or lower. In this specification, "liquid" means a fluid whose viscosity at 20°C or higher and 30°C or lower is preferably 0.001 Pa·s or higher and 1,000 Pa·s or lower, as measured using a rotational viscometer (e.g., manufactured by Brookfield). A "liquid" substance may be a pure substance or a mixture. This mixture may be in a homogeneous form (such as a solution) or in a heterogeneous form (such as an emulsion or suspension). In other words, unless otherwise specified, if the mixture as a whole satisfies the above-mentioned fluid requirements, the mixture can be considered to be liquid even if it contains components that do not qualify as liquids.

Component (A) in the resin composition is less than 30% by mass, preferably 29.99% by mass or less, more preferably 29% by mass or less, even more preferably 28% by mass or less, may be 25% by mass or less, or may be 20% by mass or less, based on 100% by mass of the organic matter contained in the resin composition. Component (A) in the resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, even more preferably 1.0% by mass or more, may be 1.2% by mass or more, or may be 1.5% by mass or more, based on 100% by mass of the organic matter contained in the resin composition. In one embodiment, the component (A) in the resin composition is 0.1% by mass or more and less than 30% by mass, preferably 0.5% by mass or more and 29.99% by mass or less, more preferably 0.5% by mass or more and 29% by mass or less, even more preferably 1.0% by mass or more and 28% by mass or less, particularly preferably 1.2% by mass or more and 25% by mass or less, and most preferably 1.5% by mass or more and 20% by mass or less, based on 100% by mass of the organic matter contained in the resin composition. If the component (A) is 30% by mass or more based on 100% by mass of the organic matter contained in the resin composition, some of the adjacent functional groups are not involved in polymerization due to the influence of steric hindrance, so that the crosslink density after curing cannot be increased and Tg decreases. A cured product with a low crosslink density and a low Tg may have reduced reliability such as moisture resistance or durability. When component (A) is less than 30% by mass, preferably 0.1% by mass or more and 29.99% by mass or less, based on 100% by mass of the organic matter contained in the resin composition, the viscosity of the resin composition can be maintained low while the functional groups are easily reactive, the crosslink density can be increased, and a cured product with a high Tg can be obtained.

The organic matter in the resin composition, including components (A) and (B), refers to 100% by mass of the organic matter excluding the inorganic matter, when the resin composition contains an inorganic matter. An example of the inorganic matter contained in the resin composition is the (C) filler made of an inorganic matter, which will be described later. When the (C) filler, which will be described later, is made of an organic matter, or when the (C) filler contains an organic matter, the organic matter that is the (C) filler or the organic matter contained in the (C) filler is included in the organic matter in the resin composition. In addition to components (A) and (B), the organic matter contained in the resin composition preferably contains the (D) hardener, which will be described later, and when the (E) hardener and/or (F) dispersant are contained, part of the organic matter contains the (E) hardener and/or (F) dispersant.

For the PETG of component (A), a commercially available product can be used, for example, Showfree (registered trademark) PETG (manufactured by Showa Denko K.K.). The commercially available PETG of component (A) is preferably one with high purity, for example, a chlorine concentration of less than 50 ppm by mass measured by ion chromatography in accordance with JIS K0127 "General rules for ion chromatography."

The resin composition contains an epoxy resin other than component (A) as component (B). The epoxy resin of component (B) may be one type of epoxy resin or two or more types of epoxy resins. If the resin composition is liquid, component (B) may be liquid or solid. Component (B) is preferably liquid. When two or more types of components (B) are used in combination, component (B) refers to a mixture obtained by mixing all of the components (B).

Component (B) preferably contains at least one type of multifunctional epoxy resin. A multifunctional epoxy resin is an epoxy resin having two or more epoxy groups. Examples of multifunctional epoxy resins include aliphatic multifunctional epoxy resins and aromatic multifunctional epoxy resins.

Examples of aliphatic multifunctional epoxy resins include:
- diepoxy resins such as (poly)ethylene glycol diglycidyl ether, (poly)propylene glycol diglycidyl ether, butanediol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane diglycidyl ether, polytetramethylene ether glycol diglycidyl ether, glycerin diglycidyl ether, neopentyl glycol diglycidyl ether, cyclohexane type diglycidyl ether, dicyclopentadiene type diglycidyl ether;
- triepoxy resins such as trimethylolpropane triglycidyl ether, glycerin triglycidyl ether;
- alicyclic epoxy resins such as vinyl(3,4-cyclohexene) dioxide, 2-(3,4-epoxycyclohexyl)-5,1-spiro-(3,4-epoxycyclohexyl)-m-dioxane;
- glycidylamine type epoxy resins such as tetraglycidylbis(aminomethyl)cyclohexane;
Hydantoin type epoxy resins such as -1,3-diglycidyl-5-methyl-5-ethylenehydantoin, and epoxy resins having a silicone skeleton such as -1,3-bis(3-glycidoxypropyl)-1,1,3,3-tetramethyldisiloxane, but are not limited thereto.

Among the above examples, "cyclohexane-type diglycidyl ether" refers to a compound having a structure in which two glycidyl groups are bonded, each via an ether bond, to a divalent saturated hydrocarbon group having one cyclohexane ring as the parent structure. "Dicyclopentadiene-type diglycidyl ether" refers to a compound having a structure in which two glycidyl groups are bonded, each via an ether bond, to a divalent saturated hydrocarbon group having a dicyclopentadiene skeleton as the parent structure. An example of a cyclohexane-type diglycidyl ether is 1,4-cyclohexanedimethanol diglycidyl ether. The aliphatic polyfunctional epoxy resin preferably has a molecular weight of 150 to 800. When the molecular weight of the aliphatic polyfunctional epoxy resin is within the range of 150 to 800, the viscosity of the resin composition containing the aliphatic polyfunctional epoxy resin as component (B) can be maintained low, improving the handleability. In addition, the resin composition can have a high crosslink density and a cured product with a high Tg can be obtained by reacting component (A) with component (B).

The aromatic polyfunctional epoxy resin is a polyfunctional epoxy resin having a structure containing an aromatic ring such as a benzene ring. Examples of aromatic polyfunctional epoxy resins include:
- bisphenol A type epoxy resin;
- branched polyfunctional bisphenol A type epoxy resins such as p-glycidyloxyphenyldimethyltribisphenol A diglycidyl ether;
- bisphenol F type epoxy resin;
- Novolac type epoxy resins;
- tetrabromobisphenol A type epoxy resin;
- fluorene type epoxy resin;
- biphenyl aralkyl epoxy resins;
-Diepoxy resins such as 1,4-phenyldimethanol diglycidyl ether;
-Biphenyl type epoxy resins such as 3,3',5,5'-tetramethyl-4,4'-diglycidyloxybiphenyl; -glycidylamine type epoxy resins such as diglycidylaniline, diglycidyl-o-toluidine, triglycidyl-p-aminophenol, tetraglycidyl-m-xylylenediamine, and 4-(diglycidylamino)phenyl glycidyl ether; and -naphthalene ring-containing epoxy resins. Not limited to these. The aromatic polyfunctional epoxy resin preferably has a molecular weight of 200 to 400. When the molecular weight of the aromatic polyfunctional epoxy resin is within the range of 200 to 400, the viscosity of the resin composition containing the aromatic polyfunctional epoxy resin as component (B) can be maintained low and the handleability can be improved. In addition, the resin composition can increase the crosslink density by reacting component (A) with component (B), and obtain a cured product having a high Tg.

Component (B) preferably contains an epoxy resin having an aromatic ring and a bifunctional or higher epoxy group. When component (B) contains an epoxy resin having an aromatic ring and a bifunctional or higher epoxy group, component (B) reacts with component (A) to increase the crosslinking density, thereby making it possible to obtain a cured product with a high Tg. In one embodiment, component (B) preferably contains a bifunctional epoxy resin having an aromatic ring and two epoxy groups.

Component (B) preferably contains an epoxy resin with an epoxy equivalent of 90 to 500 g/eq. If the epoxy equivalent is too large, many epoxy resins are solid at room temperature, making it difficult to maintain a low viscosity of the resin composition. If the epoxy equivalent is too small, many epoxy resins have one functional group, and a sufficient number of crosslinking structures are not formed, making it difficult to obtain a cured product with a high Tg. The epoxy equivalent of component (B) is more preferably 100 to 400 g/eq, even more preferably 110 to 350 g/eq, even more preferably 120 to 300 g/eq, and particularly preferably 130 to 250 g/eq. The epoxy equivalent is the value obtained by dividing the mass (g) of the epoxy resin by the total number of epoxy groups. The epoxy equivalent can be determined in accordance with the method described in JIS K7236. The epoxy equivalent may be the value obtained by dividing the mass (g) equivalent to one molecule contained in the epoxy resin by the total number of epoxy groups in one molecule contained in the epoxy resin.

The resin composition preferably contains component (B) in the range of 1% by mass to 60% by mass, more preferably 3% by mass to 55% by mass, even more preferably 4% by mass to 50% by mass, and even more preferably 4% by mass to 45% by mass. When the content of component (B) in the resin composition is in the range of 1% by mass to 60% by mass, the crosslinking density can be increased by the reaction of component (A) and component (B) to obtain a cured product having a high Tg, and the viscosity of the resin composition can be maintained low by suppressing an increase in the viscosity of the resin composition. From the viewpoint of obtaining such an effect, the content of component (B) is preferably in the range of 10% by mass to 90% by mass, and more preferably in the range of 15% by mass to 85% by mass, of 100% by mass of organic matter containing components (A) and (B) in the resin composition (excluding organic particles described later).

The resin composition preferably contains a filler (C). Examples of the filler (C) (hereinafter also referred to as "component (C)") include particles made of inorganic or organic matter. When component (C) is an inorganic matter, component (C) is not included in 100% by mass of the organic matter in the resin composition, which includes components (A) and (B). When component (C) is an organic matter, component (C) is also included in 100% by mass of the organic matter in the resin composition.

When component (C) is an inorganic substance, examples of the inorganic substance include silica particles, alumina particles, talc particles, calcium carbonate particles, silver particles, copper particles, alloy particles, etc. From the viewpoint of dispersibility, insulating particles such as silica particles, alumina particles, talc particles, calcium carbonate particles, etc. are preferable.

When component (C) is an organic substance, examples of the organic substance include silicone particles, polytetrafluoroethylene (PTFE) particles, acrylic particles, styrene particles, etc. From the viewpoint of dispersibility, silicone particles are preferred.

When the filler of component (C) is a particle made of an inorganic or organic substance, the average particle size of the particles is preferably 0.1 μm or more and 5.0 μm or less. Unless otherwise specified, the average particle size refers to the particle size (volume median diameter) at which the volume cumulative frequency from the small diameter side in the volume-based particle size distribution measured by a laser diffraction method in accordance with ISO-13320 (2009) reaches 50%. When the average particle size of the filler of component (C) is 5.0 μm or less, component (C) is easily dispersed in the resin composition, and it is easy to attach it to a narrow area when using the resin composition for bonding or sealing electronic components. In the case of a filler with an average particle size of more than 5.0 μm, coarse particles are easily contained in the resin composition, and for example, when bonding or sealing electronic components, etc. using a jet dispenser, the nozzle is easily worn, and the discharged resin composition is difficult to inject into a narrow area. When the average particle size of the filler of component (C) is 0.1 μm or more, the increase in viscosity can be suppressed even when the resin composition contains component (C). The average particle size of the filler of component (C) may be 0.2 μm or more and 4.0 μm or less, or 0.2 μm or more and 3.0 μm or less.

When the filler of component (C) is an inorganic or organic substance, the content of component (C) is preferably in the range of 20% by mass to 90% by mass, more preferably in the range of 25% by mass to 88% by mass, and even more preferably in the range of 30% by mass to 85% by mass, relative to the total mass of the resin composition. When the filler of component (C) is an inorganic or organic substance, if component (C) is contained in the range of 20% by mass to 65% by mass, relative to the total mass of the resin composition, the adhesive strength to the adherend is sufficiently maintained while suppressing an increase in the viscosity of the resin composition, and the resin composition can be injected and applied even in narrow areas, improving handleability.

Component (C) may be a commercially available product; in the case of silica particles, SO-E5 (manufactured by Admatechs Co., Ltd.) may be used; in the case of alumina particles, AG2051 (manufactured by Admatechs Co., Ltd.) may be used; and in the case of silicone particles, EP2601 (manufactured by Dow Toray Co., Ltd.) may be used. Component (C) may be used alone or in combination of two or more types. When two or more types of component (C) are used, two or more types of inorganic substances may be used, or one or more types of inorganic substances and one or more types of organic substances may be used in combination.

The resin composition preferably contains (D) a curing agent (hereinafter also referred to as "component (D)"). Component (D) is not particularly limited as long as it can cure the epoxy resin of component (B). Examples of component (D) include at least one selected from the group consisting of phenolic resins, acid anhydrides, thiol compounds, and amine compounds (such as aromatic amines).

Examples of phenolic resins include allylated phenolic resins, phenolic novolac resins, cresol novolac resins, naphthol-modified phenolic resins, dicyclopentadiene-modified phenolic resins, and p-xylene-modified phenolic resins. Commercially available phenolic resins can be used, such as MEH8005 (allylated phenolic resin, manufactured by UBE Co., Ltd.), Shownol (registered trademark) BRM-553 (phenolic novolac resin, manufactured by Aica Kogyo Co., Ltd.), and Shownol (registered trademark) BRG-558 (phenolic novolac resin, manufactured by Aica Kogyo Co., Ltd.).

Examples of acid anhydrides include methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, alkylated tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhymic anhydride, dodecenyl succinic anhydride, and methylnadic anhydride.

Examples of thiol compounds include trimethylolpropane tris(3-mercaptopropionate) (manufactured by SC Organic Chemical Co., Ltd.: TMMP), tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate (manufactured by SC Organic Chemical Co., Ltd.: TEMPIC), pentaerythritol tetrakis(3-mercaptopropionate) (manufactured by SC Organic Chemical Co., Ltd.: PEMP), tetraethylene glycol bis(3-mercaptopropionate ) (manufactured by SC Organic Chemical Industries, Ltd.: EGMP-4), dipentaerythritol hexakis(3-mercaptopropionate) (manufactured by SC Organic Chemical Industries, Ltd.: DPMP), pentaerythritol tetrakis(3-mercaptobutyrate) (manufactured by Showa Denko K.K.: KarenzMT (registered trademark) PE1), 1,3,5-tris(3-mercaptobutyryloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione (manufactured by Showa Denko K.K.: Karenz MT (registered trademark) NR1), 1,3,4,6-tetrakis (2-mercaptoethyl) glycoluril (manufactured by Shikoku Chemical Industry Co., Ltd.: TS-G), (1,3,4,6-tetrakis (3-mercaptopropyl) glycoluril (manufactured by Shikoku Chemical Industry Co., Ltd.: C3 TS-G), pentaerythritol trippropanethiol (manufactured by SC Organic Chemical Co., Ltd.: PEPT), 3-[2,3-bis(3-sulfanylpropoxy)propoxy]propane-1- Thiol, 3-[2,2-bis[(3-mercaptopropoxy)methyl]butoxy]-1-propanethiol, pentaerythritol tetrapropanethiol, 1,2,3-tris(mercaptomethylthio)propane, 1,2,3-tris(2-mercaptoethylthio)propane, 1,2,3-tris(3-mercaptopropylthio)propane, 4-mercaptomethyl-1,8-dimercapto-3,6-dithiaoctane, 5,7-dimercaptomethyl -1,11-dimercapto-3,6,9-trithiaundecane, 4,7-dimercaptomethyl-1,11-dimercapto-3,6,9-trithiaundecane, 4,8-dimercaptomethyl-1,11-dimercapto-3,6,9-trithiaundecane, tetrakis(mercaptomethylthiomethyl)methane, tetrakis(2-mercaptoethylthiomethyl)methane, tetrakis(3-mercaptopropylthiomethyl)methane, 1,1,3,3-tetrakis(2-mercaptoethylthiomethyl)methane, tetrakis(3-mercaptopropylthiomethyl)methane, bis(mercaptomethylthio)propane, 1,1,2,2-tetrakis(mercaptomethylthio)ethane, 1,1,5,5-tetrakis(mercaptomethylthio)-3-thiapentane, 1,1,6,6-tetrakis(mercaptomethylthio)-3,4-dithiahexane, 2,2-bis(mercaptomethylthio)ethanethiol, 3-mercaptomethylthio-1,7-dimercapto-2,6-dithiaheptane, 3,6-bis(mercaptomethylthio)-1 ,9-dimercapto-2,5,8-trithianonane, 3-mercaptomethylthio-1,6-dimercapto-2,5-dithiahexane, 1,1,9,9-tetrakis(mercaptomethylthio)-5-(3,3-bis(mercaptomethylthio)-1-thiapropyl)-3,7-dithianonane, tris(2,2-bis(mercaptomethylthio)ethyl)methane, tris(4,4-bis(mercaptomethylthio)-2-thiabutyl)methane, tetrakis(2,2 -bis(mercaptomethylthio)ethyl)methane, tetrakis(4,4-bis(mercaptomethylthio)-2-thiabutyl)methane, 3,5,9,11-tetrakis(mercaptomethylthio)-1,13-dimercapto-2,6,8,12-tetrathiatridecane, 3,5,9,11,15,17-hexakis(mercaptomethylthio)-1,19-dimercapto-2,6,8,12,14,18-hexathianonadecane, 9-(2,2-bis(mercaptomethylthio)ethyl)methane, 3,4,8,9-tetrakis(mercaptomethylthio)-1,11-dimercapto-2,5,7,10-tetrathiaundecane, 3,4,8,9,13,14-hexakis(mercaptomethylthio)-1,16-dimercapto-2,5,7,10,12,15-hexakis Ahexadecane, 8-[bis(mercaptomethylthio)methyl]-3,4,12,13-tetrakis(mercaptomethylthio)-1,15-dimercapto-2,5,7,9,11,14-hexathiapentadecane, 4,6-bis[3,5-bis(mercaptomethylthio)-7-mercapto-2,6-dithiaheptylthio]-1,3-dithiane, 4-[3,5-bis(mercaptomethylthio)-7-mercapto-2,6-dithiaheptylthio]-6-methyl mercaptomethylthio-1,3-dithiane, 1,1-bis[4-(6-mercaptomethylthio)-1,3-dithianylthio]-1,3-bis(mercaptomethylthio)propane, 1-[4-(6-mercaptomethylthio)-1,3-dithianylthio]-3-[2,2-bis(mercaptomethylthio)ethyl]-7,9-bis(mercaptomethylthio)-2,4,6,10-tetrathiaundecane, 3-[2-(1,3-dithietanyl)]methyl-7,9 -bis(mercaptomethylthio)-1,11-dimercapto-2,4,6,10-tetrathiaundecane, 9-[2-(1,3-dithietanyl)]methyl-3,5,13,15-tetrakis(mercaptomethylthio)-1,17-dimercapto-2,6,8,10,12,16-hexathiaheptadecane, 3-[2-(1,3-dithietanyl)]methyl-7,9,13,15-tetrakis(mercaptomethylthio)-1,17-dimercapto-2,4 , 6,10,12,16-hexathiaheptadecane, 4,6-bis[4-(6-mercaptomethylthio)-1,3-dithianylthio]-6-[4-(6-mercaptomethylthio)-1,3-dithianylthio]-1,3-dithiane, 4-[3,4,8,9-tetrakis(mercaptomethylthio)-11-mercapto-2,5,7,10-tetrathiaundecyl]-5-mercaptomethylthio-1,3-dithiolane, 4,5-bis[3,4-bis(mercaptomethylthio) 4-[3,4-bis(mercaptomethylthio)methyl-6-mercapto-2,5-dithiahexylthio]-1,3-dithiolane, 4-[3-bis(mercaptomethylthio)methyl-5,6-bis(mercaptomethylthio)-8-mercapto-2,4,7-trithiaoctyl]-5-mercaptomethylthio-1,3-dithiolane, 2-{ Bis[3,4-bis(mercaptomethylthio)-6-mercapto-2,5-dithiahexylthio]methyl}-1,3-dithietane, 2-[3,4-bis(mercaptomethylthio)-6-mercapto-2,5-dithiahexylthio]mercaptomethylthiomethyl-1,3-dithietane, 2-[3,4,8,9-tetrakis(mercaptomethylthio)-11-mercapto-2,5,7,10-tetrathiaundecylthio]mercaptomethylthiomethyl-1 , 3-dithietane, 2-[3-bis(mercaptomethylthio)methyl-5,6-bis(mercaptomethylthio)-8-mercapto-2,4,7-trithiaoctyl]mercaptomethylthiomethyl-1,3-dithietane, 4-{1-[2-(1,3-dithietanyl)]-3-mercapto-2-thiapropylthio}-5-[1,2-bis(mercaptomethylthio)-4-mercapto-3-thiabutylthio]-1,3-dithiolane, etc. These may be used alone or in combination of two or more.

Examples of amine compounds include aromatic amines such as methylenedianiline, m-phenylenediamine, 4,4'-diaminodiphenyl sulfone, and 3,3'-diaminodiphenyl sulfone.

Component (D) preferably contains at least one selected from the group consisting of phenolic resins, acid anhydrides, thiol compounds, and amine compounds. The phenolic resin may be liquid or solid at 20°C or higher and 30°C or lower. The resin composition according to the present invention has a low viscosity, but from the viewpoint of further reducing the viscosity of the resin composition, it is preferable that the phenolic resin in component (D) is an allylated phenolic resin.

The total amount of functional groups (hydroxyl groups, acid anhydride groups, amino groups, etc.) that react with epoxy groups in component (D) in the resin composition may be approximately equivalent to the total amount of epoxy groups in components (A) and (B). If the total amount of epoxy groups in components (A) and (B) in the resin composition is taken as 1 equivalent, the total amount of functional groups that react with epoxy groups in component (D) may be 0.01 to 1.5 equivalents, or 0.01 to 1.2 equivalents. If the total amount of functional groups in component (D) in the resin composition is outside the above-mentioned range, there will be many unreacted functional groups, which may make it difficult to increase the crosslink density, make it difficult to obtain a cured product with a high Tg, and make it difficult to obtain reliability. When component (D) is a phenolic resin, using a small amount of component (D) can increase the shear strength of the cured product after PCT (pressure cooker test). In one embodiment, when the component (D) is a phenolic resin, the equivalent number of the hydroxyl group of the component (D) is preferably 0.01 to 0.3, more preferably 0.01 to 0.2, and even more preferably 0.01 to 0.1, when the total equivalent number of the epoxy groups of the components (A) and (B) in the resin composition is taken as 1. When the equivalent number of the hydroxyl group of the component (D) is less than 0.01 or exceeds 0.3, when the total equivalent number of the epoxy groups of the components (A) and (B) in the resin composition is taken as 1, the shear strength of the cured product after PCT may decrease. The phenolic resin as the component (D) is considered to have a longer distance between crosslinking points than the component (A). For this reason, when the total equivalent number of the epoxy groups of the components (A) and (B) in the resin composition is taken as 1, when the equivalent number of the hydroxyl group of the component (D) is less than 0.01, the ratio of the phenolic resin as the component (D) is small, and the distance between the crosslinking points of the component (A) is short, resulting in steric hindrance. Due to the influence of this steric hindrance, some epoxy groups that are not involved in polymerization remain, and the crosslink density decreases, so water is taken into the gaps in the molecular chains during PCT, and the shear strength after PCT decreases. On the other hand, when the total equivalent number of the epoxy groups in components (A) and (B) in the resin composition is taken as 1, if the equivalent number of the hydroxyl groups in component (D) exceeds 0.3, the ratio of the phenolic resin as component (D) is high and the distance between the crosslink points becomes long. For this reason, the crosslink density decreases, water is taken into the gaps in the molecular chains during PCT, and the shear strength after PCT decreases.

The resin composition preferably contains component (D) in the range of 0.3% by mass to 50% by mass, more preferably 0.5% by mass to 45% by mass, even more preferably 0.6% by mass to 42% by mass, and even more preferably 0.7% by mass to 40% by mass, relative to the total mass of the resin composition. When the content of component (D) in the resin composition is in the range of 0.3% by mass to 50% by mass, the crosslink density can be increased to obtain a cured product with a high Tg, and an increase in the viscosity of the resin composition can be suppressed to maintain the low viscosity of the resin composition.

The resin composition may contain (E) a curing accelerator (hereinafter also referred to as "component (E)"). Component (E) is not particularly limited as long as it is a compound that can accelerate the curing of components (A) and (B).

Component (E) can be, for example, an imidazole compound. Component (E) may be used alone or in combination of two or more types.

Examples of imidazole compounds include 1-methylimidazole, 2-heptadecylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-undecylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,4-diamino-6-(2'-methylimidazolyl-(1)')-ethyl-S-triazine isocyanuric acid adduct, 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole. Examples of the imidazole compound include 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole-trimellitate, 1-cyanoethyl-2-phenylimidazole-trimellitate, N-(2-methylimidazolyl-1-ethyl)-urea, N,N'-(2-methylimidazolyl-(1)-ethyl)-adiboyldiamide, 1-[([1,1'-biphenyl]-2-yl)oxy]-3-(2-methyl-1H-imidazol-1-yl)propan-2-ol, etc. Commercially available imidazole compounds can be used, for example, 2P4MZ (2-phenyl-4-methylimidazole, manufactured by Shikoku Chemical Industry Co., Ltd.). The imidazole compound may be a synthesized compound, and 1-[([1,1'-biphenyl]-2-yl)oxy]-3-(2-methyl-1H-imidazol-1-yl)propan-2-ol may be synthesized by referring to the description in, for example, WO 2021/201060.

Component (E) may be a latent curing accelerator. A latent curing accelerator is a compound that is inactive at room temperature of about 25°C and is activated by heating or the like to function as a curing accelerator. Examples of latent curing accelerators include imidazole compounds that are solid at room temperature; solid-dispersed amine adduct-based latent curing accelerators such as reaction products of amine compounds and epoxy compounds (amine-epoxy adduct systems); and reaction products of amine compounds and isocyanate compounds or urea compounds (urea adduct systems).

Representative examples of commercially available latent curing catalysts include amine-epoxy adduct systems (amine adduct systems): "Amicure (registered trademark) PN-23" (manufactured by Ajinomoto Fine-Techno Co., Ltd.), "Amicure (registered trademark) PN-40" (manufactured by Ajinomoto Fine-Techno Co., Ltd.), "Amicure (registered trademark) PN-50" (manufactured by Ajinomoto Fine-Techno Co., Ltd.), "Hardener X-3661S" (manufactured by ACS Co., Ltd.), "Hardener X-3670S" (manufactured by ACS Co., Ltd.), and "Novacure (registered trademark) HX-3742" (manufactured by Asahi Chemical Industry Co., Ltd.). Examples of such compounds include "Novacure (registered trademark) HX-3721" (manufactured by Asahi Kasei Corporation), "Novacure (registered trademark) HXA9322HP" (manufactured by Asahi Kasei Corporation), "Novacure (registered trademark) HXA3922HP" (manufactured by Asahi Kasei Corporation), "Novacure (registered trademark) HXA3932HP" (manufactured by Asahi Kasei Corporation), "Novacure (registered trademark) HXA5945HP" (manufactured by Asahi Kasei Corporation), "Novacure (registered trademark) HXA5911HP" (manufactured by Asahi Kasei Corporation), and "Novacure (registered trademark) HXA9382HP" (manufactured by Asahi Kasei Corporation). Examples of urea-type adducts include "Fujicure FXE-1000" (manufactured by T&K TOKA Corporation), "Fujicure FXR1020" (manufactured by T&K TOKA Corporation), "Fujicure FXR-1030" (manufactured by T&K TOKA Corporation), "Fujicure FXR1121" (manufactured by T&K TOKA Corporation), "Fujicure FXR1081" (manufactured by T&K TOKA Corporation), "Fujicure FXR1061" (manufactured by T&K TOKA Corporation), and "Fujicure FXR1171" (manufactured by T&K TOKA Corporation), but are not limited to these. Component (E) may be used alone or in combination of two or more types. Component (E) is preferably a latent curing accelerator.

Some component (E) is provided in the form of a dispersion in which a solid compound having a solid latent hardening accelerating effect is dispersed in a liquid epoxy resin. When component (E) in such a form is used, the amount of epoxy resin in which the solid compound is dispersed is included in the amount of epoxy resin in component (B).

The resin composition preferably contains component (E) in the range of 1% by mass to 40% by mass, more preferably 2% by mass to 35% by mass, and even more preferably 2% by mass to 32% by mass, relative to the total mass of the resin composition. When the content of component (E) in the resin composition is in the range of 1% by mass to 40% by mass, the reaction of components (A) and (B) is promoted while maintaining a low viscosity, and a cured product having a high Tg can be obtained.

The resin composition may contain (F) a dispersant (hereinafter also referred to as "component (F)"). Component (F) is not particularly limited as long as it facilitates dispersion of, for example, component (C) in the resin composition. Examples of component (F) include phosphate polyesters. Examples of commercially available dispersants for component (F) include, for example, BYK111 (manufactured by BYK Japan KK) under the trade name.

The resin composition preferably contains component (F) in the range of 0.1% by mass or more and 2.0% by mass or less, based on the total mass of the resin composition. The resin composition may not contain component (F), and the component (F) may be 0% by mass.

The resin composition may contain optional components other than components (A) to (F). Examples of optional components contained in the resin composition include stabilizers and coupling agents. Examples of stabilizers include liquid boric acid ester compounds. Examples of coupling agents include silane coupling agents. Examples of optional components include additives, leveling agents, antioxidants, defoamers, thixotropic agents, viscosity modifiers, flame retardants, colorants, solvents, etc. Examples of additives include carbon black and titanium black. When optional components are contained in the resin composition, the amount of the optional components may be in a range that can obtain a cured product having a high Tg and suppress an increase in the viscosity of the resin composition. For example, the amount of the optional components is in a range of 0.001 parts by mass to 30 parts by mass or less, may be in a range of 0.05 parts by mass to 25 parts by mass or less, or may be in a range of 0.1 parts by mass to 20 parts by mass or less, relative to 100 parts by mass of the total amount of components (A), (B), (D), and (E).

2. Method for Producing Resin Composition The resin composition can be produced by mixing components (A) and (B), and if necessary, component (C), and further if necessary, components (D), (E) and (F). The resin composition may be produced by mixing each component together with additives if necessary. Each component is introduced simultaneously or separately into an appropriate mixer, and if necessary, the components are stirred and mixed while being melted by heating to obtain a resin composition. The method for producing the resin composition is not particularly limited. The resin composition can be produced by mixing the raw materials for each component with a mixer such as a Raikai mixer, a Henschel mixer, a roll mill, a three-roll mill, a ball mill, a planetary mixer, a bead mill, or a hybrid mixer equipped with a stirring device and a heating device. The resin composition may also be produced by using an appropriate combination of the above devices.

The resin composition is liquid at 20°C to 30°C. The viscosity of the resin composition is preferably 200 Pa·s or less, or may be 190 Pa·s or less, and is preferably 1 Pa·s or more, measured using a Brookfield rotational viscometer (HBDV-I or RVDV-I type, spindle: SC4-14 spindle, rotation speed: 50 rpm, measurement temperature: 25°C) immediately after preparation of the resin composition and after leaving the resin composition at room temperature (approximately 25°C) for a predetermined period of time.

Adhesive or sealing material, die attachment agent The resin composition can be used as an adhesive or sealing material for fixing, bonding or protecting components constituting an electronic device, and can also be used as an adhesive or sealing material containing the resin composition. Among the adhesives for fixing, bonding or protecting components, the resin composition can also be used as a die attachment agent for die bonding of bare chips, bonding of light-emitting diodes (LEDs), bonding of electrodes and lead wires, etc. The resin composition may be an adhesive or sealing material. The resin composition may be a die attachment agent.

Method for Supplying Resin Composition The resin composition can be supplied using a jet dispenser, an air dispenser, etc. Also, it can be supplied by a known coating method (dip coating, spray coating, bar coater coating, gravure coating, reverse gravure coating, spin coater coating, etc.) and a known printing method (lithographic printing, carton printing, metal printing, offset printing, screen printing, gravure printing, flexographic printing, inkjet printing, etc.).

Curing conditions of the resin composition The resin composition is thermosetting and can be cured by heating, for example, at 40°C or more and 150°C or less. The curing temperature of the resin composition is preferably 40°C or more and 120°C or less. It may be a high-temperature, short-time curing type that cures in a few seconds at 150°C. The heating time for curing the resin composition is preferably 15 minutes to 4 hours, more preferably 30 minutes to 2 hours, and even more preferably 30 minutes to 60 minutes.

Cured product A cured product is obtained by curing a resin composition, an adhesive or sealing material containing the resin composition, or a die attachment agent containing the resin composition. The cured product obtained by curing the resin composition at 120 ° C. for 60 minutes has a glass transition temperature (Tg) of preferably 80 ° C. or higher, more preferably 82 ° C. or higher, and even more preferably 83 ° C. or higher, when measured at a heating rate of 3 ° C. / min using a dynamic viscoelasticity measuring device (e.g., DMA850, manufactured by TA Instruments Japan Co., Ltd.), and may be 200 ° C. or lower, 195 ° C. or lower, or 190 ° C. or lower. If the Tg of the obtained cured product is 80 ° C. or higher, a cured product with improved moisture resistance or durability can be obtained.

Electronic Device When the resin composition is used as an adhesive or sealant containing the resin composition, or a die attachment agent containing the resin composition for fixing, bonding or protecting an electronic component, an electronic device containing a cured product obtained by curing the resin composition, adhesive, sealant or die attachment agent is obtained. The electronic device may be a semiconductor device. Examples of electronic devices include mobile phones, smartphones, notebook computers, tablet terminals, camera modules, etc. When the resin composition is used as an adhesive or sealant containing the resin composition, or a die attachment agent containing the resin composition for fixing, bonding or protecting an electronic component, the cured product having a Tg of 80 ° C. or more has improved reliability such as moisture resistance or durability, and can provide an electronic device that is reliable even in harsh environments such as high temperature and high humidity.

The present invention will be specifically explained below with reference to examples. The present invention is not limited to these examples. In the following examples and comparative examples, the numbers indicating the blending ratio of each component contained in the resin composition represent mass % relative to the total mass of the resin composition, unless otherwise specified.

Component (A): Showfree (registered trademark) PETG (pentaerythritol glycidyl ether), liquid, chlorine concentration measured by ion chromatography is less than 50 ppm by mass, manufactured by Showa Denko K.K.

Component (B): Epoxy resin other than PETG of component (A) B-1: YDF8170 (bisphenol F type epoxy resin), liquid, epoxy equivalent: 159 g/eq, manufactured by Nippon Steel Chemical & Material Co., Ltd.
B-2: RE410S (bisphenol A type epoxy resin), liquid, epoxy equivalent: 180 g/eq, manufactured by Nippon Kayaku Co., Ltd. B-3: CDMDG (1,4-cyclohexanedimethanol diglycidyl ether), liquid, epoxy equivalent: 135 g/eq, manufactured by Showa Denko K.K. B-4: jER630 (4-(diglycidylamino)phenyl glycidyl ether), liquid, epoxy equivalent: 98 g/eq, manufactured by Mitsubishi Chemical Corporation B-5: EP3980S (diglycidyl-o-toluidine), liquid, epoxy equivalent: 115 g/eq, manufactured by ADEKA Corporation

Component (C): Filler C-1: SO E5 (silicon dioxide), average particle size: 1.3 μm to 1.7 μm (catalog value), manufactured by Admatechs Co., Ltd. C-2: AG2051-SXM (aluminum oxide), average particle size: 0.3 μm, manufactured by Admatechs Co., Ltd. C-3: EP-2601 (silicone elastomer), average particle size: 2 μm, manufactured by Dow Toray Co., Ltd.

Component (D): Curing agent D-1: MEH8005 (allylated phenol resin), liquid at 25°C, hydroxyl equivalent: 135 g/eq, manufactured by UBE Co., Ltd. D-2: Shownol (registered trademark) BRM-553 (phenol novolac resin), high viscosity liquid at 25°C, hydroxyl equivalent: 102 g/eq, manufactured by Aica Kogyo Co., Ltd. D-3: Shownol (registered trademark) BRG-558 (phenol novolac resin), solid at 25°C (softening point: 95°C), hydroxyl equivalent: 106 g/eq, manufactured by Aica Kogyo Co., Ltd.

Component (E): Curing accelerator E-1: 2P4MZ (2-phenyl-4-methylimidazole), manufactured by Shikoku Chemical Industry Co., Ltd. E-2: OPPG-2MZH (1-[([1,1'-biphenyl]-2-yl)oxy]-3-(2-methyl-1H-imidazol-1-yl)propan-2-ol), manufactured by Namics Corporation E-3: Novacure (registered trademark) HXA9322HP (core-shell type) (core-shell type epoxy-amine adduct type latent curing catalyst), manufactured by Asahi Kasei Corporation E-4: Novacure (registered trade) HXA5911HP (core-shell type) (core-shell type epoxy-amine adduct type latent curing catalyst), manufactured by Asahi Kasei Corporation E-5: FXR1020 (modified amine) (modified amine type latent curing catalyst), manufactured by T&K TOKA Corporation Incidentally, E-3 is in the form of a dispersion liquid (latent curing catalyst/mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin=33/67 (mass ratio)) in which fine particle-like latent curing catalyst is dispersed in epoxy resin (mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin (epoxy equivalent: 165 g/eq)).
E-4 is in the form of a dispersion (latent curing catalyst/mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin=50/50 (mass ratio)) in which a fine particle latent curing catalyst is dispersed in an epoxy resin (mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin (epoxy equivalent: 172 g/eq)).

Component (F): Dispersant F-1: BYK111 (polyester phosphate), manufactured by BYK-Chemie Japan Co., Ltd.

Examples 1 to 23, Comparative Examples 1 to 2
Component (A), component (B), component (C), component (D), and component (E), and optionally component (F), were mixed in the proportions shown in Tables 1 to 3, and a three-roll mill was used when the filler of component (C) was included, and a planetary mixer was used when the filler of component (C) was not included, to produce each resin composition of the examples and comparative examples. In the tables, values without units represent mass % relative to 100 mass % of the total mass of the resin composition, or mass % relative to 100 mass % of the organic matter in the resin composition. For component (A), both the mass % of component (A) in 100 mass % of the organic matter and the mass % of component (A) in 100 mass % of the total mass of the resin composition were listed. In addition, in the tables, the symbol "-" indicates that the corresponding component is not included in the resin composition or could not be measured.

The following evaluations were carried out on each of the resin compositions in the Examples and Comparative Examples, and on the cured products obtained by curing each of the resin compositions. The results are shown in Tables 1 to 3.

Evaluation: Viscosity (Pa·s)
For each of the resin compositions in the Examples and Comparative Examples, the viscosity (Pa·s) was measured using a rotational viscometer HBDV-1 (manufactured by Brookfield) or a rotational viscometer RVDV-1 (manufactured by Brookfield) at 50 rpm and 25° C. using a spindle SC4-14. When the viscosity was less than 10 Pa·s, the measurement was performed using the rotational viscometer RVDV-1, and when the viscosity was 10 Pa·s or more, the measurement was performed using the rotational viscometer HBDV-1.

Glass transition temperature Tg (°C)
The glass transition temperature Tg (°C) of the cured product obtained by curing each of the resin compositions of the Examples and Comparative Examples was measured using a dynamic viscoelasticity measuring device. Specifically, a Teflon (registered trademark) sheet was attached to the surface of a glass plate having a thickness of 1.5 mm, and spacers were placed in two places on the Teflon sheet so that the film thickness when cured was 200 ± 100 μm. Next, the resin composition was applied between the two spacers, and the Teflon sheet was sandwiched between another glass plate with a Teflon sheet attached to the surface without trapping air bubbles, and cured at 120 ° C for 60 minutes to obtain a cured product. Finally, the cured product was peeled off from the glass plate with the Teflon sheet attached, and then cut into a predetermined size (3 mm long x 15 mm wide) with a cutter to obtain a test piece. The cut edge of the test piece was smoothed with sandpaper. The test piece was subjected to measurements using a dynamic viscoelasticity measuring device (Discovery DMA850, manufactured by TA Instruments Japan, Inc.) in the range of −25° C. to 200° C., at a frequency of 1 Hz, a temperature rise rate of 3° C./min, and a strain amplitude of 20 μm, using a tensile method. The peak temperature of tan δ was read and taken as the glass transition temperature Tg (° C.).

As shown in Tables 1 to 3, each of the resin compositions of Examples 1 to 23 had a low viscosity of 200 Pa·s or less at 25°C, and could be used to bond small areas and narrow gaps, and had good handleability. The cured products obtained by curing each of the resin compositions of Examples 1 to 23 at 120°C for 60 minutes had a high Tg of 80°C or more, and a highly reliable cured product was obtained even when used in harsh environments such as high temperatures and high humidity.

The resin composition of Comparative Example 1 did not contain PETG, and therefore a cured product with a high Tg of 80°C or higher was obtained, but the viscosity of the resin composition became too high to measure. The resin composition of Comparative Example 2 contained 35% by mass of PETG (component (A)) relative to 100% by mass of the organic matter, including components (A) and (B), contained in the resin composition, and therefore the cured product obtained by curing the resin composition at 120°C for 60 minutes had a Tg of 75°C, which did not meet the Tg of 80°C, and there was a risk of a decrease in reliability in terms of moisture resistance or durability.

Share strength after PCT (N)
The shear strength of the cured product obtained by curing each of the resin compositions of Examples 2, 9, 10, 12, 13, and 14 after PCT was measured using a universal bond tester (series 4000: manufactured by Nordson Advanced Technology Co., Ltd.). Specifically, the resin composition was first stencil-printed on a ceramic substrate of 20 mm x 20 mm with a diameter of 2 mm (2 mmΦ). Next, a 2 mm square silicon chip (with a SiN film formed) was placed on the printed resin composition and cured at 120 ° C for 60 minutes to obtain a test piece. Thereafter, the test piece was subjected to PCT (conditions: 121 ° C, 2 atmospheres, 100% RH, 20 hours) using a highly accelerated life tester (EHS-221M: manufactured by Espec Corporation), and then the stress (unit: N) was measured at a test speed of 200 μm / s using a universal bond tester. The results are shown in Table 4.

As shown in Table 4, when a small amount of phenolic resin was used as component (D) relative to the total amount of components (A) and (B), the shear strength of the cured material after PCT was high. This was thought to be due to the low water absorption rate of such cured materials. In particular, when a very small amount of phenolic resin was used, as in Examples 2 and 13, the shear strength after PCT was higher.

Water absorption rate after PCT (%)
The water absorption rate was measured from the weight ratio before and after PCT of the cured product obtained by curing each of the resin compositions of Examples 2, 9, and 10. Specifically, first, spacers were placed in two places on a 4 cm x 6 cm SUS (Steel Special Use Stainless) 304 plate so that the film thickness when the resin composition was cured was 250 μm. Next, the resin composition was applied and cured at 120 ° C for 60 minutes to obtain a test piece, and the weight of the test piece was measured. Then, the test piece was subjected to PCT (conditions: 121 ° C, 2 atmospheres, 100% RH, 20 hours) using a highly accelerated life tester (EHS-221M: manufactured by Espec Corporation), and then the weight was measured again. The water absorption rate (unit: %) was calculated from (weight after PCT [g]) / (weight before PCT [g]) × 100. The results are shown in Table 5.

Compared to Example 9, which did not contain phenolic resin, the water absorption rate was lower when a small amount of phenolic resin was used. Between Examples 2 and 10, Example 2, which used a very small amount of phenolic resin, had a lower water absorption rate.

The resin composition according to the present invention can be suitably used as an adhesive or sealant for fixing, joining or protecting components constituting an electronic device. The resin composition according to the present invention can also be suitably used as a die attachment agent. The resin composition according to the embodiment of the present invention, the adhesive or sealant containing the resin composition, the cured product obtained by curing the die attachment agent, and the electronic device containing the cured product can be used, for example, in mobile phones, smartphones, notebook computers, tablet terminals, camera modules, etc.

Claims

(A) pentaerythritol tetraglycidyl ether, and (B) an epoxy resin other than the component (A),
A resin composition, comprising 100% by mass of an organic substance containing the components (A) and (B), and wherein the component (A) is less than 30% by mass.
The resin composition according to claim 1, wherein component (B) contains an epoxy resin having an aromatic ring and an epoxy group having two or more functionalities.
The resin composition according to claim 1 or 2, wherein component (B) contains an epoxy resin having an epoxy equivalent of 90 to 500 g/eq.
　(C) The resin composition according to any one of claims 1 to 3, which contains a filler.
An adhesive or sealant comprising the resin composition according to any one of claims 1 to 4.
A die attachment agent comprising the resin composition according to any one of claims 1 to 4.
A cured product obtained by curing the resin composition according to any one of claims 1 to 4, the adhesive or sealant according to claim 5, or the die attachment agent according to claim 6.
An electronic device comprising the cured product according to claim 7.